LINER LTC2422IMS 1-/2-channel 20-bit upower no latency adcs in msop-10 Datasheet

LTC2421/LTC2422
1-/2-Channel 20-Bit µPower
No Latency ∆ΣTMADCs in MSOP-10
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FEATURES
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DESCRIPTIO
20-Bit ADCs in Tiny MSOP-10 Packages
1- or 2-Channel Inputs
Single Supply 2.7V to 5.5V Operation
Low Supply Current (200µA) and Auto Shutdown
Automatic Channel Selection (Ping-Pong) (LTC2422)
No Latency: Digital Filter Settles in a
Single Conversion Cycle
8ppm INL, No Missing Codes
4ppm Full-Scale Error
0.5ppm Offset
1.2ppm Noise
Zero Scale and Full Scale Set for Reference
and Ground Sensing
Internal Oscillator—No External Components Required
110dB Min, 50Hz/60Hz Notch Filter
Reference Input Voltage: 0.1V to VCC
Live Zero—Extended Input Range Accommodates
12.5% Overrange and Underrange
Pin Compatible with LTC2401/LTC2402
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APPLICATIO S
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Through a single pin, the LTC2421/LTC2422 can be
configured for better than 110dB rejection at 50Hz or
60Hz ±2%, or can be driven by an external oscillator for
a user defined rejection frequency in the range 1Hz to
120Hz. The internal oscillator requires no external frequency setting components.
These converters accept an external reference voltage
from 0.1V to VCC. With an extended input conversion
range of –12.5% VREF to 112.5% VREF (VREF = FSSET –
ZSSET), the LTC2421/LTC2422 smoothly resolve the offset and overrange problems of preceding sensors or
signal conditioning circuits.
The LTC2421/LTC2422 communicate through a 2- or
3-wire digital interface that is compatible with SPI and
MICROWIRETM protocols.
Weight Scales
Direct Temperature Measurement
Gas Analyzers
Strain Gauge Transducers
Instrumentation
Data Acquisition
Industrial Process Control
, LTC and LT are registered trademarks of Linear Technology Corporation.
No Latency ∆Σ is a trademark of Linear Technology Corporation.
MICROWIRE is a trademark of National Semiconductor Corporation.
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The LTC®2421/LTC2422 are 1- and 2-channel 2.7V to 5.5V
micropower 20-bit analog-to-digital converters with an
integrated oscillator, 8ppm INL and 1.2ppm RMS noise.
These ultrasmall devices use delta-sigma technology and
a new digital filter architecture that settles in a single cycle.
This eliminates the latency found in conventional ∆Σ
converters and simplifies multiplexed applications.
TYPICAL APPLICATIO
Pseudo Differential Bridge Digitizer
2.7V TO 5.5V
2.7V TO 5.5V
1µF
1
VCC
FO
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
1
VCC
2
3
4
5
FSSET
CH1
CH0
ZSSET
SCK
SDO
CS
GND
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
9
8
2
4
3-WIRE
SPI INTERFACE
3
VCC
LTC2422
FSSET
9
SCK
CH0
SDO
CH1
CS
ZSSET
GND
6
FO
7
5
6
8
3-WIRE
SPI INTERFACE
7
10
INTERNAL OSCILLATOR
60Hz REJECTION
24212 TA01
24012TA02
24212f
1
LTC2421/LTC2422
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ABSOLUTE MAXIMUM RATINGS
(Notes 1, 2)
Supply Voltage (VCC) to GND .......................– 0.3V to 7V
Analog Input Voltage to GND ....... – 0.3V to (VCC + 0.3V)
Reference Input Voltage to GND .. – 0.3V to (VCC + 0.3V)
Digital Input Voltage to GND ........ – 0.3V to (VCC + 0.3V)
Digital Output Voltage to GND ..... – 0.3V to (VCC + 0.3V)
Operating Temperature Range
LTC2421/LTC2422C ................................ 0°C to 70°C
LTC2421/LTC2422I ............................ – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
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PACKAGE/ORDER INFORMATION
ORDER PART NUMBER
ORDER PART NUMBER
TOP VIEW
TOP VIEW
1
2
3
4
5
VCC
FSSET
VIN
NC
ZSSET
10
9
8
7
6
FO
SCK
SDO
CS
GND
MS10 PACKAGE
10-LEAD PLASTIC MSOP
LTC2421CMS
LTC2421IMS
MS10 PART MARKING
LTUX
LTUY
TJMAX = 125°C, θJA = 130°C/W
VCC
FSSET
CH1
CH0
ZSSET
10
9
8
7
6
1
2
3
4
5
LTC2422CMS
LTC2422IMS
FO
SCK
SDO
CS
GND
MS10 PART MARKING
MS10 PACKAGE
10-LEAD PLASTIC MSOP
LTUZ
LTVA
TJMAX = 125°C, θJA = 130°C/W
Consult factory for parts specified with wider operating temperature ranges.
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CONVERTER CHARACTERISTICS The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Notes 3, 4)
PARAMETER
CONDITIONS
Resolution
MIN
●
20
20
No Missing Codes Resolution
0.1V ≤ FSSET ≤ VCC, ZSSET = 0V (Note 5)
●
Integral Nonlinearity
FSSET = 2.5V, ZSSET = 0V (Note 6)
FSSET = 5V, ZSSET = 0V (Note 6)
●
●
Offset Error
2.5V ≤ FSSET ≤ VCC, ZSSET = 0V
●
Offset Error Drift
2.5V ≤ FSSET ≤ VCC, ZSSET = 0V
Full-Scale Error
2.5V ≤ FSSET ≤ VCC, ZSSET = 0V
Full-Scale Error Drift
2.5V ≤ FSSET ≤ VCC, ZSSET = 0V
Total Unadjusted Error
FSSET = 2.5V, ZSSET = 0V
FSSET = 5V, ZSSET = 0V
TYP
MAX
Bits
Bits
4
8
10
20
0.5
10
0.04
4
●
UNITS
0.04
ppm of VREF
ppm of VREF
ppm of VREF
ppm of VREF/°C
10
ppm of VREF
ppm of VREF/°C
8
16
ppm of VREF
ppm of VREF
6
µVRMS
Output Noise
VIN = 0V (Note 13)
Normal Mode Rejection 60Hz ±2%
(Note 7)
●
110
130
dB
Normal Mode Rejection 50Hz ±2%
(Note 8)
●
110
130
dB
Power Supply Rejection, DC
FSSET = 2.5V, ZSSET = 0V, VIN = 0V
100
dB
Power Supply Rejection, 60Hz ±2%
FSSET = 2.5V, ZSSET = 0V, VIN = 0V, (Notes 7, 15)
110
dB
Power Supply Rejection, 50Hz ±2%
FSSET = 2.5V, ZSSET = 0V, VIN = 0V, (Notes 8, 15)
110
dB
24212f
2
LTC2421/LTC2422
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A ALOG I PUT A D REFERE CE
The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
VIN
Input Voltage Range
(Note 14)
FSSET
ZSSET
CS(IN)
Input Sampling Capacitance
CS(REF)
Reference Sampling Capacitance
IIN(LEAK)
Input Leakage Current
CS = VCC
●
–100
1
100
nA
IREF(LEAK)
Reference Leakage Current
VREF = 2.5V, CS = VCC
●
– 100
1
100
nA
●
ZSSET – 0.12VREF
Full-Scale Set Range
●
Zero-Scale Set Range
●
TYP
MAX
UNITS
FSSET + 0.12VREF
V
0.1 + ZSSET
VCC
V
0
FSSET – 0.1
V
1
pF
1.5
pF
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DIGITAL I PUTS A D DIGITAL OUTPUTS
The ● denotes specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
VIH
High Level Input Voltage
CS, FO
2.7V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 3.3V
●
MIN
VIL
Low Level Input Voltage
CS, FO
4.5V ≤ VCC ≤ 5.5V
2.7V ≤ VCC ≤ 5.5V
●
VIH
High Level Input Voltage
SCK
2.7V ≤ VCC ≤ 5.5V (Note 9)
2.7V ≤ VCC ≤ 3.3V (Note 9)
●
VIL
Low Level Input Voltage
SCK
4.5V ≤ VCC ≤ 5.5V (Note 9)
2.7V ≤ VCC ≤ 5.5V (Note 9)
●
IIN
Digital Input Current
CS, FO
0V ≤ VIN ≤ VCC
●
IIN
Digital Input Current
SCK
0V ≤ VIN ≤ VCC (Note 9)
●
CIN
Digital Input Capacitance
CS, FO
CIN
Digital Input Capacitance
SCK
(Note 9)
VOH
High Level Output Voltage
SDO
IO = – 800µA
●
VOL
Low Level Output Voltage
SDO
IO = 1.6mA
●
VOH
High Level Output Voltage
SCK
IO = – 800µA (Note 10)
●
VOL
Low Level Output Voltage
SCK
IO = 1.6mA (Note 10)
●
IOZ
High-Z Output Leakage
SDO
●
TYP
MAX
UNITS
2.5
2.0
V
V
0.8
0.6
V
V
2.5
2.0
V
V
0.8
0.6
V
V
–10
10
µA
–10
10
µA
10
pF
10
pF
VCC – 0.5
V
0.4
V
VCC – 0.5
V
–10
0.4
V
10
µA
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POWER REQUIRE E TS
The ● denotes specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
VCC
Supply Voltage
ICC
Supply Current
Conversion Mode
Sleep Mode
CONDITIONS
MIN
●
CS = 0V (Note 12)
CS = VCC (Note 12)
●
●
TYP
2.7
200
20
MAX
UNITS
5.5
V
300
30
µA
µA
24212f
3
LTC2421/LTC2422
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TI I G CHARACTERISTICS
The ● denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX
UNITS
fEOSC
External Oscillator Frequency Range
●
2.56
307.2
kHz
tHEO
External Oscillator High Period
tLEO
External Oscillator Low Period
●
0.5
390
µs
●
0.5
390
µs
tCONV
Conversion Time
FO = 0V
FO = VCC
External Oscillator (Note 11)
fISCK
Internal SCK Frequency
Internal Oscillator (Note 10)
External Oscillator (Notes 10, 11)
DISCK
Internal SCK Duty Cycle
(Note 10)
fESCK
External SCK Frequency Range
(Note 9)
●
tLESCK
External SCK Low Period
(Note 9)
●
250
ns
tHESCK
External SCK High Period
(Note 9)
●
250
ns
tDOUT_ISCK
Internal SCK 24-Bit Data Output Time
Internal Oscillator (Notes 10, 12)
External Oscillator (Notes 10, 11)
●
●
1.23
tDOUT_ESCK
External SCK 24-Bit Data Output Time
(Note 9)
●
t1
CS ↓ to SDO Low Z
●
0
150
ns
t2
CS ↑ to SDO High Z
●
0
150
ns
t3
CS ↓ to SCK ↓
(Note 10)
●
0
150
ns
t4
CS ↓ to SCK ↑
(Note 9)
●
50
tKQMAX
SCK ↓ to SDO Valid
tKQMIN
SDO Hold After SCK ↓
●
15
ns
t5
SCK Set-Up Before CS ↓
●
50
ns
t6
SCK Hold After CS ↓
●
●
●
●
130.86
133.53
136.20
157.03
160.23
163.44
20510/fEOSC (in kHz)
19.2
fEOSC/8
45
Note 1: Absolute Maximum Ratings are those values beyond which the
life of the device may be impaired.
Note 2: All voltage values are with respect to GND.
Note 3: VCC = 2.7 to 5.5V unless otherwise specified. Input source
resistance = 0Ω.
Note 4: Internal Conversion Clock source with the FO pin tied
to GND or to VCC or to external conversion clock source with
fEOSC = 153600Hz unless otherwise specified.
Note 5: Guaranteed by design, not subject to test.
Note 6: Integral nonlinearity is defined as the deviation of a code from
a straight line passing through the actual endpoints of the transfer
curve. The deviation is measured from the center of the quantization
band.
Note 7: FO = 0V (internal oscillator) or fEOSC = 153600Hz ±2%
(external oscillator).
Note 8: FO = VCC (internal oscillator) or fEOSC = 128000Hz ±2%
(external oscillator).
ms
ms
ms
kHz
kHz
55
%
2000
kHz
1.25
1.28
192/fEOSC (in kHz)
ms
ms
24/fESCK (in kHz)
ms
ns
200
●
(Note 5)
TYP
50
ns
ns
Note 9: The converter is in external SCK mode of operation such that
the SCK pin is used as digital input. The frequency of the clock signal
driving SCK during the data output is fESCK and is expressed in kHz.
Note 10: The converter is in internal SCK mode of operation such that
the SCK pin is used as digital output. In this mode of operation, the
SCK pin has a total equivalent load capacitance CLOAD = 20pF.
Note 11: The external oscillator is connected to the FO pin. The external
oscillator frequency, fEOSC, is expressed in kHz.
Note 12: The converter uses the internal oscillator.
FO = 0V or FO = VCC.
Note 13: The output noise includes the contribution of the internal
calibration operations.
Note 14: VREF = FSSET – ZSSET. The minimum input voltage is limited
to – 0.3V and the maximum to VCC + 0.3V.
Note 15: VCC (DC) = 4.1V, VCC (AC) = 2.8VP-P.
24212f
4
LTC2421/LTC2422
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TYPICAL PERFOR A CE CHARACTERISTICS
Total Unadjusted Error (3V Supply)
10
10
VCC = 3V
VREF = 2.5V
8
6
4
4
4
2
–2
–4
2
0
–2
0.5
0
1.5
2.0
1.0
INPUT VOLTAGE (V)
TA = –55°C, –45°C, 25°C, 90°C
–6
–8
2.5
–8
–10
0.5
0
1.5
2.0
1.0
INPUT VOLTAGE (V)
0
2.5
INL (5V Supply)
10
6
4
4
ERROR (ppm)
6
4
2
0
–2
–4
TA = –55°C, –45°C, 25°C, 90°C
–6
–8
2.60 2.65 2.70
INPUT VOLTAGE (V)
2.75
–10
2.80
1
0
3
2
INPUT VOLTAGE (V)
24212 G04
6
4
10
TA = 25°C
TA = 90°C
TA = –45°C
8
2
0
–2
4
0
–6
–8
–8
–10
5.00
5
VCC = 5V
TA = 25°C
120
–2
–6
24212 G07
3
2
INPUT VOLTAGE (V)
Offset Error vs Reference Voltage
VCC = 5V
VREF = 5V
2
–4
–0.05 –0.10 –0.15 –0.20 –0.25 –0.30
INPUT VOLTAGE (V)
1
150
4
–4
–10
0
24212 G06
6
TA = –55°C
0
–10
5
Positive Extended Input Range
Total Unadjusted Error (5V Supply)
ERROR (ppm)
VCC = 5V
VREF = 5V
8
4
24212 G05
Negative Extended Input Range
Total Unadjusted Error (5V Supply)
10
TA = –55°C, –45°C, 25°C, 90°C
–8
TA = –55°C
TA = 90°C
TA = 25°C
OFFSET ERROR (ppm)
2.55
–2
–6
–8
–10
2.50
2
0
–4
TA = –55°C, –45°C, 25°C, 90°C
–6
VCC = 5V
VREF = 5V
8
6
–2
–0.05 –0.10 –0.15 –0.20 –0.25 –0.30
INPUT VOLTAGE (V)
24212 G03
VCC = 5V
VREF = 5V
8
ERROR (ppm)
ERROR (ppm)
10
2
TA = –55°C
–6
Total Unadjusted Error (5V Supply)
–4
ERROR (ppm)
0
24212 G02
VCC = 3V
VREF = 2.5V
0
TA = –45°C
–2
–10
Positive Extended Input Range
Total Unadjusted Error (3V Supply)
8
TA = 25°C
2
–8
24212 G01
10
TA = 90°C
–4
–4
TA = –55°C, –45°C, 25°C, 90°C
–6
–10
ERROR (ppm)
6
0
VCC = 3V
VREF = 2.5V
8
6
ERROR (ppm)
ERROR (ppm)
10
VCC = 3V
VREF = 2.5V
8
Negative Extended Input Range
Total Unadjusted Error (3V Supply)
INL (3V Supply)
90
60
30
TA = –45°C
0
5.05
5.10 5.15 5.20
INPUT VOLTAGE (V)
5.25
5.30
24212 G08
0
1
3
4
2
REFERENCE VOLTAGE (V)
5
24212 G09
24212f
5
LTC2421/LTC2422
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TYPICAL PERFOR A CE CHARACTERISTICS
RMS Noise vs Reference Voltage
60
Offset Error vs VCC
10
VCC = 5V
TA = 25°C
VREF = 2.5V
TA = 25°C
30
20
5
VREF = 2.5V
TA = 25°C
7.5
RMS NOISE (ppm)
OFFSET ERROR (ppm)
RMS NOISE (ppm OF VREF)
50
40
RMS Noise vs VCC
10.0
0
–5
5.0
2.5
10
0
0
1
–10
5
2
3
4
REFERENCE VOLTAGE (V)
0
2.7
3.2
3.7
4.2
VCC (V)
5.2 5.5
4.7
24212 G10
RMS Noise vs Code Out
5.00
VCC = 5
=5
V
300 VREF= 0
IN
3.75
RMS NOISE (ppm)
200
150
100
3.7
4.2
VCC (V)
4.7
5.2 5.5
24212 G12
Offset Error vs Temperature
10
VCC = 5V
VREF = 5V
VIN = 0.3V TO 5.3V
TA = 25°C
OFFSET ERROR (ppm)
Noise Histogram
250
3.2
24212 G11
350
NUMBER OF READINGS
2.7
2.50
1.25
VCC = 5V
VREF = 5V
VIN = 0V
5
0
–5
50
–2
4
2
0
OUTPUT CODE (ppm)
6
0
7FFFF
CODE OUT (HEX)
FFFFF
–5
FULL-SCALE ERROR (ppm)
FULL-SCALE ERROR (ppm)
FULL-SCALE ERROR (ppm)
10
–25
0
120
Full-Scale Error vs VCC
0
5
95
24212 G15
Full-Scale Error
vs Reference Voltage
Full-Scale Error vs Temperature
VCC = 5V
VREF = 5V
VIN = 5V
70
–5
20
45
TEMPERATURE (°C)
24212 G14
24212 G13
10
–10
–55 –30
0
0
–50
–75
–100
VREF = 2.5V
VIN = 2.5V
TA = 25°C
5
0
–5
–125
–10
–55 –30
VCC = 5V
VIN = VREF
–150
70
–5
20
45
TEMPERATURE (°C)
95
120
24212 G16
0
1
2
3
4
REFERENCE VOLTAGE (V)
5
24212 G17
–10
2.7
3.2
3.7
4.2
VCC (V)
4.7
5.2 5.5
24212 G18
24212f
6
LTC2421/LTC2422
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TYPICAL PERFOR A CE CHARACTERISTICS
Conversion Current
vs Temperature
Sleep Current vs Temperature
220
VCC = 4.1V
VIN = 0V
–20 TA = 25°C
FO = 0
VCC = 5.5V
200
VCC = 4.1V
190
180
VCC = 2.7V
170
VCC = 2.7V
20
REJECTION (dB)
210
SUPPLY CURRENT (µA)
SUPPLY CURRENT (µA)
Rejection vs Frequency at VCC
0
30
230
VCC = 5V
10
150
– 55 –30
70
45
20
TEMPERATURE (°C)
–5
95
–5
20
45
70
TEMPERATURE (°C)
95
Rejection vs Frequency at VCC
Rejection vs Frequency at VCC
–80
–100
50
150
200
100
FREQUENCY AT VCC (Hz)
250
Rejection vs Frequency at VIN
VCC = 4.1V
VIN = 0V
–20 TA = 25°C
FO = 0
–20
–40
–40
–60
–80
–80
–100
–120
15200 15250 15300 15350 15400 15450 15500
FREQUENCY AT VCC (Hz)
–120
1
–70
–20
REJECTION (dB)
–80
–110
Rejection vs Frequency at VIN
0
VCC = 5V
VREF = 5V
VIN = 2.5V
FO = 0
–20
–40
–40
REJECTION (dB)
–60
–60
–80
–60
–80
–100
–120
–100
–130
250
100
150
200
FREQUENCY AT VIN (Hz)
24212 G24
Rejection vs Frequency at VIN
0
–100
50
24212 G22
24212 G21
–90
VCC = 5V
VREF = 5V
VIN = 2.5V
FO = 0
–60
–100
Rejection vs Frequency at VIN
1M
0
REJECTION (dB)
REJECTION (dB)
–60
100
10k
FREQUENCY AT VCC (Hz)
24212 G23
0
VCC = 4.1V
VIN = 0V
T = 25°C
–40 F A = 0
O
1
1
120
24212 G20
–20
REJECTION (dB)
–80
–120
0
–55 –30
120
24212 G19
REJECTION (dB)
–60
–100
160
–120
–40
–120
SAMPLE RATE = 15.36kHz ± 2%
–140
–120
15100
–12
–8
–4
0
4
8
12
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
24212 G25
15200
15300
15400
FREQUENCY AT VIN (Hz)
15500
–140
0
fS/2
fS
INPUT FREQUENCY
24212 G26
24212 G27
24212f
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LTC2421/LTC2422
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TYPICAL PERFOR A CE CHARACTERISTICS
VCC = 5V
VREF = 5V
FO = EXTERNAL
16
TA = –45°C
TA = 25°C
14
TA = 90°C
16
TA = –45°C
14
TA = 25°C
TA = 90°C
12
12
10
Resolution vs Output Rate
24
VCC = 3V
VREF = 2.5V
FO = EXTERNAL
18
TUE RESOLUTION (BITS)
18
TUE RESOLUTION (BITS)
INL vs Output Rate
20
10
0
10 20 30 40 50 60 70 80 90 100
OUTPUT RATE (Hz)
0
10 20 30 40 50 60 70 80 90 100
OUTPUT RATE (Hz)
24212 G28
24212 G29
EFFECTIVE RESOLUTION (BITS)
INL vs Output Rate
20
22
20
VCC = 5V
18 V
REF = 5V
TA = 25°C
fO = EXTERNAL
TA = 90°C
STANDARD DEVIATION
TA = –45°C
OF 100 SAMPLES
16
25
75
0 7.5
100
50
OUTPUT RATE (Hz)
24212 G30
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PIN FUNCTIONS
VCC (Pin 1): Positive Supply Voltage. Bypass to GND
(Pin␣ 6) with a 10µF tantalum capacitor in parallel with
0.1µF ceramic capacitor as close to the part as possible.
be connected directly to a ground plane through a minimum length trace or it should be the single-point-ground
in a single-point grounding system.
FSSET (Pin 2): Full-Scale Set Input. This pin defines the
full-scale input value. When VIN = FSSET, the ADC outputs
full scale (FFFFFH). The total reference voltage is
FSSET – ZSSET.
CS (Pin 7): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion, the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW on CS wakes up the ADC. A
LOW-to-HIGH transition on this pin disables the SDO
digital output. A LOW-to-HIGH transition on CS during the
Data Output transfer aborts the data transfer and starts a
new conversion.
CH0, CH1 (Pins 4, 3): Analog Input Channels. The input
voltage range is – 0.125 • VREF to 1.125 • VREF. For
VREF > 2.5V, the input voltage range may be limited by the
absolute maximum rating of – 0.3V to VCC + 0.3V. Conversions are performed alternately between CH0
and CH1 for the LTC2422. Pin 4 is a No Connect (NC) on
the LTC2421.
ZSSET (Pin 5): Zero-Scale Set Input. This pin defines the
zero-scale input value. When VIN = ZSSET, the ADC
outputs zero scale (00000H).
GND (Pin 6): Ground. Shared pin for analog ground,
digital ground, reference ground and signal ground. Should
SDO (Pin 8): Three-State Digital Output. During the data
output period, this pin is used for serial data output. When
the chip select CS is HIGH (CS = VCC), the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods, this pin can be used as a conversion status output. The conversion status can be observed by pulling CS
LOW.
24212f
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LTC2421/LTC2422
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PIN FUNCTIONS
SCK (Pin 9): Bidirectional Digital Clock Pin. In the Internal
Serial Clock Operation mode, SCK is used as digital output
for the internal serial interface clock during the data output
period. In the External Serial Clock Operation mode, SCK
is used as digital input for the external serial interface. An
internal pull-up current source is automatically activated
in Internal Serial Clock Operation mode. The Serial Clock
mode is determined by the level applied to SCK at power
up and the falling edge of CS.
FO (Pin 10): Frequency Control Pin. Digital input that
controls the ADC’s notch frequencies and conversion
time. When the FO pin is connected to VCC (FO = VCC), the
converter uses its internal oscillator and the digital filter’s
first null is located at 50Hz. When the FO pin is connected
to GND (FO = 0V), the converter uses its internal oscillator
and the digital filter’s first null is located at 60Hz. When FO
is driven by an external clock signal with a frequency fEOSC,
the converter uses this signal as its clock and the digital
filter first null is located at a frequency fEOSC/2560.
W
FUNCTIONAL BLOCK DIAGRA
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INTERNAL
OSCILLATOR
VCC
GND
VIN
AUTOCALIBRATION
AND CONTROL
∫
∫
FO
(INT/EXT)
∫
∑
SDO
SERIAL
INTERFACE
ADC
SCK
CS
VREF
DECIMATING FIR
DAC
24212 FD
TEST CIRCUITS
VCC
3.4k
SDO
SDO
3.4k
Hi-Z TO VOH
VOL TO VOH
VOH TO Hi-Z
CLOAD = 20pF
24212 TC01
CLOAD = 20pF
Hi-Z TO VOL
VOH TO VOL
VOL TO Hi-Z
24212 TC02
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The LTC2421/LTC2422 are pin compatible with the
LTC2401/LTC2402. The devices are designed to allow the
user to incorporate either device in the same design with
no modifications. While the LTC2421/LTC2422 output word
length is 24 bits (as opposed to the 32-bit output of the
LTC2401/LTC2402), its output clock timing can be identical to the LTC2401/LTC2402. As shown in Figure 1, the
LTC2421/LTC2422 data output is concluded on the falling
edge of the 24th serial clock (SCK). In order to maintain
drop-in compatibility with the LTC2401/LTC2402, it is
possible to clock the LTC2421/LTC2422 with an additional
8 serial clock pulses. This results in 8 additional output bits
which are always logic HIGH.
Converter Operation Cycle
The LTC2421/LTC2422 are low power, delta-sigma analog-to-digital converters with an easy to use 3-wire serial
interface. Their operation is simple and made up of three
states. The converter operating cycle begins with the conversion, followed by the sleep state and concluded with the
data output (see Figure 2). The 3-wire interface consists of
serial data output (SDO), a serial clock (SCK) and a chip
select (CS).
Once CS is pulled LOW and SCK rising edge is applied, the
device begins outputting the conversion result. There is no
latency in the conversion result. The data output corresponds to the conversion just performed. This result is
shifted out on the serial data out pin (SDO) under the
control of the serial clock (SCK). Data is updated on the
falling edge of SCK allowing the user to reliably latch data
on the rising edge of SCK, see Figure 4. The data output
state is concluded once 24 bits are read out of the ADC or
when CS is brought HIGH. The device automatically
initiates a new conversion and the cycle repeats.
Through timing control of the CS and SCK pins, the
LTC2421/LTC2422 offer several flexible modes of operation (internal or external SCK and free-running conversion modes). These various modes do not require
programming configuration registers; moreover, they do
not disturb the cyclic operation described above. These
modes of operation are described in detail in the Serial
Interface Timing Modes section.
CONVERT
SLEEP
Initially, the LTC2421/LTC2422 perform a conversion. Once
the conversion is complete, the device enters the sleep
state. While in this sleep state, power consumption is reduced by an order of magnitude if CS is HIGH. The part
remains in the sleep state as long as CS is logic HIGH. The
conversion result is held indefinitely in a static shift register while the converter is in the sleep state.
1
CS AND
SCK
0
DATA OUTPUT
24212 F02
Figure 2. LTC2421/LTC2422 State Transition Diagram
CS
8
8
8
8 (OPTIONAL)
SCK
SDO
EOC = 1
EOC = 0
DATA OUT
4 STATUS BITS 20 DATA BITS
CONVERSION
SLEEP
DATA OUTPUT
EOC = 1
LAST 8 BITS ALWAYS 1
CONVERSION
24212 F01
Figure 1. LTC2421/LTC2422 Compatible Timing with the LTC2401/LTC2402
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Conversion Clock
above. The first conversion result following POR is accurate within the specifications of the device.
A major advantage delta-sigma converters offer over conventional type converters is an on-chip digital filter (commonly known as Sinc or Comb filter). For high resolution,
low frequency applications, this filter is typically designed
to reject line frequencies of 50Hz or 60Hz plus their harmonics. In order to reject these frequencies in excess of
110dB, a highly accurate conversion clock is required. The
LTC2421/LTC2422 incorporate an on-chip highly accurate oscillator. This eliminates the need for external frequency setting components such as crystals or oscillators. Clocked by the on-chip oscillator, the LTC2421/
LTC2422 reject line frequencies (50Hz or 60Hz ±2%) a
minimum of 110dB.
The LTC2421/LTC2422 can accept a reference voltage (VREF
= FSSET – ZSSET) from 0V to VCC. The converter output
noise is determined by the thermal noise of the front-end
circuits, and as such, its value in microvolts is nearly constant with reference voltage. A decrease in reference voltage will not significantly improve the converter’s effective
resolution. On the other hand, a reduced reference voltage
will improve the overall converter INL performance. The
recommended range for the LTC2421/LTC2422 voltage
reference is 100mV to VCC.
Ease of Use
Input Voltage Range
The LTC2421/LTC2422 data output has no latency, filter
settling or redundant data associated with the conversion cycle. There is a one-to-one correspondence between the conversion and the output data. Therefore,
multiplexing an analog input voltage is easy.
The converter is able to accommodate system level offset
and gain errors as well as system level overrange situations due to its extended input range, see Figure 3. The
LTC2421/LTC2422 convert input signals within the extended input range of – 0.125 • VREF to 1.125 • VREF
(VREF = FSSET – ZSSET).
The LTC2421/LTC2422 perform offset and full-scale calibrations every conversion cycle. This calibration is transparent to the user and has no effect on the cyclic operation
described above. The advantage of continuous calibration
is extreme stability of offset and full-scale readings with
respect to time, supply voltage change and temperature
drift.
Power-Up Sequence
The LTC2421/LTC2422 automatically enter an internal reset
state when the power supply voltage VCC drops below
approximately 2.2V. This feature guarantees the integrity
of the conversion result and of the serial interface mode
selection which is performed at the initial power-up. (See
the 2-wire I/O sections in the Serial Interface Timing Modes
section.)
When the VCC voltage rises above this critical threshold,
the converter creates an internal power-on-reset (POR)
signal with duration of approximately 0.5ms. The POR
signal clears all internal registers. Following the POR signal, the LTC2421/LTC2422 start a normal conversion cycle
and follows the normal succession of states described
Reference Voltage Range
For large values of VREF (VREF = FSSET – ZSSET), this range
is limited by the absolute maximum voltage range of
– 0.3V to (VCC + 0.3V). Beyond this range, the input ESD
protection devices begin to turn on and the errors due to
the input leakage current increase rapidly.
Input signals applied to VIN may extend below ground by
– 300mV and above VCC by 300mV. In order to limit any
VCC + 0.3V
FSSET + 0.12VREF
FSSET
NORMAL
INPUT
RANGE
EXTENDED
INPUT
RANGE
ABSOLUTE
MAXIMUM
INPUT
RANGE
ZSSET
ZSSET – 0.12VREF
–0.3V
(VREF = FSSET – ZSSET)
24212 F03
Figure 3. LTC2421/LTC2422 Input Range
24212f
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fault current, a resistor of up to 5k may be added in series
with the VIN pin without affecting the performance of the
device. In the physical layout, it is important to maintain
the parasitic capacitance of the connection between this
series resistance and the VIN pin as low as possible; therefore, the resistor should be located as close as practical to
the VIN pin. The effect of the series resistance on the converter accuracy can be evaluated from the curves presented in the Analog Input/Reference Current section. In
addition, a series resistor will introduce a temperature dependent offset error due to the input leakage current. A
1nA input leakage current will develop a 1ppm offset error
on a 5k resistor if VREF = 5V. This error has a very strong
temperature dependency.
0␣ ≤␣ VIN ≤ VREF, this bit is LOW. If the input is outside the
normal input range, VIN > VREF or VIN < 0, this bit is HIGH.
The function of these bits is summarized in Table 1.
Table 1. LTC2421/LTC2422 Status Bits
Bit 23
EOC
Bit 22
CH0/CH1
Bit 21
SIG
Bit 20
EXR
VIN > VREF
0
*0/1
1
1
0 < VIN ≤ VREF
0
*0/1
1
0
0
*0/1
1/0
0
0
*0/1
0
1
Input Range
VIN =
0+/0 –
VIN < 0
*Bit 22 displays the channel number for the LTC2422. Bit 22 is always
0 for the LTC2421
Bit 19 (fifth output bit) is the most significant bit (MSB).
Bits 19-0 are the 20-bit conversion result MSB first.
Output Data Format
The LTC2421/LTC2422 serial output data stream is 24 bits
long. The first 4 bits represent status information indicating the sign, selected channel, input range and conversion
state. The next 20 bits are the conversion result, MSB first.
Bit 23 (first output bit) is the end of conversion (EOC)
indicator. This bit is available at the SDO pin during the
conversion and sleep states whenever the CS pin is LOW.
This bit is HIGH during the conversion and goes LOW
when the conversion is complete.
Bit 22 (second output bit) for the LTC2422, this bit is LOW
if the last conversion was performed on CH0 and HIGH for
CH1. This bit is always LOW for the LTC2421.
Bit 21 (third output bit) is the conversion result sign indicator (SIG). If VIN is >0, this bit is HIGH. If VIN is <0, this
bit is LOW. The sign bit changes state during the zero code.
Bit 20 (fourth output bit) is the extended input range (EXR)
indicator. If the input is within the normal input range
Bit 0 is the least significant bit (LSB).
Data is shifted out of the SDO pin under control of the serial
clock (SCK), see Figure 4. Whenever CS is HIGH, SDO
remains high impedance and any SCK clock pulses are
ignored by the internal data out shift register.
In order to shift the conversion result out of the device, CS
must first be driven LOW. EOC is seen at the SDO pin of the
device once CS is pulled LOW. EOC changes real time from
HIGH to LOW at the completion of a conversion. This signal may be used as an interrupt for an external microcontroller. Bit 23 (EOC) can be captured on the first rising edge
of SCK. Bit 22 is shifted out of the device on the first falling
edge of SCK. The final data bit (Bit 0) is shifted out on the
falling edge of the 23rd SCK and may be latched on the
rising edge of the 24th SCK pulse. On the falling edge of the
24th SCK pulse, SDO goes HIGH indicating a new conversion cycle has been initiated. This bit serves as EOC (Bit
23) for the next conversion cycle. Table 2 summarizes the
output data format.
CS
SDO
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXT
MSB
BIT 4
BIT 0
LSB20
Hi-Z
SCK
1
SLEEP
2
3
4
5
DATA OUTPUT
19
20
24
CONVERSION
24212 F04
Figure 4. Output Data Timing
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Table 2. LTC2421/LTC2422 Output Data Format
Bit 23
EOC
Bit 22*
CH0/CH1
Bit 21
SIG
Bit 20
EXR
Bit 19
MSB
Bit 18
Bit 17
Bit 16
Bit 15
…
Bit 0
LSB
VIN > 9/8 • VREF
0
CH0/CH1
1
1
0
0
0
1
1
...
1
9/8 • VREF
0
CH0/CH1
1
1
0
0
0
1
1
...
1
VREF + 1LSB
0
CH0/CH1
1
1
0
0
0
0
0
...
0
VREF
0
CH0/CH1
1
0
1
1
1
1
1
...
1
3/4VREF + 1LSB
0
CH0/CH1
1
0
1
1
0
0
0
...
0
3/4VREF
0
CH0/CH1
1
0
1
0
1
1
1
...
1
1/2VREF + 1LSB
0
CH0/CH1
1
0
1
0
0
0
0
...
0
1/2VREF
0
CH0/CH1
1
0
0
1
1
1
1
...
1
Input Voltage
1/4VREF + 1LSB
0
CH0/CH1
1
0
0
1
0
0
0
...
0
1/4VREF
0
CH0/CH1
1
0
0
0
1
1
1
...
1
0+/0 –
0
CH0/CH1
1/0**
0
0
0
0
0
0
...
0
–1LSB
0
CH0/CH1
0
1
1
1
1
1
1
...
1
–1/8 • VREF
0
CH0/CH1
0
1
1
1
1
0
0
...
0
VIN < –1/8 • VREF
0
CH0/CH1
0
1
1
1
1
0
0
...
0
*Bit 22 is always 0 for the LTC2421 **The sign bit changes state during the 0 code.
As long as the voltage on the VIN pin is maintained within
the – 0.3V to (VCC + 0.3V) absolute maximum operating
range, a conversion result is generated for any input value
from – 0.125 • VREF to 1.125 • VREF. For input voltages
greater than 1.125 • VREF, the conversion result is clamped
to the value corresponding to 1.125 • VREF. For input voltages below – 0.125 • VREF, the conversion result is clamped
to the value corresponding to – 0.125 • VREF.
Frequency Rejection Selection (FO Pin Connection)
The LTC2421/LTC2422 internal oscillator provides better
than 110dB normal mode rejection at the line frequency
and all its harmonics for 50Hz ±2% or 60Hz ±2%. For
60Hz rejection, FO (Pin 10) should be connected to GND
(Pin 6) while for 50Hz rejection the FO pin should be connected to VCC (Pin␣ 1).
The selection of 50Hz or 60Hz rejection can also be made
by driving FO to an appropriate logic level. A selection
change during the sleep or data output states will not
disturb the converter operation. If the selection is made
during the conversion state, the result of the conversion in
progress may be outside specifications but the following
conversions will not be affected.
When a fundamental rejection frequency different from
50Hz or 60Hz is required or when the converter must be
synchronized with an outside source, the LTC2421/
LTC2422 can operate with an external conversion clock.
The converter automatically detects the presence of an
external clock signal at the FO pin and turns off the internal
oscillator. The frequency fEOSC of the external signal must
be at least 2560Hz (1Hz notch frequency) to be detected.
The external clock signal duty cycle is not significant as
long as the minimum and maximum specifications for the
high and low periods tHEO and tLEO are observed.
While operating with an external conversion clock of a
frequency fEOSC, the LTC2421/LTC2422 provide better than
110dB normal mode rejection in a frequency range fEOSC/
2560 ±4% and its harmonics. The normal mode rejection
as a function of the input frequency deviation from fEOSC/
2560 is shown in Figure 5.
Whenever an external clock is not present at the FO pin, the
converter automatically activates its internal oscillator and
enters the Internal Conversion Clock mode. The LTC2421/
LTC2422 operation will not be disturbed if the change of
conversion clock source occurs during the sleep state or
during the data output state while the converter uses an
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synchronous 3-wire interface. During the conversion and
sleep states, this interface can be used to assess the converter status and during the data output state, it is used to
read the conversion result.
–60
–70
REJECTION (dB)
–80
–90
–100
Serial Clock Input/Output (SCK)
–110
The serial clock signal present on SCK (Pin 9) is used to
synchronize the data transfer. Each bit of data is shifted out
the SDO pin on the falling edge of the serial clock.
–120
–130
–140
–12
–8
–4
0
4
8
12
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
24212 F05
Figure 5. LTC2421/LTC2422 Normal Mode Rejection When
Using an External Oscillator of Frequency fEOSC
external serial clock. If the change occurs during the conversion state, the result of the conversion in progress may
be outside specifications but the following conversions
will not be affected. If the change occurs during the data
output state and the converter is in the Internal SCK mode,
the serial clock duty cycle may be affected but the serial
data stream will remain valid.
Table 3 summarizes the duration of each state as a function of FO.
In the Internal SCK mode of operation, the SCK pin is an
output and the LTC2421/LTC2422 create their own serial
clock by dividing the internal conversion clock by 8. In the
External SCK mode of operation, the SCK pin is used as
input. The internal or external SCK mode is selected on
power-up and then reselected every time a HIGH-to-LOW
transition is detected at the CS pin. If SCK is HIGH or
floating at power-up or during this transition, the converter enters the internal SCK mode. If SCK is LOW at
power-up or during this transition, the converter enters
the external SCK mode.
Serial Data Output (SDO)
SERIAL INTERFACE
The serial data output pin, SDO (Pin 8), drives the serial
data during the data output state. In addition, the SDO pin
is used as an end of conversion indicator during the conversion and sleep states.
The LTC2421/LTC2422 transmit the conversion results
and receives the start of conversion command through a
When CS (Pin 7) is HIGH, the SDO driver is switched to a
high impedance state. This allows sharing the serial
Table 3. LTC2421/LTC2422 State Duration
State
Operating Mode
CONVERT
Internal Oscillator
External Oscillator
Duration
FO = LOW
(60Hz Rejection)
133ms
FO = HIGH
(50Hz Rejection)
160ms
FO = External Oscillator
with Frequency fEOSC kHz
(fEOSC/2560 Rejection)
20510/fEOSCs
SLEEP
DATA OUTPUT
As Long As CS = HIGH Until CS = 0 and SCK
Internal Serial Clock
External Serial Clock with
Frequency fSCK kHz
FO = LOW/HIGH
(Internal Oscillator)
As Long As CS = LOW But Not Longer Than 1.28ms
(24 SCK cycles)
FO = External Oscillator with
Frequency fEOSC kHz
As Long As CS = LOW But Not Longer Than 192/fEOSCms
(24 SCK cycles)
As Long As CS = LOW But Not Longer Than 24/fSCKms
(24 SCK cycles)
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interface with other devices. If CS is LOW during the convert or sleep state, SDO will output EOC. If CS is LOW
during the conversion phase, the EOC bit appears HIGH on
the SDO pin. Once the conversion is complete, EOC goes
LOW. The device remains in the sleep state until the first
rising edge of SCK occurs while CS = 0. While in the sleep
state, the device is in a LOW power state if CS is HIGH.
Chip Select Input (CS)
The active LOW chip select, CS (Pin 7), is used to test the
conversion status and to enable the data output transfer as
described in the previous sections.
In addition, the CS signal can be used to trigger a new
conversion cycle before the entire serial data transfer has
been completed. The LTC2421/LTC2422 will abort any
serial data transfer in progress and start a new conversion
cycle anytime a LOW-to-HIGH transition is detected at the
CS pin after the converter has entered the data output state
(i.e., after the first rising edge of SCK occurs with CS = 0).
Finally, CS can be used to control the free-running modes
of operation, see Serial Interface Timing Modes section.
Grounding CS will force the ADC to continuously convert
at the maximum output rate selected by FO. Tying a capacitor to CS will reduce the output rate and power dissipation by a factor proportional to the capacitor’s value,
see Figures 13 to 15.
SERIAL INTERFACE TIMING MODES
The LTC2421/LTC2422’s 3-wire interface is SPI and
MICROWIRE compatible. This interface offers several
flexible modes of operation. These include internal/external serial clock, 2- or 3-wire I/O, single cycle conversion
and autostart. The following sections describe each of
these serial interface timing modes in detail. In all these
cases, the converter can use the internal oscillator (FO =
LOW or FO = HIGH) or an external oscillator connected to
the FO pin. Refer to Table 4 for a summary.
External Serial Clock, Single Cycle Operation
(SPI/MICROWIRE Compatible)
This timing mode uses an external serial clock to shift out
the conversion result and a CS signal to monitor and control the state of the conversion cycle, see Figure 6.
The serial clock mode is selected on the falling edge of CS.
To select the external serial clock mode, the serial clock pin
(SCK) must be LOW during each CS falling edge.
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
While CS is LOW, EOC is output to the SDO pin. EOC = 1
while a conversion is in progress and EOC = 0 if the device
is in the sleep state. Independent of CS, the device automatically enters the sleep state once the conversion is
complete. While in the sleep state, power is reduced an
order of magnitude if CS is HIGH.
When the device is in the sleep state (EOC = 0), its
conversion result is held in an internal static shift register.
The device remains in the sleep state until the first rising
edge of SCK is seen while CS is LOW. Data is shifted out
the SDO pin on each falling edge of SCK. This enables
external circuitry to latch the output on the rising edge of
SCK. EOC can be latched on the first rising edge of SCK
and the last bit of the conversion result can be latched on
the 24th rising edge of SCK. On the 24th falling edge of
SCK, the device begins a new conversion. SDO goes HIGH
(EOC = 1) indicating a conversion is in progress.
Table 4. LTC2421/LTC2422 Interface Timing Modes
Configuration
SCK
Source
Conversion
Cycle
Control
Data
Output
Control
Connection
and
Waveforms
External SCK, Single Cycle Conversion
External
CS and SCK
CS and SCK
Figures 6, 7
External SCK, 2-Wire I/O
External
SCK
SCK
Figure 8
Internal SCK, Single Cycle Conversion
Internal
CS ↓
CS ↓
Figures 9, 10
Internal SCK, 2-Wire I/O, Continuous Conversion
Internal
Continuous
Internal
Figure 11
Internal SCK, Autostart Conversion
Internal
CEXT
Internal
Figure 12
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At the conclusion of the data cycle, CS may remain LOW
and EOC monitored as an end-of-conversion interrupt.
Alternatively, CS may be driven HIGH setting SDO to Hi-Z.
As described above, CS may be pulled LOW at any time in
order to monitor the conversion status.
CS HIGH anytime between the first rising edge and the
24th falling edge of SCK, see Figure 7. On the rising edge
of CS, the device aborts the data output state and immediately initiates a new conversion. This is useful for systems not requiring all 24 bits of output data, aborting an
invalid conversion cycle or synchronizing the start of a
conversion.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
2
3
4
5
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
9
8
3-WIRE
SERIAL I/O
7
6
CS
TEST EOC
TEST EOC
SDO
Hi-Z
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 18
BIT 4
TEST EOC
BIT 0
LSB20
Hi-Z
Hi-Z
SCK
(EXTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F06
Figure 6. External Serial Clock, Single Cycle Operation
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
2
3
4
5
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
9
8
3-WIRE
SERIAL I/O
7
6
CS
BIT 0
SDO
TEST EOC
TEST EOC
EOC
Hi-Z
Hi-Z
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 9
Hi-Z
TEST EOC
BIT 8
Hi-Z
SCK
(EXTERNAL)
SLEEP
CONVERSION
SLEEP
DATA OUTPUT
DATA OUTPUT
CONVERSION
24212 F07
Figure 7. External Serial Clock, Reduced Data Output Length
24212f
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LTC2421/LTC2422
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goes HIGH (EOC = 1) indicating a new conversion has
begun.
External Serial Clock, 2-Wire I/O
This timing mode utilizes a 2-wire serial I/O interface. The
conversion result is shifted out of the device by an externally generated serial clock (SCK) signal, see Figure 8. CS
may be permanently tied to ground (Pin 6), simplifying the
user interface or isolation barrier.
Internal Serial Clock, Single Cycle Operation
This timing mode uses an internal serial clock to shift out
the conversion result and a CS signal to monitor and control the state of the conversion cycle, see Figure 9.
The external serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after VCC exceeds 2.2V. The level
applied to SCK at this time determines if SCK is internal or
external. SCK must be driven LOW prior to the end of POR
in order to enter the external serial clock timing mode.
In order to select the internal serial clock timing mode, the
serial clock pin (SCK) must be floating (Hi-Z) or pulled
HIGH prior to the falling edge of CS. The device will not
enter the internal serial clock mode if SCK is driven LOW
on the falling edge of CS. An internal weak pull-up resistor
is active on the SCK pin during the falling edge of CS;
therefore, the internal serial clock timing mode is automatically selected if SCK is not externally driven.
Since CS is tied LOW, the end-of-conversion (EOC) can
be continuously monitored at the SDO pin during the
convert and sleep states. EOC may be used as an interrupt to an external controller indicating the conversion
result is ready. EOC = 1 while the conversion is in progress
and EOC = 0 once the conversion enters the low power
sleep state. On the falling edge of EOC, the conversion
result is loaded into an internal static shift register. The
device remains in the sleep state until the first rising edge
of SCK. Data is shifted out the SDO pin on each falling
edge of SCK enabling external circuitry to latch data on
the rising edge of SCK. EOC can be latched on the first
rising edge of SCK. On the 24th falling edge of SCK, SDO
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
Once CS is pulled LOW, SCK goes LOW and EOC is output
to the SDO pin. EOC = 1 while a conversion is in progress
and EOC = 0 if the device is in the sleep state.
When testing EOC, if the conversion is complete (EOC = 0),
the device will exit the sleep state and enter the data output
state if CS remains LOW. In order to prevent the device
from exiting the low power sleep state, CS must be pulled
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
2
3
4
5
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
9
2-WIRE SERIAL I/O
8
7
6
CS
SDO
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 18
BIT 4
BIT 0
LSB20
SCK
(EXTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F08
Figure 8. External Serial Clock, CS = 0 Operation
24212f
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VCC
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
2
3
4
5
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10k
9
8
7
6
<tEOCtest
CS
TEST EOC
SDO
Hi-Z
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 18
BIT 4
BIT 0
TEST EOC
LSB20
Hi-Z
Hi-Z
Hi-Z
SCK
(INTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F09
Figure 9. Internal Serial Clock, Single Cycle Operation
HIGH before the first rising edge of SCK. In the internal
SCK timing mode, SCK goes HIGH and the device begins
outputting data at time tEOCtest after the falling edge of CS
(if EOC = 0) or tEOCtest after EOC goes LOW (if CS is LOW
during the falling edge of EOC). The value of tEOCtest is 23µs
if the device is using its internal oscillator (F0 = logic LOW
or HIGH). If FO is driven by an external oscillator of frequency fEOSC, then tEOCtest is 3.6/fEOSC. If CS is pulled
HIGH before time tEOCtest, the device remains in the sleep
state. The conversion result is held in the internal static
shift register.
If CS remains LOW longer than tEOCtest, the first rising
edge of SCK will occur and the conversion result is serially
shifted out of the SDO pin. The data output cycle begins on
this first rising edge of SCK and concludes after the 24th
rising edge. Data is shifted out the SDO pin on each falling
edge of SCK. The internally generated serial clock is output
to the SCK pin. This signal may be used to shift the conversion result into external circuitry. EOC can be latched
on the first rising edge of SCK and the last bit of the conversion result on the 24th rising edge of SCK. After the
24th rising edge, SDO goes HIGH (EOC = 1), SCK stays
HIGH, and a new conversion starts.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
CS HIGH anytime between the first and 24th rising edge of
SCK, see Figure 10. On the rising edge of CS, the device
aborts the data output state and immediately initiates a
new conversion. This is useful for systems not requiring
all 24 bits of output data, aborting an invalid conversion
cycle, or synchronizing the start of a conversion. If CS is
pulled HIGH while the converter is driving SCK LOW, the
internal pull-up is not available to restore SCK to a logic
HIGH state. This will cause the device to exit the internal
serial clock mode on the next falling edge of CS. This can
be avoided by adding an external 10k pull-up resistor to
the SCK pin or by never pulling CS HIGH when SCK is LOW.
Whenever SCK is LOW, the LTC2421/LTC2422’s internal
pull-up at pin SCK is disabled. Normally, SCK is not externally driven if the device is in the internal SCK timing mode.
However, certain applications may require an external driver
on SCK. If this driver goes Hi-Z after outputting a LOW
signal, the LTC2421/LTC2422’s internal pull-up remains
disabled. Hence, SCK remains LOW. On the next falling
edge of CS, the device is switched to the external SCK
timing mode. By adding an external 10k pull-up resistor to
SCK, this pin goes HIGH once the external driver goes
Hi-Z. On the next CS falling edge, the device will remain in
the internal SCK timing mode.
24212f
18
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VCC
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
0V TO FSSET – 100mV
> tEOCtest
2
3
4
5
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10k
9
8
7
6
<tEOCtest
CS
TEST EOC
BIT 0
SDO
TEST EOC
EOC
Hi-Z
Hi-Z
Hi-Z
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 18
Hi-Z
BIT 8
TEST EOC
Hi-Z
SCK
(INTERNAL)
SLEEP
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F10
DATA OUTPUT
Figure 10. Internal Serial Clock, Reduced Data Output Length
A similar situation may occur during the sleep state when
CS is pulsed HIGH-LOW-HIGH in order to test the conversion status. If the device is in the sleep state (EOC = 0), SCK
will go LOW. Once CS goes HIGH (within the time period
defined above as tEOCtest), the internal pull-up is activated.
For a heavy capacitive load on the SCK pin, the internal
pull-up may not be adequate to return SCK to a HIGH level
before CS goes low again. This is not a concern under
normal conditions where CS remains LOW after detecting
EOC = 0. This situation is easily overcome by adding an
external 10k pull-up resistor to the SCK pin.
Internal Serial Clock, 2-Wire I/O,
Continuous Conversion
This timing mode uses a 2-wire, all output (SCK and SDO)
interface. The conversion result is shifted out of the device
by an internally generated serial clock (SCK) signal, see
Figure 11. CS may be permanently tied to ground (Pin 6),
simplifying the user interface or isolation barrier.
The internal serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after VCC exceeds 2.2V. An internal
weak pull-up is active during the POR cycle; therefore, the
internal serial clock timing mode is automatically selected
if SCK is not externally driven LOW (if SCK is loaded such
that the internal pull-up cannot pull the pin HIGH, the external SCK mode will be selected).
During the conversion, the SCK and the serial data output
pin (SDO) are HIGH (EOC = 1). Once the conversion is
complete, SCK and SDO go LOW (EOC = 0) indicating the
conversion has finished and the device has entered the
sleep state. The part remains in the sleep state a minimum
amount of time (1/2 the internal SCK period) then immediately begins outputting data. The data output cycle begins
on the first rising edge of SCK and ends after the 24th
rising edge. Data is shifted out the SDO pin on each falling
edge of SCK. The internally generated serial clock is output to the SCK pin. This signal may be used to shift the
conversion result into external circuitry. EOC can be latched
on the first rising edge of SCK and the last bit of the
conversion result can be latched on the 24th rising edge
of SCK. After the 24th rising edge, SDO goes HIGH
(EOC = 1) indicating a new conversion is in progress. SCK
remains HIGH during the conversion.
24212f
19
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VCC
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
10
LTC2422
2
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
3
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
4
5
0V TO FSSET – 100mV
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10k
9
8
7
6
CS
SDO
BIT 23
BIT 22
BIT 21
BIT 20
BIT 19
EOC
CH0/CH1
SIG
EXR
MSB
BIT 18
BIT 4
BIT 0
LSB20
SCK
(INTERNAL)
CONVERSION
DATA OUTPUT
CONVERSION
24212 F11
SLEEP
Figure 11. Internal Serial Clock, Continuous Operation
Internal Serial Clock, Autostart Conversion
This timing mode is identical to the internal serial clock,
2-wire I/O described above with one additional feature.
Instead of grounding CS, an external timing capacitor is
tied to CS.
While the conversion is in progress, the CS pin is held
HIGH by an internal weak pull-up. Once the conversion is
complete, the device enters the low power sleep state and
an internal 25nA current source begins discharging the
capacitor tied to CS, see Figure 12. The time the converter
spends in the sleep state is determined by the value of the
external timing capacitor, see Figures 13 and 14. Once the
voltage at CS falls below an internal threshold (≈1.4V), the
device automatically begins outputting data. The data output cycle begins on the first rising edge of SCK and ends
on the 24th rising edge. Data is shifted out the SDO pin on
each falling edge of SCK. The internally generated serial
clock is output to the SCK pin. This signal may be used to
shift the conversion result into external circuitry. After the
24th rising edge, CS is pulled HIGH and a new conversion
is immediately started. This is useful in applications requiring periodic monitoring and ultralow power. Figure 15
shows the average supply current as a function of capacitance on CS.
It should be noticed that the external capacitor discharge
current is kept very small in order to decrease the converter power dissipation in the sleep state. In the autostart
mode, the analog voltage on the CS pin cannot be
observed without disturbing the converter operation
using a regular oscilloscope probe. When using this configuration, it is important to minimize the external leakage
current at the CS pin by using a low leakage external capacitor and properly cleaning the PCB surface.
The internal serial clock mode is selected every time the
voltage on the CS pin crosses an internal threshold voltage. An internal weak pull-up at the SCK pin is active while
CS is discharging; therefore, the internal serial clock timing mode is automatically selected if SCK is floating. It is
important to ensure there are no external drivers pulling
SCK LOW while CS is discharging.
DIGITAL SIGNAL LEVELS
The LTC2421/LTC2422’s digital interface is easy to use.
Its digital inputs (FO, CS and SCK in External SCK mode of
operation) accept standard TTL/CMOS logic levels and the
internal hysteresis receivers can tolerate edge rates as
slow as 100µs. However, some considerations are required
24212f
20
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VCC
2.7V TO 5.5V
VCC
1µF
1
VCC
FO
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
10
LTC2422
REFERENCE VOLTAGE
ZSSET + 0.1V TO VCC
2
3
ANALOG INPUT RANGE
ZSSET – 0.12VREF TO
FSSET + 0.12VREF
(VREF = FSSET – ZSSET)
FSSET
SCK
CH1
SDO
CH0
CS
4
0V TO FSSET – 100mV
5
ZSSET
GND
10k
9
8
7
CEXT
6
VCC
CS
GND
BIT 23
SDO
BIT 22
BIT 21
BIT 0
SIG
EOC
Hi-Z
Hi-Z
SCK
(INTERNAL)
CONVERSION
DATA OUTPUT
SLEEP
CONVERSION
2420 F12
Figure 12. Internal Serial Clock, Autostart Operation
6
250
tSAMPLE (SEC)
5
4
3
2
VCC = 5V
VCC = 3V
1
10
100
250
VCC = 5V
200
VCC = 3V
150
100
50
1
0
300
SUPPLY CURRENT (µARMS)
300
SUPPLY CURRENT (µARMS)
7
1000
10000
CAPACITANCE ON CS (pF)
100000
200
VCC = 3V
150
100
50
0
0
1
10
100
1000
10000
CAPACITANCE ON CS (pF)
100000
1
10
100
1000
10000
CAPACITANCE ON CS (pF)
24212 F15
24212 F13
Figure 13. CS Capacitance vs tSAMPLE
VCC = 5V
Figure 14. CS Capacitance
vs Output Rate
to take advantage of exceptional accuracy and low supply
current.
The digital output signals (SDO and SCK in Internal SCK
mode of operation) are less of a concern because they are
not generally active during the conversion state.
100000
24212 F15
Figure 15. CS Capacitance
vs Supply Current
In order to preserve the LTC2421/LTC2422’s accuracy, it
is very important to minimize the ground path impedance
which may appear in series with the input and/or reference
signal and to reduce the current which may flow through
this path. The GND pin should be connected to a low
24212f
21
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resistance ground plane through a minimum length trace.
The use of multiple via holes is recommended to further
reduce the connection resistance.
In an alternative configuration, the GND pin of the converter can be the single-point-ground in a single point
grounding system. The input signal ground, the reference
signal ground, the digital drivers ground (usually the digital ground) and the power supply ground (the analog
ground) should be connected in a star configuration with
the common point located as close to the GND pin as
possible.
The power supply current during the conversion state
should be kept to a minimum. This is achieved by restricting the number of digital signal transitions occurring during this period.
While a digital input signal is in the range 0.5V to
(VCC␣ –␣ 0.5V), the CMOS input receiver draws additional
current from the power supply. It should be noted that,
when any one of the digital input signals (FO, CS and SCK
in External SCK mode of operation) is within this range, the
LTC2421/LTC2422 power supply current may increase
even if the signal in question is at a valid logic level. For
micropower operation and in order to minimize the potential errors due to additional ground pin current, it is recommended to drive all digital input signals to full CMOS levels
[VIL < 0.4V and VOH > (VCC – 0.4V)].
Severe ground pin current disturbances can also occur
due to the undershoot of fast digital input signals. Undershoot and overshoot can occur because of the impedance mismatch at the converter pin when the transition
time of an external control signal is less than twice the
propagation delay from the driver to LTC2421/LTC2422.
For reference, on a regular FR-4 board, signal propagation velocity is approximately 183ps/inch for internal
traces and 170ps/inch for surface traces. Thus, a driver
generating a control signal with a minimum transition
time of 1ns must be connected to the converter pin through
a trace shorter than 2.5 inches. This problem becomes
particularly difficult when shared control lines are used
and multiple reflections may occur. The solution is to
carefully terminate all transmission lines close to their
characteristic impedance.
Parallel termination near the LTC2421/LTC2422 pin will
eliminate this problem but will increase the driver power
dissipation. A series resistor between 27Ω and 56Ω placed
near the driver or near the LTC2421/LTC2422 pin will also
eliminate this problem without additional power dissipation. The actual resistor value depends upon the trace
impedance and connection topology.
Driving the Input and Reference
The analog input and reference of the typical delta-sigma
analog-to-digital converter are applied to a switched capacitor network. This network consists of capacitors switching between the analog input (VIN), ZSSET (Pin 5) and FSSET
(Pin 2). The result is small current spikes seen at both VIN
and VREF. A simplified input equivalent circuit is shown in
Figure 16.
The key to understanding the effects of this dynamic input
current is based on a simple first order RC time constant
model. Using the internal oscillator, the LTC2421/
LTC2422’s internal switched capacitor network is clocked
at 153,600Hz corresponding to a 6.5µs sampling period.
Fourteen time constants are required each time a capacitor
is switched in order to achieve 1ppm settling accuracy.
Therefore, the equivalent time constant at VIN and VREF
should be less than 6.5µs/14 = 460ns in order to achieve
1ppm accuracy.
VCC
IREF(LEAK)
RSW
5k
VREF
IREF(LEAK)
IIN
VCC
IIN(LEAK) RSW
5k
AVERAGE INPUT CURRENT:
IIN = 0.25(VIN – 0.5 • VREF)fCEQ
VIN
CEQ
1pF (TYP)
IIN(LEAK)
RSW
5k
GND
24212 F16
SWITCHING FREQUENCY
f = 153.6kHz FOR INTERNAL OSCILLATOR (fO = LOGIC LOW OR HIGH)
f = fEOSC FOR EXTERNAL OSCILLATORS
Figure 16. LTC2421/LTC2422 Equivalent Analog Input Circuit
24212f
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Input Current (VIN)
If complete settling occurs on the input, conversion results will be uneffected by the dynamic input current. If the
settling is incomplete, it does not degrade the linearity
performance of the device. It simply results in an offset/
full-scale shift, see Figure 17. To simplify the analysis of
input dynamic current, two separate cases are assumed:
large capacitance at VIN (CIN > 0.01µF) and small capacitance at VIN (CIN < 0.01µF).
TUE
If the total capacitance at VIN (see Figure 18) is small
(< 0.01µF), relatively large external source resistances (up
to 80k for 20pF parasitic capacitance) can be tolerated
without any offset/full-scale error. Figures 19 and 20 show
a family of offset and full-scale error curves for various
small valued input capacitors (CIN < 0.01µF) as a function
of input source resistance.
For large input capacitor values (CIN > 0.01µF), the input
spikes are averaged by the capacitor into a DC current. The
gain shift becomes a linear function of input source resistance independent of input capacitance, see Figures 21
and 22. The equivalent input impedance is 16.6MΩ. This
results in ±150nA of input dynamic current at the extreme
values of VIN (VIN = 0V and VIN = VREF, when VREF = 5V).
This corresponds to a 0.3ppm shift in offset and full-scale
readings for every 10Ω of input source resistance.
35
CIN = 22µF
CIN = 10µF
CIN = 1µF
CIN = 0.1µF
CIN = 0.01µF
CIN = 0.001µF
ZSSET
FSSET
VIN
24212 F17
Figure 17. Offset/Full-Scale Shift
OFFSET ERROR (ppm)
30
RSOURCE
INTPUT
SIGNAL
SOURCE
CIN
CPAR
≅ 20pF
25
20 VCC = 5V
VREF = 5V
15 VIN = 0V
TA = 25°C
10
VIN
5
LTC2421/
LTC2422
0
0
200
400
600
RSOURCE (Ω)
24212 F17
24212 F20
Figure 20. Offset vs RSOURCE (Large C)
Figure 18. An RC Network at VIN
50
30
0
FULL-SCALE ERROR (ppm)
OFFSET ERROR (ppm)
5
VCC = 5V
VREF = 5V
VIN = 0V
TA = 25°C
40
CIN = 0pF
CIN = 100pF
CIN = 1000pF
20
CIN = 0.01µF
10
VCC = 5V
VREF = 5V
VIN = 0V
TA = 25°C
–5
–10
–15
–20
CIN = 22µF
CIN = 10µF
CIN = 1µF
CIN = 0.1µF
CIN = 0.01µF
CIN = 0.001µF
–25
–30
0
1
10
1000
800
1k
100
RSOURCE (Ω)
10k
100k
24212 F19
Figure 19. Offset vs RSOURCE (Small C)
–35
0
200
400
600
RSOURCE (Ω)
800
1000
24212 F21
Figure 21. Full-Scale Error vs RSOURCE (Large C)
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60
10
FULL-SCALE ERROR (ppm)
0
FULL-SCALE ERROR (ppm)
CVREF = 22µF
CVREF = 10µF
CVREF = 1µF
CVREF = 0.1µF
CVREF = 0.01µF
CVREF = 0.001µF
50
–10
CIN = 0pF
CIN = 100pF
CIN = 1000pF
–20
–30
VCC = 5V
VREF = 5V
VIN = 5V
TA = 25°C
–40
–50
1
10
CIN = 0.01µF
40
30 VCC = 5V
VREF = 5V
20 VIN = 5V
TA = 25°C
10
0
–10
100
1k
RSOURCE (Ω)
10k
0
100k
200
400
600
800
RESISTANCE AT VREF (Ω)
24212 F23
24212 F22
In addition to the input current spikes, the input ESD protection diodes have a temperature dependent leakage current. This leakage current, nominally 1nA (±100nA max),
results in a fixed offset shift of 10µV for a 10k source
resistance.
The effect of input leakage current is evident for CIN = 0 in
Figures 19 and 22. A leakage current of 3nA results in a
150µV (30ppm) error for a 50k source resistance. As
RSOURCE gets larger, the switched capacitor input current
begins to dominate.
Figure 23. Full-Scale Error vs RVREF (Large C)
500
FULL-SCALE ERROR (ppm)
Figure 22. Full-Scale Error vs RSOURCE (Small C)
1000
VCC = 5V
= 5V
V
400 VREF= 5V
IN
TA = 25°C
300
CVREF = 1000pF
CVREF = 100pF
200
CVREF = 0.01µF
100
0
CVREF = 0pF
–100
–200
1
10
Reference Current (VREF)
100
1k
10k
RESISTANCE AT VREF (Ω)
100k
24212 F24
Unlike the analog input, the integral nonlinearity of the
device can be degraded with excessive external RC time
constants tied to the reference input. If the capacitance at
node VREF is small (CVREF < 0.01µF), the reference input
can tolerate large external resistances without reduction
in INL, see Figure 25. If the external capacitance is large
(CVREF > 0.01µF), the linearity will be degraded by
Figure 24. Full-Scale Error vs RVREF (Small C)
50
VCC = 5V
= 5V
V
40 T REF
A = 25°C
INL ERROR (ppm)
Similar to the analog input, the reference input has a dynamic input current. This current has negligible effect on
the offset. However, the reference current at VIN = VREF is
similar to the input current at full-scale. For large values of
reference capacitance (CVREF > 0.01µF), the full-scale error shift is 0.03ppm/Ω of external reference resistance
independent of the capacitance at VREF, see Figure 23. If
the capacitance tied to VREF is small (CVREF < 0.01µF), an
input resistance of up to 80k (20pF parasitic capacitance
at VREF) may be tolerated, see Figure 24.
30
CVREF = 1000pF
20
CVREF = 100pF
10
CVREF = 0.01µF
0
–10
CVREF = 0pF
–20
1
10
100
1k
10k
RESISTANCE AT VREF (Ω)
100k
24212 F25
Figure 25. INL Error vs RVREF (Small C)
24212f
24
LTC2421/LTC2422
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APPLICATIO S I FOR ATIO
0.015ppm/Ω independent of capacitance at VREF, see
Figure 26.
–20
–40
REJECTION (dB)
In addition to the dynamic reference current, the VREF ESD
protection diodes have a temperature dependent leakage
current. This leakage current, nominally 1nA (±10nA max),
results in a fixed full-scale shift of 10µV for a 10k source
resistance.
0
–60
–80
–100
–120
10
CVREF = 22µF
CVREF = 10µF
CVREF = 1µF
CVREF = 0.1µF
CVREF = 0.01µF
CVREF = 0.001µF
8
INL ERROR (ppm)
6
4
2
–140
–2
24212 F27
–4
–6
–8
–10
0
200
fS
INPUT FREQUENCY
VCC = 5V
VREF = 5V
TA = 25°C
0
fS/2
0
400
600
800
RESISTANCE AT VREF (Ω)
1000
24212 F26
Figure 26. INL Error vs RVREF (Large C)
Figure 27. Sinc4 Filter Rejection
The modulator contained within the LTC2421/LTC2422
can handle large-signal level perturbations without saturating. Signal levels up to 40% of VREF do not saturate the
analog modulator. These signals are limited by the input
ESD protection to 300mV below ground and 300mV above
VCC.
Simple Basic Program for Interfacing to the
LTC2421/LTC2422
ANTIALIASING
One of the advantages delta-sigma ADCs offer over conventional ADCs is on-chip digital filtering. Combined with
a large oversampling ratio, the LTC2421/LTC2422 significantly simplify antialiasing filter requirements.
The digital filter provides very high rejection except at
integer multiples of the modulator sampling frequency
(fS), see Figure 27. The modulator sampling frequency is
256 • FO, where FO is the notch frequency (typically 50Hz
or 60Hz). The bandwidth of signals not rejected by the
digital filter is narrow (≈ 0.2%) compared to the bandwidth of the frequencies rejected.
As a result of the oversampling ratio (256) and the digital
filter, minimal (if any) antialias filtering is required in front
of the LTC2421/LTC2422. If passive RC components are
placed in front of the LTC2421/LTC2422, the input dynamic current should be considered (see Input Current
section). In cases where large effective RC time constants
are used, an external buffer amplifier may be required to
minimize the effects of input dynamic current.
VREF
VIN
SCK
LTC2421
LTC2422
SDO
CS
GND
DTR
CTS
RTS
PC
SERIAL
PORT
24212 F28
Figure 28
”TINY.BAS V1.0 Copyright (C) 2000 by J. A. Dutra and LTC, All rights reseved'
NOTE this program generates 32 SCK’s for compatibility to 24-bit parts
'For use with most LTC24xy demo boards
designed for the PC Com Port, QBASIC
'Outputs are chan%,signneg%,d2400 (magnitude), PPM, and v (volts)
CLS : ON ERROR GOTO 4970
cport = 1: REM INPUT "com port number "; cport
GOSUB 1900: timestart$ = TIME$
mcr% = port + 4: msr% = port + 6
COLOR 15: LOCATE 3, 1: PRINT "Hit any key to stop…
";
FOR np = 1 TO 2000: OUT port, c0%: NEXT np: 'Power Via TxD
DO: '-------------------------START LOOP here-------24212f
25
LTC2421/LTC2422
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APPLICATIO S I FOR ATIO
nummeas = nummeas + c1%
LOCATE 5, 21: PRINT "CHANNEL 1": LOCATE 5, 2: PRINT "CHANNEL 0"
LOCATE 2, 2: PRINT "Scan#="; nummeas; " "; DATE$; " "; TIME$;
FOR n% = port TO port + 7: OUT n%, 0: NEXT n%: ’Init UART regs
OUT mcr%, c0%: 'Initialize SCLK=0
CLOSE #1: DEF SEG = 0: RETURN ’--------------------------------------
k1 = km: d2400 = 0: chan% = c0%: signneg% = c0%
2000 ’SUB read MSR AND RETURN data dfrm% INTERFACE
FOR bita% = 31 TO 0 STEP -1: v31 = 1
x3% = INP(msr%) AND c16%: OUT mcr%, c1%
GOSUB 3000: OUT mcr%, c0%
148 GOSUB 2200: v31 = v31 + 1
150 IF bita% = 31 THEN GOTO 152 ELSE 156
OUT mcr%, c0%: RETURN ’---------------------------------------------
152 IF dfrm% = c0% THEN GOTO 156
155 IF v31 > 2 THEN LOCATE 16, 16: OUT port, c0%: PRINT "waiting for eoc":
IF v31 < 20000 THEN IF dfrm% = c1% THEN GOTO 148
IF dfrm% = 1 THEN LOCATE 17, 16: PRINT "Timed out on EOC,not fatal"
FOR bs = 1 TO 32: ' never got an eoc => clock it 32 times
2200 ’SUB READ THE DATA BIT dfrm% does NOT change sclock
x3% = INP(msr%) AND C16%: GOTO 2040: RETURN’---------------3000 REM delay sub !!!!!!!!!!
FOR n8% = 0 TO 1: OUT port, c0%: NEXT n8%: RETURN: ’---------3700 FOR n = 6 TO 9: LOCATE n, 20
GOSUB 2000: NEXT bs: GOTO 1800
156 LOCATE 16, 16: PRINT"
2040 IF x3% = c16% THEN dfrm% = c1% ELSE dfrm% = c0%
": GOSUB 2000
IF bita% = 30 THEN 161 ELSE 171 ' CHANNEL BIT !!!!!!!!!!!!!!!
161 IF dfrm% = c1% THEN chan% = c1%: ch1% = c0%
IF dfrm% = c0% THEN chan% = c0%: ch1% = ch1% + c1%
IF ch1% > c4% THEN GOSUB 3700: ch1% = c1%
171 IF bita% = 29 THEN IF dfrm% = c0% THEN signneg% = c1%: ' NEG
IF bita% <= 28 THEN d2400 = d2400 + (dfrm% * k1): k1 = k1 / c2%
NEXT bita%: k1 = 1: digin% = c0%: 'MATH BELOW
1600 PPM = (d2400 / km) * kn: rw% = 6: hz% = (chan% * 20) + 1
PRINT "
": NEXT n: RETURN’---------------------------
3800 ’SUB to convert PPM into Volts and print it
v = PPM * (5 / 1000000): v1 = v * 1000000: hz% = (chan% * 20) + 12
IF v <= .1 THEN PRINT v1; " "; : LOCATE rw% + 1, hz%: PRINT "uV "
IF v > .1 THEN PRINT v; " "; : LOCATE rw% + 1, hz%: PRINT "Volts";
RETURN’---------------------------------------------------------------4970 PRINT "ERROR !!!!!!!!!!!!!!!"
5000 PRINT : LOCATE 18, 1: PRINT "Ending!!": PRINT "Hit any key to exit."
PRINT "Start ="; timestart$; " End = "; TIME$; " # samples ="; nummeas
IF signneg% = c1% THEN 1700 ELSE 1705
CLOSE #1: END
1700 IF d2400 <> c0% THEN PPM = (PPM - 2000000)
Single Ended Half-Bridge Digitizer
with Reference and Ground Sensing
1705 LOCATE rw%, hz%: PRINT PPM; " "; : LOCATE rw%, hz% + 11:
PRINT "PPM";
LOCATE rw% + 1, (chan% * 20) + 1: GOSUB 3800: 'THIS WORKS!
1800 LOOP WHILE INKEY$ = "": REM Works with "DO"
GOTO 5000 ’rem END!!-------------- Subs follow !!----------------!!!
1900 ’ESSENTIAL INITIALIZATIONS
REM set some constants, since they can be accessed much faster
LET c128% = 128: c64% = 64: c32% = 32: c16% = 16: c8% = 8: c4% = 4
LET c3% = 3: c2% = 2: c1% = 1: c0% = 0: km = (2 ^ 30) - 1: kn = 1000000
IF cport = 2 THEN OPEN "COM2:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR
RANDOM AS #1: port = (&H2F8)
IF cport = 1 THEN OPEN "COM1:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR
RANDOM AS #1: port = (&H3F8)
Sensors convert real world phenomena (temperature, pressure, gas levels, etc.) into a voltage. Typically, this voltage
is generated by passing an excitation current through the
sensor. The wires connecting the sensor to the ADC form
parasitic resistors RP1 and RP2. The excitation current also
flows through parasitic resistors RP1 and RP2, as shown in
Figure 29. The voltage drop across these parasitic resistors leads to systematic offset and full-scale errors.
In order to eliminate the errors associated with these parasitic resistors, the LTC2421/LTC2422 include a full-scale
set input (FS SET ) and a zero-scale set input
(ZSSET). As shown in Figure 30, the FSSET pin acts as a
zero current full-scale sense input. Errors due to parasitic
24212f
26
LTC2421/LTC2422
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APPLICATIO S I FOR ATIO
resistance RP1 in series with the half-bridge sensor are
removed by the FSSET input to the ADC. The absolute fullscale output of the ADC (data out = FFFFFHEX ) will occur
at VIN = VB = FSSET, see Figure 31. Similarly, the offset
errors due to RP2 are removed by the ground sense input
ZSSET. The absolute zero output of the ADC (data out =
00000HEX) occurs at VIN = VA = ZSSET. Parasitic resistors
RP3 to RP5 have negligible errors due to the 1nA (typ)
leakage current at pins FSSET, ZSSET and VIN. The wide
dynamic input range (– 300mV to 5.3V) and low noise
(1.2ppm RMS) enable the LTC2421 or the LTC2422 to
directly digitize the output of the bridge sensor.
1
VB
RP3
IDC ≅ 0
IEXCITATION
RP4
IDC ≅ 0
VA
IEXCITATION
2
3
LTC2421
FSSET
SCK
VIN
SDO
CS
5
6
9
8
7
3-WIRE
SPI INTERFACE
ZSSET
GND
FO
10
24212 F03
Figure 30. Half-Bridge Digitizer with
Zero-Scale and Full-Scale Sense
12.5%
EXTENDED
RANGE
ADC DATA OUT
FFFFFH
+
V
– FULL-SCALE ERROR
SENSOR
RP2
RP5
RP2
The LTC2422 is ideal for applications requiring continuous monitoring of two input sensors. As shown in
Figure 32, the LTC2422 can monitor both a thermocouple
temperature probe and a cold junction temperature sensor. Absolute temperature measurements can be
performed with a variety of thermocouples using digital
cold junction compensation.
RP1
IDC ≅ 0
RP1
VCC
+
SENSOR OUTPUT
–
00000H
+
V
– OFFSET ERROR
12.5%
UNDER
RANGE
ZSSET
FSSET
VIN
24212 F29
Figure 29. Errors Due to Excitation Currents
24212 F31
Figure 31. Transfer Curve with Zero-Scale and Full-Scale Set
2.7V TO 5.5V
LTC2422
1
2
12k
COLD JUNCTION
THERMISTOR
100Ω
3
4
5
+
VCC
FO
FSSET
SCK
CH1
SDO
CH0
CS
ZSSET
GND
10
9
PROCESSOR
8
7
24212 F32
6
–
THERMOCOUPLE
ISOLATION
BARRIER
Figure 32. Isolated Temperature Measurement
24212f
27
LTC2421/LTC2422
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APPLICATIO S I FOR ATIO
The selection between CH0 and CH1 is automatic. Initially,
after power-up, a conversion is performed on CH0. For
each subsequent conversion, the input channel selection
is alternated. Embedded within the serial data output is a
status bit indicating which channel corresponds to the
conversion result. If the conversion was performed on
CH0, this bit (Bit 22) is LOW and is HIGH if the conversion
was performed on CH1 (see Figure 33).
There are no extra control or status pins required to perform the alternating 2-channel measurements. The
LTC2422 only requires two digital signals (SCK and SDO).
This simplification is ideal for isolated temperature measurements or systems where minimal control signals are
available.
Pseudo Differential Applications
Generally, designers choose fully differential topologies
for several reasons. First, the interface to a 4- or 6-wire
bridge is simple (it is a differential output). Second, they
require good rejection of line frequency noise. Third, they
typically look at a small differential signal sitting on a
large common mode voltage; they need accurate
measurements of the differential signal independent of
the common mode input voltage. Many applications currently using fully differential analog-to-digital converters
for any of the above reasons may migrate to a pseudo
differential conversion using the LTC2422.
conversion results may be digitally subtracted yielding the
differential result.
The LTC2422’s single ended rejection of line frequencies
(±2%) and harmonics is better than 110dB. Since the
device performs two independent single ended conversions each with > 110dB rejection, the overall common
mode and differential rejection is much better than the
80dB rejection typically found in other differential input
delta-sigma converters.
In addition to excellent rejection of line frequency noise,
the LTC2422 also exhibits excellent single ended noise
rejection over a wide range of frequencies due to its 4th
order sinc filter. Each single ended conversion independently rejects high frequency noise (> 60Hz). Care must be
taken to insure noise at frequencies below 15Hz and at
multiples of the ADC sample rate (15,360Hz) are not
present. For this application, it is recommended the
LTC2422 is placed in close proximity to the bridge sensor
in order to reduce the noise injected into the ADC input. By
performing three successive conversions (CH0-CH1-CH0),
the drift and low frequency noise can be measured and
compensated for digitally.
IEXCITATION
IDC = 0
2
350Ω
Direct Connection to a Full Bridge
350Ω
3
The LTC2422 interfaces directly to a 4- or 6-wire bridge,
as shown in Figure 34. The LTC2422 includes a FSSET and
a ZSSET for sensing the excitation voltage directly across
the bridge. This eliminates errors due to excitation currents flowing through parasitic resistors. The LTC2422
also includes two single ended input channels which can
tie directly to the differential output of the bridge. The two
4
350Ω
SDO
VCC
FSSET
LTC2422
9
SCK
CH1
SDO
CH0
CS
350Ω
IDC = 0
5
FO
8
3-WIRE
SPI INTERFACE
7
10
ZSSET
GND
6
24212 F32
Figure 34. Pseudo Differential Strain Guage Application
• • •
SCK
5V
1
• • •
CH1 DATA OUT
CH0 DATA OUT
24212 F33
EOC
EOC
CH1
CH0
Figure 33. Embedded Selected Channel Indicator
24212f
28
LTC2421/LTC2422
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The absolute accuracy (less than 10 ppm total error) of the
LTC2422 enables extremely accurate measurement of
small signals sitting on large voltages. Each of the two
pseudo differential measurements performed by the
LTC2422 is absolutely accurate independent of the common mode voltage output from the bridge. The pseudo
differential result obtained from digitally subtracting the
two single ended conversion results is accurate to within
the noise level of the device (3µVRMS) times the square
root of 2, independent of the common mode input voltage.
resistance changes as a function of temperature (100Ω to
400Ω for 0°C to 800°C). The same excitation current flows
back to the ADC ground and generates another voltage
drop across the return leads. In order to get an accurate
measurement of the temperature, these voltage drops must
be measured and removed from the conversion result.
Assuming the resistance is approximately the same for the
forward and return paths (R1 = R2), the auxiliary channel
on the LTC2422 can measure this drop. These errors are
then removed with simple digital correction.
Typically, a bridge sensor outputs 2mV/V full scale. With
a 5V excitation, this translates to a full-scale output of
10mV. Divided by the RMS noise of 8.4µV(= 6µV • 1.414),
this circuit yields 1190 counts with no averaging or amplification. If more counts are required, several conversions
may be averaged (the number of effective counts is increased by a factor of square root of 2 for each doubling
of averages).
The result of the first conversion on CH0 corresponds to an
input voltage of VRTD + R1 • IEXCITATION. The result of the
second conversion (CH1) is – R1 • IEXCITATION. Note, the
LTC2422’s input range is not limited to the supply rails, it
has underrange capabilities. The device’s input range is
– 300mV to VREF + 300mV. Adding the two conversion
results together, the voltage drop across the RTD’s leads
are cancelled and the final result is VRTD.
An RTD Temperature Digitizer
An Isolated, 20-Bit Data Acquisition System
RTDs used in remote temperature measurements often
have long lead lengths between the ADC and RTD sensor.
These long lead lengths lead to voltage drops due to excitation current in the interconnect to the RTD. This voltage
drop can be measured and digitally removed using the
LTC2422 (see Figure 35).
The LTC1535 is useful for signal isolation. Figure 36 shows
a fully isolated, 20-bit differential input A/D converter implemented with the LTC1535 and LTC2422. Power on the
isolated side is regulated by an LT1761-5.0 low noise, low
dropout micropower regulator. Its output is suitable for
driving bridge circuits and for ratiometric applications.
The excitation current (typically 200µA) flows from the
ADC through a long lead length to the remote temperature
sensor (RTD). This current is applied to the RTD, whose
During power-up, the LTC2422 becomes active at VCC =
2.3V, while the isolated side of the LTC1535 must wait for
VCC2 to reach its undervoltage lockout threshold of 4.2V.
5V
1
2
VCC
FSSET
LTC2422
IEXCITATION = 200µA
+
Pt
VRTD
100Ω
–
25Ω
R1
R2
4
SCK
CH0
SDO
1000pF
IEXCITATION = 200µA
IDC = 0
5k
3
25Ω
5k
0.1µF
5
CS
9
8
7
3-WIRE
SPI INTERFACE
CH1
FO
10
ZSSET
GND
6
24212 F35
Figure 35. RTD Remote Temperature Measurement
24212f
29
LTC2421/LTC2422
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APPLICATIO S I FOR ATIO
from the time power is applied to VCC1 until the LT1761’s
output has reached 5V, is approximately 1ms.
Below 4.2V, the LTC1535’s driver outputs Y and Z are in a
high impedance state, allowing the 1kΩ pull-down to define the logic state at SCK. When the LTC2422 first becomes active, it samples SCK; a logic “0” provided by the
1kΩ pull-down invokes the external serial clock mode. In
this mode, the LTC2422 is controlled by a single clock line
from the nonisolated side of the barrier, through the
LTC1535’s driver output Y. The entire power-up sequence,
Data returns to the nonisolated side through the LTC1535’s
receiver at RO. An internal divider on receiver input B sets
a logic threshold of approximately 3.4V at input A, facilitating communications with the LTC2422’s SDO output
without the need for any external components.
1/2 BAT54C
LT1761-5
+
T1
10µF
16V
TANT
IN
OUT
SHDN
BYP
10µF
+
GND
1µF
10µF
10V
TANT
2
+
1/2 BAT54C
2
RO ST1
RE
DE
DI VCC1
“SDO”
“SCK”
LOGIC 5V
1
10µF
10V
TANT
+
ST2
LTC1535
G1
1
1
VCC2
G2
2
ISOLATION
BARRIER
1
A
B
Y
Z
= LOGIC COMMON
10µF
CERAMIC
10µF
10V
TANT
2
LTC2422
FO
SCK
SDO
CS
GND
1k
2
VCC
FSSET
CH1
CH0
ZSSET
24212 F36
= FLOATING COMMON
2
2
T1 = COILTRONICS CTX02-14659
OR SIEMENS B78304-A1477-A3
Figure 36. Complete, Isolated 20-Bit Data Acquisition System
24212f
30
LTC2421/LTC2422
W
PACKAGE I FOR ATIO
U
U
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.50
3.05 ± 0.38
(.0197)
(.0120 ± .0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
0.497 ± 0.076
(.0196 ± .003)
REF
10 9 8 7 6
3.00 ± 0.102
(.118 ± .004)
NOTE 4
4.88 ± 0.10
(.192 ± .004)
DETAIL “A”
0° – 6° TYP
GAUGE PLANE
1 2 3 4 5
0.53 ± 0.01
(.021 ± .006)
DETAIL “A”
1.10
(.043)
MAX
0.86
(.034)
REF
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
0.50
(.0197)
NOTE:
TYP
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.13 ± 0.05
(.005 ± .002)
MSOP (MS) 1001
24212f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
31
LTC2421/LTC2422
U
TYPICAL APPLICATIO
convert either the thermal couple output or the thermistor
cold junction output. After each conversion, the devices
enter their sleep state and wait for the SCK signal before
clocking out data and beginning the next conversion.
Figure 37 shows the block diagram of a demo circuit
(contact LTC for a demonstration) of a multichannel
isolated temperature measurement system. This circuit
decodes an address to select which LTC2422 receives a
24-bit burst of SCK signal. All devices independently
D1
LTC1535 A
SDO
Y
SCK
LTC2422
RE
R0
SCK
ZSSET
CH1
CH0
HC138
D1
LTC1535 A
SDO
Y
SCK
R0
ZSSET
D1
HC138
LTC1535 A
SDO
Y
SCK
R0
HC595
ADDRESS
LATCH
+
–
CH1
CH0
2500V
VCC
FSSET
LTC2422
RE
SD0
VCC
FSSET
LTC2422
RE
DIN
(ADDRESS
OR COUNTER)
VCC
FSSET
ZSSET
CH1
CH0
SEE FIGURE 34 FOR
THE COMPLETE CIRCUIT
24212 F37
Figure 37. Mulitchannel Isolated Temperature Measurement System
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1019
Precision Bandgap Reference, 2.5V, 5V
3ppm/°C Drift, 0.05% Max
LTC1050
Precision Chopper Stabilized Op Amp
No External Components 5µV Offset, 1.6µVP-P Noise
LT1236A-5
Precision Bandgap Reference, 5V
0.05% Max, 5ppm/°C Drift
LTC1391
8-Channel Multiplexer
Low RON: 45Ω, Low Charge Injection Serial Interface
LT1461-2.5
Precision Micropower Voltage Reference
50µA Supply Current, 3ppm/°C Drift
LTC1535
Isolated RS485 Transceiver
2500VRMS Isolation
LTC2400
24-Bit, No Latency ∆Σ ADC in SO-8
4ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2401/LTC2402
1-/2-Channel, 24-Bit, No Latency ∆Σ ADC in MSOP
0.6ppm Noise, 4ppm INL, Pin Compatible with the LTC2421/LTC2422
LTC2404/LTC2408
4-/8-Channel, 24-Bit, No Latency ∆Σ ADC
4ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2413
24-Bit, No Latency ∆Σ ADC
Simultaneous 50Hz and 60Hz Rejection, 0.16ppm Noise
LTC2415
24-Bit, Fully Differential, No Latency ∆Σ ADC
15Hz Output Rate at 60Hz Rejection, Pin Conpatible with the LTC2410
LTC2420
20-Bit, No Latency ∆Σ ADC in SO-8
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2400
LTC2424/LTC2428
4-/8-Channel, 20-Bit, No Latency ∆Σ ADC
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2404/LTC2408
LTC2430
20-Bit, Fully Differential, No Latency ∆Σ ADC in SSOP-16
0.16ppm Noise, 2ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2431
24-Bit, Fully Differential, No Latency ∆Σ ADC in MS10
0.29ppm Noise, 4ppm INL, 10ppm Total Unadjusted Error, 200µA
24212f
32
Linear Technology Corporation
LT/TP 0202 2K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
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www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2002