LMV331 SINGLE LMV393 DUAL LMV339 QUAD www.ti.com SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS FEATURES 1 The LMV393 and LMV339 devices are low-voltage (2.7 V to 5.5 V) versions of the dual and quad comparators, LM393 and LM339, which operate from 5 V to 30 V. The LMV331 is the single-comparator version. The LMV331, LMV339, and LMV393 are the most cost-effective solutions for applications where lowvoltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393 devices at a fraction of the supply current. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 3OUT 4OUT GND 4IN+ 4IN– 3IN+ 3IN– LMV339 . . . RUC PACKAGE (TOP VIEW) 1OUT 1 VCC+ 1IN– 3OUT DESCRIPTION/ ORDERING INFORMATION 2OUT 1OUT VCC+ 1IN– 1IN+ 2IN– 2IN+ 14 13 12 4OUT 2 11 GND 3 10 4IN+ 1IN+ 4 9 4IN– 2IN– 5 8 3IN+ 6 7 3IN– • • LMV339 . . . D OR PW PACKAGE (TOP VIEW) 2OUT • 2.7-V and 5-V Performance Low Supply Current – LMV331 . . . 130 μA Typ – LMV393 . . . 210 μA Typ – LMV339 . . . 410 μA Typ Input Common-Mode Voltage Range Includes Ground Low Output Saturation Voltage 200 mV Typical Open-Collector Output for Maximum Flexibility 2IN+ • • LMV393 . . . D, DDU, DGK OR PW PACKAGE (TOP VIEW) 1OUT 1IN– 1IN+ GND 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN– 2IN+ LMV331 . . . DBV OR DCK PACKAGE (TOP VIEW) 1IN+ 1 GND 2 1IN– 3 5 VCC+ 4 OUT 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2012, Texas Instruments Incorporated LMV331 SINGLE LMV393 DUAL LMV339 QUAD SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SC-70 – DCK Single SOT23-5 – DBV MSOP/VSSOP – DGK SOIC – D –40°C to 125°C Dual TSSOP – PW VSSOP – DDU SOIC – D Quad TSSOP – PW µQFN – RUC (1) (2) (3) TOP-SIDE MARKING (3) ORDERABLE PART NUMBER Reel of 3000 LMV331IDCKR Reel of 250 LMV331IDCKT Reel of 3000 LMV331IDBVR Reel of 250 LMV331IDBVT Reel of 2500 LMV393IDGKR Tube of 75 LMV393ID Reel of 2500 LMV393IDR Tube of 90 LMV393IPW Reel of 2000 LMV393IPWR Reel of 3000 LMV393IDDUR Tube of 50 LMV339ID Reel of 2500 LMV339IDR Tube of 150 LMV339IPW Reel of 2000 LMV339IPWR Reel of 3000 LMV339IRUCR R2_ R1I_ R9_ MV393I MV393I RABR LM339I MV339I RT_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK/DGK/RUC : The actual top-side marking has one additional character that designates the wafer fab/assembly site. SYMBOL (EACH COMPARATOR) IN– – OUT IN+ + SIMPLIFIED SCHEMATIC VCC+ Q6 Q7 Q8 OUT IN+ Q1 Q2 Q3 Q4 Q5 Q9 IN− R1 R3 R2 GND 2 Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated LMV331 SINGLE LMV393 DUAL LMV339 QUAD www.ti.com SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) Duration of output short circuit (one amplifier) to ground (4) 0 At or below TA = 25°C, VCC ≤ 5.5 V D package Package thermal impedance (5) θJA (6) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 5.5 V ±5.5 V VCC+ V 8 pin 97 14 pin 86 DBV package 206 DCK package 252 DDU package 210 RUC package 216 PW package UNIT Unlimited DGK package TJ MAX °C/W 172 8 pin 149 14 pin 113 –65 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC Supply voltage (single-supply operation) VOUT Output voltage TA Operating free-air temperature Copyright © 1999–2012, Texas Instruments Incorporated I temperature MIN MAX 2.7 5.5 V VCC+ + 0.3 V 125 °C –40 Submit Documentation Feedback UNIT 3 LMV331 SINGLE LMV393 DUAL LMV339 QUAD SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 www.ti.com Electrical Characteristics VCC+ = 2.7 V, GND = 0 V, at specified free-air temperature (unless otherwise noted) PARAMETER VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TEST CONDITIONS TA MIN 25°C Saturation voltage ICC Supply current 7 5 25°C 15 5 –40°C to 125°C VO ≤ 1.5 V 5 mV 250 nA 50 150 25°C UNIT μV/°C 400 25°C VSAT 1.7 –40°C to 125°C Output Leakage Current Common-mode input voltage range MAX –40°C to 125°C 25°C VICR TYP 23 nA mA 0.003 –40°C to 125°C 1 25°C –0.1 to 2 IO ≤ 1.5 mA 25°C 200 LMV331 25°C 40 100 LMV393 (both comparators) 25°C 70 140 LMV339 (all four comparators) 25°C 140 200 µA V mV μA Switching Characteristics TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TYP tPHL Propagation delay high to low level output switching Input overdrive = 10 mV 1000 Input overdrive = 100 mV 350 tPLH Propagation delay low to high level output switching Input overdrive = 10 mV 500 Input overdrive = 100 mV 400 4 Submit Documentation Feedback UNIT ns ns Copyright © 1999–2012, Texas Instruments Incorporated LMV331 SINGLE LMV393 DUAL LMV339 QUAD www.ti.com SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 Electrical Characteristics VCC+ = 5 V, GND = 0 V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN 25°C VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current –40°C to 125°C IIO Input offset current –40°C to 125°C IO Output current (sinking) 1.7 7 VO ≤ 1.5 V 25°C 5 25°C 25 25°C Output Leakage Current Common-mode input voltage range 25°C AVD Large-signal differential voltage gain 25°C VSAT Saturation voltage 25°C IO ≤ 4 mA –40°C to 125°C LMV331 –40°C to 125°C LMV393 (both comparators) –40°C to 125°C LMV339 (all four comparators) –40°C to 125°C 25°C 25°C 25°C mV μV/°C 250 nA 400 2 50 nA 150 10 84 mA 0.003 –40°C to 125°C VICR UNIT 9 25°C Supply current MAX –40°C to 125°C 25°C ICC TYP µA 1 –0.1 to 4.2 20 V 50 200 V/mV 400 mV 700 60 120 150 100 200 μA 250 170 300 350 Switching Characteristics TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TYP tPHL Propagation delay high to low level output switching Input overdrive = 10 mV Input overdrive = 100 mV 200 tPLH Propagation delay low to high level output switching Input overdrive = 10 mV 450 Input overdrive = 100 mV 300 Copyright © 1999–2012, Texas Instruments Incorporated 600 UNIT Submit Documentation Feedback ns ns 5 LMV331 SINGLE LMV393 DUAL LMV339 QUAD SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012 www.ti.com REVISION HISTORY Changes from Revision M (November 2005) to Revision N Page • Changed document format from Quicksilver to DocZone. .................................................................................................... 1 • Added RUC package pin out and RUC package ordering information. ............................................................................... 1 Changes from Revision N (April 2011) to Revision O • Changed VI in the Absolute Maximum Ratings from 5.5 V to VCC+ ...................................................................................... 3 Changes from Revision O (February 2012) to Revision P • Page Updated the Top Side Marking for RUC package, RT_. ...................................................................................................... 2 Changes from Revision Q (April 2012) to Revision R • Page Updated Ordering Information Table for Top Side Marking, R9_. ........................................................................................ 2 Changes from Revision P (March 2012) to Revision Q • Page Page Added RUC to marking list ................................................................................................................................................... 2 Changes from Revision R (May 2012) to Revision S Page • Updated Operating Temperature Range .............................................................................................................................. 2 • Added thermal impedance data ............................................................................................................................................ 3 6 Submit Documentation Feedback Copyright © 1999–2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R1I2 ~ R1IC ~ R1II) LMV331IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV331IDCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV331IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV331IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV331IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV331IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R2C ~ R2I ~ R2R) LMV339ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I LMV339IDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I LMV339IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I LMV339IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I LMV339IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV339IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LMV339I LMV339IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV339I LMV339IRUCR ACTIVE QFN RUC 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 RT LMV393ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 RABR LMV393IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 RABR LMV393IDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 RABR LMV393IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (R9B ~ R9Q ~ R9R) LMV393IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (R9B ~ R9Q ~ R9R) LMV393IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 MV393I LMV393IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV393IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I LMV393IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 MV393I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF LMV331, LMV393 : • Automotive: LMV331-Q1, LMV393-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 15-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV331IDBVR SOT-23 DBV 5 3000 178.0 9.0 LMV331IDBVR SOT-23 DBV 5 3000 180.0 LMV331IDBVT SOT-23 DBV 5 250 180.0 LMV331IDBVT SOT-23 DBV 5 250 LMV331IDCKR SC70 DCK 5 LMV331IDCKR SC70 DCK LMV331IDCKT SC70 DCK LMV331IDCKT SC70 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 DCK 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 LMV339IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV339IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV339IRUCR QFN RUC 14 3000 180.0 8.4 2.3 2.3 0.55 4.0 8.0 Q2 LMV393IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 LMV393IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV393IDR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LMV393IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV393IDRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV393IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 LMV331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 LMV331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 LMV331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 LMV331IDCKR SC70 DCK 5 3000 205.0 200.0 33.0 LMV331IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 LMV331IDCKT SC70 DCK 5 250 180.0 180.0 18.0 LMV331IDCKT SC70 DCK 5 250 205.0 200.0 33.0 LMV339IDR SOIC D 14 2500 367.0 367.0 38.0 LMV339IPWR TSSOP PW 14 2000 367.0 367.0 35.0 LMV339IRUCR QFN RUC 14 3000 202.0 201.0 28.0 LMV393IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV393IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LMV393IDR SOIC D 8 2500 364.0 364.0 27.0 LMV393IDR SOIC D 8 2500 340.5 338.1 20.6 LMV393IDRG4 SOIC D 8 2500 340.5 338.1 20.6 LMV393IPWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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