HLMP-ADxx/AGxx/ALxx/BDxx/BGxx/BLxx 5mm mini Oval Precision Optical Performance AlInGaP Lamps Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern (35° x 70°) and high luminous intensity ensure that these devices are excellent for wide field of view outdoor application where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. • Well defined spatial radiation pattern High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP) for amber and red. Each lamp is made with an advance optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. Designers can select parallel or perpendicular orientation. Both lamps are available in tinted version. Benefits • Viewing angle designed for wide field of view application • Superior performance in outdoor environments • Viewing angles: Major axis 70° Minor axis 35° • High luminous output • Red and Amber intensity are available for: AlInGaP (Bright) AlInGaP II (Brightest) • Colors: 626 nm red 630 nm red 590 nm amber 592 nm amber • Superior resistance to moisture • UV resistant epoxy Applications • Full color/video signs Table 1. Device Selection Guide for AlInGaP II Part Number Color and Dominant Wavelength ld (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Stand-Off Leadframe Orientation Package Drawing HLMP-AD06-NSTxx Red 630 680 2500 No Parallel A HLMP-AD06-P00xx Red 630 880 No Parallel A HLMP-AD06-P0Txx Red 630 880 No Parallel A HLMP-AD06-PQ0xx Red 630 880 1500 No Parallel A HLMP-AD06-RSTxx Red 630 1500 2500 No Parallel A HLMP-AD06-STTxx Red 630 1900 3200 No Parallel A HLMP-AD16-P00xx Red 630 880 Yes Parallel B HLMP-AD16-QTTxx Red 630 1150 3200 Yes Parallel B HLMP-AD16-RS0xx Red 630 1500 2500 Yes Parallel B HLMP-AD16-RSTxx Red 630 1500 2500 Yes Parallel B HLMP-AD16-RUTxx Red 630 1500 4200 Yes Parallel B HLMP-AD16-ST0xx Red 630 1900 3200 Yes Parallel B HLMP-AD16-STTxx Red 630 1900 3200 Yes Parallel B HLMP-AL16-RSRxx Amber 592 1500 2500 Yes Parallel B HLMP-AL16-RSKxx Amber 592 1500 2500 Yes Parallel B HLMP-BD06-L00xx Red 630 400 No Perpendicular C HLMP-BD06-P00xx Red 630 880 No Perpendicular C HLMP-BD06-RS0xx Red 630 1500 2500 No Perpendicular C HLMP-BD06-RSTxx Red 630 1500 2500 No Perpendicular C HLMP-BD06-STTxx Red 630 1900 3200 No Perpendicular C HLMP-BD16-NP0xx Red 630 680 1150 Yes Perpendicular D HLMP-BD16-QRTxx Red 630 1150 1900 Yes Perpendicular D HLMP-BD16-RU0xx Red 630 1500 4200 Yes Perpendicular D HLMP-BD16-RUTxx Red 630 1500 4200 Yes Perpendicular D HLMP-BD16-ST0xx Red 630 1900 3200 Yes Perpendicular D HLMP-BD16-STTxx Red 630 1900 3200 Yes Perpendicular D HLMP-BL06-N00xx Amber 592 680 No Perpendicular C Table 2. Device Selection Guide for AlInGaP Part Number Color and Dominant Wavelength ld (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. HLMP-AG01-K00xx Red 626 HLMP-AL01-L00xx Amber 590 HLMP-AL01-LP0xx Amber 590 400 HLMP-AL01-N00xx Amber 590 680 HLMP-AL01-NR0xx Amber 590 680 1900 HLMP-AL01-PQKxx Amber 590 880 HLMP-AL11-NR0xx Amber 590 HLMP-BG01-LM0xx Red 626 HLMP-BG01-MN0xx Stand-Off Leadframe Orientation Package Drawing 310 No Parallel A 400 No Parallel A No Parallel A No Parallel A No Parallel A 1150 No Parallel A 880 1900 Yes Parallel B 400 520 No Perpendicular C Red 626 520 680 No Perpendicular C HLMP-BL01-NR0xx Red 626 680 1900 No Perpendicular C HLMP-BL11-KN0xx Red 626 310 880 Yes Perpendicular D HLMP-BL11-NR0xx Red 626 680 1900 Yes Perpendicular D 1150 Part Numbering System HLMP - X X X X - X X X XX Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin 0: No Color Bin Limitation B: Color bin 2 and 3 only K: Color bins 2 and 4 only R: Color Bins 1, 2, 4, and 6 with VF max of 2.6 V S: Color bins 2 and 4 with VF max of 2.6 V T: Red Color with VF max of 2.6 V Maximum Intensity Bin 0: No Iv Bin Limitation Minimum Intensity Bin Tint Option 1 or 6: Matching Color Tints Standoff Option 0: Without 1: With Color D: 630 nm Red G: 626 nm Red L: 590 or 592 nm Amber Package A: 5 mm Mini Oval, Parallel B: 5 mm Mini Oval, Perpendicular Note: Please refer to AB 5337 for complete information on part numbering system. Package Dimensions 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 2.54 ± 0.38 (0.100 ± 0.015) 0.70 (0.028) MAX. A 1.00 MIN. (0.039) CATHODE LEAD 31.60 MIN. (1.244) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.50 ±0.15 (0.059 ± 0.006) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 0.70 (0.028) MAX. 2.54 ± 0.38 (0.100 ± 0.015) B + 0.13 11.70 – 0.08 0.005 (0.461 +– 0.003 ) 1.00 MIN. (0.039) CATHODE LEAD 31.60 MIN. (1.244) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 2.54 ± 0.38 (0.100 ± 0.015) 0.70 (0.028) MAX. C 1.00 MIN. (0.039) CATHODE LEAD 31.60 MIN. (1.244) 8.71 ± 0.20 (0.343 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.50 ±0.15 (0.059 ± 0.006) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 0.70 (0.028) MAX. D CATHODE LEAD 1.00 MIN. (0.039) 31.60 MIN. (1.244) HLMP-ALXX Pkg Dimensions NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS. 3. RECOMMENDED PC BOARD HOLE DIAMETERS: – LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.). – LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS. 2.54 ± 0.38 (0.100 ± 0.015) Absolute Maximum Ratings at TA = 25˚C Parameter Red and Amber DC Forward Current[1] 50 mA Peak Pulsed Forward Current[2] 100 mA Average Forward Current 30 mA Reverse Voltage (IR = 100 µA) 5V Power Dissipation 120 mW LED Junction Temperature 130°C Operating Temperature Range –40°C to +100°C Storage Temperature Range –40°C to +100°C Notes: 1. Derate linearly as shown in figure 4. 2. Duty Factor 30%, Frequency 1kHz. Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Typical Viewing Angle Major Minor 2q1/2 Forward Voltage Red (ld = 626 nm) Red (ld = 630 nm) Option xx0xx Option xxTxx Amber (ld = 590 nm) Amber (ld = 592 nm) Option xx0xx Option xxRxx, xxSxx Reverse Voltage Amber, Red Min. Max. 70 35 VF VR Typ. 5 Units Test Conditions deg V IF = 20 mA 20 V IR = 100 µA 2.0 2.4 2.2 2.3 2.0 2.4 2.6 2.4 2.2 2.3 2.4 2.6 Peak Wavelength Amber (ld = 592 nm) Red (ld = 630 nm) lpeak 594 639 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Amber (ld = 592 nm) Red (ld = 630 nm) ∆l1/2 17 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA C 40 pF Luminous Efficacy Amber (ld = 592 nm) Red (ld = 630 nm) hv 500 155 lm/W Thermal Resistance RQJ-PIN 240 °C/W Capacitance Amber, Red VF = 0, F = 1 MHz Emitted Luminous Power/Emitted Radiant Power at IF = 20 mA LED Junction-toCathode Lead Notes: 1. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/hv where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 6. For Options -xxRxx, -xxSxx and -xxTxx, max. forward voltage (Vf ) is 2.6 V. Refer to Vf bin table. 1 AMBER RELATIVE INTENSITY 0.9 RED 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 650 700 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. 70 CURRENT – mA 60 DC FORWARD CURRENT – mA 50 RED 50 40 AMBER 30 20 10 0 1.0 1.5 2.0 2.5 40 30 20 AMBER 10 RED 0 3.0 0 0.5 VF – FORWARD VOLTAGE – V 1.0 1.5 2.0 2.5 3.0 FORWARD VOLTAGE – V Figure 2a. Amber, red forward current vs. forward voltage. Figure 2b. Forward current vs. forward voltage for option -xxTxx red, and option -xxRxx and -xxSxx amber. HLMP-ALXX fig 3 2.0 IF – FORWARD CURRENT – mA RELATIVE INTENSITY (NORMALIZED AT 20 mA) 2.5 RED 1.5 AMBER 1.0 0.5 0 0 10 20 30 40 50 FORWARD CURRENT – mA Figure 3. Amber, red relative luminous intensity vs. forward current. 50 40 RθJA = 585° C/W 30 RθJA = 780° C/W 20 10 0 0 20 40 60 80 Figure 4. Amber, red maximum forward current vs. ambient temperature. HLMP-ALXX fig 7 100 TA – AMBIENT TEMPERATURE – °C 100 90 90 RELATIVE INTENSITY – % RELATIVE INTENSITY – % 100 80 70 60 50 40 30 20 10 0 50 80 70 60 50 40 30 20 10 40 30 20 10 0 -10 -20 -30 -40 0 50 -50 VERTICAL ANGULAR DISPLACEMENT – DEGREES 40 30 Figure 5. Spatial radiation patternHLMP-ALXX – 35 x 70 degree lamps. fig 8a Intensity Bin Limits (mcd at 20 mA) 20 10 0 -10 -20 -50 Vf Bin Table [2,3] Min. Max. Bin Id Min. Max. K 310 400 VA 2.0 2.2 L 400 520 VB 2.2 2.4 M 520 680 VC 2.4 2.6 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 Tolerance for each bin limit is ±15%. Amber Color Bin Limits (nm at 20 mA) Bin Name Min. Max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 -40 HLMP-ALXX fig 8b Bin Name Tolerance for each bin limit is ± 0.5 nm. -30 HORIZONTAL ANGULAR DISPLACEMENT – DEGREES Notes: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. 2. Vf bin table only available for those numbers with options -xxRxx, -xxSxx, -xxTxx. 3. Tolerance for each bin limit is ± 0.05V Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE Note: Electrical connection AllnGaP Devicebetween bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff. 10 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A O AG IES AV LOG E NO HOD CH CAT E T + DE ANO – ANODE LEAD LEAVES THE BOX FIRST. C R LA THE MO BEL Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 11 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-1903EN AV02-1542EN - September 16, 2008