NZ9F2V4T5G, SZNZ9F2V4T5G SERIES Zener Voltage Regulators 250 mW SOD−923 Surface Mount This series of Zener diodes is packaged in a SOD−923 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. www.onsemi.com 1 Cathode Specification Features: • Standard Zener Breakdown Voltage Range − 2.4 V to 24 V • Steady State Power Rating of 250 mW • Small Body Outline Dimensions: • • • • 2 Anode MARKING DIAGRAM 2 0.039″ x 0.024″ (1.00 mm x 0.60 mm) Low Body Height: 0.016″ (0.40 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 SOD−923 CASE 514AB 1 X MG G 2 X = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic ORDERING INFORMATION Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range Package Shipping† NZ9FxxxxT5G, SZNZ9FxxxxT5G SOD−923 (Pb−Free) 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS Rating Device Symbol Max Unit PD 250 2.0 mW mW/°C RqJA 500 °C/W TJ, Tstg −65 to +150 °C DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 3 of this data sheet. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 Minimum Pad. © Semiconductor Components Industries, LLC, 2016 November, 2016 − Rev. 4 1 Publication Order Number: NZ9F2V4/D NZ9F2V4T5G, SZNZ9F2V4T5G SERIES ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Parameter Symbol VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK VZ VR IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF C IR VF IZT Zener Voltage Regulator Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz 100 80 POWER DISSIPATION (%) QVZ IF 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 1. Steady State Power Derating www.onsemi.com 2 150 V NZ9F2V4T5G, SZNZ9F2V4T5G SERIES ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Zener Voltage (Note 1) VZ (Volts) Zener Impedance @ IZT ZZT @ IZT Leakage Current ZZK @ IZK QVZ (mV/k) @ IZT IR @ VR C @ VR = 0 f = 1 MHz Device*** Device Marking Min Max mA W W mA mA Volts Min Max pF SZ, NZ9F2V4T5G J 2.28 2.52 5 100 1000 1 50 1 −3.5 0 210 SZ, NZ9F2V7T5G E** 2.57 2.84 5 100 1000 1 20 1 −3.5 0 210 SZ, NZ9F3V0T5G T** 2.85 3.15 5 100 1000 1 10 1 −3.5 0 210 SZ, NZ9F3V3T5G Q 3.14 3.47 5 100 1000 1 10 1 −3.5 0 210 SZ, NZ9F3V6T5G 3** 3.42 3.78 5 100 1000 1 10 1 −3.5 0 210 SZ, NZ9F3V9T5G V** 3.71 4.10 5 100 1000 1 5 1 −3.5 −2.5 210 SZ, NZ9F4V3T5G Y** 4.09 4.52 5 100 1000 1 5 1 −3.5 0 210 SZ, NZ9F4V7T5G 3 4.47 4.94 5 100 800 0.5 2 1 −3.5 0.2 150 SZ, NZ9F5V1T5G 4 4.85 5.36 5 80 500 0.5 2 1.5 −2.7 1.2 130 SZ, NZ9F5V6T5G 5 5.32 5.88 5 60 200 0.5 1 2.5 −2.0 2.5 115 SZ, NZ9F6V2T5G 6 5.89 6.51 5 60 100 0.5 1 3 0.4 3.7 110 SZ, NZ9F6V8T5G A* 6.46 7.14 5 40 60 0.5 0.5 3.5 1.2 4.5 105 SZ, NZ9F7V5T5G D* 7.13 7.88 5 30 60 0.5 0.5 4 2.5 5.3 100 SZ, NZ9F8V2T5G E* 7.79 8.61 5 30 60 0.5 0.5 5 3.2 6.2 90 SZ, NZ9F9V1T5G F* 8.65 9.56 5 30 60 0.5 0.5 6 3.8 7 80 SZ, NZ9F10VT5G J* 9.50 10.50 5 30 60 0.5 0.1 7 4.5 8 80 SZ, NZ9F11VT5G K* 10.45 11.55 5 30 60 0.5 0.1 8 5.4 9 80 SZ, NZ9F12VT5G L* 11.40 12.60 5 30 80 0.5 0.1 9 6 10 80 SZ, NZ9F13VT5G P* 12.35 13.65 5 37 80 0.5 0.1 10 7 11 75 SZ, NZ9F15VT5G Q* 14.25 15.75 5 42 80 0.5 0.1 11 9.2 13 70 SZ, NZ9F16VT5G R* 15.20 16.80 5 50 80 0.5 0.1 12 10.4 14 65 SZ, NZ9F18VT5G T* 17.10 18.90 5 50 80 0.5 0.1 14 12.4 16 60 SZ, NZ9F20VT5G V* 19.00 21.00 5 55 100 0.5 0.1 15.4 14.4 18 55 SZ, NZ9F22VT5G Y* 20.90 23.10 5 55 100 0.5 0.1 16.8 15.4 20 55 SZ, NZ9F24VT5G F 22.80 25.20 5 70 120 0.5 0.1 18.9 16.8 22 50 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Rotated 90°. **Rotated 270°. ***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. 1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C. www.onsemi.com 3 NZ9F2V4T5G, SZNZ9F2V4T5G SERIES PACKAGE DIMENSIONS SOD−923 CASE 514AB ISSUE C −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E 1 2X b 0.08 X Y 2 TOP VIEW DIM A b c D E HE L L2 A c HE MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.19 REF 0.05 0.10 0.15 INCHES MIN NOM MAX 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 REF 0.002 0.004 0.006 SIDE VIEW 2X SOLDERING FOOTPRINT* L 2X 0.36 2X 1.20 2X 0.25 L2 BOTTOM VIEW PACKAGE OUTLINE DIMENSIONS: MILLIMETERS See Application Note AND8455/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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