MOTOROLA MPX2010 10 kpa on chip temperature compensated calibrated silicon pressure sensor Datasheet

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SEMICONDUCTOR TECHNICAL DATA
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UNIBODY PACKAGE
The MPX2010/MPXV2010G series silicon
piezoresistive pressure sensors provide a very
ac c ur at e and l i n e a r v o l ta g e o u tp u t — d i r ec tl y
proportional to the applied pressure. These sensors
house a single monolithic silicon die with the strain
gauge and thin–film resistor network integrated on
each chip. The sensor is laser trimmed for precise
span, offset calibration and temperature
compensation.
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Motorola Preferred Device
COMPENSATED
PRESSURE SENSOR
0 to 10 kPa (0 to 1.45 psi)
FULL SCALE SPAN: 25 mV
MPX2010D
CASE 344
Features
SMALL OUTLINE PACKAGE
SURFACE MOUNT
• Temperature Compensated over 0°C to +85°C
• Ratiometric to Supply Voltage
• Differential and Gauge Options
Application Examples
• Respiratory Diagnostics
• Air Movement Control
MPX2010GP
CASE 344B
• Controllers
MPXV2010GP
CASE 1369
• Pressure Switching
Figure 1 shows a block diagram of the internal
circuitry on the stand–alone pressure sensor chip.
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MPX2010DP
CASE 344C
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MPXV2010DP
CASE 1351
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MPX2010GS
CASE 344E
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
1
Gnd
5
N/C
2
+Vout
6
N/C
3
VS
7
N/C
4
–Vout
8
N/C
NOTE: Pin 1 is noted by the notch in
the lead.
VOLTAGE OUTPUT versus
APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the
pressure side (P1) relative to the vacuum side (P2).
Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the
pressure side (P1).
MPX2010GSX
CASE 344F
PIN NUMBER
Preferred devices are Motorola recommended choices for future use and
best overall value.
REV 9
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1
Gnd
3
VS
2
+Vout
4
–Vout
NOTE: Pin 1 is noted by the notch in
the lead.
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MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
75
kPa
Storage Temperature
Tstg
–40 to +125
°C
Operating Temperature
TA
–40 to +125
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
kPa
VS
—
10
16
Vdc
Io
—
6.0
—
mAdc
VFSS
24
25
26
mV
Voff
–1.0
—
1.0
mV
Sensitivity
∆V/∆P
—
2.5
—
mV/kPa
Linearity(5)
—
–1.0
—
1.0
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–1.0
—
1.0
%VFSS
TCVoff
–1.0
—
1.0
mV
Input Impedance
Zin
1000
—
2550
Ω
Output Impedance
Zout
1400
—
3000
Ω
tR
—
1.0
—
ms
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Pressure
Supply
Range(1)
Voltage(2)
Supply Current
Full Scale
Span(3)
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Offset(4)
Pressure
Hysteresis(5)
Temperature
(0 to 10 kPa)
Hysteresis(5)
(–40°C to +125°C)
Temperature Effect on Full Scale
Temperature Effect on Offset(5)
Response
Time(6)
Warm–Up
Offset
Stability(7)
(10% to 90%)
Span(5)
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
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ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
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Figure 2. Output versus Pressure Differential
Figure 2 shows the output characteristics of the
MPX2010/MPXV2010G series at 25°C. The output is directly proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
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This performance over temperature is achieved by having
both the shear stress strain gauge and the thin–film resistor
circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration
and temperature compensation.
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Figure 3. Unibody Package — Cross–Sectional
Diagram (not to scale)
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPX2010/MPXV2010G series pressure sensor oper-
Motorola Sensor Device Data
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
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LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 5) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange pressure.
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Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MPX2010D
344
Stainless Steel Cap
MPX2010DP
344C
Side with Part Marking
MPX2010GP
344B
Side with Port Attached
MPX2010GS
344E
Side with Port Attached
MPX2010GSX
344F
Side with Port Attached
MPXV2010GP
1369
Side with Port Attached
MPXV2010DP
1351
Side with Part Marking
ORDERING INFORMATION — UNIBODY PACKAGE (MPX2010 SERIES)
MPX Series
Device Type
Options
Order Number
Case Type
Device Marking
Basic Element
Differential
344
MPX2010D
MPX2010D
Ported Elements
Differential, Dual Port
344C
MPX2010DP
MPX2010DP
Gauge
344B
MPX2010GP
MPX2010GP
Gauge, Axial
344E
MPX2010GS
MPX2010D
Gauge, Axial PC Mount
344F
MPX2010GSX
MPX2010D
ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2010G SERIES)
Device Type
Ported Elements
4
Options
Case No.
MPX Series Order No.
Packing Options
Marking
Gauge, Side Port, SMT
1369
MPXV2010GP
Trays
MPXV2010G
Differential, Dual Port, SMT
1351
MPXV2010DP
Trays
MPXV2010G
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SMALL OUTLINE PACKAGE DIMENSIONS
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SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED
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UNIBODY PACKAGE DIMENSIONS
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NOTES
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NOTES
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