ON NBC12439FNG 3.3v/5v programmable pll synthesized clock generator Datasheet

NBC12439, NBC12439A
3.3V/5V Programmable PLL
Synthesized Clock
Generator
50 MHz to 800 MHz
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Description
The NBC12439 and NBC12439A are general purpose, PLL based
synthesized clock sources. The VCO will operate over a frequency
range of 400 MHz to 800 MHz. The VCO frequency is sent to the
N−output divider, where it can be configured to provide division ratios
of 1, 2, 4 or 8. The VCO and output frequency can be programmed
using the parallel or serial interfaces to the configuration logic. Output
frequency steps of 16 MHz, 8 MHz, 4 MHz, or 2 MHz can be
achieved using a 16 MHz crystal, depending on the output divider
settings. The PLL loop filter is fully integrated and does not require
any external components.
MARKING
DIAGRAMS
1 28
NBC12439xG
AWLYYWW
PLCC−28
FN SUFFIX
CASE 776
Features
•
•
•
•
•
•
•
•
•
•
Best−in−Class Output Jitter Performance, ±20 ps Peak−to−Peak
50 MHz to 800 MHz Programmable Differential PECL Outputs
Fully Integrated Phase−Lock−Loop with Internal Loop Filter
Parallel Interface for Programming Counter and Output Dividers
During Powerup
Minimal Frequency Overshoot
NBC12
439x
AWLYYWWG
LQFP−32
FA SUFFIX
CASE 873A
1
Serial 3−Wire Programming Interface
1
Crystal Oscillator Inputs 10 MHz to 20 MHz
32
QFN32
MN SUFFIX
CASE 488AM
Operating Range: VCC = 3.135 V to 5.25 V
CMOS and TTL Compatible Control Inputs
Pin and Function Compatible with Motorola MC12439 and
MPC9239
Powerdown of PECL Outputs (B16)
•
• 0°C to 70°C Ambient Operating Temperature (NBC12439)
• −40°C to 85°C Ambient Operating Temperature (NBC12439A)
• Pb−Free Packages are Available
x
A
WL, L
YY, Y
WW, W
G or G
NBC12
439x
AWLYYWWG
G
= Blank or A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
January, 2009 − Rev. 14
1
Publication Order Number:
NBC12439/D
NBC12439, NBC12439A
+3.3 or 5.0 V
PWR_DOWN
1
PLL_VCC
2
B2
XTAL_SEL
10−20MHz
XTAL1
7−BIT B M
COUNTER
B2
VCC
24
23
BN
(1, 2, 4, 8)
400−800
MHz
21, 25
FOUT
FOUT
20
XTAL2
LATCH
6
TEST
LATCH
28
LATCH
7
P_LOAD
0
S_CLOCK
+3.3 or 5.0 V
VCO
OSC
5
S_DATA
POWER
DOWN
3
4
S_LOAD
PHASE
DETECTOR
15
FREF_EXT
OE
FREF
27
1
0
1
2−BIT SR
7−BIT SR
3−BIT SR
26
17, 18
8 → 14
22, 19
7
2
M[6:0]
N[1:0]
Figure 1. Block Diagram (28−Lead PLCC)
Table 1. Output Division
Table 2. XTAL_SEL And OE
N [1:0]
Output Division
Input
0
1
00
01
10
11
2
4
8
1
PWR_DOWN
XTAL_SEL
OE*
FOUT
FREF_EXT
Outputs Disabled
FOUT B 16
XTAL
Outputs Enabled
*When disabled, FOUT goes LOW, FOUT goes HIGH.
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2
28
16
NC
PLL_VCC
1
15
XTAL_SEL
PWR_DOWN
2
14
M[6]
FREF_EXT
3
13
M[5]
XTAL1
4
12
M[4]
5
6
7
8
9
10
11
M[3]
S_LOAD
M[2]
N[0]
M[1]
17
M[0]
27
P_LOAD
S_DATA
OE
N[1]
XTAL2
18
GND
19
TEST
GND
20
VCC
TEST
21
VCC
VCC
22
GND
GND
23
FOUT
FOUT
24
26
FOUT
FOUT
25
S_CLOCK
VCC
VCC
NBC12439, NBC12439A
32
31
30
29
28
27
26
25
25
N[1]
3
22
N[0]
PLL_VCC
4
21
NC
PLL_VCC
5
20
XTAL_SEL
PWR_DOWN
6
19
M[6]
FREF_EXT
7
18
M[5]
XTAL1
8
17
M[4]
S_LOAD
3
22
N[0]
PLL_VCC
4
21
NC
PLL_VCC
5
20
XTAL_SEL
PWR_DOWN
6
19
M[6]
FREF_EXT
7
18
M[5]
XTAL1
8
17
M[4]
9
10
11
12
13
14
15
16
N/C
N[1]
M[3]
23
M[2]
2
M[1]
S_DATA
M[0]
N/C
P_LOAD
24
OE
1
XTAL2
S_CLOCK
9
10
11
12
13
14
15
16
N/C
GND
26
23
M[3]
TEST
27
2
M[2]
VCC
28
S_DATA
S_LOAD
M[1]
VCC
29
N/C
M[0]
GND
30
24
P_LOAD
FOUT
31
1
OE
FOUT
32
S_CLOCK
XTAL2
VCC
Figure 2. 28−Lead PLCC (Top View)
Figure 3. 32−Lead LQFP (Top View)
Exposed Pad (EP)
Figure 4. 32−Lead QFN (Top View)
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3
NBC12439, NBC12439A
The following gives a brief description of the functionality of the NBC12439 and NBC12349A Inputs and Outputs. Unless
explicitly stated, all inputs are CMOS/TTL compatible with either pull−up or pulldown resistors. The PECL outputs are
capable of driving two series terminated 50 W transmission lines on the incident edge.
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Table 3. PIN FUNCTION DESCRIPTION
Pin Name
Function
Description
INPUTS
XTAL1, XTAL2
Crystal Inputs
These pins form an oscillator when connected to an external series−resonant
crystal.
S_LOAD*
CMOS/TTL Serial Latch Input
(Internal Pulldown Resistor)
This pin loads the configuration latches with the contents of the shift registers.
The latches will be transparent when this signal is HIGH; thus, the data must be
stable on the HIGH−to−LOW transition of S_LOAD for proper operation.
S_DATA*
CMOS/TTL Serial Data Input
(Internal Pulldown Resistor)
This pin acts as the data input to the serial configuration shift registers.
S_CLOCK*
CMOS/TTL Serial Clock Input
(Internal Pulldown Resistor)
This pin serves to clock the serial configuration shift registers. Data from S_DATA
is sampled on the rising edge.
P_LOAD**
CMOS/TTL Parallel Latch Input
(Internal Pullup Resistor)
This pin loads the configuration latches with the contents of the parallel inputs
.The latches will be transparent when this signal is LOW; therefore, the parallel
data must be stable on the LOW−to−HIGH transition of P_LOAD for proper operation.
M[6:0]**
CMOS/TTL PLL Loop Divider
Inputs (Internal Pullup Resistor)
These pins are used to configure the PLL loop divider. They are sampled on the
LOW−to−HIGH transition of P_LOAD. M[6] is the MSB, M[0] is the LSB.
N[1:0]**
CMOS/TTL Output Divider Inputs
(Internal Pullup Resistor)
These pins are used to configure the output divider modulus. They are sampled
on the LOW−to−HIGH transition of P_LOAD.
OE**
CMOS/TTL Output Enable Input
(Internal Pullup Resistor)
Active HIGH Output Enable. The Enable is synchronous to eliminate possibility of
runt pulse generation on the FOUT output. When Disabled, FOUT goes LOW and
FOUT.
FREF_EXT*
CMOS/TTL Input
(Internal Pulldown Resistor)
This pin can be used as the PLL Reference
XTAL_SEL**
CMOS/TTL Input
(Internal Pullup Resistor)
This pin selects between the crystal and the FREF_EXT source for the PLL reference signal. A HIGH selects the crystal input.
PWR_DOWN
CMOS/TTL Input
(Internal Pulldown Resistor)
PWR_DOWN forces the FOUT outputs to synchronously reduce frequency by a
factor of 16.
FOUT, FOUT
PECL Differential Outputs
These differential, positive−referenced ECL signals (PECL) are the outputs of the
synthesizer.
TEST
CMOS/TTL Output
The function of this output is determined by the serial configuration bits T[2:0].
VCC
Positive Supply for the Logic
The positive supply for the internal logic and output buffer of the chip, and is connected to +3.3 V or +5.0 V.
PLL_VCC
Positive Supply for the PLL
This is the positive supply for the PLL and is connected to +3.3 V or +5.0 V.
GND
Negative Power Supply
These pins are the negative supply for the chip and are normally all connected to
ground.
−
Exposed Pad for QFN−32 only
The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to
the die for improved heat transfer out of package. The exposed pad must be attached to a heat−sinking conduit. The pad is electrically connected to GND.
OUTPUTS
POWER
* When left Open, these inputs will default LOW.
** When left Open, these inputs will default HIGH.
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4
NBC12439, NBC12439A
Table 4. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
37.5 kW
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity (Note 1)
PLCC
LQFP
QFN
Flammability Rating
Oxygen Index: 28 to 34
> 2 kV
> 150 V
> 1 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 2
Level 1
Level 3
Level 2
Level 1
UL 94 V−0 @ 0.125 in
Transistor Count
2269
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
VCC
Positive Supply
GND = 0 V
VI
Input Voltage
GND = 0 V
Iout
Output Current
Continuous
Surge
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
qJA
Condition 2
VI VCC
NB12439
NB12439A
Rating
Unit
6
V
6
V
50
100
mA
mA
0 to 70
−40 to +85
°C
−65 to +150
°C
PLCC−28
PLCC−28
63.5
43.5
°C/W
°C/W
Standard Board
PLCC−28
22 to 26
°C/W
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
LQFP−32
LQFP−32
80
55
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
LQFP−32
12 to 17
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
QFN−32
QFN−32
31
27
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P
QFN−32
12
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<3 sec @ 248°C
<3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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NBC12439, NBC12439A
Table 6. DC CHARACTERISTICS (VCC = 3.3 V ± 5%; TA = 0°C to 70°C (NBC12439), TA = −40°C to 85°C (NBC12439A))
Characteristic
Symbol
Condition
Min
2.0
VIH
LVCMOS/
LVTTL
Input HIGH Voltage
VCC = 3.3 V
VIL
LVCMOS/
LVTTL
Input LOW Voltage
VCC = 3.3 V
IIN
Input Current
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VOH
PECL
Output HIGH Voltage
VOL
PECL
Output LOW Voltage
ICC
Power Supply Current
IOH = −0.8 mA
TEST
Typ
FOUT
FOUT
FOUT
FOUT
Unit
V
0.8
V
1.0
mA
2.5
V
IOL = 0.8 mA
TEST
Max
0.4
V
VCC = 3.3 V
(Notes 2, 3)
2.155
2.405
V
VCC = 3.3 V
(Notes 2, 3)
1.355
1.675
V
80
28
mA
mA
44
19
VCC
PLL_VCC
58
23
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. FOUT/FOUT output levels will vary 1:1 with VCC variation.
3. FOUT/FOUT outputs are terminated through a 50 W resistor to VCC − 2.0 volts.
Table 7. DC CHARACTERISTICS (VCC = 5.0 V ± 5%; TA = 0°C to 70°C (NBC12439), TA = −40°C to 85°C (NBC12439A))
Condition
Min
VIH
CMOS/
TTL
Symbol
Input HIGH Voltage
Characteristic
VCC = 5.0 V
2.0
Typ
Max
Min
Typ
VIL
CMOS/
TTL
Input LOW Voltage
VCC = 5.0 V
IIN
Input Current
VOH
Output HIGH Voltage
TEST
IOH = −0.8 mA
VOL
Output LOW Voltage
TEST
IOL = 0.8 mA
VOH
PECL
Output HIGH Voltage
FOUT
FOUT
VCC = 5.0 V
(Notes 4, 5)
3.855
4.105
3.855
4.105
VOL
PECL
Output LOW Voltage
FOUT
FOUT
VCC = 5.0 V
(Notes 4, 5)
3.055
3.305
3.055
ICC
Power Supply Current
VCC
PLL_VCC
85
28
47
19
Typ
Max
2.0
Unit
V
0.8
0.8
V
1.0
1.0
1.0
mA
2.5
2.5
0.4
58
24
Min
0.8
2.5
47
19
Max
2.0
V
0.4
60
24
0.4
V
3.855
4.105
V
3.305
3.055
3.305
V
85
28
47
19
85
28
mA
mA
60
24
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. FOUT/FOUT output levels will vary 1:1 with VCC variation.
5. FOUT/FOUT outputs are terminated through a 50 W resistor to VCC − 2.0 volts.
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NBC12439, NBC12439A
Table 8. AC CHARACTERISTICS (VCC = 3.135 V to 5.25 V ± 5%; TA = 0°C to 70°C (NBC12439), TA = −40°C to 85°C
(NBC12439A)) (Note 7)
Characteristic
Symbol
Condition
Min
Max
Unit
−
10
10
10
20
100
MHz
400
50
800
800
MHz
10
ms
50 MHz v fOUT < 100 MHz
100 MHz v fOUT < 800 MHz
8
5
ps
50 MHz v fOUT < 100 MHz
100 MHz v fOUT < 800 MHz
"40
"20
ps
20
20
20
−
−
−
ns
S_DATA to S_CLOCK
S_CLOCK to S_LOAD
M, N to P_LOAD
20
20
20
−
−
−
ns
S_LOAD
P_LOAD
50
50
−
−
ns
47.5
52.5
%
175
425
ps
FIN
Input Frequency
S_CLOCK
Xtal Oscillator
FREF_EXT (Note 8)
FOUT
Output Frequency
tLOCK
Maximum PLL Lock Time
tjitter(pd)
Period Jitter (RMS)
(1s)
tjitter(cyc−cyc)
Cycle−to−Cycle Jitter (Peak−to−Peak)
(8s)
ts
Setup Time
S_DATA to S_CLOCK
S_CLOCK to S_LOAD
M, N to P_LOAD
th
Hold Time
tpwMIN
Minimum Pulse Width
DCO
Output Duty Cycle
tr, tf
Output Rise/Fall
(Note 6)
VCO (Internal)
FOUT
FOUT
20%−80%
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. 10 MHz is the maximum frequency to load the feedback divide registers. S_CLOCK can be switched at higher frequencies when used as
a test clock in TEST_MODE 6.
7. FOUT/FOUT outputs are terminated through a 50 W resistor to VCC − 2.0 V. Internal phase detector can handle up to 100 MHz on it’s input.
8. Maximum frequency on FREF_EXT is a function of setting the appropriate M counter value for the VCO to operate within the valid range
of 400 MHz v fVCO v 800 MHz. (See Table 11)
9. See applications information section.
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NBC12439, NBC12439A
FUNCTIONAL DESCRIPTION
for the output driver and the internal logic is separated from
the power supply for the phase−locked loop to minimize
noise induced jitter.
The configuration logic has two sections: serial and
parallel. The parallel interface uses the values at the M[6:0]
and N[1:0] inputs to configure the internal counters.
Normally upon system reset, the P_LOAD input is held
LOW until sometime after power becomes valid. On the
LOW−to−HIGH transition of P_LOAD, the parallel inputs
are captured. The parallel interface has priority over the
serial interface. Internal pullup resistors are provided on the
M[6:0] and N[1:0] inputs to reduce component count in the
application of the chip.
The serial interface logic is implemented with a fourteen
bit shift register scheme. The register shifts once per rising
edge of the S_CLOCK input. The serial input S_DATA must
meet setup and hold timing as specified in the AC
Characteristics section of this document. With P_LOAD
held high, the configuration latches will capture the value of
the shift register on the HIGH−to−LOW edge of the
S_LOAD input. See the programming section for more
information.
The TEST output reflects various internal node values and
is controlled by the T[2:0] bits in the serial data stream. See
the programming section for more information.
The internal oscillator uses the external quartz crystal as
the basis of its frequency reference. The output of the
reference oscillator is divided by 2 before being sent to the
phase detector. With a 16 MHz crystal, this provides a
reference frequency of 8 MHz. Although this data sheet
illustrates functionality only for a 16 MHz crystal, Table 9,
any crystal in the 10 − 20 MHz range can be used, Table 11.
The VCO within the PLL operates over a range of 400 to
800 MHz. Its output is scaled by a divider, M divider, that is
configured by either the serial or parallel interfaces. The
output of this loop divider is also applied to the phase
detector.
The phase detector and the loop filter force the VCO
output frequency to be M times the reference frequency by
adjusting the VCO control voltage. Note that for some
values of M (either too high or too low), the PLL will not
achieve loop lock.
The output of the VCO is also passed through an output
divider before being sent to the PECL output driver. This
N output divider is configured through either the serial or the
parallel interfaces and can provide one of four division ratios
(1, 2, 4, or 8). This divider extends the performance of the
part while providing a 50% duty cycle.
The output driver is driven differentially from the output
divider and is capable of driving a pair of transmission lines
terminated into 50 W to VCC − 2.0 V. The positive reference
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Table 9. Programming VCO Frequency Function Table with 16 MHz Crystal
64
32
16
8
4
2
1
M Count Divisor
M6
M5
M4
M3
M2
M1
M0
25
0
0
1
1
0
0
1
416
26
0
0
1
1
0
1
0
432
27
0
0
1
1
0
1
1
448
28
0
0
1
1
1
0
0
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
752
47
0
1
0
1
1
1
1
768
48
0
1
1
0
0
0
0
784
49
0
1
1
0
0
0
1
800
50
0
1
1
0
0
1
0
VCO
Frequency (MHz)
400
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8
NBC12439, NBC12439A
PROGRAMMING INTERFACE
The input frequency and the selection of the feedback
divider M is limited by the VCO frequency range and
fXTAL. M must be configured to match the VCO frequency
range of 400 to 800 MHz in order to achieve stable PLL
operation.
Programming the NBC12439 and NBC12439A is
accomplished by properly configuring the internal dividers
to produce the desired frequency at the outputs. The output
frequency can by represented by this formula:
F OUT + ǒ(F XTAL or FREF_EXT B 2) 2 MǓ B N (eq. 1)
This can be simplified to:
F OUT + ǒ(F XTAL or FREF_EXT)
MǓ B N
(eq. 2)
where FXTAL is the crystal frequency, M is the loop divider
modulus, and N is the output divider modulus. Note that it
is possible to select values of M such that the PLL is unable
to achieve loop lock. To avoid this, always make sure that M
is selected to be 25 ≤ M ≤ 50 for a 16 MHz input reference.
See Table 11.
Assuming that a 16 MHz reference frequency is used the
above equation reduces to:
FOUT + 16M B N
(eq. 3)
Substituting the four values for N (1, 2, 4, 8) yields:
Table 10. Programmable Output Divider Function
Table
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
FOUT
Output Frequency
Range (MHz)*
FOUT
Step
N1
N0
N Divider
1
1
B1
M
16
400−800
16 MHz
0
0
B2
M
8
200−400
8 MHz
0
1
B4
M
4
100−200
4 MHz
1
0
B8
M
2
50−100
2 MHz
*For crystal frequency of 16 MHz.
The user can identify the proper M and N values for the
desired frequency from the above equations. The four output
frequency ranges established by N are 400−800 MHz,
200 − 400 MHz,
100 − 200 MHz and
50 − 100 MHz,
respectively. From these ranges, the user will establish the
value of N required. The value of M can then be calculated
based on Equation 1. For example, if an output frequency of
384 MHz was desired, the following steps would be taken to
identify the appropriate M and N values. 384 MHz falls
within the frequency range set by an N value of 2; thus, N
[1:0]
=
00.
For N = 2, FOUT = 8M and M = FOUT B 8. Therefore,
M = 384 B 8 = 48, so M[6:0] = 0110000. Following this same
procedure, a user can generate a selected frequency. The size
of the programmable frequency steps of FOUT will be equal
to FXTAL ÷ N.
For input reference frequencies other than 16 MHz, see
Table 11, which shows the usable VCO frequency and M
divider range.
(eq. 4)
M max + fVCOmax B FXTAL
(eq. 5)
The value for M falls within the constraints set for PLL
stability. If the value for M fell outside of the valid range, a
different N value would be selected to move M in the
appropriate direction.
The M and N counters can be loaded either through a
parallel or serial interface. The parallel interface is
controlled via the P_LOAD signal such that a LOW to HIGH
transition will latch the information present on the M[6:0]
and N[1:0] inputs into the M and N counters. When the
P_LOAD signal is LOW, the input latches will be
transparent and any changes on the M[6:0] and N[1:0] inputs
will affect the FOUT output pair. To use the serial port, the
S_CLOCK signal samples the information on the S_DATA
line and loads it into a 12 bit shift register. Note that the
P_LOAD signal must be HIGH for the serial load operation
to function. The Test register is loaded with the first three
bits, the N register with the next two, and the M register with
the final nine bits of the data stream on the S_DATA input.
For each register, the most significant bit is loaded first (T2,
N1, and M6). The HIGH to LOW transition on the S_LOAD
input will latch the new divide values into the counters. A
pulse on the S_LOAD pin after the shift register is fully
loaded will transfer the divide values into the counters.
Figures 5 and 6 illustrate the timing diagram for both a
parallel and a serial load of the device synthesizer.
M[6:0] and N[1:0] are normally specified after power−up
through the parallel interface, and then possibly, fine tuned
again through the serial interface. This approach allows the
application to ramp up at one frequency and then change or
fine−tune the clock as the ability to control the serial
interface becomes available.
The TEST output provides visibility for one of the several
internal nodes as determined by the T[2:0] bits in the serial
configuration stream. It is not configurable through the
parallel interface. The T2, T1, and T0 control bits are preset
to ‘000’ when P_LOAD is LOW so that the PECL FOUT
outputs are as jitter−free as possible. Any active signal on the
TEST output pin will have detrimental affects on the jitter
of the PECL output pair. In normal operations, jitter
specifications are only guaranteed if the TEST output is
static. The serial configuration port can be used to select one
of the alternate functions for this pin.
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9
M min + fVCOmin B FXTAL and
NBC12439, NBC12439A
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
Table 11. Frequency Operating Range
M
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
VCO Frequency (MHz) Range for a Crystal Frequency (MHz) of:
M[6:0]
10
12
14
16
0010100
0010101
0010110
0010111
0011000
0011001
400
0011010
416
0011011
432
0011100
448
0011101
406
464
0011110
420
480
0011111
434
496
0100000
448
512
0100001
462
528
0100010
408
476
544
0100011
420
490
560
0100100
432
504
576
0100101
444
518
592
0100110
456
532
608
0100111
468
546
624
0101000
400
480
560
640
0101001
410
492
574
656
0101010
420
504
588
672
0101011
430
516
602
688
0101100
440
528
616
704
0101101
450
540
630
720
0101110
460
552
644
736
0101111
470
564
658
752
0110000
480
576
672
768
0110001
490
588
686
784
0110010
500
600
700
800
0110011
510
612
714
0110100
520
624
728
0110101
530
636
742
0110110
540
648
756
0110111
550
660
770
0111000
560
672
784
0111001
570
684
798
0111010
580
696
0111011
590
708
0111100
600
720
0111101
610
732
0111110
620
744
0111111
630
756
1000000
640
768
1000001
650
780
1000010
660
792
1000011
670
1000100
680
1000101
690
1000110
700
1000111
710
1001000
720
1001001
730
1001010
740
1001011
750
1001100
760
1001101
770
1001110
780
1001111
790
1010000
800
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10
18
414
432
450
468
486
504
522
540
558
576
594
612
630
648
666
684
702
720
738
756
774
792
20
400
420
440
460
480
500
520
540
560
580
600
620
640
660
680
700
720
740
760
780
800
Output Frequency (MHz) for
fXTAL = 16 MHz and for N =
B1
B2
B4
B8
400
416
432
448
464
480
496
512
528
544
560
576
592
608
624
640
656
672
688
704
720
736
752
768
784
800
200
208
216
224
232
240
248
256
264
272
280
288
296
304
312
320
328
336
344
352
360
368
376
384
392
400
100
104
108
112
116
120
124
128
132
136
140
144
148
152
156
160
164
168
172
176
180
184
188
192
196
200
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
NBC12439, NBC12439A
Most of the signals available on the TEST output pin are
useful only for performance verification of the device itself.
However, the PLL bypass mode may be of interest at the
board level for functional debug. When T[2:0] is set to 110,
the device is placed in PLL bypass mode. In this mode the
S_CLOCK input is fed directly into the M and N dividers.
The N divider drives the FOUT differential pair and the M
counter drives the TEST output pin. In this mode the
S_CLOCK input could be used for low speed board level
functional test or debug. Bypassing the PLL and driving
FOUT directly gives the user more control on the test clocks
sent through the clock tree. Figure 7 shows the functional
setup of the PLL bypass mode. Because the S_CLOCK is a
CMOS level the input frequency is limited to 250 MHz or
less. This means the fastest the FOUT pin can be toggled via
the S_CLOCK is 250 MHz as the minimum divide ratio of
the N counter is 1. Note that the M counter output on the
TEST output will not be a 50% duty cycle due to the way the
divider is implemented.
S_CLOCK
ÇÇÇÇ
ÇÇÇÇ
C1
ts
th
S_DATA
T2
S_LOAD
First
Bit
ÇÇÇÇ
ÇÇÇÇ
C2
T1
C3
T2
T1
T0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
M[8:0]
N[1:0]
TEST OUTPUT
SHIFT REGISTER OUT
HIGH
FREF
M COUNTER OUT
FOUT
LOW
PLL BYPASS
FOUT B 4
ÉÉÉÉ
ÉÉÉÉ
VALID
ts
P_LOAD
ÉÉÉÉ
ÉÉÉÉ
th
M, N to P_LOAD
Figure 5. Parallel Interface Timing Diagram
C4
C5
C6
C7
C8
C9
C10
C11
C12
M4
M3
M2
M1
M0
S_DATA to S_CLOCK
T0
N1
N0
M6
M5
Last
Bit
th
ts
S_CLOCK to S_LOAD
Figure 6. Serial Interface Timing Diagram
FREF_EXT
MCNT
PLL 12430
VCO_CLK
0
1
SCLOCK
M COUNTER
DECODE
SDATA
SHIFT
REG T0
14−BIT T1
T2
NB
(1, 2, 4, 8)
FDIV4
MCNT
LOW
FOUT
MCNT
FREF
HIGH
FOUT
(VIA ENABLE GATE)
7
TEST
MUX
0
LATCH
SLOAD
Reset
PLOAD
•
•
T2=T1=1, T0=0: Test Mode
SCLOCK is selected, MCNT is on TEST output, SCLOCK B N is on FOUT pin.
PLOAD acts as reset for test pin latch. When latch reset, T2 data is shifted out TEST pin.
Figure 7. Serial Test Clock Block Diagram
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11
TEST
NBC12439, NBC12439A
APPLICATIONS INFORMATION
Using the On−Board Crystal Oscillator
Table 12. Crystal Specifications
The NBC12439 and NBC12439A feature a fully
integrated on−board crystal oscillator to minimize system
implementation costs. The oscillator is a series resonant,
multivibrator type design as opposed to the more common
parallel resonant oscillator design. The series resonant
design provides better stability and eliminates the need for
large load capacitors. The oscillator is totally self contained
so that the only external component required is the crystal
per Figure 8 (do not use cyrstal load caps). As the oscillator
is somewhat sensitive to loading on its inputs, the user is
advised to mount the crystal as close to the device as possible
to avoid any board level parasitics. To facilitate co−location,
surface mount crystals are recommended, but not required.
Because the series resonant design is affected by capacitive
loading on the crystal terminals, loading variation
introduced by crystals from different vendors could be a
potential issue. For crystals with a higher shunt capacitance,
it may be required to place a resistance, optional Rshunt,
across the terminals to suppress the third harmonic.
Although typically not required, it is a good idea to layout
the PCB with the provision of adding this external resistor.
The resistor value will typically be between 500 W and
1 kW.
The oscillator circuit is a series resonant circuit and thus,
for optimum performance, a series resonant crystal should
be used. Unfortunately, most crystals are characterized in a
parallel resonant mode. Fortunately, there is no physical
difference between a series resonant and a parallel resonant
crystal. The difference is purely in the way the devices are
characterized. As a result, a parallel resonant crystal can be
used with the device with only a minor error in the desired
frequency. A parallel resonant mode crystal used in a series
resonant circuit will exhibit a frequency of oscillation a few
hundred ppm lower than specified (a few hundred ppm
translates to kHz inaccuracy). Table 12 below specifies the
performance requirements of the crystals to be used with the
device.
Parameter
Value
Crystal Cut
Fundamental AT Cut
Resonance
Series Resonance*
Frequency Tolerance
±75 ppm at 25°C
Frequency/Temperature Stability
±150 ppm 0 to 70°C
Operating Range
0 to 70°C
Shunt Capacitance
5−7 pF
Equivalent Series Resistance (ESR)
50 to 80 W
Correlation Drive Level
100 mW
Aging
5 ppm/Yr
(First 3 Years)
* See accompanying text for series versus parallel resonant
discussion.
Power Supply Filtering
The NBC12439 and NBC12439A are mixed
analog/digital products and as such, exhibit some
sensitivities that would not necessarily be seen on a fully
digital product. Analog circuitry is naturally susceptible to
random noise, especially if this noise is seen on the power
supply pins. The NBC12439 and NBC1239A provide
separate power supplies for the digital circuitry (VCC) and
the internal PLL (PLL_VCC) of the device. The purpose of
this design technique is to try and isolate the high switching
noise of the digital outputs from the relatively sensitive
internal analog phase−locked loop. In a controlled
environment such as an evaluation board, this level of
isolation is sufficient. However, in a digital system
environment where it is more difficult to minimize noise on
the power supplies, a second level of isolation may be
required. The simplest form of isolation is a power supply
filter on the PLL_VCC pin for the NBC12439 and
NBC12349A.
Figure 9 illustrates a typical power supply filter scheme.
The NBC12439 and NBC12439A are most susceptible to
noise with spectral content in the 1 KHz to 1 MHz range.
Therefore, the filter should be designed to target this range.
The key parameter that needs to be met in the final filter
design is the DC voltage drop that will be seen between the
VCC supply and the PLL_VCC pin of the NBC12439 and
NBC12439A. From the data sheet, the PLL_VCC current
(the current sourced through the PLL_VCC pin) is typically
23 mA (28 mA maximum). Assuming that a minimum of
2.8 V must be maintained on the PLL_VCC pin, very little
DC voltage drop can be tolerated when a 3.3 V VCC supply
is used. The resistor shown in Figure 9 must have a
resistance of 10−15 W to meet the voltage drop criteria. The
RC filter pictured will provide a broadband filter with
approximately 100:1 attenuation for noise whose spectral
content is above 20 kHz. As the noise frequency crosses the
series resonant point of an individual capacitor, it’s overall
Figure 8. Crystal Application
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12
NBC12439, NBC12439A
impedance begins to look inductive and thus increases with
increasing frequency. The parallel capacitor combination
shown ensures that a low impedance path to ground exists
for frequencies well above the bandwidth of the PLL.
3.3 V or
5.0 V
3.3 V or
5.0 V
C1
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
C1
R1
RS = 10−15 W
L=1000 mH
R=15 W
PLL_VCC
C3
1
C2
R1 = 10−15 W
C1 = 0.01 mF
C2 = 22 mF
C3 = 0.1 mF
22 mF
0.01 mF
NBC12439
NBC12439A
VCC
Xtal
0.01 mF
RSHUNT
ÉÉ
ÉÉ
= VCC
= GND
Figure 9. Power Supply Filter
= Via
A higher level of attenuation can be achieved by replacing
the resistor with an appropriate valued inductor. Figure 9
shows a 1000 mH choke. This value choke will show a
significant impedance at 10 KHz frequencies and above.
Because of the current draw and the voltage that must be
maintained on the PLL_VCC pin, a low DC resistance
inductor is required (less than 15 W). Generally, the
resistor/capacitor filter will be cheaper, easier to implement,
and provide an adequate level of supply filtering.
The
NBC12439
and
NBC12439A
provide
sub−nanosecond output edge rates and therefore a good
power supply bypassing scheme is a must. Figure 10 shows
a representative board layout for the NBC12439. There
exists many different potential board layouts and the one
pictured is but one. The important aspect of the layout in
Figure 10 is the low impedance connections between VCC
and GND for the bypass capacitors. Combining good quality
general purpose chip capacitors with good PCB layout
techniques will produce effective capacitor resonances at
frequencies adequate to supply the instantaneous switching
current for the NBC12439 and NBC12439A outputs. It is
imperative that low inductance chip capacitors are used. It
is equally important that the board layout not introduce any
of the inductance saved by using the leadless capacitors.
Thin interconnect traces between the capacitor and the
power plane should be avoided and multiple large vias
should be used to tie the capacitors to the buried power
planes. Fat interconnect and large vias will help to minimize
layout induced inductance and thus maximize the series
resonant point of the bypass capacitors.
Figure 10. PCB Board Layout for (PLCC−28)
Note the dotted lines circling the crystal oscillator
connection to the device. The oscillator is a series resonant
circuit and the voltage amplitude across the crystal is
relatively small. It is imperative that no actively switching
signals cross under the crystal as crosstalk energy coupled
to these lines could significantly impact the jitter of the
device. Special attention should be paid to the layout of the
crystal to ensure a stable, jitter free interface between the
crystal and the on−board oscillator. Note the provisions for
placing a resistor across the crystal oscillator terminals as
discussed in the crystal oscillator section of this data sheet.
Although the NBC12439 and NBC12439A have several
design features to minimize the susceptibility to power
supply noise (isolated power and grounds and fully
differential PLL), there still may be applications in which
overall performance is being degraded due to system power
supply noise. The power supply filter and bypass schemes
discussed in this section should be adequate to eliminate
power supply noise−related problems in most designs.
Jitter Performance
Jitter is a common parameter associated with clock
generation and distribution. Clock jitter can be defined as the
deviation in a clock’s output transition from its ideal
position.
Cycle−to−Cycle Jitter (short−term) is the period
variation between adjacent periods over a defined number of
observed cycles. The number of cycles observed is
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13
NBC12439, NBC12439A
Recent hardware and software developments have
resulted in advanced jitter measurement techniques. The
Tektronix TDS−series oscilloscopes have superb jitter
analysis capabilities on non−contiguous clocks with their
histogram and statistics capabilities. The Tektronix
TDSJIT2/3 Jitter Analysis software provides many key
timing parameter measurements and will extend that
capability by making jitter measurements on contiguous
clock and data cycles from single−shot acquisitions.
M1 by Amherst was used as well and both test methods
correlated.
This test process can be correlated to earlier test methods
and are more accurate. All of the jitter data reported on the
NBC12439 and NBC12439A was collected in this manner.
Figure 13 shows the RMS jitter performance as a function
of the VCO frequency range. The general trend is that as the
VCO frequency is increased, the RMS output jitter will
decrease.
Figure 14 illustrates the RMS jitter performance versus
the output frequency. Note the jitter is a function of both the
output frequency as well as the VCO frequency. However,
the VCO frequency shows a much stronger dependence.
Long−Term Period Jitter is the maximum jitter
observed at the end of a period’s edge when compared to the
position of the perfect reference clock’s edge and is
specified by the number of cycles over which the jitter is
measured. The number of cycles used to look for the
maximum jitter varies by application but the JEDEC spec is
10,000 observed cycles.
The NBC12439 and NBC12439A exhibit long term and
cycle−to−cycle jitter, which rivals that of SAW based
oscillators. This jitter performance comes with the added
flexibility associated with a synthesizer over a fixed
frequency oscillator. The jitter data presented should
provide users with enough information to determine the
effect on their overall timing budget. The jitter performance
meets the needs of most system designs while adding the
flexibility of frequency margining and field upgrades. These
features are not available with a fixed frequency SAW
oscillator.
application dependent but the JEDEC specification is 1000
cycles. See Figure 11.
T0
T1
TJITTER(cycle−cycle) = T1 − T0
Figure 11. Cycle−to−Cycle Jitter
RMS
or one
Sigma
Jitter
Time*
*1,000 − 10,000 Cycles
Typical
Gaussian
Distribution
Peak−to−Peak Jitter (8s)
Jitter Amplitude
Random Peak−to−Peak Jitter is the difference between
the highest and lowest acquired value and is represented as
the width of the Gaussian base. See Figure 12.
Figure 12. Random Peak−to−Peak and RMS Jitter
There are different ways to measure jitter and often they
are confused with one another. An earlier method of
measuring jitter is to look at the timing signal with an
oscilloscope and observe the variations in period−to−period
or cycle−to−cycle. If the scope is set up to trigger on every
rising or falling edge, set to infinite persistence mode and
allowed to trace sufficient cycles, it is possible to determine
the maximum and minimum periods of the timing signal.
Digital scopes can accumulate a large number of cycles,
create a histogram of the edge placements and record
peak−to−peak as well as standard deviations of the jitter.
Care must be taken that the measured edge is the edge
immediately following the trigger edge. These scopes can
also store a finite number of period durations and
post−processing software can analyze the data to find the
maximum and minimum periods.
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14
NBC12439, NBC12439A
20
20
RMS JITTER (ps)
25
RMS JITTER
(ps)
25
15
10
5
N=
8
N=
4
N=
1 N=
0
2 500
400
600
700
VCO FREQUENCY (MHz)
15
10
5
0
800
100
200
300
400
500
600
OUTPUT FREQUENCY (MHz)
700
Figure 14. Cycle−to−Cycle RMS Jitter vs.
Output Frequency
Figure 13. Cycle−to−Cycle RMS Jitter vs.
VCO Frequency
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15
800
NBC12439, NBC12439A
S_DATA
S_CLOCK
tHOLD
tSET−UP
Figure 15. Setup and Hold
S_DATA
S_LOAD
tHOLD
tSET−UP
Figure 16. Setup and Hold
M[6:0]
N[1:0]
P_LOAD
tHOLD
tSET−UP
Figure 17. Setup and Hold
FOUT
FOUT
Pulse Width
tPERIOD
Figure 18. Output Duty Cycle
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16
DCO +
tpw
tPERIOD
NBC12439, NBC12439A
FOUT
Zo = 50 W
D
Receiver
Device
Driver
Device
FOUT
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 19. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping†
NBC12439FA
LQFP−32
250 Units / Tray
NBC12439FAG
LQFP−32
(Pb−Free)
250 Units / Tray
NBC12439FAR2
LQFP−32
2000 / Tape & Reel
NBC12439FAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
NBC12439FN
PLCC−28
37 Units / Rail
NBC12439FNG
PLCC−28
(Pb−Free)
37 Units / Rail
NBC12439FNR2
PLCC−28
500 / Tape & Reel
NBC12439FNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
NBC12439AFA
LQFP−32
250 Units / Tray
NBC12439AFAG
LQFP−32
(Pb−Free)
250 Units / Tray
NBC12439AFAR2
LQFP−32
2000 / Tape & Reel
NBC12439AFAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
NBC12439AFN
PLCC−28
37 Units / Rail
NBC12439AFNG
PLCC−28
(Pb−Free)
37 Units / Rail
NBC12439AFNR2
PLCC−28
500 / Tape & Reel
NBC12439AFNR2G
PLCC−28
(Pb−Free)
500 / Tape & Reel
NBC12439AMNG
QFN−32
(Pb−Free)
74 Units / Rail
NBC12439AMNR4G
QFN−32
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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17
NBC12439, NBC12439A
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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18
NBC12439, NBC12439A
PACKAGE DIMENSIONS
28 LEAD PLLC
CASE 776−02
ISSUE F
B
Y BRK
−N−
0.007 (0.180)
U
M
T L-M
0.007 (0.180)
M
N
S
T L-M
S
S
N
S
D
Z
−M−
−L−
W
28
D
X
V
1
G1
0.010 (0.250)
T L-M
S
N
S
S
VIEW D−D
Z
A
0.007 (0.180)
R
0.007 (0.180)
M
M
T L-M
T L-M
S
S
N
N
H
S
0.007 (0.180)
M
T L-M
S
N
S
S
K1
C
E
G
S
K
PLANE
F
VIEW S
G1
0.010 (0.250)
0.004 (0.100)
−T− SEATING
J
T L-M
S
N
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
--0.025
--0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2_
10_
0.410
0.430
0.040
---
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
--0.64
--11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2_
10_
10.42
10.92
1.02
---
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19
0.007 (0.180)
M
T L-M
S
N
S
NBC12439, NBC12439A
PACKAGE DIMENSIONS
A1
A
32
−T−, −U−, −Z−
32 LEAD LQFP
CASE 873A−02
ISSUE C
4X
25
0.20 (0.008) AB T-U Z
1
AE
−U−
−T−
B
P
V
17
8
BASE
METAL
DETAIL Y
V1
AC T-U Z
AE
DETAIL Y
ÉÉ
ÉÉ
ÉÉ
−Z−
9
S1
4X
0.20 (0.008) AC T-U Z
F
S
8X M_
D
DETAIL AD
G
−AB−
SECTION AE−AE
C E
−AC−
H
W
K
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE −AB− IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS −T−, −U−, AND −Z− TO BE
DETERMINED AT DATUM PLANE −AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE −AC−.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
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20
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.450
0.750
12_ REF
0.090
0.160
0.400 BSC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.030
12_ REF
0.004
0.006
0.016 BSC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Q_
0.250 (0.010)
0.10 (0.004) AC
GAUGE PLANE
SEATING
PLANE
J
R
M
N
9
0.20 (0.008)
B1
NBC12439, NBC12439A
PACKAGE DIMENSIONS
QFN32 5*5*1 0.5 P
CASE 488AM−01
ISSUE O
PIN ONE
LOCATION
2X
ÉÉ
ÉÉ
0.15 C
2X
A
B
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.15 C
(A3)
0.10 C
A
32 X
0.08 C
C
L
32 X
9
D2
SEATING
PLANE
A1
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.800 0.900 1.000
0.000 0.025 0.050
0.200 REF
0.180 0.250 0.300
5.00 BSC
2.950 3.100 3.250
5.00 BSC
2.950 3.100 3.250
0.500 BSC
0.200
−−−
−−−
0.300 0.400 0.500
SOLDERING FOOTPRINT*
EXPOSED PAD
16
K
5.30
32 X
17
3.20
8
32 X
E2
1
0.63
24
32
25
32 X b
0.10 C A B
e
3.20 5.30
0.05 C
BOTTOM VIEW
32 X
0.28
28 X
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury
or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an
Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NBC12439/D