ALSC AS7C513B-15JI 5v 32k x 16 cmos sram Datasheet

March 2004
AS7C513B
®
5V 32K×16 CMOS SRAM
Features
• Industrial and commercial temperature
• Organization: 32,768 words × 16 bits
• Center power and ground pins
• High speed
• 10/12/15/20 ns address access time
• 5, 6, 7, 8 ns output enable access time
• Low power consumption: ACTIVE
• 605mW / max @ 10 ns
• Low power consumption: STANDBY
• 55 mW / max CMOS I/O
• 6T 0.18u CMOS Technology
• Easy memory expansion with CE, OE inputs
• TTL-compatible, three-state I/O
• 44-pin JEDEC standard package
• 400 mil SOJ
• 400 mil TSOP 2
• ESD protection > 2000 volts
• Latch-up current > 200 mA
Pin arrangement
A0
A2
A3
A4
A5
A6
44-Pin SOJ, TSOP 2 (400 mil)
VCC
Row decoder
A1
32K × 16
Array
GND
NC
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
VCC
GND
I/O4
I/O5
I/O6
I/O7
WE
A14
A13
A12
A11
NC
A7
I/O
buffer
Control circuit
A14
A13
A12
A11
A8
A9
Column decoder
WE
A10
I/O0–I/O7
I/O8–I/O15
UB
OE
LB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
AS7C513B
Logic block diagram
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A4
A5
A6
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
VCC
I/O11
I/O10
I/O9
I/O8
NC
A7
A8
A9
A10
NC
CE
Selection guide
-10
-12
-15
-20
Unit
Maximum address access time
10
12
15
20
ns
Maximum output enable access time
5
6
7
8
ns
Maximum operating current
110
100
90
80
mA
Maximum CMOS standby current
10
10
10
10
mA
3/26/04, v.1.3
Alliance Semiconductor
P. 1 of 9
Copyright © Alliance Semiconductor. All rights reserved.
AS7C513B
®
Functional description
The AS7C513B is a high performance CMOS 524,288-bit Static Random Access Memory (SRAM) device organized as 32,768 words × 16
bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5, 6, 7, 8 ns are ideal for
high performance applications. The chip enable input CE permits easy memory expansion with multiple-bank memory systems.
When CE is high, the device enters standby mode. If inputs are still toggling, the device consumes ISB power. If the bus is static, then the full
standby power is reached (ISB1). The AS7C513B is guaranteed not to exceed 55mW power consumption under nominal full standby
conditions.
A write cycle is accomplished by asserting write enable (WE), (UB) and/or (LB), and chip enable (CE). Data on the input pins I/O0 - I/O7,
and/or I/O8 – I/O15, is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices
should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE), (UB) and (LB), and chip enable (CE), with write enable (WE) high. The chips
drive I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write enable is
active, or (UB) and (LB), output drivers stay in high-impedance mode.
The devices provide multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be written and
read. LB controls the lower bits, I/O0 – I/O7, and UB controls the higher bits, I/O8 – I/O15.
All chip inputs and outputs are TTL-compatible. The AS7C513B is packaged in common industry standard packages.
Absolute maximum ratings
Parameter
Symbol
Min
Max
Unit
Voltage on VCC relative to GND
Vt1
–0.50
+7.0
V
Voltage on any pin relative to GND
Vt2
–0.50
VCC +0.50
V
Power dissipation
PD
–
1.0
W
Storage temperature (plastic)
Tstg
–65
+150
oC
Ambient temperature with VCC applied
Tbias
–55
+125
oC
DC current into outputs (low)
IOUT
–
20
mA
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
Truth table
CE
WE
OE
LB
UB
I/O0–I/O7
I/O8–I/O15
Mode
H
X
X
X
X
High Z
High Z
Standby (ISB, ISBI)
L
H
L
L
H
DOUT
High Z
Read I/O0–I/O7 (ICC)
L
H
L
H
L
High Z
DOUT
Read I/O8–I/O15 (ICC)
L
H
L
L
L
DOUT
DOUT
Read I/O0–I/O15 (ICC)
L
L
X
L
L
DIN
DIN
Write I/O0–I/O15 (ICC)
L
L
X
L
H
DIN
High Z
Write I/O0–I/O7 (ICC)
L
L
X
H
L
High Z
DIN
Write I/O8–I/O15 (ICC)
L
L
H
X
H
X
X
H
X
H
High Z
High Z
Output disable (ICC)
Key: X = Don’t care; L = Low; H = High
3/26/04, v.1.3
Alliance Semiconductor
P. 2 of 9
AS7C513B
®
Recommended operating conditions
Parameter
Symbol
Min
Typical
Max
Unit
VCC
4.5
5
5.5
V
VIH
2.2
–
VCC + 0.5
VIL
–0.5
–
0.8
V
commercial
TA
0
–
70
°C
industrial
TA
–40
–
85
°C
Supply voltage
Input voltage
Ambient operating temperature
VIL min = -1.0V for pulse width less than 5ns
VIH max = VCC+2.0V for pulse width less than 5ns.
DC operating characteristics (over the operating range)1
-10
Parameter
-20
Max
Min
Max
Min
Max
Min
Max
Unit
VCC = Max
VIN = GND to VCC
–
1
–
1
–
1
–
1
µA
Output leakage
| ILO |
current
VCC = Max
VOUT = GND to VCC
–
1
–
1
–
1
–
1
µA
Operating
power supply
current
ICC
VCC = Max, CE ≤ VIL
f = fMax , IOUT = 0mA
–
110
–
100
–
90
–
80
mA
ISB
VCC = Max, CE ≥ VIH
f = fMax
–
50
–
45
–
45
–
40
mA
ISB1
VCC = Max, CE ≥ VCC - 0.2V
VIN ≤ 0.2V or
VIN ≥ VCC –0.2V, f = 0
–
10
–
10
–
10
–
10
mA
VOL
IOL = 8 mA, VCC = Min
–
0.4
–
0.4
–
0.4
–
0.4
V
VOH
IOH = –4 mA, VCC = Min
2.4
–
2.4
–
2.4
–
2.4
–
V
Max
Unit
Standby power
supply current
Output voltage
| ILI |
Test conditions
-15
Min
Input leakage
current
Sym
-12
Capacitance (f = 1MHz, Ta = 25o C, VCC = NOMINAL)2
Parameter
Symbol
Signals
Test conditions
Input capacitance
CIN
A, CE, WE, OE, LB, UB
Vin = 0V
5
pF
I/O capacitance
CI/O
I/O
Vin = Vout = 0V
7
pF
Read cycle (over the operating range) 3,9
-10
Parameter
-12
-15
-20
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Read cycle time
tRC
10
–
12
–
15
–
20
–
ns
Address access time
tAA
–
10
–
12
–
15
–
20
ns
3
Chip enable (CE) access time
tACE
–
10
–
12
–
15
–
20
ns
3
Output enable (OE) access time
tOE
–
5
–
6
–
7
–
8
ns
Output hold from address
change
tOH
3
–
3
–
3
–
3
–
ns
3/26/04, v.1.3
Alliance Semiconductor
P. 3 of 9
Notes
5
AS7C513B
®
-10
Parameter
-12
-15
-20
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Notes
CE low to output in low Z
tCLZ
3
–
3
–
3
–
3
–
ns
4,5
CE high to output in high Z
tCHZ
–
4
–
5
–
6
–
7
ns
4,5
OE low to output in low Z
tOLZ
0
–
0
–
0
–
0
–
ns
4,5
Byte select access time
tBA
–
5
–
6
–
7
–
8
ns
Byte select Low to low Z
tBLZ
0
–
0
–
0
–
0
–
ns
4,5
Byte select High to high Z
tBHZ
–
5
–
6
–
6
–
7
ns
4,5
OE high to output in high Z
tOHZ
–
4
–
5
–
6
–
7
ns
4,5
Power up time
tPU
0
–
0
–
0
–
0
–
ns
4,5
Power down time
tPD
–
10
–
12
–
15
20
ns
4,5
Key to switching waveforms
Rising input
Falling input
Undefined output/don’t care
Read waveform 1 (address controlled)3,6,7,9
tRC
Address
tAA
tOH
Data OUT
tOH
Previous data valid
Data valid
Read waveform 2 (CE, OE, UB, LB controlled)3,6,8,9
tRC
Address
tAA
OE
tOE
tOH
tOLZ
CE
tOHZ
tACE
tLZ
tHZ
LB, UB
tBA
tBHZ
tBLZ
Data OUT
3/26/04, v.1.3
Data valid
Alliance Semiconductor
P. 4 of 9
AS7C513B
®
Write cycle (over the operating range)11
-10
Parameter
-12
-15
-20
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Write cycle time
tWC
10
–
12
–
15
–
20
–
ns
Chip enable (CE) to write end
tCW
8
–
9
–
10
–
12
–
ns
Address setup to write end
tAW
8
–
9
–
10
–
12
–
ns
Address setup time
tAS
0
–
0
–
0
–
0
–
ns
Write pulse width
tWP
7
–
8
–
9
–
12
–
ns
Write recovery time
tWR
0
–
0
–
0
–
0
–
ns
Address hold from end of write
tAH
0
–
0
–
0
–
0
–
ns
Data valid to write end
tDW
5
–
6
–
8
–
10
–
ns
Data hold time
tDH
0
–
0
–
0
–
0
–
ns
5
Write enable to output in high
Z
tWZ
–
5
–
6
–
7
–
8
ns
4,5
Output active from write end
tOW
1
–
1
–
1
–
2
–
ns
4,5
Byte select low to end of write
tBW
7
–
8
–
9
–
9
–
ns
Write waveform 1(WE controlled)11
tWC
Address
tWR
tBW
LB, UB
tAS
tAW
tWP
WE
tDW
tWZ
Data OUT
3/26/04, v.1.3
tDH
Data valid
Data IN
Data undefined
Alliance Semiconductor
tOW
High-Z
P. 5 of 9
Notes
AS7C513B
®
Write waveform 2 (CE controlled)11
tWC
Address
tAS
tAH & tWR
tCW
CE
tAW
tBW
LB, UB
tWP
WE
tDH
tDW
Data valid
Data IN
tWZ
tCLZ
Data OUT
High-Z
Data undefined
tOW
High-Z
AC test conditions
-
Output load: see Figure B.
Input pulse level: GND to 3.5V. See Figure A.
Input rise and fall times: 2 ns. See Figure A.
Input and output timing reference levels: 1.5V.
Thevenin equivalent:
168Ω
Dout
+1.728V
+5.0V
480Ω
+3.5V
GND
90%
10%
Dout
255Ω
90%
2 ns
10%
C13
GND
Figure B: 5.0V Output load
Figure A: Input pulse
Notes
1
2
3
4
5
6
7
8
9
10
11
12
13
During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
This parameter is sampled, but not 100% tested.
For test conditions, see AC Test Conditions, Figures A and B.
These parameters are specified with CL = 5pF, as in Figure B. Transition is measured ±500mV from steady-state voltage.
This parameter is guaranteed, but not 100% tested.
WE is High for read cycle.
CE and OE are Low for read cycle.
Address valid prior to or coincident with CE transition Low.
All read cycle timings are referenced from the last valid address to the first transitioning address.
Not applicable.
All write cycle timings are referenced from the last valid address to the first transitioning address.
Not applicable.
C=30pF, except on High Z and Low Z parameters, where C=5pF.
3/26/04, v.1.3
Alliance Semiconductor
P. 6 of 9
AS7C513B
®
Package dimensions
44-pin TSOP 2
c
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
Min
(mm)
Max
(mm)
A1
0.05
0.15
A2
0.95
1.05
b
0.3
0.45
c
0.12
0.21
d
18.31
18.52
e
10.06
10.26
He
11.68
11.94
Symbol
A
e He
44-pin TSOP 2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
d
l
A2
A
0–5°
A1
E
E
b
l
D
E1 E2
Pin 1
B
c
A
A1
b
0.60
Seating
Plane
A2
Symbol
Min
Max
A
0.128
0.148
A1
0.025
-
A2
0.105
0.115
B
0.026
0.032
b
0.015
0.020
c
0.007
0.013
D
1.120
1.130
E
E
Alliance Semiconductor
0.370 NOM
E1
0.395
0.405
E2
0.435
0.445
e
3/26/04, v.1.3
0.80 (typical)
0.40
44-pin SOJ
400 mil
44-pin SOJ
e
1.2
0.050 NOM
P. 7 of 9
AS7C513B
®
Ordering codes
Package\Access time
10 ns
12 ns
15 ns
20 ns
Plastic SOJ, 400
mil
Commercial
AS7C513B-10JC
AS7C513B-12JC
AS7C513B-15JC
AS7C513B-20JC
Industrial
AS7C513B-10JI
AS7C513B-12JI
AS7C513B-15JI
AS7C513B-20JI
TSOP 2,
18.4×10.2 mm
Commercial
AS7C513B-10TC
AS7C513B-12TC
AS7C513B-15TC
AS7C513B-20TC
Industrial
AS7C513B-10TI
AS7C513B-12TI
AS7C513B-15TI
AS7C513B-20TI
Part numbering system
AS7C
513B
–XX
X
Package:
SRAM prefix
3/26/04, v.1.3
Device number
Access time
J = SOJ 400 mil
T =TSOP 2 18.4×10.2 mm
Alliance Semiconductor
C
Temperature range:
C = Commercial, 0°C to 70°C
I = Industrial, -40°C to 85°C
P. 8 of 9
®
Alliance Semiconductor Corporation
2575, Augustine Drive,
Santa Clara, CA 95054
Tel: 408 - 855 - 4900
Fax: 408 - 855 - 4999
Copyright © Alliance Semiconductor
All Rights Reserved
Part Number: AS7C513B
Document Version: v.1.3
www.alsc.com
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered
trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make
changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document.
The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at
any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in
this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any
guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related
to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and
Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of
Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other
intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems
where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such lifesupporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.