AgilentHSME-C110/C120/C150/ C170/C177/C190/C191/C197/C265 AlInGaP Green ChipLED Data Sheet Features • Small size • Industry standard footprint • Operating temperature range of –30˚C to +85˚C • Compatible with IR soldering • Available in 8 mm tape on 7" diameter reel • Reel sealed in zip-locked moisture barrier bags Description This chip-type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. These chipLEDs come in top mounting, top emitting packages (HSMx-C150/170/177/190/191/197), top mounting, side emitting packages (HSMx-C110/120) or reverse mounting, top emitting package (HSMx-C265). All packages are binned by both color and intensity. In order to facilitate pick and place operation, these chipLEDs are shipped in Tape & Reel, with 4000 units per reel for HSMxC120/170/ 177/190/191/197 and 3000 units per reel for HSMxC110/C150/265. Applications • Membrane switch indicator • LCD backlighting • Pushbutton backlighting • Front panel indicator • Symbol backlighting • Keypad backlighting These packages are compatible with reflow soldering process. Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product(s) at anytime. Package Dimensions CATHODE LINE LED DIE CATHODE MARK LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 3.2 (0.126 ) 2.00 (0.079 ) POLARITY CLEAR EPOXY 0.62 (0.024) 1.40 (0.055) DIFFUSED EPOXY POLARITY 1.5 (0.059) 0.30 (0.012) PC BOARD PC BOARD 1.6 (0.063 ) 0.80 (0.031) 0.30 (0.012) 0.5 (0.020) CATHODE LINE 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) 1.0 (0.039) POLARITY POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) PC BOARD 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 HSMx-C191 CATHODE MARK LED DIE 3.40 (0.134) CATHODE MARK (ETCHED) LED DIE 1.6 (0.063) 1.25 (0.049) 0.8 (0.031) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD POLARITY 1.20 (0.047) UNDIFFUSED EPOXY 2– 1.10 (0.043) 1.10 (0.043) PC BOARD 0.5 (0.020) CATHODE LINE 0.30 (0.012) 0.5 ± 0.2 (0.020 ± 0.008) 0.5 ± 0.2 (0.020 ± 0.008) CATHODE LINE 2– 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMx-C265 HSMx-C150 CATHODE MARK CATHODE MARK LED DIE LED DIE 0.6 (0.024) 0.80 (0.031) 1.6 (0.063) 0.40 (0.016) 1.60 (0.063) POLARITY CLEAR EPOXY DIFFUSED EPOXY 0.3 (0.012) POLARITY 1.2 (0.047) 0.40 (0.016) PC BOARD 1.0 (0.039) 0.5 (0.020) PC BOARD 0.16 (0.006) 0.30 ± 0.15 (0.012 ± 0.006) CATHODE LINE 3 – 0.3 (0.012) CATHODE LINE 0.70 (0.028) MIN. SOLDERING TERMINAL HSMx-C197 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3 SOLDERING TERMINAL HSMx-C120 Package Dimensions, continued CATHODE MARK LED DIE 1.25 (0.049) 0.62 (0.025) 2.00 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) PC BOARD 0.16 (0.006) 0.40 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.10 (0.043) SOLDERING TERMINAL HSMx-C177 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 4 Device Selection Guide Package Dimension (mm)[1,2] AlInGaP Green Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused 1.6 (L) x 0.6 (W) x 1.0 (H) HSME-C120 Untinted, Non-diffused 3.2 (L) x 1.0 (W) x 1.5 (H) HSME-C110 Untinted, Non-diffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25°C HSME-C110/120/170/177/ 190/191/197/150/265 Units 20 mA Power Dissipation 52 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range –30 to +85 °C Storage Temperature Range –40 to +85 °C Soldering Temperature See reflow soldering profile (Figures 6 & 7) Parameter DC Forward Current[1,2] Notes: 1. Derate linearly as shown in Figure 4. 2. Drive current above 5 mA is recommended for best long term performance. Electrical Characteristics at TA = 25°C 5 Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ–PIN (°C/W) Typ. HSME-C110/120 2.1 2.6 5 18 550 HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450 HSME-C265 2.1 2.6 5 16 450 Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd[2] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[3] Typ. Luminous Efficacy ηV(lm/w) Typ. HSME-C110 18 52 570 572 130 570 HSME-C120 18 52 570 572 155 570 HSME-150/170/ 190/191 18 50 570 572 170 570 HSME-C177/197 18 50 570 572 130 570 HSME-C265 18 50 570 572 170 570 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Green Color Bin Limits[1] Light Intensity (IV) Bin Limits[1] Intensity (mcd) Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. A 561.5 564.5 A 0.11 0.18 B 564.5 567.5 B 0.18 0.29 C 567.5 570.5 C 0.29 0.45 D 570.5 573.5 D 0.45 0.72 E 573.5 576.5 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 Tolerance: ± 0.5 nm Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 6 100 80 70 60 50 40 30 20 10 0 400 450 500 550 600 650 10 1 0.1 1.5 1.6 700 1.7 1.8 1.9 Figure 1. Relative intensity vs. wavelength. 1.0 0.8 0.6 0.4 0.2 0 2.2 0 5 10 15 20 25 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 100 25 RELATIVE INTENSITY – % 90 20 15 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 ANGLE TA – AMBIENT TEMPERATURE – °C Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150. 100 90 RELATIVE INTENSITY – % 2.1 Figure 2. Forward current vs. forward voltage. Figure 4. Maximum forward current vs. ambient temperature. 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197. 7 2.0 VF – FORWARD VOLTAGE – V WAVELENGTH - nm IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.2 LUMINOUS INTENSITY (NORMALIZED @ 20 mA) 90 IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 30 RELATIVE INTENSITY – % 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 20 40 60 80 100 ANGLE RELATIVE INTENSITY – % 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 ANGLE Figure 5c. Relative intensity vs. angle for HSMx-C110. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5d. Relative intensity vs. angle for HSMx-C120. 8 100 80 70 60 10 SEC. MAX. 50 TEMPERATURE RELATIVE INTENSITY – % 90 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 230°C MAX. 4°C/SEC. MAX. 140-160°C –3°C/SEC. 4°C/SEC. MAX. 10 20 30 40 50 60 70 80 90 OVER 2 MIN. TIME ANGLE Figure 5e. Relative intensity vs. angle for HSMx-C265. Figure 6. Recommended reflow soldering profile. 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 100 - 150 °C 2.2 (0.087) DIA. PCB HOLE 60 to 150 SEC. MAX. 120 SEC. 1.25 (0.049) TIME 1.4 (0.055) * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 7. Recommended Pb-free reflow soldering profile. 2.3 (0.091) 1.4 (0.055) Figure 8. Recommended soldering pattern for HSMx-C265. 5.0 (0.200) 0.4 (0.016) 0.9 (0.035) 0.4 (0.016) 0.9 (0.035) 1.0 (0.039) 0.7 (0.028) 0.2 (0.008) 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) CENTERING BOARD Figure 10. Recommended soldering pattern for HSMx-C110. Figure 9. Recommended soldering pattern for HSMx-C120. 0.8 (0.031) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 11. Recommended soldering pattern for HSMx-C170 and HSMx-C177. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 9 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 12. Recommended soldering pattern for HSMx-C190, HSMx-C191 and HSMx-C197. 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 13. Recommended soldering pattern for HSMx-C150. USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 14. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMx-C110/C120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) 4.00 (0.157) HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES 1.86 (0.073) 1.80 (0.071) 2.30 (0.091) 3.35 (0.132) 3.50 (0.138) 0.89 (0.035) 0.95 (0.037) 1.45 (0.057) 1.85 (0.073) 1.88 (0.074) 0.87 (0.034) 0.87 (0.034) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) HSMx-C120 SERIES HSMx-C197 SERIES HSMx-C177 SERIES 1.90 (0.075) 1.75 (0.069) 2.30 (0.091) 1.15 (0.045) 0.95 (0.037) 1.40 (0.055) 0.80 (0.031) 0.60 (0.024) 0.60 (0.024) HSMx-C110 HSMx-C120 R 1.0 ± 0.05 R 0.5 ± 0.05 (0.039 ± 0.002) (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 11 COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 17. Tape leader and trailer dimensions. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-7659EN April 28, 2004 5989-0520EN Convective IR Reflow Soldering For more information on soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours.