Pressure sensors C28 series Series/Type: Ordering code: Gauge pressure sensor die for back side pressure applications Date: Version: 2009-08-03 3 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left bar): Pressure sensors Identification/Classification 2 (header 2 + bottom left header bar): C28 series Ordering code: (top right header bar) Series/Type: (top right header bar) Gauge pressure sensor die for back side pressure applications Preliminary data (optional): (if necessary) Department: AS SEN PD Date: 2009-08-03 Version: 3 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited Pressure sensors C28 series Gauge pressure sensor die for back side pressure applications Applications Medical devices Automotive Automation Features Piezoresistive MEMS technology Small dimensions: 2.05 × 2.05 mm Square diaphragm Measured media (back side): Non-aggressive gases and fluids. Unsuitable for substances which react with glass or silicon. Whetstone bridge with mV output, ratiometric to supply voltage Rated pressure ranges 1.6 up to 40 bar Options Temperature sensing diode Delivery mode Tray Dimensional drawings 2050 560 390 150 A B 800 560 Note1 X5 640 700 400 allowable edge disruptions 80 µm max. allowable edge disruptions 50 µm max. 810 235 X8 A B Note1 2050 95 660 X4 X9 660 B X4 X5 X1 X2 electrical diagram: X3 X10 280 560 840 X5 280 560 850 Si 100 all dimensions in µm Note1: geometry of diaphragm depend on specification checked bond area (typ. 100µm x 100µm) AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. glass BOROFLOATTM R1 R2 X4 R3 R4 X3 X2 p X9 X8 X1 X1 : X2 : X3 : X4 : X5 : X8 : X9 : X10: Vout– VDD– VDD– Vout+ VDD+ Diode (N) Diode (P) Substrate 2009-08-03 Page 2 of 8 Pressure sensors C28 series Gauge pressure sensor die for back side pressure applications Technical data Absolute maximum ratings Parameter Symbol Conditions VDD Without damage Min. Typ. Max. Unit 10 V Supply voltage Maximum supply voltage 1) Temperature ranges Operating temperature range Storage temperature range 2) –40 135 °C For t <15 min –40 140 °C Tst 3) –40 150 °C pr Gauge pressure 4) 0 ... 1.6 0 ... 40 bar Gauge pressure 5) 2.5 pr pberst Gauge pressure 6) 3 pr Symbol Conditions Min. 7) 1.0 Ta Pressure ranges Operating pressure ranges Over pressure Burst pressure pov Electrical specifications Parameter Typ. Max. Unit 5.0 V Supply voltage / bridge resistance Operating supply voltage VDD Total bridge resistance RS Temperature coefficient of total bridge resistance αRs @ 25 °C 8) @ 25 °C 9) βRs 2.7 3.2 3.7 kΩ 2.1 2.4 2.7 10 /K 4 6 8 10 /K –30 0 30 mV –3 –6 2 Output signal @ VDD = 5 V Offset V0 Sensitivity S Temperature coefficient of the sensitivity αS Pressure hysteresis pHys @ 25 °C 10) @ 25 °C 13) @ 25 °C 15) See next table βS 16) mV/bar –3 –2.5 –2.2 –1.9 10 /K 3 5 8 10 /K 0.1 % FS –0.1 –6 2 Optional temperature sensing diode Forward diode voltage VF @ 25 °C, IF = 50 µA 17) 550 600 650 mV Temperature coefficient of forward diode voltage TCVF @ 25 °C, IF = 50 µA 18) –2.4 –2.2 –2.0 mV/K Long-term stability (Full scale normal output FSON = 120 mV) Temperature hysteresis of offset Temperature cycle drift of offset High temperature drift of offset Long term stability of offset THV0 19) –0.35 ±0.2 0.35 % FSON TCDV0 19) –0.25 ±0.1 0.25 % FSON HTDV0 19) –0.25 ±0.1 0.25 % FSON LTSV0 19) –0.45 ±0.3 0.45 % FSON AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. 2009-08-03 Page 3 of 8 Pressure sensors C28 series Gauge pressure sensor die for back side pressure applications Operating pressures and ordering codes Parameter @ 25 °C, VDD = 5 V Operating pressure 4) Temperature coefficient 11) of offset voltage (unglued) [min/typ/max] Nonlinearity 14) [typ/max] Symbol Typ. Typ. Typ. Typ. Units pr 2.5 6.0 10 25 bar TCV0 – –8/±4/8 –8/±4/8 –8/±4/8 –8/±4/8 µV/VK TCV0 + –4/±2/4 –4/±2/4 –4/±2/4 –4/±2/4 µV/VK L ±0.2/±0.3 ±0.2/±0.3 ±0.2/±0.3 ±0.2/±0.3 % FS S 36/48/60 15/20/25 9/12/15 3.6/4.8/6 mV/bar yes yes yes yes 13) Sensitivity [min/typ/max] Product type AER 2.500 C28/1 G08 D AER 6.000 C28/1 G08 D AER 10.00 C28/1 G08 D AER 25.00 C28/1 G08 D Ordering code B58601D8010A016 B58601D8010A017 B58601D8010A018 B58601D8010A019 Temperature sensing diode present Other operating pressures upon request. AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. 2009-08-03 Page 4 of 8 Pressure sensors C28 series Gauge pressure sensor die for back side pressure applications Symbols and Terms 1) 2) 3) 4) 5) 6) 7) Maximum power supply VDD This is the maximal allowed voltage, which may be applied to the piezoresistive bridge circuit without damage. Operating temperature range Ta This is the operating Temperature range Ta,min to Ta,max. Because most of the sensor parameters depend on assembling conditions like gluing, wire bonding etc, the die has to be tested over the operating temperature range by the customer fully assembled. For design verification and process control samples, mounted in AK transducer package (AK2 series) are tested over a reduced measuring temperature range of Tmeas,min to Tmeas,max. Storage temperature range Tst If the pressure sensor dies are stored in the temperature range Tst,min to Tst,max without applied voltage power supply, this will not affect the performance of the pressure sensor dies. Operating pressure range pr In the operating pressure range 0 to pr,max the pressure sensor die output characteristic is as defined in this specification. Over pressure pOV Pressure cycles in the pressure range 0 to pov do not affect the performance of the pressure sensor dies. Burst pressure pberst Up to the burst pressure pberst the diaphragm of the sensor die will not be destroyed mechanically. This parameter is tested at room temperature on samples mounted on an aluminium socket by increasing the applied pressure until the diaphragm is destroyed. Operating power supply VDD The pressure sensor parameters are defined for a power supply voltage of VDD = 5 V. In the operating power supply voltage range VDD,min to VDD,max the ratiometric parameters r(VDD) like sensitivity, offset voltage and the temperature coefficient of the offset voltage are defined by: r (VDD ) = r(5[ V ]) VDD 5[ V ] 8) Total bridge resistance RS The total bridge resistance is defined between pad X5 and X2, X3 (see the dimensional drawing in this data sheet) of the closed piezoresistive bridge circuit. The total bridge resistance is in a good approximation the output impedance of the piezoresistive bridge circuit. This parameter is tested completely on a wafer (wafer level test measurement). 9) Temperature coefficients of resistance αRs and β Rs: The temperature coefficients of resistance are tested for design verification on samples, mounted on AK transducer package (AK2 series) over a reduced temperature range Tmeas,min = –20 °C to Tmeas,max = 80 °C with TR = 25 °C. The temperature coefficients of first and second order are defined with the polynomial: RS(T) = RS (T = 25°C ) 1+α Rs T−25°C +β Rs T−25°C ( 10) 11) ) ( ) 2 The coefficients αRs and βRs are calculated using the three measurement points of Rs(T) at Tmeas,min, TR and Tmeas,max. Offset voltage V0 The offset voltage V0 is the output voltage Vout(p = 0 bar gauge) at zero gauge pressure and for a bridge voltage power supply VDD = 5 V. This parameter is tested completely on a wafer (wafer level test measurement). It should be noted that this parameter may be influenced by assembly. Temperature coefficient of offset voltage TCV0 The temperature coefficients of offset voltage are defined for a bridge voltage power supply VDD = 5 V. These parameters strongly depend on assembly conditions like gluing, wire bonding etc. The temperature coefficients of offset voltage are tested for design verification on samples, mounted on AK transducer package (AK2 series) over a temperature range Tmin = –40 °C to Tmax = 135 °C. Therefore TCV0+ and TCV0- are defined for the measurement temperature range by: TCVo + = Vo (Tmax ) − Vo (25°C) Tmax − 25°C AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. TCVo − = Vo (Tmin ) − Vo (25°C) Tmin − 25°C 2009-08-03 Page 5 of 8 Pressure sensors C28 series 12) Gauge pressure sensor die for back side pressure applications Full scale value FS FS = Vout (p r max ) − Vo 13) Sensitivity S The sensitivity is defined for a bridge voltage power supply VDD = 5 V. It can be determined by the formula: S= 14) Vout (p r max ) − Vo p r max This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series). Nonlinearity L This parameter may be influenced by assembly. The nonlinearity is measured using the endpoint method. Assuming a characteristic, this can be approximated by a polynomial of second order, where the maximum is at px = prmax/2. The nonlinearity is defined at px = prmax/2, using the equation: L= Vout (p x ) − Vo px − Vout (p r max ) − Vo p r max This parameter is tested for process control on samples, mounted on AK transducer package (AK2 series). 15) Temperature coefficient of sensitivity αS and βS: These parameters may be influenced by assembly. The temperature coefficients of sensitivity are tested for design verification on samples, mounted on AK transducer package (AK2 series) over a reduced temperature range Tmeas,min = –20 °C to Tmeas,max = 80 °C with TR = 25 °C. The temperature coefficients of first and second order are defined with the polynomial: 2 S(T) = S (T = 25 °C) 1+ αS T − 25 °C + βS T − 25 °C ( 16) 18) Vout,2 (p k ) − Vout,1(p k ) FS With k = min, 1, 2, 3, max. The pressure steps are: prmin = 0, p1 = 0.25·pr,max, p2 = 0.5·pr,max, p3 = 0.75·pr, max, pr,max. This parameter is tested for design verification on samples, mounted on AK transducer package (AK2 series). Forward diode voltage VF The voltage drop is measured across anode and cathode by a forward current of 47 µA. This parameter is tested completely on a wafer (wafer level test measurement). Temperature coefficient of forward diode voltage TCVF The temperature sensitivity of diode voltage drop is defined by the measured values at –20 °C and 80 °C using the equation: TCVF = 19) ) The coefficients αS and βS are calculated using the three measurement points of S(T) at Tmeas,min, TR and Tmeas,max. Pressure hysteresis pHys The pressure hysteresis is the difference between output voltages at constant pressure and constant temperature while applying a pressure cycle with pressure steps of pr, min, p1, p2, p3, pr,max, p3, p2, p1, pr, min: pHys = 17) ) ( VF (Tmeas,max ) − VF (Tmeas,min ) Tmeas,max − Tmeas,min With Tmeas,min = –20 °C and Tmeas,max = 80 °C and the measurement is done with a constant current of 50 µA. The estimated temperature coefficient is also valid at temperatures between –40 °C and 135 °C. This parameter is tested for design verification on samples, mounted on AK transducer package (AK2 series). Reliability data For long-term stability of offset voltage LTSV0 please refer to the defined Aktiv Sensor’s standard AS100001 in chapter “Reliability data” on the internet. AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. 2009-08-03 Page 6 of 8 Pressure sensors C28 series Gauge pressure sensor die for back side pressure applications Cautions and warnings Storage (general) All pressure sensors should be stored in their original packaging. They should not be placed in harmful environments such as corrosive gases nor exposed to heat or direct sunlight, which may cause deformations. Similar effects may result from extreme storage temperatures and climatic conditions. Avoid storing the sensor dies in an environment where condensation may form or in a location exposed to corrosive gases, which will adversely affect their performance. Plastic materials should not be used for wrapping/packing when storing or transporting these dies, as they may become charged. Pressure sensor dies should be used soon after opening their seal and packaging. Operation (general) Media compatibility with the pressure sensors must be ensured to prevent their failure. The use of other media can cause damage and malfunction. Never use pressure sensors in atmospheres containing explosive liquids or gases. Ensure pressure equalization to the environment, if gauge pressure sensors are used. Avoid operating the pressure sensors in an environment where condensation may form or in a location exposed to corrosive gases. These environments adversely affect their performance. If the operating pressure is not within the rated pressure range, it may change the output characteristics. This may also happen with pressure sensor dies if an incorrect mounting method is used. Be sure that the applicable pressure does not exceed the overpressure, as it may damage the pressure sensor. Do not exceed the maximum rated supply voltage nor the rated storage temperature range, as it may damage the pressure sensor. Temperature variations in both the ambient conditions and the media (liquid or gas) can affect the accuracy of the output signal from the pressure sensors. Be sure to check the operating temperature range and thermal error specification of the pressure sensors to determine their suitability for the application. Connections must be wired in accordance with the terminal assignment specified in the data sheets. Care should be taken as reversed pin connections can damage the pressure transmitters or degrade their performance. Contact between the pressure sensor terminals and metals or other materials may cause errors in the output characteristics. Design notes (dies) This specification describes the mechanical, electrical and physical requirements of a piezoresistive sensor die for measuring pressure. The specified parameters are valid for the pressure sensor die with pressure application either to the front or back side of the diaphragm as described in the data sheet. Pressure application to the other side may result in differing data. Most of the parameters are influenced by assembly conditions. Hence these parameters and the reliability have to be specified for each specific application and tested over its temperature range by the customer. Handling/Mounting (dies) Pressure sensor dies should be handled appropriately and not be touched with bare hands. They should only be picked up manually by the sides using tweezers. Their top surface should never be touched with tweezers. Latex gloves should not be used for handling them, as this will inhibit the curing of the adhesive used to bond the die to the carrier. When handling, be careful to avoid cuts caused by the sharp-edged terminals. The sensor die must not be contaminated during manufacturing processes (gluing, soldering, silk-screen process). The package of pressure sensor dies should not to be opened until the die is mounted and should be closed after use. The sensor die must not be cleaned. The sensor die must not be damaged during the assembly process (especially scratches on the diaphragm). Soldering (transducers, transmitters) The thermal capacity of pressure sensors is normally low, so steps should be taken to minimize the effects of external heat. High temperatures may lead to damage or changes in characteristics. A non-corrosive type of flux resin should normally be used and complete removal of the flux is recommended. Avoid rapid cooling due to dipping in solvent. Note that the output signal may change if pressure is applied to the terminals during soldering. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. AS SEN PD Please read Cautions and warnings and Important notes at the end of this document. 2009-08-03 Page 7 of 8 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MiniCell, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 8 of 8