MAS MAS9283AHTG00 Ic for 10.00 - 56.00 mhz vcxo Datasheet

DA9283.006
13 July 2006
MAS9283
IC FOR 10.00 – 56.00 MHz VCXO
This is preliminary information on a new
product under development. Micro Analog
Systems Oy reserves the right to make any
changes without notice.
Low Power
Wide Supply Range
CMOS (Square Wave) Output
Very Low Phase Noise
Low Cost
Divider Function
•
•
•
•
•
•
DESCRIPTION
MAS9283 is an integrated circuit well suited to
build a VCXO for telecommunication and other
FEATURES
•
•
•
•
•
applications. To build a VCXO only one additional
component, a crystal, is needed.
APPLICATIONS
Very small size
Minimal current consumption
Wide operating temperature range
Phase noise < -130 dBc/Hz at 1 kHz offset
CMOS (Square wave) output
•
•
•
VCXO for telecommunications systems
VCXO for set-top boxes
VCXO for MPEG
BLOCK DIAGRAM
Figure 1. Block diagram of MAS9283.
1 (14)
DA9283.006
13 July 2006
PIN DESCRIPTION
Pin Description
Crystal Oscillator Output
Voltage Control Input
Power Supply Ground
Crystal/Varactor Oscillator Input
Output Buffer Power Down Control
Power Supply Voltage
Buffer Output
Symbol
x-coordinate
y-coordinate
X2
VC
VSS
X1
PD
VDD
OUT
186
372
543
149
330
500
919
142
142
142
920
920
920
920
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location. However, the distances between pads are
accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Supply Voltage
Input Pin Voltage
Power Dissipation (max)
Storage Temperature
ESD Rating
VDD - VSS
Conditions
PMAX
TST
Min
Max
Unit
-0.3
VSS -0.3
5.5
VDD + 0.3
100
150
2
V
V
mW
o
C
kV
-55
HBM
Note
RECOMMENDED OPERATION CONDITIONS
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Note
Supply Voltage
VDD
2.5
3.3
5.3
V
1)
2.5
IDD
TOP
3.3
3.2
4.0
Supply Current
Operating Temperature
Voltage Control Line
Impedance
Crystal Pulling Sensitivity
Crystal Load Capacitance
For 3.3 V / 5.0 V
versions
For 3.3 V versions
VDD = 2.8 V
30
10
ppm/pF
pF
-40
ZVC,LINE
S
CL
1
mA
o
C
MΩ
VC = 1.65 V
+85
1, 2)
3)
4)
Note 1: It is recommended to connect a 1 nF capacitor between the VDD and VSS pins.
Note 2: For 3.3 V versions MAS9283AA-AE, MAS9283AN-AR.
Note 3: Value at 15MHz. At 40MHz IDD is typically 5.8 mA.
Note 4: MAS9283AG – AL has a typical crystal load capacitance of 8.5 pF when VC = 2.5 V. MAS9283AT – AX
has a typical crystal load capacitance of 9 pF when VC = 2.5 V.
2 (14)
DA9283.006
13 July 2006
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Min
Crystal Frequency Range
fo
Voltage Control Range
VC
Typ
Max
Unit
Note
10.00
56
MHz
1)
0
VDD
V
Voltage Control Sensitivity
MAS9283AN – AR
VCSENS
90
ppm/V
Voltage Control impedance
ZVC
1.3
MΩ
Output Current (VDD = 3 V)
MAS9283 (RL=10kΩ)
MAS9283 (RL=1 kΩ)
MAS9283 (RL=250Ω)
MAS9283 (RL=50Ω)
Output Current (VDD = 5 V)
MAS9283 (RL=10kΩ)
MAS9283 (RL=1 kΩ)
MAS9283 (RL=250Ω)
MAS9283 (RL=50Ω)
Rise and Fall Time (10 - 50 pF)
IOUT
Output Buffer
Enabled
Disabled
mA
0.3
3.2
12.1
42.6
mA
IOUT
0.5
4.9
18.7
42.6
Output Symmetry
Startup Time
2)
45
TSTART
48-52
10
ns
55
%
2
1.6
0
ms
VDD
0.55
V
3)
Note 1: An RS < 15 Ω crystal provides 56 MHz maximum frequency (i.e. negative resistance typically 30 Ω). With
an RS = 70 Ω crystal the maximum frequency is typically 40 MHz (i.e. negative resistance typically 110 Ω).
Note 2: VC sensitivity value depends on the crystal used. With a 30 ppm/pF crystal typical values are
MAS9283AN – AR > 90 ppm/V, MAS9283AA – AE > 75 ppm/V, MAS9283AG – AL > 60 ppm/V,
MAS9283AT – AX > 50 ppm/V.
Note 3: If the PD pin is floating the output buffer is active. Oscillator is always running.
IC OUTLINES
Figure 2. IC outline of MAS9283.
Note 1: MAS9283 pads are round with 80 µm diameter at opening.
Note 2: Die map reference is the actual left bottom corner of the sawn chip.
3 (14)
DA9283.006
13 July 2006
EXTERNAL COMPONENT SELECTION
MAS9283 requires a minimum number of external components for proper operation.
Quartz Crystal
The MAS9283 VCXO function consists of the
external crystal and the integrated VCXO oscillator
circuit. To assure the best system performance
(frequency pull range) and reliability, a crystal
device with the recommended parameters (shown
below) must be used, and the layout guidelines in
the following section must be followed. The
frequency of the oscillation of a quartz crystal is
determined by its “cut” and by the load capacitors
connected to it. MAS9283 incorporates on-chip
variable load capacitors that “pull” (change) the
frequency of the crystal. The crystal specified for
use with the MAS9283 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is 10 pF. See Note 3 on page 2 for
other capacitance options.
The external crystal must be connected as close to the chip as possible and should be on the same side
of the PCB as the MAS9283. There should be no vias between the crystal pins and the X1 and X2 device
pins. There should be no signal traces underneath or close to the crystal.
Recommended Crystal Parameters:
Parameter
Symbol
Typ
Unit
Initial Accuracy at 25°C
±20
ppm
Temperature Stability
Crystal Load Capacitance
CL
±30
10
ppm
pF
Crystal Shunt Capacitance (Typical)
C0
2
pF
C0/C1 Ratio (Typical)
Note
1)
≤ 300
Note 1. If the crystal with a load other than 10 pF is used with MAS9283, the crystal has to have frequency offset
in order to have the nominal frequency at VC = 1.65 V. Please see table below for offset frequencies vs. crystal
load. (Values are for a typical crystal with S = 30 ppm/pF.)
Parameter
Unit
Crystal frequency
27
27
27
27
MHz
Crystal load
Offset / ppm (MAS9283AA – AE, AN – AR, VC=1.65 V)
8
+30
9
0
12.5
-105
15
-180
pF
0
-30
-135
-210
Offset / ppm (MAS9283AG – AR, VC= 2.5V)
For example:
When the desired nominal frequency of the application and the crystal load are 27.00 MHz and 12.5 pF, the
crystal nominal frequency has to be,
 27.00 MHz 


27.00 MHz + 
×
(
−
105
)
 = 26.997165 MHz .

10 6



4 (14)
DA9283.006
13 July 2006
VOLTAGE CONTROL SENSITIVITY
MAS9283AA, MAS9283AG and MAS9283AN Voltage control sensitivity graphs have been measured by using
26.996220MHz crystal (CL 14.6pF, C1 17.0fF, C0 3.9pF). For offset see note 1 page 4.
Frequency change (ppm)
MAS9283AA, AG, AN VC-sensitivity with 27MHz output.
270
250
230
210
190
170
150
130
110
90
70
50
30
10
-10
-30
-50
-70
-90
-110
-130
-150
-170
-190
-210
MAS9283AA
MAS9283AG
MAS9283AN
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
VC-voltage (V)
Figure 3. Control voltage sensitivity of MAS9283.
5 (14)
DA9283.006
13 July 2006
MODULATION RESPONSE
MAS9283AA Modulation Response
2,00
0,00
Gain (dB)
-2,00
-4,00
-6,00
-8,00
-10,00
0,1
1
10
100
Frequency (kHz)
Figure 4. Modulation response of MAS9293.
3dB point is typically at 20.4 kHz. Measurement has been done using typical modulation connection described
below.
MODULATION MEASUREMENT
Figure 5. Modulation response measurement setup.
6 (14)
DA9283.006
13 July 2006
SAMPLES IN SB20 DIL PACKAGE
X2 1
20
2
19
X1 3
18 PD
4
17
MAS9283
YYWW
XXXXX.X
VC 5
VSS 6
16 VDD
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
15
7
14
8
13
9
12
11 OUT
10
DEVICE OUTLINE CONFIGURATION
pin 1
X1
9283
AX
VSS
YWW
VC
X2
PD
Top View
VDD
OUT
A = product version
X = MAS internal code
Y = year
WW= week
MSOP8/TSSOP8
7 (14)
DA9283.006
13 July 2006
PACKAGE (MSOP-8) OUTLINE
Gage plane
F
E1 E
Land
Pattern
Recommendation
P
R
A
Q
L
A
R1
N
e
c
D
G
A2
c1
M
b1
(b)
A
A1
Section A - A
b
Symbol
Min
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
(Terminal length for
soldering)
M
N
P
Q
R
R1
0
0.75
0.22
0.22
0.08
0.08
0.40
Nom
0.85
0.30
3.00 BSC
4.90 BSC
3.00 BSC
0.65 BSC
4.8
0.65
0.60
Max
Unit
1.10
0.15
0.95
0.38
0.33
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.80
0.41
1.02
0°
mm
mm
8°
0.25 BSC
0.07
0.07
mm
mm
mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
All measurement according to JEDEC standard MO-187.
8 (14)
DA9283.006
13 July 2006
PACKAGE (TSSOP-8) OUTLINE
e/2
A
VIEW B-B
b
E
E1
12° REF
c1
c
S
R
b1
INDEX AREA
GAUGE PLANE
0°-8°
e
A
L
0.25
12° REF
L1
D
A
A2
B
B
A1
VIEW A-A
b
MS/ 21.11.2001
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
R
S
-0.05
0.85
0.19
0.19
0.09
0.09
2.90
--0.90
-0.22
--3.00
6.4 BSC
4.40
0.65 BSC
0.60
1.00 REF
-0.20
1.10
0.15
0.95
0.30
0.25
0.20
0.16
3.10
0.75
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
---
mm
mm
4.30
0.50
0.09
--
4.50
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-153.
9 (14)
DA9283.006
13 July 2006
SOLDERING INFORMATION
◆ For Eutectic Sn/Pb
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Moisture Sensitivity Level (MSL)
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
1
◆ For Pb-Free
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Moisture Sensitivity Level (MSL)
260°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
1
10 (14)
DA9283.006
13 July 2006
EMBOSSED TAPE SPECIFICATIONS (MSOP-8)
P1
T
DO
PO
P2
E
W
F
BO
A
AO
KO
D1
Section A-A
User Direction of Feed
Pin 1 Designator
Dimension
Min/Max
Unit
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 +0.30/-0.10
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
11 (14)
DA9283.006
13 July 2006
REEL SPECIFICATIONS (MSOP-8)
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
5000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
Weight
Leader
Components
Min
1.5
12.80
20.2
50
12.4
Max
Unit
330
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
14.4
18.4
160
390,
of which minimum 160
mm of empty carrier tape
sealed with cover tape
1500
g
12 (14)
DA9283.006
13 July 2006
ORDERING INFORMATION
Product Code
Recommended
Supply Voltage
Output
Frequency
Pulling range
0 V < VC < 3.3 V
Package
MAS9283AATG00
IC FOR 3.3 V VCXO
fo
> 250 ppm
MAS9283AASM06
IC FOR 3.3 V VCXO
fo
> 250 ppm
MAS9283AASN06
IC FOR 3.3 V VCXO
fo
> 250 ppm
MAS9283ABTG00
IC FOR 3.3 V VCXO
fo/2
> 250 ppm
MAS9283ACTG00
IC FOR 3.3 V VCXO
fo/4
> 250 ppm
MAS9283ADTG00
IC FOR 3.3 V VCXO
fo/8
> 250 ppm
MAS9283AETG00
IC FOR 3.3 V VCXO
fo/16
> 250 ppm
MAS9283AGTG00
fo
> 200 ppm
fo
> 200 ppm
fo
> 200 ppm
fo/2
> 200 ppm
fo/4
> 200 ppm
fo/8
> 200 ppm
fo/16
> 200 ppm
MAS9283ANTG00
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 V VCXO
fo
> 300 ppm
MAS9283ANSN06
IC FOR 3.3 V VCXO
fo
> 300 ppm
MAS9283APTG00
IC FOR 3.3 V VCXO
fo/2
> 300 ppm
MAS9283AQTG00
IC FOR 3.3 V VCXO
fo/4
> 300 ppm
MAS9283ARTG00
IC FOR 3.3 V VCXO
fo/8
> 300 ppm
MAS9283ATTG00
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
IC FOR 3.3 / 5.0 V
VCXO
fo
> 165 ppm
fo/2
> 165 ppm
fo/4
> 165 ppm
fo/8
> 165 ppm
fo/16
> 165 ppm
EWS tested wafers
215 µm
MSOP-8, T&R/5000
pcs/r.
MSOP-8, T&R/5000
pcs/r. Pb free RoHS
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
MSOP-8, T&R/5000
pcs/r.
MSOP-8, T&R/5000
pcs/r. Pb free RoHS
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
MSOP-8, T&R/5000
pcs/r. Pb free, RoHS
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
EWS tested wafers
215 µm
MAS9283AGSM06
MAS9283AGSN06
MAS9283AHTG00
MAS9283AJTG00
MAS9283AKTG00
MAS9283ALTG00
MAS9283AUTG00
MAS9283AVTG00
MAS9283AWTG00
MAS9283AXTG00
Contact Micro Analog Systems Oy for other wafer thickness, Power Down logic options and versions in MSOP8
and TSSOP8 packages.
Note 1: Typical Vc Sensitivity values with a 30 ppm/pF crystal.
Note 2: In Recommended Supply Voltage column voltage version is maximum optimized Voltage Control (VC)
value.
13 (14)
DA9283.006
13 July 2006
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
14 (14)
Similar pages