LITEON LTL1CHJDE-011A Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL1CHJDE-011A
Spec No.: DS20-2011-0182
Effective Date: 12/13/2012
Revision: A
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Lead (Pb) free product – RoHS compliant.
* High luminous intensity output.
* Low power consumption.
* High efficiency.
* Versatile mounting on P.C. Board or panel.
* I.C. Compatible/low current requirement.
* 3.1 mm diameter package.
Package Dimensions
Part No.
Lens
Source Color
LTL1CHJDE-011A
Red Diffused
AlInGaP Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm (.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
6. The LED lamp original is LTL1CHJDE.
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
1
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at TA=25℃
Parameter
Maximum Rating
Unit
75
mW
90
mA
DC Forward Current
30
mA
Derating Linear From 50℃
0.4
mA/℃
5
V
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Reverse Voltage
Operating Temperature Range
-40℃ to +100℃
Storage Temperature Range
-55℃ to + 100℃
Lead Soldering Temperature
[2 mm(.0787") From Body]
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
260℃ for 5 Seconds Max.
Page :
2
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at TA=25℃
Parameter
Luminous Intensity
Symbol
Min.
Typ.
Max.
Unit
IV
85
240
310
mCd
2θ1/2
60
deg
Peak Emission Wavelength
λP
632
nm
Dominant Wavelength
λd
Viewing Angle
617
621
Δλ
20
Forward Voltage
VF
2.05
Reverse Current
IR
Spectral Line Half-Width
629
nm
Test Condition
IF = 20mA
Note 1
Note 2 (Fig.5)
Measurement
@Peak (Fig.1)
Note 4
nm
2.4
V
100
μA
IF = 20mA
Note 5
VR = 5V
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
5. Reverse Voltage (VR) condition is applied for IR test only. The device is not designed for reverse
Operation
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
3
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics
(25℃
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Ambient
Temperature
Unless
Otherwise
Curves
Noted)
Page :
4
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Compatible with radial lead automatic insertion equipment.
* Most radial lead plastic lead lamps available packaged in tape and reel.
* 5mm (0.197") formed lead and 2.54mm (0.1") straight lead spacing available.
* Reel packaging simplifies handling and testing.
* Ammo packing series lamp type 24 LED+GAP.
Package Dimensions
Specification
Item
Symbol
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
D
3.8
0.149
4.2
0.165
Component Lead Pitch
F
4.8
0.188
5.8
0.228
Front to Rear Deflection
△H
--
--
2.0
0.078
Height of Seating Plane
H
15.5
0.610
16.5
0.649
Feed Hole to Bottom of Component
H1
19.0
0.748
21.0
0.827
Feed Hole to Overall Component Height
H2
23.9
0.940
26.5
1.043
11.0
0.433
Lead Length After Component Height
L
Feed Hole Pitch
P
12.4
0.488
13.0
0.511
Lead Location
P1
3.15
0.124
4.55
0.179
Center of Component Location
P2
5.05
0.198
7.65
0.301
Total Taped Thickness
T
--
--
0.90
0.035
Feed Hole Location
W0
8.5
0.334
9.75
0.384
Adhesive Tape Position
W2
0
0
3.0
0.118
Tape Width
W3
17.5
0.689
19.0
0.748
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
W0
Page :
5
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Packing Spec
3,000 pcs per inner carton
10 Inner cartons per outer carton
total 30,000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
6
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Bin code for reference
Luminous Intensity
Unit : mcd @20mA
Bin Code
Min.
Max.
EF
85
140
GH
140
240
J
240
310
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength
Unit : nm @20mA
Bin Code
Min.
Max.
H28
617.0
621.0
H29
621.0
625.0
H30
625.0
629.0
Note: Tolerance of each bin limit is ±1nm
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
7
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, For Lamp without stopper type and must be leave a minimum of 3 mm clearance
from the base of the lens to the soldering point.
To avoided the Epoxy climb up on lead frame and was impact to non-soldering problem, Dipping the
lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or
catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp Product.
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
8
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
ESD-damaged Leeds will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and
Vf of the suspect LEDs at low currents.
The Vf of “good” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.
Chip ESD level
Machine Model
Human Body Model
100 V
300 V
AlInGaP
200 V
500 V
InGaN / SiC
600 V
1000 V
InGaN / Sapphire
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
9
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
Part No. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
10
of
11
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
8. Reliability Test
Classification
Test
Item
Operation Life (LT)
Endurance
Test
Condition
Ta = under room temperature
IF = per datasheet maximum drive current
*Test time = 1000 hrs
Ta = 60℃
High temperature/
High humidity storage RH = 90%
(THS)
Test time = 240hrs
Test
High temperature
storage
Ta = 105 ± 5 ℃
Test time = 1000 hrs
Low temperature
storage
Ta= -55 ± 5 ℃
Test time = 1000 hrs
100°C ~ 25°C ~ -40°C ~ 25°C
Temperature cycling 30 mins
5 mins
30 mins 5 mins
30 cycles
Thermal
Shock
Environmental Solder resistance
Test
(no pre-condition)
100 ± 5 ℃ ~ -30 ± 5 ℃
15 mins
15 mins
30 cycles (< 20 secs transfer)
T.sol = 260 ± 5℃
Dwell time = 10 ± 1 sec
3mm from the base of the epoxy buib
Reference
Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
JEITA ED-4701: 200 202 (2001)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
MIL-STD-750D:2031 (1995)
JEITA ED-4701: 300 302 (2001)
MIL-STD-750D:2026 (1995)
Solderability
(no pre-condition)
T.sol = 245 ± 5℃
Dwell time = 5 ± 0.5 sec
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
(no pre-condition)
T.sol = 350 ± 5℃
Dwell time = 3.5 ± 0.5 sec
MIL-STD-202G:208H (2002)
JEITA ED-4701: 300 302 (2001)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
Part no. : LTL1CHJDE-011A
BNS-OD-C131/A4
Page :
11
of
11
Similar pages