Material Content Data Sheet Sales Product Name IPD60R520C6 Issued MA# MA001348740 Package PG-TO252-3-341 20. April 2015 Weight* 388.82 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-22-4 7440-31-5 7439-92-1 3.425 0.88 0.248 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.88 8809 8809 639 0.075 0.02 248.124 63.82 63.90 638141 192 638972 0.429 0.11 0.11 1103 1103 0.388 0.10 997 11.755 3.02 117.030 30.10 33.22 300986 30232 332215 3.787 0.97 0.97 9739 9739 0.515 0.13 0.13 1325 1325 0.076 0.02 0.061 0.02 2.910 0.75 196 157 0.79 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7484 7837 1000000