TI1 LM334M/NOPB Lm134/lm234/lm334 3-terminal adjustable current source Datasheet

LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
LM134/LM234/LM334 3-Terminal Adjustable Current Sources
Check for Samples: LM134, LM234, LM334
FEATURES
1
•
•
•
•
•
2
•
Operates From 1V to 40V
0.02%/V Current Regulation
Programmable From 1μA to 10mA
True 2-Terminal Operation
Available as Fully Specified Temperature
Sensor
±3% Initial Accuracy
DESCRIPTION
The LM134/LM234/LM334 are 3-terminal adjustable
current sources featuring 10,000:1 range in operating
current, excellent current regulation and a wide
dynamic voltage range of 1V to 40V. Current is
established with one external resistor and no other
parts are required. Initial current accuracy is ±3%.
The LM134/LM234/LM334 are true floating current
sources with no separate power supply connections.
In addition, reverse applied voltages of up to 20V will
draw only a few dozen microamperes of current,
allowing the devices to act as both a rectifier and
current source in AC applications.
The sense voltage used to establish operating current
in the LM134 is 64mV at 25°C and is directly
proportional to absolute temperature (°K). The
simplest one external resistor connection, then,
generates a current with ≈+0.33%/°C temperature
dependence. Zero drift operation can be obtained by
adding one extra resistor and a diode.
Applications for the current sources include bias
networks, surge protection, low power reference,
ramp generation, LED driver, and temperature
sensing. The LM234-3 and LM234-6 are specified as
true temperature sensors with ensured initial
accuracy of ±3°C and ±6°C, respectively. These
devices are ideal in remote sense applications
because series resistance in long wire runs does not
affect accuracy. In addition, only 2 wires are required.
The LM134 is specified over a temperature range of
−55°C to +125°C, the LM234 from −25°C to +100°C
and the LM334 from 0°C to +70°C. These devices
are available in TO hermetic, TO-92 and SOIC-8
plastic packages.
Connection Diagrams
SOIC-8 Surface Mount Package
Figure 1. See Package Number D
SOIC-8 Alternative Pinout Surface Mount Package
Figure 2. See Package Number D
−
V Pin is electrically connected to case.
TO Metal Can Package
(Bottom View)
Figure 3. See Package Number NDV
TO-92 Plastic Package
(Bottom View)
Figure 4. See Package Number LP
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
V+ to V− Forward Voltage
LM134/LM234/LM334
40V
LM234-3/LM234-6
30V
V+ to V− Reverse Voltage
20V
−
5V
Set Current
10 mA
R Pin to V Voltage
Power Dissipation
ESD Susceptibility
400 mW
(3)
2000V
Operating Temperature Range (4)
LM134
−55°C to +125°C
LM234/LM234-3/LM234-6
−25°C to +100°C
LM334
Soldering Information
0°C to +70°C
TO-92 Package (10 sec.)
260°C
TO Package (10 sec.)
SOIC Package
(1)
(2)
(3)
(4)
300°C
Vapor Phase (60 sec.)
215°C
Infrared (15 sec.)
220°C
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Human body model, 100pF discharged through a 1.5kΩ resistor.
For elevated temperature operation, TJ max is:
LM134
150°C
LM234
125°C
LM334
100°C
See Thermal Characteristics.
Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
Thermal Resistance
θja (Junction to Ambient)
TO-92
TO
SOIC-8
180°C/W (0.4″ leads)
440°C/W
165°C/W
32°C/W
80°C/W
160°C/W (0.125″ leads)
θjc (Junction to Case)
2
Submit Documentation Feedback
N/A
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
Electrical Characteristics
(1)
Parameter
Set Current Error, V+=2.5V
Conditions
(2)
LM134/LM234
Min
Typ
6
%
8
%
12
%
8
14
18
23
14
14
18
26
14
2 μA≤ISET≤100 μA
18
2μA ≤ ISET ≤ 100μA
0.8
0.8
V
100μA < ISET ≤ 1mA
0.9
0.9
V
1mA < ISET ≤ 5mA
1mA < ISET ≤ 5mA
23
18
1.0
26
1.0
V
1.5 ≤ V+ ≤ 5V
0.02
0.05
0.02
0.1
%/V
5V ≤ V+ ≤ 40V
0.01
0.03
0.01
0.05
%/V
1.5V ≤ V ≤ 5V
0.03
5V ≤ V ≤ 40V
25μA ≤ ISET ≤ 1mA
0.03
0.02
0.96T
Effective Shunt Capacitance
(3)
Units
5
Average Change in Set Current 2μA ≤ ISET ≤ 1mA
with Input Voltage
(1)
(2)
Max
3
1mA ≤ ISET ≤ 5mA
Temperature Dependence of
Set Current (3)
Typ
1mA < ISET ≤ 5mA
100μA ≤ ISET ≤ 1mA
Minimum Operating Voltage
Min
10μA ≤ ISET ≤ 1mA
2μA ≤ ISET < 10μA
Ratio of Set Current to Bias
Current
LM334
Max
T
%/V
0.02
1.04T
0.96T
15
T
%/V
1.04T
15
pF
Unless otherwise specified, tests are performed at Tj = 25°C with pulse testing so that junction temperature does not change during test
Set current is the current flowing into the V+ pin. For the Basic 2-Terminal Current Source circuit shown in Figure 13. ISET is determined
by the following formula: ISET = 67.7 mV/RSET (@ 25°C). Set current error is expressed as a percent deviation from this amount. ISET
increases at 0.336%/°C @ Tj = 25°C (227 μV/°C).
ISET is directly proportional to absolute temperature (°K). ISET at any temperature can be calculated from: ISET = Io (T/To) where Io is ISET
measured at To (°K).
Electrical Characteristics
(1)
Parameter
Set Current Error, V+=2.5V
Conditions
(2)
LM234-3
Min
Typ
100μA ≤ ISET ≤ 1mA
LM234-6
Max
Min
Typ
Max
Units
±1
±2
%
±3
±6
°C
TJ = 25°
Equivalent Temperature Error
Ratio of Set Current to Bias
Current
100μA ≤ ISET ≤ 1mA
Minimum Operating Voltage
100μA ISET ≤ 1mA
Average Change in Set Current 100μA ≤ ISET ≤ 1mA
with Input Voltage
Temperature Dependence of
Set Current (3)
100μA ≤ ISET ≤ 1mA
14
18
0.02
5V ≤ V+ ≤ 30V
0.98T
18
0.01
0.03
T
1.02T
15
26
0.9
0.05
0.02
0.97T
V
0.01
%/V
0.01
0.05
%/V
T
1.03T
±2
Effective Shunt Capacitance
(3)
14
0.9
1.5 ≤ V+ ≤ 5V
Equivalent Slope Error
(1)
(2)
26
±3
15
%
pF
Unless otherwise specified, tests are performed at Tj = 25°C with pulse testing so that junction temperature does not change during test
Set current is the current flowing into the V+ pin. For the Basic 2-Terminal Current Source circuit shown in Figure 13. ISET is determined
by the following formula: ISET = 67.7 mV/RSET (@ 25°C). Set current error is expressed as a percent deviation from this amount. ISET
increases at 0.336%/°C @ Tj = 25°C (227 μV/°C).
ISET is directly proportional to absolute temperature (°K). ISET at any temperature can be calculated from: ISET = Io (T/To) where Io is ISET
measured at To (°K).
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
3
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
Typical Performance Characteristics
4
Output Impedance
Maximum Slew Rate
Linear Operation
Figure 5.
Figure 6.
Start-Up
Transient Response
Figure 7.
Figure 8.
Voltage Across RSET (VR)
Current Noise
Figure 9.
Figure 10.
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
Typical Performance Characteristics (continued)
Turn-On Voltage
Ratio of ISET to IBIAS
Figure 11.
Figure 12.
APPLICATION HINTS
The LM134 has been designed for ease of application, but a general discussion of design features is presented
here to familiarize the designer with device characteristics which may not be immediately obvious. These include
the effects of slewing, power dissipation, capacitance, noise, and contact resistance.
Calculating RSET
The total current through the LM134 (ISET) is the sum of the current going through the SET resistor (IR) and the
LM134's bias current (IBIAS), as shown in Figure 13.
Figure 13. Basic Current Source
A graph showing the ratio of these two currents is supplied under Ratio of ISET to IBIAS in Typical Performance
Characteristics. The current flowing through RSET is determined by VR, which is approximately 214μV/°K (64
mV/298°K ∼ 214μV/°K).
(1)
Since (for a given set current) IBIAS is simply a percentage of ISET, the equation can be rewritten
(2)
where n is the ratio of ISET to IBIAS as specified in Electrical Characteristics and shown in the graph. Since n is
typically 18 for 2μA ≤ ISET ≤ 1mA, the equation can be further simplified to
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
5
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
(3)
for most set currents.
Slew Rate
At slew rates above a given threshold (see curve), the LM134 may exhibit non-linear current shifts. The slewing
rate at which this occurs is directly proportional to ISET. At ISET = 10μA, maximum dV/dt is 0.01V/μs; at ISET =
1mA, the limit is 1V/μs. Slew rates above the limit do not harm the LM134, or cause large currents to flow.
Thermal Effects
Internal heating can have a significant effect on current regulation for ISET greater than 100μA. For example, each
1V increase across the LM134 at ISET = 1 mA will increase junction temperature by ≈0.4°C in still air. Output
current (ISET) has a temperature coefficient of ≈0.33%/°C, so the change in current due to temperature rise will be
(0.4) (0.33) = 0.132%. This is a 10:1 degradation in regulation compared to true electrical effects. Thermal
effects, therefore, must be taken into account when DC regulation is critical and ISET exceeds 100μA. Heat
sinking of the TO package or the TO-92 leads can reduce this effect by more than 3:1.
Shunt Capacitance
In certain applications, the 15 pF shunt capacitance of the LM134 may have to be reduced, either because of
loading problems or because it limits the AC output impedance of the current source. This can be easily
accomplished by buffering the LM134 with an FET as shown in the applications. This can reduce capacitance to
less than 3 pF and improve regulation by at least an order of magnitude. DC characteristics (with the exception
of minimum input voltage), are not affected.
Noise
Current noise generated by the LM134 is approximately 4 times the shot noise of a transistor. If the LM134 is
used as an active load for a transistor amplifier, input referred noise will be increased by about 12dB. In many
cases, this is acceptable and a single stage amplifier can be built with a voltage gain exceeding 2000.
Lead Resistance
The sense voltage which determines operating current of the LM134 is less than 100mV. At this level,
thermocouple or lead resistance effects should be minimized by locating the current setting resistor physically
close to the device. Sockets should be avoided if possible. It takes only 0.7Ω contact resistance to reduce output
current by 1% at the 1 mA level.
Sensing Temperature
The LM134 makes an ideal remote temperature sensor because its current mode operation does not lose
accuracy over long wire runs. Output current is directly proportional to absolute temperature in degrees Kelvin,
according to the following formula:
(4)
Calibration of the LM134 is greatly simplified because of the fact that most of the initial inaccuracy is due to a
gain term (slope error) and not an offset. This means that a calibration consisting of a gain adjustment only will
trim both slope and zero at the same time. In addition, gain adjustment is a one point trim because the output of
the LM134 extrapolates to zero at 0°K, independent of RSET or any initial inaccuracy.
6
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
Figure 14. Gain Adjustment
This property of the LM134 is illustrated in the accompanying graph. Line abc is the sensor current before
trimming. Line a′b′c′ is the desired output. A gain trim done at T2 will move the output from b to b′ and will
simultaneously correct the slope so that the output at T1 and T3 will be correct. This gain trim can be done on
RSET or on the load resistor used to terminate the LM134. Slope error after trim will normally be less than ±1%.
To maintain this accuracy, however, a low temperature coefficient resistor must be used for RSET.
A 33 ppm/°C drift of RSET will give a 1% slope error because the resistor will normally see about the same
temperature variations as the LM134. Separating RSET from the LM134 requires 3 wires and has lead resistance
problems, so is not normally recommended. Metal film resistors with less than 20 ppm/°C drift are readily
available. Wire wound resistors may also be used where best stability is required.
Application as a Zero Temperature Coefficent Current Source
Adding a diode and a resistor to the standard LM134 configuration can cancel the temperature-dependent
characteristic of the LM134. The circuit shown in Figure 15 balances the positive tempco of the LM134 (about
+0.23 mV/°C) with the negative tempco of a forward-biased silicon diode (about −2.5 mV/°C).
Figure 15. Zero Tempco Current Source
The set current (ISET) is the sum of I1 and I2, each contributing approximately 50% of the set current, and IBIAS.
IBIAS is usually included in the I1 term by increasing the VR value used for calculations by 5.9%. (See
CALCULATING RSET.)
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
7
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
(5)
The first step is to minimize the tempco of the circuit, using the following equations. An example is given using a
value of +227μV/°C as the tempco of the LM134 (which includes the IBIAS component), and −2.5 mV/°C as the
tempco of the diode (for best results, this value should be directly measured or obtained from the manufacturer
of the diode).
(6)
(7)
With the R1 to R2 ratio determined, values for R1 and R2 should be determined to give the desired set current.
The formula for calculating the set current at T = 25°C is shown below, followed by an example that assumes the
forward voltage drop across the diode (VD) is 0.6V, the voltage across R1 is 67.7mV (64 mV + 5.9% to account
for IBIAS), and R2/R1 = 10 (from the previous calculations).
(8)
This circuit will eliminate most of the LM134's temperature coefficient, and it does a good job even if the
estimates of the diode's characteristics are not accurate (as the following example will show). For lowest tempco
with a specific diode at the desired ISET, however, the circuit should be built and tested over temperature. If the
measured tempco of ISET is positive, R2 should be reduced. If the resulting tempco is negative, R2 should be
increased. The recommended diode for use in this circuit is the 1N457 because its tempco is centered at 11
times the tempco of the LM134, allowing R2 = 10 R1. You can also use this circuit to create a current source with
non-zero tempcos by setting the tempco component of the tempco equation to the desired value instead of 0.
EXAMPLE: A 1mA, Zero-Tempco Current Source
First, solve for R1 and R2:
(9)
The values of R1 and R2 can be changed to standard 1% resistor values (R1 = 133Ω and R2 = 1.33kΩ) with less
than a 0.75% error.
If the forward voltage drop of the diode was 0.65V instead of the estimate of 0.6V (an error of 8%), the actual set
current will be
(10)
an error of less than 5%.
8
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
If the estimate for the tempco of the diode's forward voltage drop was off, the tempco cancellation is still
reasonably effective. Assume the tempco of the diode is 2.6mV/°C instead of 2.5mV/°C (an error of 4%). The
tempco of the circuit is now:
(11)
A 1mA LM134 current source with no temperature compensation would have a set resistor of 68Ω and a
resulting tempco of
(12)
So even if the diode's tempco varies as much as ±4% from its estimated value, the circuit still eliminates 98% of
the LM134's inherent tempco.
Typical Applications
*Select R3 = VREF/583μA. VREF may be any stable positive voltage ≥ 2V
Trim R3 to calibrate
Figure 16. Ground Referred Fahrenheit Thermometer
Figure 17. Terminating Remote Sensor for Voltage Output
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
9
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
*Output impedance of the LM134 at the “R” pin is approximately
where R2 is the equivalent external resistance connected from the V− pin to ground. This negative resistance can be
reduced by a factor of 5 or more by inserting an equivalent resistor R3 = (R2/16) in series with the output.
Figure 18. Low Output Impedance Thermometer
Figure 19. Low Output Impedance Thermometer
*Select R1 and C1 for optimum stability
Figure 20. Higher Output Current
10
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
Figure 21. Basic 2-Terminal Current Source
Figure 22. Micropower Bias
Figure 23. Low Input Voltage Reference Driver
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
11
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
Figure 24. Ramp Generator
*Select ratio of R1 to R2 to obtain zero temperature drift
Figure 25. 1.2V Reference Operates on 10 μA and 2V
*Select ratio of R1 to R2 for zero temperature drift
Figure 26. 1.2V Regulator with 1.8V Minimum Input
12
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
Figure 27. Zener Biasing
*For ±10% adjustment, select RSET10% high, and make R1 ≈ 3 RSET
Figure 28. Alternate Trimming Technique
Figure 29. Buffer for Photoconductive Cell
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
13
LM134, LM234, LM334
SNVS746C – MAY 2004 – REVISED MARCH 2005
www.ti.com
*Select Q1 or Q2 to ensure at least 1V across the LM134. Vp (1 − ISET/IDSS) ≥ 1.2V.
Figure 30. FET Cascoding for Low Capacitance and/or Ultra High Output Impedance
*ZOUT ≈ −16 • R1 (R1/VIN must not exceed ISET)
Figure 31. Generating Negative Output Impedance
14
Submit Documentation Feedback
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
LM134, LM234, LM334
www.ti.com
SNVS746C – MAY 2004 – REVISED MARCH 2005
*Use minimum value required to ensure stability of protected device. This minimizes inrush current to a direct short.
Figure 32. In-Line Current Limiter
Schematic Diagram
Copyright © 2004–2005, Texas Instruments Incorporated
Product Folder Links: LM134 LM234 LM334
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM134H
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-55 to 125
LM134H
LM134H/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 125
LM134H
LM234Z-3/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-25 to 100
LM234
Z-3
LM234Z-6/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-25 to 100
LM234
Z-6
LM334M
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM334
M
LM334M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM334
M
LM334MX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM334
M
LM334MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM334
M
LM334SM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM334
SM
LM334SM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM334
SM
LM334SMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM334
SM
LM334SMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM334
SM
LM334Z/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM334Z/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
(1)
LM334
Z
0 to 70
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
LM334
Z
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM334MX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM334MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM334SMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM334SMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM334MX
SOIC
D
8
2500
349.0
337.0
45.0
LM334MX/NOPB
SOIC
D
8
2500
349.0
337.0
45.0
LM334SMX
SOIC
D
8
2500
349.0
337.0
45.0
LM334SMX/NOPB
SOIC
D
8
2500
349.0
337.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDV0003H
H03H (Rev F)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
National Semiconductor (TI):
LM334Z
Texas Instruments:
LM334M LM334M/NOPB LM334MX LM334MX/NOPB LM334SM LM334SM/NOPB LM334SMX
LM334SMX/NOPB LM334Z/LFT1 LM334Z/LFT7 LM334Z/NOPB LM334Z/T7 LM134H LM134H/NOPB LM234Z-3
LM234Z-3/NOPB LM234Z-6/LFT7 LM234Z-6/NOPB LM234Z-6/T7