SUPPLEMENT Am29F100 Known Good Die 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS ■ Single power supply operation — 5.0 V ± 10% for read, erase, and program operations — Simplifies system-level power requirements ■ High performance — 120 ns maximum access time ■ Low power consumption — 20 mA typical active read current for byte mode — 28 mA typical active read current for word mode — 30 mA typical program/erase current — 25 µA typical standby current ■ Flexible sector architecture — One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and one 64 Kbyte sectors (byte mode) — One 8 Kword, two 4 Kword, one 16 Kword, and one 32 Kword sectors (word mode) — Any combination of sectors can be erased — Supports full chip erase ■ Top or bottom boot block configurations available ■ Sector protection — Hardware-based feature that disables/reenables program and erase operations in any combination of sectors ■ Embedded Algorithms — Embedded Erase algorithm automatically pre-programs and erases the chip or any combination of designated sector — Embedded Program algorithm automatically programs and verifies data at specified address ■ Minimum 100,000 program/erase cycles guaranteed ■ Compatible with JEDEC standards — Pinout and software compatible with single-power-supply flash — Superior inadvertent write protection ■ Data Polling and Toggle Bits — Provides a software method of detecting program or erase cycle completion ■ Ready/Busy pin (RY/BY#) — Provides a hardware method for detecting program or erase cycle completion ■ Erase Suspend/Erase Resume — Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation ■ Hardware RESET# pin — Hardware method of resetting the device to reading array data — Sector protection/unprotection can be implemented using standard PROM programming equipment ■ Tested to datasheet specifications at temperature — Temporary Sector Unprotect feature allows insystem code changes in protected sectors ■ Quality and reliability levels equivalent to standard packaged components Publication# 21235 Rev: B Amendment/0 Issue Date: January 1998 S U P P L E M E N T GENERAL DESCRIPTION The Am29F100 in Known Good Die (KGD) form is a 1 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. Am29F100 Features The Am29F100 is a 1 Mbit, 5.0 Volt-only Flash memory organized as 131,072 bytes or 65,536 words. Wordwide data appears on DQ0-DQ15; byte-wide data on DQ0-DQ7. The device is designed to be programmed in-system with the standard system 5.0 Volt VCC supply. A 12.0 volt VPP is not required for program or erase operations. The device can also be programmed or erased in standard EPROM programmers. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program command sequence. This invokes the Embedded Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Device erasure occurs by executing the erase command sequence. This invokes the Embedded Erase algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the 2 device automatically times the erase pulse widths and verifies proper cell margin. The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The Erase Suspend feature enables the system to put erase on hold for any period of time to read data from, or program data to, a sector that is not being erased. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is erased when shipped from the factory. The hardware data protection measures include a low VCC detector automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory, and is implemented using standard EPROM programmers. The temporary sector unprotect feature allows in-system changes to protected sectors. The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory. The system can place the device into the standby mode. Power consumption is greatly reduced in this mode. AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the h i g h e st l e ve l s o f q u a l i ty, re l i a b il i ty, a n d c o s t effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection. ELECTRICAL SPECIFICATIONS Refer to the Am29F100 data sheet, document number 18926, for full electrical specifications on the Am29F100. Am29F100 Known Good Die S U P P L E M E N T PRODUCT SELECTOR GUIDE Family Part Number Am29F100 KGD Speed Option (VCC = 5.0 V ± 10%) -120 Max Access Time, tACC (ns) 120 Max CE# Access, tCE (ns) 120 Max OE# Access, tOE (ns) 50 DIE PHOTOGRAPH Orientation relative to leading edge of tape and reel Orientation relative to top left corner of Gel-Pak DIE PAD LOCATIONS 11 10 9 8 7 6 5 4 3 2 1 47 46 45 44 43 42 41 40 39 38 37 36 35 12 13 34 AMD logo location 14 15 16 17 18 19 20 21 22 23 33 24 Am29F100 Known Good Die 25 26 27 28 29 30 31 32 3 S U P P L E M E N T PAD DESCRIPTION Pad Signal 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 VCC DQ4 DQ12 DQ5 DQ13 DQ6 DQ14 NC DQ7 NC NC DQ15 VSS BYTE# A15 A14 A13 A12 A11 A10 A9 A8 WE# RESET# RY/BY# A7 A6 A5 A4 A3 A2 A1 A0 CE# VSS OE# NC NC NC DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 Pad Center (mils) X Y 0.0 0.0 –16.5 0.6 –27.0 0.6 –37.8 0.6 –48.4 0.6 –59.1 0.6 –69.7 0.6 –80.5 0.6 –91.0 0.6 –103 0.6 –109.6 0.6 –114.7 –20.6 –114.7 –29.5 –113.3 –37.0 –110.2 –121.9 –100.0 –121.9 –90.0 –121.9 –79.9 –121.9 –69.9 –121.9 –59.9 –121.9 –49.9 –121.9 –39.9 –121.9 –29.9 –121.9 47.8 –121.9 61.2 –121.9 71.1 –121.9 81.1 –121.9 91.0 –121.9 101.1 –121.9 114.5 –121.9 121.4 –121.9 131.4 –121.9 134.5 –41.1 134.5 –32.7 134.5 –17.6 130.7 0.6 120.9 0.6 114.2 0.6 107.5 0.6 91.6 0.6 80.2 0.6 69.4 0.6 58.9 0.6 48.1 0.6 37.5 0.6 26.7 0.6 16.2 0.6 Pad Center (millimeters) X Y 0.00 0.00 –0.42 0.02 –0.69 0.02 –0.96 0.02 –1.23 0.02 –1.50 0.02 –1.77 0.02 –2.04 0.02 –2.31 0.02 –2.62 0.02 –2.78 0.02 –2.91 –0.52 –2.91 –0.75 –2.88 –0.94 –2.80 –3.10 –2.54 –3.10 –2.29 –3.10 –2.03 –3.10 –1.78 –3.10 –1.52 –3.10 –1.27 –3.10 –1.01 –3.10 –0.76 –3.10 1.21 –3.10 1.55 –3.10 1.81 –3.10 2.06 –3.10 2.31 –3.10 2.57 –3.10 2.91 –3.10 3.08 –3.10 3.34 –3.10 3.42 –1.04 3.42 –0.83 3.42 –0.45 3.32 0.02 3.07 0.02 2.90 0.02 2.73 0.02 2.33 0.02 2.04 0.02 1.76 0.02 1.50 0.02 1.22 0.02 0.95 0.02 0.68 0.02 0.41 0.02 Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment. 4 Am29F100 Known Good Die S U P P L E M E N T ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F100 T -120 DP C 1 DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature. TEMPERATURE RANGE C = Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) E = Extended (–55°C to +125°C) PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP = Waffle Pack 180 die per 5 tray stack DG = Gel-Pak® Die Tray 420 die per 6 tray stack DT = Surftape™ (Tape and Reel) 1600 per 7-inch reel DW = Gel-Pak® Wafer Tray (sawn wafer on frame) Call AMD sales office for minimum order quantity SPEED OPTION See Valid Combinations BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION Am29F100 Known Good Die 1 Megabit (128 K x 8-Bit/64K x 16-Bit) CMOS Flash Memory—Die Revision 1 5.0 Volt-only Program and Erase Valid Combinations Am29F100T-120 Am29F100B-120 DPC 1, DPI 1, DPE 1, DGC 1, DGI 1, DGE 1, DTC 1, DTI 1, DTE 1, DWC 1, DWI 1, DWE 1 Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. Am29F100 Known Good Die 5 S U P P L E M E N T PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F100 product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition, an Wafer Sort 1 Bake 24 hours at 250°C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack Shipment Figure 1. 6 AMD KGD Product Test Flow Am29F100 Known Good Die S U P P L E M E N T PHYSICAL SPECIFICATIONS MANUFACTURING INFORMATION Die dimensions . . . . . . . . . . . . . . 266 mils x 142 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.76 mm x 3.61 mm Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm Bond Pad Size . . . . . . . . . . . . . . 4.64 mils x 4.64 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 117.8 µm x 117.8 µm Pad Area Free of Passivation . . . . . . . . . .21.53 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,877 µm2 Manufacturing ID (Top Boot) . . . . . . . . . . . . 98242AK (Bottom Boot) . . . . . . . .98242ABK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride DC OPERATING CONDITIONS VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250°C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Junction Temperature Under Bias . .TJ (max) = 130°C Storage Operating Temperature . . . . . . . . . . . . . . . . . . . . . . Commercial 0°C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C Store at a maximum temperature of 30°C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Am29F100 Known Good Die 7 S U P P L E M E N T TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to AMD Products under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD’s standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. AMD warrants articles of its manufacture against defective materials or workmanship for a period of ninety (90) days from date of shipment. This warranty does not extend beyond AMD’s customer, and does not extend to die which has been affixed onto a board or substrate of any kind. The liability of AMD under this warranty is limited, at AMD’s option, solely to repair or to replacement with equivalent articles, or to make an appropriate credit adjustment not to exceed the original sales price, for articles returned to AMD, provided that: (a) The Buyer promptly notifies AMD in writing of each and every defect or nonconformity in any article for which Buyer wishes to make a warranty claim against AMD; (b) Buyer obtains authorization from AMD to return the article; (c) the article is returned to AMD, transportation charges paid by AMD, F.O.B. AMD’s factory; and (d) AMD’s examination of such article discloses to its satisfaction that such alleged defect or nonconformity actually exists and was not caused by negligence, misuse, improper installation, accident or unauthorized repair or alteration by an entity other than AMD. The aforementioned provisions do not extend the original warranty period of any article which has either been repaired or replaced by AMD. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD’S PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYERS SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING ARTICLES AND AMD SH ALL NOT IN AN Y EVENT BE LIABLE FOR DAMAGES BY REASON OF FAILURE OF ANY PRODUCT TO FUNCTION PROPERLY OR FOR ANY SPECIAL, INDIRECT, CONSEQUENTIAL, INCIDENTAL OR EXEMPLARY DAMAGES, INCLUDING BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS OF USE OR COST OF LABOR BY REASON OF THE FACT THAT SUCH ARTICLES SHALL HAVE BEEN DEFECTIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representations to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD’s warranty. Buyer assumes all responsibility for successful die prep, die attach and wire bonding processes. Due to the unprotected nature of the AMD Products which are the subject hereof, AMD assumes no responsibility for environmental effects on die. AMD products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in a personal injury. Buyer’s use of AMD products for use in life support applications is at Buyer’s own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale. REVISION SUMMARY FOR AM29F100 KNOWN GOOD DIE Formatted to match current template. Updated Distinctive Characteristics and General Description sections using the current main data sheet. Changed Surftape quantity to 1600. Trademarks Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. 8 Am29F100 Known Good Die