Mitsubishi CM300DY-24NF Igbt modules high power switching use Datasheet

MITSUBISHI IGBT MODULES
CM300DY-24NF
HIGH POWER SWITCHING USE
CM300DY-24NF
¡IC ................................................................... 300A
¡VCES ......................................................... 1200V
¡Insulated Type
¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
Tc measured point (Base plate)
E2
C1
7
18
7
18
6
6
4-φ6.5 MOUNTING HOLES
TAB #110. t=0.5
C2E1
E2
21.2
29
+1.0
–0.5
8.5
18
21.5
25
E2 G2
25
G1 E1
15
80
62±0.25
3-M6 NUTS
LABEL
C1
G1 E1
C2E1
4
30
(20.5)
14
E2 G2
14
110
93±0.25
14
CIRCUIT DIAGRAM
Feb. 2009
1
MITSUBISHI IGBT MODULES
CM300DY-24NF
HIGH POWER SWITCHING USE
MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol
VCES
VGES
IC
ICM
IE (Note 1)
IEM (Note 1)
PC (Note 3)
Tj
Tstg
Viso
—
—
—
Parameter
Collector-emitter voltage
Gate-emitter voltage
Collector current
Emitter current
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Torque strength
Weight
Conditions
G-E Short
C-E Short
DC, TC’ = 111°C*3
Pulse
Ratings
1200
±20
300
600
300
600
1130
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
580
(Note 2)
Pulse
TC = 25°C
(Note 2)
Terminals to base plate, f = 60Hz, AC 1 minute
Main terminals M6 screw
Mounting M6 screw
Typical value
Unit
V
V
A
A
A
A
W
°C
°C
Vrms
N•m
N•m
g
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
Parameter
Test conditions
Limits
Typ.
—
Max.
1
Unit
ICES
Collector cutoff current
VCE = VCES, VGE = 0V
Min.
—
VGE(th)
Gate-emitter threshold voltage
IC = 30mA, VCE = 10V
6
7
8
V
IGES
Gate leakage current
±VGE = VGES, VCE = 0V
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.0
—
1.8
2.0
—
—
—
2000
—
—
—
—
—
13
—
—
—
0.02
—
—
0.5
2.5
—
70
6
1.4
—
500
150
600
350
250
—
3.2
0.11
0.18
µA
VCE(sat)
Collector-emitter saturation voltage
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note 1)
Qrr (Note 1)
VEC(Note 1)
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
Rth(j-c’)Q
RG
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Thermal resistance*1
Contact thermal resistance
Thermal resistance
External gate resistance
Tj = 25°C
Tj = 125°C
IC = 300A, VGE = 15V
VCE = 10V
VGE = 0V
VCC = 600V, IC = 300A, VGE = 15V
VCC = 600V, IC = 300A
VGE = ±15V
RG = 1Ω, Inductive load
IE = 300A
IE = 300A, VGE = 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to heat sink, Thermal compound Applied*2 (1/2 module)
Case temperature measured point is just under the chips
mA
V
nF
nF
nF
nC
ns
ns
ns
ns
ns
—
0.046*3
10
µC
V
K/W
K/W
K/W
K/W
Ω
*1 : Case temperature (Tc) measured point is shown in page OUTLINE DRAWING.
*2 : Typical value is measured by using thermally conductive grease of λ = 0.9[W/(m • K)].
*3 : Case temperature (Tc’) measured point is just under the chips.
If you use this value, Rth(f-a) should be measured just under the chips.
Note 1. IE, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
Feb. 2009
2
MITSUBISHI IGBT MODULES
CM300DY-24NF
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
Tj = 25°C
15
13
500
12
400
11
300
200
10
100
9
0
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
VGE =
20V
0
4
2
6
8
10
VGE = 15V
3
2
1
Tj = 25°C
Tj = 125°C
0
100
0
200
300
400
500
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
10
7
8
6
4
IC = 300A
IC = 600A
2
5
3
2
102
7
5
3
2
Tj = 25°C
Tj = 125°C
IC = 120A
0
6
8
10
12
14
16
18
7
5
101
20
7
5
2
3
4
5
CAPACITANCE–VCE
CHARACTERISTICS
(TYPICAL)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
104
Cies
SWITCHING TIME (ns)
100
1
EMITTER-COLLECTOR VOLTAGE VEC (V)
101
3
2
0
GATE-EMITTER VOLTAGE VGE (V)
3
2
7
5
600
103
Tj = 25°C
102
CAPACITANCE Cies, Coes, Cres (nF)
4
COLLECTOR-EMITTER VOLTAGE VCE (V)
EMITTER CURRENT IE (A)
COLLECTOR CURRENT IC (A)
600
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
OUTPUT CHARACTERISTICS
(TYPICAL)
Coes
Cres
3
2
VGE = 0V
10–1 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
7
5
3
2
Conditions:
VCC = 600V, VGE = ±15V, RG = 1.0Ω
Tj = 125°C, Inductive load
103
7
5
3
2
td(on)
tf
102
7
5
3
2
101 1
10
COLLECTOR-EMITTER VOLTAGE VCE (V)
td(off)
tr
2
3
5 7 102
2
3
5 7 103
COLLECTOR CURRENT IC (A)
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM300DY-24NF
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
103
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101
100
7
5
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth (j–c)
REVERSE RECOVERY TIME trr (ns)
REVERSE RECOVERY CURRENT lrr (A)
HIGH POWER SWITCHING USE
3
Irr
2
trr
102
7
5
3
2
101 1
10
2
3
5 7 102
Conditions:
VCC = 600V
VGE = ±15V
RG = 1.0Ω
Tj = 25°C
Inductive load
2 3
5 7 103
7
5
3
2
Single Pulse
TC = 25°C
10–1
10–1
7
5
3
2
7
5
3
2
IGBT part:
10–2 Per unit base =
7
5 Rth(j–c) = 0.11K/W
FWDi part:
3
Per unit base =
2
Rth(j–c) = 0.18K/W
–3
10
10–2
7
5
3
2
10–3
10–5 2 3 5 710–4 2 3 5 7 10–3
TIME (s)
EMITTER CURRENT IE (A)
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE VGE (V)
20
IC = 300A
VCC = 400V
16
VCC = 600V
12
8
4
0
0
500
1000 1500 2000 2500 3000
GATE CHARGE QG (nC)
Feb. 2009
4
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