Material Content Data Sheet Sales Product Name IPP034N03L G MA# MA000867482 Package PG-TO220-3-123 Issued 29. August 2013 Weight* 2025.66 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 2.247 0.11 1.407 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.11 1109 1109 694 0.422 0.02 1404.801 69.34 69.43 693503 208 694405 5.953 0.29 0.29 2939 2939 2.344 0.12 1157 67.988 3.36 515.773 25.46 28.94 254619 33563 289339 21.462 1.06 1.06 10595 10595 1.764 0.09 0.09 871 871 0.150 0.01 0.376 0.02 0.977 0.05 74 186 0.08 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 482 742 1000000