Vishay HFA16PA120CPBF Ultrafast soft recovery diode, 2 x 8 a Datasheet

HFA16PA120C
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 8 A
FEATURES
•
•
•
•
•
•
Base
common
cathode
2
Ultrafast recovery
Ultrasoft recovery
Very low IRRM
Very low Qrr
Specified at operating conditions
Designed and qualified for industrial level
BENEFITS
TO-247AC
•
•
•
•
•
1
3
Anode
Anode
2
1
2
Common
cathode
DESCRIPTION
HFA16PA120C is a state of the art ultrafast recovery diode.
Employing the latest in epitaxial construction and advanced
processing techniques it features a superb combination of
characteristics which result in performance which is
unsurpassed by any rectifier previously available. With basic
ratings of 1200 V and 8 A per leg continuous current, the
HFA16PA120C is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA16PA120C is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRODUCT SUMMARY
VR per leg
1200 V
VF at 8 A at 25 °C
3.3 V
IF(AV)
2x8A
trr (typical)
28 ns
TJ (maximum)
150 °C
IRRM (typical) per leg
4.5 A
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
Maximum continuous forward current
per leg
per device
IF
Single pulse forward current
IFSM
Maximum repetitive forward current
IFRM
Maximum power dissipation
PD
Operating junction and storage temperature range
Document Number: 93069
Revision: 30-Jul-08
TEST CONDITIONS
VR
TC = 100 °C
VALUES
UNITS
1200
V
8
16
130
A
32
TC = 25 °C
73.5
TC = 100 °C
29
TJ, TStg
For technical questions, contact: [email protected]
- 55 to + 150
W
°C
www.vishay.com
1
HFA16PA120C
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 8 A
ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Cathode to anode
breakdown voltage
VBR
Maximum forward voltage
VFM
TEST CONDITIONS
IR = 100 µA
MIN.
TYP.
MAX.
1200
-
-
IF = 8.0 A
-
2.6
3.3
IF = 16 A
-
3.4
4.3
IF = 8.0 A, TJ = 125 °C
-
2.4
3.1
VR = VR rated
-
0.31
10
TJ = 125 °C, VR = 0.8 x VR rated
-
135
1000
UNITS
V
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
-
11
20
pF
Series inductance
LS
Measured lead to lead 5 mm from package
-
8.0
-
nH
µA
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
Peak recovery current
Reverse recovery charge
Peak rate of recovery current
during tb
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
-
28
-
trr
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V
trr1
TJ = 25 °C
-
63
95
trr2
TJ = 125 °C
-
106
160
-
4.5
8.0
-
6.2
11
IRRM1
TJ = 25 °C
IRRM2
TJ = 125 °C
IF = 8.0 A
dIF/dt = 200 A/µs
VR = 200 V
UNITS
ns
A
Qrr1
TJ = 25 °C
-
140
380
Qrr2
TJ = 125 °C
-
335
880
dI(rec)M/dt1
TJ = 25 °C
-
133
-
dI(rec)M/dt2
TJ = 125 °C
-
85
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
1.7
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
40
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.25
-
-
6.0
-
g
-
0.21
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
0.063" from case (1.6 mm) for 10 s
Weight
Mounting torque
Marking device
www.vishay.com
2
Case style TO-247AC (JEDEC)
For technical questions, contact: [email protected]
K/W
HFA16PA120C
Document Number: 93069
Revision: 30-Jul-08
HFA16PA120C
100
1000
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 8 A
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
0
2
4
6
100
TJ = 125 °C
TJ = 100 °C
10
1
0.1
TJ = 25 °C
0.01
300
0
10
8
600
900
1200
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
100
TJ = 25 °C
10
1
1
10
100
1000
10 000
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 93069
Revision: 30-Jul-08
For technical questions, contact: [email protected]
www.vishay.com
3
HFA16PA120C
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 8 A
160
1000
IF = 8 A
IF = 4 A
IF = 8 A
IF = 4 A
140
dI(rec)M/dt (A/µs)
trr (ns)
120
100
80
60
VR = 160 V
TJ = 125 °C
TJ = 25 °C
40
100
VR = 160 V
TJ = 125 °C
TJ = 25 °C
10
20
100
1000
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Stored Charge vs. dIF/dt
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
1200
20
16
IF = 8 A
IF = 4 A
VR = 160 V
TJ = 125 °C
TJ = 25 °C
800
Qrr (nC)
12
Irr (A)
VR = 160 V
TJ = 125 °C
TJ = 25 °C
1000
8
IF = 8 A
IF = 4 A
600
400
4
200
0
100
1000
0
100
1000
dIF/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dIF/dt
www.vishay.com
4
dIF/dt (A/µs)
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
For technical questions, contact: [email protected]
Document Number: 93069
Revision: 30-Jul-08
HFA16PA120C
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 2 x 8 A
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 93069
Revision: 30-Jul-08
For technical questions, contact: [email protected]
www.vishay.com
5
HFA16PA120C
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 2 x 8 A
ORDERING INFORMATION TABLE
Device code
HF
A
16
PA
120
C
-
1
2
3
4
5
6
7
1
-
HEXFRED® family
2
-
Process designator: A = Subs. electron irradiated
B = Subs. platinum
3
-
Current rating (16 = 16 A)
4
-
Package outline (PA = TO-247, 3 pins)
5
-
Voltage rating (120 = 1200 V)
6
-
Configuration (C = Center tap common cathode)
7
-
None = Standard production
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
http://www.vishay.com/doc?95223
Part marking information
http://www.vishay.com/doc?95226
www.vishay.com
6
For technical questions, contact: [email protected]
Document Number: 93069
Revision: 30-Jul-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
Similar pages