CY7C1379C 9-Mbit (256K x 32) Flow-through SRAM with NoBL™ Architecture Functional Description[1] Features • Can support up to 133-MHz bus operations with zero wait states — Data is transferred on every clock • Pin compatible and functionally equivalent to ZBT™ devices • Internally self-timed output buffer control to eliminate the need to use OE • Registered inputs for flow-through operation The CY7C1379C is a 3.3V, 256K x 32 Synchronous Flow-through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1379C is equipped with the advanced No Bus Latency™ (NoBL™) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 6.5 ns (133-MHz device). • Byte Write capability • 256K x 32 common I/O architecture • Single 3.3V power supply (VDD) • Fast clock-to-output times — 6.5 ns (for 133-MHz device) Write operations are controlled by the two Byte Write Select (BW[A:D]) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry. • Clock Enable (CEN) pin to suspend operation • Synchronous self-timed writes Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. In order to avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence. • Asynchronous Output Enable • Available in JEDEC-standard lead-free 100-Pin TQFP, lead-free and non lead-free 165-Ball FBGA package • Burst Capability—linear or interleaved burst order • Low standby power Logic Block Diagram–CY7C1379C (256K x 36) ADDRESS REGISTER A0, A1, A A1 D1 A0 D0 MODE CLK CEN C CE ADV/LD C BURST LOGIC Q1 A1' A0' Q0 WRITE ADDRESS REGISTER ADV/LD BWA WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC BWB BWC WRITE DRIVERS MEMORY ARRAY S E N S E A M P S BWD WE OE CE1 CE2 CE3 INPUT REGISTER D A T A S T E E R I N G O U T P U T B U F F E R S DQs E E READ LOGIC ZZ SLEEP Control Note: 1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05688 Rev. *D • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised September 14, 2006 CY7C1379C Selection Guide 133 MHz 100 MHz Unit Maximum Access Time 6.5 7.5 ns Maximum Operating Current 250 180 mA Maximum CMOS Standby Current 40 40 mA Pin Configurations Document #: 38-05688 Rev. *D A A OE 86 81 CEN 87 82 WE 88 A CLK 89 83 VSS 90 ADV/LD VDD 91 NC(18M) CE3 92 84 BWA 93 85 BWC BWD 96 BWB CE2 97 94 A CE1 98 A 99 95 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 A A A A1 A0 NC NC VSS VDD NC(72M) NC(36M) A A A A A A A CY7C1379C A BYTE D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE BYTE C NC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC VSS/DNU VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD NC 100 100-Pin TQFP Pinout NC DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA NC BYTE B BYTE A Page 2 of 15 CY7C1379C Pin Configurations (continued) 165-Ball FBGA Pinout CY7C1379C (256K x 32) 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P NC/576M 1 A CE1 BWC BWB CE3 CEN ADV/LD A A NC NC/1G A CE2 BWD BWA CLK WE OE NC/18M A NC NC DQC NC DQC VDDQ VSS VDD VSS VSS VSS VSS VSS VSS VSS VDD VDDQ VDDQ VDDQ NC DQB NC DQB R MODE DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB DQC DQC VDDQ VDD VSS VSS VSS VDD VDDQ DQB DQB DQC NC DQD DQC VDD DQD VDDQ NC VDDQ VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDD VDD VDDQ NC VDDQ DQB NC DQA DQB ZZ DQA DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA DQD DQD VDDQ VDD VSS VSS VSS VDD VDDQ DQA DQA DQD NC DQD NC VDDQ VDDQ VDD VSS VSS NC VSS VDD VSS VDDQ VDDQ DQA NC DQA NC A A NC NC A1 VSS NC NC A A A NC/288M A A NC A0 NC A A A A NC/144M NC/72M NC/36M Pin Definitions Name TQFP FBGA 37,36,32,33,34,3 5,44,45,46, 47,48,49,50,81,8 2,83,99,100 R6,P6,A2, A9,A10,B2 B10,P3,P4, P8,P9,P10, R3,R4,R8, R9,R10,R11 InputAddress Inputs used to select one of the 256K address Synchronous locations. Sampled at the rising edge of the CLK. A[1:0] are fed to the two-bit burst counter. 93,94,95,96 B5,A5,A4, B4 InputByte Write Inputs, active LOW. Qualified with WE to conduct Synchronous writes to the SRAM. Sampled on the rising edge of CLK. WE 88 B7 InputWrite Enable Input, active LOW. Sampled on the rising edge Synchronous of CLK if CEN is active LOW. This signal must be asserted LOW to initiate a write sequence. ADV/LD 85 A8 InputAdvance/Load Input. Used to advance the on-chip address Synchronous counter or load a new address. When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new address can be loaded into the device for an access. After being deselected, ADV/LD should be driven LOW in order to load a new address. CLK 89 B6 CE1 98 A3 InputChip Enable 1 Input, active LOW. Sampled on the rising edge Synchronous of CLK. Used in conjunction with CE2, and CE3 to select/deselect the device. CE2 97 B3 InputChip Enable 2 Input, active HIGH. Sampled on the rising edge Synchronous of CLK. Used in conjunction with CE1 and CE3 to select/deselect the device. CE3 92 A6 InputChip Enable 3 Input, active LOW. Sampled on the rising edge Synchronous of CLK. Used in conjunction with CE1 and CE2 to select/deselect the device. A0, A1, A BWA, BWB, BWC, BWD Document #: 38-05688 Rev. *D I/O Input-Clock Description Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK is only recognized if CEN is active LOW. Page 3 of 15 CY7C1379C Pin Definitions (continued) Name TQFP FBGA OE 86 B8 InputOutput Enable, asynchronous input, active LOW. Combined Asynchronous with the synchronous logic block inside the device to control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is masked during the data portion of a write sequence, during the first clock when emerging from a deselected state, when the device has been deselected. CEN 87 A7 InputClock Enable Input, active LOW. When asserted LOW the Synchronous Clock signal is recognized by the SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not deselect the device, CEN can be used to extend the previous cycle when required. ZZ 64 H11 InputZZ “sleep” Input. This active HIGH input places the device in a Asynchronous non-time critical “sleep” condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ pin has an internal pull-down. 52,53,56,57, 58,59,62,63, 68,69,72,73, 74,75,78,79, 2,3,6,7, 8,9,12,13, 18,19,22,23, 24,25,28,29 M11,L11, K11,J11, J10,K10, L10,M10, D10,E10, F10,G10, D11,E11, F11,G11, D1,E1,F1, G1,D2,E2, F2,G2,J1, K1,L1,M1, J2,K2,L2 M2 I/OBidirectional Data I/O Lines. As inputs, they feed into an Synchronous on-chip data register that is triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by address during the clock rise of the Read cycle. The direction of the pins is controlled by OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When HIGH, DQs are placed in a tri-state condition. The outputs are automatically tri-stated during the data portion of a write sequence, during the first clock when emerging from a deselected state, and when the device is deselected, regardless of the state of OE. 31 R1 15,41,65,91 D4,D8,E4, E8,F4,F8, G4,G8,H2, H4,H8,J4, J8,K4,K8, L4,L8,M4, M8 4,11,20,27,54, 61,70,77 C3,C9,D3, D9,E3,E9, F3,F9,G3, G9,J3,J9, K3,K9,L3, L9,M3,M9, N3,N9 DQs Mode VDD VDDQ Document #: 38-05688 Rev. *D I/O Input Strap Pin Description Mode Input. Selects the burst order of the device. When tied to GND selects linear burst sequence. When tied to VDD or left floating selects interleaved burst sequence. Power Supply Power supply inputs to the core of the device. I/O Power Supply Power supply for the I/O circuitry. Page 4 of 15 CY7C1379C Pin Definitions (continued) Name VSS NC VSS/DNU TQFP FBGA I/O 5,10,17,21, 26,40,55,60, 67,71,76,90, C4,C5,C6, C7,C8,D5, D6,D7,E5, E6,E7,F5, F6,F7,G5, G6,G7,H5, H6,H7,J5, J6,J7,K5,K6,K 7,L5,L6,L7,M5 ,M6,M7, N4,N8 Ground 1,16,30,38,39, A1,A11,B1, 42,43,51,66,80,8 B9,B11,C1, 4,95,96 C2,C10,C11,H 1,H3,H9, H10,N1,N2, N5,N6,N7 N10,N11,P1,P 2,P5,P7, P11,R2,R5, R7 14 - – Ground/DNU Functional Overview The CY7C1379C is a synchronous flow-through burst SRAM designed specifically to eliminate wait states during Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133-MHz device). Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device will be latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). BW[A:D] can be used to conduct byte write operations. Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self-timed write circuitry. Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD should be driven LOW once the device has been deselected in order to load a new address for the next operation. Single Read Accesses A read access is initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, (3) the Write Enable input signal WE is deasserted HIGH, and 4) ADV/LD is asserted LOW. The address presented to the address inputs is latched into the Address Register and presented to the memory array and control logic. The control logic determines that a read Document #: 38-05688 Rev. *D Description Ground for the device. No Connects. Not Internally connected to the die. 18M, 36M, 72M, 144M, 288M, 576M, and 1G are address expansion pins and are not internally connected to the die. This pin can be connected to Ground or should be left floating. access is in progress and allows the requested data to propagate to the output buffers. The data is available within 6.5 ns (133-MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. On the subsequent clock, another operation (Read/Write/Deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, its output will be tri-stated immediately. Burst Read Accesses The CY7C1379C has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW in order to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and will wrap around when incremented sufficiently. A HIGH input on ADV/LD will increment the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence. Single Write Accesses Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the Write signal WE is asserted LOW. The address presented to the address bus is loaded into the Address Register. The write signals are latched into the Control Logic block. The data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQs. Page 5 of 15 CY7C1379C On the next clock rise the data presented to DQs (or a subset for Byte Write operations, see Truth Table for details) inputs is latched into the device and the write is complete. Additional accesses (Read/Write/Deselect) can be initiated on this cycle. The data written during the Write operation is controlled by BW[A:D] signals. The CY7C1379C provides Byte Write capability that is described in the truth table. Asserting the Write Enable input (WE) with the selected Byte Write Select input will selectively write to only the desired bytes. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the Write operations. Byte Write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple Byte Write operations. Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Linear Burst Address Table (MODE = GND) Because the CY7C1379C is a common I/O device, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQ inputs. Doing so will tri-state the output drivers. As a safety precaution, DQs and DQPX.are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE. Burst Write Accesses The CY7C1379C has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write operations without reasserting the address inputs. ADV/LD must be driven LOW in order to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BW[A:D] inputs must be driven in each cycle of the burst write, in order to write the correct bytes of data. First Address A1, A0 Second Address A1, A0 Third Address A1, A0 Fourth Address A1, A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 Interleaved Burst Sequence First Address Second Address Third Address Fourth Address A1, A0 A1, A0 A1, A0 A1, A0 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min. Max. Unit IDDZZ Sleep mode standby current ZZ > VDD − 0.2V 50 mA tZZS Device operation to ZZ ZZ > VDD − 0.2V 2tCYC ns tZZREC ZZ recovery time ZZ < 0.2V tZZI ZZ Active to Sleep current This parameter is sampled tRZZI ZZ inactive to exit Sleep current This parameter is sampled Document #: 38-05688 Rev. *D 2tCYC ns 2tCYC 0 ns ns Page 6 of 15 CY7C1379C Truth Table[2, 3, 4, 5, 6, 7, 8] Operation ADRESS Used CE1 CE2 CE3 ZZ ADV/LD WE BWX OE CEN CLK DQ Deselect Cycle None H X X L L X X X L L->H Tri-State Deselect Cycle None X X H L L X X X L L->H Tri-State Deselect Cycle None X L X L L X X X L L->H Tri-State Continue Deselect Cycle READ Cycle (Begin Burst) None X X X L H X X X L L->H Tri-State External L H L L L H X L L L->H Data Out (Q) Next READ Cycle (Continue Burst) X X X L H X X L L L->H Data Out (Q) NOP/DUMMY READ (Begin Burst) External L H L L L H X H L L->H Tri-State DUMMY READ (Continue Burst) Next X X X L H X X H L L->H Tri-State External L H L L L L L X L L->H Data In (D) WRITE Cycle (Continue Burst) Next X X X L H X L X L L->H Data In (D) NOP/WRITE ABORT (Begin Burst) None L H L L L L H X L L->H Tri-State WRITE Cycle (Begin Burst) WRITE ABORT (Continue Burst) IGNORE CLOCK EDGE (Stall) Sleep MODE Next X X X L H X H X L L->H Tri-State Current X X X L X X X X H L->H – None X X X H X X X X X X Tri-State Truth Table for Read/Write[2, 3] Function (CY7C1379C) WE BWA BWB BWC BWD Read H X X X X Write No Bytes Written L H H H H Write Byte A – (DQA) L L H H H Write Byte B – (DQB) Write Byte C – (DQC) L H L H H L H H L H Write Byte D – (DQD) L H H H L Write All Bytes L L L L L Notes: 2. X =”Don't Care.” H = HIGH, L = LOW. BWx = 0 signifies at least one Byte Write Select is active, BWx = Valid signifies that the desired byte write selects are asserted, see Truth Table for details. 3. Write is defined by BWX, and WE. See Truth Table for Read/Write. 4. When a Write cycle is detected, all I/Os are tri-stated, even during Byte Writes. 5. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 6. CEN = H, inserts wait states. 7. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE. 8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle DQs = Three-state when OE is inactive or when the device is deselected, and DQs = data when OE is active. Document #: 38-05688 Rev. *D Page 7 of 15 CY7C1379C Maximum Ratings DC Input Voltage ................................... –0.5V to VDD + 0.5V (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-up Current.................................................... > 200 mA Operating Range Supply Voltage on VDD Relative to GND........ –0.5V to +4.6V Supply Voltage on VDDQ Relative to GND ...... –0.5V to +VDD DC Voltage Applied to Outputs in High-Z State .................................... –0.5V to VDDQ + 0.5V Range Ambient Temperature (TA) VDD/VDDQ 0°C to +70°C 3.3V – 5%/+10% Com’l Ind’l –40°C to +85°C Electrical Characteristics Over the Operating Range [9, 10] Parameter Description Test Conditions Min. Max. Unit 3.135 3.6 V 3.135 VDD V VDD Power Supply Voltage VDDQ I/O Supply Voltage for 3.3V I/O VOH Output HIGH Voltage for 3.3V I/O, IOH = –4.0 mA VOL Output LOW Voltage for 3.3V I/O, IOL = 8.0 mA 0.4 V VIH Input HIGH Voltage for 3.3V I/O 2.0 VDD + 0.3V V for 3.3V I/O Voltage[9] 2.4 V VIL Input LOW –0.3 0.8 V IX Input Leakage Current except ZZ and MODE GND ≤ VI ≤ VDDQ −5 5 µA Input Current of MODE Input = VSS –30 Input = VDDQ Input Current of ZZ µA 5 Input = VSS Input = VDDQ IOZ Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled IDD VDD Operating Supply Current VDD = Max., IOUT = 0 mA, f = fMAX= 1/tCYC ISB1 Automatic CE Power-down Current—TTL Inputs –5 µA µA –5 30 µA 5 µA 7.5-ns cycle, 133 MHz 250 mA 10-ns cycle, 100 MHz 180 mA VDD = Max, Device Deselected, All speeds VIN ≥ VIH or VIN ≤ VIL, f = fMAX, inputs switching 110 mA ISB2 Automatic CE VDD = Max, Device Deselected, All speeds Power-down VIN ≥ VDD – 0.3V or VIN ≤ 0.3V, Current—CMOS Inputs f = 0, inputs static 40 mA ISB3 VDD = Max, Device Deselected, All speeds Automatic CE Power-down VIN ≥ VDDQ – 0.3V or VIN ≤ 0.3V, Current—CMOS Inputs f = fMAX, inputs switching 100 mA ISB4 Automatic CE Power-down Current—TTL Inputs 40 mA VDD = Max, Device Deselected, All speeds VIN ≥ VIH or VIN ≤ VIL, f = 0, inputs static Notes: 9. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2). 10. TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. Document #: 38-05688 Rev. *D Page 8 of 15 CY7C1379C Capacitance[11] Parameter Description CIN Input Capacitance CCLOCK Clock Input Capacitance CI/O I/O Capacitance Test Conditions 100 TQFP Max. 165 FBGA Max. Unit 5 7 pF 5 7 pF 5 7 pF 100 TQFP Package 165 FBGA Package Unit 29.41 16.8 °C/W 6.13 3.0 °C/W TA = 25°C, f = 1 MHz, VDD = 3.3V VDDQ=3.3V Thermal Resistance[11] Parameters Description Test Conditions ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51 AC Test Loads and Waveforms 3.3V I/O Test Load R = 317Ω 3.3V OUTPUT ALL INPUT PULSES VDD OUTPUT RL = 50Ω Z0 = 50Ω GND 5 pF VL = 1.5V (a) R = 351Ω INCLUDING JIG AND SCOPE Switching Characteristics Over the Operating 90% 10% 90% 10% ≤ 1 ns ≤ 1 ns (b) (c) Range[12, 13, 14, 15, 16, 17] –133 Parameter tPOWER Description VDD(Typical) to the First Access[14] Min. –100 Max. Min. Max. Unit 1 1 ms Clock tCYC Clock Cycle Time 7.5 10.0 ns tCH Clock HIGH 3.0 4.0 ns tCL Clock LOW 3.0 4.0 ns Output Times tCDV Data Output Valid after CLK Rise tDOH Data Output Hold after CLK Rise tCLZ Clock to Low-Z[15, 16, 17] tCHZ Clock to High-Z[15, 16, 17] tOEV OE LOW to Output Valid tOELZ OE LOW to Output Low-Z[15, 16, 17] tOEHZ OE HIGH to Output High-Z[15, 16, 17] 6.5 7.5 ns 2.0 2.0 ns 0 0 ns 3.5 3.5 0 3.5 ns 3.5 ns 0 3.5 ns 3.5 ns Notes: 11. Tested initially and after any design or process changes that may affect these parameters. 12. Timing reference level is 1.5V when VDDQ=3.3V. 13. Test conditions shown in (a) of AC Test Loads, unless otherwise noted. 14. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD (minimum) initially, before a read or write operation can be initiated. 15. tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 16. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 17. This parameter is sampled and not 100% tested. Document #: 38-05688 Rev. *D Page 9 of 15 CY7C1379C Switching Characteristics Over the Operating Range[12, 13, 14, 15, 16, 17] (continued) –133 Parameter Description Min. Max. –100 Min. Max. Unit Set-up Times tAS Address Set-up before CLK Rise 1.5 1.5 ns tALS ADV/LD Set-up before CLK Rise 1.5 1.5 ns tWES WE, BW[A:D] Set-up before CLK Rise 1.5 1.5 ns tCENS CEN Set-up before CLK Rise 1.5 1.5 ns tDS Data Input Set-up before CLK Rise 1.5 1.5 ns tCES Chip Enable Set-up before CLK Rise 1.5 1.5 ns tAH Address Hold after CLK Rise 0.5 0.5 ns tALH ADV/LD Hold after CLK Rise 0.5 0.5 ns tWEH WE, BWX Hold after CLK Rise 0.5 0.5 ns tCENH CEN Hold after CLK Rise 0.5 0.5 ns tDH Data Input Hold after CLK Rise 0.5 0.5 ns tCEH Chip Enable Hold after CLK Rise 0.5 0.5 ns Hold Times Document #: 38-05688 Rev. *D Page 10 of 15 CY7C1379C Switching Waveforms Read/Write Waveforms[18, 19, 20] 1 2 3 tCYC 4 5 6 7 8 9 A5 A6 A7 10 CLK tCENS tCENH tCES tCEH tCH tCL CEN CE ADV/LD WE BW[A:D] A1 ADDRESS tAS A2 A4 A3 tCDV tAH tDOH tCLZ DQ D(A1) tDS D(A2) Q(A3) D(A2+1) tOEV Q(A4+1) Q(A4) tOELZ WRITE D(A1) WRITE D(A2) D(A5) Q(A6) D(A7) WRITE D(A7) DESELECT tOEHZ tDH OE COMMAND tCHZ BURST WRITE D(A2+1) READ Q(A3) READ Q(A4) DON’T CARE BURST READ Q(A4+1) tDOH WRITE D(A5) READ Q(A6) UNDEFINED Notes: 18. For this waveform ZZ is tied LOW. 19. When CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH. 20. Order of the Burst sequence is determined by the status of the MODE (0 = Linear, 1 = Interleaved). Burst operations are optional. Document #: 38-05688 Rev. *D Page 11 of 15 CY7C1379C Switching Waveforms (continued) NOP, STALL and Deselect Cycles[18, 19, 21] 1 2 A1 A2 3 4 5 A3 A4 6 7 8 9 10 CLK CEN CE ADV/LD WE BW[A:D] ADDRESS A5 tCHZ D(A1) DQ Q(A2) Q(A3) D(A4) Q(A5) tDOH COMMAND WRITE D(A1) READ Q(A2) STALL READ Q(A3) WRITE D(A4) DON’T CARE STALL NOP READ Q(A5) DESELECT CONTINUE DESELECT UNDEFINED ZZ Mode Timing[22, 23] CLK t ZZ ZZ I t ZZREC t ZZI SUPPLY I DDZZ t RZZI ALL INPUTS (except ZZ) Outputs (Q) DESELECT or READ Only High-Z DON’T CARE Notes: 21. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle. 22. Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device. 23. I/Os are in High-Z when exiting ZZ sleep mode. Document #: 38-05688 Rev. *D Page 12 of 15 CY7C1379C Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) 133 Package Diagram Ordering Code CY7C1355C-133AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1355C-133BZC 51-85122 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) CY7C1355C-133BZXC Commercial 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) Lead-Free CY7C1355C-133AXI 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1355C-133BZI 51-85122 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) CY7C1355C-133BZXI 100 Operating Range Part and Package Type lndustrial 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) Lead-Free CY7C1355C-100AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1355C-100BZC 51-85122 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) CY7C1355C-100BZXC Commercial 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) Lead-Free CY7C1355C-100AXI 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1355C-100BZI 51-85122 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) CY7C1355C-100BZXI lndustrial 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm) Lead-Free Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) (51-85050) 16.00±0.20 1.40±0.05 14.00±0.10 81 100 80 1 20.00±0.10 22.00±0.20 0.30±0.08 0.65 TYP. 30 12°±1° (8X) SEE DETAIL A 51 31 50 0.20 MAX. R 0.08 MIN. 0.20 MAX. 0.10 1.60 MAX. 0° MIN. SEATING PLANE STAND-OFF 0.05 MIN. 0.15 MAX. 0.25 NOTE: 1. JEDEC STD REF MS-026 GAUGE PLANE 0°-7° R 0.08 MIN. 0.20 MAX. 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 0.60±0.15 0.20 MIN. 51-85050-*B 1.00 REF. DETAIL Document #: 38-05688 Rev. *D A Page 13 of 15 CY7C1379C Package Diagrams (continued) 165-ball FBGA (13 x 15 x 1.2 mm) (51-85122) 51-85122-*C NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05688 Rev. *D Page 14 of 15 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1379C Document History Page Document Title: CY7C1379C 9-Mbit (256K x 32) Flow-through SRAM with NoBL™ Architecture Document Number: 38-05688 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 286269 See ECN PCI New data sheet *A 320834 See ECN PCI Address expansion pins/balls in the pinouts for all packages are modified as per JEDEC standard Added 133 MHz in the Ordering Information table Changed ΘJA and ΘJC for TQFP Package from 25 and 9 °C/W to 29.41 and 6.13 °C/W respectively Changed ΘJA and ΘJC for FBGA Package from 27 and 6 °C/W to 16.8 and 3.0 °C/W respectively Modified VOL, VOH test conditions Corrected IDD, tCDV, tCH, tDOH and tCL for 100MHz to 180 mA, 7.5 ns, 4 ns, 2 ns and 4 ns respectively Changed Snooze to Sleep in the ZZ Mode Electrical Characteristics and truth table Added Industrial operating range Added BZC package in the Ordering Information table Updated Ordering Information Table *B 377095 See ECN PCI Changed ISB2 from 30 to 40 mA Modified test condition in note# 10 from VDDQ < VDD to VDDQ < VDD *C 408725 See ECN RXU Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 North First Street” to “198 Champion Court” Changed three-state to tri-state Converted from preliminary to final Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the Electrical Characteristics Table Replaced Package Name column with Package Diagram in the Ordering Information table *D 501828 See ECN VKN Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND Updated the Ordering Information table. Document #: 38-05688 Rev. *D Page 15 of 15