Sharp GL4800E0000F Infrared emitting diode Datasheet

GL4800E0000F
GL4800E0000F
Infrared Emitting Diode
■ Features
■ Agency Approvals/Compliance
1. Side view emission type
2. Plastic mold with resin lens
3. Medium directivity angle (Δθ: ±30° TYP.)
Peak emission wavelength: 950 nm TYP.
4. Radiant flux φe: 0.7 mW MIN.
5. Lead free and RoHS directive component
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS)
(Chinese:
);
refer to page 7
■ Applications
1.
2.
3.
4.
5.
6.
7.
8.
Optoelectronic switching
Office automation equipment
Audio visual equipment
Home appliances
Telecommunication equipment
Measuring equipment
Tooling machines
Computers
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D1-A01001EN
Date: March 30, 2007
©SHARP Corporation
GL4800E0000F
1.5
■ Outline Dimensions
1.6
0.8
1.65
0.1 MAX.
2°
1.8
φ1.0E.PIN
8°
0.1 MAX.
0.8
0.3 MAX.
Resin burr
1.7
3.5
1.6
0.8
(φ0.8)
2°
8°
1.0
2 - C0.5
1.25
0.3 MAX.
Gate burr
(R.45)
3.0
0.7
φ1.5E.PIN
0.2 MAX.
Resin burr
2 - 0.9
2 - 0.45 +0.3
-0.1
17.5 ±0.5
2 - 0.25 +0.3
-0.1
2
0.5 MIN.
1
(2.54)
8°
8°
8°
8°
Pin Arrangement
1
No.
2
2°
Name
1
Cathode
2
Anode
2°
NOTES:
1. Units: mm
2. Unspecified tolerances: ±0.2
3. Package: Pink transparent epoxy resin
4. ( ): Reference dimensions
5. The thin burr thickness (0.05 mm MAX.) and the gate burr (0.3 mm MAX.)
shall not be included in the outline dimensions.
6. Protruded resin 0.3 mm MAX. However, the thin burr adheres to the lead
1.8 mm MAX. from the resin.
Sheet No.: D1-A01001EN
2
GL4800E0000F
■ Absolute Maximum Ratings
Parameter
(Ta = 25°C)
Symbol
Rating
Unit
IF
50
mA
Peak forward current *1
IFM
1
A
Reverse voltage
VR
6
V
Power dissipation
P
75
mW
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +85
°C
Soldering temperature *2
Tsol
260
°C
Forward current
width: 100 µs, Duty ratio: 0.01
*12 Pulse
* 3 s (MAX.) positioned 1.8 mm from the resin edge.
■ Electro-optical Characteristics
Parameter
Symbol
(Ta = 25°C)
Conditions
MIN.
TYP.
MAX.
Unit
VF
IF = 20 mA
–
1.2
1.4
V
VFM
IFM = 0.5 A
–
3.0
4.0
V
Reverse current
IR
VR = 3 V
–
–
10
µA
Radiant flux
φe
IF = 20 mA
0.7
1.6
3.0
mW
Peak emission wavelength
λp
IF = 5 mA
–
950
–
nm
Half intensity wavelength
Δλ
IF = 5 mA
–
45
–
nm
Terminal capacitance
Ct
VR = 0, f = 1 MHz
–
70
–
pF
Cut-off frequency
fC
–
–
300
–
kHz
Forward voltage
Peak forward voltage
Fig. 1 Forward Current vs.
Ambient Temperature
Fig. 2 Peak Forward Current vs. Duty Ratio
10,000
Pulse width ≤ 100 µs
T a = 25°C
Peak forward current IFM (mA)
60
Forward current IF (mA)
50
40
30
20
10
0
-25
1,000
100
10
10-4
10-3
10-2
10-1
100
Duty ratio
0
25
50
75 85
100
Ambient temperature Ta (°C)
Sheet No.: D1-A01001EN
3
GL4800E0000F
Fig. 3 Radiation Diagram
0°
-10°
+10°
100
-30°
-50°
-60°
1,000
60
+40°
40
+50°
+60°
20
-70°
+70°
-80°
+80°
-90°
IF = 5 mA
+30°
80
Relative radiant intensity (%)
-40°
+20°
Ta = 25°C
Peak emission wavelength λP (nm)
-20°
Fig. 5 Peak Emission Wavelength vs.
Ambient Temperature
975
950
925
+90°
0
900
-25
Angular displacement θ
0
25
50
75
100
Ambient temperature Ta (°C)
Fig. 4 Spectral Distribution
Fig. 6 Forward Current vs.
Forward Voltage
100
IF = 5 mA
Ta = 25°C
500
Ta = 75°C
200
60
Forward current IF (mA)
Relative radiant intensity (%)
80
40
20
0
880
25°C
50°C
0°C
100
-20°C
50
20
10
5
2
900
920
940
960
980
1,000 1,020 1,040
1
Wavelength λ (mm)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward voltage VF (V)
Sheet No.: D1-A01001EN
4
GL4800E0000F
Fig. 7 Relative Radiant Flux vs. Ambient
Temperature
Fig. 9 Relative Radiant Intensity vs.
Distance
100
20
Ta = 25°C
IF = const.
Relative radiant intensity (%)
Relative radiant flux
10
5
2
1
0.5
10
1
0.2
0.1
-25
0
25
50
75
0.1
100
0.1
Ambient temperature Ta (°C)
10
Fig. 10 Relative Collector Current vs.
Distance (Detector: PT4800)
Ta = 25°C
5
100
IF = 20 mA
Ta = 25°C
2
1
Relative collector current (%)
Radiant flux Φe (mW)
100
Distance to detector (mm)
Fig. 8 Radiant Flux vs. Forward Current
10
1
Pulse
(Pulse width
≤ 100 µs)
0.5
DC
0.2
0.1
0.05
0.02
0.01
1
10
100
10
1
1,000
0.1
Forward current IF (mA)
0.1
1
10
100
Distance to detector (mm)
Sheet No.: D1-A01001EN
5
GL4800E0000F
■ Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% degradation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Soldering Instructions
1. Sharp recommends not soldering this part using preheat or solder reflow methods.
2. If hand soldering, use temperatures ≤ 260°C for ≤ 3 seconds.
3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the
solder, the pad, and the circuit board.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process.
Storage and Handling
1. Sharp recommends storing these parts between 5°C and 30°C, at a relative humidity of less than 60%.
2. After breaking the package seal, Sharp recommends maintaining the environment within 5° to 30°C, at a relative
humidity of less than 60%.
■ Packing Specifications
1.
2.
3.
4.
Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.
Bags are secured in a box as shown in illustration on page 7.
Product mass: 0.07 g (approximately)
Sharp guarantees the following:
a. Missing parts will not make up more than 0.1% of the total quantity.
b. Parts will be easily removed from the packing.
Sheet No.: D1-A01001EN
6
GL4800E0000F
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
• Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese:
)
Toxic and Hazdardous Substances
Category
Infrared Emitting Diode
Lead (Pb) mercury (Hg) Cadmium (Cd)
✓
✓
✓
Hexavalent
chromiun (Cr6+)
Polybrominated
biphenyls (PBB)
Polybrominated
diphenyl ethers
(PBDE)
✓
✓
✓
NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
Sheet No.: D1-A01001EN
7
GL4800E0000F
■ Package Specification
Inner packing
Product (1,000 pieces)
Vinyl bag
NOTES:
1. Inner packing material : Vinyl bag (Polyethylene)
2. Quantity: 1,000 pieces/bag
Outer packing
Cushioning material (2 sheets)
Vinyl bag with products (2 bags)
Cushioning material (2 sheets)
Packing case
Cellophane tape
Model No., Quantity, and Lot No.
NOTES:
1. Outer material : Packing case (Corrugated cardboard),
Cushioning material (Urethane), Cellophane tape
2. Quantity: 5,000 pieces/box
3. Regular packaged mass: Approximately 460 g
4. Indication: Model No., quantity, and Lot No.
Sheet No.: D1-A01001EN
8
GL4800E0000F
■ Important Notices
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, structure, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: D1-A01001EN
9
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