GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP and 165-bump BGA packages Functional Description with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode pin low places the RAM in Flow Through mode, causing output data to bypass the Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the rising-edge-triggered Data Output Register. DCD Pipelined Reads The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) is a DCD (Dual Cycle Deselect) pipelined synchronous SRAM. SCD (Single Cycle Deselect) versions are also available. DCD SRAMs pipeline disable commands to the same degree as read commands. DCD RAMs hold the deselect command for one full cycle and then begin turning off their outputs just after the second rising edge of clock. Byte Write and Global Write Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Write control inputs. Applications The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) is a 18,874,368-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support. Sleep Mode Low power (Sleep mode) is attained through the assertion (High) of the ZZ signal, or by stopping the clock (CK). Memory data is retained during Sleep mode. Controls Addresses, data I/Os, chip enable (E1), address burst control inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positive-edge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or interleave order Core and Interface Voltages The GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V compatible. Separate output power (VDDQ) pins are used to decouple output noise from the internal circuits and are 3.3 V and 2.5 V compatible. Parameter Synopsis Rev: 2.13 11/2004 -250 -225 -200 -166 -150 -133 Unit Pipeline 3-1-1-1 tKQ tCycle 2.5 4.0 2.7 4.4 3.0 5.0 3.4 6.0 3.8 6.7 4.0 7.5 ns ns 3.3 V Curr (x18) Curr (x36) 280 330 255 300 230 270 200 230 185 215 165 190 mA mA 2.5 V Curr (x18) Curr (x36) 275 320 250 295 230 265 195 225 180 210 165 185 mA mA Flow Through 2-1-1-1 tKQ tCycle 5.5 5.5 6.0 6.0 6.5 6.5 7.0 7.0 7.5 7.5 8.5 8.5 ns ns 3.3 V Curr (x18) Curr (x36) 175 200 165 190 160 180 150 170 145 165 135 150 mA mA 2.5 V Curr (x18) Curr (x36) 175 200 165 190 160 180 150 170 145 165 135 150 mA mA 1/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) A A E1 A NC NC BB BA A VDD VSS CK GW BW G ADSC ADSP ADV A A GS8161E18 100-Pin TQFP Pinout (Package T) VDDQ LBO A A A A VSS NC NC DQB DQB VSS VDDQ DQB DQB FT VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 1M X 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Rev: 2.13 11/2004 A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC A1 A0 TMS TDI VSS VDD TDO TCK A A A A A A A NC NC NC 2/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) A A E1 A BD BC BB BA A VDD VSS CK GW BW G ADSC ADSP ADV A A GS8161E36 100-Pin TQFP Pinout (Package T) LBO A A A A A1 A0 TMS TDI VSS VDD VSS DQC DQC DQC DQC VSS VDDQ DQC DQC FT VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD DQPD 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 512K x 36 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Rev: 2.13 11/2004 DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA TDO TCK A A A A A A A DQPC DQC DQC VDDQ 3/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) TQFP Pin Description Symbol Type Description A 0, A 1 I Address field LSBs and Address Counter preset Inputs A I Address Input DQA DQB DQC DQD I/O Data Input and Output pins NC — No Connect BW I Byte Write—Writes all enabled bytes; active low BA, BB, BC, BD I Byte Write Enable for DQA, DQB Data I/Os; active low CK I Clock Input Signal; active high GW I Global Write Enable—Writes all bytes; active low E1 I Chip Enable; active low G I Output Enable; active low ADV I Burst address counter advance enable; active low ADSP, ADSC I Address Strobe (Processor, Cache Controller); active low ZZ I Sleep Mode control; active high TMS I Scan Test Mode Select TDI I Scan Test Data In TDO O Scan Test Data Out TCK I Scan Test Clock FT I Flow Through or Pipeline mode; active low LBO I Linear Burst Order mode; active low VDD I Core power supply VSS I I/O and Core Ground VDDQ I Output driver power supply Rev: 2.13 11/2004 4/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 165 Bump BGA—x18 Commom I/O—Top View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BB NC E3 BW ADSC ADV A A18 A B NC A E2 NC BA CK GW G ADSP A NC B C NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPA C D NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA D E NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA E F NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA F G NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA G H FT MCL NC VDD VSS VSS VSS VDD NC NC ZZ H J DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC J K DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC K L DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC L M DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC M N DQPB NC VDDQ VSS NC NC NC VSS VDDQ NC NC N P NC NC A A TDI A1 TDO A A A A17 P R LBO NC A A TMS A0 TCK A A A A R 11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch Rev: 2.13 11/2004 5/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 165 Bump BGA—x32 Common I/O—Top View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BC BB E3 BW ADSC ADV A NC A B NC A E2 BD BA CK GW G ADSP A NC B C NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC NC C D DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB D E DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB E F DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB F G DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB G H FT MCL NC VDD VSS VSS VSS VDD NC ZQ ZZ H J DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA J K DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA K L DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA L M DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA M N NC NC VDDQ VSS NC NC NC VSS VDDQ NC NC N P NC NC A A TDI A1 TDO A A A A17 P R LBO NC A A TMS A0 TCK A A A A R 11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch Rev: 2.13 11/2004 6/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 165 Bump BGA—x36 Common I/O—Top View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BC BB E3 BW ADSC ADV A NC A B NC A E2 BD BA CK GW G ADSP A NC B C DQPC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPB C D DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB D E DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB E F DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB F G DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB G H FT MCL NC VDD VSS VSS VSS VDD NC NC ZZ H J DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA J K DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA K L DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA L M DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA M N DQPD NC VDDQ VSS NC NC NC VSS VDDQ NC DQPA N P NC NC A A TDI A1 TDO A A A A17 P R LBO NC A A TMS A0 TCK A A A A R 11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch Rev: 2.13 11/2004 7/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) GS8161E18/32/36D 165-Bump BGA Pin Description Symbol Type Description A 0, A 1 I Address field LSBs and Address Counter Preset Inputs An I Address Inputs DQA DQB DQC DQD I/O Data Input and Output pins BA , BB , BC , BD I Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low NC — No Connect CK I Clock Input Signal; active high BW I Byte Write—Writes all enabled bytes; active low GW I Global Write Enable—Writes all bytes; active low E1 I Chip Enable; active low E3 I Chip Enable; active low E2 I Chip Enable; active high G I Output Enable; active low ADV I Burst address counter advance enable; active l0w ADSC, ADSP I Address Strobe (Processor, Cache Controller); active low ZZ I Sleep mode control; active high FT I Flow Through or Pipeline mode; active low LBO I Linear Burst Order mode; active low TMS I Scan Test Mode Select TDI I Scan Test Data In TDO O Scan Test Data Out TCK I Scan Test Clock MCL — Must Connect Low VDD I Core power supply VSS I I/O and Core Ground VDDQ I Output driver power supply Rev: 2.13 11/2004 8/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) GS8161E18(T/D)/GS8161E32(D)/GS8161E36(T/D) Block Diagram A0–An Register D Q A0 A0 D0 A1 Q0 A1 D1 Q1 Counter Load A LBO ADV Memory Array CK ADSC ADSP Q D Register GW BW BA D Q 36 36 Register D Q BB 4 4 Register D Q Q Register D D Q D Q Register Register D Q Register BC BD Register D 36 Q 36 36 Register E1 D Q 4 32 36 Parity Encode Register D Q 4 Parity Compare FT G ZZ 36 Power Down 0 DQx1–DQx9 NC NC Control Note: Only x36 version shown for simplicity. Rev: 2.13 11/2004 9/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Mode Pin Functions Mode Name Pin Name Burst Order Control LBO Output Register Control FT Power Down Control ZZ Single/Dual Cycle Deselect Control SCD FLXDrive Output Impedance Control ZQ 9th Bit Enable PE State Function L Linear Burst H Interleaved Burst L Flow Through H or NC Pipeline L or NC Active H Standby, IDD = ISB L Dual Cycle Deselect H or NC Single Cycle Deselect L High Drive (Low Impedance) H or NC Low Drive (High Impedance) L Activate DQPx I/Os (x18/x36 mode) H or NC Deactivate DQPx I/Os (x16/x32 mode) Note: There is a are pull-up devices on the ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences Linear Burst Sequence Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0] A[1:0] A[1:0] A[1:0] A[1:0] 1st address 00 01 10 11 1st address 00 01 10 11 2nd address 01 10 11 00 2nd address 01 00 11 10 3rd address 10 11 00 01 3rd address 10 11 00 01 4th address 11 00 01 10 4th address 11 10 01 00 Note: The burst counter wraps to initial state on the 5th clock. Note: The burst counter wraps to initial state on the 5th clock. BPR 1999.05.18 Rev: 2.13 11/2004 10/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Byte Write Truth Table Function GW BW BA BB BC BD Notes Read H H X X X X 1 Read H L H H H H 1 Write byte a H L L H H H 2, 3 Write byte b H L H L H H 2, 3 Write byte c H L H H L H 2, 3, 4 Write byte d H L H H H L 2, 3, 4 Write all bytes H L L L L L 2, 3, 4 Write all bytes L X X X X X Notes: 1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs. 2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes. 3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs. 4. Bytes “C” and “D” are only available on the x36 version. Rev: 2.13 11/2004 11/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Synchronous Truth Table Operation Address Used State Diagram Key5 Deselect Cycle, Power Down None X H X L X X High-Z Read Cycle, Begin Burst External R L L X X X Q Read Cycle, Begin Burst External R L H L X F Q Write Cycle, Begin Burst External W L H L X T D Read Cycle, Continue Burst Next CR X H H L F Q Read Cycle, Continue Burst Next CR H X H L F Q Write Cycle, Continue Burst Next CW X H H L T D Write Cycle, Continue Burst Next CW H X H L T D Read Cycle, Suspend Burst Current X H H H F Q Read Cycle, Suspend Burst Current H X H H F Q Write Cycle, Suspend Burst Current X H H H T D E1 ADSP ADSC ADV W3 DQ4 Write Cycle, Suspend Burst Current H X H H T D Notes: 1. X = Don’t Care, H = High, L = Low 2. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding. 3. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown as “Q” in the Truth Table above). 4. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish basic synchronous or synchronous burst operations and may be avoided for simplicity. 5. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above. 6. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above. Rev: 2.13 11/2004 12/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Simplified State Diagram X Deselect W R Simple Burst Synchronous Operation Simple Synchronous Operation W X R R First Write CW First Read CR CR W X R R X Burst Write Burst Read X CR CW CR Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and that ADSP is tied high and ADSC is tied low. 3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and assumes ADSP is tied high and ADV is tied low. Rev: 2.13 11/2004 13/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Simplified State Diagram with G X Deselect W R W X R R First Write CR CW W CW W X First Read X CR R Burst Write R CR CW W Burst Read X CW CR Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G. 2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles. 3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet Data Input Set Up Time. Rev: 2.13 11/2004 14/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Absolute Maximum Ratings (All voltages reference to VSS) Symbol Description Value Unit VDD Voltage on VDD Pins –0.5 to 4.6 V VDDQ Voltage in VDDQ Pins –0.5 to 4.6 V VI/O Voltage on I/O Pins –0.5 to VDDQ +0.5 (≤ 4.6 V max.) V VIN Voltage on Other Input Pins –0.5 to VDD +0.5 (≤ 4.6 V max.) V IIN Input Current on Any Pin +/–20 mA IOUT Output Current on Any I/O Pin +/–20 mA PD Package Power Dissipation 1.5 W TSTG Storage Temperature –55 to 125 o TBIAS Temperature Under Bias –55 to 125 o C C Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component. Power Supply Voltage Ranges Parameter Symbol Min. Typ. Max. Unit 3.3 V Supply Voltage VDD3 3.0 3.3 3.6 V 2.5 V Supply Voltage VDD2 2.3 2.5 2.7 V 3.3 V VDDQ I/O Supply Voltage VDDQ3 3.0 3.3 3.6 V 2.5 V VDDQ I/O Supply Voltage VDDQ2 2.3 2.5 2.7 V Notes Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. Rev: 2.13 11/2004 15/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) VDDQ3 Range Logic Levels Parameter Symbol Min. Typ. Max. Unit Notes VDD Input High Voltage VIH 2.0 — VDD + 0.3 V 1 VDD Input Low Voltage VIL –0.3 — 0.8 V 1 VDDQ I/O Input High Voltage VIHQ 2.0 — VDDQ + 0.3 V 1,3 VDDQ I/O Input Low Voltage VILQ –0.3 — 0.8 V 1,3 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V. VDDQ2 Range Logic Levels Parameter Symbol Min. Typ. Max. Unit Notes VDD Input High Voltage VIH 0.6*VDD — VDD + 0.3 V 1 VDD Input Low Voltage VIL –0.3 — 0.3*VDD V 1 VDDQ I/O Input High Voltage VIHQ 0.6*VDD — VDDQ + 0.3 V 1,3 VDDQ I/O Input Low Voltage VILQ –0.3 — 0.3*VDD V 1,3 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V. Recommended Operating Temperatures Parameter Symbol Min. Typ. Max. Unit Notes Ambient Temperature (Commercial Range Versions) TA 0 25 70 °C 2 Ambient Temperature (Industrial Range Versions) TA –40 25 85 °C 2 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. Rev: 2.13 11/2004 16/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Undershoot Measurement and Timing Overshoot Measurement and Timing VIH 50% tKC VDD + 2.0 V VSS 50% 50% VDD VSS – 2.0 V 50% tKC VIL Capacitance (TA = 25oC, f = 1 MHZ, VDD = 2.5 V) Parameter Symbol Test conditions Typ. Max. Unit Input Capacitance CIN VIN = 0 V 4 5 pF Input/Output Capacitance CI/O VOUT = 0 V 6 7 pF Note: These parameters are sample tested. AC Test Conditions Parameter Conditions Input high level VDD – 0.2 V Input low level 0.2 V Input slew rate 1 V/ns Input reference level VDD/2 Output reference level VDDQ/2 Output load Fig. 1 Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table. Output Load 1 DQ 50Ω 30pF* VDDQ/2 * Distributed Test Jig Capacitance Rev: 2.13 11/2004 17/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) DC Electrical Characteristics Parameter Symbol Test Conditions Min Max Input Leakage Current (except mode pins) IIL VIN = 0 to VDD –1 uA 1 uA ZZ Input Current IIN1 VDD ≥ VIN ≥ VIH 0 V ≤ VIN ≤ VIH –1 uA –1 uA 1 uA 100 uA FT, SCD, ZQ Input Current IIN2 VDD ≥ VIN ≥ VIL 0 V ≤ VIN ≤ VIL –100 uA –1 uA 1 uA 1 uA Output Leakage Current IOL Output Disable, VOUT = 0 to VDD –1 uA 1 uA Output High Voltage VOH2 IOH = –8 mA, VDDQ = 2.375 V 1.7 V — Output High Voltage VOH3 IOH = –8 mA, VDDQ = 3.135 V 2.4 V — Output Low Voltage VOL IOL = 8 mA — 0.4 V Rev: 2.13 11/2004 18/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology Rev: 2.13 11/2004 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 19/36 — Device Deselected; All other inputs ≥ VIH or ≤ VIL Deselect Current 180 20 260 15 165 10 20 IDD IDDQ IDD IDDQ IDD IDDQ ISB Pipeline Flow Through Pipeline IDD 60 85 IDD Pipeline Flow Through 20 ISB Flow Through Pipeline Flow Through 165 10 260 20 180 20 290 40 0 to 70°C 290 30 IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ IDD Symbol IDDQ Flow Through Pipeline Flow Through Pipeline Mode 65 90 30 30 175 10 270 15 190 20 300 30 175 10 270 20 190 20 300 40 –40 to 85°C -250 60 80 20 20 155 10 235 15 170 20 265 30 155 10 235 20 170 20 265 35 65 85 30 30 165 10 245 15 180 20 275 30 165 10 245 20 180 20 275 35 –40 to 85°C -225 0 to 70°C Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario. — ZZ ≥ VDD – 0.2 V (x18) (x36) (x18) (x36) Standby Current 2.5 V Operating Current Device Selected; All other inputs ≥VIH or ≤ VIL Output open Device Selected; All other inputs ≥VIH or ≤ VIL Output open Operating Current 3.3 V Test Conditions Parameter Operating Currents 50 75 20 20 150 10 215 15 165 15 240 25 150 10 215 15 165 15 240 30 0 to 70°C 55 80 30 30 160 10 225 15 175 15 250 25 160 10 225 15 175 15 250 30 –40 to 85°C -200 50 64 20 20 140 10 185 10 155 15 205 20 140 10 185 15 155 15 205 25 0 to 70°C 55 70 30 30 150 10 195 10 165 15 215 20 150 10 195 15 165 15 215 25 –40 to 85°C -166 50 60 20 20 135 10 170 10 150 15 190 20 135 10 170 15 150 15 190 25 0 to 70°C 55 65 30 30 145 10 180 10 160 15 200 20 145 10 180 15 160 15 200 25 –40 to 85°C -150 45 50 20 20 125 10 155 10 140 10 170 15 125 10 155 10 140 10 170 20 0 to 70°C 50 55 30 30 135 10 165 10 150 10 180 15 135 10 165 10 150 10 180 20 –40 to 85°C -133 mA mA mA mA mA mA mA mA mA mA mA mA Unit GS8161E18(T/D)/GS816132(D)/GS816136(T/D) © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) AC Electrical Characteristics Pipeline Flow Through Parameter Symbol Clock Cycle Time -250 -225 -200 -166 -150 -133 Unit Min Max Min Max Min Max Min Max Min Max Min Max tKC 4.0 — 4.4 — 5.0 — 6.0 — 6.7 — 7.5 — ns Clock to Output Valid tKQ — 2.5 — 2.7 — 3.0 — 3.4 — 3.8 — 4.0 ns Clock to Output Invalid tKQX 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — ns 1 Clock to Output in Low-Z tLZ 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — ns Setup time tS 1.2 — 1.3 — 1.4 — 1.5 — 1.5 — 1.5 — ns Hold time tH 0.2 — 0.3 — 0.4 — 0.5 — 0.5 — 0.5 — ns Clock Cycle Time tKC 5.5 — 6.0 — 6.5 — 7.0 — 7.5 — 8.5 — ns Clock to Output Valid tKQ — 5.5 — 6.0 — 6.5 — 7.0 — 7.5 — 8.5 ns Clock to Output Invalid tKQX 3.0 — 3.0 — 3.0 — 3.0 — 3.0 — 3.0 — ns Clock to Output in Low-Z tLZ1 3.0 — 3.0 — 3.0 — 3.0 — 3.0 — 3.0 — ns Setup time tS 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — 1.5 — ns Hold time tH 0.5 — 0.5 — 0.5 — 0.5 — 0.5 — 0.5 — ns Clock HIGH Time tKH 1.3 — 1.3 — 1.3 — 1.3 — 1.5 — 1.7 — ns Clock LOW Time tKL 1.5 — 1.5 — 1.5 — 1.5 — 1.7 — 2 — ns Clock to Output in High-Z tHZ1 1.5 2.3 1.5 2.5 1.5 3.0 1.5 3.0 1.5 3.0 1.5 3.0 ns G to Output Valid tOE — 2.3 — 2.5 — 3.2 — 3.5 — 3.8 — 4.0 ns G to output in Low-Z tOLZ1 0 — 0 — 0 — 0 — 0 — 0 — ns G to output in High-Z tOHZ1 — 2.3 — 2.5 — 3.0 — 3.0 — 3.0 — 3.0 ns ZZ setup time tZZS2 5 — 5 — 5 — 5 — 5 — 5 — ns ZZ hold time tZZH2 1 — 1 — 1 — 1 — 1 — 1 — ns ZZ recovery tZZR 20 — 20 — 20 — 20 — 20 — 20 — ns Notes: 1. These parameters are sampled and are not 100% tested. 2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above. Rev: 2.13 11/2004 20/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Pipeline Mode Timing Begin Read A Cont Deselect Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont Deselect Deselect tKL tKH tKC CK ADSP tS ADSC initiated read tH ADSC tS tH ADV tS tH Ao–An A B C tS GW tS tH BW tH tS Ba–Bd tS Deselected with E1 tH E1 tS E2 and E3 only sampled with ADSC tH E2 tS tH E3 G tS tOE DQa–DQd Hi-Z Rev: 2.13 11/2004 tOHZ Q(A) tKQ tH D(B) tHZ tLZ tKQX Q(C) Q(C+1) 21/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Q(C+2) Q(C+3) © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Flow Through Mode Timing Begin Read A Cont Deselect Write B Read C Read C+1 Read C+2 Read C+3 Read C Deselect tKL tKH tKC CK ADSP Fixed High tS tH tS tH ADSC initiated read ADSC tH tS tS tH ADV tS tH Ao–An A B C tS tH GW tS tH BW tH tS Ba–Bd tS Deselected with E1 tH E1 masks ADSP E1 tS tH E2 and E3 only sampled with ADSP and ADSC E2 tS tH E1 masks ADSP E3 G tH tS tOE tKQ DQa–DQd Rev: 2.13 11/2004 tOHZ Q(A) tKQX tHZ tLZ D(B) Q(C) Q(C+1) Q(C+2) 22/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Q(C+3) Q(C) © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Sleep Mode During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after ZZ recovery time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands may be applied while the SRAM is recovering from Sleep mode. Sleep Mode Timing Diagram tKH tKC tKL CK Setup Hold ADSP ADSC tZZR tZZS tZZH ZZ Application Tips Single and Dual Cycle Deselect SCD devices force the use of “dummy read cycles” (read cycles that are launched normally but that are ended with the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance but their use usually assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs (like this one) do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention. JTAG Port Operation Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDDQ. Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected. Rev: 2.13 11/2004 23/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) JTAG Pin Descriptions Pin Pin Name I/O Description TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. In The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level. TDI Test Data In TDO Test Data Out Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up. JTAG Port Registers Overview The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM’s JTAG Port to another device in the scan chain with as little delay as possible. Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register. Rev: 2.13 11/2004 24/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) JTAG TAP Block Diagram · · · · · · · · Boundary Scan Register · · 1 · 108 0 0 Bypass Register 2 1 0 Instruction Register TDI TDO ID Code Register 31 30 29 · · · · 2 1 0 Control Signals TMS Test Access Port (TAP) Controller TCK Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. Die Revision Code GSI Technology JEDEC Vendor ID Code I/O Configuration Not Used Presence Register ID Register Contents Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 x72 X X X X 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 1 0 0 1 1 x36 X X X X 0 0 0 X 1 0 0 1 0 0 0 0 1 0 0 0 0 0 0 1 1 0 1 1 0 0 1 1 x32 X X X X 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 1 1 0 1 1 0 0 1 1 x18 X X X X 0 0 0 X 1 0 0 1 0 0 0 0 1 0 1 0 0 0 0 1 1 0 1 1 0 0 1 1 x16 X X X X 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 1 1 0 1 1 0 0 1 1 Rev: 2.13 11/2004 25/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Tap Controller Instruction Set Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table. JTAG Tap Controller State Diagram 1 0 Test Logic Reset 0 Run Test Idle 1 Select DR 1 Select IR 0 0 1 1 Capture DR Capture IR 0 0 Shift DR 1 1 Shift IR 0 1 1 Exit1 DR 0 Exit1 IR 0 0 Pause DR 1 Exit2 DR 1 Update DR 1 1 0 0 Pause IR 1 Exit2 IR 0 1 0 0 Update IR 1 0 Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Rev: 2.13 11/2004 26/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is still determined by its input pins. Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK when the controller is in the Update-IR state. Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction. Rev: 2.13 11/2004 27/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) JTAG TAP Instruction Set Summary Instruction Code Description EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1 IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2 SAMPLE-Z 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z. 1 RFU 011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 SAMPLE/ PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1 GSI 101 GSI private instruction. 1 RFU 110 Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. 1 BYPASS 111 Places Bypass Register between TDI and TDO. Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state. Rev: 2.13 11/2004 28/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Notes 1 © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) JTAG Port Recommended Operating Conditions and DC Characteristics Parameter Symbol Min. Max. Unit Notes 3.3 V Test Port Input High Voltage VIHJ3 2.0 VDD3 +0.3 V 1 3.3 V Test Port Input Low Voltage VILJ3 –0.3 0.8 V 1 2.5 V Test Port Input High Voltage VIHJ2 0.6 * VDD2 VDD2 +0.3 V 1 2.5 V Test Port Input Low Voltage VILJ2 –0.3 0.3 * VDD2 V 1 TMS, TCK and TDI Input Leakage Current IINHJ –300 1 uA 2 TMS, TCK and TDI Input Leakage Current IINLJ –1 100 uA 3 TDO Output Leakage Current IOLJ –1 1 uA 4 Test Port Output High Voltage VOHJ 1.7 — V 5, 6 Test Port Output Low Voltage VOLJ — 0.4 V 5, 7 Test Port Output CMOS High VOHJC VDDQ – 100 mV — V 5, 8 Test Port Output CMOS Low VOLJC — 100 mV V 5, 9 Notes: 1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ ≤ VIN ≤ VDDn 3. 0 V ≤ VIN ≤ VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDDQ supply. 6. IOHJ = –4 mA 7. IOLJ = + 4 mA 8. IOHJC = –100 uA 9. IOHJC = +100 uA JTAG Port AC Test Conditions Parameter Conditions Input high level VDD – 0.2 V Input low level 0.2 V Input slew rate 1 V/ns Input reference level VDDQ/2 Output reference level VDDQ/2 DQ 50Ω 30pF* VDDQ/2 * Distributed Test Jig Capacitance Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted. Rev: 2.13 11/2004 JTAG Port AC Test Load 29/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) JTAG Port Timing Diagram tTKC tTKH tTKL TCK tTH tTS TDI tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input JTAG Port AC Electrical Characteristics Parameter Symbol Min Max Unit TCK Cycle Time tTKC 50 — ns TCK Low to TDO Valid tTKQ — 20 ns TCK High Pulse Width tTKH 20 — ns TCK Low Pulse Width tTKL 20 — ns TDI & TMS Set Up Time tTS 10 — ns TDI & TMS Hold Time tTH 10 — ns Boundary Scan (BSDL Files) For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications Engineering Department at: [email protected]. Rev: 2.13 11/2004 30/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) TQFP Package Drawing (Package T) L Min. Nom. Max A1 Standoff 0.05 0.10 0.15 A2 Body Thickness 1.35 1.40 1.45 b Lead Width 0.20 0.30 0.40 c Lead Thickness 0.09 — 0.20 D Terminal Dimension 21.9 22.0 22.1 D1 Package Body 19.9 20.0 20.1 E Terminal Dimension 15.9 16.0 16.1 E1 Package Body 13.9 14.0 14.1 e Lead Pitch — 0.65 — L Foot Length 0.45 0.60 0.75 L1 Lead Length — 1.00 — Y Coplanarity θ Lead Angle e D D1 Description c Pin 1 Symbol L1 θ b A1 A2 0.10 Y 0° — 7° E1 E Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion. Rev: 2.13 11/2004 31/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Package Dimensions—165-Bump FPBGA (Package D; Variation 1) A1 TOP BOTTOM Ø0.10M C Ø0.25M C A B Ø0.40~0.50 1 2 3 4 5 6 7 8 9 10 A1 11 10 9 8 7 6 5 4 3 2 A B C D E F G H J K L M N P R 1.0 14. 15±0.0 1.0 A B C D E F G H J K L M N P R A 1.0 1.0 0.15 C B C Rev: 2.13 11/2004 13±0.0 0.20(4 SEATING 0.25~0.4 1.20 (0.26 0.45±0.05 0.25 C 10. 32/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Ordering Information for GSI Synchronous Burst RAMs Org Part Number1 Type Package Speed2 (MHz/ns) TA3 1M x 18 GS8161E18T-250 DCD Pipeline/Flow Through TQFP 250/5.5 C 1M x 18 GS8161E18T-225 DCD Pipeline/Flow Through TQFP 225/6 C 1M x 18 GS8161E18T-200 DCD Pipeline/Flow Through TQFP 200/6.5 C 1M x 18 GS8161E18T-166 DCD Pipeline/Flow Through TQFP 166/7 C 1M x 18 GS8161E18T-150 DCD Pipeline/Flow Through TQFP 150/7.5 C 1M x 18 GS8161E18T-133 DCD Pipeline/Flow Through TQFP 133/8.5 C 512K x 36 GS8161E36T-250 DCD Pipeline/Flow Through TQFP 250/5.5 C 512K x 36 GS8161E36T-225 DCD Pipeline/Flow Through TQFP 225/6 C 512K x 36 GS8161E3T-200 DCD Pipeline/Flow Through TQFP 200/6.5 C 512K x 36 GS8161E36T-166 DCD Pipeline/Flow Through TQFP 166/7 C 512K x 36 GS8161E36T-150 DCD Pipeline/Flow Through TQFP 150/7.5 C 512K x 36 GS8161E36T-133 DCD Pipeline/Flow Through TQFP 133/8.5 C 1M x 18 GS8161E18T-250I DCD Pipeline/Flow Through TQFP 250/5.5 I 1M x 18 GS8161E18T-225I DCD Pipeline/Flow Through TQFP 225/6 I 1M x 18 GS8161E18T-200I DCD Pipeline/Flow Through TQFP 200/6.5 I 1M x 18 GS8161E18T-166I DCD Pipeline/Flow Through TQFP 166/7 I 1M x 18 GS8161E18T-150I DCD Pipeline/Flow Through TQFP 150/7.5 I 1M x 18 GS8161E18T-133I DCD Pipeline/Flow Through TQFP 133/8.5 I 512K x 36 GS8161E36T-250I DCD Pipeline/Flow Through TQFP 250/5.5 I 512K x 36 GS8161E36T-225I DCD Pipeline/Flow Through TQFP 225/6 I 512K x 36 GS8161E36T-200I DCD Pipeline/Flow Through TQFP 200/6.5 I 512K x 36 GS8161E36T-166I DCD Pipeline/Flow Through TQFP 166/7 I 512K x 36 GS8161E36T-150I DCD Pipeline/Flow Through TQFP 150/7.5 I 512K x 36 GS8161E36T-133I DCD Pipeline/Flow Through TQFP 133/8.5 I 1M x 18 GS8161E18D-250 DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 C 1M x 18 GS8161E18D-225 DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 C 1M x 18 GS8161E18D-200 DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 C 1M x 18 GS8161E18D-166 DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 C 1M x 18 GS8161E18D-150 DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 C Status 1M x 18 GS8161E18D-133 DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 C Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS816118D-133IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings. Rev: 2.13 11/2004 33/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) Ordering Information for GSI Synchronous Burst RAMs Org Part Number1 Type Package Speed2 (MHz/ns) TA3 512K x 32 GS8161E32D-250 DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 C 512K x 32 GS8161E32D-225 DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 C 512K x 32 GS8161E32D-200 DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 C 512K x 32 GS8161E32D-166 DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 C 512K x 32 GS8161E32D-150 DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 C 512K x 32 GS8161E32D-133 DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 C 512K x 36 GS8161E36D-250 DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 C 512K x 36 GS8161E36D-225 DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 C 512K x 36 GS8161E36D-200 DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 C 512K x 36 GS8161E36D-166 DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 C 512K x 36 GS8161E36D-150 DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 C 512K x 36 GS8161E36D-133 DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 C 1M x 18 GS8161E18D-250I DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 I 1M x 18 GS8161E18D-225I DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 I 1M x 18 GS8161E18D-200I DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 I 1M x 18 GS8161E18D-166I DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 I 1M x 18 GS8161E18D-150I DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 I 1M x 18 GS8161E18D-133I DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 I 512K x 32 GS8161E32D-250I DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 I 512K x 32 GS8161E32D-225I DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 I 512K x 32 GS8161E32D-200I DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 I 512K x 32 GS8161E32D-166I DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 I 512K x 32 GS8161E32D-150I DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 I 512K x 32 GS8161E32D-133I DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 I 512K x 36 GS8161E36D-250I DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 I 512K x 36 GS8161E36D-225I DCD Pipeline/Flow Through 165 BGA (var. 1) 225/6 I 512K x 36 GS8161E36D-200I DCD Pipeline/Flow Through 165 BGA (var. 1) 200/6.5 I 512K x 36 GS8161E36D-166I DCD Pipeline/Flow Through 165 BGA (var. 1) 166/7 I 512K x 36 GS8161E36D-150I DCD Pipeline/Flow Through 165 BGA (var. 1) 150/7.5 I Status 512K x 36 GS8161E36D-133I DCD Pipeline/Flow Through 165 BGA (var. 1) 133/8.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS816118D-133IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings. Rev: 2.13 11/2004 34/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 18Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; New GS8161E18T-150IT 1.00 9/ 1999A;GS8161E18T-150IT 2.00 1/1999B Types of Changes Format or Content Content • Converted from 0.25u 3.3V process to 0.18u 2.5V process. Master File Rev B • Added x72 Pinout. • Added GSI Logo. • Changed pin description in TQFP to match order of pins in pinout. GS8161E18T 2.01 1/ 2000C;GS8161E18 T 2.02 1/ 2000D • Front page; Features - changed 2.5V I/O supply to 2.5V or3.3V I/O supply; Core and Interface voltages - Changed paragraph to include information for 3.3V;Completeness • Absolute Maximum Ratings; Changed VDDQ - Value: From: .05 to VDD : to : -.05 to 3.6; Completeness. • Recommended Operating Conditions;Changed: I/O Supply Voltage- Max. from VDD to 3.6; Input High Voltage- Max. from VDD +0.3 to 3.6; Same page - took out Note 1;Completeness • Electrical Characteristics - Added second Output High Voltage line to table; completeness. • Note: There was not a Rev 2.02 for the 8160Z or the 8161Z. GS18/362.0 1/2000DGS18/ 362.03 2/2000E GS18/3662.03 2/2000E; 8161E18_r2_04 Page;Revisions;Reason Content • Changed the value of ZZ recovery in the AC Electrical Characteristics table on page 15 from 20 ns to 100 ns 8161E18_r2_04; 8161E18_r2_05 Content/Format • Added 225 MHz speed bin • Updated numbers in page 1 table, AC Characteristics table, and Operating Currents table • Updated format to comply with Technical Publications standards 8161E18_r2_05; 8161E18_r2_06 Content • Updated Capitance table—removed Input row and changed Output row to I/O 8161E18_r2_06; 8161E18_r2_07 Content • Updated Features list on page 1 • Completely reworked table on page 1 • Updated Mode Pin Functions table on page 6 Content • Added 3.3 V references to entire document • Updated Operating Conditions table • Updated JTAG section • Updated Boundary Scan Chain table • Added Pin 56 to Pin Description table • Updated Operating Currents table and added note • Updated Application Tips paragraph • Updated table on page 1; added power numbers Content • Updated Operating Currents table • Updated Synchronous Truth Table • Updated table on page 1; updated power numbers • Updated Recommended Operating Conditions table (added VDDQ references) 8161E18_r2_07; 8161E18_r2_08 8161E18_r2_08; 8161E18_r2_09 Rev: 2.13 11/2004 35/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology GS8161E18(T/D)/GS816132(D)/GS816136(T/D) 18Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; New Types of Changes Format or Content Page;Revisions;Reason Content • Updated table on page 1 • Created recommended operating conditions tables on pages 11 and 12 • Updated AC Electrical Characteristics table • Added Sleep mode description on page 22 • Updated Ordering Information for 225 MHz part (changed from 7ns to 6.5 ns) • Updated BSR table (2 and 3 changed to X (value undefined)) • Added 250 MHz speed bin • Deleted 180 MHz speed bin 8161E18_r2_10; 8161E18_r2_11 Content • Updated AC Characteristics table • Updated FT power numbers • Updated Mb references from 16Mb to 18Mb • Removed ByteSafe references • Changed DP and QE pins to NC • Updated ZZ recovery time diagram • Updated AC Test Conditions table and removed Output Load 2 diagram 8161E18_r2_11; 8161E18_r2_12 Content • Removed Preliminary banner • Removed BSR table • Removed pin locations from pin description table 8161E18_r2_12; 8161E18_r2_13 Format/Content 8161E18_r2_09; 8161E18_r2_10 Rev: 2.13 11/2004 • Updated format • Updated timing diagrams • Added 165 BGA 36/36 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 1999, GSI Technology