GE BAS40-05 Schottky diode Datasheet

BAS40 THRU BAS40-06
Schottky Diodes
FEATURES
SOT-23
♦ These diodes feature very low turn-on
.122 (3.1)
.118 (3.0)
.016 (0.4)
♦ These devices are protected by a PN
.056 (1.43)
.052 (1.33)
3
junction guard ring against excessive
voltage, such as electrostatic discharges.
.016 (0.4)
.045 (1.15)
.037 (0.95)
.037(0.95) .037(0.95)
.007 (0.175)
.005 (0.125)
2
max. .004 (0.1)
1
voltage and fast switching.
Top View
MECHANICAL DATA
.102 (2.6)
.094 (2.4)
.016 (0.4)
Case: SOT-23 Plastic Package
Weight: approx. 0.008 g
Dimensions in inches and (millimeters)
3
3
Top View
1
2
1
2
BAS40-04
Marking: 44
BAS40
Marking: 43
3
3
Top View
1
2
BAS40-05
Marking: 45
1
2
BAS40-06
Marking: 46
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS FOR ONE DIODE
Ratings at 25 °C ambient temperature unless otherwise specified
Symbol
Value
Unit
Repetitive Peak Reverse Voltage
VRRM
40
V
Forward Continuous Current at Tamb = 25 °C
IF
2001)
mA
Surge Forward Current at tp < 1 s, Tamb = 25 °C
IFSM
6001)
mA
Power Dissipation1) at Tamb = 25 °C
Ptot
2001)
mW
Junction Temperature
Tj
150
°C
Storage Temperature Range
TS
–55 to +150
°C
1)
Device on fiberglass substrate, see layout
4/98
BAS40 THRU BAS40-06
ELECTRICAL CHARACTERISTICS
Ratings for one diode at 25 °C ambient temperature unless otherwise specified
Symbol
Min.
Typ.
Max.
Unit
V(BR)R
40
–
–
V
–
20
100
nA
VF
VF
–
–
–
–
380
1000
mV
mV
Capacitance
at VR = 0 V, f = 1 MHz
Ctot
–
4.0
5
pF
Reverse Recovery Time
from IF = 10 mA through IR = 10 mA to IR = 1 mA
trr
–
–
5
ns
Thermal Resistance Junction to Ambient Air
RthJA
–
–
4301)
K/W
Reverse Breakdown Voltage
Tested with 10 µA Pulses
Leakage Current
Pulse Test tp < 300 µs
at VR = 30 V
IR
Forward Voltage
Pulse Test tp < 300 µs
at IF = 1 mA
at IF = 40 mA
1)
Device on fiberglass substrate, see layout
.30 (7.5)
.12 (3)
.04 (1)
.08 (2)
.04 (1)
.08 (2)
.59 (15)
.03 (0.8)
.47 (12)
0.2 (5)
.06 (1.5)
Dimensions in inches (millimeters)
.20 (5.1)
Layout for RthJA test
Thickness: Fiberglass 0.059 in (1.5 mm)
Copper leads 0.012 in (0.3 mm)
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