MC14572UB Hex Gate The MC14572UB hex functional gate is constructed with MOS P–channel and N–channel enhancement mode devices in a single monolithic structure. These complementary MOS logic gates find primary use where low power dissipation and/or high noise immunity is desired. The chip contains four inverters, one NOR gate and one NAND gate. • • • • • • • • http://onsemi.com Diode Protection on All Inputs Single Supply Operation Supply Voltage Range = 3.0 Vdc to 18 Vdc NOR Input Pin Adjacent to VSS Pin to Simplify Use As An Inverter NAND Input Pin Adjacent to VDD Pin to Simplify Use As An Inverter NOR Output Pin Adjacent to Inverter Input Pin For OR Application NAND Output Pin Adjacent to Inverter Input Pin For AND Application Capable of Driving Two Low–power TTL Loads or One Low–Power Schottky TTL Load over the Rated Temperature Range MARKING DIAGRAMS 16 PDIP–16 P SUFFIX CASE 648 MC14572UBCP AWLYYWW 1 16 SOIC–16 D SUFFIX CASE 751B 14572U AWLYWW 1 16 SOEIAJ–16 F SUFFIX CASE 966 MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) Parameter 1 Value Unit – 0.5 to +18.0 V – 0.5 to VDD + 0.5 V Input or Output Current (DC or Transient) per Pin ±10 mA PD Power Dissipation, per Package (Note 3.) 500 mW TA Ambient Temperature Range – 55 to +125 °C Tstg Storage Temperature Range – 65 to +150 TL Lead Temperature (8–Second Soldering) 260 Symbol VDD Vin, Vout Iin, Iout DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Package Shipping MC14572UBCP PDIP–16 2000/Box °C MC14572UBD SOIC–16 48/Rail °C MC14572UBDR2 SOIC–16 2500/Tape & Reel MC14572UBF SOEIAJ–16 See Note 1. MC14572UBFEL SOEIAJ–16 See Note 1. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. Device 1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. v Semiconductor Components Industries, LLC, 2000 March, 2000 – Rev. 3 A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week ORDERING INFORMATION 2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C v MC14572UB AWLYWW 1 Publication Order Number: MC14572UB/D MC14572UB PIN ASSIGNMENT OUTA 1 16 VDD INA 2 15 IN 2F OUTB 3 14 IN 1F INB 4 13 OUTF OUTC 5 12 INE IN 1C 6 11 OUTE IN 2C 7 10 IND VSS 8 9 OUTD LOGIC DIAGRAM 2 1 4 3 6 5 7 10 9 12 11 14 13 15 VDD = PIN 16 VSS = PIN 8 CIRCUIT SCHEMATIC VDD VDD VDD 7 1 2 13 6 5 VSS 14 15 VSS http://onsemi.com 2 VSS MC14572UB ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) – 55_C VDD Characteristic 25_C 125_C Symbol Vdc Min Max Min Typ (4.) Max Min Max Unit Output Voltage Vin = VDD or 0 “0” Level VOL 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 Vdc Vin = 0 or VDD “1” Level VOH 5.0 10 15 4.95 9.95 14.95 — — — 4.95 9.95 14.95 5.0 10 15 — — — 4.95 9.95 14.95 — — — Vdc Input Voltage “0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL 5.0 10 15 — — — 1.0 2.0 2.5 — — — 2.25 4.50 6.75 1.0 2.0 2.5 — — — 1.0 2.0 2.5 “1” Level VIH 5.0 10 15 4.0 8.0 12.5 — — — 4.0 8.0 12.5 2.75 5.50 8.25 — — — 4.0 8.0 12.5 — — — 5.0 5.0 10 15 – 1.2 – 0.25 – 0.62 – 1.8 — — — — – 1.0 – 0.2 – 0.5 – 1.5 – 1.7 – 0.36 – 0.9 – 3.5 — — — — – 0.7 – 0.14 – 0.35 – 1.1 — — — — IOL 5.0 10 15 0.64 1.6 4.2 — — — 0.51 1.3 3.4 0.88 2.25 8.8 — — — 0.36 0.9 2.4 — — — mAdc Input Current Iin 15 — ± 0.1 — ± 0.00001 ± 0.1 — ± 1.0 µAdc Input Capacitance (Vin = 0) Cin — — — — 5.0 7.5 — — pF Quiescent Current (Per Package) IDD 5.0 10 15 — — — 0.25 0.5 1.0 — — — 0.0005 0.0010 0.0015 0.25 0.5 1.0 — — — 7.5 15 30 µAdc IT 5.0 10 15 (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc Vdc IOH Source Sink Total Supply Current (5.) (6.) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) mAdc IT = (1.89 µA/kHz) f + IDD IT = (3.80 µA/kHz) f + IDD IT = (5.68 µA/kHz) f + IDD 4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 5. The formulas given are for the typical characteristics only at 25_C. 6. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.006. http://onsemi.com 3 µAdc MC14572UB ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise Time tTLH = (3.0 ns/pF) CL + 30 ns tTLH = (1.5 ns/pF) CL + 15 ns tTLH = (1.1 ns/pF) CL + 10 ns tTLH Output Fall Time tTHL = (1.5 ns/pF) CL + 25 ns tTHL = (0.75 ns/pF) CL + 12.5 ns tTHL = (0.55 ns/pF) CL + 9.5 ns tTHL Propagation Delay Time tPLH, tPHL = (1.7 ns/pF) CL + 5 ns tPLH, tPHL = (0.66 ns/pF) CL + 17 ns tPLH, tPHL = (0.5 ns/pF) CL + 15 ns tPLH, tPHL VDD Min Typ (8.) Max 5.0 10 15 — — — 180 90 65 360 180 130 5.0 10 15 — — — 100 50 40 200 100 80 5.0 10 15 — — — 90 50 40 180 100 80 Unit ns ns ns 7. The formulas given are for the typical characteristics only at 25_C. 8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD PULSE GENERATOR VDD INPUT 7 16 INPUT 2 PULSE GENERATOR OUTPUT 16 6 OUTPUT 1 8 VSS 5 CL 8 VSS CL VDD 20 ns 16 PULSE GENERATOR INPUT 15 INPUT 14 OUTPUT VSS 90% 50% 10% tPHL 13 8 90% 50% 10% CL OUTPUT 90% 50% 10% 90% 50% 10% Figure 1. Switching Time Test Circuits and Waveforms 4 VSS tPLH tf http://onsemi.com 20 ns VDD tr VOH VOL MC14572UB PACKAGE DIMENSIONS PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 5 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC14572UB PACKAGE DIMENSIONS SOIC–16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B–05 ISSUE J –A– 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 –B– 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C –T– SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC14572UB PACKAGE DIMENSIONS SOEIAJ–16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966–01 ISSUE O 16 LE 9 Q1 M_ E HE 1 L 8 DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX ––– 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 ––– 0.78 INCHES MIN MAX ––– 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 ––– 0.031 MC14572UB ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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