8-Channel, 1 MSPS, 12-Bit SAR ADC with Temperature Sensor AD7298 FEATURES FUNCTIONAL BLOCK DIAGRAM VDD 12-bit SAR ADC 8 single-ended inputs Channel sequencer functionality Fast throughput of 1 MSPS Analog input range: 0 V to 2.5 V 12-bit temperature-to-digital converter Temperature sensor accuracy of ±1°C Temperature range: −40°C to +125°C Specified for VDD: 2.8 V to 3.6 V Logic voltage VDRIVE : 1.65 V to 3.6 V Power-down current: <10 μA Internal 2.5 V reference Internal power-on reset High speed serial interface SPI 20-lead LFCSP GND VREF REF VIN7 12-BIT SUCCESSIVE APPROXIMATION ADC T/H INPUT MUX AD7298 SEQUENCER CONTROL LOGIC TEMP SENSOR SCLK DOUT DIN CS VDRIVE TSENSE _BUSY PD/RST 08754-001 VIN0 BUF Figure 1. GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The AD7298 is a 12-bit, high speed, low power, 8-channel, successive approximation ADC with an internal temperature sensor. The part operates from a single 3.3 V power supply and features throughput rates up to 1 MSPS. The device contains a low noise, wide bandwidth track-and-hold amplifier that can handle input frequencies in excess of 30 MHz. 1. Ideally Suited to Monitoring System Variables in a Variety of Systems. This includes telecommunications, and process and industrial control. 2. High Throughput Rate of 1 MSPS with Low Power Consumption. 3. Eight Single-Ended Inputs with a Channel Sequencer. A consecutive sequence of channels can be selected on which the ADC cycles and converts. 4. Integrated Temperature Sensor with 0.25°C Resolution. The AD7298 offers a programmable sequencer, which enables the selection of a preprogrammable sequence of channels for conversion. The device has an on-chip, 2.5 V reference that can be disabled to allow the use of an external reference. The AD7298 includes a high accuracy band gap temperature sensor, which is monitored and digitized by the 12-bit ADC to give a resolution of 0.25°C. The device offers a 4-wire serial interface compatible with SPI and DSP interface standards. The AD7298 uses advanced design techniques to achieve very low power dissipation at high throughput rates. The part also offers flexible power/throughput rate management options. The part is offered in a 20-lead LFCSP package. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010–2011 Analog Devices, Inc. All rights reserved. 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Product Selection Guide EVALUATION KITS Solutions Bulletins & Brochures • AD7298 Evaluation Board • Analog-to-Digital Converter and Drivers ICs Solutions Bulletin, Volume 10, Issue 2 DOCUMENTATION Technical Articles Application Notes • MS-1779: Nine Often Overlooked ADC Specifications • AN-742: Frequency Domain Response of SwitchedCapacitor ADCs • MS-2210: Designing Power Supplies for High Speed ADC Tutorials • AN-931: Understanding PulSAR ADC Support Circuitry • Integrated SAR ADC Family in 4mm x 4mm Package Data Sheet • MT-002: What the Nyquist Criterion Means to Your Sampled Data System Design • SAR ADC & Driver Quick-Match Guide • AD7298: 8-Channel, 1MSPS, 12-Bit SAR ADC with Temperature Sensor Data Sheet Technical Books • MT-031: Grounding Data Converters and Solving the Mystery of "AGND" and "DGND" • The Data Conversion Handbook, 2005 User Guides DESIGN RESOURCES • UG-254: Evaluation Board for the AD7298 8-Channel, 1 MSPS, 12-Bit SAR ADC with Temperature Sensor • AD7298 Material Declaration SOFTWARE AND SYSTEMS REQUIREMENTS • PCN-PDN Information • Quality And Reliability • Symbols and Footprints • AD7298 - Microcontroller No-OS Driver • AD7298 IIO Multi-Channel ADC Linux Driver DISCUSSIONS • AD7298 Evaluation Software View all AD7298 EngineerZone Discussions. • AD7298 FMC-SDP Interposer & Evaluation Board / Xilinx KC705 Reference Design SAMPLE AND BUY • BeMicro FPGA Project for AD7298 with Nios driver Visit the product page to see pricing options. 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AD7298 TABLE OF CONTENTS Features .............................................................................................. 1 Temperature Sensor Averaging ................................................ 14 General Description ......................................................................... 1 VDRIVE ............................................................................................ 15 Functional Block Diagram .............................................................. 1 The Internal or External Reference.......................................... 15 Product Highlights ........................................................................... 1 Control Register.............................................................................. 16 Revision History ............................................................................... 2 Modes of Operation ....................................................................... 17 Specifications..................................................................................... 3 Traditional Multichannel Mode of Operation........................ 17 Timing Specifications .................................................................. 5 Repeat Operation ....................................................................... 18 Absolute Maximum Ratings............................................................ 6 Power-Down Modes .................................................................. 19 ESD Caution.................................................................................. 6 Powering Up the AD7298 ......................................................... 20 Thermal Resistance ...................................................................... 6 Reset ............................................................................................. 20 Pin Configuration and Function Description .............................. 7 Serial Interface ................................................................................ 21 Typical Performance Characteristics ............................................. 9 Temperature Sensor Read ......................................................... 22 Terminology .................................................................................... 12 Layout and Configuration............................................................. 23 Circuit Information ........................................................................ 13 Power Supply Bypassing and Grounding................................ 23 Converter Operation.................................................................. 13 Temperature Monitoring........................................................... 23 Analog Input ............................................................................... 13 Outline Dimensions ....................................................................... 24 Temperature Sensor Operation ................................................ 14 Ordering Guide .......................................................................... 24 REVISION HISTORY 6/11—Rev. A to Rev. B Changes to Internal Temperature Sensor, Accuracy Parameter in Table 1............................................................................................ 3 1/11—Rev. 0 to Rev. A Removed Input Impedance Parameter .......................................... 3 Added Input Capacitance Parameter of 8 pF................................ 3 Changes to Figure 11...................................................................... 10 Changed C1 Value to 8 pF in Analog Input Section.................. 13 Changes to Figure 23...................................................................... 14 Changes to Ordering Guide .......................................................... 24 9/10—Revision 0: Initial Version Rev. B | Page 2 of 24 AD7298 SPECIFICATIONS VDD = 2.8 V to 3.6 V; VDRIVE = 1.65 V to 3.6 V; fSAMPLE = 1 MSPS, fSCLK = 20 MHz, VREF = 2.5 V internal; TA = −40°C to +125°C, unless otherwise noted. Table 1. Parameter DYNAMIC PERFORMANCE Signal-to-Noise Ratio (SNR) 1 , 2 Signal-to-Noise (and Distortion) Ratio (SINAD)1 Total Harmonic Distortion (THD)1 Spurious-Free Dynamic Range (SFDR) Intermodulation Distortion (IMD) Second-Order Terms Third-Order Terms Channel-to-Channel Isolation SAMPLE AND HOLD Aperture Delay 3 Aperture Jitter3 Full Power Bandwidth DC ACCURACY Resolution Integral Nonlinearity (INL)1 Differential Nonlinearity (DNL)1 Offset Error1 Offset Error Matching1 Offset Temperature Drift Gain Error1 Gain Error Matching1 Gain Temperature Drift ANALOG INPUT Input Voltage Ranges DC Leakage Current Input Capacitance REFERENCE INPUT/OUTPUT Reference Output Voltage 4 Long-Term Stability Output Voltage Hysteresis Reference Input Voltage Range 5 DC Leakage Current VREF Output Impedance VREF Temperature Coefficient VREF Noise Min Typ 70 70 72 71 −82 −84 Max Unit −77 −77.5 dB dB dB dB Test Conditions/Comments fIN = 50 kHz sine wave fA = 40.1 kHz, fB = 41.5 kHz −84 −93 −100 12 40 30 10 12 ±0.5 ±0.5 ±2 ±2.5 4 ±1 ±1 0.5 0 ±0.01 32 8 2.4925 2.5 150 50 1 ±0.01 1 12 60 ±1 ±0.99 ±4.5 ±4.5 ±4 ±2.5 VREF ±1 2.5075 2.5 ±1 35 Rev. B | Page 3 of 24 dB dB dB fIN = 50 kHz, fNOISE = 60 kHz ns ps MHz MHz @ 3 dB @ 0.1 dB Bits LSB LSB LSB LSB ppm/°C LSB LSB ppm/°C V μA pF pF V ppm ppm V μA Ω ppm/°C μV rms Guaranteed no missed codes to 12 bits When in track When in hold mode ±0.3% maximum @ 25°C For 1000 hours External reference applied to Pin VREF Bandwidth = 10 MHz AD7298 Parameter LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IIN Input Capacitance, CIN3 LOGIC OUTPUTS Output High Voltage, VOH Min Typ Max Unit +0.3 × VDRIVE ±1 V V μA pF 0.7 × VDRIVE ±0.01 3 VIN = 0 V or VDRIVE V V V μA pF VDRIVE < 1.8 VDRIVE ≥ 1.8 °C °C °C TA = −40°C to +85°C TA = +85°C to +125°C LSB size t2 + 16 × tSCLK 100 100 1 μs μs ns MSPS 10 KSPS For VIN0 to VIN7, with one cycle latency TSENSE temperature sensor channel Full-scale step input fSCLK = 20 MHz, for analog voltage conversions, one cycle latency For the TSENSE channel, one cycle latency Digital inputs = 0 V or VDRIVE 3 3 3.6 3.6 V V 5.8 4.1 2.7 1 6.3 4.6 3.3 1.6 10 mA mA mA μA μA Power Dissipation 7 Normal Mode (Operational) 17.4 Normal Mode (Static) Partial Power-Down Mode Full Power-Down Mode 14.8 9.8 3.6 18.9 22.7 16.6 11.9 5.8 36 mW mW mW mW μW μW Output Low Voltage, VOL Floating State Leakage Current Floating State Output Capacitance3 INTERNAL TEMPERATURE SENSOR Operating Range Accuracy VDRIVE − 0.3 VDRIVE − 0.2 Test Conditions/Comments ±0.01 8 −40 ±1 ±1 0.25 Resolution CONVERSION RATE Conversion Time 1 Track-and-Hold Acquisition Time3 Throughput Rate POWER REQUIREMENTS VDD VDRIVE ITOTAL 6 Normal Mode (Operational) Normal Mode (Static) Partial Power-Down Mode Full Power-Down Mode 2.8 1.65 0.4 ±1 +125 ±2 ±3 VDD = 3.6 V, VDRIVE = 3.6 V 1 TA = −40°C to +25°C TA = −40°C to +125°C VDD = 3 V, VDRIVE = 3 V TA = −40°C to +25°C TA = −40°C to +125°C See the Terminology section. All specifications expressed in decibels are referred to full-scale input, FSR, and tested with an input signal at 0.5 dB below full scale, unless otherwise specified. 3 Sample tested during initial release to ensure compliance. 4 Refers to Pin VREF specified for 25oC. 5 A correction factor may be required on the temperature sensor results when using an external VREF (see the Temperature Sensor Averaging section). 6 ITOTAL is the total current flowing in VDD and VDRIVE. 7 Power dissipation is specified with VDD = VDRIVE = 3.6 V, unless otherwise noted. 2 Rev. B | Page 4 of 24 AD7298 TIMING SPECIFICATIONS VDD = 2.8 V to 3.6 V; VDRIVE = 1.65 V to 3.6 V; VREF = 2.5 V internal; TA = −40°C to + 125°C, unless otherwise noted. Sample tested during initial release to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDRIVE) and timed from a voltage level of 1.6 V. Table 2. Parameter tCONVERT fSCLK1 tQUIET t2 t3 1 t41 t5 t6 t71 t81 t9 t10 t11 t121 tPOWER-UP_PARTIAL tPOWER-UP 1 Limit at TMIN, TMAX t2 + (16 × tSCLK) 820 100 50 20 6 Unit μs max ns typ μs max kHz min MHz max ns min 10 15 ns min ns max 35 28 0.4 × tSCLK 0.4 × tSCLK 14 16/34 5 4 100 30 1 6 ns max ns max ns min ns min ns min ns min/max ns min ns min ns min ns max μs max ms max Test Conditions/Comments Conversion time Each ADC channel VIN0 to VIN7, fSCLK = 20 MHz Temperature sensor channel Frequency of external serial clock Frequency of external serial clock Minimum quiet time required between the end of serial read and the start of the next voltage conversion in repeat and nonrepeat mode. CS to SCLK setup time Delay from CS (falling edge) until DOUT three-state disabled Data access time after SCLK falling edge VDRIVE = 1.65 V to 3 V VDRIVE = 3 V to 3.6 V SCLK low pulse width SCLK high pulse width SCLK to DOUT valid hold time SCLK falling edge to DOUT high impedance DIN setup time prior to SCLK falling edge DIN hold time after SCLK falling edge TSENSE_BUSY falling edge to CS falling edge Delay from CS rising edge to DOUT high impedance Power-up time from partial power-down Internal reference power-up time from full power-down Measured with a load capacitance on DOUT of 15 pF. Rev. B | Page 5 of 24 AD7298 ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 3. Parameter VDD to GND, GND1 VDRIVE to GND, GND1 Analog Input Voltage to GND1 Digital Input Voltage to GND Digital Output Voltage to GND VREF to GND1 GND1 to GND Input Current to Any Pin Except Supplies Operating Temperature Range Storage Temperature Range Junction Temperature Pb-Free Temperature, Soldering Reflow ESD Rating −0.3 V to +5 V −0.3 V to + 5 V −0.3 V to 3 V −0.3 V to VDRIVE + 0.3 V −0.3 V to VDRIVE + 0.3 V THERMAL RESISTANCE −0.3 V to +3 V −0.3 V to +0.3 V ±10 mA −40°C to +125°C −65°C to +150°C 150°C Table 4. Thermal Resistance Package Type 20-Lead LFCSP 260(+0)°C 3.5 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 6 of 24 θJA 52 θJC 6.5 Unit °C/W AD7298 16 VDRIVE 17 PD/RST 19 VIN1 18 VIN0 20 VIN2 PIN CONFIGURATION AND FUNCTION DESCRIPTION 15 SCLK VIN3 1 VIN4 2 14 DOUT AD7298 VIN5 3 13 DIN TOP VIEW (Not to Scale) VIN6 4 12 TSENSE _BUSY 11 CS NOTES 1. THE EXPOSED METAL PADDLE ON THE BOTTOM OF THE LFCSP PACKAGE SHOULD BE SOLDERED TO PCB GROUND FOR PROPER FUNCTIONALITY AND HEAT DISSIPATION. 08754-003 VDD 10 GND 9 DCAP 8 VREF 7 GND1 6 VIN7 5 Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 to 5, 18 to 20 6 Mnemonic VIN3, VIN4, VIN5, VIN6, VIN7, VIN0, VIN1, VIN2 GND1 7 VREF 8 DCAP 9 GND 10 VDD 11 CS 12 TSENSE_BUSY 13 DIN 14 DOUT 15 SCLK Description Analog Inputs. The AD7298 has eight single-ended analog inputs that are multiplexed into the on-chip trackand-hold. Each input channel can accept analog inputs from 0 V to 2.5 V. Any unused input channels should be connected to GND1 to avoid noise pickup. Ground. Ground reference point for the internal reference circuitry on the AD7298. The external reference signals and all analog input signals should be referred to this GND1 voltage. The GND1 pin should be connected to the GND plane of a system. All ground pins should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis. The VREF pin should be decoupled to this ground pin via a 10 μF decoupling capacitor. Internal Reference/External Reference Supply. The nominal internal reference voltage of 2.5 V appears at this pin. Provided the output is buffered, the on-chip reference can be taken from this pin and applied externally to the rest of a system. Decoupling capacitors should be connected to this pin to decouple the reference buffer. For best performance, it is recommended to use a 10 μF decoupling capacitor on this pin to GND1. The internal reference can be disabled and an external reference supplied to this pin, if required. The input voltage range for the external reference is 2.0 V to 2.5 V. Decoupling Capacitor Pin. Decoupling capacitors (1 μF recommended) are connected to this pin to decouple the internal LDO. Ground. Ground reference point for all analog and digital circuitry on the AD7298. The GND pin should be connected to the ground plane of the system. All ground pins should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis. Both DCAP and VDD pins should be decoupled to this GND pin. Supply Voltage, 2.8 V to 3.6 V. This supply should be decoupled to GND with 10 μF and 100 nF decoupling capacitors. Chip Select, Active Low Logic Input. This pin is edge triggered on the falling edge of this input, the track-andhold goes into hold mode, and a conversion is initiated. This input also frames the serial data transfer. When CS is low, the output bus is enabled, and the conversion result becomes available on the DOUT output. Busy Output. This pin transitions high when a temperature sensor conversion starts and remains high until the conversion completes. Data In, Logic input. Data to be written to the AD7298 control register is provided on this input and is clocked into the register on the falling edge of SCLK. Serial Data Output. The conversion result from the AD7298 is provided on this output as a serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from the AD7298 consists of four address bits indicating which channel the conversion result corresponds to, followed by the 12 bits of conversion data (MSB first). The output coding is straight binary for the voltage channels and twos complement for the temperature sensor result. Serial Clock, Logic Input. A serial clock input provides the SCLK for accessing the data from the AD7298. Rev. B | Page 7 of 24 AD7298 Pin No. 16 Mnemonic VDRIVE 17 PD/RST EPAD EPAD Description Logic Power Supply Input. The voltage supplied at this pin determines at the voltage at which the interface operates. This pin should be decoupled to GND. The voltage range on this pin is 1.65 V to 3.6 V and may be less than the voltage at VDD, but should never exceed it by more than 0.3 V. Power-Down Pin. This pin places the part into full power-down mode and enables power conservation when operation is not required. This pin can be used to reset the device by toggling the pin low for a minimum of 1 ns and a maximum of 100 ns. If the maximum time is exceeded, the part enters power-down mode. When placing the AD7298 in full power-down mode, the analog inputs must return to 0 V. The exposed metal paddle on the bottom of the LFCSP package should be soldered to PCB ground for proper functionality and heat dissipation. Rev. B | Page 8 of 24 AD7298 TYPICAL PERFORMANCE CHARACTERISTICS 0 0.6 VDD = VDRIVE = 3V fSAMPLE = 1.17647MHz fIN = 50kHz fSCLK = 20MHz SNR = 72.621 THD = –82.562 –40 INL MAX 0.4 0.2 INL (LSB) AMPLITUDE (dB) –20 –60 TA = 25°C VDRIVE = 3V VDD = 3V 0 –80 0.2 –100 0.4 0 50 100 150 200 250 300 350 400 450 500 FREQUENCY (kHz) 0.6 1.00 08754-035 –120 1.25 1.50 Figure 3.Typical FFT 1.0 0.6 2.25 2.50 2.75 0.6 DNL MAX 0.4 0.4 0.2 0.2 INL (LSB) INL (LSB) 2.00 Figure 6. INL vs. VREF TA = 25°C VDRIVE = 3V VREF = 2.5V VDD = 3 V 0.8 1.75 REFERENCE VOLTAGE (V) 08754-018 INL MIN 0 –0.2 0 TA = 25°C VDRIVE = 3V VDD = 3V –0.2 –0.4 DNL MIN –0.6 –0.4 –0.8 256 512 1024 1536 2048 2560 3072 3584 4096 768 1280 1792 2304 2816 3328 3840 CODE –0.6 1.00 1.25 0 –0.2 –0.4 –0.6 9 8 7 6 5 4 3 –1.0 2 512 768 2.75 10 –0.8 1024 1536 2048 2560 3072 3584 4096 1280 1792 2304 2816 3328 3840 CODE 08754-016 DNL (LSB) 0.2 256 2.50 11 0.4 0 2.25 12 EFFECTIVE NUMBER OF BITS 0.6 2.00 Figure 7. DNL vs. VREF TA = 25°C VDRIVE = 3V VREF = 2.5V VDD = 3 V 0.8 1.75 REFERENCE VOLTAGE (V) Figure 4.Typical ADC INL 1.0 1.50 VDD = 3V VDRIVE = 3V 0 0.5 1.0 1.5 2.0 VREF (V) Figure 8. Effective Number of Bits vs. VREF Figure 5. Typical ADC DNL Rev. B | Page 9 of 24 2.5 08754-020 0 08754-017 –1.0 AD7298 3.0 110 VDD = VDRIVE = 3V 105 2.5 100 ISOLATION (dB) VREF (V) 2.0 1.5 1.0 95 90 85 80 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 CURRENT LOAD (mA) 70 0 150 200 250 300 350 400 450 500 550 500 Figure 12. Channel-to-Channel Isolation, fIN = 50 kHz 76 55 74 50 RIN = 47Ω 72 45 SINAD (dB) RIN = 33Ω 40 35 30 70 RIN = 0Ω 68 66 RIN = 47Ω RIN = 100Ω 64 25 62 20 60 20 40 60 80 100 TIME (Seconds) –92 10 100 INPUT FREQUENCY (kHz) Figure 13. SINAD vs. Analog Input Frequency for Various Source Impedances Figure 10. Response to Thermal Shock from Room Temperature into 50°C Stirred Oil –90 RIN = 200Ω 75 VDD = 3V VDRIVE = 3V 70 65 –94 60 –96 55 SINAD (dB) –98 –100 –102 50 45 40 35 –104 30 –106 25 20 –110 1k 15 10k 100k 1M RIPPLE FREQUENCY (Hz) 10M 100M 08754-027 –108 Figure 11. PSRR vs. Supply Ripple Frequency Without Supply Decoupling Rev. B | Page 10 of 24 VDD = 3V VDRIVE = 3V 0 0.5 1.0 1.5 2.0 VREF (V) Figure 14. SINAD vs. Reference Voltage 2.5 08754-022 0 08754-028 TEMPERATURE READING (°C) 100 fNOISE (kHz) Figure 9. VREF vs. Reference Output Current Drive PSRR (dB) 50 08754-029 0.5 08754-024 0 08754-021 0 75 AD7298 2.0 19 17 1.0 16 POWER (mW) 0.5 0 15 14 13 –0.5 12 –1.0 11 –40 –25 –10 0 10 20 25 30 35 45 60 85 105 125 TEMPERATURE (°C) 10 08754-034 –1.5 0 4.0 RSOURCE = 47Ω 3.5 –65 RSOURCE = 200Ω 400 500 600 700 800 900 1000 –40°C 0°C +25°C VDRIVE = 3V +85°C +105°C +125°C 3.0 TOTAL CURRENT (µA) THD (dB) 300 Figure 18. Power vs. Throughput in Normal Mode with VDD = 3 V –60 RSOURCE = 100Ω –75 RSOURCE = 43Ω –80 200 THROUGHPUT (kSPS) Figure 15. Temperature Accuracy at 3 V –70 100 08754-025 TEMPERATURE ERROR (°C) VDD = VDRIVE = 3V 18 1.5 RSOURCE = 33Ω 2.5 2.0 1.5 1.0 RSOURCE = 0Ω 100 500 SIGNAL FREQUENCY (kHz) 08754-036 –90 10 0.5 Figure 16. THD vs. Analog Input Frequency for Various Source Impedances 6 VDD = VDRIVE = 3V VDD CURRENT 4 3 2 1 0 VDRIVE CURRENT 0 200 400 600 800 1000 THROUGHPUT (kSPS) 1200 08754-026 CURRENT (mA) 5 Figure 17. Average Supply Current vs. Throughput Rate Rev. B | Page 11 of 24 0 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 VDD (V) Figure 19. Full Shutdown Current vs. Supply Voltage for Various Temperatures 08754-031 –85 AD7298 TERMINOLOGY Signal-to-Noise and Distortion Ratio (SINAD) The measured ratio of signal-to-noise and distortion at the output of the ADC. The signal is the rms amplitude of the fundamental. Noise is the sum of all nonfundamental signals up to half the sampling frequency (fS/2), excluding dc. The ratio is dependent on the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal-to-noise and distortion ratio for an ideal N-bit converter with a sine wave input is given by Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB Thus, the SINAD is 74 dB for an ideal 12-bit converter. Total Harmonic Distortion (THD) The ratio of the rms sum of harmonics to the fundamental. For the AD7298, it is defined as THD(dB) = 20 log Differential Nonlinearity The difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC. Offset Error The deviation of the first code transition (00…000) to (00…001) from the ideal—that is, GND1 + 1 LSB. Offset Error Match The difference in offset error between any two channels. Gain Error The deviation of the last code transition (111…110) to (111…111) from the ideal (that is, REFIN − 1 LSB) after the offset error has been adjusted out. Gain Error Matching The difference in gain error between any two channels. Track-and-Hold Acquisition Time V2 2 + V3 2 + V4 2 + V5 2 + V6 2 V1 where V1 is the rms amplitude of the fundamental, and V2, V3, V4, V5, and V6 are the rms amplitudes of the second through sixth harmonics. Peak Harmonic or Spurious Noise The ratio of the rms value of the next largest component in the ADC output spectrum (up to fS/2 and excluding dc) to the rms value of the fundamental. Typically, the value of this specification is determined by the largest harmonic in the spectrum, but for ADCs where the harmonics are buried in the noise floor, it is a noise peak. Integral Nonlinearity The maximum deviation from a straight line passing through the endpoints of the ADC transfer function. The endpoints are zero scale, a point 1 LSB below the first code transition, and full scale, a point 1 LSB above the last code transition. The track-and-hold amplifier returns to track mode at the end of conversion. Track-and-hold acquisition time is the time required for the output of the track-and-hold amplifier to reach its final value, within ±1 LSB, after the end of conversion. Power Supply Rejection Ratio (PSRR) PSRR is defined as the ratio of the power in the ADC output at full-scale frequency, f, to the power of a 100 mV p-p sine wave applied to the ADC VDD supply of frequency, fS. The frequency of the input varies from 5 kHz to 25 MHz. PSRR (dB) = 10 log(Pf/PfS) where: Pf is the power at frequency, f, in the ADC output. PfS is the power at frequency, fS, in the ADC output. Rev. B | Page 12 of 24 AD7298 CIRCUIT INFORMATION The AD7298 is a high speed, 8-channel, 12-bit ADC with an internal temperature sensor. The part can be operated from a 2.8 V to 3.6 V supply and is capable of throughput rates of 1 MSPS per analog input channel. CAPACITIVE DAC The AD7298 provides the user with an on-chip, track-and-hold ADC and a serial interface housed in a 20-lead LFCSP. The AD7298 has eight single-ended input channels with channel repeat functionality, which allows the user to select a channel sequence through which the ADC can cycle with each consecutive CS falling edge. The serial clock input accesses data from the part, controls the transfer of data written to the ADC, and provides the clock source for the successive approximation ADC. The analog input range for the AD7928 is 0 V to VREF. The AD7298 operates with one cycle latency, which means that the conversion result is available in the serial transfer following the cycle in which the conversion is performed. The AD7298 includes a high accuracy band gap temperature sensor, which is monitored and digitized by the 12-bit ADC to give a resolution of 0.25°C. The AD7298 provides flexible power management options to allow the user to achieve the best power performance for a given throughput rate. These options are selected by programming the partial power-down bit, PPD, in the control register and using the PD/RST pin. A SW1 COMPARATOR Figure 21. ADC Conversion Phase ANALOG INPUT Figure 22 shows an equivalent circuit of the analog input structure of the AD7298. The two diodes, D1 and D2, provide ESD protection for the analog inputs. Care must be taken to ensure that the analog input signal never exceeds the internally generated LDO voltage of 2.5 V (DCAP) by more than 300 mV. This causes the diodes to become forward-biased and start conducting current into the substrate. The maximum current these diodes can conduct without causing irreversible damage to the part is 10 mA. Capacitor C1, in Figure 22, is typically about 8 pF and can primarily be attributed to pin capacitance. The Resistor R1 is a lumped component made up of the on resistance of a switch (track-and-hold switch) and also includes the on resistance of the input multiplexer. The total resistance is typically about 155 Ω. The capacitor, C2, is the ADC sampling capacitor and has a capacitance of 34 pF typically. DCAP (2.5V) CAPACITIVE DAC B CONTROL LOGIC SW2 COMPARATOR 08754-004 GND1 A Figure 20. ADC Acquisition Phase D1 R1 VIN C1 pF D2 C2 pF CONVERSION PHASE: SWITCH OPEN TRACK PHASE: SWITCH CLOSED 08754-006 The AD7298 is a 12-bit successive approximation ADC based around a capacitive DAC. Figure 20 and Figure 21 show simplified schematics of the ADC. The ADC is comprised of control logic, SAR, and a capacitive DAC that are used to add and subtract fixed amounts of charge from the sampling capacitor to bring the comparator back into a balanced condition. Figure 20 shows the ADC during its acquisition phase. SW2 is closed and SW1 is in Position A. The comparator is held in a balanced condition and the sampling capacitor acquires the signal on the selected VIN channel. SW1 CONTROL LOGIC SW2 GND1 CONVERTER OPERATION VIN B 08754-005 VIN Figure 22. Equivalent Analog Input Circuit For ac applications, removing high frequency components from the analog input signal is recommended by using an RC lowpass filter on the relevant analog input pin. In applications where harmonic distortion and signal-to-noise ratios are critical, the analog input should be driven from a low impedance source. Large source impedances significantly affect the ac performance of the ADC. This may necessitate the use of an input buffer amplifier. The choice of the op amp is a function of the particular application performance criteria. ADC Transfer Function When the ADC starts a conversion (see Figure 21), SW2 opens and SW1 moves to Position B, causing the comparator to become unbalanced. The control logic and the capacitive DAC are used to add and subtract fixed amounts of charge to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC output code. Figure 23 shows the ADC’s transfer functions. The output coding of the AD7298 is straight binary for the analog input channel conversion results and twos complement, for the temperature conversion result. The designed code transitions occur at successive LSB values (that is, 1 LSB, 2 LSBs, and so forth). The LSB size is VREF/4096 for the AD7298. The ideal transfer characteristic for the AD7298 for straight binary coding is shown in Figure 23. Rev. B | Page 13 of 24 AD7298 The temperature conversion consists of two phases, the integration followed by the conversion. The integration is initiated on the CS falling edge. It takes a period of approximately 100 μs to complete the integration and conversion of the temperature result. When the integration is completed, the conversion is initiated automatically. Once the temperature integration is initiated, the TSENSE_BUSY signal goes high to indicate that a temperature conversion is in progress and remains high until the conversion is completed. 111...111 ADC CODE 111...110 111...000 011...111 1LSB = VREF/4096 000...010 Theoretically, the temperature measuring circuit can measure temperatures from –512°C to +511°C with a resolution of 0.25°C. However, temperatures outside TA (the specified temperature range for the AD7298) are outside the guaranteed operating temperature range of the device. The temperature sensor is selected by setting the TSENSE bit in the control register. 000...000 0V 1LSB 08754-007 000...001 +VREF – 1LSB ANALOG INPUT NOTES 1. VREF IS 2.5V. Figure 23. Straight Binary Transfer Characteristic TEMPERATURE SENSOR OPERATION TEMPERATURE SENSOR AVERAGING The AD7298 contains one local temperature sensor. The on-chip, band gap temperature sensor measures the temperature of the AD7298 die. The AD7298 incorporates a temperature sensor averaging feature to enhance the accuracy of the temperature measurements. To enable the temperature sensor averaging feature, both the TSENSEAVG bit and the TSENSE bit must be enabled in the control register. In this mode the temperature is internally averaged to reduce the effect of noise on the temperature result. The temperature is measured each time a TSENSE conversion is performed and a moving average method is used to determine the result in the TSENSE Result Register. The average result is given by the following equation: The temperature sensor module on the AD7298 is based on the three-current principle (see Figure 24), where three currents are passed through a diode and the forward voltage drop is measured, allowing the temperature to be calculated free of errors caused by series resistance. 4×I 8×I IBIAS VDD TSENSE AVG = TO ADC VOUT– INTERNAL SENSE TRANSISTOR BIAS DIODE Figure 24. Top-Level Structure of Internal Temperature Sensor 7 (Previous _ Average _ Result ) + 1 (Current _ Result ) 8 8 The TSENSE result read when averaging is enabled is the TSENSEAVG result, a moving average temperature measurement. VOUT+ 08754-008 I The first TSENSE conversion result given by the AD7298 after the temperature sensor and averaging mode has been selected in the control register (Bit D1 and Bit D5) is the actual first TSENSE conversion result. If the control register is written to and the content of the TSENSEAVG bit changed, the averaging function is reset and the next TSENSE average conversion result is the current temperature conversion result. If the status of the TSENSEAVG bit is not changed on successive writes to the control register, the averaging function is reinitialized and continues calculating the cumulative average. The user has the option of disabling the averaging by setting Bit TSENSEAVG to 0 in the control register. The AD7298 defaults on power-up with the averaging function disabled. The total time to measure a temperature channel is typically 100 μs. Rev. B | Page 14 of 24 AD7298 Temperature Value Format VDRIVE One LSB of the ADC corresponds to 0.25°C. The temperature reading from the ADC is stored in a 12-bit twos complement format to accommodate both positive and negative temperature measurements. The temperature data format is provided in Table 6. The AD7298 also provides the VDRIVE feature. VDRIVE controls the voltage at which the serial interface operates. VDRIVE allows the ADC to easily interface to both 1.8 V and 3 V processors. For example, if the AD7298 is operated with a VDD of 3.3 V, the VDRIVE pin can be powered from a 1.8 V supply. Table 6. Temperature Data Format This enables the AD7298 to operate with a larger dynamic range with a VDD of 3.3 V while still being able to interface to 1.8 V processors. Take care to ensure VDRIVE does not exceed VDD by more than 0.3 V (see the Absolute Maximum Ratings section). Temperature (°C) −40 −25 −10 −0.25 0 +0.25 +10 +25 +50 +75 +100 +105 +125 Digital Output 1111 0110 0000 1111 1001 1100 1111 1101 1000 1111 1111 1111 0000 0000 0000 0000 0000 0001 0000 0010 1000 0000 0110 0100 0000 1100 1000 0001 0010 1100 0001 1001 0000 0001 1010 0100 0001 1111 0100 THE INTERNAL OR EXTERNAL REFERENCE The AD7298 can operate with either the internal 2.5 V on-chip reference or an externally applied reference. The EXT_REF bit in the control register is used to determine whether the internal reference is used. If the EXT_REF bit is selected in the control register, an external reference can be supplied through the VREF pin. On power-up, the internal reference is enabled. Suitable external reference sources for the AD7298 include AD780, AD1582, ADR431, REF193, and ADR391. The internal reference circuitry consists of a 2.5 V band gap reference and a reference buffer. When the AD7298 operates in internal reference mode, the 2.5 V internal reference is available at the VREF pin, which should be decoupled to GND1 using a 10 μF capacitor. It is recommended that the internal reference be buffered before applying it elsewhere in the system. The temperature conversion formulas are as follows: Positive Temperature = ADC Code/4 Negative Temperature = (4096 − ADC Code)/4 The previous formulas are for a VREF of 2.5 V only. If an external reference is used, the temperature sensor requires an external reference of between 2 V and 2.5 V for correct operation. When an external reference of less than 2.5 V is applied, the temperature results are calculated using the following formula, where VEXT_REF is the value of the external reference voltage. The internal reference is capable of sourcing up to 2 mA of current when the converter is static. The reference buffer requires 5.5 ms to power up and charge the 10 μF decoupling capacitor during the power-up time. ⎛ ADCCode ⎞ Temperatur e = V EXT _ REF ⎜ + 109.3 ⎟ − 273.15 10 ⎝ ⎠ Rev. B | Page 15 of 24 AD7298 CONTROL REGISTER The control register of the AD7298 is a 16-bit, write-only register. Data is loaded from the DIN pin of the AD7298 on the falling edge of SCLK. The data is transferred on the DIN line at the same time that the conversion result is read from the part. The data transferred on the DIN line corresponds to the AD7298 configuration for the next conversion. This requires 16 serial clocks for every data transfer. Only the information provided on the first 16 falling clock edges (after the falling edge of CS) is loaded to the control register. MSB denotes the first bit in the data stream. The bit functions are outlined in Table 7 and Table 8. On power-up, the default content of the control register is all zeros. Table 7. Control Register Bit Functions MSB D15 WRITE D14 REPEAT D13 CH0 D12 CH1 D11 CH2 D10 CH3 D9 CH4 D8 CH5 D7 CH6 D6 CH7 D5 TSENSE D4 DONTC D3 DONTC D2 EXT_REF D1 TSENSEAVG LSB D0 PPD Table 8. Control Register Bit Function Description Bit D15 Mnemonic WRITE D14 D13 to D6 REPEAT CH0 to CH7 D4 TSENSE 4 to 3 D2 DONTC EXT_REF D1 TSENSEAVG D0 PPD Description The value written to this bit determines whether the subsequent 15 bits are loaded to the control register. If this bit is a 1, the following 15 bits are written to the control register; if it is a 0, then the remaining 15 bits are not loaded to the control register and it remains unchanged. This bit enables the repeated conversion of the selected sequence of channels. These eight channel selection bits are loaded at the end of the current conversion and select which analog input channel is to be converted in the next serial transfer, or they may select the sequence of channels for conversion in the subsequent serial transfers. Each CHX bit corresponds to an analog input channel. A channel or sequence of channels is selected for conversion by writing a 1 to the appropriate CHX bit/bits. Channel address bits corresponding to the conversion result are output on DOUT prior to the 12 bits of data. The next channel to be converted is selected by the mux on the 14th SCLK falling edge. Writing a 1 to this bit enables the temperature conversion. When the temperature sensor is selected for conversion, the TSENSE_BUSY pin goes high after the next CS falling edge to indicate that the conversion is in progress; the previous conversion result can be read while the temperature conversion is in progress. Once TSENSE_BUSY goes low, CS can be brought low 100 ns later to read the TSENSE conversion result. Don’t care. Writing a Logic 1 to this bit, enables the use of an external reference. The input voltage range for the external reference is 1 V to 2.5 V. The external reference should not exceed 2.5 V or the device performance is affected. Writing a 1 to this bit enables the temperature sensor averaging function. When averaging is enabled, the AD7298 internally computes a running average of the conversion results to determine the final TSENSE result (see the Temperature Sensor Averaging section for more details). This mode reduces the influence of noise on the final TSENSE result. Selecting this feature does not automatically select the TSENSE for conversion. The TSENSE bit must also be set to start a temperature sensor conversion. This partial power-down mode is selected by writing a 1 to this bit in the control register. In this mode, some of the internal analog circuitry is powered down. The AD7298 retains the information in the control register while in partial power-down mode. The part remains in this mode until a 0 is written to this bit. Table 9. Channel Address Bits ADD3 0 0 0 0 0 0 0 0 1 1 ADD2 0 0 0 0 1 1 1 1 0 0 ADD1 0 0 1 1 0 0 1 1 0 0 ADD0 0 1 0 1 0 1 0 1 0 1 Rev. B | Page 16 of 24 Analog Input Channel VIN0 VIN1 VIN2 VIN3 VIN4 VIN5 VIN6 VIN7 TSENSE TSENSE with averaging enabled AD7298 MODES OF OPERATION third CS falling edge will have the result (VIN2) available for reading. The AD7298 operates with one cycle latency, thus the conversion result corresponding to each conversion is available one serial read cycle after the cycle in which the conversion was initiated. The AD7298 offers different modes of operation that are designed to provide additional flexibility for the user. These options can be chosen by programming the content of the control register to select the desired mode. TRADITIONAL MULTICHANNEL MODE OF OPERATION The AD7298 can operate as a traditional multichannel ADC, where each serial transfer selects the next channel for conversion. One must write to the control register to configure and select the desired input channel prior to initiating any conversions. In the traditional mode of operation, the CS signal is used to frame the first write to the converter on the DIN pin. In this mode of operation, the REPEAT bit in the control register is set to a low logic level, 0, thus the REPEAT function is not in use. The data, which appears on the DOUT pin during the initial write to the control register, is invalid. The first CS falling edge initiates a write to the control register to configure the device; a conversion is then initiated for the selected analog input channel (VIN0) on the subsequent (2nd) CS falling edge; the As the device operates with one cycle latency, the control register configuration sets up the configuration for the next conversion, which is initiated on the next CS falling edge, but the first bit of the corresponding result is not clocked out until the subsequent falling CS edge, as shown in Figure 25. If more than one channel is selected in the control register, the AD7298 converts all selected channels sequentially in ascending order on successive CS falling edges. Once all the selected channels in the control register are converted, the AD7298 ceases converting until the user rewrites to the control register to select the next channel for conversion. This operation is shown in Figure 26. DOUT returns all 1s if the sequence of conversions is completed or if no channel is selected. CS 1 12 16 1 16 1 16 1 16 DIN INVALID DATA INVALID DATA CONVERSION RESULT FOR CHANNEL 1 CONVERSION RESULT FOR CHANNEL 4 DATA WRITTEN TO CONTROL REGISTER CHANNEL 1 SELECTED DATA WRITTEN TO CONTROL REGISTER CHANNEL 4 SELECTED NO WRITE TO THE CONTROL REGISTER NO WRITE TO THE CONTROL REGISTER Figure 25. Configuring a Conversion and Read with the AD7298. One channel selected for conversion. CS 1 12 16 1 16 1 16 SCLK INVALID DATA INVALID DATA CONVERSION RESULT FOR CHANNEL 1 DATA WRITTEN TO CONTROL REGISTER CH 1 AND 2 SELECTED NO WRITE TO THE CONTROL REGISTER DATA WRITTEN TO CONTROL REGISTER CHANNEL 5 SELECTED DOUT DIN CS 1 16 1 16 SCLK DOUT CONVERSION RESULT FOR CHANNEL 2 CONVERSION RESULT FOR CHANNEL 5 DIN NO WRITE TO THE CONTROL REGISTER NO WRITE TO THE CONTROL REGISTER Figure 26. Configuring a Conversion and Read with the AD7298. Numerous channels selected for conversion. Rev. B | Page 17 of 24 08754-010 DOUT 08754-009 SCLK AD7298 CS 1 12 16 1 16 1 16 SCLK INVALID DATA DOUT DIN INVALID DATA CONVERSION RESULT FOR CHANNEL 0 NO WRITE TO THE CONTROL REGISTER NO WRITE TO THE CONTROL REGISTER DATA WRITTEN TO CONTROL REGISTER CH 0, CH 1, AND CH 2 SELECTED: REPEAT = 1 CS 1 16 1 16 1 16 DOUT CONVERSION RESULT FOR CHANNEL 1 CONVERSION RESULT FOR CHANNEL 2 CONVERSION RESULT FOR CHANNEL 0 DIN NO WRITE TO THE CONTROL REGISTER NO WRITE TO THE CONTROL REGISTER NO WRITE TO THE CONTROL REGISTER 08754-011 SCLK Figure 27. Configuring a Conversion and Read in Repeat Mode REPEAT OPERATION The REPEAT bit in the control register allows the user to select a sequence of channels on which the AD7298 continuously converts. When the REPEAT bit is set in the control register, the AD7298 continuously cycles through the selected channels in ascending order, beginning with the lowest channel and converting all channels selected in the control register. On completion of the sequence, the AD7298 returns to the first selected channel in the control register and recommences the sequence. The conversion sequence of the selected channels in the repeat mode of operation continues until such time as the control register of the AD7298 is reprogrammed. If the TSENSE bit is selected in the control register, then the temperature conversion will be available for conversion after the last analog input channel in the sequence has been converted. It is not necessary to write to the control register once a repeat operation is initiated unless a change in the AD7298 configuration is required. The WRITE bit must be set to zero or the DIN line tied low to ensure that the control register is not accidentally overwritten, or the automatic conversion sequence interrupted. A write to the control register during the repeat mode of operation resets the cycle even if the selected channels are unchanged. Thus, the next conversion by the AD7298 after a write operation will be the first selected channel in the sequence. To select a sequence of channels, the associated channel bit must be set to a logic high state (1) for each analog input whose conversion is required. For example, if the REPEAT bit = 1, then CH0, CH1, and CH2 = 1. The VIN0 analog input is converted on the first CS falling edge following the write to the control register, the VIN1 channel is converted on the subsequent CS falling edge, and the VIN0 conversion result is available for reading. The third CS falling edge following the write operation initiates a conversion on VIN2 and has the VIN1 result available for reading. The AD7298 operates with one cycle latency, thus the conversion result corresponding to each conversion is available one serial read cycle after the cycle in which the conversion is initiated. This mode of operation simplifies the operation of the device by allowing consecutive channels to be converted without having to reprogram the control register or write to the part on each serial transfer. Figure 27 illustrates how to set up the AD7298 to continuously convert on a particular sequence of channels. To exit the repeat mode of operation and revert back to the traditional mode of operation of a multichannel ADC, ensure that the REPEAT bit = 0 on the next serial write. Rev. B | Page 18 of 24 AD7298 POWER-DOWN MODES CS Normal Mode Normal mode is intended for the fastest throughput rate performance because the user does not have to be concerned about any power-up times because the AD7298 remains fully powered on at all times. Figure 28 shows the general diagram of operation of the AD7298 in this mode. The conversion is initiated on the falling edge of CS and the track-and-hold enters hold mode. On the 14th SCLK falling edge, the track-and-hold returns to track mode and starts acquiring the analog input, as described in the Serial Interface section. The data presented to the AD7298 on the DIN line during the first 16 clock cycles of the data transfer are loaded into the control register (provided the WRITE bit is 1). The part remains fully powered up in normal mode at the end of the conversion as long as the PPD bit is set to 0 in the write transfer during that conversion. To ensure continued operation in normal mode, the PPD bit should be loaded with 0 on every data write operation. Sixteen serial clock cycles are required to complete the conversion and access the conversion result. For specified performance, the throughput rate should not exceed 1 MSPS. Once a conversion is complete and the CS has returned high, a minimum of the quiet time, tQUIET, must elapse before bringing CS low again to initiate another conversion and access the previous conversion result. PART IS IN PARTIAL POWER DOWN 1 16 SCLK 4 CHANNEL ADDRESS BITS + CONVERSION RESULT DOUT 08754-012 The AD7298 has a number of power conservation modes of operation that are designed to provide flexible power management options. These options can be chosen to optimize the power dissipation/throughput rate ratio for different application requirements. The power-down modes of operation of the AD7298 are controlled by the power-down (PPD) bit in the control register and the PD/RST pin on the device. When power supplies are first applied to the AD7298, care should be taken to ensure that the part is placed in the required mode of operation DATA WRITTEN TO CONTROL REGISTER IF REQUIRED DIN Figure 28. Normal Mode Operation Partial Power-Down Mode In this mode, part of the internal circuitry on the AD7298 is powered down. The AD7298 enters partial power-down on the CS rising edge once the current serial write operation containing 16 SCLK clock cycles is completed. To enter partial power-down, the PPD bit in the control register should be set to 1 on the last required read transfer from the AD7298. Once in partial power-down mode, the AD7298 transmits all 1s on the DOUT pin if CS is toggled low. If the averaging feature for the temperature sensor is enabled in the control register, the averaging is reset once the device enters partial power-down mode. The AD7298 remains in partial power-down until the powerdown bit, PPD, in the control register is changed to a logic level zero (0). The AD7298 begins powering up on the rising edge of CS following the write to the control register disabling the power-down bit. Once tQUIET has elapsed, a full 16-SCLK write to the control register must be completed to update its content with the desired channel configuration for the subsequent conversion. A valid conversion is then initiated on the next CS falling edge. Because the AD7298 has one cycle latency, the first conversion result after exiting partial power-down mode is available in the fourth serial transfer, as shown in Figure 29. The first cycle updates the PPD bit, the second cycle updates the configuration and Channel ID bits, the third completes the conversion, and the fourth accesses the DOUT valid result. The use of this mode enables a reduction in the overall power consumption of the device. THE PART IS FULLY POWERED UP ONCE THE WRITE TO THE CONTROL REGISTER IS COMPLETED. PART BEGINS TO POWER UP ON CS RISING EDGE. tQUIET tQUIET CS 1 12 16 1 16 1 16 DOUT DIN WRITE TO CONTROL REGISTER, PPD = 0. CONTROL REGISTER CONFIGURED TO POWER UP DEVICE. INVALID DATA INVALID DATA WRITE TO THE CONTROL REGISTER, SELECT CH1, PPD = 0 NO WRITE TO CONTROL REGISTER SELECT ANALOG INPUT CHANNELS FOR CONVERSION. THE NEXT CYCLE WILL CONVERT THE FIRST CHANNEL PROGRAMMED IN THIS WRITE OPERATION. Figure 29. Partial Power-Down Mode of Operation Rev. B | Page 19 of 24 AD7298 CONVERTING CHANNEL 1 NEXT CYCLE HAS CHANNEL 1 RESULT AVAILABLE FOR READING. 08754-013 SCLK AD7298 Full Power-Down Mode In this mode, all internal circuitry on the AD7298 is powered down and no information is retained in the control register or any other internal register. If the averaging feature for the temperature sensor is enabled in the control register (TSENSEAVG), the averaging is reset once the device enters power-down mode. The AD7298 is placed into full power-down mode by bringing the logic level on the PD/RST pin low for greater than 100 ns. When placing the AD7298 in full power-down mode, the ADC inputs must return to 0 V. The PD/RST pin is asynchronous to the clock, thus it can be triggered at any time. The part can be powered up for normal operation by bringing the PD/RST pin logic level back to a high logic state. The full power-down feature can be used to reduce the average power consumed by the AD7298 when operating at lower throughput rates. The user should ensure that tPOWER_UP has elapsed prior to programming the control register and initiating a valid conversion. POWERING UP THE AD7298 The AD7298 contains a power-on reset circuit, which sets the control register to its default setting of all zeros, thus the internal reference is enabled and the device is configured for the normal mode of operation. On power-up, the internal reference is by default enabled, which takes up 6 ms (maximum) to power-up. If an external reference is being used, the user does not need to wait for the internal reference to power-up fully. The AD7298 digital interface is fully functional after 500 μs from initial power-up. Therefore, the user can write to the control register after 500 μs to switch to external reference mode. The AD7298 is then immediately ready to convert once the external reference is available on the VREF pin. When supplies are first applied to the AD7298, the user must wait the specified 500 μs before programming the control register to select the desired channels for conversion. RESET The AD7298 includes a reset feature that can be used to reset the device and the contents of all internal registers, including the control register, to their default state. To activate the reset operation, the PD/RST pin should be brought low for no longer than 100 ns. It is asynchronous with the clock, thus it can be triggered at any time. If the PD/RST pin is held low for greater than 100 ns, the part enters full powerdown mode. It is imperative that the PD/RST pin be held at a stable logic level at all times to ensure normal operation. Rev. B | Page 20 of 24 AD7298 SERIAL INTERFACE The CS going low provides the first address bit to be read in by the microcontroller or DSP. The remaining data is then clocked out by subsequent SCLK falling edges, beginning with a second address bit. Thus, the first falling clock edge on the serial clock has the first address bit provided for reading and also clocks out the second address bit. The three remaining address bits and 12 data bits are clocked out by subsequent SCLK falling edges. The final bit in the data transfer is valid for reading on the 16th falling edge having been clocked out on the previous (15th) falling edge. Figure 30 shows the detailed timing diagram for the serial interface to the AD7298. The serial clock provides the conversion clock and controls the transfer of information to and from the AD7298 during each conversion. The CS signal initiates the data transfer and conversion process. The falling edge of CS puts the track-and-hold into hold mode at which point the analog input is sampled and the bus is taken out of three-state. The conversion is also initiated at this point and requires 16 SCLK cycles to complete. The track-and-hold goes back into track on the 14th SCLK falling edge as shown in Figure 30 at Point B. On the 16th SCLK falling edge or on the rising edge of CS , the DOUT line goes back into three-state. In applications with a slower SCLK, it may be possible to read in data on each SCLK rising edge depending on the SCLK frequency. The first rising edge of SCLK after the CS falling edge would have the first address bit provided, and the 15th rising SCLK edge would have last data bit provided. If the rising edge of CS occurs before 16 SCLKs have elapsed, the conversion is terminated, the DOUT line goes back into tristate, and the control register is not updated; otherwise, DOUT returns to three-state on the 16th SCLK falling edge. Sixteen serial clock cycles are required to perform the conversion process and to access data from the AD7298. Writing information to the control register takes place on the first 16 falling edges of SCLK in a data transfer, assuming the MSB (that is, the WRITE bit) has been set to 1. The 16-bit word read from the AD7298 always contains four channel address bits that the conversion result corresponds to, followed by the 12-bit conversion result. For the AD7298, four-channel address bits (ADD3 to ADD0) that identify which channel the conversion result corresponds to precede the 12 bits of data (see Table 9). tQUIET CS tACQUISITION t2 t6 1 SCLK 2 3 4 5 B 13 14 15 16 t5 t4 t3 THREESTATE ADD3 ADD2 ADD1 t9 DIN WRITE REPEAT ADD0 DB11 DB10 DB2 t8 DB1 THREESTATE DB0 t10 CH0 CH1 CH2 CH3 EXT_REF Figure 30. Serial Interface Timing Diagram Rev. B | Page 21 of 24 TSENSE AVG PPD 08754-014 DOUT t7 AD7298 TEMPERATURE SENSOR READ Alternatively, if CS remains high while TSENSE_BUSY is high, then the DOUT bus remains in three-state. The temperature sensor conversion involves two phases, the integration phase and the conversion phase as detailed in the Temperature Sensor Operation section. The integration phase is initiated on the falling edge of CS and once completed the conversion is automatically initiated internally by the AD7298. When a temperature conversion integration is initiated, the TSENSE_BUSY signal goes high to indicate that a temperature conversion is in progress and remains high until the conversion is completed. If the user writes to the control register during the first 16 SCLK cycles following TSENSE_BUSY going high, the configuration of the device for the next conversion, which is initiated on the subsequent CS falling edge after TSENSE_BUSY goes low, is altered. If the user configures the part for partial power-down in a write to the control register during the first 16 SCLK cycles following TSENSE_BUSY going high, the temperature sensor conversion is aborted and the part enters partial power-down on the 16th SCLK falling edge. The total time to measure and convert a temperature channel with the AD7298 is 100 μs max. Once the TSENSE_BUSY signal goes low to indicate that the temperature conversion is completed, 100 ns must elapse prior to the next falling edge of CS. If a minimum of 100 ns is not adhered to between the falling edge of TSENSE_BUSY and the subsequent falling edge of CS, the next conversion will be corrupted but the temperature result that is framed by the CS will not be affected. This restriction is in place to ensure that sufficient acquisition time is allowed for the next conversion. Thus, it is recommended not to write to the control register if the CS signal will be toggling while TSENSE_BUSY is high. Care should be taken to ensure that the WRITE bit is set to zero during the temperature conversion phase when CS is toggling. If an SCLK frequency of more than 10 kHz is used, the temperature conversion requires more than one standard read cycle to complete. In this case, the user can monitor the TSENSE_BUSY signal to determine when the conversion is completed and the result is available for reading. Once the TSENSE_BUSY signal goes high, the user may provide a CS falling edge to frame the read of the previous conversion and program the control register if required (see Figure 31). Once the previous conversion result has been read, any subsequent CS falling edges which occur while the TSENSE_BUSY signal is high are internally ignored by the AD7298. If additional CS falling edges are provided while TSENSE_BUSY is high, the AD7298 provides an invalid digital output of all 1s. ENSURES ADEQUATE ACQUISITION TIME FOR NEXT ADC CONVERSION THE TEMPERATURE INTEGRATION BEGINS t11 CS 1 12 16 1 16 1 16 SCLK PREVIOUS CONVERSION RESULT DIN TSENSE _BUSY DATA WRITTEN TO CONTROL REGISTER CH T SENSE SELECTED TEMPERATURE SENSOR RESULT CONFIGURE CONTROL REGISTER FOR NEXT CONVERSION THE TEMPERATURE CONVERSION IS COMPLETED Figure 31. Serial Interface Timing Diagram for the Temperature Sensor Conversion Rev. B | Page 22 of 24 08754-015 DOUT AD7298 LAYOUT AND CONFIGURATION POWER SUPPLY BYPASSING AND GROUNDING For optimum performance, carefully consider the power supply and ground return layout on any PCB where the AD7298 is used. The PCB containing the AD7298 should have separate analog and digital sections, each having its own area of the board. The AD7298 should be located in the analog section on any PCB. Decouple the power supply to the AD7298 to ground with 10 μF and 0.1 μF capacitors. Place the capacitors as physically close as possible to the device, with the 0.1 μF capacitor ideally right up against the device. It is important that the 0.1 μF capacitor have low effective series resistance (ESR) and low effective series inductance (ESL); common ceramic types of capacitors are suitable. The 0.1 μF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The 10 μF capacitors are the tantalum bead type. The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Shield clocks and other components with fast switching digital signals from other parts of the board by a digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects on the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side; however, this is not always possible with a 2-layer board. TEMPERATURE MONITORING The AD7298 is ideal for monitoring the thermal environment. The die accurately reflects the exact thermal conditions that affect nearby integrated circuits. The AD7298 measures and converts the temperature at the surface of its own semiconductor chip. When it is used to measure the temperature of a nearby heat source, the thermal impedance between the heat source and the AD7298 must be considered. When the thermal impedance is determined, the temperature of the heat source can be inferred from the AD7298 output. As much as 60% of the heat transferred from the heat source to the thermal sensor on the AD7298 die is discharged via the copper tracks and the bond pads. Of the pads on the AD7298, the GND pad transfers most of the heat. Therefore, to measure the temperature of a heat source, it is recommended that the thermal resistance between the AD7298 GND pad and the GND of the heat source be reduced as much as possible. Rev. B | Page 23 of 24 AD7298 OUTLINE DIMENSIONS PIN 1 INDICATOR 0.30 0.25 0.18 0.50 BSC PIN 1 INDICATOR 20 16 15 1 EXPOSED PAD 2.75 2.60 SQ 2.35 11 TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 5 10 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 6 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WGGD. 020509-B 4.10 4.00 SQ 3.90 Figure 32. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very, Very Thin Quad (CP-20-8) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD7298BCPZ AD7298BCPZ-RL7 EVAL-AD7298SDZ 1 Temperature Range −40°C to +125°C −40°C to +125°C Package Description 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Evaluation Board Z = RoHS Compliant Part. ©2010–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08754-0-6/11(B) Rev. B | Page 24 of 24 Package Option CP-20-8 CP-20-8