FEATURES FUNCTIONAL BLOCK DIAGRAM Q1 IN THERMAL PROTECTION R1 CC DRIVER gm R2 BANDGAP REF GND Figure 1. APPLICATIONS Notebooks, palmtop computers SCSI terminators Battery-powered systems PCMCIA regulators Bar code scanners Camcorders, cameras OUT ADP3339 02191-0-001 High accuracy over line and load: ±0.9% at 25°C, ±1.5% over temperature Ultralow dropout voltage: 230 mV (typical) at 1.5 A Requires only COUT = 1.0 μF for stability anyCAP = stable with any type of capacitor (including MLCC) Current and thermal limiting Low noise 2.8 V to 6 V input voltage range −40°C to +85°C ambient temperature range SOT-223 package ADP3339 VIN IN 1μF VOUT OUT GND 1μF 02191-0-002 Data Sheet High Accuracy, Ultralow IQ, 1.5 A, anyCAP Low Dropout Regulator ADP3339 Figure 2. Typical Application Circuit GENERAL DESCRIPTION The ADP3339 is a member of the ADP33xx family of precision, low dropout, anyCAP® voltage regulators. The ADP3339 operates with an input voltage range of 2.8 V to 6 V and delivers a load current up to 1.5 A. The ADP3339 stands out from the conventional LDOs with a novel architecture and an enhanced process that enables it to offer performance advantages and higher output current than its competition. Its patented design requires only a 1.0 μF output capacitor for stability. This device is insensitive to output capacitor equivalent series resistance (ESR), and is stable with any good quality capacitor, including ceramic (MLCC) types for space-restricted applications. The ADP3339 achieves exceptional accuracy of ±0.9% at room temperature and ±1.5% over temperature, line, and load variations. The dropout voltage of the ADP3339 is only 230 mV (typical) at 1.5 A. The device also includes a safety current limit and thermal overload protection. The ADP3339 has ultralow quiescent current: 130 μA (typical) in light load situations. Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2001–2011 Analog Devices, Inc. All rights reserved. ADP3339 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation .........................................................................9 Applications....................................................................................... 1 Applications Information .............................................................. 10 Functional Block Diagram .............................................................. 1 Capacitor Selection .................................................................... 10 General Description ......................................................................... 1 Output Current Limit ................................................................ 10 Revision History ............................................................................... 2 Thermal Overload Protection .................................................. 10 Specifications..................................................................................... 3 Calculating Power Dissipation ................................................. 10 Absolute Maximum Ratings............................................................ 4 Printed Circuit Board Layout Considerations ....................... 10 ESD Caution.................................................................................. 4 Outline Dimensions ....................................................................... 11 Pin Configuration and Function Descriptions............................. 5 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 6 REVISION HISTORY 8/11—Rev. B to Rev. C Changes to Ordering Guide .......................................................... 11 4/11—Rev. A to Rev. B Change to Features Section ............................................................. 1 Changed IL to ILOAD Throughout ..................................................... 3 Updated Outline Dimensions ....................................................... 11 Changes to Ordering Guide .......................................................... 11 6/04—Rev. 0 to Rev. A Updated Format..................................................................Universal Changes to Table 1............................................................................ 3 Changes to Thermal Overload Protection Section .................... 10 Updated Outline Dimensions ....................................................... 12 Changes to Ordering Guide .......................................................... 12 10/01—Revision 0: Initial Version Rev. C | Page 2 of 12 Data Sheet ADP3339 SPECIFICATIONS VIN = 6.0 V, CIN = COUT = 1 μF, TJ =–40°C to +125°C, unless otherwise noted. Table 1. Parameter 1, 2 OUTPUT Voltage Accuracy 3 Line Regulation3 Load Regulation Dropout Voltage Peak Load Current Output Noise GROUND CURRENT In Regulation In Dropout 1 2 3 Symbol Conditions Min VOUT VIN = VOUTNOM + 0.5 V to 6 V, ILOAD = 0.1 mA to 1.5 A, TJ = 25°C VIN = VOUTNOM + 0.5 V to 6 V, ILOAD = 0.1 mA to 1.5 A, TJ = –40°C to +125°C VIN = VOUTNOM + 0.5 V to 6 V, ILOAD = 100 mA to 1.5 A, TJ = 150°C VIN = VOUTNOM + 0.5 V to 6 V, TJ = 25°C ILOAD = 0.1 mA to 1.5 A, TJ = 25°C VOUT = 98% of VOUTNOM ILOAD = 1.5 A ILOAD = 1 A ILOAD = 500 mA ILOAD = 100 mA VIN = VOUTNOM + 1 V f = 10 Hz to 100 kHz, CL = 10 μF, ILOAD = 1.5 A –0.9 –1.5 –1.9 VDROP ILDPK VNOISE IGND IGND ILOAD = 1.5 A ILOAD = 1 A ILOAD = 500 mA ILOAD = 100 mA ILOAD = 0.1 mA VIN = VOUTNOM − 100 mV, ILOAD = 0.1 mA All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods. Application stable with no load. VIN = 2.8 V for models with VOUTNOM ≤ 2.3 V. Rev. C | Page 3 of 12 Typ Max Unit +0.9 +1.5 +1.9 % % % mV/V mV/mA 230 180 150 100 2.0 95 480 380 300 mV mV mV mV A μV rms 13 9 5 1 130 100 40 25 15 3 200 300 mA mA mA mA μA μA 0.04 0.004 ADP3339 Data Sheet ABSOLUTE MAXIMUM RATINGS Unless otherwise specified, all voltages are referenced to GND. Table 2. Parameter Input Supply Voltage Power Dissipation Operating Ambient Temperature Range Operating Junction Temperature Range θJA, 4-Layer Board θJC Storage Temperature Range Lead Temperature (Soldering 10 sec) Vapor Phase (60 sec) Infrared (15 sec) Rating –0.3 V to +8.5 V Internally limited –40°C to +85°C –40°C to +150°C 62.3°C/W 26.8°C/W –65°C to +150°C 300°C 215°C 220°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. ESD CAUTION Rev. C | Page 4 of 12 Data Sheet ADP3339 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADP3339 3 IN OUT TOP VIEW (Not to Scale) 1 GND 2 NOTES 1. PIN 2 AND OUT TAB ARE INTERNALLY CONNECTED. 02191-0-003 OUT Figure 3. 3-Lead SOT-223 Pin Configuration Table 3. Pin Function Descriptions Pin No. 1 2 3 Mnemonic GND OUT IN Description Ground Pin. Output of the Regulator. Bypass to ground with a 1 μF or larger capacitor. Regulator Input. Bypass to ground with a 1 μF or larger capacitor. Rev. C | Page 5 of 12 ADP3339 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. 3.301 14 ILOAD = 0A 3.300 VIN = 6V VOUT = 3.0V 12 VOUT = 3.3V GROUND CURRENT (mA) 3.298 ILOAD = 500mA 3.297 ILOAD = 1A 3.295 ILOAD = 1.5A 02191-0-004 3.293 4 6 4 2 3.294 3 8 6 5 INPUT VOLTAGE (V) 0 0 Figure 7. Ground Current vs. Load Current Figure 4. Output Voltage vs. Input Voltage 3.301 1.0 VIN = 6V VOUT = 3.3V VIN = 6V 0.8 OUTPUT VOLTAGE (%) 3.299 3.298 3.297 3.296 ILOAD = 1A 0.6 ILOAD = 10mA 0.4 ILOAD = 500mA 0.2 0 3.295 3.294 0 0.5 1.0 LOAD CURRENT (A) 1.5 02191-0-005 ILOAD = 1.5A –0.2 –40 –20 0 20 40 60 80 100 JUNCTION TEMPERATURE (°C) 120 140 02191-0-008 OUTPUT VOLTAGE (V) 3.300 Figure 8. Output Voltage Variation Percentage vs. Junction Temperature Figure 5. Output Voltage vs. Load Current 180 25 VOUT = 3.3V VOUT = 3.3V ILOAD = 0A 160 20 GROUND CURRENT (mA) 140 120 100 80 60 40 ILOAD = 1.5A 15 ILOAD = 1A ILOAD = 0.5A 10 5 20 ILOAD = 1mA 0 0 2 4 INPUT VOLTAGE (V) 6 02191-0-006 GROUND CURRENT (μA) 1.5 0.5 1.0 LOAD CURRENT (A) 02191-0-007 3.296 10 0 –40 Figure 6. Ground Current vs. Supply Voltage 110 10 60 JUNCTION TEMPERATURE (°C) Figure 9. Ground Current vs. Junction Temperature Rev. C | Page 6 of 12 160 02191-0-009 OUTPUT VOLTAGE (V) 3.299 Data Sheet ADP3339 250 VOUT = 3.3V COUT = 10μF ILOAD = 1.5A VOUT = 3.3V 3.31 200 DROPOUT (mV) 3.30 3.29 VOLTS 150 100 5 50 0 0 0.2 0.4 1.0 0.6 0.8 LOAD CURRENT (mA) 1.2 1.4 40 120 140 TIME (μs) 220 180 Figure 13. Line Transient Response Figure 10. Dropout Voltage vs. Load Current VOUT = 3.3V ILOAD = 1.5A VIN = 6V COUT = 10μF VOLTS 3.5 3.3 3 3.1 2 1.5 1 1.0 0 0.5 A INPUT/OUTPUT VOLTAGE (V) 80 02191-0-013 02191-0-010 4 2 3 4 5 6 TIME (μs) 7 8 9 10 0 400 600 TIME (μs) 800 1000 1000 Figure 14. Load Transient Response Figure 11. Power-Up/Power-Down VOUT = 3.3V COUT = 1μF ILOAD = 1.5A VIN = 6V COUT = 1μF 3.5 VOLTS 3.31 200 02191-0-014 1 02191-0-015 0 02191-0-011 0 3.30 3.3 3.1 VOLTS 3.29 1.5 A 1.0 5 0.5 0 40 80 120 140 TIME (μs) 180 220 02191-0-012 4 0 200 400 600 TIME (μs) 800 Figure 15. Load Transient Response Figure 12. Line Transient Response Rev. C | Page 7 of 12 ADP3339 Data Sheet 600 VOLTS VIN = 6V 3.3 500 RMS NOISE (μV) 0 3 A 2 400 300 ILOAD = 1.5A 200 1 100 0 400 600 TIME (μs) 800 1000 0 VOLTAGE NOISE SPECTRAL DENSITY (μV/ Hz) 0 VOUT = 3.3V CL = 1μF ILOAD = 1.5A CL = 10μF ILOAD = 1.5A –60 –70 CL = 10μF ILOAD = 0 C = 1μF L ILOAD = 0 –80 –90 –100 10 100 1k 10k FREQUENCY (Hz) 100k 1M 02191-0-017 RIPPLE REJECTION (dB) –20 –50 20 30 40 1M Figure 18. RMS Noise vs. CL (10 Hz to 100 kHz) –10 –40 10 CL (μF) Figure 16. Short-Circuit Current –30 50 02191-0-018 200 02191-0-019 0 02191-0-016 ILOAD = 0A 0 100 10 1 CL = 1μF 0.1 CL = 10μF 0.01 0.001 10 100 10k 1k FREQUENCY (Hz) Figure 19. Output Noise Density Figure 17. Power Supply Ripple Rejection Rev. C | Page 8 of 12 100k Data Sheet ADP3339 THEORY OF OPERATION Most LDOs place very strict requirements on the range of ESR values for the output capacitor because they are difficult to stabilize due to the uncertainty of load capacitance and resistance. Moreover, the ESR value required to keep conventional LDOs stable changes depending on load and temperature. These ESR limitations make designing with LDOs more difficult because of their unclear specifications and extreme variations over temperature. The ADP3339 anyCAP LDO uses a single control loop for regulation and reference functions. The output voltage is sensed by a resistive voltage divider, consisting of R1 and R2, which is varied to provide the available output voltage option. Feedback is taken from this network by way of a series diode (D1) and a second resistor divider (R3 and R4) to the input of an amplifier. A very high gain error amplifier is used to control this loop. The amplifier is constructed in such a way that equilibrium produces a large, temperature-proportional input offset voltage that is repeatable and very well controlled. The temperature-proportional offset voltage is combined with the complementary diode voltage to form a virtual band gap voltage that is implicit in the network, although it never appears explicitly in the circuit. Ultimately, this patented design makes it possible to control the loop with only one amplifier. This technique also improves the noise characteristics of the amplifier by providing more flexibility on the trade-off of noise sources that leads to a low noise design. With the ADP3339 anyCAP LDO, this is no longer true. The ADP3339 can be used with virtually any good quality capacitor, with no constraint on the minimum ESR. This innovative design allows the circuit to be stable with just a small 1 μF capacitor on the output. Additional advantages of the polesplitting scheme include superior line noise rejection and very high regulator gain, which lead to excellent line and load regulation. An impressive ±1.5% accuracy is guaranteed over line, load, and temperature. Additional features of the circuit include current limit and thermal shutdown. VIN C2 1μF C1 1μF IN OUT Figure 20. Typical Application Circuit INPUT OUTPUT COMPENSATION CAPACITOR Q1 NONINVERTING WIDEBAND DRIVER gm GND ADP3339 The patented amplifier controls a new and unique noninverting driver that drives the pass transistor, Q1. The use of this special noninverting driver enables the frequency compensation to include the load capacitor in a pole-splitting arrangement to achieve reduced sensitivity to the value, type, and ESR of the load capacitance. ATTENUATION (VBANDGAP/VOUT) R3 PTAT VOS R1 D1 (a) R4 PTAT CURRENT RLOAD R2 02191-0-020 ADP3339 CLOAD GND Figure 21. Functional Block Diagram Rev. C | Page 9 of 12 VOUT 02191-0-021 The R1/R2 divider is chosen in the same ratio as the band gap voltage to the output voltage. Although the R1/R2 resistor divider is loaded by Diode D1 and a second divider consisting of R3 and R4, the values can be chosen to produce a temperaturestable output. This unique arrangement specifically corrects for the loading of the divider, thus avoiding the error resulting from base current loading in conventional circuits. ADP3339 Data Sheet APPLICATIONS INFORMATION Therefore, for a junction temperature of 125°C and a maximum ambient temperature of 85°C, the required thermal resistance from junction to ambient is CAPACITOR SELECTION Output Capacitor The stability and transient response of the LDO is a function of the output capacitor. The ADP3339 is stable with a wide range of capacitor values, types, and ESR (anyCAP). A capacitor as low as 1 μF is all that is needed for stability. A higher capacitance may be necessary if high output current surges are anticipated, or if the output capacitor cannot be located near the output and ground pins. The ADP3339 is stable with extremely low ESR capacitors (ESR ≈ 0) such as multilayer ceramic capacitors (MLCC) or OSCON. Note that the effective capacitance of some capacitor types falls below the minimum over temperature or with dc voltage. Input Capacitor An input bypass capacitor is not strictly required but is recommended in any application involving long input wires or high source impedance. Connecting a 1 μF capacitor from the input to ground reduces the circuit’s sensitivity to PC board layout and input transients. If a larger output capacitor is necessary, a larger value input capacitor is also recommended. θ JA = 125°C − 85°C 1.246 W = 32.1°C/W PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS The thermal resistance, θJA, of SOT-223 is determined by the sum of the junction-to-case and the case-to-ambient thermal resistances. The junction-to-case thermal resistance, θJC, is determined by the package design and specified at 26.8°C/W. However, the case-to-ambient thermal resistance is determined by the printed circuit board design. As shown in Figure 22, the amount of copper onto which the ADP3339 is mounted affects thermal performance. When mounted onto the minimal pads of 2 oz. copper (see Figure 22a), θJA is 126.6°C/W. Adding a small copper pad under the ADP3339 (see Figure 22b) reduces the θJA to 102.9°C/W. Increasing the copper pad to 1 square inch (see Figure 22c) reduces the θJA even further, to 52.8°C/W. OUTPUT CURRENT LIMIT 02191-0-022 The ADP3339 is short-circuit protected by limiting the pass transistor’s base drive current. The maximum output current is limited to about 3 A. See Figure 16. THERMAL OVERLOAD PROTECTION The ADP3339 is protected against damage due to excessive power dissipation by its thermal overload protection circuit. Thermal protection limits the die temperature to a maximum of 160°C. Under extreme conditions (that is, high ambient temperature and power dissipation) where the die temperature starts to rise above 160°C, the output current is reduced until the die temperature has dropped to a safe level. Current and thermal limit protections are intended to protect the device against accidental overload conditions. For normal operation, the device’s power dissipation should be externally limited so that the junction temperature does not exceed 150°C. CALCULATING POWER DISSIPATION a PD = (VIN – VOUT) × ILOAD + (VIN × IGND) Use the following general guidelines when designing printed circuit boards: 1. 2. 3. 5. where ILOAD and IGND are the load current and ground current, and VIN and VOUT are the input and output voltages, respectively. Assuming worst-case operating conditions are ILOAD = 1.5 A, IGND = 14 mA, VIN = 3.3 V, and VOUT = 2.5 V, the device power dissipation is c Figure 22. PCB Layouts 4. Device power dissipation is calculated as follows: b 6. PD = (3.3 V – 2.5 V) × 1500 mA + (3.3 V × 14 mA) = 1246 mW Rev. C | Page 10 of 12 Keep the output capacitor as close to the output and ground pins as possible. Keep the input capacitor as close to the input and ground pins as possible. PC board traces with larger cross sectional areas remove more heat from the ADP3339. For optimum heat transfer, use thick copper and use wide traces. The thermal resistance can be decreased by adding a copper pad under the ADP3339, as shown in Figure 22b. If possible, use the adjacent area to add more copper around the ADP3339. Connecting the copper area to the output of the ADP3339, as shown in Figure 22c, is best, but thermal performance is improved even if it is connected to other pins. Use additional copper layers or planes to reduce the thermal resistance. Again, connecting the other layers to the output of the ADP3339 is best, but is not necessary. When connecting the output pad to other layers, use multiple vias. Data Sheet ADP3339 OUTLINE DIMENSIONS *3.15 3.00 2.95 7.30 7.00 6.70 3.70 3.50 3.30 1 2 3 *0.85 0.70 0.65 1.70 1.50 2.30 BSC 1.05 0.85 6.70 6.50 6.30 1.30 1.10 0.35 0.26 0.24 16° 10° GAUGE PLANE 10° MAX 0.10 0.02 0.25 4.60 BSC 0.75 MIN 16° 10° *COMPLIANT TO JEDEC STANDARDS TO-261-AA WITH THE EXCEPTION TO LEAD WIDTH. 103107-A SEATING PLANE Figure 23. 3-Lead Small Outline Transistor Package [SOT-223] (KC-3) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP3339AKC-1.5-RL ADP3339AKCZ-1.5-RL ADP3339AKCZ-1.5-R7 ADP3339AKCZ-1.8-RL ADP3339AKCZ-1.8-R7 ADP3339AKCZ-2.5-RL ADP3339AKCZ-2.5-R7 ADP3339AKC-2.85-RL ADP3339AKCZ-3-R7 ADP3339AKC-3.3-RL ADP3339AKCZ-3.3-RL ADP3339AKCZ-3.3-R7 ADP3339AKCZ-5-R7 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Output Voltage (V) 1.5 1.5 1.5 1.8 1.8 2.5 2.5 2.85 3.0 3.3 3.3 3.3 5 Package Description 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 3-Lead SOT-223 Z = RoHS Compliant Part. This package option is halide free. Rev. C | Page 11 of 12 Package Option 2 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 KC-3 Branding L1C L1C L19 L19 L1D L1D L3F L1A L1A L1A L3G ADP3339 Data Sheet NOTES ©2001–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D02191-0-8/11(C) Rev. C | Page 12 of 12