LITEON LTST-N683GBEW Smd led Datasheet

SMD LED
Product Data Sheet
LTST-N683GBEW
Spec No.: DS35-2015-0131
Effective Date: 07/06/2016
Revision: A
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
LTST-N683GBEW
1. Description
SMD LEDs from Lite-On are available in miniature sizes and special configurations for automated PC board assembly and
space-sensitive applications. These SMD LEDs are suitable for use in a wide variety of electronic equipment, including cordless
and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications.
1.1 Features







1.2 Applications
Meet ROHS
Package in 8mm tape on 7" diameter reels
EIA STD package
I.C. compatible
Compatible with automatic placement equipment
Compatible with infrared reflow solder process
Preconditioning: accelerate to JEDEC level 3



Telecommunication, Office automation, home appliances,
industrial equipment
Signage
Indoor display
2. Package Dimensions
Part No.
Lens Color
LTST-N683GBEW
Diffused Lens
Source Color
Pin Assignment
InGaN Green
4
InGaN Blue
3
AlInGaP Red
2
Notes:
1.
2.
All dimensions are in millimeters.
Tolerance is ±0.2 mm (.008") unless otherwise noted.
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SMD LED
LTST-N683GBEW
3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
LTST-N683GBEW
Parameter
Unit
Blue
Green
Red
80
80
72
mW
100
100
80
mA
20
20
30
mA
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Operating Temperature Range
-40°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
3.2 Suggest IR Reflow Condition for Pb Free Process:
IR-Reflow Soldering Profile for lead free soldering (Acc. to J-STD-020B)
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SMD LED
LTST-N683GBEW
3.3 Electrical / Optical Characteristics at Ta=25°C
LTST-N683GBEW
Parameter
Symbol
Luminous Intensity
Viewing Angle
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
IV
Blue
Green
Red
MIN.
180
710
355
TYP.
-
-
-
MAX.
355
1400
710
21/2
TYP.
P
TYP.
d

VF
IR
Test
Condition
mcd
IF = 20mA
Note 1
120
Note 2 (Fig.6)
468
518
632
465
520
617
-
-
-
475
530
630
TYP.
25
35
20
MIN.
2.8
2.8
1.8
TYP.
-
-
-
MAX.
3.8
3.8
2.6
MAX.
10
10
10
TYP.
Unit
nm
Measurement
@Peak (Fig.1)
nm
IF = 20mA
Note 3
nm
V
IF = 20mA
Note 4
μA
VR = 5V
Note 5
Notes:
1.
Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve
2.
θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3.
The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device
4.
Forward Voltage Tolerance is +/- 0.1 volt.
5.
Reverse voltage (VR) condition is applied to IR test only. The device is not designed for reverse operation.
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SMD LED
LTST-N683GBEW
4. Bin Rank
 IV Rank
Luminous Intensity
Color : Blue , Unit : mcd @ 20mA
Bin Code
Min.
Max.
S1
180.0
224.0
S2
224.0
280.0
T1
280.0
355.0
Tolerance on each Intensity bin is +/-11%
Luminous Intensity
Color : Green , Unit : mcd @ 20mA
Bin Code
Min.
Max.
V1
710.0
900.0
V2
900.0
1120.0
W1
1120.0
1400.0
Tolerance on each Intensity bin is +/-11%
Luminous Intensity
Color : Red , Unit : mcd @ 20mA
Bin Code
Min.
Max.
T2
355.0
450.0
U1
450.0
560.0
U2
560.0
710.0
Tolerance on each Intensity bin is +/-11%
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SMD LED
LTST-N683GBEW
 Wd Rank
Dominant Wavelength
Color : Blue , Unit : nm @ 20mA
Bin Code
Min.
Max.
AC1
465.0
467.5
AC2
467.5
470.0
AD1
470.0
472.5
AD2
472.5
475.0
Tolerance for each Dominate Wavelength bin is +/- 1nm
Dominant Wavelength
Color : Green , Unit : nm @ 20mA
Bin Code
Min.
Max.
AP1
520.0
522.5
AP2
522.5
525.0
AQ1
525.0
527.5
AQ2
527.5
530.0
Tolerance for each Dominate Wavelength bin is +/- 1nm
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SMD LED
LTST-N683GBEW
4.2 Bin Code on Tag Cross Table
Luminous Intensity
Blue
Bin Code
On Tag
Unit : mcd @ 20mA
Code
Green
Range
Code
Red
Range
Code
Range
T2
355-450
U1
450-560
A3
U2
560-710
A4
T2
355-450
U1
450-560
A6
U2
560-710
A7
T2
355-450
U1
450-560
A9
U2
560-710
B1
T2
355-450
U1
450-560
B3
U2
560-710
B4
T2
355-450
U1
450-560
B6
U2
560-710
B7
T2
355-450
U1
450-560
U2
560-710
A1
A2
A5
V1
S1
180-224
A8
W1
B2
B5
B8
V2
V1
S2
224-280
V2
W1
710-900
900-1120
1120-1400
710-900
900-1120
1120-1400
B9
Tolerance on each Intensity bin is +/-11%
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SMD LED
LTST-N683GBEW
Luminous Intensity
Blue
Bin Code
On Tag
Unit : mcd @ 20mA
Code
Green
Range
Code
Red
Range
Code
Range
T2
355-450
U1
450-560
C3
U2
560-710
C4
T2
355-450
U1
450-560
C6
U2
560-710
C7
T2
355-450
U1
450-560
U2
560-710
C1
C2
C5
C8
V1
T1
280-355
V2
W1
710-900
900-1120
1120-1400
C9
Tolerance on each Intensity bin is +/-11%
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Part No. : LTST-N683GBEW
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SMD LED
LTST-N683GBEW
Dominant Wavelength
Unit : nm @20mA
Blue
Bin Code
Green
on Tag
Code
Range
D1
AC1
465.0-467.5
D2
AC2
467.5-470.0
D3
AD1
470.0-472.5
D4
AD2
472.5-475.0
D5
AC1
465.0-467.5
D6
AC2
467.5-470.0
D7
AD1
470.0-472.5
D8
AD2
472.5-475.0
D9
AC1
465.0-467.5
D10
AC2
467.5-470.0
D11
AD1
470.0-472.5
D12
AD2
472.5-475.0
D13
AC1
465.0-467.5
D14
AC2
467.5-470.0
D15
AD1
470.0-472.5
D16
AD2
472.5-475.0
Red
Code
Range
AP1
520.0-522.5
AP2
522.5-525.0
AQ1
525.0-527.5
AQ2
527.5-530.0
Code
Range
-
617-630
Tolerance for each Dominate Wavelength Bin is +/- 1nm
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Part No. : LTST-N683GBEW
BNS-OD-FC002/A4
SMD LED
LTST-N683GBEW
5. Typical Electrical / Optical Characteristics Curves.
(25°C Ambient Temperature Unless Otherwise Noted)
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SMD LED
LTST-N683GBEW
6. User Guide
6.1 Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the
LED in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute.
6.2 Recommend Printed Circuit Board Attachment Pad
6.3 Package Dimensions of Tape and Reel
Note:
1. All dimensions are in millimeters (inches).
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SMD LED
LTST-N683GBEW
6.4 Package Dimensions of Reel
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel 2000 pieces per reel.
3. Minimum packing quantity is 500 pieces for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481 specifications.
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SMD LED
LTST-N683GBEW
7. Cautions
7.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications
in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize
life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety
devices).
7.2 Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while
the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within 168hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container
with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than 168hrs should be baked at about 60 °C for at least 48 hours
before solder assembly.
7.3 Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
7.4 Soldering
Recommended soldering conditions:
Reflow soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Soldering iron
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Notes:
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit
boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing.Profiles used at LITE-ON are based on
JEDEC standards to ensure that all packages can be successfully and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a
generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and
recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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SMD LED
LTST-N683GBEW
7.5 Drive Method
A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED
as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
7.6 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:




Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a
result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or
“ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.
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SMD LED
LTST-N683GBEW
8. Reliability Test
No.
Test item
1
Resistance to soldering heat
2
Solderability
Test condition
Reference standard
Tsld = 260°C, 10sec.
3 times
JEITA ED-4701 300 301
Tsld=245± 5°C
(Lead Free Solder, Coverage ≧ 95% of the
JEITA ED-4701 300 303
dipped surface)
3
Thermal Shock
85 ± 5°C ~ -30°C ± 5°C
30min
30min
100cycles
JEITA ED-4701 300 307
4
Temperature Cycle
-55°C ~ 25°C ~ 100°C ~ 25°C
30min
5min 30min 5min
100cycles
JEITA ED-4701 100 105
5
High Temperature Storage
100°C
1000hrs
JEITA ED-4701 200 201
6
Low Temperature Storage
-55°C
1000hrs
JEITA ED-4701 200 202
7
Temperature Humidity Storage
60°C/90%RH 300hrs
8
Room temp life test
25°C, IF: Max current , 1000hrs
JEITA ED-4701 100 103
--
9. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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SMD LED
LTST-N683GBEW
10. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with
conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for InGaN LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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BNS-OD-FC002/A4
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