HD74LS26 Quadruple 2-input High-voltage Interface Positive NAND Gates REJ03D0402–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS26P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS26FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2A 4 11 4Y 2B 5 10 3B 2Y 6 9 3A GND 7 8 3Y (Top view) Circuit Schematic (1/4) VCC 20k 8k Inputs A Output Y B 4.5k GND Rev.2.00, Feb.18.2005, page 1 of 3 HD74LS26 Absolute Maximum Ratings Item Symbol VCC VIN PT Tstg Supply voltage Input voltage Power dissipation Storage temperature Ratings 7 7 400 –65 to +150 Unit V V mW °C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output voltage Output current Operating temperature Symbol VCC VOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 15 8 75 Unit V V mA °C Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Output voltage Input current Symbol VIH VIL VOL IIH IIL II Output current IOH Supply current ICCH ICCL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C min. 2.0 typ.* — max. — Unit V — — — — — — 0.8 0.4 0.5 V — — — — — — — — — — 20 –0.4 0.1 50 1 µA mA mA µA mA — — — 0.8 2.4 — 1.6 4.4 –1.5 mA mA V V Condition IOL = 4 mA IOL = 8 mA VCC = 4.75 V, VIH = 2 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VOH = 12 V VCC = 4.75 V, VIL = 0.8 V VOH = 15 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL min. — — typ. 17 15 max. 32 28 Unit ns ns Condition CL = 15 pF, RL = 2 kΩ Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 2 of 3 HD74LS26 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.2.00, Feb.18.2005, page 3 of 3 8° 0.50 1 0.70 1.15 0.90 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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