ESD Array ESDP020604V12B1 Description This specification is applied to protect sensitive electronic circuits from the threat of electrostatic discharge (ESD). The function meets with the requirement of IEC61000-4-2 specification. The extreme low capacitance is suit for HDMI ESD protection application. According to the special property of device, we recommend not to use on such application as: DC/AC power line. Features u RoHS compliant, Lead-Free u Protection against ESD voltages and currents (IEC Equivalent Circuits 61000-4-2 Level 4) u Extremely quick response time (<1ns) present ideal ESD protection 6 u Extremely low capacitance (0.1pF typical) u Extremely low leakage current u u Surface mount device Zero signal distortion 1 2 GND 4 3 GND Pin Identification 1,6 Data Lines 2,5 Data Lines (No Internal Connection) 3,4 Ground Product Model Applications u u u u u 5 u u u u Antenna circuit USB2.0 IEEE-1394 DVI HDMI Digital Video Equipment Mobil Phone GPS Antenna Bluetooth Communication Equipment Electrical Characteristics Characteristic Rate Voltage VDC Leakage Current Trigger Voltage Value (Max) IL 12V (Max) (@12VDC) 0.01μA VT Clamping Voltage 300V Typical VC Capacitance, @1MHz 30V Typical CP 0.1pF Typical Response Time <1ns ESD Voltage Capability, IEC61000-4-2 Contact Discharge Mode 8KV ESD Voltage Capability, IEC61000-4-2 Air Discharge Mode 15KV ESD Withstand Pulses 1000 Typical CP - Device Capacitance measured with 1Vrms SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 1/5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP020604V12B1 Explanation of Part Number ESDP 02 0604 V12 B1 B1, Mode Code Max Rated Voltage VDC, V12=12V Chip Size, 0604 = 0604 (EIA) Channels, 02 = 2 channels Series Type: Polymer ESD Suppressors Construction & Dimensions End termination Unit: mm Ag / Ni / Sn Marking Symbol Spec. L 1.60±0.10 W 1.00±0.10 T 0.55±0.10 B 0.20±0.10 C 0.20±0.05 D 0.50±0.05 P 0.5 P1 1.0 X 0.2 Y 0.7 Z 1.6 G 0.2 Overcoat color: Block Recommended pad outline SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 2/5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP020604V12B1 Temperature Specifications Parameter Value Unit Operating Temperature -55 to +125 °C Storage Temperature --55 to +125 °C 5 to 40 °C <65 %RH 12 Max Month Taping Package Storage Condition Storage Temperature Relative Humidity Storage Time Soldering Parameters Reflow Condition TP Critical Zone TL to TP Ramp-up Pb free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C -Time (min to max) (TS) 60 -180 Seconds TL Pre Heat Temperature TS(max) Ramp-down TS(min) Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max Preheat 25 Time to peak temperature (t 25℃ to peak) Time - Temperature (TL) (Liquidus) +217°C - Time (min to max) (TL) 60 -150 Seconds Reflow Precaution for soldering Precaution for soldering Note that this product will be easily damaged by rapid heating, Peak Temperature (TP) 260 +0/-5°C rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. Time within 5°C of actual peak Temperature (TP) 20-40 Seconds We recommend to take preheating and gradual cooling Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 3/5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP020604V12B1 Packaging Information Carrier Tape Dimensions Unit: mm Packaging method - Products shall be heat-sealed in the chip pocket, spacing Symbol Spec. A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 1.90±0.20 W 1.40±0.20 T 0.75±0.05 pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - Tape material to be paper. - Cover Tape adhesion to be 35±25 grams. Taping Reel Dimensions Unit: mm Taping Specifications There Shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. Quantity of products in the taping package Standard Quantity 5000PCS / Reel Shipping quantity is a multiple of standard quantity SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 4/5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP020604V12B1 HDMI Interface Application HDMI Block Diagram HDMI Source Video HDMI Sink TMDS Channel 0 Video TMDS Channel 1 Audio TMDS Channel 2 Control/Status TMDS Clock Channel Audio Control/Status EDID ROM Display Data Channel (DDC) CEC Line Sink Source Video Video Audio Audio DCC Data1 DCC Data2 Control/status GND GND SOCAY Electronics Co., Ltd. Revision November 08, 2013 Control/status www.socay.com 5/5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information.