ON NZ9F22VT5G Zener voltage regulator Datasheet

NZ9F2V4T5G,
SZNZ9F2V4T5G SERIES
Zener Voltage Regulators
250 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
www.onsemi.com
1
Cathode
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 24 V
• Steady State Power Rating of 250 mW
• Small Body Outline Dimensions:
•
•
•
•
2
Anode
MARKING
DIAGRAM
2
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
Low Body Height: 0.016″ (0.40 mm)
ESD Rating of Class 3 (>16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
SOD−923
CASE 514AB
1
X MG
G
2
X = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
ORDERING INFORMATION
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
Junction and Storage Temperature Range
Package
Shipping†
NZ9FxxxxT5G,
SZNZ9FxxxxT5G
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Device
Symbol
Max
Unit
PD
250
2.0
mW
mW/°C
RqJA
500
°C/W
TJ, Tstg
−65 to
+150
°C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2016
November, 2016 − Rev. 4
1
Publication Order Number:
NZ9F2V4/D
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Parameter
Symbol
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
VZ VR
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
C
IR VF
IZT
Zener Voltage Regulator
Maximum Temperature Coefficient of VZ
Max. Capacitance @VR = 0 and f = 1 MHz
100
80
POWER DISSIPATION (%)
QVZ
IF
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 1. Steady State Power Derating
www.onsemi.com
2
150
V
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Zener Voltage
(Note 1)
VZ (Volts)
Zener Impedance
@ IZT
ZZT
@ IZT
Leakage Current
ZZK @ IZK
QVZ
(mV/k) @ IZT
IR @ VR
C
@ VR = 0
f = 1 MHz
Device***
Device
Marking
Min
Max
mA
W
W
mA
mA
Volts
Min
Max
pF
SZ, NZ9F2V4T5G
J
2.28
2.52
5
100
1000
1
50
1
−3.5
0
210
SZ, NZ9F2V7T5G
E**
2.57
2.84
5
100
1000
1
20
1
−3.5
0
210
SZ, NZ9F3V0T5G
T**
2.85
3.15
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V3T5G
Q
3.14
3.47
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V6T5G
3**
3.42
3.78
5
100
1000
1
10
1
−3.5
0
210
SZ, NZ9F3V9T5G
V**
3.71
4.10
5
100
1000
1
5
1
−3.5
−2.5
210
SZ, NZ9F4V3T5G
Y**
4.09
4.52
5
100
1000
1
5
1
−3.5
0
210
SZ, NZ9F4V7T5G
3
4.47
4.94
5
100
800
0.5
2
1
−3.5
0.2
150
SZ, NZ9F5V1T5G
4
4.85
5.36
5
80
500
0.5
2
1.5
−2.7
1.2
130
SZ, NZ9F5V6T5G
5
5.32
5.88
5
60
200
0.5
1
2.5
−2.0
2.5
115
SZ, NZ9F6V2T5G
6
5.89
6.51
5
60
100
0.5
1
3
0.4
3.7
110
SZ, NZ9F6V8T5G
A*
6.46
7.14
5
40
60
0.5
0.5
3.5
1.2
4.5
105
SZ, NZ9F7V5T5G
D*
7.13
7.88
5
30
60
0.5
0.5
4
2.5
5.3
100
SZ, NZ9F8V2T5G
E*
7.79
8.61
5
30
60
0.5
0.5
5
3.2
6.2
90
SZ, NZ9F9V1T5G
F*
8.65
9.56
5
30
60
0.5
0.5
6
3.8
7
80
SZ, NZ9F10VT5G
J*
9.50
10.50
5
30
60
0.5
0.1
7
4.5
8
80
SZ, NZ9F11VT5G
K*
10.45
11.55
5
30
60
0.5
0.1
8
5.4
9
80
SZ, NZ9F12VT5G
L*
11.40
12.60
5
30
80
0.5
0.1
9
6
10
80
SZ, NZ9F13VT5G
P*
12.35
13.65
5
37
80
0.5
0.1
10
7
11
75
SZ, NZ9F15VT5G
Q*
14.25
15.75
5
42
80
0.5
0.1
11
9.2
13
70
SZ, NZ9F16VT5G
R*
15.20
16.80
5
50
80
0.5
0.1
12
10.4
14
65
SZ, NZ9F18VT5G
T*
17.10
18.90
5
50
80
0.5
0.1
14
12.4
16
60
SZ, NZ9F20VT5G
V*
19.00
21.00
5
55
100
0.5
0.1
15.4
14.4
18
55
SZ, NZ9F22VT5G
Y*
20.90
23.10
5
55
100
0.5
0.1
16.8
15.4
20
55
SZ, NZ9F24VT5G
F
22.80
25.20
5
70
120
0.5
0.1
18.9
16.8
22
50
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*Rotated 90°.
**Rotated 270°.
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
www.onsemi.com
3
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
DIM
A
b
c
D
E
HE
L
L2
A
c
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
SIDE VIEW
2X
SOLDERING FOOTPRINT*
L
2X
0.36
2X
1.20
2X
0.25
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NZ9F2V4/D
Similar pages