ON MC74LCX257 Low-voltage cmos quad 2-input multiplexer Datasheet

MC74LCX257
Low-Voltage CMOS Quad
2-Input Multiplexer
With 5.0 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
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The MC74LCX257 is a high performance, quad 2−input
multiplexer with 3−state outputs operating from a 2.3 to 3.6 V supply.
High impedance TTL compatible inputs significantly reduce current
loading to input drivers while TTL compatible outputs offer improved
switching noise performance. A VI specification of 5.5 V allows
MC74LCX257 inputs to be safely driven from 5.0 V devices.
Four bits of data from two sources can be selected using the Select
input. The four outputs present the selected data in the true
(non−inverted) form. The outputs may be switched to a high
impedance state by placing a logic HIGH on the Output Enable (OE)
input. Current drive capability is 24 mA at the outputs.
Features
•
•
•
•
•
•
•
•
•
•
•
Designed for 2.3 to 3.6 V VCC Operation
5.0 V Tolerant − Interface Capability with 5.0 V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
♦ Human Body Model >2000 V
♦ Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 7
1
MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
16
1
LCX257G
AWLYWW
1
16
16
1
LCX
257
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
1
A
WL, L
Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC74LCX257/D
MC74LCX257
VCC
OE
I0c
I1c
Zc
I0d
I1d
Zd
16
15
14
13
12
11
10
9
I0a
I1a
I0b
I1b
1
S
2
I0a
3
I1a
4
5
Za
I0b
6
I1b
7
Zb
I0c
8
GND
I1c
Figure 1. Pinout: 16−Lead Plastic Package
(Top View)
I0d
I1d
OE
2
4
3
5
7
6
14
12
13
11
9
10
15
1
S
Figure 2. Logic Diagram
PIN NAMES
Pins
Function
l0n
Source 0 Data Inputs
l1n
Source 1 Data Inputs
OE
Output Enable Input
S
Select Input
Zn
Outputs
TRUTH TABLE
Inputs
H
L
X
Z
Outputs
OE
S
l0n
l1n
Zn
H
X
X
X
Z
L
H
X
L
L
L
H
X
H
H
L
L
L
X
L
L
L
H
X
H
=
=
=
=
High Voltage Level
Low Voltage Level
High or Low Voltage Level and Transitions are Acceptable
High Impedance State
For ICC reasons, DO NOT FLOAT Inputs
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2
Za
Zb
Zc
Zd
MC74LCX257
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
Condition
Units
−0.5 to +7.0
V
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
VO
DC Output Voltage
−0.5 ≤ VI ≤ +7.0
Output in 3−State
V
−0.5 ≤ VO ≤ VCC + 0.5
Output in HIGH or LOW State (Note 1)
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
−65 to +150
°C
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Type
Max
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
VI
Input Voltage
0
5.5
VO
Output Voltage
(HIGH or LOW State)
(3−State)
0
0
VCC
5.5
IOH
HIGH Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
−24
−12
−8
IOL
LOW Level Output Current
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
+24
+12
+8
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
Units
V
V
V
mA
mA
−40
+85
°C
0
10
ns/V
ORDERING INFORMATION
Package
Shipping†
MC74LCX257DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LCX257DTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74LCX257DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC74LCX257
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C
Symbol
VIH
VIL
VOH
VOL
Characteristic
HIGH Level Input Voltage (Note 2)
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
LOW Level Output Voltage
IOZ
3−State Output Current
IOFF
Power Off Leakage Current
Condition
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
Max
V
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.3 V; IOH = −8 mA
1.8
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL = 8 mA
0.6
V
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 5.5 V
±5
mA
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Increase in ICC per Input
2. These values of VI are used to test DC electrical characteristics only.
AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W
Limits
TA = −40°C to +85°C
Symbol
Parameter
VCC = 3.3 V ± 0.3 V
VCC = 2.7 V
VCC = 2.5 V ± 0.2 V
CL = 50 pF
CL = 50 pF
CL = 30 pF
Waveform
Min
Max
Min
Max
Min
Max
Units
tPLH
tPHL
Propagation Delay
In to Zn
1
1.5
1.5
6.0
6.0
1.5
1.5
6.5
6.5
1.5
1.5
7.2
7.2
ns
tPLH
tPHL
Propagation Delay
S to Zn
1, 2
1.5
1.5
7.0
7.0
1.5
1.5
8.5
8.5
1.5
1.5
9.1
9.1
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
3
1.5
1.5
7.0
7.0
1.5
1.5
8.5
8.5
1.5
1.5
9.1
9.1
ns
tPHZ
tPLZ
Output Disable Time from
High and Low Level
3
1.5
1.5
5.5
5.5
1.5
1.5
6.0
6.0
1.5
1.5
6.6
6.6
ns
tOSHL
tOSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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4
MC74LCX257
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.8
0.6
V
VOLV
Dynamic LOW Valley Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.8
−0.6
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
CI/O
Input/Output Capacitance
CPD
Power Dissipation Capacitance
Condition
Typical
Units
VCC = 3.3 V, VI = 0 V or VCC
7
pF
VCC = 3.3 V, VI = 0 V or VCC
8
pF
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
VCC
VCC
In, S Vmi
Vmi
Vmi
S
Vmi
0V
tPLH
0V
tPHL
tPLH
tPHL
VOH
Zn
Vmo
VOH
Vmo
Vmo
Zn
VOL
VOL
WAVEFORM 1 − NON−INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns
WAVEFORM 2 − INVERTING PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns
VCC
Vmi
OE
Vmi
0V
tPZH
tPHZ
VCC
VOH − 0.3
V
Vmo
Zn
≈0V
tPZL
tPLZ
≈ 3.0V
Vmo
Zn
Vmo
VOL + 0.3 V
GND
WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns
Vcc
Symbol
3.3 V ± 0.3 V
2.7 V
2.5 V ± 0.2 V
Vmi
1.5 V
1.5 V
Vcc/2
Vmo
1.5 V
1.5 V
Vcc/2
VHZ
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.15 V
VLZ
VOH − 0.3 V
VOH − 0.3 V
VOH − 0.15 V
Figure 3. AC Waveforms
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5
MC74LCX257
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
1
8
−B−
P
8 PL
0.25 (0.010)
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74LCX257
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
−−−
1.20
−−− 0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.18
0.28 0.007
0.011
−W−
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1
0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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7
MC74LCX257
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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