IRF HFB20HJ20C Ultrafast, soft recovery diode Datasheet

PD - 94169A
HFB20HJ20C
HEXFRED
Ultrafast, Soft Recovery Diode
TM
Features
•
•
•
•
•
VR = 200V
Reduced RFI and EMI
Reduced Snubbing
Extensive Characterization of Recovery Parameters
Hermetic
Surface Mount
IF(AV) = 20A
trr = 20ns
Description
TM
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies
the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber
in most applications. These devices are ideally suited for power converters, motors drives and other applications
where switching losses are significant portion of the total losses.
Absolute Maximum Ratings
Parameter
VR
IF(AV)
IFSM
PD @ TC = 25°C
TJ, TSTG
Cathode to Anode Voltage ( Per Leg )
Continuous Forward Current, Q TC = 85°C
Single Pulse Forward Current, R TC = 25°C ( Per Leg)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Max.
Units
200
20
125
28
-55 to +150
V
A
W
°C
Note: Q D.C. = 50% rect. wave
R 1/2 sine wave, 60 Hz , P.W. = 8.33 ms
CASE STYLE
(ISOLATED BASE)
ANODE
COMMON
CATHODE
ANODE
SMD-0.5
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5/08/01
HFB20HJ20C
Electrical Characteristics ( Per Leg ) @ TJ = 25°C (unless otherwise specified)
Parameter
VBR
Cathode Anode Breakdown Voltage
VF
Min. Typ. Max. Units
V
Test Conditions
200
—
—
IR = 100µA
Forward Voltage
—
—
1.26
See Fig. 1
—
—
1.11
—
—
1.30
IF = 20A, TJ = 25°C
—
—
0.96
IF = 10A, TJ = 125°C
IF = 10A, TJ = -55°C
V
IF = 10A, TJ = 25°C
See Fig. 2
IR
Reverse Leakage Current
See Fig. 2
—
—
—
—
10
1.0
µA
mA
VR = VR Rated
VR = VR Rated, TJ = 125°C
CT
Junction Capacitance, See Fig. 3
—
—
20
pF
VR = 200V
LS
Series Inductance
—
4.8
—
nH
Measured from center of cathode pad
to center of anode pad
Dynamic Recovery Characteristics ( Per Leg )@ TJ = 25°C (unless otherwise specified)
Parameter
t rr
trr1
trr2
IRRM1
IRRM2
Q rr1
Q rr2
di(rec)M/dt1
di(rec)M/dt2
Min.
Reverse Recovery Time
Reverse Recovery Time
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During tb
—
—
—
—
—
—
—
—
—
Typ. Max. Units
—
27
42
3.5
5.5
54
120
640
850
20
—
—
—
—
—
—
—
—
Test Conditions
ns
ns
IF = 1.0A,VR = 30V, dif/dt = 200A/µs
TJ = 25°C See Fig.
TJ = 125°C
5
IF = 20A
TJ = 25°C See Fig.
A
A
TJ = 125°C
6
VR = 160V
TJ = 25°C See Fig.
nC
TJ = 125°C
7
dif/dt = 200A/µs
nC
TJ = 25°C See Fig.
A/µs
8
A/µs TJ = 125°C
Thermal - Mechanical Characteristics
Parameter
RthJC
Wt
2
Junction-to-Case, Single Leg Conducting
Weight
Typ.
Max.
Units
—
1.0
4.5
—
°C/W
g
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HFB20HJ20C
100
100
125°C
Reverse Current - I R (µA)
100°C
1
75°C
0.1
25°C
0.01
0.001
0.0001
1E-005
0
50
100
150
200
Reverse Voltage - V R (V)
10
Fig. 2 - Typical Reverse Current Vs. Reverse
Voltage ( Per Leg )
100
Junction Capacitance - C T (pF)
Instantaneous Forward Current - I F (A)
10
Tj = 125°C
Tj = 25°C
Tj = -55°C
T J = 25°C
1
0.0
0.4
0.8
1.2
10
1.6
0
50
Forward Voltage Drop - V F (V)
100
150
200
Reverse Voltage - VR (V)
Fig. 1 - Maximum Forward Voltage Drop Vs.
Instantaneous Forward Current ( Per Leg )
Fig. 3 - Typical Junction Capacitance Vs.
Reverse Voltage ( Per Leg )
Thermal Response (Z thJC )
10
D = 0.50
1
0.20
0.10
0.05
0.02
0.01
0.1
0.01
0.00001
P DM
SINGLE PULSE
(THERMAL RESPONSE)
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = P DM x Z thJC + TC
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics ( Per Leg )
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HFB20HJ20C
50
100
IF = 40A
40
IF = 20A
IF = 20A
30
20
IRRM - ( A )
trr - ( ns )
IF = 10A
IF = 40A
IF = 10A
10
VR = 160V
VR = 160V
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
10
1
100
1000
100
1000
dif / dt - ( A / µs )
dif / dt - ( A / µs )
Fig. 5 - Typical Reverse Recovery Vs. dif/dt,( Per Leg)
1000
Fig. 6 -Typical Recovery Current Vs. dif/dt ( Per Leg)
10000
IF = 40A
IF = 10A
di ( rec )M / dt - ( A / µs )
IF = 20A
Qrr - ( nC )
IF = 10A
100
VR = 160V
IF = 20A
IF = 40A
1000
VR = 160V
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
10
100
100
1000
dif / dt - ( A / µs )
Fig. 7 - Typical Stored Charge Vs. dif/dt ( Per Leg)
4
100
1000
dif / dt - ( A / µs )
Fig. 8 - Typical di(rec)M/dt Vs. dif/dt ( Per Leg )
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HFB20HJ20C
3
t rr
IF
R E V E R S E R E C O V E R Y C IR C U IT
tb
ta
0
Q rr
V R = 2 00 V
2
I RRM
4
0.5 I R R M
di(rec)M /dt
0.01 Ω
0.75 I R R M
L = 70µH
1
D .U .T.
D
d if/d t
A D JU S T
G
5
IR F P 2 50
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
di f /dt
1. dif/dt - Rate of change of current
through zero crossing
2. IRRM - Peak reverse recovery current
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
4. Qrr - Area under curve defined by trr
and IRRM
trr X IRRM
Qrr =
2
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Case Outline and Dimensions — SMD-0.5
HEXFRED DOUBLE DIE
1 = COMMON CATHODE
2 = ANODE 1
3 = ANODE 2
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 05/01
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