TI CY74FCT574ATSOCTG4 8-bit registers with 3-state output Datasheet

CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
D
D
D
D
D
D
D
D
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
O0
O1
O2
O3
O4
O5
O6
O7
CP
CY54FCT574T . . . L PACKAGE
(TOP VIEW)
D2
D3
D4
D5
D6
O0
D
OE
D0
D1
D2
D3
D4
D5
D6
D7
GND
OE
VCC
D
CY54FCT574T . . . D PACKAGE
CY74FCT574T . . . Q OR SO PACKAGE
(TOP VIEW)
D1
D0
D
Function, Pinout, and Drive Compatible
With FCT and F Logic
Reduced VOH (Typically = 3.3 V) Versions
of Equivalent FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
Ioff Supports Partial-Power-Down Mode
Operation
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Edge-Triggered D-Type Inputs
250-MHz Typical Switching Rate
CY54FCT574T
– 32-mA Output Sink Current
– 12-mA Output Source Current
CY74FCT574T
– 64-mA Output Sink Current
– 32-mA Output Source Current
3-State Outputs
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
O1
O2
O3
O4
O5
D7
GND
CP
O7
O6
D
description
The ’FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for
each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and
output-enable (OE) inputs are common to all flip-flops. The ’FCT574T are identical to ’FCT374T, except for a
flow-through pinout to simplify board design. The eight flip-flops in the ’FCT574T store the state of their
individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When
OE is low, the contents of the eight flip-flops are available at the outputs. When OE is high, the outputs are in
the high-impedance state. The state of OE does not affect the state of the flip-flops.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
ORDERING INFORMATION
SPEED
(ns)
PACKAGE†
TA
QSOP – Q
Tape and reel
5.2
CY74FCT574CTQCT
Tube
5.2
CY74FCT574CTSOC
Tape and reel
5.2
CY74FCT574CTSOCT
Tape and reel
6.5
CY74FCT574ATQCT
Tube
6.5
CY74FCT574ATSOC
Tape and reel
6.5
CY74FCT574ATSOCT
Tape and reel
10
CY74FCT574TQCT
Tube
10
CY74FCT574TSOC
Tape and reel
10
CY74FCT574TSOCT
CDIP – D
Tube
6.2
CY54FCT574CTDMB
CDIP – D
Tube
7.2
CY54FCT574ATDMB
SOIC – SO
QSOP – Q
–40°C to 85°C
SOIC – SO
QSOP – Q
SOIC – SO
–55°C to 125°C
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
FCT574C
FCT574C
FCT574A
FCT574A
FCT574
FCT574
LCC – L
Tube
7.2
CY54FCT574ATLMB
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OE
OUTPUT
O
↑
L
H
↑
L
L
X
H
Z
D
CP
H
L
X
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance state,
↑ = Low-to-high clock transition
logic diagram (positive logic)
OE
CP
1
11
C1
D0
2
1D
Q
To Seven Other Channels
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
O0
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
CY54FCT574T
CY74FCT574T
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
V
High-level output current
–12
–32
mA
IOL
TA
Low-level output current
32
64
mA
85
°C
High-level input voltage
2
Operating free-air temperature
–55
2
125
–40
V
V
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
CY54FCT574T
TYP†
MAX
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.75 V,
IIN = –18 mA
IIN = –18 mA
VCC = 4.5 V,
IOH = –12 mA
IOH = –32 mA
VCC = 4
4.75
75 V
MIN
–0.7
–1.2
–0.7
2.4
2.4
Vhys
All inputs
II
VCC = 5.5 V,
VCC = 5.25 V,
VIN = VCC
VIN = VCC
5
IIH
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 2.7 V
VIN = 2.7 V
±1
IIL
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 0.5 V
VIN = 0.5 V
±1
VCC = 0 V,
VCC = 5.5 V,
VOUT = 4.5 V
VOUT = 0 V
VCC = 5.25 V,
VCC = 5.5 V,
VOUT = 0 V
VIN = 2.7 V
VCC = 5.25 V,
VCC = 5.5 V,
VIN = 2.7 V
VIN = 0.5 V
VCC = 5.25 V,
VCC = 5.5 V,
VIN = 0.5 V
VIN ≤ 0.2 V,
IOZH
IOZL
ICC
∆ICC
0.3
3.3
0.55
IOL = 64 mA
0.3
0.2
0.55
0.2
±1
±1
±1
–120
±1
–225
–60
–120
–225
10
10
–10
–10
VIN ≥ VCC – 0.2 V
VCC = 5.25 V,
VIN ≤ 0.2 V,
VIN ≥ VCC – 0.2 V
VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open
VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open
0.1
0.5
V
V
5
–60
V
V
2
IOH = –15 mA
IOL = 32 mA
VCC = 4.5 V,
VCC = 4.75 V,
IOS‡
–1.2
UNIT
3.3
VOL
Ioff
CY74FCT574T
TYP†
MAX
MIN
µA
µA
µA
µA
mA
µA
µA
0.2
0.1
0.2
0.5
2
2
mA
mA
† Typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or
sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, IOS tests should be performed last.
§ Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER
ICCD¶
CY54FCT574T
TYP†
MAX
TEST CONDITIONS
MIN
VCC = 5.5 V, Outputs open,
One bit switching at 50% duty cycle, OE = GND,
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
VCC = 5.25 V, Outputs open,
One bit switching at 50% duty cycle, OE = GND,
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
VCC = 5.5 V,
f0 = 10 MHz,,
Outputs open,
OE = GND
IC
VCC = 5.25 V,
f0 = 10 MHz,,
Outputs open,
OE = GND
0.06
CY74FCT574T
TYP†
MAX
MIN
UNIT
0.12
mA/
MHz
0.06
0.12
One bit
switching
at f1 = 5 MHz
at 50% duty
cycle
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
0.7
1.4
VIN = 3.4 V or GND
1.2
3.4
Eight bits
switching
at f1 = 2.5 MHz
at 50% duty
cycle
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
1.6
3.2||
VIN = 3.4 V or GND
3.9
12.2||
One bit
switching
at f1 = 5 MHz
at 50% duty
cycle
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
0.7
1.4
VIN = 3.4 V or GND
1.2
3.4
Eight bits
switching
at f1 = 2.5 MHz
at 50% duty
cycle
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
1.6
3.2||
VIN = 3.4 V or GND
3.9
12.2||
mA
Ci
5
10
5
10
pF
Co
9
12
9
12
pF
† Typical values are at VCC = 5 V, TA = 25°C.
¶ This parameter is derived for use in total power-supply calculations.
# IC
= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
IC
= Total supply current
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH
= Duty cycle for TTL inputs high
NT
= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0
= Clock frequency for registered devices, otherwise zero
f1
= Input signal frequency
N1
= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY54FCT574T
MIN
MAX
CY54FCT574AT
MIN
MAX
CY54FCT574CT
MIN
MAX
UNIT
tw
tsu
Pulse duration, CP high or low
7
6
6
ns
Setup time, data before CP↑
2
2
2
ns
th
Hold time, data after CP↑
1.5
1.5
1.5
ns
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY74FCT574T
MIN
MAX
CY74FCT574AT
MIN
MAX
CY74FCT574CT
MIN
MAX
UNIT
tw
tsu
Pulse duration, CP high or low
7
5
5
ns
Setup time, data before CP↑
2
2
2
ns
th
Hold time, data after CP↑
1.5
1.5
1.5
ns
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
CP
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
CY54FCT574T
CY54FCT574AT
CY54FCT574CT
MIN
MAX
MIN
MAX
MIN
MAX
2
11
2
7.2
2
6.2
2
11
2
7.2
2
6.2
1.5
14
1.5
7.5
1.5
6.2
1.5
14
1.5
7.5
1.5
6.2
1.5
8
1.5
6.5
1.5
5.7
1.5
8
1.5
6.5
1.5
5.7
UNIT
ns
ns
ns
switching characteristics over operating free-air temperature range (see Figure 1)
6
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
CP
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
POST OFFICE BOX 655303
CY74FCT574T
CY74FCT574AT
CY74FCT574CT
MIN
MAX
MIN
MAX
MIN
MAX
2
10
2
6.5
2
5.2
2
10
2
6.5
2
5.2
1.5
12.5
1.5
6.5
1.5
5.5
1.5
12.5
1.5
6.5
1.5
5.5
1.5
8
1.5
5.5
1.5
5
1.5
8
1.5
5.5
1.5
5
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
CY54FCT574T, CY74FCT574T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS073 – OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7V
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
Open
TEST
GND
CL = 50 pF
(see Note A)
500 Ω
S1
500 Ω
S1
Open
7V
Open
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
tsu
3V
1.5 V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9222203M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9222203MRA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
5962-9222205MRA
ACTIVE
CDIP
J
20
1
TBD
CY54FCT574ATLMB
ACTIVE
LCCC
FK
20
1
TBD
CY74FCT574ATQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574ATQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574ATQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574ATSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574ATSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574ATSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574ATSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574ATSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574ATSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574CTQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574CTQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574CTSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574CTSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574TQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574TQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574TQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT574TSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT574TSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CY74FCT574TSOCG4
ACTIVE
SOIC
DW
20
CY74FCT574TSOCT
ACTIVE
SOIC
DW
CY74FCT574TSOCTE4
ACTIVE
SOIC
CY74FCT574TSOCTG4
ACTIVE
SOIC
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CY74FCT574ATQCT
Package Package Pins
Type Drawing
SSOP/
QSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT574ATSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT574CTQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT574CTSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT574TQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT574TSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CY74FCT574ATQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT574ATSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT574CTQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT574CTSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT574TQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT574TSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
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