MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 FEATURES APPLICATIONS • • • • • • • • • • • • • • • ESD Protection for RS-232 Bus Pins – ±15 kV (HBM) – ±8 kV (IEC61000-4-2, Contact Discharge) – ±15 kV (IEC61000-4-2, Air-Gap Discharge) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates up to 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 µA Typ External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Pin Compatible to Alternative High-Speed Device (1 Mbit/s) – SNx5C3232 Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment D, DB, DW, OR PW PACKAGE (TOP VIEW) C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 DESCRIPTION/ORDERING INFORMATION ORDERING INFORMATION PACKAGE (1) (2) TA SOIC – D SOIC – DW –0°C to 70°C SSOP – DB TSSOP – PW SOIC – D SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) (2) ORDERABLE PART NUMBER Tube of 40 MAX3232ECD Reel of 2500 MAX3232ECDR Tube of 40 MAX3232ECDW Reel of 2000 MAX3232ECDWR Tube of 80 MAX3232ECDB Reel of 2000 MAX3232ECDBR Tube of 90 MAX3232ECPW Reel of 2000 MAX3232ECPWR Tube of 40 MAX3232EID Reel of 2500 MAX3232EIDR Tube of 40 MAX3232EIDW Reel of 2000 MAX3232EIDWR Tube of 80 MAX3232EIDB Reel of 2000 MAX3232EIDBR Tube of 90 MAX3232EIPW Reel of 2000 MAX3232EIPWR TOP-SIDE MARKING MAX3232EC MAX3232EC MP232EC MP232EC MAX3232EI MAX3232EI MP232EI MP232EI Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2007, Texas Instruments Incorporated MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. FUNCTION TABLES ABC EACH DRIVER (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 2 RIN2 Submit Documentation Feedback MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative output supply voltage V+ – V– Supply voltage difference (2) VI Input voltage range VO range (2) θJA Package thermal impedance (3) (4) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) Drivers –0.3 6 V Receivers –25 25 V –13.2 13.2 V –0.3 VCC + 0.3 V Drivers Output voltage range UNIT Receivers D package 73 DB package 82 DW package 57 PW package 108 –65 °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 4 VCC = 3.3 V Supply voltage VIH Driver high-level input voltage VIL Driver low-level input voltage VI Receiver input voltage TA (1) Operating free-air temperature VCC = 5 V DIN VCC = 3.3 V VCC = 5 V DIN MAX3232EC MAX3232EI MIN NO M MAX 3 3.3 3.6 4.5 5 5.5 2 5.5 2.4 5.5 UNIT V V 0 0.8 V –25 25 V 0 70 –40 85 °C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER ICC (1) (2) Supply current TEST CONDITIONS No load, VCC = 3.3 V or 5 V MIN TYP (2) MAX 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback 3 MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current rO Output resistance (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V 300 MAX UNIT V V ±0.01 ±1 µA ±0.01 ±1 µA ±35 ±60 mA Ω 10M Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER MIN TYP (2) MAX Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, See Figure 2 RL = 3 kΩ to 7 kΩ, SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 (1) (2) (3) 4 TEST CONDITIONS 150 250 kbit/s 300 ns Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback UNIT V/µs MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP (2) VCC – 0.6 VCC – 0.1 MAX V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 3 V V V 0.3 VI = ±3 V to ±25 V UNIT V 5 7 kΩ Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tsk(p) Pulse skew (3) (1) (2) (3) CL = 150 pF TYP (2) UNIT 300 ns 300 ns 300 ns Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback 5 MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) tTLH 3V Output −3 V TEST CIRCUIT SR(tr) + t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 Submit Documentation Feedback MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS664A – AUGUST 2005 – REVISED APRIL 2007 APPLICATION INFORMATION 1 − 16 + CBYPASS − = 0.1µF + C1 VCC C1+ 2 + † C3 V+ GND 15 − 3 4 14 DOUT1 C1− 13 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 4. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDW ACTIVE SOIC DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3232EIDRG4 ACTIVE SOIC D 16 MAX3232EIDW ACTIVE SOIC DW 16 MAX3232EIDWR ACTIVE SOIC DW 16 MAX3232EIPW ACTIVE TSSOP PW 16 90 MAX3232EIPWE4 ACTIVE TSSOP PW 16 MAX3232EIPWG4 ACTIVE TSSOP PW 16 MAX3232EIPWR ACTIVE TSSOP PW MAX3232EIPWRE4 ACTIVE TSSOP MAX3232EIPWRG4 ACTIVE TSSOP 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 30-Apr-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant MAX3232ECDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1 MAX3232ECDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 MAX3232ECDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1 MAX3232ECPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1 MAX3232EIDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1 MAX3232EIDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 MAX3232EIDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1 MAX3232EIPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) MAX3232ECDBR DB 16 MLA 333.2 333.2 28.58 MAX3232ECDR D 16 MLA 333.2 333.2 28.58 MAX3232ECDWR DW 16 TAI 346.0 346.0 33.0 MAX3232ECPWR PW 16 MLA 338.1 340.5 20.64 MAX3232EIDBR DB 16 MLA 333.2 333.2 28.58 MAX3232EIDR D 16 MLA 333.2 333.2 28.58 MAX3232EIDWR DW 16 TAI 346.0 346.0 33.0 MAX3232EIPWR PW 16 MLA 338.1 340.5 20.64 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 3 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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