Order this document by MPX5050/D SEMICONDUCTOR TECHNICAL DATA !! " ! !" ! OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output ! The MPX5050 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • 2.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller–Based Systems • Temperature Compensated Over – 40° to +125°C BASIC CHIP CARRIER ELEMENT CASE 867–08, STYLE 1 • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element • Easy–to–Use Chip Carrier Option VS 3 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 Vout DIFFERENTIAL PORT OPTION CASE 867C–05, STYLE 1 NOTE: Pin 1 is the notched pin. 2 PINS 4, 5 AND 6 ARE NO CONNECTS PIN NUMBER GND Figure 1. Fully Integrated Pressure Sensor Schematic MAXIMUM RATINGS(1) Symbol Value Unit Overpressure(2) (P1 > P2) Parametrics Pmax 200 kPa Burst Pressure(2) (P1 > P2) Pburst 700 kPa Tstg – 40° to +125° °C TA – 40° to +125° °C Storage Temperature Operating Temperature 1 Vout 4 N/C 2 Grd 5 N/C 3 VS 6 N/C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Senseon and X–ducer are trademarks of Motorola, Inc. REV 3 Motorola Sensor Device Data Motorola, Inc. 1997 1 OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10.0 mAdc Characteristic Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85°C) Voff 0.088 0.20 0.313 Vdc Full Scale Output(4) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.587 4.70 4.813 Vdc Full Scale Span(5) @ VS = 5.0 Volts (0 to 85°C) VFSS — 4.50 — Vdc — — — "2.5 %VFSS Accuracy(6) Sensitivity V/P — 90 — mV/kPa Response Time(7) tR — 1.0 — mS Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time(8) — — 20 mSec Offset Stability(9) — — "0.5 — — %VFSS Symbol Min Typ Max Unit Weight, Basic Element (Case 867) — — 4.0 — Grams Common Mode Line Pressure(10) — — — 690 kPa Decoupling circuit shown in Figure 4 required to meet electrical specifications. MECHANICAL CHARACTERISTICS Characteristic NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface. 2 Motorola Sensor Device Data Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for in- formation regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor. Proper decoupling of the power supply is recommended. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.) OUTPUT (V) 5.0 TRANSFER FUNCTION: 4.5 Vout = VS*(0.018*P+0.04) ± ERROR 4.0 VS = 5.0 Vdc TEMP = 0 to 85°C 3.5 3.0 TYPICAL 2.5 2.0 1.5 MIN MAX 1.0 0.5 0 0 5 10 20 25 30 15 35 40 DIFFERENTIAL PRESSURE (kPa) 45 50 55 Figure 2. Output versus Pressure Differential FLUORO SILICONE GEL DIE COAT DIE STAINLESS STEEL METAL COVER ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ P1 EPOXY PLASTIC CASE WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT MPX5050 OUPUT (PIN 1) 50 pF A/D 51 k µ PROCESSOR DIE BOND P2 Figure 3. Cross–Sectional Diagram (Not to Scale) Motorola Sensor Device Data Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface 3 Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) +/– (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Band MPX5050D Series 4.0 Temp 3.0 Temperature Error Factor Multiplier – 40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 Pressure (in kPa) 0 10 20 30 40 50 60 –1.0 – 2.0 – 3.0 4 Pressure Error (Max) 0 to 50 kPa ± 1.25 kPa Motorola Sensor Device Data PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5050D 867–08 Stainless Steel Cap MPX5050DP 867C–05 Side with Part Marking MPX5050GP 867B–04 Side with Port Attached MPX5050GVP 867D–04 Stainless Steel Cap MPX5050GS 867E–03 Side with Port Attached MPX5050GVS 867A–04 Stainless Steel Cap MPX5050GSX 867F–03 Side with Port Attached MPX5050GVSX 867G–03 Stainless Steel Cap ORDERING INFORMATION The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking Basic Element Differential 867–08 MPX5050D MPX5050D Ported Elements Differential Dual Ports 867C–05 MPX5050DP MPX5050DP Gauge 867B–04 MPX5050GP MPX5050GP Gauge Vacuum Port 867D–04 MPX5050GVP MPX5050GVP Gauge, Axial 867E–03 MPX5050GS MPX5050D Gauge Vacuum Axial 867A–04 MPX5050GVS MPX5050D Gauge, Axial PC Mount 867F–03 MPX5050GSX MPX5050D Gauge Vacuum Axial PC Mount 867G–03 MPX5050GVSX MPX5050D Motorola Sensor Device Data 5 PACKAGE DIMENSIONS C R M B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) –A– N PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 –T– G J S F D 6 PL 0.136 (0.005) M T A M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867–08 ISSUE N MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 VOUT GROUND VCC V1 V2 VEX BASIC ELEMENT (D) A C –B– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. POSITIVE PRESSURE (P1) V DIM A B C D E F G J K N S V PIN 1 PORT #2 VACUUM (P2) 1 K J N E –T– 2 3 4 5 6 S G F D 6 PL 0.13 (0.005) M T B M INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867A–04 ISSUE E VACUUM SIDE PORTED (GVS) 6 Motorola Sensor Device Data PACKAGE DIMENSIONS–CONTINUED –T– A U L SEATING PLANE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. PORT #1 POSITIVE PRESSURE (P1) V –Q– N B K 1 2 3 4 5 6 PIN 1 –P– C 0.25 (0.010) J M T Q S G M D 6 PL 0.13 (0.005) F M INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC 0.182 0.194 DIM A B C D F G J K L N P Q R S U V T P Q S S STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867B–04 ISSUE E MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC 4.62 4.93 VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (GP) P 0.25 (0.010) M T Q M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N –Q– PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE –T– –T– S SEATING PLANE J D 6 PL G F 0.13 (0.005) M A M CASE 867C–05 ISSUE F DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX PRESSURE AND VACUUM SIDES PORTED (DP) Motorola Sensor Device Data 7 PACKAGE DIMENSIONS–CONTINUED 0.25 (0.010) –P– T Q M M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A U –T– SEATING PLANE PORT #2 VACUUM (P2) L V R DIM A B C D F G J K L N P Q R S U V POSITIVE PRESSURE (P1) –Q– N B PIN 1 1 2 3 4 5 K 6 S C G D 6 PL J F 0.13 (0.005) M T P S Q INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. S CASE 867D–04 ISSUE F MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC 4.62 4.93 VOUT GROUND VCC V1 V2 VEX VACUUM SIDE PORTED (GVP) C –B– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K J N 5 –T– 3 2 1 S G F E 4 D 6 PL 0.13 (0.005) M T B M INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867E–03 ISSUE D PRESSURE SIDE PORTED (AS, GS) 8 Motorola Sensor Device Data PACKAGE DIMENSIONS–CONTINUED –T– C A U E –Q– N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) –P– 0.25 (0.010) T Q M 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.027 0.033 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. F MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.68 0.84 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867F–03 ISSUE D PRESSURE SIDE PORTED (GSX) –T– C A U E –Q– POSITIVE PRESSURE (P1) N V B R PORT #2 VACUUM (P2) PIN 1 –P– 0.25 (0.010) M T Q M 1 2 3 4 5 6 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.027 0.033 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.68 0.84 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.93 VOUT GROUND VCC V1 V2 VEX CASE 867G–03 ISSUE D VACUUM SIDE PORTED (GVSX) Motorola Sensor Device Data 9 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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