6 and 8-Channel Low Capacitance ESD Protection Arrays CM1213 Features • • • • • • • • • 6 or 8 channels of ESD protection Note: For 1, 2, and 4 channel devices, see the CM1213A datasheet. Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge Low channel input capacitance of 1.0pF typical Minimal capacitance change with temperature and voltage Channel input capacitance matching of 0.02pF typical is ideal for differential signals Mutual capacitance between signal pin and adjacent signal pin -0.11pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes* Available in SOIC and MSOP, lead-free packaging Applications • • • • • • USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection ©2010 SCILLC. All rights reserved. April 2010 – Rev. 3 Product Description The CM1213 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1213 will protect against ESD pulses up to ±8kV per the IEC 61000-4-2 standard. These devices are particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire, iLink), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. Publication Order Number: CM1213/D CM1213 Block Diagram Rev. 3 | Page 2 of 17 | www.onsemi.com CM1213 Pin Descriptions PIN DESCRIPTIONS 6-CHANNEL, 8-LEAD MSOP-8/SOIC-8 PACKAGES PIN NAME TYPE DESCRIPTION 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 VN GND Negative voltage supply rail 4 CH3 I/O ESD Channel 5 CH4 I/O ESD Channel 6 CH5 I/O ESD Channel 7 VP PWR Positive voltage supply rail 8 CH6 I/O ESD Channel PIN DESCRIPTIONS 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE PIN NAME TYPE DESCRIPTION 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 CH3 I/O ESD Channel 4 CH4 I/O ESD Channel 5 VN GND Negative voltage supply rail 6 CH5 I/O ESD Channel 7 CH6 I/O ESD Channel 8 VP PWR Positive voltage supply rail 9 CH7 I/O ESD Channel 10 CH8 I/O ESD Channel Rev. 3 | Page 3 of 17 | www.onsemi.com CM1213 Ordering Information PART NUMBERING INFORMATION Lead-free Finish # of Channels Leads Package Ordering Part 1 Number Part Marking 6 8 SOIC-8 CM1213-06SM D136 6 8 MSOP-8 CM1213-06MR D137 8 10 MSOP-10 CM1213-08MR D138 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V Operating Temperature Range -40 to +85 °C Storage Temperature Range -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating MSOP-8 Package (CM1213-06MR) MSOP-10 Package (CM1213-08MR) SOIC-8 Package (CM1213-06SM) Rev. 3 | Page 4 of 17 | www.onsemi.com RATING UNITS -40 to +85 °C 400 400 600 mW mW mW CM1213 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS (SEE NOTE 1) MIN TYP MAX UNITS 3.3 5.5 V 8.0 µA 0.80 0.80 0.95 0.95 V V VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V ±0.1 ±1.0 µA CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; 1.0 1.5 pF ∆C Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; 0.02 pF CMUTUAL Mutual Capacitance between signal pin and adjacent signal pin At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; 0.11 pF VESD ESD Protection Peak Discharge Voltage at any channel input, in system Contact discharge per IEC 61000-4-2 standard IN VCL RDYN 0.60 0.60 Notes 3 and 4; TA=25°C Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20uS; Note 4 Dynamic Resistance Positive Transients Negative Transients IPP = 1A, tP = 8/20uS Any I/O pin to Ground; Note 4 Note 1: Note 2: Note 3: Note 4: kV ±8 +8.8 -1.4 V V 0.7 0.4 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP (VP floating). Rev. 3 | Page 5 of 17 | www.onsemi.com CM1213 Ordering Information PART NUMBERING INFORMATION 1 Bumps Package Ordering Part Number Part Marking 10 CSP CM1205-08CP 120508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 6 of 17 | www.onsemi.com RATING UNITS -40 to +85 °C CM1213 Specifications (cont’d) ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS VREV Reverse Standoff Voltage IDIODE=10µA ILEAK Leakage Current VIN=3.3V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 & 3 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 & 3 Channel Capacitance At 2.5V DC, f = 1MHz, Note 3 VESD VCL C MIN TYP MAX 6.0 5.6 -1.2 6.8 -0.8 UNITS V 100 nA 8.0 -0.4 V V +30 kV +25 kV +12 -8 39 V V 47 pF Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization. Rev. 3 | Page 7 of 17 | www.onsemi.com CM1213 Performance Information Input Channel Capacitance Performance Curves Rev. 3 | Page 8 of 17 | www.onsemi.com CM1213 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 3 | Page 9 of 17 | www.onsemi.com CM1213 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Application of Positive ESD Pulse between Input Channel and Ground, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: VCL = Fwd + L2 x d(IESD ) / dt voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here -9 d(IESD)/dt can be approximated by ∆IESD/∆t, or 30/(1x10 ). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1213 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.calmicro.com. Figure 3. Application of Positive ESD Pulse between Input Channel and Ground Rev. 3 | Page 10 of 17 | www.onsemi.com CM1213 Mechanical Details The CM1213 is available in MSOP-8, SOIC-8, and MSOP-10 packages with a lead-free finishing. SOIC-8 Mechanical Specifications The CM1213-06SM is supplied in an 8-pin SOIC package. Dimensions are presented below. * PACKAGE DIMENSIONS Package SOIC Pins 8 Dimensions Millimeters Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.19 0.150 0.165 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 # per tape and reel 2500 pieces Controlling dimension: inches Package Dimensions for SOIC-8 Rev. 3 | Page 11 of 17 | www.onsemi.com CM1213 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213-06SM 4.90 X 6.00 X 1.55 5.30 X 6.50 X 2.10 12mm 330mm (13") 2500 4mm 8mm Rev. 3 | Page 12 of 17 | www.onsemi.com CM1213 Mechanical Details (Cont’d) MSOP-8 Mechanical Specifications: The CM1213-06MR is supplied in an 8-pin MSOP package. Dimensions are presented below. PACKAGE DIMENSIONS TOP VIEW MSOP Package D 8 8 Pins Dimensions Millimeters 7 Max Min Max A 0.75 0.95 0.030 0.037 A1 0.05 0.15 0.002 0.006 B 0.28 0.38 0.011 0.015 C 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 E H Pin 1 Marking 1 H L # per tape and reel 0.65 BSC 0.026 BSC 4.90 BSC 0.40 0.016 4000 pieces 2 3 4 SIDE VIEW A SEAT ING PLANE A1 B 0.193 BSC 0.70 5 Inches Min e 6 0.028 e END VIEW C Controlling dimension: millimeters L Package Dimensions for MSOP-8 Rev. 3 | Page 13 of 17 | www.onsemi.com CM1213 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213-06MR 3.00 X 3.00 X 0.85 3.3 X 5.3 X1.3 12mm 330mm (13") 4000 4mm 8mm Rev. 3 | Page 14 of 17 | www.onsemi.com CM1213 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications The CM1213-08MR is supplied in a 10-pin MSOP package. Dimensions are presented below. * PACKAGE DIMENSIONS TOP VIEW MSOP Package 10 Pins Dimensions D 10 Millimeters Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.17 0.33 0.007 0.013 C 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 H L 8 6 7 Inches Min e 9 E H Pin 1 Marking 1 2 3 4 5 SIDE VIEW A 0.50 BSC 0.0196 BSC 4.90 BSC 0.40 0.70 SEAT ING PLANE A1 B 0.193 BSC 0.0137 e 0.029 END VIEW # per tape and reel 4000 C Controlling dimension: inches L Package Dimensions for MSOP-10 Rev. 3 | Page 15 of 17 | www.onsemi.com CM1213 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1213-08MR 3.00 X 3.00 X 0.85 3.3 X 5.3 X1.3 12mm 330mm (13") 4000 4mm 8mm Rev. 3 | Page 16 of 17 | www.onsemi.com CM1213 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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