NL17SG17 Schmitt Buffer The NL17SG17 MiniGatet is an advanced high−speed CMOS Schmitt Buffer in ultra−small footprint. The NL17SG17 input structures provides protection when voltages up to 4.6 V are applied. www.onsemi.com Features Wide Operating VCC Range: 0.9 V to 3.6 V MARKING DIAGRAMS High Speed: tPD = 3.7 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C SOT−953 CASE 527AE 4.6 V Overvoltage Tolerant (OVT) Input Pins A Ultra−Small Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 GND 2 NC 3 5 4 VCC OUT Y NC 1 IN A 2 GND 3 4 VCC SC−88A DF SUFFIX CASE 419A M G 1 6 VCC IN A 2 5 NC UDFN6 1.45 x 1.0 CASE 517AQ M M OUT Y Figure 2. SC−88A (Top View) NC UDFN6 1.0 x 1.0 CASE 517BX M Figure 1. SOT−953 (Top Thru View) 5 A = Specific Device Code (A with 90 degree clockwise rotation) T IN A M 1 5 • • • • • • AN M G G = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT GND 3 4 OUT Y Figure 3. UDFN6 (Top View) OUT Y IN A SOT−953 SC−88A UDFN6 NC NC 1 IN A 2 GND IN A IN A 3 NC GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC NC 6 VCC Figure 4. Logic Symbol FUNCTION TABLE A Input Y Output L H L H ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 6 1 Publication Order Number: NL17SG17/D NL17SG17 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current Value Unit −0.5 to +5.5 V −0.5 to +4.6 V −0.5 to VCC + 0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND Output at High or Low State Power−Down Mode (VCC = 0 V) IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) >2000 >100 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 No Limit ns/V VOUT TA Dt / DV Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NL17SG17 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VT+ Positive−Going Input Threshold Voltage −555C 3 TA 3 1255C TA = 255C VCC (V) Min Typ Max Min Max 0.9 0.64 0.7 0.86 0.62 0.87 1.1 0.73 0.81 0.95 0.71 1 1.4 0.86 0.94 1.16 0.84 1.2 1.65 0.95 1.06 1.25 0.94 1.3 2.3 1.22 1.36 1.6 1.18 1.65 3.0 1.51 1.8 2.05 1.38 2.1 0.9 0.09 0.23 0.30 0.08 0.33 1.1 0.15 0.33 0.39 0.12 0.43 1.4 0.3 0.47 0.54 0.25 0.55 1.65 0.35 0.6 0.65 0.3 0.65 2.3 0.55 0.85 0.88 0.5 0.88 3.0 0.95 1.13 1.16 0.9 1.16 0.9 0.15 0.5 0.75 0.2 0.8 1.1 0.15 0.5 0.75 0.2 0.8 1.4 0.15 0.5 0.75 0.2 0.8 1.65 0.15 0.5 0.75 0.2 0.8 2.3 0.15 0.5 0.75 0.2 0.8 3.0 0.25 0.65 0.85 0.3 0.9 IOH = −20 mA 0.9 0.75 0.75 IOH = −0.3 mA 1.1 to 1.3 0.75 x VCC 0.75 x VCC IOH = −1.7 mA 1.4 to 1.6 0.75 x VCC 0.75 x VCC IOH = −3.0 mA 1.65 to 1.95 VCC − 0.45 VCC − 0.45 IOH = −4.0 mA 2.3 to 2.7 2.0 2.0 IOH = −8.0 mA 3.0 to 3.6 2.48 2.48 IOL = 20 mA 0.9 0.1 0.1 IOL = 0.3 mA 1.1 to 1.3 0.25 x VCC 0.25 x VCC IOL = 1.7 mA 1.4 to 1.6 0.25xV CC 0.25 x VCC Condition Unit V VT− VH VOH VOL Negative−Going Input Threshold Voltage Hysteresis Voltage High−Level Output Voltage Low−Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL V V V IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 ±0.1 ±1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL17SG17 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = −555C to +1255C TA = 25 5C Symbol Parameter Test Condition VCC (V) Min Typ Max Min Max Unit tPLH, tPHL Propagation Delay, A to Y CL = 10 pF, RL = 1 MW 0.9 − 27.3 − − − ns 1.1 to 1.3 − 13.0 22.6 1.0 35.9 1.4 to 1.6 − 7.5 10.5 1.0 11.3 1.65 to 1.95 − 6.0 7.8 1.0 8.2 2.3 to 2.7 − 4.3 5.4 1.0 5.8 3.0 to 3.6 − 3.5 4.4 1.0 4.6 0.9 − 29.5 − − − 1.1 to 1.3 − 14.3 25.1 1.0 41.8 1.4 to 1.6 − 8.0 11.5 1.0 12.6 1.65 to 1.95 − 6.3 8.4 1.0 8.7 2.3 to 2.7 − 4.6 5.7 1.0 6.1 3.0 to 3.6 − 3.7 4.6 1.0 5.0 0.9 − 40.5 − − − 1.1 to 1.3 − 19.6 35.7 1.0 58.1 1.4 to 1.6 − 10.7 15.8 1.0 17.6 1.65 to 1.95 − 7.8 10.7 1.0 11.7 2.3 to 2.7 − 5.4 6.9 1.0 8.1 3.0 to 3.6 − 4.3 5.2 1.0 6.1 CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW ns ns CIN Input Capacitance 0 to 3.6 3 − − − pF CO Output Capacitance VO = GND 0 3 − − − pF CPD Power Dissipation Capacitance (Note 5) f = 10 MHz 0.9 to 3.6 4 − − − pF − Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. www.onsemi.com 4 NL17SG17 VCC Input A 50% 50% GND tPLH tPHL VOH Output Y 50% VCC VOL Figure 5. Switching Waveform VCC PULSE GENERATOR DUT RT CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 6. Test Circuit ORDERING INFORMATION Package Shipping† NL17SG17P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG17DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG17AMUTCG UDFN6 1.45x1 mm (Pb−Free) 3000 / Tape & Reel NL17SG17CMUTCG* UDFN6 1x1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *In Development www.onsemi.com 5 NL17SG17 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 NL17SG17 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 NL17SG17 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 NL17SG17 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A G 5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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