TI LMZ14201 Lmz14201 1a simple switcherâ® power module with 42v maximum input voltage Datasheet

LMZ14201
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SNVS649E – JANUARY 2010 – REVISED MARCH 2013
LMZ14201 1A SIMPLE SWITCHER® Power Module with 42V Maximum Input Voltage
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FEATURES
1
•
•
•
2
•
•
•
•
•
•
•
Integrated Shielded Inductor
Simple PCB Layout
Flexible Startup Sequencing Using External
Soft-start and Precision Enable
Protection Against Inrush Currents and Faults
such as Input UVLO and Output Short Circuit
– 40°C to 125°C Junction Temperature Range
Single Exposed Pad and Standard Pinout for
Easy Mounting and Manufacturing
Fast Transient Response for Powering FPGAs
and ASICs
Low Output Voltage Ripple
Pin-to-pin Compatible Family:
– LMZ14203/2/1 (42V Max 3A, 2A, 1A)
– LMZ12003/2/1 (20V Max 3A, 2A, 1A)
Fully Enabled for Webench® Power Designer
APPLICATIONS
•
•
•
•
Point of Load Conversions from 12V and 24V
Input Rail
Time Critical Projects
Space Constrained / High Thermal
Requirement Applications
Negative Output Voltage Applications
(See AN-2027) SNVA425
DESCRIPTION
The LMZ14201 SIMPLE SWITCHER power module
is an easy-to-use step-down DC-DC solution capable
of driving up to 1A load with exceptional power
conversion efficiency, line and load regulation, and
output accuracy. The LMZ14201 is available in an
innovative
package
that
enhances
thermal
performance and allows for hand or machine
soldering.
The LMZ14201 can accept an input voltage rail
between 6V and 42V and deliver an adjustable and
highly accurate output voltage as low as 0.8V. The
LMZ14201 only requires three external resistors and
four external capacitors to complete the power
solution. The LMZ14201 is a reliable and robust
design with the following protection features: thermal
shutdown, input under-voltage lockout, output overvoltage protection, short-circuit protection, output
current limit, and allows startup into a pre-biased
output. A single resistor adjusts the switching
frequency up to 1 MHz.
ELECTRICAL SPECIFICATIONS
•
•
•
•
•
6W Maximum Total Output Power
Up to 1A Output Current
Input Voltage Range 6V to 42V
Output Voltage Range 0.8V to 6V
Efficiency up to 90%
PERFORMANCE BENEFITS
•
•
•
Figure 1. Easy To Use 7 Pin Package
PFM 7 Pin Package
10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)
θJA = 20°C/W, θJC = 1.9°C/W
RoHS Compliant
•
Operates at High Ambient Temperature with
no Thermal Derating
High Efficiency Reduces System Heat
Generation
Low Radiated Emissions (EMI) Complies with
EN55022 Class B Standard
Low External Component Count
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LMZ14201
SNVS649E – JANUARY 2010 – REVISED MARCH 2013
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System Performance
Efficiency VIN = 24V VOUT = 5.0V
100
95
EFFICIENCY (%)
90
85
80
75
70
65
60
55
50
0
0.4
0.2
0.6
0.8
1
OUTPUT CURRENT (A)
Thermal Derating Curve
VIN = 24V, VOUT = 5.0V,
1.2
OUTPUT CURRENT (A)
1
0.8
0.6
0.4
0.2
0
50
60
70
80
90
100 110 120
AMBIENT TEMPERATURE (°C)
Radiated Emissions (EN 55022 Class B)
from Evaluation Board
RADIATED EMISSIONS (dBµV/m)
80.0
70.0
60.0
50.0
EN 55022 CLASS B LIMIT
40.0
30.0
20.0
10.0
0.0
0
200
400
600
800
1000
FREQUENCY (MHz)
2
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Simplified Application Schematic
VOUT
FB
SS
EN
VIN
GND
VIN
RON
LMZ14201
VOUT
RFBT
5V
3.3V
2.5V
1.8V
1.5V
1.2V
0.8V
5.62k
3.32k
2.26k
1.87k
1.00k
4.22k
0
RFBB
1.07k
1.07k
1.07k
1.50k
1.13k
8.45k
39.2k
RON
VIN Range
100k
61.9k
47.5k
32.4k
28.0k
22.6k
24.9k
7.5...42V
6...42V
6...30V
6...25V
6...21V
6...19V
6...18V
VOUT @ 1A
CFF
RON
0.022 PF
RFBT
See Table
Enable
See Table
CIN
CSS
RFBB
10 PF
0.022 PF
See Table
100 PF
Connection Diagram
Exposed Pad
Connect to GND
7
6
5
4
3
2
1
VOUT
FB
SS
GND
EN
RON
VIN
Figure 2. Top View
7-Lead PFM
Pin Descriptions
Pin
Name
Description
1
VIN
Supply input — Nominal operating range is 6V to 42V . A small amount of internal capacitance is contained within the
package assembly. Additional external input capacitance is required between this pin and exposed pad.
2
RON
On Time Resistor — An external resistor from VIN to this pin sets the on-time of the application. Typical values range from
25k to 124k ohms.
3
EN
4
GND
5
SS
Soft-Start — An internal 8 µA current source charges an external capacitor to produce the soft-start function. This node is
discharged at 200 µA during disable, over-current, thermal shutdown and internal UVLO conditions.
6
FB
Feedback — Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation reference
point is 0.8V at this input pin. Connected the feedback resistor divider between the output and ground to set the output
voltage.
7
VOUT
EP
EP
Enable — Input to the precision enable comparator. Rising threshold is 1.18V nominal; 90 mV hysteresis nominal.
Maximum recommended input level is 6.5V.
Ground — Reference point for all stated voltages. Must be externally connected to EP.
Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad.
Exposed Pad — Internally connected to pin 4. Used to dissipate heat from the package during operation. Must be
electrically connected to pin 4 external to the package.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings
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(1) (2)
VIN, RON to GND
-0.3V to 43.5V
EN, FB, SS to GND
-0.3V to 7V
Junction Temperature
150°C
Storage Temperature Range
-65°C to 150°C
ESD Susceptibility (3)
± 2 kV
For soldering specifications:
see product folder at www.ti.com and SNOA549
(1)
(2)
(3)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
Operating Ratings
(1)
VIN
6V to 42V
EN
0V to 6.5V
−40°C to 125°C
Operation Junction Temperature
(1)
4
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
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Electrical Characteristics
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the
following conditions apply: VIN = 24V, Vout = 3.3V
Symbol
Parameter
Conditions
Min
Typ
Max
1.10
1.18
1.25
(1)
(2)
(1)
Units
SYSTEM PARAMETERS
Enable Control (3)
VEN
VEN-HYS
EN threshold trip point
VEN rising
EN threshold hysteresis
VEN falling
SS source current
VSS = 0V
V
90
mV
Soft-Start
ISS
ISS-DIS
5
SS discharge current
8
11
µA
-200
µA
Current Limit
ICL
Current limit threshold
d.c. average
1.4
1.95
3.0
A
ON/OFF Timer
tON-MIN
tOFF
ON timer minimum pulse width
150
ns
OFF timer pulse width
260
ns
Regulation and Over-Voltage Comparator
VFB
VFB-OV
In-regulation feedback voltage
VSS >+ 0.8V
TJ = -40°C to 125°C
IO = 1A
.777
0.798
0.818
V
VSS >+ 0.8V
TJ = 25°C
IO = 10 mA
0.786
0.802
0.818
V
Feedback over-voltage
protection threshold
0.92
V
IFB
Feedback input bias current
5
nA
IQ
Non Switching Input Current
VFB= 0.86V
1
mA
ISD
Shut Down Quiescent Current
VEN= 0V
25
μA
Thermal Shutdown
Rising
165
°C
Thermal shutdown hysteresis
Falling
15
°C
Junction to Ambient (4)
4 layer JEDEC Printed Circuit Board,
100 vias, No air flow
19.3
°C/W
2 layer JEDEC Printed Circuit Board, No
air flow
21.5
°C/W
No air flow
1.9
°C/W
Thermal Characteristics
TSD
TSD-HYST
θJA
θJC
Junction to Case
PERFORMANCE PARAMETERS
ΔVO
(2)
(3)
(4)
8
mV
PP
Line Regulation
VIN = 12V to 42V, IO= 1A
.01
%
ΔVO/IOUT
Load Regulation
VIN = 24V
1.5
mV/A
Efficiency
VIN = 24V VO = 3.3V IO = 1A
92
%
η
(1)
Output Voltage Ripple
ΔVO/ΔVIN
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely parametric norm.
EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test.
θJA measured on a 1.705” x 3.0” four layer board, with one ounce copper, thirty five 12 mil thermal vias, no air flow, and 1W power
dissipation. Refer to PCB layout diagrams
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Typical Performance Characteristics
Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic;
Tambient = 25 C for efficiency curves and waveforms.
Efficiency 6V Input @ 25°C
95
3.3
2.5
1.8
1.5
1.2
0.8
85
80
75
70
65
1.8
1.5
0.2
1.2
0.8
0.15
0.1
60
25°C
0.05
55
50
3.3
2.5
0.25
DISSIPATION (W)
EFFICIENCY (%)
90
Dissipation 6V Input @ 25°C
0.3
100
25°C
0
0
0.2
0.4
0.6
0.8
0
1
0.2
OUTPUT CURRENT (A)
Figure 3.
Efficiency 12V Input @ 25°C
85
80
75
6.0
5.0
0.375
DISSIPATION (W)
90
EFFICIENCY (%)
1
0.8
Dissipation 12V Input @ 25°C
0.45
6.0
5.0
3.3
2.5
1.8
1.5
1.2
0.8
95
70
65
3.3
2.5
0.3
1.8
1.5
0.225
1.2
0.8
0.15
25°C
60
0.075
55
25°C
0
0.2
0.4
0.6
0.8
0
1
0
0.2
OUTPUT CURRENT (A)
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
Figure 5.
Figure 6.
Efficiency 24V Input @ 25°C
Dissipation 24V Input @ 25°C
100
0.7
95
0.6
85
80
DISSIPATION (W)
6.0
5.0
3.3
2.5
1.8
90
EFFICIENCY (%)
0.6
Figure 4.
100
50
0.4
OUTPUT CURRENT (A)
75
70
65
6.0
5.0
3.3
2.5
0.5
0.4
1.8
0.3
0.2
60
0.1
55
50
25°C
0
0.2
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
0
0.2
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
Figure 7.
6
25°C
0
Figure 8.
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Typical Performance Characteristics (continued)
Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic;
Tambient = 25 C for efficiency curves and waveforms.
Efficiency 36V Input @ 25°C
Dissipation 36V Input @ 25°C
1.2
100
95
1.0
6.0
5.0
85
DISSIPATION (W)
EFFICIENCY (%)
90
80
3.3
75
70
65
60
0.6
3.3
0.4
0.2
55
50
6.0
5.0
0.8
25°C
25°C
0
0
0.2
0.4
0.6
0.8
0.2
0
1
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 9.
Figure 10.
Efficiency 42V Input @ 25°C
Dissipation 42V Input @ 25°C
1.2
100
95
1.0
85
DISSIPATION (W)
EFFICIENCY (%)
90
6.0
5.0
80
75
3.3
70
65
60
5.0
0.8
3.3
0.6
0.4
0.2
55
50
6.0
25°C
25°C
0
0.2
0.4
0.6
0.8
0
1
0
0.2
OUTPUT CURRENT (A)
0.4
0.6
1
0.8
OUTPUT CURRENT (A)
Figure 11.
Figure 12.
Efficiency 6V Input @ 85°C
Dissipation 6V Input @ 85°C
0.45
100
95
85
80
DISSIPATION (W)
EFFICIENCY (%)
0.375
3.3
2.5
1.8
1.5
1.2
90
75
70
65
0.3
0.225
1.2
0.15
85°C
60
0.075
55
50
3.3
2.5
1.8
1.5
85°C
0
0.2
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
0
0
0.2
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
Figure 13.
Figure 14.
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Typical Performance Characteristics (continued)
Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic;
Tambient = 25 C for efficiency curves and waveforms.
Efficiency 8V Input 85°C
95
5.0
3.3
2.5
1.8
1.5
1.2
85
80
75
70
65
0.3
0.225
1.2
0.15
85°C
60
0.075
55
50
5.0
3.3
2.5
1.8
1.5
0.375
DISSIPATION (W)
EFFICIENCY (%)
90
Dissipation 8V Input 85°C
0.45
100
85°C
0
0
0.2
0.4
0.6
0.8
1
0
0.2
OUTPUT CURRENT (A)
Figure 15.
100
Efficiency 12V Input@ 85°C
1
0.8
Dissipation 12V Input @ 85°C
0.6
6.0
5.0
3.3
2.5
1.8
1.5
1.2
85
80
0.5
DISSIPATION (W)
90
EFFICIENCY (%)
0.6
Figure 16.
95
75
70
65
60
6.0
5.0
3.3
2.5
0.4
0.3
1.8
1.5
0.2
1.2
0.1
55
50
0.4
OUTPUT CURRENT (A)
85°C
0
0.2
0.4
0.6
0.8
85°C
0
1
0
0.2
OUTPUT CURRENT (A)
0.4
0.6
0.8
1
OUTPUT CURRENT (A)
Figure 17.
Figure 18.
Efficiency 24V Input @ 85°C
Dissipation 24V Input @ 85°C
100
1.2
95
80
6.0
5.0
3.3
2.5
75
1.8
85
1.0
DISSIPATION (W)
EFFICIENCY (%)
90
70
65
60
8
6.0
5.0
0.6
0.4
3.3
2.5
0.2
1.8
55
50
0.8
85°C
85°C
0
0
0.2
0.4
0.6
0.8
1
0
0.2
0.4
0.6
0.8
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 19.
Figure 20.
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Typical Performance Characteristics (continued)
Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic;
Tambient = 25 C for efficiency curves and waveforms.
Efficiency 36V Input @ 85°C
100
Dissipation 36V Input @ 85°C
1.2
95
80
6.0
5.0
75
3.3
DISSIPATION (W)
EFFICIENCY (%)
85
70
65
60
0.8
0.6
3.3
0.4
0.2
55
50
6.0
5.0
1.0
90
85°C
0
0.4
0.2
0.6
0.8
85°C
0
1
0.2
0
OUTPUT CURRENT (A)
0.4
0.6
Figure 21.
Figure 22.
Efficiency 42V Input @ 85°C
Dissipation 42V Input @ 85°C
1.2
100
6.0
95
1.0
85
DISSIPATION (W)
EFFICIENCY (%)
90
6.0
5.0
80
75
3.3
70
65
60
5.0
0.8
3.3
0.6
0.4
0.2
55
50
1
0.8
OUTPUT CURRENT (A)
85°C
0
0
0.4
0.2
0.6
0.8
1
85°C
0
0.2
0.4
0.6
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 23.
Figure 24.
Line and Load Regulation @ 25°C
1
0.8
Line and Load Regulation @ 85°C
3.34
3.36
3.32
3.34
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
24
42
3.30
6
3.28
24
8
20
12
3.26
36
42
3.32
36
8 12 20
3.28
25°C
85°C
3.24
0
6
3.30
0.2
0.4
0.6
0.8
1.0
OUTPUT CURRENT (A)
3.26
0
0.2
0.4
0.6
0.8
1.0
OUTPUT CURRENT (A)
Figure 25.
Figure 26.
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Typical Performance Characteristics (continued)
Unless otherwise specified, the following conditions apply: VIN = 24V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic;
Tambient = 25 C for efficiency curves and waveforms.
Output Ripple
24VIN 3.3VO 1A, BW = 200 MHz
Transient Response
24VIN 3.3VO 0.5A to 1A Step
0.5 A/Div
20 mV/Div
Figure 27.
Figure 28.
Thermal Derating VOUT = 3.3V
1.2
Current Limit 1.8VOUT@ 25°C
2.4
1
2.3
0.8
CURRENT (A)
OUTPUT CURRENT (A)
200 Ps/Div
6VIN
0.6
12VIN
0.4
ÆJA = 19°C/W
24VIN
VOUT = 3.3V
36VIN
0.2
2.2
SHORT CIRCUIT
2.1
2.0
ONSET
1.9
0
50
70
60
80
90
25°C
1.8
100 110 120
0
5
10
15
20
25
AMBIENT TEMPERATURE (C)
INPUT VOLTAGE (V)
Figure 29.
Figure 30.
Current Limit 3.3VOUT@ 25°C
2.4
Current Limit 3.3VOUT@ 85°C
2.5
2.3
2.4
SHORT CIRCUIT
2.2
CURRENT (A)
CURRENT (A)
SHORT CIRCUIT
2.1
ONSET
2.0
2.3
2.2
2.1
ONSET
1.9
2.0
25°C
1.8
10
20
30
40
50
INPUT VOLTAGE (V)
0
10
20
30
40
50
INPUT VOLTAGE (V)
Figure 31.
10
85°C
1.9
0
Figure 32.
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APPLICATION BLOCK DIAGRAM
Vin
VIN 1
Linear reg
CIN
Cvcc
5
SS
Css
CBST
3
EN
RON
2
VOUT 7
RON
Timer
CFF
6
10 PH
VO
Co
FB
RFBT
RFBB
0.47 PF
Regulator IC
Internal
Passives
GND
4
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COT CONTROL CIRCUIT OVERVIEW
Constant On Time control is based on a comparator and an on-time one shot, with the output voltage feedback
compared with an internal 0.8V reference. If the feedback voltage is below the reference, the main MOSFET is
turned on for a fixed on-time determined by a programming resistor RON. RON is connected to VIN such that ontime is reduced with increasing input supply voltage. Following this on-time, the main MOSFET remains off for a
minimum of 260 ns. If the voltage on the feedback pin falls below the reference level again the on-time cycle is
repeated. Regulation is achieved in this manner.
Design Steps for the LMZ14201 Application
The LMZ14201 is fully supported by Webench® and offers the following: Component selection, electrical and
thermal simulations as well as the build-it board for a reduction in design time. The following list of steps can be
used to manually design the LMZ14201 application.
•
•
•
•
•
•
•
•
Select minimum operating VIN with enable divider resistors
Program VO with divider resistor selection
Program turn-on time with soft-start capacitor selection
Select CO
Select CIN
Set operating frequency with RON
Determine module dissipation
Layout PCB for required thermal performance
ENABLE DIVIDER, RENT AND RENB SELECTION
The enable input provides a precise 1.18V band-gap rising threshold to allow direct logic drive or connection to a
voltage divider from a higher enable voltage such as VIN. The enable input also incorporates 90 mV (typ) of
hysteresis resulting in a falling threshold of 1.09V. The maximum recommended voltage into the EN pin is 6.5V.
For applications where the midpoint of the enable divider exceeds 6.5V, a small zener can be added to limit this
voltage.
The function of this resistive divider is to allow the designer to choose an input voltage below which the circuit
will be disabled. This implements the feature of programmable under voltage lockout. This is often used in
battery powered systems to prevent deep discharge of the system battery. It is also useful in system designs for
sequencing of output rails or to prevent early turn-on of the supply as the main input voltage rail rises at powerup. Applying the enable divider to the main input rail is often done in the case of higher input voltage systems
such as 24V AC/DC systems where a lower boundary of operation should be established. In the case of
sequencing supplies, the divider is connected to a rail that becomes active earlier in the power-up cycle than the
LMZ14201 output rail. The two resistors should be chosen based on the following ratio:
RENT / RENB = (VIN UVLO/ 1.18V) – 1
(1)
The LMZ14201 demonstration and evaluation boards use 11.8kΩ for RENB and 68.1kΩ for RENT resulting in a
rising UVLO of 8V. This divider presents 6.25V to the EN input when the divider input is raised to 42V.
The EN pin is internally pulled up to VIN and can be left floating for always-on operation.
OUTPUT VOLTAGE SELECTION
Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of
the divider is connected to the FB input. The voltage at FB is compared to a 0.8V internal reference. In normal
operation an on-time cycle is initiated when the voltage on the FB pin falls below 0.8V. The main MOSFET ontime cycle causes the output voltage to rise and the voltage at the FB to exceed 0.8V. As long as the voltage at
FB is above 0.8V, on-time cycles will not occur.
The regulated output voltage determined by the external divider resistors RFBT and RFBB is:
VO = 0.8V * (1 + RFBT / RFBB)
(2)
Rearranging terms; the ratio of the feedback resistors for a desired output voltage is:
RFBT / RFBB = (VO / 0.8V) - 1
(3)
These resistors should be chosen from values in the range of 1.0 kohm to 10.0 kohm.
12
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For VO = 0.8V the FB pin can be connected to the output directly so long as an output preload resistor remains
that draws more than 20uA. Converter operation requires this minimum load to create a small inductor ripple
current and maintain proper regulation when no load is present.
A feed-forward capacitor is placed in parallel with RFBT to improve load step transient response. Its value is
usually determined experimentally by load stepping between DCM and CCM conduction modes and adjusting for
best transient response and minimum output ripple.
A table of values for RFBT , RFBB , CFF and RON is included in the applications schematic.
SOFT-START CAPACITOR SELECTION
Programmable soft-start permits the regulator to slowly ramp to its steady state operating point after being
enabled, thereby reducing current inrush from the input supply and slowing the output voltage rise-time to
prevent overshoot.
Upon turn-on, after all UVLO conditions have been passed, an internal 8uA current source begins charging the
external soft-start capacitor. The soft-start time duration to reach steady state operation is given by the formula:
tSS = VREF * CSS / Iss = 0.8V * CSS / 8uA
(4)
This equation can be rearranged as follows:
CSS = tSS * 8 μA / 0.8V
(5)
Use of a 0.022μF results in 2.2 msec soft-start interval which is recommended as a minimum value.
As the soft-start input exceeds 0.8V the output of the power stage will be in regulation. The soft-start capacitor
continues charging until it reaches approximately 3.8V on the SS pin. Voltage levels between 0.8V and 3.8V
have no effect on other circuit operation. Note that the following conditions will reset the soft-start capacitor by
discharging the SS input to ground with an internal 200 μA current sink.
•
•
•
•
The enable input being “pulled low”
Thermal shutdown condition
Over-current fault
Internal Vcc UVLO (Approximately 4V input to VIN)
CO SELECTION
None of the required CO output capacitance is contained within the module. At a minimum, the output capacitor
must meet the worst case minimum ripple current rating of 0.5 * ILR P-P, as calculated in Equation 19 below.
Beyond that, additional capacitance will reduce output ripple so long as the ESR is low enough to permit it. A
minimum value of 10 μF is generally required. Experimentation will be required if attempting to operate with a
minimum value. Ceramic capacitors or other low ESR types are recommended. See AN-2024 for more detail.
Equation 6 provides a good first pass approximation of CO for load transient requirements:
CO≥ISTEP*VFB*L*VIN/ (4*VO*(VIN—VO)*VOUT-TRAN)
(6)
Solving:
CO≥ 1A*0.8V*10μH*24V / (4*3.3V*( 24V — 3.3V)*33mV) ≥ 21.3μF
(7)
The LMZ14201 demonstration and evaluation boards are populated with a 100 uF 6.3V X5R output capacitor.
Locations for other output capacitors are provided.
CIN SELECTION
The LMZ14201 module contains an internal 0.47 µF input ceramic capacitor. Additional input capacitance is
required external to the module to handle the input ripple current of the application. This input capacitance should
be located in very close proximity to the module. Input capacitor selection is generally directed to satisfy the input
ripple current requirements rather than by capacitance value. Worst case input ripple current rating is dictated by
Equation 8:
I(CIN(RMS)) ≊ 1 /2 * IO * √ (D / 1-D)
(8)
where D ≊ VO / VIN
(As a point of reference, the worst case ripple current will occur when the module is presented with full load
current and when VIN = 2 * VO).
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Recommended minimum input capacitance is 10uF X7R ceramic with a voltage rating at least 25% higher than
the maximum applied input voltage for the application. It is also recommended that attention be paid to the
voltage and temperature deratings of the capacitor selected. It should be noted that ripple current rating of
ceramic capacitors may be missing from the capacitor data sheet and you may have to contact the capacitor
manufacturer for this rating.
If the system design requires a certain minimum value of input ripple voltage ΔVIN be maintained then Equation 9
may be used.
CIN ≥ IO * D * (1–D) / fSW-CCM * ΔVIN
(9)
If ΔVIN is 1% of VIN for a 24V input to 3.3V output application this equals 240 mV and fSW = 400 kHz.
CIN≥ 1A * 3.3V/24V * (1– 3.3V/24V) / (400000 * 0.240 V)
≥ 0.9μF
Additional bulk capacitance with higher ESR may be required to damp any resonant effects of the input
capacitance and parasitic inductance of the incoming supply lines.
RON RESISTOR SELECTION
Many designs will begin with a desired switching frequency in mind. For that purpose Equation 10 can be used.
fSW(CCM) ≊ VO / (1.3 * 10-10 * RON)
(10)
This can be rearranged as
RON ≊ VO / (1.3 * 10 -10 * fSW(CCM))
(11)
The selection of RON and fSW(CCM) must be confined by limitations in the on-time and off-time for the COT
Control Circuit Overview section.
The on-time of the LMZ14201 timer is determined by the resistor RON and the input voltage VIN. It is calculated
as follows:
tON = (1.3 * 10-10 * RON) / VIN
(12)
The inverse relationship of tON and VIN gives a nearly constant switching frequency as VIN is varied. RON should
be selected such that the on-time at maximum VIN is greater than 150 ns. The on-timer has a limiter to ensure a
minimum of 150 ns for tON. This limits the maximum operating frequency, which is governed by Equation 13:
fSW(MAX) = VO / (VIN(MAX) * 150 nsec)
(13)
This equation can be used to select RON if a certain operating frequency is desired so long as the minimum ontime of 150 ns is observed. The limit for RON can be calculated as follows:
RON ≥ VIN(MAX) * 150 nsec / (1.3 * 10 -10)
(14)
If RON calculated in Equation 11 is less than the minimum value determined in Equation 14 a lower frequency
should be selected. Alternatively, VIN(MAX) can also be limited in order to keep the frequency unchanged.
Additionally note, the minimum off-time of 260 ns limits the maximum duty ratio. Larger RON (lower FSW) should
be selected in any application requiring large duty ratio.
Discontinuous Conduction and Continuous Conduction Modes
At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the
critical conduction point, it will operate in continuous conduction mode (CCM). When operating in DCM the
switching cycle begins at zero amps inductor current; increases up to a peak value, and then recedes back to
zero before the end of the off-time. Note that during the period of time that inductor current is zero, all load
current is supplied by the output capacitor. The next on-time period starts when the voltage on the at the FB pin
falls below the internal reference. The switching frequency is lower in DCM and varies more with load current as
compared to CCM. Conversion efficiency in DCM is maintained since conduction and switching losses are
reduced with the smaller load and lower switching frequency. Operating frequency in DCM can be calculated as
follows:
fSW(DCM)≊VO*(VIN-1)*10μH*1.18*1020*IO/(VIN–VO)*RON2
(15)
In CCM, current flows through the inductor through the entire switching cycle and never falls to zero during the
off-time. The switching frequency remains relatively constant with load current and line voltage variations. The
CCM operating frequency can be calculated using Equation 7 above.
14
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Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes.
Figure 33. CCM and DCM Operating Modes
VIN = 12V, VO = 3.3V, IO = 1 A / 0.25 A
500 mA/Div
2.00 Ps/Div
The approximate formula for determining the DCM/CCM boundary is as follows:
IDCB≊VO*(VIN–VO)/(2*10 μH*fSW(CCM)*VIN)
(16)
Following is a typical waveform showing the boundary condition.
Figure 34. Transition Mode Operation
VIN = 24V, VO = 3.3V, IO = 0.29 A
500 mA/Div
2.00 Ps/Div
The inductor internal to the module is 10 μH. This value was chosen as a good balance between low and high
input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple
current (ILR). ILR can be calculated with:
ILR P-P=VO*(VIN- VO)/(10µH*fSW*VIN)
(17)
Where VIN is the maximum input voltage and fSW is determined from Equation 10.
If the output current IO is determined by assuming that IO = IL, the higher and lower peak of ILR can be
determined. Be aware that the lower peak of ILR must be positive if CCM operation is required.
POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS
For the design case of VIN = 24V, VO = 3.3V, IO = 1A, TAMB(MAX) = 85°C , and TJUNCTION = 125°C, the device must
see a thermal resistance from case to ambient of less than:
θCA< (TJ-MAX — TAMB(MAX)) / PIC-LOSS - θJC
(18)
Given the typical thermal resistance from junction to case to be 1.9 °C/W. Use the 85°C power dissipation curves
in the Typical Performance Characteristics section to estimate the PIC-LOSS for the application being designed. In
this application it is 0.52W.
θCA = (125 — 85) / 0.52W — 1.9 = 75
To reach θCA = 75, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good
estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is:
Board Area_cm2 = 500°C x cm2/W / θJC
(19)
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As a result, approximately 6 square cm of 1 oz copper on top and bottom layers is required for the PCB design.
Additional area will decrease die temperature proportionately. The PCB copper heat sink must be connected to
the exposed pad. Approximately thirty six, 10mils (254 μm) thermal vias spaced 59mils (1.5 mm) apart must
connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout of
approximately 31 square cm area. Refer to the Evaluation Board application note AN-2024 SNVA422. For more
information on thermal design see AN-2020 SNVA419 and AN-2026 SNVA424.
PC BOARD LAYOUT GUIDELINES
PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance
of a DC-DC converter and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage drop
in the traces. These can send erroneous signals to the DC-DC converter resulting in poor regulation or instability.
Good layout can be implemented by following a few simple design rules.
VIN
LMZ14201
VIN
VO
VOUT
High
di/dt
Cin1
CO1
GND
Loop 2
Loop 1
1. Minimize area of switched current loops.
From an EMI reduction standpoint, it is imperative to minimize the high di/dt paths during PC board layout. The
high current loops that do not overlap have high di/dt content that will cause observable high frequency noise on
the output pin if the input capacitor (Cin1) is placed at a distance away from the LMZ14201. Therefore place CIN1
as close as possible to the LMZ14201 VIN and GND exposed pad. This will minimize the high di/dt area and
reduce radiated EMI. Additionally, grounding for both the input and output capacitor should consist of a localized
top side plane that connects to the GND exposed pad (EP).
2. Have a single point ground.
The ground connections for the feedback, soft-start, and enable components should be routed to the GND pin of
the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly
handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Provide
the single point ground connection from pin 4 to EP.
3. Minimize trace length to the FB pin.
Both feedback resistors, RFBT and RFBB, and the feed forward capacitor CFF, should be located close to the FB
pin. Since the FB node is high impedance, maintain the copper area as small as possible. The trace are from
RFBT, RFBB, and CFF should be routed away from the body of the LMZ14201 to minimize noise.
4. Make input and output bus connections as wide as possible.
This reduces any voltage drops on the input or output of the converter and maximizes efficiency. To optimize
voltage accuracy at the load, ensure that a separate feedback voltage sense trace is made to the load. Doing so
will correct for voltage drops and provide optimum output accuracy.
5. Provide adequate device heat-sinking.
Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If
the PCB has a plurality of copper layers, these thermal vias can also be employed to make connection to inner
layer heat-spreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 10mils
(254 μm) thermal vias spaced 59mils (1.5 mm). Ensure enough copper area is used for heat-sinking to keep the
junction temperature below 125°C.
16
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Additional Features
OUTPUT OVER-VOLTAGE COMPARATOR
The voltage at FB is compared to a 0.92V internal reference. If FB rises above 0.92V the on-time is immediately
terminated. This condition is known as over-voltage protection (OVP). It can occur if the input voltage is
increased very suddenly or if the output load is decreased very suddenly. Once OVP is activated, the top
MOSFET on-times will be inhibited until the condition clears. Additionally, the synchronous MOSFET will remain
on until inductor current falls to zero.
CURRENT LIMIT
Current limit detection is carried out during the off-time by monitoring the current in the synchronous MOSFET.
Referring to the Functional Block Diagram, when the top MOSFET is turned off, the inductor current flows
through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds 2.0 (typical) the
current limit comparator disables the start of the next on-time period. The next switching cycle will occur only if
the FB input is less than 0.8V and the inductor current has decreased below 2.0A. Inductor current is monitored
during the period of time the synchronous MOSFET is conducting. So long as inductor current exceeds 2.0A,
further on-time intervals for the top MOSFET will not occur. Switching frequency is lower during current limit due
to the longer off-time. It should also be noted that current limit is dependent on both duty cycle and temperature
as illustrated in the graphs in the Typical Performance Characteristics section.
THERMAL PROTECTION
The junction temperature of the LMZ14201 should not be allowed to exceed its maximum ratings. Thermal
protection is implemented by an internal Thermal Shutdown circuit which activates at 165 °C (typ) causing the
device to enter a low power standby state. In this state the main MOSFET remains off causing VO to fall, and
additionally the CSS capacitor is discharged to ground. Thermal protection helps prevent catastrophic failures for
accidental device overheating. When the junction temperature falls back below 145 °C (typ Hyst = 20 °C) the SS
pin is released, VO rises smoothly, and normal operation resumes.
Applications requiring maximum output current especially those at high input voltage may require application
derating at elevated temperatures.
ZERO COIL CURRENT DETECTION
The current of the lower (synchronous) MOSFET is monitored by a zero coil current detection circuit which
inhibits the synchronous MOSFET when its current reaches zero until the next on-time. This circuit enables the
DCM operating mode, which improves efficiency at light loads.
PRE-BIASED STARTUP
The LMZ14201 will properly start up into a pre-biased output. This startup situation is common in multiple rail
logic applications where current paths may exist between different power rails during the startup sequence. The
following scope capture shows proper behavior during this event.
Figure 35. Pre-Biased Startup
OUTPUT
VOLTAGE
2V PRE-BIAS
OUTPUT
CURRENT
ENABLE
3.3V OUTPUT
1.0 V/Div
0.5 A/Div
2.0 V/Div
1 ms/Div
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Evaluation Board Schematic Diagram and BOM
U1
EP
VIN
Enable
VOUT
3.3VO @ 1A
7
FB
SS
6
GND
5
VIN
EN
4
3
2
1
RON
LMZ14201TZ-ADJ
6.0V to 42V
RENT
CFF
68.1k
0.022 PF
RON
RFBT
61.9k
RENB
11.8k
18
CIN2
D1
OPT
10 PF
3.32k
CIN1
CSS
1 PF
0.022 PF
RFBB
1.07k
CO1
CO2
1 PF
100 PF
Ref Des
Description
Case Size
Manufacturer
Manufacturer P/N
U1
SIMPLE SWITCHER ®
PFM-7
Texas Instruments
LMZ14201TZ-ADJ
Cin1
1 µF, 50V, X7R
1206
Taiyo Yuden
UMK316B7105KL-T
Cin2
10 µF, 50V, X7R
1210
Taiyo Yuden
UMK325BJ106MM-T
CO1
1 µF, 50V, X7R
1206
Taiyo Yuden
UMK316B7105KL-T
CO2
100 µF, 6.3V, X7R
1210
Taiyo Yuden
JMK325BJ107MM-T
RFBT
3.32 kΩ
0603
Vishay Dale
CRCW06033K32FKEA
RFBB
1.07 kΩ
0603
Vishay Dale
CRCW06031K07FKEA
RON
61.9 kΩ
0603
Vishay Dale
CRCW060361k9FKEA
RENT
68.1 kΩ
0603
Vishay Dale
CRCW060368k1FKEA
RENB
11.8 kΩ
0603
Vishay Dale
CRCW060311k8FKEA
CFF
22 nF, ±10%, X7R, 16V
0603
TDK
C1608X7R1H223K
CSS
22 nF, ±10%, X7R, 16V
0603
TDK
C1608X7R1H223K
D1
5.1V
SOD-23
—
Optional
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Figure 36. Top View and Bottom View of Evaluation PCB
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REVISION HISTORY
Changes from Revision D (March 2013) to Revision E
•
20
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 19
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LMZ14201TZ-ADJ/NOPB
ACTIVE
PFM
NDW
7
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
-40 to 85
LMZ14201
TZ-ADJ
LMZ14201TZE-ADJ/NOPB
ACTIVE
PFM
NDW
7
45
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
-40 to 85
LMZ14201
TZ-ADJ
LMZ14201TZX-ADJ/NOPB
ACTIVE
PFM
NDW
7
500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
-40 to 85
LMZ14201
TZ-ADJ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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3-Jun-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LMZ14201TZ-ADJ/NOPB
LMZ14201TZX-ADJ/NOP
B
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
PFM
NDW
7
250
330.0
24.4
10.6
14.22
5.0
16.0
24.0
Q2
PFM
NDW
7
500
330.0
24.4
10.6
14.22
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMZ14201TZ-ADJ/NOPB
PFM
NDW
7
250
367.0
367.0
45.0
LMZ14201TZX-ADJ/NOPB
PFM
NDW
7
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDW0007A
BOTTOM SIDE OF PACKAGE
TOP SIDE OF PACKAGE
TZA07A (Rev D)
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