I547/I747 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Product Features: Applications: Low Jitter, Non-PLL Based Output Clipped Sinewave Analog Compensation Available 0.5 ppm Stability 3.20 GPS Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 10Mhz to 52 Mhz GPS Frequencies 16.396Mhz, 16.3676Mhz, 16.367667Mhz, 19.200Mhz, 24.5535Mhz, 26.000Mhz 1.5 ppm Frequency Stability Vs Temperature Vs Supply Voltage ( 5%) Vs Load(10%) Output Level Clipped Sinewave Output Load Clipped Sinewave 10K Ohms / 10 pF Duty Cycle (HCMOS) 50% ±10% Frequency Slope (2C steps from -20 C to +70 C) Start Time (90% of Vp-p) 0.1 ppm / C 3.0 mS Max. Aging 1 ppm / Year Max. Supply Voltage See Supply Voltage Table , tolerance 5% Current 1.5 mA Max Voltage Control (I747) Operating 1.5 VDC 1.0 VDC, 5.0 ppm Min. Storage -40 C to +85 C Phase Noise -87 dBc/Hz @ 10 Hz -112 dBc/Hz @ 100 Hz -135 dBc/Hz @ 1KHz -145 dBc/Hz @ 10 Khz I547 (Clipped Sinewave TCXO) I747 (Clipped Sinewave TCVCXO) 2 0.10 0.8 V p-p Min. 1 2 4 3 0.10 Recommended Pad Layout 2.40 4 3 1 2 2.0 1.3 0.9 Pin 1 2 3 4 Connection Vcontrol / N.C. GND Output Vcc Dimension Units: mm Sample Part Number: I547-1Q3-20.000 Mhz FrequencyStability vs Temperature Supply Voltage **Y = 0.5 ppm 3 = 3.3 V 1 = 0 C to +70 C **N = 1.0 ppm 7 = 3.0 V 3 = -20 C to +70 C **O = 1.5 ppm 2 = 2.7 V 5 = -30 C to +85 C **P = 2.0 ppm 1 = 1.8 V 2 = -40 C to +85 C Q = 2.5 ppm R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 8/09/11_E 0.65 +/-0.02 0.62 +/-0.02 Part Number Guide Operating Temperature 7 = 0 C to +50 C 1 1.2 Max. See Frequency Stability Table 0.1 ppm Max. .0.2 ppm Max. See Operating Temperature Table Package 3 2.50 Frequency Frequency Tolerance @ 25 C 4 Specifications subject to change without notice Page 1 Frequency - 20.000 MHz I547/I747 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I - Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 8/09/11_E Specifications subject to change without notice Page 2