MC74AC244, MC74ACT244 Octal Buffer/Line Driver with 3-State Outputs The MC74AC244/74ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter/receiver which provides improved PC board density. www.onsemi.com Features • 3−State Outputs Drive Bus Lines or Buffer Memory Address • • • Registers Outputs Source/Sink 24 mA ′ACT244 Has TTL Compatible Inputs These are Pb−Free Devices VCC OE2 20 19 18 17 16 15 14 SOIC−20W DW SUFFIX CASE 751D 1 13 12 TSSOP−20 DT SUFFIX CASE 948E 11 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 1 2 3 4 5 6 OE1 7 8 9 10 GND DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. Pinout: 20−Lead Packages Conductors (Top View) TRUTH TABLE Inputs Outputs OE1 D (Pins 12, 14, 16, 18) L L H L H X L H Z NOTE: H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance TRUTH TABLE Inputs Outputs OE2 D (Pins 3, 5, 7, 9) L L H L H X L H Z NOTE: H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance © Semiconductor Components Industries, LLC, 2015 February, 2015 − Rev. 8 1 Publication Order Number: MC74AC244/D MC74AC244, MC74ACT244 MAXIMUM RATINGS Symbol Parameter Value Unit −0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) (Note 1) −0.5 to VCC +0.5 V VOUT IIK DC Input Diode Current ±20 mA IOK DC Output Diode Current ±50 mA IOUT DC Output Sink/Source Current ±50 mA ICC DC Supply Current, per Output Pin ±50 mA IGND DC Ground Current, per Output Pin ±100 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias 140 _C qJA Thermal Resistance (Note 2) 65.8 110.7 _C/W MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup SOIC TSSOP Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 > 1000 V ±100 mA Above VCC and Below GND at 85_C (Note 6) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IOUT absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD 51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT tr, tf Parameter Supply Voltage Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − −40 25 85 °C DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 7) ′AC Devices except Schmitt Inputs Unit V V ns/V tr, tf Input Rise and Fall Time (Note 8) ′ACT Devices except Schmitt Inputs TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 8. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2 MC74AC244, MC74ACT244 DC CHARACTERISTICS Symbol VCC (V) Parameter 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V IOUT = −50 mA 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 V IOUT = 50 mA 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) Symbol Parameter VCC* (V) 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Figure No. tPLH Propagation Delay Data to Output 3.3 5.0 2.0 1.5 6.5 5.0 9.0 7.0 1.5 1.0 10.0 7.5 ns 3−5 tPHL Propagation Delay Data to Output 3.3 5.0 2.0 1.5 6.5 5.0 9.0 7.0 2.0 1.0 10.0 7.5 ns 3−5 tPZH Output Enable Time 3.3 5.0 2.0 1.5 6.0 5.0 10.5 7.0 1.5 1.5 11.0 8.0 ns 3−7 tPZL Output Enable Time 3.3 5.0 2.5 1.5 7.5 5.5 10.0 8.0 2.0 1.5 11.0 8.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 3.0 2.5 7.0 6.5 10.0 9.0 1.5 1.0 10.5 9.5 ns 3−7 tPLZ Output Disable Time 3.3 5.0 2.5 2.0 7.5 6.5 10.5 9.0 2.5 2.0 11.5 9.5 ns 3−8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. www.onsemi.com 3 MC74AC244, MC74ACT244 DC CHARACTERISTICS Symbol VCC (V) Parameter 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V IOUT = −50 mA V 4.5 5.5 − − 3.86 4.86 3.76 4.76 *VIN = VIL or VIH −24 mA IOH −24 mA 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 V IOUT = 50 mA V 4.5 5.5 − − 0.36 0.36 0.44 0.44 *VIN = VIL or VIH 24 mA 24 mA IOL Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND VOL IIN Maximum Low Level Output Voltage IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com) Parameter Symbol VCC* (V) 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Figure No. tPLH Propagation Delay Data to Output 5.0 2.0 6.5 9.0 1.5 10.0 ns 3−5 tPHL Propagation Delay Data to Output 5.0 2.0 7.0 9.0 1.5 10.0 ns 3−5 tPZH Output Enable Time 5.0 1.5 6.0 8.5 1.0 9.5 ns 3−7 tPZL Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−8 tPHZ Output Disable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−7 tPLZ Output Disable Time 5.0 2.5 7.5 10.0 2.0 10.5 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V www.onsemi.com 4 MC74AC244, MC74ACT244 ORDERING INFORMATION Device Package Shipping† SOIC−20 (Pb−Free) 1000 / Tape & Reel MC74AC244DWG 38 Units / Rail MC74AC244DWR2G MC74ACT244DWG 38 Units / Rail MC74ACT244DWR2G 1000 / Tape & Reel MC74AC244DTR2G 2500 / Tape & Reel TSSOP−20 (Pb−Free) MC74ACT244DTR2G 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS SOIC−20W TSSOP−20 20 20 AC 244 ALYWG G AC244 AWLYYWWG 1 1 20 20 ACT 244 ALYWG G ACT244 AWLYYWWG 1 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) www.onsemi.com 5 MC74AC244, MC74ACT244 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B L SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− N F DETAIL E C G D 0.100 (0.004) −T− SEATING H DETAIL E SOLDERING FOOTPRINT* PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 C --1.20 --0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC −W− H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MC74AC244, MC74ACT244 PACKAGE DIMENSIONS SOIC−20W DW SUFFIX CASE 751D−05 ISSUE G 20 11 X 45 _ h H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. q A B M D 1 10 20X B B 0.25 M T A S B S L A 18X e A1 DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ SEATING PLANE C T ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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