Datasheet High Speed Digital Isolator 2500 Vrms 2ch BM67221FV-C General Description Key Specification The BM67221FV-C is a high-speed isolator IC used in electric vehicles and hybrid vehicles. This IC features dielectric strength of 2500 Vrms between I/O. Maximum propagation delay time is 45 ns. Features 1. 2. 3. 4. 5. Supply Voltage Range: Propagation Delay: Stand-by Current: Operating Temperature Range: Package 4.5V to 5.5V 45ns (Max) 0μA (Typ) -40°C to +125°C W(Typ) x D(Typ) x H(Max) Dielectric strength of 2500 Vrms between I/O Maximum propagation delay time of 45 ns Built-in 2ch bi-directional propagation AEC-Q100 Qualified UL1577 Recognized:File No. E356010 Applications Propagation of logic signal within electric and hybrid vehicles SSOP-B20W 6.50mm x 8.10mm x 2.01mm OUT113 TEN2 IN2 Typical Application Circuit IN1 EN2 EN1 VCC1 TEN1 EN1 14 7 4 UVLO UVLO 17 VCC2 8 13 LVG. OUT2 5 * IN1 6 Q S pulse generator R pulse generator pulse generator S pulse generator R EN2 VCC2 TEN2 HVG.SSOP-B20W IN2 16 * Q 15 2 11 9 20 GND1 OUT1 GND2 LVG. HVG. * Please connect bypass capacitor directly to the IC pin. Figure 1. BM67221FV-C Application Example ） ○Products structure: Silicon hybrid integrated circuit ○This product has no designed protection against radioactive rays. http://www.rohm.co.jp TSZ02201-0727ABG00020-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/24 TSZ22111・14・001 25.Dec.2015 Rev.006 BM67221FV-C Pin Configuration N.C. GND1 N.C. VCC1 OUT2 IN1 EN1 TEN1 GND1 N.C. GND2 N.C. N.C. VCC2 IN2 OUT1 EN2 TEN2 N.C. GND2 Figure 2. BM67221FV-C Package (SSOP-B20W) Pin Description No. Pin Name 1 NC 2 GND1 No. Pin Name No Connection Function 20 GND2 Function Ground 1 19 NC No Connection Ground 2 3 NC No Connection 18 NC No Connection 4 VCC1 Power supply 1 17 VCC2 Power supply 2 5 OUT2 Output 2 16 IN2 6 IN1 Input 1 15 OUT１ 7 EN1 Enable input 1 14 EN2 8 TEN1 Test mode input 1 13 TEN2 9 GND1 Ground 1 12 NC 10 NC No Connection 11 GND2 http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/24 Input 2 Output 1 Enable input 2 Test mode input 2 No Connection Ground 2 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Description of Operation 1. Input/Output logic The input/output logic levels for the BM67221FV-C are as shown in the table below. No. 1 2 3 4 5 6 7 8 9 10 11 12 13 EN1 L EN2 L L H H L H H IN1 X L L H H L L H H L L H H IN2 X L H L H L H L H L H L H OUT1 OUT2 L L L L L L * L * L L L L * L L L * L L L H H L H H * Retains its previous state In case EN1 and EN2 pins are "L" as in no. 1, the logic of OUT1 pin and OUT2 pin becomes "L". The logic of OUT2 pin becomes "L" in case EN1 pin is "L" and EN2 pin is "H" as in no. 2 ~ 5. The output logic of OUT1 pin retains its previous state when IN1 pin is “H”. The logic of OUT1 pin becomes "L" in case EN2 pin is "L" and EN1 pin is "H" as in no. 6 ~ 9. The output logic of OUT1 (OUT2) changes according to the input logic of IN1 (IN2) in case EN1 and EN2 pins are in "H" as in no. 10 ~ 13. Likewise, since pull up/pull down resistor has not been connected to IN1, IN2, EN1 and EN2 pins, it is necessary to connect external resistor in case you would like to fix the input logic of IN1, IN2, EN1 and EN2 pins. 2. TEN pins The TEN pins serve as a test enable pin, respectively. Please connect to GND to avoid the possibility of chip malfunction. 3. Output pin voltage Logic levels for output pins are indicated in the truth table in Sections 1, 6, and 7. However, it may be assumed that such logic levels disable the output circuit to fully turn ON at a low voltage when turning ON or OFF the power supply, thus putting the output pin into the high impedance state. 4. Under Voltage Lock Out (UVLO) function This IC has a built-in UVLO function to prevent the IC from malfunctioning whenever the power supply voltage drops. It triggers the UVLO state when VCC1 pin and VCC2 pin are changed to 3.8V (Typ) or less and becomes in operational state when changed to 4.0V (Typ) or more. (1) VCC1 pin voltage drops at 4V (Typ) or more for VCC2 and in case VCC2 was changed to 3.8V (Typ) or below, the output logic of OUT2 pin becomes "L" and output logic of OUT1 pin changes to hold state. (2) VCC2 pin voltage drops at 4V Typ. or more for VCC1 and in case it changed to 3.8V (Typ), the output logic of OUT1 pin becomes "L" and the output logic of OUT2 pin changes to hold state. (3) In case VCC2 pin voltage was changed from 3.8V (Typ) or less to 4.0V (Typ) or more in 4.0V (Typ) or more for VCC1 pin voltage, the output logic of OUT2 pin changes according to the input logic of input IN2 pin. The output logic of OUT1 pin becomes "L". (4) In case the VCC1 pin voltage was changed from 3.8V (Typ) or less to 4.0V (Typ) or more at 4.0V (Typ) or more for VCC2 pin voltage, the output logic of OUT1 pin changes according to the input logic of IN1 pin. 5. Under Voltage Lock Out (UVLO) function masking time This IC provides masking time for the UVLO function. The masking time is set to 10 µsec (Typ). http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C 6. Input/Output logic levels with power supply turned OFF The following table shows the output logic levels according to the order in which the power supply turns OFF. Power Supply No. 1 2 3 4 5 6 7 8 IN1 IN2 OUT1 OUT2 L L H H L L H H L H L H L H L H L L H H L L L L L L L L L H L H VCC1 VCC2 In case VCC1 is turned OFF as in No. 1 ~ 4, the output logic of OUT2 pin becomes "L" and the output logic of OUT1 pin is retained. In case VCC2 is turned OFF as in no. 5 ~ 8, the output logic of OUT1 pin becomes "L" and the logic output of OUT2 is retained. 7. Output logic levels with power supply turned ON The following table shows the output logic levels according to the order in which the power supply turns ON. No. 1 2 3 4 5 6 7 8 Turning-ON Order1 Turning-ON Order2 VCC1 VCC2 VCC2 VCC1 IN1 IN2 L L H H L L H H L H L H L H L H OUT1 OUT2 L L L H L* L L* H L L L L* H L H L* *Different input and output logic In case VCC1 is turned ON first as in no. 1 ~ 4, a signal from VCC1 side to the circuit of VCC2 side cannot be received because of the cancellation by the signal before the circuit of VCC2 side starts-up. For that reason, the output logic of OUT1 pin becomes "L" and the output logic does not match with the input logic as in no. 3, 4*. In case VCC2 is turned ON first as in no. 5 ~ 8, the signal from VCC2 side to the circuit of VCC1 side cannot be received because of the cancellation by the signal before the circuit of VCC1 side starts-up. For that reason, the output logic of OUT2 pin becomes "L" and the output logic does not match with the input logic as in no. 6 and 8*. http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Timing Chart UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 OUT1 OUT2 Figure 3. VCC1 to VCC2 (IN1=L, IN2=L) UVLO OFF U VLO ON VCC1 UVLO OFF U VLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 Mask time (typ.10 µs) OUT1 OUT2 Mask time (typ.10 µs) Mask time (typ.10 µs) Mask time (typ.10 µs) Figure 4. VCC1 to VCC2 (N1=H, IN2=H) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Timing Chart - continued UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 Mask time (typ.10 µs) OUT1 Mask time (typ.10 µs) Mask time (typ.10 µs) Mask time (typ.10 µs) OUT2 Figure 5. VCC1 to VCC2 (IN1=L to H, IN2=L to H) UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 OUT1 OUT2 Mask time (typ.10 µs) Figure 6. VCC1 to VCC2 (IN1=H to L, IN2=H to L) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Timing Chart - continued UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 OUT1 OUT2 Figure 7. VCC2 to VCC1 (IN1=L, IN2=L) UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 OUT1 Mask time (typ.10 µs) Mask time (typ.10 µs) Mask time (typ.10 µs) OUT2 Mask time (typ.10 µs) Figure 8. VCC2→ VCC1（IN1=H, IN2=H） http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Timing Chart - continued UVLO OFF U VLO ON VCC1 UVLO OFF U VLO ON VCC2 Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 Mask time (typ.10 µs) OUT1 Mask time (typ.10 µs) OUT2 Mask time (typ.10 µs) Mask time (typ.10 µs) Figure 9. VCC2 to VCC1(IN1=L to H, IN2=L to H) UVLO OFF UVLO ON VCC1 UVLO OFF UVLO ON Input inhibition area（max.500µs） EN1 Input inhibition area（max.500µs） EN2 IN1 IN2 OUT1 Mask time ( typ.10 µs ) OUT2 Figure 10. VCC2 to VCC1 (IN1=H to L, IN2=H to L) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Absolute Maximum Ratings Parameter Rating Symbol Unit BM67221FV-C VCC1 7.0(Note 1) V Power Supply Voltage 2 VCC2 7.0(Note 2) V IN1 Pin Voltage VIN1 -0.3 to +7.0(Note 1) V VIN2 +7.0(Note 2) V VOUT1 -0.3 to +7.0(Note 2) V VOUT2 +7.0(Note 1) V Power Supply Voltage 1 IN2 Pin Voltage OUT1 Pin Voltage OUT2 Pin Voltage -0.3 to -0.3 to IOMAX(OUT) ±10(Note 3) GND1-GND2 Ground Potential VGND 2500 Vrms Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Pd 1.19(Note 4) W Tjmax 150 °C Output Current Power Dissipation Maximum Junction Temperature mA (Note 1) Reference to GND1. (Note 2) Reference to GND2. (Note 3) Should not exceed Pd and ASO. (Note 4) Derate by 9.52mW/°C when operating above Ta=25°C, when mounted on a glass epoxy board measuring 70 mm 70 mm 1.6 mm (including a copper foil area of 3% or less). Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings Recommended Operating Conditions Parameter Power Supply Voltage 1 Power Supply Voltage 2 Symbol BM67221FV-C Unit VCC1 4.5 to 5.5(Note 5) V VCC2 5.5(Note 6) V 4.5 to (Note 5) Relative to GND1 (Note 6) Relative to GND2 Insulation Related Characteristics Parameter Symbol Characteristic Unit Insulation Resistance(VIO=500V) RS >109 Ω Insulation Withstand Voltage/1Min VISO 2500 Vrms Insulation Test Voltage/1s VISO 3000 Vrms UL1577 Ratings Table Following values are described in UL Report. Parameter Values Units Side 1 Circuit Current 0.21 mA VCC1=5V Side 2 Circuit Current 0.21 mA VCC2=5V Side 1 Consumption Power 1.05 mW VCC1=5V Side 2 Consumption Power 1.05 mW VCC2=5V Isolation Voltage 2500 Vrms Maximum Operating (Ambient) Temperature 125 ℃ Maximum Junction Temperature 150 ℃ Maximum Strage Temperature 150 ℃ Maximum Data Transmission Rate 20 MHz http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/24 Conditions TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Electrical Characteristics (All values at Ta-40C to125C and VCC4.5V to 5.5V, unless otherwise specified) Parameter Symbol Limit Min Typ Max Unit Conditions <Whole> VCC1 Power Supply Current, Quiescent ICC1STBY - 0 10 µA EN1 = 0 VCC2 Power Supply Current, Quiescent ICC2STBY - 0 10 µA EN2 = 0 ICC1Q - 0.21 0.42 mA VIN = 0 or VCC VCC2 Power Supply Current, DC ICC2Q - 0.21 0.42 mA VIN = 0 or VCC VCC1 Power Supply Current, 10kbps ICC10k1 - 0.22 0.44 mA fIN : 5kHz VCC2 Power Supply Current, 10kbps ICC10k2 - 0.22 0.44 mA fIN : 5kHz VCC1 Power Supply Current, 1Mbps ICC1M1 - 0.86 2.00 mA fIN : 500kHz VCC2 Power Supply Current, 1Mbps ICC1M2 - 0.86 2.00 mA fIN : 500kHz tIN - - 500(Note 7) µs High-level Output Voltage VOH VCC-0.5 VCC-0.3 VCC V IO=-4mA Low-level Output Voltage VOL 0 0.2 0.4 V IO=4mA VCC1 Power Supply Current, DC IN1,IN2 Input Inhibition Area <Output pin: OUT1 and OUT2> (Note 7) Please do not switch the input signal IN1 and IN2 between tIN sections. Output may not match the logic input. VCC1 VCC2 tININ T EN1 EN2 Figure 11. http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 IN1, IN2 Input Inhibition Area 10/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Electrical Characteristics – continued (All values at Ta-40C to 125C and VCC4.5Vto5.5V, unless otherwise specified) Parameter Limit Symbol Unit Min Typ Max IIN - 0 10 µA High-level Input Threshold VINH VCC×0.7 - VCC V Low-level Input Threshold VINL 0 - VCC×0.3 V IEN - 0 10 µA High-level Input Threshold VENH VCC×0.7 - VCC V Low-level Input Threshold VENL 0 - VCC×0.3 V Conditions <Input pin: IN1 and IN2> Input Current VIN=VCC <Enable pin: EN1 and EN2> Input Current VEN=VCC <Test pin: T_EN1 and T_EN2> Input Current ITEN 30 50 70 µA High-level Input Threshold VTENH VCC×0.7 - VCC V Low-level Input Threshold VTENL 0 - VCC×0.3 V tPLH 10 20 45 ns VT_EN=VCC <Switching Characteristics> Propagation Delay (Low to High) Propagation Delay (High to Low) tPHL 10 20 45 ns |tPLH - tPHL| - 0 8 ns Rise Time tr - 2.5 - ns Fall Time tf - 2.5 - ns CML - 35 - kV/µs Propagation Distortion Common-Mode Transient Immunity design assurance Input/Output Timing IN1, IN2 50% 50% tPHL TPHL tTPLH PHL 90% OUT1, OUT2 50% 90% 50% 10% 10% tftf ttrr Figure 12. Input/Output Timing Chart http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C 0.5 0.5 0.4 0.4 Circuit Current: ICC [mA] Circuit Current : Icc [mA] Circuit Current: ICC [mA] Circuit Current : Icc [mA] Typical Performance Curve 125°C 0.3 25°C 0.2 -40°C 0.1 0.0 125°C 0.3 25°C 0.2 -40°C 0.1 0.0 4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.50 Voltage::VVcc CC [V] Supply Voltage [V] SupplyVoltage Voltage:: V [V] CC [V] Supply Vcc Figure 13. Circuit Current vs Supply Voltage (VCC1 Power Supply Current) Figure 14. Circuit Current vs Supply Voltage (VCC2 Power Supply Current, DC) 10 6.0 5.5 5.0 8 125°C -40°C 25°C Output Voltage: VO [V] Output Voltage : [V] 4.5 Input Current: IIN [µA] Input Current : [µA] 5.25 6 4 125°C 25°C -40°C 2 0 125°C 25°C -40°C 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -2 -0.5 0 1 2 3 4 5 0 Input Voltage : VIN [V] 2 3 4 5 Input Voltage : VIN [V] Figure 15. Input Current vs Input Voltage (Input Current at Input Pin) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 Figure 16. Output Voltage vs Input Voltage (High-/Low-level Input Threshold, VCC1, VCC2＝4.5V) 12/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Typical Performance Curve - continued 6.0 6.0 5.5 5.0 125°C 25°C -40°C 5.0 4.0 Output Voltage: VOH [V] Output Voltage : [V] 125°C 25°C -40°C 4.5 Output Voltage : [V] Output Voltage: VOH [V] 125°C 25°C -40°C 5.5 125°C 25°C -40°C 3.5 3.0 2.5 2.0 1.5 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 1.0 0.5 0.5 0.0 0.0 -0.5 -0.5 0 1 2 3 4 0 5 1 Input Voltage : VIN[V] 5.0 4.3 4.8 Output Voltage: VOH [V] Output Voltage : VOH [V] Output Voltage: VOH [V] Output Voltage : VOH [V] 4 5 Figure 18. Output Voltage vs Input voltage (High-/Low-level Input Threshold, VCC1, VCC2＝5.5V) 4.5 -40°C 4.1 25°C 125°C 3.7 3 Input Voltage : VIN [V] Figure 17. Output Voltage vs Input Voltage (High-/Low-level Input Threshold, VCC1, VCC2＝5.0V) 3.9 2 3.5 -40°C 4.6 25°C 4.4 125°C 4.2 4.0 0 2 4 6 8 10 0 2 4 6 8 Output Current : lO [mA] Output Current : lO [mA] Figure 19. Output Voltage vs Output Current (High-level Output Voltage,VCC1,VCC2＝4.5V) Figure 20. output Voltage vs Output Current (High-level Output Voltage,VCC1,VCC2＝5.0V) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/24 10 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Typical Performance Curve - continued 5.5 1.0 0.8 Output Voltage: VOL [V] OL [V] Output Voltage : V Output Voltage: VOH [V] OH [V] Output Voltage : V 5.3 -40°C 5.1 25°C 4.9 125°C 4.7 125°C 0.6 25°C 0.4 -40°C 0.2 4.5 0.0 0 2 4 6 8 10 0 2 Output Current : l O [mA] 1.0 0.8 0.8 Output Voltage: VOL [V] OL [V] Output Voltage : V Output Voltage: VOL [V] OL [V] Output Voltage : V 8 10 Figure 22. Output Voltage vs Output Current (Low-level Output Voltage VCC1, VCC2＝4.5V) 1.0 125°C 0.6 25°C -40°C 0.2 6 Output Current : l O [mA] Figure 21. Output Voltage vs Output Current (High-level Output Voltage, VCC1,VCC2＝5.5V) 0.4 4 125°C 0.6 25°C 0.4 -40°C 0.2 0.0 0.0 0 2 4 6 8 0 10 2 4 6 8 10 OutputCurrent: Current :IOl O[mA] [mA] Output Output Current : l O [mA] Figure 23. Output Voltage vs Output Current (Low-level Output Voltage, VCC1, VCC2＝5.0V) Figure 24. Output Voltage vs Output Current (Low-level Output Voltage, VCC1, VCC2＝5.5V) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C 26 26 25 25 24 24 Propagation Delay : [ns] Propagation Delay : [ns] Typical Performance Curve - continued 23 tPHL 22 21 20 tPLH 19 23 22 tPHL 21 20 19 tPLH 18 18 17 17 16 16 -50 -25 0 -50 25 50 75 100 125 150 Temperature: Temperature[°C] : [℃] -25 0 25 50 75 100 125 150 Temperature Temperature:: [℃] [°C] Figure 25. Propagation Delay vs Temperature (VCC1, VCC2 = 4.5V) Figure 26. Propagation Delay vs Temperature (VCC1, VCC2 = 5.0V) 26 2.0 25 Circuit Current : Icc[mA] Propagation Delay : [ns] 24 23 22 tPHL 21 20 19 tPLH 18 1.5 1.0 125°C 0.5 25°C 17 -40°C 0.0 16 -50 -25 0 25 50 75 0.0 100 125 150 Temperature: :[°C] Temperature [℃] 0.4 0.6 0.8 1.0 Input Frequency : [Mbps] Figure 27. Propagation Delay vs Temperature (VCC1, VCC2 = 5.5V) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.2 Figure 28. Circuit Current vs Input Frequency (VCC1 Power Supply Current, VCC1, VCC2 = 4.5V) 15/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Typical Performance Curve – continued 2.0 Circuit Current: ICC [mA] Circuit Current :Icc[mA] Circuit Current: ICC [mA] Circuit Current :Icc[mA] 2.0 1.5 1.0 125°C 0.5 1.5 1.0 125°C 0.5 25°C 25°C -40°C 0.0 0.0 -40°C 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 Input Frequency : [Mbps] 1.5 1.5 Circuit Current: ICC [mA] Circuit Current : Icc[mA] Circuit Current: ICC [mA] Circuit Current : Icc[mA] 2.0 1.0 125°C 0.5 1.0 1.0 125°C 0.5 25°C 25°C -40°C -40°C 0.0 0.2 0.8 Figure 30. Circuit Current vs Input Frequency (VCC1 Power Supply Current VCC1, VCC2 = 5.5V) 2.0 0.0 0.6 Input Frequency :[Mbps] Figure 29. Circuit Current vs Input Frequency (VCC1 Power Supply Current , VCC1, VCC2 = 5.0V) 0.0 0.4 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 Input Frequency : [Mbps] Input Frequency : [Mbps] Figure 31. Circuit Current vs Input Frequency (VCC2 Power Supply Current, VCC1, VCC2 = 4.5V) Figure 32. Circuit Current vs Input Frequency (VCC2 Power Supply Current, VCC1, VCC2 = 5.0V) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Typical Performance Curve - continued Circuit Current: ICC [mA] Circuit Current Icc[mA] 2.0 1.5 1.0 125°C 0.5 25°C -40°C 0.0 0.0 0.2 0.4 0.6 0.8 1.0 Input Frequency : [Mbps] Figure 33. Circuit Current vs Input Frequency (VCC2 Power Supply Current, VCC1, VCC2 =5.5V) http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C I/O Equivalent Circuit VCC1 VCC2 VCC2 VCC1 OUT1 OUT2 IN1 IN2 GND Figure 34. IN1, IN2 Figure 35. OUT1, OUT2 VCC1 VCC2 VCC1 VCC2 TEN1 TEN2 EN1 EN2 100k Figure 36. TEN1, TEN2 http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 37. EN1, EN2 18/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Power Dissipation Reduction Characteristics Measuring equipment: TH156 (Kuwano Electric) Measuring condition: Mounted on the ROHM’s board Board size: 70 70 1.6 mm3 Power Pdd[W] [W] PowerDissipation: Dissipation:P 1.5 Single-layer board: ja 105.3C/W 1.19W 1.0 0.5 0 0 25 50 75 100 125 150 Ambient a[℃] Ambient Temperature:T Temperature: [°C] Figure 38. SSOP-B20W Power Dissipation Reduction Curve Thermal Dissipation In consideration of the power consumption (P), package power dissipation (Pd), and ambient temperature (Tj) of this IC, ensure that the operating temperature of the chip will not exceed 150C. If Tj is beyond 150C, parasitic elements may malfunction and may cause leakage current to increase. Constantly using the IC under the said conditions may deteriorate the IC and further lead to its breakdown. Strictly keep Tjmax at 150C under any circumstances. http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Appendix: Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Ordering Information B M 6 7 2 2 1 F V Package FV : SSOP-B20W Part Number - CE 2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B20W TOP VIEW Product Name. BM67221 LOT No. 1PIN MARK http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Physical Dimension, Tape and Reel Information Package Name http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP-B20W 23/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 BM67221FV-C Revision History Date Revision 25.Jun.2012 28.Aug.2012 001 002 26.Oct.2012 003 20.Dec.2012 004 05.Mar.2014 005 25.Dec.2015 006 Changes New Release Fix typo about Figure 7. VCC2→ VCC1(IN1=L,IN2=L) P.3 Add a description about 4) Under voltage lock out. P.10 Fix typo about Electrical Characteristics about IN1, IN2 Input inhibition area. P.5~P.8 Fix typo about input inhibition about area. P.11 Add minimum propagation delay. P.21 Delete description. P.1 Add a description 4) AEC-Q100 Qualified at Features Applied new style and improved understandability. P.1 Add a description 5) UL1577 Recognized at Features P.9 Add UL1577 Ratings Table http://www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/24 TSZ02201-0727ABG00020-1-2 25.Dec.2015 Rev.006 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BM67221FV-C - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BM67221FV-C SSOP-B20W 2000 2000 Taping inquiry Yes