REJ09B0260-0200 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. H8/3024 16 Group, H8/3024F-ZTAT, H8/3026F-ZTAT Hardware Manual Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Series H8/3024 H8/3026 H8/3024F H8/3026F Rev. 2.00 Revision Date: Sep 20, 2005 HD6433024F, HD6433024TE, HD6433024FP HD6433026F, HD6433026TE, HD6433026FP HD64F3024F, HD64F3024TE, HD64F3024FP HD64F3026F, HD64F3026TE, HD64F3026FP Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. Rev. 2.00 Sep 20, 2005 page ii of xxxviii Preface The H8/3024 Group is a high-performance single-chip microcomputer that integrates peripheral functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal architecture as its core. The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to changing application specifications and the demands of the transition from initial to full-fledged volume production. Note: * F-ZTAT is a trademark of Renesas Technology Corp. Intended Readership: This manual is intended for users undertaking the design of an application system using the H8/3024 Group. Readers using this manual require a basic knowledge of electrical circuits, logic circuits, and microcomputers. Purpose: The purpose of this manual is to give users an understanding of the hardware functions and electrical characteristics of the H8/3024 Group. Details of execution instructions can be found in the H8/300H Series Programming Manual, which should be read in conjunction with the present manual. Using this Manual: • For an overall understanding of the H8/3024 Group’s functions Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system control functions, peripheral functions, and electrical characteristics. • For a detailed understanding of CPU functions Refer to the separate publication H8/300H Series Programming Manual. Note on bit notation: Bits are shown in high-to-low order from left to right. • For a detailed understanding of a register when its name is known The addresses, bits, and initial values of the registers are summarized in appendix B, Internal I/O Registers. Related Material: The latest information is available at our Web Site. Please make sure that you have the most up-to-date information available. (http://www.renesas.com/eng/) Rev. 2.00 Sep 20, 2005 page iii of xxxviii User's Manuals on the H8/3024: Manual Title Document No. H8/3024 Hardware Manual This manual H8/300H Series Programming Manual ADE-602-053 Users manuals for development tools: Manual Title Document No. H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual REJ10B0058-0100H H8S, H8/300 Series Simulator/Debugger User’s Manual ADE-702-037 High-Performance Embedded Workshop User’s Manual ADE-702-201 H8S, H8/300 Series High-Performance Embedded Workshop, High-Performance Debugging Interface User’s Manual ADE-702-231 Application Note: Manual Title Document No. H8/300H for CPU Application Note ADE-502-033 H8/300H On-Chip Supporting Modules Application Note REJ05B0522-0300 H8/300H Technical Q&A REJ05B0521-0200 Rev. 2.00 Sep 20, 2005 page iv of xxxviii Comparison of H8/3024 Group Product Specifications There are four members of the H8/3024 Group: the H8/3024F-ZTAT and H8/3026F-ZTAT (all with on-chip flash memory), and the H8/3024 mask ROM version and H8/3026 mask ROM version. The specifications of these products are compared below. H8/3024F-ZTAT Product specifications Product code H8/3026F-ZTAT On-chip single-power-supply flash memory HD64F3024 H8/3026 Mask ROM Version Mask ROM version HD64F3026 HD6433024 HD6433026 See figures 1.2 and 1.3, Pin Arrangement, in section 1 Pin arrangement RAM size 4 kbytes ROM size 128 kbytes 8 kbytes 4 kbytes 8 kbytes 256 kbytes 128 kbytes 256 kbytes Address update mode 1 or 2 selectable Address output functions Flash memory H8/3024 Mask ROM Version See 6.3.5, Address Output Method, in section 6 See section 18, Flash Memory See section 17, Flash Memory — — See section 21, Electrical Characteristics Electrical characteristics (operating frequency) 2 to 25 MHz Registers See table B.1, Comparison of H8/3024 Group Internal I/O Register Specifications, in appendix B See appendix B.2, Address List See appendix B.1, Address List See appendix B.2, Address List See appendix B.1, Address List Rev. 2.00 Sep 20, 2005 page v of xxxviii Rev. 2.00 Sep 20, 2005 page vi of xxxviii Main Revisions for This Edition Item Page Revision (See Manual for Details) All All references to Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names changed to Renesas Technology Corp. Designation for categories changed from “series” to “group” 7.12.2 Register Descriptions 203, 204 Description amended PB3/TP11/TMIO3/CS4 Table 7.23 Port B Pin Functions (Modes 1 to 5) Bits OIS3/2 and OS1/0 in 8TCSR3, bit CS4E in CSCR, bit NDER11 in NDERB, and bit PB3DDR select the pin function as follows. PB1/TP9/TMIO1/CS6 Bits OIS3/2 and OS1/0 in 8TCSR1, bit CS6E in CSCR, bit NDER9 in NDERB, and bit PB1DDR select the pin function as follows. Table 7.24 Port B 205, 206 PB3/TP11/TMIO3 Pin Functions Bits OIS3/2 and OS1/0 in 8TCSR3, bit NDER11 in NDERB, (Modes 6 and 7) and bit PB3DDR select the pin function as follows. PB1/TP9/TMIO1 Bits OIS3/2 and OS1/0 in 8TCSR1, bit NDER9 in NDERB, and bit PB1DDR select the pin function as follows. 18.5.1 Boot Mode 548 Description amended After the transfer is completed, control branches to the start address (H'FFF520) of the programming control program area and the programming control program execution state is entered (flash memory programming/erasing can be performed). 21.2.6 Flash Memory Characteristics Table 21.19 Flash Memory Characteristics 629, 630 Table amended and note added Item Symbol Min Typ Max Unit 1 2 4 Programming time* * * tP — 10 200 ms/ 128 bytes Erase time* * * 1 tE — 1200 ms/block Reprogramming count NWEC 100* 10,000* — Times Data retention period tDRP 10*8 — — Years 3 5 100 6 7 Notes Notes: 6. Minimum number of times at which all characteristics are guaranteed after reprogramming. (Reprogramming count from 1 to minimum value is guaranteed.) 7. Reference characteristics at 25°C. (This is an indication that reprogramming operations can normally be performed up to this figure.) 8. Data retention characteristics when reprogramming is performed correctly within the specification values, including the minimum data retention period. Rev. 2.00 Sep 20, 2005 page vii of xxxviii Rev. 2.00 Sep 20, 2005 page viii of xxxviii Contents Section 1 Overview............................................................................................................. 1.1 1.2 1.3 1.4 1 Overview........................................................................................................................... 1 Block Diagram.................................................................................................................. 6 Pin Description ................................................................................................................. 7 1.3.1 Pin Arrangement.................................................................................................. 7 1.3.2 Pin Functions ....................................................................................................... 10 1.3.3 Pin Assignments in Each Mode ........................................................................... 15 Caution on Crystal Resonator Connection........................................................................ 18 Section 2 CPU ...................................................................................................................... 19 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Overview........................................................................................................................... 2.1.1 Features................................................................................................................ 2.1.2 Differences from H8/300 CPU ............................................................................ CPU Operating Modes...................................................................................................... Address Space................................................................................................................... Register Configuration...................................................................................................... 2.4.1 Overview.............................................................................................................. 2.4.2 General Registers................................................................................................. 2.4.3 Control Registers ................................................................................................. 2.4.4 Initial CPU Register Values................................................................................. Data Formats..................................................................................................................... 2.5.1 General Register Data Formats............................................................................ 2.5.2 Memory Data Formats......................................................................................... Instruction Set................................................................................................................... 2.6.1 Instruction Set Overview ..................................................................................... 2.6.2 Instructions and Addressing Modes..................................................................... 2.6.3 Tables of Instructions Classified by Function...................................................... 2.6.4 Basic Instruction Formats .................................................................................... 2.6.5 Notes on Use of Bit Manipulation Instructions ................................................... Addressing Modes and Effective Address Calculation..................................................... 2.7.1 Addressing Modes ............................................................................................... 2.7.2 Effective Address Calculation ............................................................................. Processing States .............................................................................................................. 2.8.1 Overview.............................................................................................................. 2.8.2 Program Execution State ..................................................................................... 2.8.3 Exception-Handling State .................................................................................... 2.8.4 Exception Handling Operation ............................................................................ 2.8.5 Bus-Released State .............................................................................................. 19 19 20 20 21 22 22 23 24 25 26 26 27 29 29 30 31 40 41 43 43 45 49 49 49 50 51 52 Rev. 2.00 Sep 20, 2005 page ix of xxxviii 2.9 2.8.6 Reset State ........................................................................................................... 2.8.7 Power-Down State ............................................................................................... Basic Operational Timing ................................................................................................. 2.9.1 Overview.............................................................................................................. 2.9.2 On-Chip Memory Access Timing........................................................................ 2.9.3 On-Chip Supporting Module Access Timing ...................................................... 2.9.4 Access to External Address Space....................................................................... 53 53 53 53 54 55 56 Section 3 MCU Operating Modes .................................................................................. 57 3.1 3.2 3.3 3.4 3.5 3.6 Overview........................................................................................................................... 3.1.1 Operating Mode Selection ................................................................................... 3.1.2 Register Configuration......................................................................................... Mode Control Register (MDCR) ...................................................................................... System Control Register (SYSCR) ................................................................................... Operating Mode Descriptions ........................................................................................... 3.4.1 Mode 1................................................................................................................. 3.4.2 Mode 2................................................................................................................. 3.4.3 Mode 3................................................................................................................. 3.4.4 Mode 4................................................................................................................. 3.4.5 Mode 5................................................................................................................. 3.4.6 Mode 6................................................................................................................. 3.4.7 Mode 7................................................................................................................. Pin Functions in Each Operating Mode ............................................................................ Memory Map in Each Operating Mode ............................................................................ 3.6.1 Comparison of H8/3024 Group Memory Maps................................................... 3.6.2 Reserved Areas .................................................................................................... 57 57 58 59 60 62 62 62 63 63 63 63 63 64 65 65 65 Section 4 Exception Handling ......................................................................................... 71 4.1 4.2 4.3 4.4 4.5 4.6 Overview........................................................................................................................... 4.1.1 Exception Handling Types and Priority............................................................... 4.1.2 Exception Handling Operation ............................................................................ 4.1.3 Exception Vector Table ....................................................................................... Reset ................................................................................................................................. 4.2.1 Overview.............................................................................................................. 4.2.2 Reset Sequence .................................................................................................... 4.2.3 Interrupts after Reset............................................................................................ Interrupts........................................................................................................................... Trap Instruction ................................................................................................................ Stack Status after Exception Handling.............................................................................. Notes on Stack Usage ....................................................................................................... Rev. 2.00 Sep 20, 2005 page x of xxxviii 71 71 71 72 74 74 74 77 77 78 79 80 Section 5 Interrupt Controller .......................................................................................... 83 5.1 5.2 5.3 5.4 5.5 Overview........................................................................................................................... 5.1.1 Features................................................................................................................ 5.1.2 Block Diagram..................................................................................................... 5.1.3 Pin Configuration ................................................................................................ 5.1.4 Register Configuration......................................................................................... Register Descriptions........................................................................................................ 5.2.1 System Control Register (SYSCR)...................................................................... 5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB)............................................. 5.2.3 IRQ Status Register (ISR).................................................................................... 5.2.4 IRQ Enable Register (IER) .................................................................................. 5.2.5 IRQ Sense Control Register (ISCR) .................................................................... Interrupt Sources............................................................................................................... 5.3.1 External Interrupts ............................................................................................... 5.3.2 Internal Interrupts ................................................................................................ 5.3.3 Interrupt Exception Handling Vector Table......................................................... Interrupt Operation ........................................................................................................... 5.4.1 Interrupt Handling Process .................................................................................. 5.4.2 Interrupt Exception Handling Sequence .............................................................. 5.4.3 Interrupt Response Time...................................................................................... Usage Notes ...................................................................................................................... 5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction...................... 5.5.2 Instructions that Inhibit Interrupts ....................................................................... 5.5.3 Interrupts during EEPMOV Instruction Execution.............................................. 83 83 84 85 85 85 85 86 92 93 94 95 95 96 96 100 100 105 106 107 107 108 108 Section 6 Bus Controller ................................................................................................... 109 6.1 6.2 6.3 Overview........................................................................................................................... 6.1.1 Features................................................................................................................ 6.1.2 Block Diagram..................................................................................................... 6.1.3 Pin Configuration ................................................................................................ 6.1.4 Register Configuration......................................................................................... Register Descriptions........................................................................................................ 6.2.1 Bus Width Control Register (ABWCR)............................................................... 6.2.2 Access State Control Register (ASTCR) ............................................................. 6.2.3 Wait Control Registers H and L (WCRH, WCRL).............................................. 6.2.4 Bus Release Control Register (BRCR) ................................................................ 6.2.5 Bus Control Register (BCR) ................................................................................ 6.2.6 Chip Select Control Register (CSCR).................................................................. 6.2.7 Address Control Register (ADRCR) ................................................................... Operation .......................................................................................................................... 6.3.1 Area Division....................................................................................................... 109 109 110 111 112 112 112 113 114 118 120 122 123 124 124 Rev. 2.00 Sep 20, 2005 page xi of xxxviii 6.4 6.5 6.6 6.7 6.3.2 Bus Specifications ............................................................................................... 6.3.3 Memory Interfaces............................................................................................... 6.3.4 Chip Select Signals .............................................................................................. 6.3.5 Address Output Method....................................................................................... Basic Bus Interface ........................................................................................................... 6.4.1 Overview.............................................................................................................. 6.4.2 Data Size and Data Alignment............................................................................. 6.4.3 Valid Strobes ....................................................................................................... 6.4.4 Memory Areas ..................................................................................................... 6.4.5 Basic Bus Control Signal Timing ........................................................................ 6.4.6 Wait Control ........................................................................................................ Idle Cycle.......................................................................................................................... 6.5.1 Operation ............................................................................................................. 6.5.2 Pin States in Idle Cycle........................................................................................ Bus Arbiter ....................................................................................................................... 6.6.1 Operation ............................................................................................................. Register and Pin Input Timing.......................................................................................... 6.7.1 Register Write Timing ......................................................................................... 6.7.2 BREQ Pin Input Timing ...................................................................................... 127 128 129 130 131 131 131 132 133 134 141 143 143 146 146 147 149 149 150 Section 7 I/O Ports .............................................................................................................. 151 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 Overview........................................................................................................................... Port 1................................................................................................................................. 7.2.1 Overview.............................................................................................................. 7.2.2 Register Descriptions........................................................................................... Port 2................................................................................................................................. 7.3.1 Overview.............................................................................................................. 7.3.2 Register Descriptions........................................................................................... Port 3................................................................................................................................. 7.4.1 Overview.............................................................................................................. 7.4.2 Register Descriptions........................................................................................... Port 4................................................................................................................................. 7.5.1 Overview.............................................................................................................. 7.5.2 Register Descriptions........................................................................................... Port 5................................................................................................................................. 7.6.1 Overview.............................................................................................................. 7.6.2 Register Descriptions........................................................................................... Port 6................................................................................................................................. 7.7.1 Overview.............................................................................................................. 7.7.2 Register Descriptions........................................................................................... Port 7................................................................................................................................. Rev. 2.00 Sep 20, 2005 page xii of xxxviii 151 155 155 156 158 158 159 162 162 162 164 164 165 167 167 168 171 171 172 175 7.8.1 Overview.............................................................................................................. 7.8.2 Register Description ............................................................................................ 7.9 Port 8................................................................................................................................. 7.9.1 Overview.............................................................................................................. 7.9.2 Register Descriptions........................................................................................... 7.10 Port 9................................................................................................................................. 7.10.1 Overview.............................................................................................................. 7.10.2 Register Descriptions........................................................................................... 7.11 Port A................................................................................................................................ 7.11.1 Overview.............................................................................................................. 7.11.2 Register Descriptions........................................................................................... 7.12 Port B................................................................................................................................ 7.12.1 Overview.............................................................................................................. 7.12.2 Register Descriptions........................................................................................... 175 176 176 176 177 182 182 183 187 187 189 199 199 201 Section 8 16-Bit Timer ...................................................................................................... 207 8.1 8.2 8.3 8.4 Overview........................................................................................................................... 8.1.1 Features................................................................................................................ 8.1.2 Block Diagrams ................................................................................................... 8.1.3 Pin Configuration ................................................................................................ 8.1.4 Register Configuration......................................................................................... Register Descriptions........................................................................................................ 8.2.1 Timer Start Register (TSTR) ............................................................................... 8.2.2 Timer Synchro Register (TSNC) ......................................................................... 8.2.3 Timer Mode Register (TMDR)............................................................................ 8.2.4 Timer Interrupt Status Register A (TISRA)......................................................... 8.2.5 Timer Interrupt Status Register B (TISRB) ......................................................... 8.2.6 Timer Interrupt Status Register C (TISRC) ......................................................... 8.2.7 Timer Counters (16TCNT) .................................................................................. 8.2.8 General Registers (GRA, GRB)........................................................................... 8.2.9 Timer Control Registers (16TCR) ....................................................................... 8.2.10 Timer I/O Control Register (TIOR)..................................................................... 8.2.11 Timer Output Level Setting Register C (TOLR) ................................................. CPU Interface ................................................................................................................... 8.3.1 16-Bit Accessible Registers ................................................................................. 8.3.2 8-Bit Accessible Registers ................................................................................... Operation .......................................................................................................................... 8.4.1 Overview.............................................................................................................. 8.4.2 Basic Functions.................................................................................................... 8.4.3 Synchronization ................................................................................................... 8.4.4 PWM Mode ......................................................................................................... 207 207 209 212 213 214 214 215 217 219 222 225 227 228 229 231 233 235 235 237 238 238 239 246 248 Rev. 2.00 Sep 20, 2005 page xiii of xxxviii 8.5 8.6 8.4.5 Phase Counting Mode.......................................................................................... 8.4.6 16-Bit Timer Output Timing................................................................................ Interrupts........................................................................................................................... 8.5.1 Setting of Status Flags ......................................................................................... 8.5.2 Timing of Clearing of Status Flags...................................................................... 8.5.3 Interrupt Sources.................................................................................................. Usage Notes ...................................................................................................................... 252 254 255 255 257 258 259 Section 9 8-Bit Timers ....................................................................................................... 271 9.1 9.2 9.3 9.4 9.5 9.6 9.7 Overview........................................................................................................................... 9.1.1 Features................................................................................................................ 9.1.2 Block Diagram..................................................................................................... 9.1.3 Pin Configuration ................................................................................................ 9.1.4 Register Configuration......................................................................................... Register Descriptions........................................................................................................ 9.2.1 Timer Counters (8TCNT) .................................................................................... 9.2.2 Time Constant Registers A (TCORA)................................................................. 9.2.3 Time Constant Registers B (TCORB) ................................................................. 9.2.4 Timer Control Register (8TCR)........................................................................... 9.2.5 Timer Control/Status Registers (8TCSR) ............................................................ CPU Interface ................................................................................................................... 9.3.1 8-Bit Registers ..................................................................................................... Operation .......................................................................................................................... 9.4.1 8TCNT Count Timing ......................................................................................... 9.4.2 Compare Match Timing....................................................................................... 9.4.3 Input Capture Signal Timing ............................................................................... 9.4.4 Timing of Status Flag Setting .............................................................................. 9.4.5 Operation with Cascaded Connection.................................................................. 9.4.6 Input Capture Setting........................................................................................... Interrupt ............................................................................................................................ 9.5.1 Interrupt Sources.................................................................................................. 9.5.2 A/D Converter Activation.................................................................................... 8-Bit Timer Application Example .................................................................................... Usage Notes ...................................................................................................................... 9.7.1 Contention between 8TCNT Write and Clear...................................................... 9.7.2 Contention between 8TCNT Write and Increment .............................................. 9.7.3 Contention between TCOR Write and Compare Match ...................................... 9.7.4 Contention between TCOR Read and Input Capture........................................... 9.7.5 Contention between Counter Clearing by Input Capture and Counter Increment 9.7.6 Contention between TCOR Write and Input Capture .......................................... Rev. 2.00 Sep 20, 2005 page xiv of xxxviii 271 271 273 274 275 276 276 277 278 279 282 287 287 289 289 290 291 292 294 296 298 298 299 299 300 300 301 302 303 304 305 9.7.7 9.7.8 9.7.9 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode (Cascaded Connection)........................................................................................ 306 Contention between Compare Matches A and B ................................................. 307 8TCNT Operation and Internal Clock Source Switchover .................................. 307 Section 10 Programmable Timing Pattern Controller (TPC) ................................. 311 10.1 Overview........................................................................................................................... 10.1.1 Features................................................................................................................ 10.1.2 Block Diagram..................................................................................................... 10.1.3 Pin Configuration ................................................................................................ 10.1.4 Register Configuration......................................................................................... 10.2 Register Descriptions........................................................................................................ 10.2.1 Port A Data Direction Register (PADDR)........................................................... 10.2.2 Port A Data Register (PADR).............................................................................. 10.2.3 Port B Data Direction Register (PBDDR) ........................................................... 10.2.4 Port B Data Register (PBDR) .............................................................................. 10.2.5 Next Data Register A (NDRA) ............................................................................ 10.2.6 Next Data Register B (NDRB) ............................................................................ 10.2.7 Next Data Enable Register A (NDERA).............................................................. 10.2.8 Next Data Enable Register B (NDERB).............................................................. 10.2.9 TPC Output Control Register (TPCR)................................................................. 10.2.10 TPC Output Mode Register (TPMR)................................................................... 10.3 Operation .......................................................................................................................... 10.3.1 Overview.............................................................................................................. 10.3.2 Output Timing ..................................................................................................... 10.3.3 Normal TPC Output............................................................................................. 10.3.4 Non-Overlapping TPC Output............................................................................. 10.3.5 TPC Output Triggering by Input Capture............................................................ 10.4 Usage Notes ...................................................................................................................... 10.4.1 Operation of TPC Output Pins............................................................................. 10.4.2 Note on Non-Overlapping Output ....................................................................... 311 311 312 313 314 315 315 315 316 316 317 319 321 322 323 326 328 328 329 330 332 334 335 335 335 Section 11 Watchdog Timer............................................................................................. 11.1 Overview........................................................................................................................... 11.1.1 Features................................................................................................................ 11.1.2 Block Diagram..................................................................................................... 11.1.3 Pin Configuration ................................................................................................ 11.1.4 Register Configuration......................................................................................... 11.2 Register Descriptions........................................................................................................ 11.2.1 Timer Counter (TCNT)........................................................................................ 11.2.2 Timer Control/Status Register (TCSR)................................................................ 337 337 337 338 338 339 339 339 340 Rev. 2.00 Sep 20, 2005 page xv of xxxviii 11.2.3 Reset Control/Status Register (RSTCSR)............................................................ 11.2.4 Notes on Register Access .................................................................................... 11.3 Operation .......................................................................................................................... 11.3.1 Watchdog Timer Operation ................................................................................. 11.3.2 Interval Timer Operation ..................................................................................... 11.3.3 Timing of Setting of Overflow Flag (OVF)......................................................... 11.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) .................................. 11.4 Interrupts........................................................................................................................... 11.5 Usage Notes ...................................................................................................................... 342 344 346 346 347 347 348 349 349 Section 12 Serial Communication Interface ................................................................ 12.1 Overview........................................................................................................................... 12.1.1 Features................................................................................................................ 12.1.2 Block Diagram..................................................................................................... 12.1.3 Pin Configuration ................................................................................................ 12.1.4 Register Configuration......................................................................................... 12.2 Register Descriptions........................................................................................................ 12.2.1 Receive Shift Register (RSR) .............................................................................. 12.2.2 Receive Data Register (RDR).............................................................................. 12.2.3 Transmit Shift Register (TSR)............................................................................. 12.2.4 Transmit Data Register (TDR) ............................................................................ 12.2.5 Serial Mode Register (SMR) ............................................................................... 12.2.6 Serial Control Register (SCR) ............................................................................. 12.2.7 Serial Status Register (SSR) ................................................................................ 12.2.8 Bit Rate Register (BRR) ...................................................................................... 12.3 Operation .......................................................................................................................... 12.3.1 Overview.............................................................................................................. 12.3.2 Operation in Asynchronous Mode ....................................................................... 12.3.3 Multiprocessor Communication .......................................................................... 12.3.4 Synchronous Operation ....................................................................................... 12.4 SCI Interrupts.................................................................................................................... 12.5 Usage Notes ...................................................................................................................... 12.5.1 Notes on Use of SCI ............................................................................................ 351 351 351 353 354 355 356 356 356 357 357 358 361 366 372 380 380 383 392 399 408 409 409 Section 13 Smart Card Interface ..................................................................................... 13.1 Overview........................................................................................................................... 13.1.1 Features................................................................................................................ 13.1.2 Block Diagram..................................................................................................... 13.1.3 Pin Configuration ................................................................................................ 13.1.4 Register Configuration......................................................................................... 13.2 Register Descriptions........................................................................................................ 415 415 415 416 417 417 418 Rev. 2.00 Sep 20, 2005 page xvi of xxxviii 13.2.1 Smart Card Mode Register (SCMR).................................................................... 13.2.2 Serial Status Register (SSR) ................................................................................ 13.2.3 Serial Mode Register (SMR) ............................................................................... 13.2.4 Serial Control Register (SCR) ............................................................................. 13.3 Operation .......................................................................................................................... 13.3.1 Overview.............................................................................................................. 13.3.2 Pin Connections................................................................................................... 13.3.3 Data Format ......................................................................................................... 13.3.4 Register Settings .................................................................................................. 13.3.5 Clock.................................................................................................................... 13.3.6 Transmitting and Receiving Data ........................................................................ 13.4 Usage Notes ...................................................................................................................... 418 420 421 422 423 423 423 424 426 428 430 437 Section 14 A/D Converter................................................................................................. 441 14.1 Overview........................................................................................................................... 14.1.1 Features................................................................................................................ 14.1.2 Block Diagram..................................................................................................... 14.1.3 Pin Configuration ................................................................................................ 14.1.4 Register Configuration......................................................................................... 14.2 Register Descriptions........................................................................................................ 14.2.1 A/D Data Registers A to D (ADDRA to ADDRD) ............................................. 14.2.2 A/D Control/Status Register (ADCSR) ............................................................... 14.2.3 A/D Control Register (ADCR) ............................................................................ 14.3 CPU Interface ................................................................................................................... 14.4 Operation .......................................................................................................................... 14.4.1 Single Mode (SCAN = 0) .................................................................................... 14.4.2 Scan Mode (SCAN = 1)....................................................................................... 14.4.3 Input Sampling and A/D Conversion Time ......................................................... 14.4.4 External Trigger Input Timing............................................................................. 14.5 Interrupts........................................................................................................................... 14.6 Usage Notes ...................................................................................................................... 441 441 442 443 444 445 445 446 448 449 451 451 453 455 456 456 457 Section 15 D/A Converter................................................................................................. 15.1 Overview........................................................................................................................... 15.1.1 Features................................................................................................................ 15.1.2 Block Diagram..................................................................................................... 15.1.3 Pin Configuration ................................................................................................ 15.1.4 Register Configuration......................................................................................... 15.2 Register Descriptions........................................................................................................ 15.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) ................................................. 15.2.2 D/A Control Register (DACR) ............................................................................ 463 463 463 464 465 465 466 466 466 Rev. 2.00 Sep 20, 2005 page xvii of xxxviii 15.2.3 D/A Standby Control Register (DASTCR).......................................................... 468 15.3 Operation .......................................................................................................................... 468 15.4 D/A Output Control .......................................................................................................... 470 Section 16 RAM .................................................................................................................. 16.1 Overview........................................................................................................................... 16.1.1 Block Diagram..................................................................................................... 16.1.2 Register Configuration......................................................................................... 16.2 System Control Register (SYSCR) ................................................................................... 16.3 Operation .......................................................................................................................... 471 471 472 472 473 474 Section 17 Flash Memory [H8/3026F-ZTAT Version] ........................................... 475 17.1 Overview........................................................................................................................... 475 17.2 Features............................................................................................................................. 476 17.2.1 Block Diagram..................................................................................................... 477 17.2.2 Pin Configuration ................................................................................................ 478 17.2.3 Register Configuration......................................................................................... 478 17.3 Register Descriptions........................................................................................................ 479 17.3.1 Flash Memory Control Register 1 (FLMCR1) .................................................... 479 17.3.2 Flash Memory Control Register 2 (FLMCR2) .................................................... 482 17.3.3 Erase Block Register 1 (EBR1) ........................................................................... 483 17.3.4 Erase Block Register 2 (EBR2) ........................................................................... 484 17.3.5 RAM Control Register (RAMCR)....................................................................... 485 17.4 Overview of Operation ..................................................................................................... 487 17.4.1 Mode Transitions ................................................................................................. 487 17.4.2 On-Board Programming Modes........................................................................... 489 17.4.3 Flash Memory Emulation in RAM ...................................................................... 491 17.4.4 Block Configuration ............................................................................................ 492 17.5 On-Board Programming Mode ......................................................................................... 493 17.5.1 Boot Mode ........................................................................................................... 494 17.5.2 User Program Mode............................................................................................. 499 17.6 Flash Memory Programming/Erasing............................................................................... 501 17.6.1 Program Mode ..................................................................................................... 503 17.6.2 Program-Verify Mode ......................................................................................... 503 17.6.3 Erase Mode .......................................................................................................... 508 17.6.4 Erase-Verify Mode .............................................................................................. 509 17.7 Flash Memory Protection.................................................................................................. 511 17.7.1 Hardware Protection ............................................................................................ 511 17.7.2 Software Protection ............................................................................................. 512 17.7.3 Error Protection ................................................................................................... 513 17.8 Flash Memory Emulation in RAM ................................................................................... 515 Rev. 2.00 Sep 20, 2005 page xviii of xxxviii 17.9 NMI Input Disabling Conditions ...................................................................................... 17.10 Flash Memory PROM Mode ............................................................................................ 17.10.1 Socket Adapters and Memory Map ..................................................................... 17.10.2 Notes on Use of PROM Mode............................................................................. 17.11 Flash Memory Programming and Erasing Precautions..................................................... 17.12 Mask ROM (H8/3026 Mask ROM Version) Overview.................................................... 17.12.1 Block Diagram..................................................................................................... 17.13 Notes on Ordering Mask ROM Version Chip .................................................................. 17.14 Notes when Converting the F-ZTAT Application Software to the Mask ROM Versions 518 519 519 520 520 526 526 527 528 Section 18 Flash Memory [H8/3024F-ZTAT Version] ........................................... 529 18.1 Overview........................................................................................................................... 529 18.2 Features............................................................................................................................. 530 18.2.1 Block Diagram..................................................................................................... 531 18.2.2 Pin Configuration ................................................................................................ 532 18.2.3 Register Configuration......................................................................................... 532 18.3 Register Descriptions........................................................................................................ 533 18.3.1 Flash Memory Control Register 1 (FLMCR1) .................................................... 533 18.3.2 Flash Memory Control Register 2 (FLMCR2) .................................................... 536 18.3.3 Erase Block Register (EBR) ................................................................................ 538 18.3.4 RAM Control Register (RAMCR)....................................................................... 539 18.4 Overview of Operation ..................................................................................................... 541 18.4.1 Mode Transitions ................................................................................................. 541 18.4.2 On-Board Programming Modes........................................................................... 543 18.4.3 Flash Memory Emulation in RAM ...................................................................... 545 18.4.4 Block Configuration ............................................................................................ 546 18.5 On-Board Programming Mode ......................................................................................... 547 18.5.1 Boot Mode ........................................................................................................... 548 18.5.2 User Program Mode............................................................................................. 553 18.6 Flash Memory Programming/Erasing............................................................................... 555 18.6.1 Program Mode ..................................................................................................... 557 18.6.2 Program-Verify Mode ......................................................................................... 557 18.6.3 Erase Mode .......................................................................................................... 562 18.6.4 Erase-Verify Mode .............................................................................................. 563 18.7 Flash Memory Protection.................................................................................................. 565 18.7.1 Hardware Protection ............................................................................................ 565 18.7.2 Software Protection ............................................................................................. 566 18.7.3 Error Protection ................................................................................................... 567 18.8 Flash Memory Emulation in RAM ................................................................................... 569 18.9 NMI Input Disabling Conditions ...................................................................................... 570 18.10 Flash Memory PROM Mode ............................................................................................ 571 Rev. 2.00 Sep 20, 2005 page xix of xxxviii 18.10.1 Socket Adapters and Memory Map ..................................................................... 18.10.2 Notes on Use of PROM Mode............................................................................. 18.11 Flash Memory Programming and Erasing Precautions..................................................... 18.12 Notes when Converting the F-ZTAT Application Software to the Mask ROM Versions 571 572 573 579 Section 19 Clock Pulse Generator .................................................................................. 581 19.1 Overview........................................................................................................................... 19.1.1 Block Diagram..................................................................................................... 19.2 Oscillator Circuit .............................................................................................................. 19.2.1 Connecting a Crystal Resonator .......................................................................... 19.2.2 External Clock Input............................................................................................ 19.3 Duty Adjustment Circuit................................................................................................... 19.4 Prescalers .......................................................................................................................... 19.5 Frequency Divider ............................................................................................................ 19.5.1 Register Configuration......................................................................................... 19.5.2 Division Control Register (DIVCR) .................................................................... 19.5.3 Usage Notes......................................................................................................... 581 582 583 583 585 587 587 588 588 588 589 Section 20 Power-Down State ......................................................................................... 591 20.1 Overview........................................................................................................................... 591 20.2 Register Configuration...................................................................................................... 593 20.2.1 System Control Register (SYSCR)...................................................................... 593 20.2.2 Module Standby Control Register H (MSTCRH)................................................ 595 20.2.3 Module Standby Control Register L (MSTCRL) ................................................ 596 20.3 Sleep Mode ....................................................................................................................... 598 20.3.1 Transition to Sleep Mode..................................................................................... 598 20.3.2 Exit from Sleep Mode.......................................................................................... 598 20.4 Software Standby Mode.................................................................................................... 598 20.4.1 Transition to Software Standby Mode ................................................................. 598 20.4.2 Exit from Software Standby Mode ...................................................................... 599 20.4.3 Selection of Waiting Time for Exit from Software Standby Mode ..................... 599 20.4.4 Sample Application of Software Standby Mode.................................................. 601 20.4.5 Usage Notes......................................................................................................... 601 20.5 Hardware Standby Mode .................................................................................................. 602 20.5.1 Transition to Hardware Standby Mode................................................................ 602 20.5.2 Exit from Hardware Standby Mode..................................................................... 602 20.5.3 Timing for Hardware Standby Mode................................................................... 603 20.6 Module Standby Function................................................................................................. 604 20.6.1 Module Standby Timing ...................................................................................... 604 20.6.2 Read/Write in Module Standby ........................................................................... 604 20.6.3 Usage Notes......................................................................................................... 604 Rev. 2.00 Sep 20, 2005 page xx of xxxviii 20.7 System Clock Output Disabling Function ........................................................................ 605 Section 21 Electrical Characteristics ............................................................................. 21.1 Electrical Characteristics of H8/3024 Mask ROM Version and H8/3026 Mask ROM Version .................................................................................... 21.1.1 Absolute Maximum Ratings ................................................................................ 21.1.2 DC Characteristics ............................................................................................... 21.1.3 AC Characteristics ............................................................................................... 21.1.4 A/D Conversion Characteristics .......................................................................... 21.1.5 D/A Conversion Characteristics .......................................................................... 21.2 Electrical Characteristics of H8/3024F-ZTAT Version and H8/3026F-ZTAT Version ... 21.2.1 Absolute Maximum Ratings ................................................................................ 21.2.2 DC Characteristics ............................................................................................... 21.2.3 AC Characteristics ............................................................................................... 21.2.4 A/D Conversion Characteristics .......................................................................... 21.2.5 D/A Conversion Characteristics .......................................................................... 21.2.6 Flash Memory Characteristics ............................................................................. 21.3 Operational Timing........................................................................................................... 21.3.1 Clock Timing ....................................................................................................... 21.3.2 Control Signal Timing ......................................................................................... 21.3.3 Bus Timing .......................................................................................................... 21.3.4 TPC and I/O Port Timing..................................................................................... 21.3.5 Timer Input/Output Timing ................................................................................. 21.3.6 SCI Input/Output Timing..................................................................................... 607 607 607 608 611 616 617 618 618 619 622 627 628 629 631 631 632 633 637 637 638 Appendix A Instruction Set .............................................................................................. 639 A.1 A.2 A.3 Instruction List.................................................................................................................. 639 Operation Code Maps ....................................................................................................... 654 Number of States Required for Execution ........................................................................ 657 Appendix B Internal I/O Registers ................................................................................. 667 B.1 B.2 B.3 Address List (H8/3026F-ZTAT, H8/3026 Mask ROM Version) ..................................... 668 Address List (H8/3024F-ZTAT, H8/3024 Mask ROM Version) ..................................... 678 Functions .......................................................................................................................... 688 Appendix C I/O Port Block Diagrams .......................................................................... 754 C.1 C.2 C.3 C.4 C.5 Port 1 Block Diagram ....................................................................................................... Port 2 Block Diagram ....................................................................................................... Port 3 Block Diagram ....................................................................................................... Port 4 Block Diagram ....................................................................................................... Port 5 Block Diagram ....................................................................................................... 754 755 756 757 758 Rev. 2.00 Sep 20, 2005 page xxi of xxxviii C.6 C.7 C.8 C.9 C.10 C.11 Port 6 Block Diagrams...................................................................................................... Port 7 Block Diagrams...................................................................................................... Port 8 Block Diagrams...................................................................................................... Port 9 Block Diagrams...................................................................................................... Port A Block Diagrams..................................................................................................... Port B Block Diagrams ..................................................................................................... 759 764 765 769 775 778 Appendix D Pin States ....................................................................................................... 784 D.1 D.2 Port States in Each Mode.................................................................................................. 784 Pin States at Reset............................................................................................................. 789 Appendix E Timing of Transition to and Recovery from Hardware Standby Mode ............................................................... 792 Appendix F Product Code Lineup ................................................................................. 793 Appendix G Package Dimensions .................................................................................. 794 Appendix H Comparison of H8/300H Series Product Specifications ................. 797 H.1 Comparison of Pin Functions of 100-Pin Package Products (FP-100B, TFP-100B)........ 797 Rev. 2.00 Sep 20, 2005 page xxii of xxxviii Figures Section 1 Overview Figure 1.1 Block Diagram..................................................................................................... Figure 1.2 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT, H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version (FP-100B or TFP-100B Package, Top View)...................................................... Figure 1.3 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT, H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version (FP-100A Package, Top View)............................................................................ Section 2 CPU Figure 2.1 CPU Operating Modes......................................................................................... Figure 2.2 Memory Map ....................................................................................................... Figure 2.3 CPU Registers...................................................................................................... Figure 2.4 Usage of General Registers.................................................................................. Figure 2.5 Stack .................................................................................................................... Figure 2.6 General Register Data Formats............................................................................ Figure 2.7 General Register Data Formats............................................................................ Figure 2.8 Memory Data Formats......................................................................................... Figure 2.9 Instruction Formats.............................................................................................. Figure 2.10 Memory-Indirect Branch Address Specification ................................................. Figure 2.11 Processing States ................................................................................................. Figure 2.12 Classification of Exception Sources .................................................................... Figure 2.13 State Transitions .................................................................................................. Figure 2.14 Stack Structure after Exception Handling............................................................ Figure 2.15 On-Chip Memory Access Cycle .......................................................................... Figure 2.16 Pin States during On-Chip Memory Access (Address Update Mode 1).............. Figure 2.17 Access Cycle for On-Chip Supporting Modules.................................................. Figure 2.18 Pin States during Access to On-Chip Supporting Modules ................................. 6 8 9 20 21 22 23 24 26 27 28 41 45 49 50 51 52 54 54 55 55 Section 3 MCU Operating Modes Figure 3.1 Memory Map of H8/3024F-ZTAT and H8/3024 Mask ROM Version in Each Operating Mode................................................................................................... 66 Figure 3.2 Memory Map of H8/3026F-ZTAT and H8/3026 Mask ROM Version in Each Operating Mode................................................................................................... 68 Section 4 Exception Handling Figure 4.1 Exception Sources ............................................................................................... 72 Figure 4.2 Reset Sequence (Modes 1 and 3)......................................................................... 75 Rev. 2.00 Sep 20, 2005 page xxiii of xxxviii Figure 4.3 Figure 4.4 Figure 4.5 Figure 4.6 Figure 4.7 Reset Sequence (Modes 2 and 4)......................................................................... Reset Sequence (Mode 6) .................................................................................... Interrupt Sources and Number of Interrupts ........................................................ Stack after Completion of Exception Handling ................................................... Operation when SP Value is Odd ........................................................................ 76 77 78 79 81 Section 5 Interrupt Controller Figure 5.1 Interrupt Controller Block Diagram..................................................................... Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5 .......................................................... Figure 5.3 Timing of Setting of IRQnF................................................................................. Figure 5.4 Process Up to Interrupt Acceptance when UE = 1............................................... Figure 5.5 Interrupt Masking State Transitions (Example)................................................... Figure 5.6 Process Up to Interrupt Acceptance when UE = 0............................................... Figure 5.7 Interrupt Exception Handling Sequence .............................................................. Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction...................... 84 95 96 101 103 104 105 107 Section 6 Bus Controller Figure 6.1 Block Diagram of Bus Controller........................................................................ Figure 6.2 Access Area Map for Each Operating Mode ....................................................... Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3024F-ZTAT, H8/3024 Mask ROM Verion) (1).......................................... Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3026F-ZTAT, H8/3026 Mask ROM Verion) (2).......................................... Figure 6.4 CSn Signal Output Timing (n = 0 to 7)................................................................ Figure 6.5 Sample Address Output in Each Address Update Mode (Basic Bus Interface, 3-State Space).................................................................... Figure 6.6 Access Sizes and Data Alignment Control (8-Bit Access Area) ......................... Figure 6.7 Access Sizes and Data Alignment Control (16-Bit Access Area) ....................... Figure 6.8 Bus Control Signal Timing for 8-Bit, Three-State-Access Area ......................... Figure 6.9 Bus Control Signal Timing for 8-Bit, Two-State-Access Area ........................... Figure 6.10 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1) (Byte Access to Even Address) ........................................................................... Figure 6.11 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2) (Byte Access to Odd Address)............................................................................. Figure 6.12 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3) (Word Access) ..................................................................................................... Figure 6.13 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1) (Byte Access to Even Address) ........................................................................... Figure 6.14 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2) (Byte Access to Odd Address)............................................................................. Rev. 2.00 Sep 20, 2005 page xxiv of xxxviii 110 124 125 126 129 130 131 132 134 135 136 137 138 139 140 Figure 6.15 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3) (Word Access) ..................................................................................................... Example of Wait State Insertion Timing ............................................................. Example of Idle Cycle Operation (ICIS1 = 1) ..................................................... Example of Idle Cycle Operation (ICIS0 = 1) ..................................................... Example of Idle Cycle Operation ........................................................................ Example of External Bus Master Operation ........................................................ ASTCR Write Timing.......................................................................................... DDR Write Timing .............................................................................................. BRCR Write Timing............................................................................................ 141 142 143 144 145 148 149 149 150 Section 7 I/O Ports Figure 7.1 Port 1 Pin Configuration...................................................................................... Figure 7.2 Port 2 Pin Configuration...................................................................................... Figure 7.3 Port 3 Pin Configuration...................................................................................... Figure 7.4 Port 4 Pin Configuration...................................................................................... Figure 7.5 Port 5 Pin Configuration...................................................................................... Figure 7.6 Port 6 Pin Configuration...................................................................................... Figure 7.7 Port 7 Pin Configuration...................................................................................... Figure 7.8 Port 8 Pin Configuration...................................................................................... Figure 7.9 Port 9 Pin Configuration...................................................................................... Figure 7.10 Port A Pin Configuration ..................................................................................... Figure 7.11 Port B Pin Configuration ..................................................................................... 155 158 162 164 167 171 175 177 182 188 200 Section 8 16-Bit Timer Figure 8.1 16-bit timer Block Diagram (Overall) ................................................................. Figure 8.2 Block Diagram of Channels 0 and 1 .................................................................... Figure 8.3 Block Diagram of Channel 2 ............................................................................... Figure 8.4 16TCNT Access Operation [CPU → 16TCNT (Word)] ..................................... Figure 8.5 Access to Timer Counter (CPU Reads 16TCNT, Word)..................................... Figure 8.6 Access to Timer Counter H (CPU Writes to 16TCNTH, Upper Byte)................ Figure 8.7 Access to Timer Counter L (CPU Writes to 16TCNTL, Lower Byte) ................ Figure 8.8 Access to Timer Counter H (CPU Reads 16TCNTH, Upper Byte)..................... Figure 8.9 Access to Timer Counter L (CPU Reads 16TCNTL, Lower Byte) ..................... Figure 8.10 16TCR Access (CPU Writes to 16TCR) ............................................................. Figure 8.11 16TCR Access (CPU Reads 16TCR) .................................................................. Figure 8.12 Counter Setup Procedure (Example) ................................................................... Figure 8.13 Free-Running Counter Operation ........................................................................ Figure 8.14 Periodic Counter Operation ................................................................................. Figure 8.15 Count Timing for Internal Clock Sources............................................................ Figure 8.16 Count Timing for External Clock Sources (when Both Edges are Detected) ...... 209 210 211 235 235 236 236 236 237 237 238 239 240 241 241 242 Figure 6.16 Figure 6.17 Figure 6.18 Figure 6.19 Figure 6.20 Figure 6.21 Figure 6.22 Figure 6.23 Rev. 2.00 Sep 20, 2005 page xxv of xxxviii Figure 8.17 Figure 8.18 Figure 8.19 Figure 8.20 Figure 8.21 Figure 8.22 Figure 8.23 Figure 8.24 Figure 8.25 Figure 8.26 Figure 8.27 Figure 8.28 Figure 8.29 Figure 8.30 Figure 8.31 Figure 8.32 Figure 8.33 Figure 8.34 Figure 8.35 Figure 8.36 Figure 8.37 Figure 8.38 Figure 8.39 Figure 8.40 Figure 8.41 Figure 8.42 Figure 8.43 Figure 8.44 Setup Procedure for Waveform Output by Compare Match (Example) .............. 0 and 1 Output (TOA = 1, TOB = 0) ................................................................... Toggle Output (TOA = 1, TOB = 0).................................................................... Output Compare Output Timing.......................................................................... Setup Procedure for Input Capture (Example)..................................................... Input Capture (Example) ..................................................................................... Input Capture Signal Timing ............................................................................... Setup Procedure for Synchronization (Example)................................................. Synchronization (Example) ................................................................................. Setup Procedure for PWM Mode (Example)....................................................... PWM Mode (Example 1)..................................................................................... PWM Mode (Example 2)..................................................................................... Setup Procedure for Phase Counting Mode (Example) ....................................... Operation in Phase Counting Mode (Example) ................................................... Phase Difference, Overlap, and Pulse Width in Phase Counting Mode............... Timing for Setting 16-Bit Timer Output Level by Writing to TOLR .................. Timing of Setting of IMFA and IMFB by Compare Match................................. Timing of Setting of IMFA and IMFB by Input Capture .................................... Timing of Setting of OVF.................................................................................... Timing of Clearing of Status Flags...................................................................... Contention between 16TCNT Write and Clear.................................................... Contention between 16TCNT Word Write and Increment .................................. Contention between 16TCNT Byte Write and Increment.................................... Contention between General Register Write and Compare Match ...................... Contention between 16TCNT Write and Overflow............................................. Contention between General Register Read and Input Capture........................... Contention between Counter Clearing by Input Capture and Counter Increment Contention between General Register Write and Input Capture.......................... 242 243 243 244 245 245 246 247 248 249 250 251 252 253 253 254 255 256 257 257 259 260 261 262 263 264 265 266 Section 9 8-Bit Timers Figure 9.1 Block Diagram of 8-Bit Timer Unit (Two Channels: Group 0)........................... Figure 9.2 8TCNT Access Operation (CPU Writes to 8TCNT, Word) ................................ Figure 9.3 8TCNT Access Operation (CPU Reads 8TCNT, Word) ..................................... Figure 9.4 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte)................... Figure 9.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte)................... Figure 9.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte)........................ Figure 9.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte) ....................... Figure 9.8 Count Timing for Internal Clock Input................................................................ Figure 9.9 Count Timing for External Clock Input (Both-Edge Detection).......................... Figure 9.10 Timing of Timer Output ...................................................................................... Figure 9.11 Timing of Clear by Compare Match.................................................................... 273 287 287 288 288 288 288 289 290 290 291 Rev. 2.00 Sep 20, 2005 page xxvi of xxxviii Figure 9.12 Figure 9.13 Figure 9.14 Figure 9.15 Figure 9.16 Figure 9.17 Figure 9.18 Figure 9.19 Figure 9.20 Figure 9.21 Figure 9.22 Figure 9.23 Figure 9.24 Timing of Clear by Input Capture........................................................................ Timing of Input Capture Input Signal.................................................................. CMF Flag Setting Timing when Compare Match Occurs ................................... CMFB Flag Setting Timing when Input Capture Occurs .................................... Timing of OVF Setting ........................................................................................ Example of Pulse Output ..................................................................................... Contention between 8TCNT Write and Clear...................................................... Contention between 8TCNT Write and Increment .............................................. Contention between TCOR Write and Compare Match ...................................... Contention between TCOR Read and Input Capture........................................... Contention between Counter Clearing by Input Capture and Counter Increment Contention between TCOR Write and Input Capture .......................................... Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode . 291 292 292 293 293 299 300 301 302 303 304 305 306 Section 10 Programmable Timing Pattern Controller (TPC) Figure 10.1 TPC Block Diagram ............................................................................................ Figure 10.2 TPC Output Operation......................................................................................... Figure 10.3 Timing of Transfer of Next Data Register Contents and Output (Example) ....... Figure 10.4 Setup Procedure for Normal TPC Output (Example) .......................................... Figure 10.5 Normal TPC Output Example (Five-Phase Pulse Output)................................... Figure 10.6 Setup Procedure for Non-Overlapping TPC Output (Example) .......................... Figure 10.7 Non-Overlapping TPC Output Example (Four-Phase Complementary Non-Overlapping Pulse Output) ........................... Figure 10.8 TPC Output Triggering by Input Capture (Example) .......................................... Figure 10.9 Non-Overlapping TPC Output............................................................................. Figure 10.10 Non-Overlapping Operation and NDR Write Timing ......................................... 333 334 335 336 Section 11 Watchdog Timer Figure 11.1 WDT Block Diagram........................................................................................... Figure 11.2 Format of Data Written to TCNT and TCSR....................................................... Figure 11.3 Format of Data Written to RSTCSR.................................................................... Figure 11.4 Operation in Watchdog Timer Mode................................................................... Figure 11.5 Interval Timer Operation ..................................................................................... Figure 11.6 Timing of Setting of OVF.................................................................................... Figure 11.7 Timing of Setting of WRST Bit and Internal Reset............................................. Figure 11.8 Contention between TCNT Write and Count up ................................................. 338 344 345 346 347 347 348 349 312 328 329 330 331 332 Section 12 Serial Communication Interface Figure 12.1 SCI Block Diagram.............................................................................................. 353 Figure 12.2 Data Format in Asynchronous Communication (Example: 8-Bit Data with Parity and 2 Stop Bits).............................................. 383 Rev. 2.00 Sep 20, 2005 page xxvii of xxxviii Figure 12.3 Figure 12.4 Figure 12.5 Figure 12.6 Figure 12.7 Figure 12.8 Figure 12.9 Figure 12.10 Figure 12.11 Figure 12.12 Figure 12.13 Figure 12.14 Figure 12.15 Figure 12.16 Figure 12.17 Figure 12.18 Figure 12.19 Figure 12.20 Figure 12.21 Figure 12.22 Figure 12.23 Figure 12.24 Phase Relationship between Output Clock and Serial Data (Asynchronous Mode) ......................................................................................... Sample Flowchart for SCI Initialization .............................................................. Sample Flowchart for Transmitting Serial Data .................................................. Example of SCI Transmit Operation in Asynchronous Mode (8-Bit Data with Parity and One Stop Bit)........................................................... Sample Flowchart for Receiving Serial Data....................................................... Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit).. Example of Communication among Processors using Multiprocessor Format (Sending Data H'AA to Receiving Processor A) ................................................. Sample Flowchart for Transmitting Multiprocessor Serial Data ......................... Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) ...................................... Sample Flowchart for Receiving Multiprocessor Serial Data.............................. Example of SCI Receive Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) ...................................... Data Format in Synchronous Communication..................................................... Sample Flowchart for SCI Initialization .............................................................. Sample Flowchart for Serial Transmitting........................................................... Example of SCI Transmit Operation ................................................................... Sample Flowchart for Serial Receiving ............................................................... Example of SCI Receive Operation..................................................................... Sample Flowchart for Simultaneous Serial Transmitting and Receiving ............ Receive Data Sampling Timing in Asynchronous Mode..................................... Example of Synchronous Transmission............................................................... Operation when Switching from SCK Pin Function to Port Pin Function........... Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output) ....................................................... Section 13 Smart Card Interface Figure 13.1 Block Diagram of Smart Card Interface .............................................................. Figure 13.2 Smart Card Interface Connection Diagram.......................................................... Figure 13.3 Smart Card Interface Data Format....................................................................... Figure 13.4 Timing of TEND Flag Setting ............................................................................. Figure 13.5 Sample Transmission Processing Flowchart........................................................ Figure 13.6 Relation Between Transmit Operation and Internal Registers............................. Figure 13.7 Timing of TEND Flag Setting ............................................................................. Figure 13.8 Sample Reception Processing Flowchart............................................................. Figure 13.9 Timing for Fixing Cock Output ........................................................................... Figure 13.10 Procedure for Stopping and Restarting the Clock................................................ Figure 13.11 Receive Data Sampling Timing in Smart Card Interface Mode .......................... Rev. 2.00 Sep 20, 2005 page xxviii of xxxviii 385 386 387 388 389 392 393 394 395 396 398 399 401 402 403 404 406 407 410 411 412 413 416 424 425 431 432 433 433 434 435 436 437 Figure 13.12 Retransmission in SCI Receive Mode ................................................................. 439 Figure 13.13 Retransmission in SCI Transmit Mode................................................................ 440 Section 14 A/D Converter Figure 14.1 A/D Converter Block Diagram ............................................................................ Figure 14.2 A/D Data Register Access Operation (Reading H'AA40) ................................... Figure 14.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) ........ Figure 14.4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected) .............................................................................................................. Figure 14.5 A/D Conversion Timing ...................................................................................... Figure 14.6 External Trigger Input Timing............................................................................. Figure 14.7 Example of Analog Input Protection Circuit ....................................................... Figure 14.8 Analog Input Pin Equivalent Circuit.................................................................... Figure 14.9 A/D Converter Accuracy Definitions (1)............................................................. Figure 14.10 A/D Converter Accuracy Definitions (2)............................................................. Figure 14.11 Analog Input Circuit (Example) .......................................................................... 442 450 452 454 455 456 458 458 460 460 461 Section 15 D/A Converter Figure 15.1 D/A Converter Block Diagram ............................................................................ 464 Figure 15.2 Example of D/A Converter Operation ................................................................. 469 Section 16 RAM Figure 16.1 RAM Block Diagram........................................................................................... 472 Section 17 Flash Memory [H8/3026F-ZTAT Version] Figure 17.1 Block Diagram of Flash Memory ........................................................................ Figure 17.2 Flash Memory Related State Transitions............................................................. Figure 17.3 Reading Overlap RAM Data in User Mode/User Program Mode ....................... Figure 17.4 Writing Overlap RAM Data in User Program Mode ........................................... Figure 17.5 System Configuration When Using Boot Mode .................................................. Figure 17.6 Boot Mode Execution Procedure......................................................................... Figure 17.7 RAM Areas in Boot Mode................................................................................... Figure 17.8 Example of User Program Mode Execution Procedure ....................................... Figure 17.9 FLMCR1 Bit Settings and State Transitions ....................................................... Figure 17.10 Program/Program-Verify Flowchart (128-Byte Programming)........................... Figure 17.11 Erase/Erase-Verify Flowchart (Single-Block Erasing) ........................................ Figure 17.12 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled))........................................................... Figure 17.13 Flowchart of Flash Memory Emulation in RAM................................................. Figure 17.14 Example of RAM Overlap Operation .................................................................. Figure 17.15 Memory Map in PROM Mode............................................................................. 477 488 491 492 494 495 497 500 502 507 510 514 515 516 519 Rev. 2.00 Sep 20, 2005 page xxix of xxxviii Figure 17.16 Power-On/Off Timing (Boot Mode).................................................................... Figure 17.17 Power-On/Off Timing (User Program Mode) ..................................................... Figure 17.18 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode) .......................... Figure 17.19 ROM Block Diagram (H8/3026 Mask ROM Version)........................................ Figure 17.20 Mask ROM Addresses and Data.......................................................................... Section 18 Flash Memory [H8/3024F-ZTAT Version] Figure 18.1 Block Diagram of Flash Memory ........................................................................ Figure 18.2 Example of ROM Area/RAM Area Overlap ....................................................... Figure 18.3 Flash Memory Related State Transitions............................................................. Figure 18.4 Reading Overlap RAM Data in User Mode/User Program Mode ....................... Figure 18.5 Writing Overlap RAM Data in User Program Mode ........................................... Figure 18.6 System Configuration When Using Boot Mode .................................................. Figure 18.7 Boot Mode Execution Procedure......................................................................... Figure 18.8 RAM Areas in Boot Mode................................................................................... Figure 18.9 Example of User Program Mode Execution Procedure ....................................... Figure 18.10 FLMCR1 Bit Settings and State Transitions ....................................................... Figure 18.11 Program/Program-Verify Flowchart (128-Byte Programming)........................... Figure 18.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) ........................................ Figure 18.13 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled))........................................................... Figure 18.14 Example of RAM Overlap Operation .................................................................. Figure 18.15 Memory Map in PROM Mode............................................................................. Figure 18.16 Power-On/Off Timing (Boot Mode).................................................................... Figure 18.17 Power-On/Off Timing (User Program Mode) ..................................................... Figure 18.18 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode) .......................... Section 19 Clock Pulse Generator Figure 19.1 Block Diagram of Clock Pulse Generator ........................................................... Figure 19.2 Connection of Crystal Resonator (Example) ....................................................... Figure 19.3 Crystal Resonator Equivalent Circuit .................................................................. Figure 19.4 Oscillator Circuit Block Board Design Precautions ............................................ Figure 19.5 External Clock Input (Examples) ........................................................................ Figure 19.6 External Clock Input Timing ............................................................................... Figure 19.7 External Clock Output Settling Delay Timing..................................................... 523 524 525 526 527 531 541 542 545 546 548 549 551 554 556 561 564 568 569 572 576 577 578 582 583 584 584 585 587 587 Section 20 Power-Down State Figure 20.1 NMI Timing for Software Standby Mode (Example).......................................... 601 Figure 20.2 Hardware Standby Mode Timing......................................................................... 603 Rev. 2.00 Sep 20, 2005 page xxx of xxxviii Figure 20.3 Starting and Stopping of System Clock Output ................................................... 605 Section 21 Electrical Characteristics Figure 21.1 Darlington Pair Drive Circuit (Example)............................................................. Figure 21.2 Sample LED Circuit ............................................................................................ Figure 21.3 Output Load Circuit............................................................................................. Figure 21.4 Darlington Pair Drive Circuit (Example)............................................................. Figure 21.5 Sample LED Circuit ............................................................................................ Figure 21.6 Output Load Circuit............................................................................................. Figure 21.7 Oscillator Settling Timing.................................................................................... Figure 21.8 Reset Input Timing .............................................................................................. Figure 21.9 Reset Output Timing............................................................................................ Figure 21.10 Interrupt Input Timing ......................................................................................... Figure 21.11 Basic Bus Cycle: Two-State Access .................................................................... Figure 21.12 Basic Bus Cycle: Three-State Access .................................................................. Figure 21.13 Basic Bus Cycle: Three-State Access with One Wait State................................. Figure 21.14 Bus-Release Mode Timing .................................................................................. Figure 21.15 TPC and I/O Port Input/Output Timing ............................................................... Figure 21.16 Timer Input/Output Timing ................................................................................. Figure 21.17 Timer External Clock Input Timing..................................................................... Figure 21.18 SCI Input Clock Timing ...................................................................................... Figure 21.19 SCI Input/Output Timing in Synchronous Mode................................................. 611 611 615 622 622 626 631 632 632 633 634 635 636 636 637 637 638 638 638 Appendix C I/O Port Block Diagrams Figure C.1 Port 1 Block Diagram........................................................................................ Figure C.2 Port 2 Block Diagram........................................................................................ Figure C.3 Port 3 Block Diagram........................................................................................ Figure C.4 Port 4 Block Diagram........................................................................................ Figure C.5 Port 5 Block Diagram........................................................................................ Figure C.6 (a) Port 6 Block Diagram (Pin P60) ........................................................................ Figure C.6 (b) Port 6 Block Diagram (Pin P61) ........................................................................ Figure C.6 (c) Port 6 Block Diagram (Pin P62) ........................................................................ Figure C.6 (d) Port 6 Block Diagram (Pins P63 to P66) ............................................................ Figure C.6 (e) Port 6 Block Diagram (Pin P67) ........................................................................ Figure C.7 (a) Port 7 Block Diagram (Pins P70 to P75) ............................................................ Figure C.7 (b) Port 7 Block Diagram (Pins P76 and P77).......................................................... Figure C.8 (a) Port 8 Block Diagram (Pin P80) ........................................................................ Figure C.8 (b) Port 8 Block Diagram (Pins P81 and P82).......................................................... Figure C.8 (c) Port 8 Block Diagram (Pin P83) ........................................................................ Figure C.8 (d) Port 8 Block Diagram (Pin P84) ........................................................................ Figure C.9 (a) Port 9 Block Diagram (Pin P90) ........................................................................ 754 755 756 757 758 759 760 761 762 763 764 764 765 766 767 768 769 Rev. 2.00 Sep 20, 2005 page xxxi of xxxviii Figure C.9 (b) Figure C.9 (c) Figure C.9 (d) Figure C.9 (e) Figure C.9 (f) Figure C.10 (a) Figure C.10 (b) Figure C.10 (c) Figure C.11 (a) Figure C.11 (b) Figure C.11 (c) Figure C.11 (d) Figure C.11 (e) Figure C.11 (f) Port 9 Block Diagram (Pin P91) ........................................................................ Port 9 Block Diagram (Pin P92) ........................................................................ Port 9 Block Diagram (Pin P93) ........................................................................ Port 9 Block Diagram (Pin P94) ........................................................................ Port 9 Block Diagram (Pin P95) ........................................................................ Port A Block Diagram (Pins PA0 and PA1) ....................................................... Port A Block Diagram (Pins PA2 and PA3) ....................................................... Port A Block Diagram (Pins PA4 to PA7).......................................................... Port B Block Diagram (Pins PB0 and PB2)........................................................ Port B Block Diagram (Pins PB1 and PB3)........................................................ Port B Block Diagram (Pin PB4) ....................................................................... Port B Block Diagram (Pin PB5) ....................................................................... Port B Block Diagram (Pin PB6) ....................................................................... Port B Block Diagram (Pin PB7) ....................................................................... 770 771 772 773 774 775 776 777 778 779 780 781 782 783 Appendix D Figure D.1 Figure D.2 Figure D.3 Figure D.4 Pin States Reset during Memory Access (Modes 1 and 2)................................................... Reset during Memory Access (Modes 3 and 4)................................................... Reset during Memory Access (Mode 5) .............................................................. Reset during Operation (Modes 6 and 7)............................................................. 789 790 791 791 Appendix G Figure G.1 Figure G.2 Figure G.3 Package Dimensions Package Dimensions (FP-100B).......................................................................... 794 Package Dimensions (TFP-100B) ....................................................................... 795 Package Dimensions (FP-100A).......................................................................... 796 Rev. 2.00 Sep 20, 2005 page xxxii of xxxviii Tables Section 1 Overview Table 1.1 Features................................................................................................................ 2 Table 1.2 Comparison of H8/3024 Group Pin Arrangements.............................................. 7 Table 1.3 Pin Functions ....................................................................................................... 10 Table 1.4 Pin Assignments in Each Mode (FP-100B or TFP-100B, FP-100A) .................. 15 Section 2 CPU Table 2.1 Instruction Classification ..................................................................................... 29 Table 2.2 Instructions and Addressing Modes..................................................................... 30 Table 2.3 Data Transfer Instructions ................................................................................... 32 Table 2.4 Arithmetic Operation Instructions ....................................................................... 33 Table 2.5 Logic Operation Instructions ............................................................................... 35 Table 2.6 Shift Instructions.................................................................................................. 35 Table 2.7 Bit Manipulation Instructions .............................................................................. 36 Table 2.8 Branching Instructions......................................................................................... 38 Table 2.9 System Control Instructions................................................................................. 39 Table 2.10 Block Transfer Instruction ................................................................................... 40 Table 2.11 Addressing Modes ............................................................................................... 43 Table 2.12 Absolute Address Access Ranges........................................................................ 44 Table 2.13 Effective Address Calculation ............................................................................. 46 Table 2.14 Exception Handling Types and Priority............................................................... 50 Section 3 MCU Operating Modes Table 3.1 Operating Mode Selection ................................................................................... Table 3.2 Registers .............................................................................................................. Table 3.3 Pin Functions in Each Mode................................................................................ Table 3.4 Address Maps in Mode 5..................................................................................... 57 58 64 65 Section 4 Exception Handling Table 4.1 Exception Types and Priority .............................................................................. 71 Table 4.2 Exception Vector Table ....................................................................................... 73 Section 5 Interrupt Controller Table 5.1 Interrupt Pins ....................................................................................................... Table 5.2 Interrupt Controller Registers .............................................................................. Table 5.3 Interrupt Sources, Vector Addresses, and Priority............................................... Table 5.4 UE, I, and UI Bit Settings and Interrupt Handling............................................... Table 5.5 Interrupt Response Time...................................................................................... 85 85 97 100 106 Rev. 2.00 Sep 20, 2005 page xxxiii of xxxviii Section 6 Bus Controller Table 6.1 Bus Controller Pins.............................................................................................. Table 6.2 Bus Controller Registers...................................................................................... Table 6.3 Bus Specifications for Each Area (Basic Bus Interface) ..................................... Table 6.4 Data Buses Used and Valid Strobes..................................................................... Table 6.5 Pin States in Idle Cycle........................................................................................ 111 112 128 133 146 Section 7 I/O Ports Table 7.1 Port Functions...................................................................................................... Table 7.2 Port 1 Registers.................................................................................................... Table 7.3 Port 2 Registers.................................................................................................... Table 7.4 Input Pull-Up Transistor States (Port 2) .............................................................. Table 7.5 Port 3 Registers.................................................................................................... Table 7.6 Port 4 Registers.................................................................................................... Table 7.7 Input Pull-Up Transistor States (Port 4) .............................................................. Table 7.8 Port 5 Registers.................................................................................................... Table 7.9 Input Pull-Up Transistor States (Port 5) .............................................................. Table 7.10 Port 6 Registers.................................................................................................... Table 7.11 Port 6 Pin Functions in Modes 1 to 5................................................................... Table 7.12 Port 7 Data Register............................................................................................. Table 7.13 Port 8 Registers.................................................................................................... Table 7.14 Port 8 Pin Functions in Modes 1 to 5................................................................... Table 7.15 Port 8 Pin Functions in Modes 6 and 7 ................................................................ Table 7.16 Port 9 Registers.................................................................................................... Table 7.17 Port 9 Pin Functions............................................................................................. Table 7.18 Port A Registers................................................................................................... Table 7.19 Port A Pin Functions (Modes 1, 2, 6, and 7)........................................................ Table 7.20 Port A Pin Functions (Modes 3 to 5) ................................................................... Table 7.21 Port A Pin Functions (Modes 1 to 7) ................................................................... Table 7.22 Port B Registers ................................................................................................... Table 7.23 Port B Pin Functions (Modes 1 to 5) ................................................................... Table 7.24 Port B Pin Functions (Modes 6 and 7)................................................................. 151 156 159 161 162 165 167 168 170 172 174 176 177 180 181 183 185 189 191 193 196 201 203 205 Section 8 16-Bit Timer Table 8.1 16-bit timer Functions.......................................................................................... Table 8.2 16-bit timer Pins .................................................................................................. Table 8.3 16-bit timer Registers .......................................................................................... Table 8.4 PWM Output Pins and Registers ......................................................................... Table 8.5 Up/Down Counting Conditions ........................................................................... Table 8.6 16-bit timer Interrupt Sources.............................................................................. Table 8.7 (a) 16-bit timer Operating Modes (Channel 0).......................................................... 208 212 213 249 253 258 268 Rev. 2.00 Sep 20, 2005 page xxxiv of xxxviii Table 8.7 (b) 16-bit timer Operating Modes (Channel 1).......................................................... 269 Table 8.7 (c) 16-bit timer Operating Modes (Channel 2).......................................................... 270 Section 9 8-Bit Timers Table 9.1 8-Bit Timer Pins .................................................................................................. Table 9.2 8-Bit Timer Registers .......................................................................................... Table 9.3 Operation of Channels 0 and 1 when Bit ICE is Set to 1 in 8TCSR1 Register.... Table 9.4 Operation of Channels 2 and 3 when Bit ICE is Set to 1 in 8TCSR3 Register.... Table 9.5 Types of 8-Bit Timer Interrupt Sources and Priority Order................................. Table 9.6 8-Bit Timer Interrupt Sources.............................................................................. Table 9.7 Timer Output Priority Order ................................................................................ Table 9.8 Internal Clock Switchover and 8TCNT Operation .............................................. 274 275 285 285 298 298 307 308 Section 10 Programmable Timing Pattern Controller (TPC) Table 10.1 TPC Pins .............................................................................................................. 313 Table 10.2 TPC Registers ...................................................................................................... 314 Table 10.3 TPC Operating Conditions .................................................................................. 328 Section 11 Watchdog Timer Table 11.1 WDT Pin.............................................................................................................. 338 Table 11.2 WDT Registers .................................................................................................... 339 Table 11.3 Read Addresses of TCNT, TCSR, and RSTCSR................................................. 345 Section 12 Serial Communication Interface Table 12.1 SCI Pins ............................................................................................................... Table 12.2 SCI Registers ....................................................................................................... Table 12.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode...................... Table 12.4 Examples of Bit Rates and BRR Settings in Synchronous Mode ........................ Table 12.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode)................. Table 12.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode).............. Table 12.7 Maximum Bit Rates with External Clock Input (Synchronous Mode) ................ Table 12.8 SMR Settings and Serial Communication Formats ............................................. Table 12.9 SMR and SCR Settings and SCI Clock Source Selection.................................... Table 12.10 Serial Communication Formats (Asynchronous Mode) ...................................... Table 12.11 Receive Error Conditions .................................................................................... Table 12.12 SCI Interrupt Sources .......................................................................................... Table 12.13 SSR Status Flags and Transfer of Receive Data .................................................. 354 355 373 376 378 379 380 382 382 384 391 408 409 Section 13 Smart Card Interface Table 13.1 Smart Card Interface Pins .................................................................................... 417 Table 13.2 Smart Card Interface Registers ............................................................................ 417 Rev. 2.00 Sep 20, 2005 page xxxv of xxxviii Table 13.3 Table 13.4 Table 13.5 Table 13.6 Table 13.7 Table 13.8 Smart Card Interface Register Settings................................................................ n-Values of CKS1 and CKS0 Settings................................................................. Bit Rates (bits/s) for Various BRR Settings (When n = 0) .................................. BRR Settings for Typical Bit Rates (bits/s) (When n = 0)................................... Maximum Bit Rates for Various Frequencies (Smart Card Interface Mode) ...... Smart Card Interface Mode Operating States and Interrupt Sources ................... 426 428 428 429 429 436 Section 14 A/D Converter Table 14.1 A/D Converter Pins.............................................................................................. Table 14.2 A/D Converter Registers...................................................................................... Table 14.3 Analog Input Channels and A/D Data Registers (ADDRA to ADDRD)............. Table 14.4 A/D Conversion Time (Single Mode).................................................................. Table 14.5 Analog Input Pin Ratings..................................................................................... 443 444 445 456 458 Section 15 D/A Converter Table 15.1 D/A Converter Pins.............................................................................................. 465 Table 15.2 D/A Converter Registers...................................................................................... 465 Section 16 RAM Table 16.1 H8/3024 Group On-Chip RAM Specifications.................................................... 471 Table 16.2 System Control Register ...................................................................................... 472 Section 17 Flash Memory [H8/3026F-ZTAT Version] Table 17.1 Operating Modes and ROM................................................................................. Table 17.2 Flash Memory Pins .............................................................................................. Table 17.3 Flash Memory Registers ...................................................................................... Table 17.4 Flash Memory Erase Blocks ................................................................................ Table 17.5 Flash Memory Area Divisions ............................................................................. Table 17.6 On-Board Programming Mode Settings .............................................................. Table 17.7 System Clock Frequencies for which Automatic Adjustment of H8/3026F-ZTAT Version Bit Rate is Possible................................................ Table 17.8 Hardware Protection ............................................................................................ Table 17.9 Software Protection ............................................................................................. Table 17.10 H8/3026F-ZTAT Version Socket Adapter Product Codes .................................. 496 511 512 519 Section 18 Flash Memory [H8/3024F-ZTAT Version] Table 18.1 Operating Modes and ROM................................................................................. Table 18.2 Flash Memory Pins .............................................................................................. Table 18.3 Flash Memory Registers ...................................................................................... Table 18.4 Flash Memory Erase Blocks ................................................................................ Table 18.5 RAM Area Setting ............................................................................................... 529 532 532 539 540 Rev. 2.00 Sep 20, 2005 page xxxvi of xxxviii 475 478 478 485 486 493 Table 18.6 Table 18.7 On-Board Programming Mode Settings .............................................................. System Clock Frequencies for which Automatic Adjustment of H8/3024F-ZTAT Version Bit Rate is Possible................................................ Hardware Protection ............................................................................................ Software Protection ............................................................................................. H8/3024F-ZTAT Version Socket Adapter Product Codes .................................. 550 565 566 572 Section 19 Clock Pulse Generator Table 19.1 (1) Damping Resistance Value.................................................................................. Table 19.1 (2) External Capacitance Values ............................................................................... Table 19.2 Crystal Resonator Parameters.............................................................................. Table 19.3 (1) Clock Timing for On-Chip Flash Memory Versions ........................................... Table 19.3 (2) Clock Timing for On-Chip Mask ROM Versions ............................................... Table 19.4 Frequency Division Register ............................................................................... 583 583 584 586 586 588 Section 20 Power-Down State Table 20.1 Power-Down State and Module Standby Function.............................................. Table 20.2 Control Register................................................................................................... Table 20.3 Clock Frequency and Waiting Time for Clock to Settle...................................... Table 20.4 φ Pin State in Various Operating States............................................................... 592 593 600 605 Section 21 Electrical Characteristics Table 21.1 Absolute Maximum Ratings ................................................................................ Table 21.2 DC Characteristics ............................................................................................... Table 21.3 Permissible Output Currents................................................................................ Table 21.4 Clock Timing ....................................................................................................... Table 21.5 Control Signal Timing ......................................................................................... Table 21.6 Bus Timing .......................................................................................................... Table 21.7 Timing of On-Chip Supporting Modules............................................................. Table 21.8 A/D Conversion Characteristics .......................................................................... Table 21.9 D/A Conversion Characteristics .......................................................................... Table 21.10 Absolute Maximum Ratings ................................................................................ Table 21.11 DC Characteristics ............................................................................................... Table 21.12 Permissible Output Currents................................................................................ Table 21.13 Clock Timing ....................................................................................................... Table 21.14 Control Signal Timing ......................................................................................... Table 21.15 Bus Timing .......................................................................................................... Table 21.16 Timing of On-Chip Supporting Modules............................................................. Table 21.17 A/D Conversion Characteristics .......................................................................... Table 21.18 D/A Conversion Characteristics .......................................................................... Table 21.19 Flash Memory Characteristics ............................................................................. 607 608 610 612 612 613 614 616 617 618 619 621 623 623 624 625 627 628 629 Table 18.8 Table 18.9 Table 18.10 547 Rev. 2.00 Sep 20, 2005 page xxxvii of xxxviii Appendix A Table A.1 Table A.2 Table A.2 Table A.2 Table A.3 Table A.4 Instruction Set Instruction Set...................................................................................................... Operation Code Map (1)...................................................................................... Operation Code Map (2)...................................................................................... Operation Code Map (3)...................................................................................... Number of States per Cycle ................................................................................. Number of Cycles per Instruction........................................................................ 641 654 655 656 658 659 Appendix B Internal I/O Registers Table B.1 Comparison of H8/3024 Group Internal I/O Register Specifications .................. 667 Appendix D Pin States Table D.1 Port States ............................................................................................................ 784 Appendix F Product Code Lineup Table F.1 H8/3024 Group .................................................................................................... 793 Appendix H Comparison of H8/300H Series Product Specifications Table H.1 Pin Arrangement of Each Product (FP-100B, TFP-100B)................................... 797 Rev. 2.00 Sep 20, 2005 page xxxviii of xxxviii Section 1 Overview Section 1 Overview 1.1 Overview The H8/3024 Group is a series of microcontrollers (MCUs) that integrate system supporting functions together with an H8/300H CPU core having an original Renesas Technology architecture. The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address space. Its instruction set is upward-compatible at the object-code level with the H8/300 CPU, enabling easy porting of software from the H8/300 Series. The on-chip system supporting functions include ROM, RAM, a 16-bit timer, an 8-bit timer, a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), an A/D converter, a D/A converter, I/O ports, and other facilities. The four members of the H8/3024 Group are the H8/3024F-ZTAT, H8/3026F-ZTAT, H8/3024 (mask ROM version), and H8/3026 (mask ROM version). Seven MCU operating modes offer a choice of bus width and address space size. The modes (modes 1 to 7) include two single-chip modes and five expanded modes. In addition to its mask ROM versions, the H8/3024 Group has F-ZTAT™* versions with on-chip flash memory that allows programs to be freely rewritten by the user. This version enables users to respond quickly and flexibly to changing application specifications, growing production volumes, and other conditions. Table 1.1 summarizes the features of the H8/3024 Group. Note: * F-ZTATTM (Flexible ZTAT) is a trademark of Renesas Technology Corp. Rev. 2.00 Sep 20, 2005 page 1 of 800 REJ09B0260-0200 Section 1 Overview Table 1.1 Features Feature Description CPU Upward-compatible with the H8/300 CPU at the object-code level General-register machine • Sixteen 16-bit general registers (also usable as sixteen 8-bit registers plus eight 16-bit registers, or as eight 32-bit registers) High-speed operation H8/3024F-ZTAT Maximum clock rate Add/ subtract Multiply/ divide 25 MHz 80 ns 560 ns H8/3026F-ZTAT H8/3024 (mask ROM version) H8/3026 (mask ROM version) 16-Mbyte address space Instruction features • 8/16/32-bit data transfer, arithmetic, and logic instructions • Signed and unsigned multiply instructions (8 bits × 8 bits, 16 bits × 16 bits) • Signed and unsigned divide instructions (16 bits ÷ 8 bits, 32 bits ÷ 16 bits) • Bit accumulator function Bit manipulation instructions with register-indirect specification of bit positions Memory H8/3024F-ZTAT ROM RAM 128 kbytes 4 kbytes 256 kbytes 8 kbytes H8/3024 (mask ROM version) H8/3026F-ZTAT H8/3026 (mask ROM version) Interrupt controller • Seven external interrupt pins: NMI, IRQ0 to IRQ5 • 27 internal interrupts • Three selectable interrupt priority levels Rev. 2.00 Sep 20, 2005 page 2 of 800 REJ09B0260-0200 Section 1 Overview Feature Description Bus controller • Address space can be partitioned into eight areas, with independent bus specifications in each area • Chip select output available for areas 0 to 7 • 8-bit access or 16-bit access selectable for each area • Two-state or three-state access selectable for each area • Selection of two wait modes • Number of program wait states selectable for each area • Bus arbitration function • Two address update modes • Three 16-bit timer channels, capable of processing up to six pulse outputs or six pulse inputs • 16-bit timer counter (channels 0 to 2) • Two multiplexed output compare/input capture pins (channels 0 to 2) • Operation can be synchronized (channels 0 to 2) • PWM mode available (channels 0 to 2) • Phase counting mode available (channel 2) • 8-bit up-counter (external event count capability) • Two time constant registers • Two channels can be connected • Maximum 16-bit pulse output, using 16-bit timer as time base • Up to four 4-bit pulse output groups (or one 16-bit group, or two 8-bit groups) • Non-overlap mode available Watchdog timer (WDT), 1 channel • Internal reset signal can be generated by overflow • Reset signal can be output externally (not available in on-chip flash memory versions) • Usable as an interval timer Serial communication interface (SCI), 2 channels • Selection of asynchronous or synchronous mode • Full duplex: can transmit and receive simultaneously • On-chip baud-rate generator • Smart card interface functions added 16-bit timer, 3 channels 8-bit timer, 4 channels Programmable timing pattern controller (TPC) Rev. 2.00 Sep 20, 2005 page 3 of 800 REJ09B0260-0200 Section 1 Overview Feature A/D converter D/A converter I/O ports Operating modes Description • Resolution: 10 bits • Eight channels, with selection of single or scan mode • Variable analog conversion voltage range • Sample-and-hold function • A/D conversion can be started by an external trigger or 8-bit timer comparematch • Resolution: 8 bits • Two channels • D/A outputs can be sustained in software standby mode • 70 input/output pins • 9 input-only pins Seven MCU operating modes Mode Power-down state Other features Address Space Address Pins Initial Bus Width Max. Bus Width Mode 1 1 Mbyte A19 to A0 8 bits 16 bits Mode 2 1 Mbyte A19 to A0 16 bits 16 bits Mode 3 16 Mbytes A23 to A0 8 bits 16 bits Mode 4 16 Mbytes A23 to A0 16 bits 16 bits Mode 5 16 Mbytes A23 to A0 8 bits 16 bits Mode 6 64 kbytes — — — Mode 7 1 Mbyte — — — • On-chip ROM is disabled in modes 1 to 4 • In the versions with on-chip flash memory, an on-board programming mode is supported that allows flash memory to be programmed in modes 5 and 7. • Sleep mode • Software standby mode • Hardware standby mode • Module standby function • Programmable system clock frequency division • On-chip clock pulse generator Rev. 2.00 Sep 20, 2005 page 4 of 800 REJ09B0260-0200 Section 1 Overview Feature Description Product lineup Product Type H8/3024F-ZTAT H8/3026F-ZTAT H8/3024 mask ROM version H8/3026 mask ROM version Model 3.3 V operation 3.3 V operation 3.3 V operation 3.3 V operation Package (Package Code) HD64F3024F 100-pin QFP (FP-100B) HD64F3024TE 100-pin TQFP (TFP-100B) HD64F3024FP 100-pin QFP (FP-100A) HD64F3026F 100-pin QFP (FP-100B) HD64F3026TE 100-pin TQFP (TFP-100B) HD64F3026FP 100-pin QFP (FP-100A) HD6433024F 100-pin QFP (FP-100B) HD6433024TE 100-pin TQFP (TFP-100B) HD6433024FP 100-pin QFP (FP-100A) HD6433026F 100-pin QFP (FP-100B) HD6433026TE 100-pin TQFP (TFP-100B) HD6433026FP 100-pin QFP (FP-100A) Rev. 2.00 Sep 20, 2005 page 5 of 800 REJ09B0260-0200 Section 1 Overview 1.2 Block Diagram Port 3 P40 /D0 P41 /D1 P42 /D2 P43 /D3 P44 /D4 P45 /D5 P46 /D6 P47 /D7 P30 /D8 P31 /D9 P32 /D10 P33 /D11 P34 /D12 P35 /D13 P36 /D14 P37 /D15 VSS VSS VSS VSS VSS VSS VCC VCC VCC Figure 1.1 shows an internal block diagram. Port 4 Address bus Data bus (upper) MD 1 Data bus (lower) P53 /A 19 Port 5 MD 2 MD 0 P52 /A 18 P51 /A 17 P50 /A 16 EXTAL P27 /A 15 Clock pulse generator RES RESO/FWE* P26 /A 14 H8/300H CPU P25 /A 13 Port 2 XTAL STBY NMI LWR/P66 RD/P64 AS/P63 Port 6 HWR/P65 ROM (mask ROM or flash memory) P21 /A 9 P20 /A 8 P17 /A 7 P16 /A 6 P15 /A 5 Port 1 BACK/P62 P23 /A 11 P22 /A 10 Bus controller Interrupt controller φ/P67 P24 /A 12 BREQ/P61 WAIT/P60 P14 /A 4 P13 /A 3 P12 /A 2 RAM P11 /A 1 CS0/P84 CS2/IRQ2/P82 CS3/IRQ1/P81 Port 8 ADTRG/CS1/IRQ3/P83 P10 /A 0 Watchdog timer (WDT) 16-bit timer unit IRQ0/P80 Serial communication interface (SCI) × 2 channels 8-bit timer unit P95 /SCK 1 /IRQ 5 Programmable timing pattern controller (TPC) P94 /SCK 0 /IRQ 4 Port 9 A/D converter D/A converter P93 /RxD1 P92 /RxD0 P91 /TxD 1 P90 /TxD 0 AN0/P70 AN1/P71 AN2/P72 AN3/P73 AN4/P74 AN5/P75 DA0/AN6/P76 DA1/AN7/P77 AVSS AVCC VREF TCLKA/TP0/PA0 TCLKB/TP1/PA1 Port 7 TCLKC/TIOCA0/TP2/PA2 TCLKD/TIOCB0/TP3/PA3 A23/TIOCA1/TP4/PA4 A22/TIOCB1/TP5/PA5 A21/TIOCA2/TP6/PA6 A20/TIOCB2/TP7/PA7 CS7/TMO0/TP8/PB0 CS6/TMIO1/TP9/PB1 Port A CS5/TMO2/TP10/PB2 CS4/TMIO3/TP11/PB3 TP12/PB4 TP13/PB5 TP15/PB7 TP14/PB6 Port B Note: * Functions as RESO in the mask ROM versions, and as FWE in the on-chip flash memory versions. Figure 1.1 Block Diagram Rev. 2.00 Sep 20, 2005 page 6 of 800 REJ09B0260-0200 Section 1 Overview 1.3 Pin Description 1.3.1 Pin Arrangement The pin arrangement of the H8/3024 Group is shown in figures 1.2 to 1.5. Differences in the H8/3024 Group pin arrangements are shown in table 1.2. Except for the differences shown in table 1.2, the pin arrangements are the same. Table 1.2 Comparison of H8/3024 Group Pin Arrangements Pin Number H8/3024F-ZTAT H8/3026F-ZTAT H8/3024 Mask ROM Version H8/3026 Mask ROM Version FP-100B (TFP-100B) 10 FWE FWE RESO RESO FP-100A 12 FWE FWE RESO RESO Package Rev. 2.00 Sep 20, 2005 page 7 of 800 REJ09B0260-0200 MD2 MD1 MD0 P66 /LWR P65 /HWR P64 /RD P63 /AS VCC XTAL EXTAL VSS NMI RES STBY P67/φ P62 /BACK P61 /BREQ P60 /WAIT VSS P53 /A 19 P52 /A 18 P51 /A 17 P50 /A 16 P27 /A 15 P26 /A 14 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 Section 1 Overview AV CC 76 50 P25/A13 VREF 77 49 P24/A12 P70 /AN0 78 48 P23/A11 P71 /AN1 79 47 P22/A10 P72 /AN2 80 46 P21/A9 P73 /AN3 81 45 P20/A8 P74 /AN4 82 44 VSS P75 /AN5 83 43 P17/A7 P76 /AN6 /DA 0 84 42 P16/A6 P77 /AN7 /DA 1 85 41 P15/A5 AV SS IRQ0 /P80 86 40 P14/A4 39 P13/A3 CS 3 /IRQ1/P81 88 38 P12/A2 CS2/IRQ2/P82 89 37 P11/A1 ADTRG/CS1/IRQ3/P83 90 36 P10/A0 CS0/P84 91 35 VCC 87 Top view (FP-100B, TFP-100B) VSS 92 34 TCLKA/TP0/PA0 93 33 D15/P37 D14/P36 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VSS TxD0 /P90 TxD1 /P91 RxD0 /P92 RxD1 /P93 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P40 D1 /P41 D2 /P42 D3 /P43 VSS D4 /P44 D5 /P45 D6 /P46 D7/P47 10 26 9 100 TP15/PB7 RESO/FWE* A20/TIOCB2/TP7/PA7 8 D8/P30 TP14/PB6 D9/P31 27 7 28 99 TP13/PB5 98 A21/TIOCA2/TP6/PA6 6 A22/TIOCB1/TP5/PA5 TP12/PB4 D11/P33 D10/P32 5 29 CS4 /TMIO 3/TP11/PB3 97 4 A23/TIOCA1/TP4/PA4 CS5 /TMO2/TP10/PB2 30 3 96 CS6 /TMIO 1/TP9/PB1 D12/P34 TCLKD/TIOCB0/TP3/PA3 2 D13/P35 31 1 32 95 VCC 94 CS7/TMO0/TP8/PB0 TCLKB/TP1/PA1 TCLKC/TIOCA0/TP2/PA2 Note: * Functions as the RES0 pin in the mask ROM version, and as the FWE pin in the F-ZTAT version. Figure 1.2 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT, H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version (FP-100B or TFP-100B Package, Top View) Rev. 2.00 Sep 20, 2005 page 8 of 800 REJ09B0260-0200 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P70/AN0 VREF AVCC MD2 MD1 MD0 P66/LWR P65/HWR P64/RD P63/AS VCC XTAL EXTAL VSS NMI RES STBY P67/φ P62/BACK P61/BREQ P60/WAIT VSS P53/A19 P52/A18 P51/A17 P50/A16 P27/A15 P26/A14 P25/A13 P24/A12 Section 1 Overview 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 Top view (FP-100A) 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 P23/A11 P22/A10 P21/A9 P20/A8 VSS P17/A7 P16/A6 P15/A5 P14/A4 P13/A3 P12/A2 P11/A1 P10/A0 V CC D15 /P3 7 D14 /P3 6 D13 /P3 5 D12 /P3 4 D11 /P3 3 D10 /P32 A21/TIOCA2 /TP6 /PA6 A20/TIOCB2 /TP7 /PA7 VCC CS7 /TMO0 /TP8 /PB0 CS 6 /TMIO1 /TP9 /PB1 CS 5 /TMO 2 /TP10 /PB2 CS 4 /TMIO 3 /TP11/PB3 TP12 /PB4 TP13 /PB5 TP14 /PB6 TP15 /PB 7 RESO/FWE* VSS TxD0 /P90 TxD1 /P91 RxD0 /P9 2 RxD1 /P9 3 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P4 0 D1 /P41 D2 /P42 D3 /P43 V SS D4 /P44 D5 /P4 5 D6 /P4 6 D7 /P4 7 D8 /P3 0 D9 /P3 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS P80/IRQ0 P81/IRQ1/CS3 P82/IRQ2/CS2 P83/IRQ3/CS1/ADTRG P84/CS0 VSS PA0/TP0/TCLKA PA1/TP1/TCLKB PA2/TP2/TIOCA0/TCLKC PA3/TP3/TIOCB0/TCLKD PA4/TP4/TIOCA1/A23 PA5/TP5/TIOCB1/A22 Note: * Functions as the RES0 pin in the mask ROM version, and as the FWE pin in the F-ZTAT version. Figure 1.3 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT, H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version (FP-100A Package, Top View) Rev. 2.00 Sep 20, 2005 page 9 of 800 REJ09B0260-0200 Section 1 Overview 1.3.2 Pin Functions Table 1.3 summarizes the pin functions. Table 1.3 Pin Functions Pin No. FP-100B TFP-100B FP-100A I/O Type Symbol Power VCC 1, 35, 68 3, 37, 70 Input Power: For connection to the power supply. Connect all VCC pins to the system power supply. VSS 11, 22, 44, 57, 65, 92 13, 24, 46, 59, 67, 94 Input Ground: For connection to ground (0 V). Connect all VSS pins to the 0-V system power supply. XTAL 67 69 Input For connection to a crystal resonator. For examples of crystal resonator and external clock input, see section 19, Clock Pulse Generator. EXTAL 66 68 Input For connection to a crystal resonator or input of an external clock signal. For examples of crystal resonator and external clock input, see section 19, Clock Pulse Generator. φ 61 63 Output System clock: Supplies the system clock to external devices. 75 to 73 77 to 75 Input Clock Operating MD2 to mode MD0 control Name and Function Mode 2 to mode 0: For setting the operating mode, as follows. Inputs at these pins must not be changed during operation. MD2 0 0 0 0 1 1 1 1 Rev. 2.00 Sep 20, 2005 page 10 of 800 REJ09B0260-0200 MD1 0 0 1 1 0 0 1 1 MD0 0 1 0 1 0 1 0 1 Operating Mode Setting prohibited Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Section 1 Overview Pin No. Type Symbol FP-100B TFP-100B FP-100A I/O System control RES 63 65 Input RESO 10 12 Output Reset output (On-chip mask ROM versions): Outputs the reset signal generated by the watchdog timer to external devices FWE 10 12 Input Write enable signal (On-chip flash memory versions): Flash memory programming control signal STBY 62 64 Input Standby: When driven low, this pin forces a transition to hardware standby mode BREQ 59 61 Input Bus request: Used by an external bus master to request the bus right BACK 60 62 Output Bus request acknowledge: Indicates that the bus has been granted to an external bus master 64 66 Input 17, 16, 90 to 87 19, 18, Input 92 to 89 Interrupts NMI IRQ5 to IRQ0 Name and Function Reset input: When driven low, this pin resets the chip. This pin must be driven low at power-up. Nonmaskable interrupt: Requests a nonmaskable interrupt Interrupt request 5 to 0: Maskable interrupt request pins Address bus A23 to A0 97 to 100, 99, 100, Output Address bus: Outputs address signals 56 to 45, 1, 2, 43 to 36 58 to 47, 45 to 38 Data bus D15 to D0 34 to 23, 21 to 18 36 to 25, Input/ Data bus: Bidirectional data bus 23 to 20 output Bus control CS7 CS0 2 to 5, 88 to 91 4 to 7, 90 Output Chip select: Select signals for areas 7 to 0 to 93 AS 69 71 Output Address strobe: Goes low to indicate valid address output on the address bus RD 70 72 Output Read: Goes low to indicate reading from the external address space HWR 71 73 Output High write: Goes low to indicate writing to the external address space; indicates valid data on the upper data bus (D15 to D8). LWR 72 74 Output Low write: Goes low to indicate writing to the external address space; indicates valid data on the lower data bus (D7 to D0). to Rev. 2.00 Sep 20, 2005 page 11 of 800 REJ09B0260-0200 Section 1 Overview Pin No. Type Symbol FP-100B TFP-100B FP-100A I/O Bus control WAIT 58 16-bit timer TCLKD to 96 to 93 TCLKA 60 Input 98 to 95 Input Name and Function Wait: Requests insertion of wait states in bus cycles during access to the external address space Clock input D to A: External clock inputs TIOCA2 to 99, 97, 95 1, 99, 97 Input/ Input capture/output compare A2 to A0: TIOCA0 output GRA2 to GRA0 output compare or input capture, or PWM output TIOCB2 to 100, 98, TIOCB0 96 2, 100, 98 Input/ Input capture/output compare B2 to B0: output GRB2 to GRB0 output compare or input capture 8-bit timer TMO0, TMO2 2, 4 4, 6 Output Compare match output: Compare match output pins TMIO1, TMIO3 3, 5 5, 7 Input/ Input capture input/compare match output output: Input capture input or compare match output pins TCLKD to 96 to 93 TCLKA 98 to 95 Input Counter external clock input: These pins input an external clock to the counters. Programmable timing pattern controller (TPC) TP15 to TP0 9 to 2, 11 to 4, 100 to 93 2, 1, 100 to 95 Output TPC output 15 to 0: Pulse output Serial communication interface (SCI) TxD1, TxD0 13, 12 15, 14 Output Transmit data (channels 0, 1): SCI data output RxD1, RxD0 15, 14 17, 16 Input SCK1, SCK0 17, 16 19, 18 Input/ Serial clock (channels 0, 1): SCI clock output input/output AN7 to AN0 85 to 78 87 to 80 Input Analog 7 to 0: Analog input pins ADTRG 90 92 A/D conversion external trigger input: External trigger input for starting A/D conversion A/D converter Rev. 2.00 Sep 20, 2005 page 12 of 800 REJ09B0260-0200 Input Receive data (channels 0, 1): SCI data input Section 1 Overview Pin No. FP-100B TFP-100B FP-100A I/O Type Symbol D/A converter DA1, DA0 85, 84 87, 86 Output Analog output: Analog output from the D/A converter Analog power supply AVCC 76 78 Input Power supply pin for the A/D and D/A converters. Connect to the system power supply when not using the A/D and D/A converters. Analog power supply AVSS 86 88 Input Ground pin for the A/D and D/A converters. Connect to system ground (0 V). VREF 77 79 Input Reference voltage input pin for the A/D and D/A converters. Connect to the system power supply when not using the A/D and D/A converters. I/O ports Name and Function P17 to P10 43 to 36 45 to 38 Input/ Port 1: Eight input/output pins. The direction output of each pin can be selected in the port 1 data direction register (P1DDR). P27 to P20 52 to 45 54 to 47 Input/ Port 2: Eight input/output pins. The direction output of each pin can be selected in the port 2 data direction register (P2DDR). P37 to P30 34 to 27 36 to 29 Input/ Port 3: Eight input/output pins. The direction output of each pin can be selected in the port 3 data direction register (P3DDR). P47 to P40 26 to 23, 21 to 18 28 to 25, Input/ Port 4: Eight input/output pins. The direction 23 to 20 output of each pin can be selected in the port 4 data direction register (P4DDR). P53 to P50 56 to 53 58 to 55 Input/ Port 5: Four input/output pins. The direction output of each pin can be selected in the port 5 data direction register (P5DDR). P67 to P60 61, 72 to 69, 60 to 58 63, Input/ Port 6: Eight input/output pins. The direction 74 to 71, output of each pin can be selected in the port 6 data 62 to 60 direction register (P6DDR). P77 to P70 85 to 78 87 to 80 Input P84 to P80 91 to 87 93 to 89 Input/ Port 8: Five input/output pins. The direction of output each pin can be selected in the port 8 data direction register (P8DDR). P95 to P90 17 to 12 19 to 14 Input/ Port 9: Six input/output pins. The direction of output each pin can be selected in the port 9 data direction register (P9DDR). Port 7: Eight input pins Rev. 2.00 Sep 20, 2005 page 13 of 800 REJ09B0260-0200 Section 1 Overview Pin No. FP-100B TFP-100B FP-100A I/O Type Symbol I/O ports PA7 to PA0 100 to 93 2, 1, Input/ Port A: Eight input/output pins. The direction 100 to 95 output of each pin can be selected in the port A data direction register (PADDR). PB7 to PB0 9 to 2 11 to 4 Rev. 2.00 Sep 20, 2005 page 14 of 800 REJ09B0260-0200 Name and Function Input/ Port B: Eight input/output pins. The direction output of each pin can be selected in the port B data direction register (PBDDR). Section 1 Overview 1.3.3 Pin Assignments in Each Mode Table 1.4 lists the pin assignments in each mode. Table 1.4 Pin Assignments in Each Mode (FP-100B or TFP-100B, FP-100A) Pin No. Pin Name FP-100B TFP-100B FP-100A Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 1 3 vCC vCC vCC vCC vCC vCC vCC 2 4 PB0/TP8/ TMO0/CS7 PB0/TP8/ TMO0/CS7 PB0/TP8/ TMO0/CS7 PB0/TP8/ TMO0/CS7 PB0/TP8/ TMO0/CS7 PB0/TP8/ TMO0 PB0/TP8/ TMO0 3 5 PB1/TP9/ PB1/TP9/ PB1/TP9/ PB1/TP9/ PB1/TP9/ PB1/TP9/ TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1 PB1/TP9/ TMIO1 4 6 PB2/TP10/ TMO2/CS5 PB2/TP10/ TMO2 PB2/TP10/ TMO2 5 7 PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3 PB3/TP11/ TMIO3 6 8 PB4/TP12 PB4/TP12 PB4/TP12 PB4/TP12 PB4/TP12 PB4/TP12 PB4/TP12 7 9 PB5/TP13 PB5/TP13 PB5/TP13 PB5/TP13 PB5/TP13 PB5/TP13 PB5/TP13 8 10 PB6/TP14 PB6/TP14 PB6/TP14 PB6/TP14 PB6/TP14 PB6/TP14 PB6/TP14 9 11 PB7/TP15 PB7/TP15 PB7/TP15 PB7/TP15 PB7/TP15 PB7/TP15 PB7/TP15 10 12 RESO/ FWE*3 RESO/ FWE*3 RESO/ RESO/ RESO/ RESO/ RESO/ PB2/TP10/ TMO2/CS5 PB2/TP10/ TMO2/CS5 FWE*3 PB2/TP10/ TMO2/CS5 FWE*3 PB2/TP10/ TMO2/CS5 FWE*3 FWE*3 FWE*3 11 13 VSS VSS VSS VSS VSS VSS VSS 12 14 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 13 15 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 14 16 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 15 17 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 16 18 17 19 P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 20 P40/D0 *1 P40/D0 *2 P40/D0 *1 P40/D0 *2 P40/D0 *1 P40 P40 19 21 1 P41/D1 * 2 P41/D1 * 1 P41/D1 * 2 P41/D1 * 1 P41/D1 * P41 P41 20 22 P42/D2 *1 P42/D2 *2 P42/D2 *1 P42/D2 *2 P42/D2 *1 P42 P42 21 23 P43/D3 *1 P43/D3 *2 P43/D3 *1 P43/D3 *2 P43/D3 *1 P43 P43 22 24 VSS VSS VSS VSS VSS VSS VSS 25 P44/D4 *1 P44/D4 *2 P44/D4 *1 P44/D4 *2 P44/D4 *1 P44 P44 18 23 Rev. 2.00 Sep 20, 2005 page 15 of 800 REJ09B0260-0200 Section 1 Overview Pin No. FP-100B TFP-100B Pin Name FP-100A Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 24 26 1 P45/D5 * 2 P45/D5 * 1 P45/D5 * 2 P45/D5 * 1 P45/D5 * P45 P45 25 27 P46/D6 *1 P46/D6 *2 P46/D6 *1 P46/D6 *2 P46/D6 *1 P46 P46 26 28 P47/D7 *1 P47/D7 *2 P47/D7 *1 P47/D7 *2 P47/D7 *1 P47 P47 27 29 D8 D8 D8 D8 D8 P30 P30 28 30 D9 D9 D9 D9 D9 P31 P31 29 31 D10 D10 D10 D10 D10 P32 P32 30 32 D11 D11 D11 D11 D11 P33 P33 31 33 D12 D12 D12 D12 D12 P34 P34 32 34 D13 D13 D13 D13 D13 P35 P35 33 35 D14 D14 D14 D14 D14 P36 P36 34 36 D15 D15 D15 D15 D15 P37 P37 35 37 VCC VCC VCC VCC VCC VCC VCC 36 38 A0 A0 A0 A0 P10/A0 P10 P10 37 39 A1 A1 A1 A1 P11/A1 P11 P11 38 40 A2 A2 A2 A2 P12/A2 P12 P12 39 41 A3 A3 A3 A3 P13/A3 P13 P13 40 42 A4 A4 A4 A4 P14/A4 P14 P14 41 43 A5 A5 A5 A5 P15/A5 P15 P15 42 44 A6 A6 A6 A6 P16/A6 P16 P16 43 45 A7 A7 A7 A7 P17/A7 P17 P17 44 46 VSS VSS VSS VSS VSS VSS VSS 45 47 A8 A8 A8 A8 P20/A8 P20 P20 46 48 A9 A9 A9 A9 P21/A9 P21 P21 47 49 A10 A10 A10 A10 P22/A10 P22 P22 48 50 A11 A11 A11 A11 P23/A11 P23 P23 49 51 A12 A12 A12 A12 P24/A12 P24 P24 50 52 A13 A13 A13 A13 P25/A13 P25 P25 51 53 A14 A14 A14 A14 P26/A14 P26 P26 52 54 A15 A15 A15 A15 P27/A15 P27 P27 53 55 A16 A16 A16 A16 P50/A16 P50 P50 54 56 A17 A17 A17 A17 P51/A17 P51 P51 55 57 A18 A18 A18 A18 P52/A18 P52 P52 56 58 A19 A19 A19 A19 P53/A19 P53 P53 Rev. 2.00 Sep 20, 2005 page 16 of 800 REJ09B0260-0200 Section 1 Overview Pin No. Pin Name FP-100B TFP-100B FP-100A Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 57 59 VSS VSS VSS VSS VSS VSS VSS 58 60 P60/WAIT P60/WAIT P60/WAIT P60/WAIT P60/WAIT P60 P60 59 61 P61/BREQ P61/BREQ P61/BREQ P61/BREQ P61/BREQ P61 P61 60 62 P62/BACK P62/BACK P62/BACK P62/BACK P62/BACK P62 P62 61 63 φ φ φ φ P67/φ P67/φ P67/φ 62 64 63 65 STBY RES STBY RES STBY RES STBY RES STBY RES STBY RES STBY RES 64 66 NMI NMI NMI NMI NMI NMI NMI 65 67 VSS VSS VSS VSS VSS VSS VSS 66 68 EXTAL EXTAL EXTAL EXTAL EXTAL EXTAL EXTAL 67 69 XTAL XTAL XTAL XTAL XTAL XTAL XTAL 68 70 VCC VCC 69 71 P63 P63 70 72 P64 P64 71 73 P65 P65 72 P66 P66 VCC VCC VCC VCC VCC 74 AS RD HWR LWR AS RD HWR LWR AS RD HWR LWR AS RD HWR LWR AS RD HWR LWR 73 75 MD0 MD0 MD0 MD0 MD0 MD0 MD0 74 76 MD1 MD1 MD1 MD1 MD1 MD1 MD1 75 77 MD2 MD2 MD2 MD2 MD2 MD2 MD2 76 78 AVCC AVCC AVCC AVCC AVCC AVCC AVCC 77 79 VREF VREF VREF VREF VREF VREF VREF 78 80 P70/AN0 P70/AN0 P70/AN0 P70/AN0 P70/AN0 P70/AN0 P70/AN0 79 81 P71/AN1 P71/AN1 P71/AN1 P71/AN1 P71/AN1 P71/AN1 P71/AN1 80 82 P72/AN2 P72/AN2 P72/AN2 P72/AN2 P72/AN2 P72/AN2 P72/AN2 81 83 P73/AN3 P73/AN3 P73/AN3 P73/AN3 P73/AN3 P73/AN3 P73/AN3 82 84 P74/AN4 P74/AN4 P74/AN4 P74/AN4 P74/AN4 P74/AN4 P74/AN4 83 85 P75/AN5 P75/AN5 P75/AN5 P75/AN5 P75/AN5 P75/AN5 P75/AN5 84 86 P76/AN6/DA0 P76/AN6/DA0 P76/AN6/DA0 P76/AN6/DA0 P76/AN6/DA0 P76/AN6/DA0 P76/AN6/DA0 85 87 P77/AN7/DA1 P77/AN7/DA1 P77/AN7/DA1 P77/AN7/DA1 P77/AN7/DA1 P77/AN7/DA1 P77/AN7/DA1 86 88 AVSS AVSS AVSS AVSS AVSS AVSS AVSS 87 89 P80/IRQ0 P80/IRQ0 P80/IRQ0 P80/IRQ0 P80/IRQ0 P80/IRQ0 P80/IRQ0 88 90 CS3 CS3 CS3 CS3 CS3 P81/IRQ1/ P81/IRQ1/ P81/IRQ1/ P81/IRQ1/ P81/IRQ1/ P81/IRQ1 P81/IRQ1 Rev. 2.00 Sep 20, 2005 page 17 of 800 REJ09B0260-0200 Section 1 Overview Pin No. Pin Name FP-100B TFP-100B FP-100A 89 91 90 92 91 93 P83/IRQ3/ P83/IRQ3/ P83/IRQ3/ P83/IRQ3/ P83/IRQ3/ P83/IRQ3/ P83/IRQ3/ CS1/ CS1/ CS1/ CS1/ CS1/ ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG P84/CS0 P84/CS0 P84/CS0 P84/CS0 P84/CS0 P84 P84 92 94 VSS VSS VSS VSS VSS VSS VSS 93 95 PA0/TP0/ TCLKA PA0/TP0/ TCLKA PA0/TP0/ TCLKA PA0/TP0/ TCLKA PA0/TP0/ TCLKA PA0/TP0/ TCLKA PA0/TP0/ TCLKA 94 96 PA1/TP1/ TCLKB PA1/TP1/ TCLKB PA1/TP1 /TCLKB PA1/TP1/ TCLKB PA1/TP1/ TCLKB PA1/TP1/ TCLKB PA1/TP1/ TCLKB 95 97 PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC PA2/TP2/ TIOCA0/ TCLKC 96 98 PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD PA3/TP3/ TIOCB0/ TCLKD 97 99 PA4/TP4/ TIOCA1 PA4/TP4/ TIOCA1 PA4/TP4/ PA4/TP4/ PA4/TP4/ PA4/TP4/ TIOCA1/A23 TIOCA1/A23 TIOCA1/A23 TIOCA1 PA4/TP4/ TIOCA1 98 100 PA5/TP5/ TIOCB1 PA5/TP5/ TIOCB1 PA5/TP5/ PA5/TP5/ PA5/TP5/ PA5/TP5/ TIOCB1/A22 TIOCB1/A22 TIOCB1/A22 TIOCB1 PA5/TP5/ TIOCB1 99 1 PA6/TP6/ TIOCA2 PA6/TP6/ TIOCA2 PA6/TP6/ PA6/TP6/ PA6/TP6/ PA6/TP6/ TIOCA2/A21 TIOCA2/A21 TIOCA2/A21 TIOCA2 PA6/TP6/ TIOCA2 100 2 PA7/TP7/ TIOCB2 PA7/TP7/ TIOCB2 A20 PA7/TP7/ TIOCB2 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 P82/IRQ2/ P82/IRQ2/ P82/IRQ2/ P82/IRQ2/ P82/IRQ2/ P82/IRQ2 P82/IRQ2 CS2 CS2 CS2 CS2 A20 CS2 PA7/TP7/ PA7/TP7/ TIOCB2/A20 TIOCB2 Notes: 1. In modes 1, 3, and 5 the P40 to P47 functions of pins P40/D0 to P47/D7 are selected after a reset, but they can be changed by software. 2. In modes 2 and 4 the D0 to D7 functions of pins P40/D0 to P47/D7 are selected after a reset, but they can be changed by software. 3. Functions as RESO in the mask ROM versions, and as FWE in the on-chip flash memory versions. Functions as the programming control signal in modes 5 and 7. 1.4 Caution on Crystal Resonator Connection The H8/3024 Group support an operating frequency of up to 25 MHz. If a crystal resonator with a frequency higher than 20 MHz is connected, attention must be paid to circuit constants such as external load capacitance values. For details see section 19.2.1, Connecting a Crystal Resonator. Rev. 2.00 Sep 20, 2005 page 18 of 800 REJ09B0260-0200 Section 2 CPU Section 2 CPU 2.1 Overview The H8/300H CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 CPU. The H8/300H CPU has sixteen 16-bit general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control. 2.1.1 Features The H8/300H CPU has the following features. • Upward compatibility with H8/300 CPU Can execute H8/300 Series object programs • General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) • 64 basic instructions 8/16/32-bit arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions • Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16, ERn) or @(d:24, ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn] Absolute address [@aa:8, @aa:16, or @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8, PC) or @(d:16, PC)] Memory indirect [@@aa:8] • 16-Mbyte linear address space • High-speed operation All frequently-used instructions execute in two to four states Maximum clock frequency: 25 MHz 8/16/32-bit register-register add/subtract: 80 ns@25 MHz 8 × 8-bit register-register multiply: 560 ns@25 MHz 16 ÷ 8-bit register-register divide: 560 ns@25 MHz Rev. 2.00 Sep 20, 2005 page 19 of 800 REJ09B0260-0200 Section 2 CPU 16 × 16-bit register-register multiply: 0.88 µs@25 MHz 32 ÷ 16-bit register-register divide: 0.88 µs@25 MHz • Two CPU operating modes Normal mode Advanced mode • Low-power mode Transition to power-down state by SLEEP instruction 2.1.2 Differences from H8/300 CPU In comparison to the H8/300 CPU, the H8/300H has the following enhancements. • More general registers Eight 16-bit registers have been added. • Expanded address space Advanced mode supports a maximum 16-Mbyte address space. Normal mode supports the same 64-kbyte address space as the H8/300 CPU. • Enhanced addressing The addressing modes have been enhanced to make effective use of the 16-Mbyte address space. • Enhanced instructions Data transfer, arithmetic, and logic instructions can operate on 32-bit data. Signed multiply/divide instructions and other instructions have been added. 2.2 CPU Operating Modes The H8/300H CPU has two operating modes: normal and advanced. Normal mode supports a maximum 64-kbyte address space. Advanced mode supports up to 16 Mbytes. Normal mode Maximum 64 kbytes, program and data areas combined Advanced mode Maximum 16 Mbytes, program and data areas combined CPU operating modes Figure 2.1 CPU Operating Modes Rev. 2.00 Sep 20, 2005 page 20 of 800 REJ09B0260-0200 Section 2 CPU 2.3 Address Space Figure 2.2 shows a simple memory map for the H8/3024 Group. The H8/300H CPU can address a linear address space with a maximum size of 64 kbytes in normal mode, and 16 Mbytes in advanced mode. For further details see section 3.6, Memory Map in Each Operating Mode. The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are ignored. H'0000 H'00000 H'000000 H'FFFF H'FFFFF H'FFFFFF a. 1-Mbyte mode Normal mode b. 16-Mbyte mode Advanced mode Figure 2.2 Memory Map Rev. 2.00 Sep 20, 2005 page 21 of 800 REJ09B0260-0200 Section 2 CPU 2.4 Register Configuration 2.4.1 Overview The H8/300H CPU has the internal registers shown in figure 2.3. There are two types of registers: general registers and control registers. General Registers (ERn) 15 0 7 0 7 0 ER0 E0 R0H R0L ER1 E1 R1H R1L ER2 E2 R2H R2L ER3 E3 R3H R3L ER4 E4 R4H R4L ER5 E5 R5H R5L ER6 E6 R6H R6L R7H R7L (SP) E7 ER7 Control Registers (CR) 23 0 PC 7 6 5 4 3 2 1 0 CCR I UI H U N Z V C Legend: SP: Stack pointer PC: Program counter CCR: Condition code register Interrupt mask bit I: User bit or interrupt mask bit UI: Half-carry flag H: User bit U: Negative flag N: Zero flag Z: Overflow flag V: Carry flag C: Figure 2.3 CPU Registers Rev. 2.00 Sep 20, 2005 page 22 of 800 REJ09B0260-0200 Section 2 CPU 2.4.2 General Registers The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used without distinction between data registers and address registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or as address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit registers. Figure 2.4 illustrates the usage of the general registers. The usage of each register can be selected independently. • Address registers • 32-bit registers • 16-bit registers • 8-bit registers E registers (extended registers) E0 to E7 RH registers R0H to R7H ER registers ER0 to ER7 R registers R0 to R7 RL registers R0L to R7L Figure 2.4 Usage of General Registers General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.5 shows the stack. Rev. 2.00 Sep 20, 2005 page 23 of 800 REJ09B0260-0200 Section 2 CPU Free area SP (ER7) Stack area Figure 2.5 Stack 2.4.3 Control Registers The control registers are the 24-bit program counter (PC) and the 8-bit condition code register (CCR). Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. When an instruction is fetched, the least significant PC bit is regarded as 0. Condition Code Register (CCR) This 8-bit register contains internal CPU status information, including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence. Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask bit. For details see section 5, Interrupt Controller. Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. Rev. 2.00 Sep 20, 2005 page 24 of 800 REJ09B0260-0200 Section 2 CPU Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. Bit 3—Negative Flag (N): Stores the value of the most significant bit of data, regarded as the sign bit. Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. Bit 0—Carry Flag (C): Set to 1 when a carry is generated by execution of an operation, and cleared to 0 otherwise. Used by: • Add instructions, to indicate a carry • Subtract instructions, to indicate a borrow • Shift and rotate instructions The carry flag is also used as a bit accumulator by bit manipulation instructions. Some instructions leave flag bits unchanged. Operations can be performed on CCR by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used by conditional branch (Bcc) instructions. For the action of each instruction on the flag bits, see appendix A.1, Instruction List. For the I and UI bits, see section 5, Interrupt Controller. 2.4.4 Initial CPU Register Values In reset exception handling, PC is initialized to a value loaded from the vector table, and the I bit in CCR is set to 1. The other CCR bits and the general registers are not initialized. In particular, the initial value of the stack pointer (ER7) is also undefined. The stack pointer (ER7) must therefore be initialized by an MOV.L instruction executed immediately after a reset. Rev. 2.00 Sep 20, 2005 page 25 of 800 REJ09B0260-0200 Section 2 CPU 2.5 Data Formats The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats Figures 2.6 and 2.7 show the data formats in general registers. Data Type General Register 1-bit data RnH 7 6 5 4 3 2 1 0 1-bit data RnL Don’t care 4-bit BCD data RnH Upper digit Lower digit 4-bit BCD data RnL Don’t care Byte data RnH Data Format 7 0 Don’t care 7 7 4 3 0 Don’t care 7 7 RnL 0 Don’t care LSB 7 0 MSB LSB Don’t care Legend: RnH: General register RH RnL: General register RL Figure 2.6 General Register Data Formats Rev. 2.00 Sep 20, 2005 page 26 of 800 REJ09B0260-0200 4 3 Upper digit Lower digit 0 MSB Byte data 0 7 6 5 4 3 2 1 0 Section 2 CPU Data Type General Register Word data Rn Word data Data Format 15 0 MSB LSB 15 0 MSB LSB En 31 16 15 0 Longword data ERn MSB LSB Legend: ERn: General register En: General register E Rn: General register R MSB: Most significant bit LSB: Least significant bit Figure 2.7 General Register Data Formats 2.5.2 Memory Data Formats Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and longword data on memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches. Rev. 2.00 Sep 20, 2005 page 27 of 800 REJ09B0260-0200 Section 2 CPU Data Type Address Data Format 7 1-bit data Address L 7 Byte data Address L MSB Word data Address 2M MSB 0 6 5 4 Address 2M + 1 Address 2N Longword data 3 2 1 0 LSB LSB MSB Address 2N + 1 Address 2N + 2 Address 2N + 3 LSB Figure 2.8 Memory Data Formats When ER7 (SP) is used as an address register to access the stack, the operand size should be word size or longword size. Rev. 2.00 Sep 20, 2005 page 28 of 800 REJ09B0260-0200 Section 2 CPU 2.6 Instruction Set 2.6.1 Instruction Set Overview The H8/300H CPU has 64 types of instructions, which are classified in table 2.1. Table 2.1 Instruction Classification Function Instruction Types Data transfer MOV, PUSH*1, POP*1, MOVTPE*2, MOVFPE*2 5 Arithmetic operations ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA, DAS, MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS, EXTU 18 Logic operations AND, OR, XOR, NOT 4 Shift operations SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR 8 Bit manipulation 14 Branch BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR, BLD, BILD, BST, BIST Bcc*3, JMP, BSR, JSR, RTS 5 System control TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP 9 Block data transfer EEPMOV 1 Total 64 types Notes: 1. POP.W Rn is identical to MOV.W @SP+, Rn. PUSH.W Rn is identical to MOV.W Rn, @–SP. POP.L ERn is identical to MOV.L @SP+, Rn. PUSH.L ERn is identical to MOV.L Rn, @–SP. 2. Not available in the H8/3024 Group. 3. Bcc is a generic branching instruction. Rev. 2.00 Sep 20, 2005 page 29 of 800 REJ09B0260-0200 Section 2 CPU 2.6.2 Instructions and Addressing Modes Table 2.2 indicates the instructions available in the H8/300H CPU. Table 2.2 Instructions and Addressing Modes @(d:24, ERn) @ERn+/@–ERn @aa:8 @aa:16 @aa:24 BWL BWL BWL BWL B BWL BWL — — — — — — — — — — — — — — — WL MOVFPE, — — — — — — — — — — — — — BWL BWL — — — — — — — — — — — WL BWL — — — — — — — — — — — ADDX, SUBX B B — — — — — — — — — — — ADDS, SUBS — L — — — — — — — — — — — INC, DEC — BWL — — — — — — — — — — — DAA, DAS — B — — — — — — — — — — — MULXU, — BW — — — — — — — — — — — NEG — BWL — — — — — — — — — — — EXTU, EXTS — WL — — — — — — — — — — — AND, OR, XOR — BWL — — — — — — — — — — — NOT — @(d:16, ERn) BWL — MOV @@aa:8 @ERn Data transfer Instruction @ (d:16, PC) Rn BWL POP, PUSH Function @(d:8, PC) #xx Addressing Modes MOVTPE Arithmetic operations ADD, CMP SUB MULXS, DIVXU, DIVXS Logic operations — BWL — — — — — — — — — — — Shift instructions — BWL — — — — — — — — — — — Bit manipulation — B B — — — B — — — — — — Branch Bcc, BSR — — — — — — — — — — — — — JMP, JSR — — — — — — — — RTS — — — — — — — — — — TRAPA — — — — — — — — — — — — RTE — — — — — — — — — — — — SLEEP — — — — — — — — — — — — LDC B B W W W W — W W — — — STC — B W W W W — W W — — — — ANDC, ORC, XORC B — — — — — — — — — — — — NOP — — — — — — — — — — — — — — — — — — — — — — — — System control Block data transfer Note: B: Byte W: Word L: Longword Rev. 2.00 Sep 20, 2005 page 30 of 800 REJ09B0260-0200 — — — BW Section 2 CPU 2.6.3 Tables of Instructions Classified by Function Tables 2.3 to 2.10 summarize the instructions in each functional category. The operation notation used in these tables is defined next. Operation Notation Rs General register (destination)* General register (source)* Rn General register* ERn General register (32-bit register or address register)* (EAd) Destination operand (EAs) Source operand CCR Condition code register N N (negative) flag of CCR Z Z (zero) flag of CCR V V (overflow) flag of CCR C C (carry) flag of CCR PC Program counter SP Stack pointer #IMM Immediate data disp Displacement + Addition – Subtraction × Multiplication ÷ Division ∧ AND logical ∨ OR logical ⊕ Exclusive OR logical → Move ¬ NOT (logical complement) :3/:8/:16/:24 3-, 8-, 16-, or 24-bit length Rd Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit data or address registers (ER0 to ER7). Rev. 2.00 Sep 20, 2005 page 31 of 800 REJ09B0260-0200 Section 2 CPU Table 2.3 Data Transfer Instructions Instruction Size* Function MOV (EAs) → Rd, Rs → (EAd) B/W/L Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. MOVFPE B (EAs) → Rd Cannot be used in this LSI. MOVTPE B Rs → (EAs) Cannot be used in this LSI. POP W/L @SP+ → Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn. PUSH W/L Rn → @–SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @–SP. Note: * Size refers to the operand size. B: Byte W: Word L: Longword Rev. 2.00 Sep 20, 2005 page 32 of 800 REJ09B0260-0200 Section 2 CPU Table 2.4 Arithmetic Operation Instructions Instruction Size* Function ADD,SUB Rd ± Rs → Rd, Rd ± #IMM → Rd B/W/L Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register. (Immediate byte data cannot be subtracted from data in a general register. Use the SUBX or ADD instruction.) ADDX, SUBX B INC, DEC B/W/L ADDS, SUBS L DAA, DAS B MULXU B/W Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd Performs addition or subtraction with carry or borrow on data in two general registers, or on immediate data and data in a general register. Rd ± 1 → Rd, Rd ± 2 → Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. Rd decimal adjust → Rd Decimal-adjusts an addition or subtraction result in a general register by referring to CCR to produce 4-bit BCD data. Rd × Rs → Rd Performs unsigned multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. MULXS B/W Rd × Rs → Rd Performs signed multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. Rev. 2.00 Sep 20, 2005 page 33 of 800 REJ09B0260-0200 Section 2 CPU Instruction Size* Function DIVXU Rd ÷ Rs → Rd B/W Performs unsigned division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16-bit remainder DIVXS B/W Rd ÷ Rs → Rd Performs signed division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder, or 32 bits ÷ 16 bits → 16-bit quotient and 16-bit remainder CMP B/W/L Rd – Rs, Rd – #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR according to the result. NEG B/W/L 0 – Rd → Rd Takes the two’s complement (arithmetic complement) of data in a general register. EXTS W/L Rd (sign extension) → Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by extending the sign bit. EXTU W/L Rd (zero extension) → Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by padding with zeros. Note: * Size refers to the operand size. B: Byte W: Word L: Longword Rev. 2.00 Sep 20, 2005 page 34 of 800 REJ09B0260-0200 Section 2 CPU Table 2.5 Logic Operation Instructions Instruction Size* Function AND Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd B/W/L Performs a logical AND operation on a general register and another general register or immediate data. OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd Performs a logical OR operation on a general register and another general register or immediate data. XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. NOT B/W/L ¬ Rd → Rd Takes the one’s complement (logical complement) of general register contents. Note: * Size refers to the operand size. B: Byte W: Word L: Longword Table 2.6 Shift Instructions Instruction Size* Function SHAL, SHAR B/W/L Rd (shift) → Rd SHLL, SHLR B/W/L ROTL, ROTR B/W/L ROTXL, ROTXR B/W/L Performs an arithmetic shift on general register contents. Rd (shift) → Rd Performs a logical shift on general register contents. Rd (rotate) → Rd Rotates general register contents. Rd (rotate) → Rd Rotates general register contents, including the carry bit. Note: * Size refers to the operand size. B: Byte W: Word L: Longword Rev. 2.00 Sep 20, 2005 page 35 of 800 REJ09B0260-0200 Section 2 CPU Table 2.7 Bit Manipulation Instructions Instruction Size* Function BSET 1 → (<bit-No.> of <EAd>) B Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register. BCLR B 0 → (<bit-No.> of <EAd>) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register. BNOT B ¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register. BTST B ¬ (<bit-No.> of <EAd>) → Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register. BAND B C ∧ (<bit-No.> of <EAd>) → C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BIAND B C ∧ [¬ (<bit-No.> of <EAd>)] → C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. Rev. 2.00 Sep 20, 2005 page 36 of 800 REJ09B0260-0200 Section 2 CPU Instruction Size* Function BOR C ∨ (<bit-No.> of <EAd>) → C B ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BIOR B C ∨ [¬ (<bit-No.> of <EAd>)] → C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BXOR B C ⊕ (<bit-No.> of <EAd>) → C Exclusive-ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BIXOR B C ⊕ [¬ (<bit-No.> of <EAd>)] → C Exclusive-ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BLD B (<bit-No.> of <EAd>) → C Transfers a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BILD B ¬ (<bit-No.> of <EAd>) → C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BST B C → (<bit-No.> of <EAd>) Transfers the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. BIST B C → ¬ (<bit-No.> of <EAd>) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. Note: * Size refers to the operand size. B: Byte Rev. 2.00 Sep 20, 2005 page 37 of 800 REJ09B0260-0200 Section 2 CPU Table 2.8 Branching Instructions Instruction Size Function Bcc Branches to a specified address if address specified condition is met. The branching conditions are listed below. — Mnemonic Description Condition BRA (BT) Always (true) Always BRN (BF) Never (false) Never BHI High C∨Z=0 BLS Low or same C∨Z=1 Bcc (BHS) Carry clear (high or same) C = 0 BCS (BLO) Carry set (low) C=1 BNE Not equal Z=0 BEQ Equal Z=1 BVC Overflow clear V=0 BVS Overflow set V=1 BPL Plus N=0 BMI Minus N=1 BGE Greater or equal N⊕V=0 BLT Less than N⊕V=1 BGT Greater than Z ∨ (N ⊕ V) = 0 BLE Less or equal Z ∨ (N ⊕ V) = 1 JMP — Branches unconditionally to a specified address BSR — Branches to a subroutine at a specified address JSR — Branches to a subroutine at a specified address RTS — Returns from a subroutine Rev. 2.00 Sep 20, 2005 page 38 of 800 REJ09B0260-0200 Section 2 CPU Table 2.9 System Control Instructions Instruction Size* Function TRAPA — Starts trap-instruction exception handling RTE — Returns from an exception-handling routine SLEEP — Causes a transition to the power-down state LDC B/W (EAs) → CCR Moves the source operand contents to the condition code register. The condition code register size is one byte, but in transfer from memory, data is read by word access. STC B/W CCR → (EAd) Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access. ANDC B CCR ∧ #IMM → CCR Logically ANDs the condition code register with immediate data. ORC B CCR ∨ #IMM → CCR Logically ORs the condition code register with immediate data. XORC B NOP — CCR ⊕ #IMM → CCR Logically exclusive-ORs the condition code register with immediate data. PC + 2 → PC Only increments the program counter. Note: * Size refers to the operand size. B: Byte W: Word Rev. 2.00 Sep 20, 2005 page 39 of 800 REJ09B0260-0200 Section 2 CPU Table 2.10 Block Transfer Instruction Instruction Size Function EEPMOV.B — if R4L ≠ 0 then repeat @ER5+ → @ER6+, R4L – 1 → R4L until R4L = 0 else next; EEPMOV.W — if R4 ≠ 0 then repeat @ER5+ → @ER6+, R4 – 1 → R4 until R4 = 0 else next; Block transfer instruction. This instruction transfers the number of data bytes specified by R4L or R4, starting from the address indicated by ER5, to the location starting at the address indicated by ER6. At the end of the transfer, the next instruction is executed. 2.6.4 Basic Instruction Formats The H8/300H instructions consist of 2-byte (word) units. An instruction consists of an operation field (OP field), a register field (r field), an effective address extension (EA field), and a condition field (cc). Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first 4 bits of the instruction. Some instructions have two operation fields. Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A 24-bit address or displacement is treated as 32-bit data in which the first 8 bits are 0 (H'00). Condition Field: Specifies the branching condition of Bcc instructions. Figure 2.9 shows examples of instruction formats. Rev. 2.00 Sep 20, 2005 page 40 of 800 REJ09B0260-0200 Section 2 CPU Operation field only op NOP, RTS, etc. Operation field and register fields op rn rm ADD.B Rn, Rm, etc. Operation field, register fields, and effective address extension op rn rm MOV.B @(d:16, Rn), Rm EA (disp) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:8 Figure 2.9 Instruction Formats 2.6.5 Notes on Use of Bit Manipulation Instructions The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, modify a bit in the byte, then write the byte back. Care is required when these instructions are used to access registers with write-only bits, or to access ports. Step Description 1 Read Read one data byte at the specified address 2 Modify Modify one bit in the data byte 3 Write Write the modified data byte back to the specified address Example 1: BCLR is executed to clear bit 0 in the port 4 data direction register (P4DDR) under the following conditions. P47, P46: Input pins P45 – P40: Output pins The intended purpose of this BCLR instruction is to switch P40 from output to input. Rev. 2.00 Sep 20, 2005 page 41 of 800 REJ09B0260-0200 Section 2 CPU Before Execution of BCLR Instruction P47 P46 P45 P44 P43 P42 P41 P40 Input/output Input Input Output Output Output Output Output Output DDR 0 0 1 1 1 1 1 1 Execution of BCLR Instruction BCLR #0, P4DDR ; Execute BCLR instruction on DDR After Execution of BCLR Instruction P47 P46 P45 P44 P43 P42 P41 P40 Input/output Output Output Output Output Output Output Output Input DDR 1 1 1 1 1 1 1 0 Explanation: To execute the BCLR instruction, the CPU begins by reading P4DDR. Since P4DDR is a write-only register, it is read as H'FF, even though its true value is H'3F. Next the CPU clears bit 0 of the read data, changing the value to H'FE. Finally, the CPU writes this value (H'FE) back to P4DDR to complete the BCLR instruction. As a result, P40DDR is cleared to 0, making P40 an input pin. In addition, P47DDR and P46DDR are set to 1, making P47 and P46 output pins. The BCLR instruction can be used to clear flags in the on-chip registers to 0. In the case of the IRQ status register (ISR), for example, a flag must be read as a condition for clearing it, but when using the BCLR instruction, if it is known that a flag has been set to 1 in an interrupt-handling routine, for instance, it is not necessary to read the flag ahead of time. Rev. 2.00 Sep 20, 2005 page 42 of 800 REJ09B0260-0200 Section 2 CPU 2.7 Addressing Modes and Effective Address Calculation 2.7.1 Addressing Modes The H8/300H CPU supports the eight addressing modes listed in table 2.11. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or absolute (@aa:8) addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2.11 Addressing Modes No. Addressing Mode Symbol 1 Register direct Rn 2 Register indirect @ERn 3 Register indirect with displacement @(d:16, ERn)/@(d:24, ERn) 4 Register indirect with post-increment Register indirect with pre-decrement @ERn+ @–ERn 5 Absolute address @aa:8/@aa:16/@aa:24 6 Immediate #xx:8/#xx:16/#xx:32 7 Program-counter relative @(d:8, PC)/@(d:16, PC) 8 Memory indirect @@aa:8 1 Register Direct—Rn: The register field of the instruction code specifies an 8-, 16-, or 32-bit register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. 2 Register Indirect—@ERn: The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand. 3 Register Indirect with Displacement—@(d:16, ERn) or @(d:24, ERn): A 16-bit or 24-bit displacement contained in the instruction code is added to the contents of an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum specify the address of a memory operand. A 16-bit displacement is sign-extended when added. Rev. 2.00 Sep 20, 2005 page 43 of 800 REJ09B0260-0200 Section 2 CPU 4 Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @–ERn: • Register indirect with post-increment—@ERn+ The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contain the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the register value should be even. • Register indirect with pre-decrement—@–ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result become the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the resulting register value should be even. 5 Absolute Address—@aa:8, @aa:16, or @aa:24: The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), or 24 bits long (@aa:24). For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space. Table 2.12 indicates the accessible address ranges. Table 2.12 Absolute Address Access Ranges Absolute Address 1-Mbyte Modes 16-Mbyte Modes 8 bits (@aa:8) H'FFF00 to H'FFFFF (1048320 to 1048575) H'FFFF00 to H'FFFFFF (16776960 to 16777215) 16 bits (@aa:16) H'00000 to H'07FFF, H'F8000 to H'FFFFF (0 to 32767, 1015808 to 1048575) H'000000 to H'007FFF, H'FF8000 to H'FFFFFF (0 to 32767, 16744448 to 16777215) 24 bits (@aa:24) H'00000 to H'FFFFF (0 to 1048575) H'000000 to H'FFFFFF (0 to 16777215) 6 Immediate—#xx:8, #xx:16, or #xx:32: The instruction code contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The instruction codes of the ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. The instruction codes of some bit manipulation instructions contain 3-bit immediate data specifying a bit number. The TRAPA instruction code contains 2-bit immediate data specifying a vector address. Rev. 2.00 Sep 20, 2005 page 44 of 800 REJ09B0260-0200 Section 2 CPU 7 Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction code is signextended to 24 bits and added to the 24-bit PC contents to generate a 24-bit branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an even number. 8 Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed by longword access. The first byte of the memory operand is ignored, generating a 24-bit branch address. See figure 2.10. The upper bits of the 8-bit absolute address are assumed to be 0 (H'0000), so the address range is 0 to 255 (H'000000 to H'0000FF). Note that the first part of this range is also the exception vector area. For further details see section 5, Interrupt Controller. Specified by @aa:8 Reserved Branch address Figure 2.10 Memory-Indirect Branch Address Specification When a word-size or longword-size memory operand is specified, or when a branch address is specified, if the specified memory address is odd, the least significant bit is regarded as 0. The accessed data or instruction code therefore begins at the preceding address. See section 2.5.2, Memory Data Formats. 2.7.2 Effective Address Calculation Table 2.13 explains how an effective address is calculated in each addressing mode. In the 1-Mbyte operating modes the upper 4 bits of the calculated address are ignored in order to generate a 20-bit effective address. Rev. 2.00 Sep 20, 2005 page 45 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 46 of 800 REJ09B0260-0200 4 3 2 r r r op r Register indirect with pre-decrement @–ERn op Register indirect with post-increment @ERn+ Register indirect with post-increment or pre-decrement op Register indirect with displacement @(d:16, ERn)/@(d:24, ERn) op Register indirect (@ERn) rm rn Register direct (Rn) 1 op Addressing Mode and Instruction Format No. 31 31 1 for a byte operand, 2 for a word operand, 4 for a longword operand 1, 2, or 4 General register contents 1, 2, or 4 General register contents disp General register contents General register contents Sign extension 31 31 Effective Address Calculation 0 0 0 0 23 23 23 23 Operand is general register contents Effective Address 0 0 0 0 Section 2 CPU Table 2.13 Effective Address Calculation 7 6 5 No. abs abs abs IMM op disp Program-counter relative @(d:8, PC) or @(d:16, PC) op Immediate #xx:8, #xx:16, or #xx:32 op @aa:24 op @aa:16 op Absolute address @aa:8 Addressing Mode and Instruction Format disp PC contents Sign extension 23 Effective Address Calculation 0 16 15 H'FFFF 8 7 23 Operand is immediate data 23 Sign extension 23 23 Effective Address 0 0 0 0 Section 2 CPU Rev. 2.00 Sep 20, 2005 page 47 of 800 REJ09B0260-0200 Memory indirect @@aa:8 8 Rev. 2.00 Sep 20, 2005 page 48 of 800 REJ09B0260-0200 abs Legend: r, rm, rn: op: disp: IMM: abs: abs Register field Operation field Displacement Immediate data Absolute address op Advanced mode op Normal mode Addressing Mode and Instruction Format No. 31 8 7 abs 0 H'0000 8 7 abs 0 0 15 0 Memory contents H'0000 Memory contents 23 23 Effective Address Calculation 23 23 16 15 H'00 Effective Address 0 0 Section 2 CPU Section 2 CPU 2.8 Processing States 2.8.1 Overview The H8/300H CPU has five processing states: the program execution state, exception-handling state, power-down state, reset state, and bus-released state. The power-down state includes sleep mode, software standby mode, and hardware standby mode. Figure 2.11 classifies the processing states. Figure 2.13 indicates the state transitions. Processing states Program execution state The CPU executes program instructions in sequence Exception-handling state A transient state in which the CPU executes a hardware sequence (saving PC and CCR, fetching a vector, etc.) in response to a reset, interrupt, or other exception Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU Reset state The CPU and all on-chip supporting modules are initialized and halted Sleep mode Power-down state The CPU is halted to conserve power Software standby mode Hardware standby mode Figure 2.11 Processing States 2.8.2 Program Execution State In this state the CPU executes program instructions in normal sequence. Rev. 2.00 Sep 20, 2005 page 49 of 800 REJ09B0260-0200 Section 2 CPU 2.8.3 Exception-Handling State The exception-handling state is a transient state that occurs when the CPU alters the normal program flow due to a reset, interrupt, or trap instruction. The CPU fetches a starting address from the exception vector table and branches to that address. In interrupt and trap exception handling the CPU references the stack pointer (ER7) and saves the program counter and condition code register. Types of Exception Handling and Their Priority: Exception handling is performed for resets, interrupts, and trap instructions. Table 2.14 indicates the types of exception handling and their priority. Trap instruction exceptions are accepted at all times in the program execution state. Table 2.14 Exception Handling Types and Priority Priority Type of Exception Detection Timing Start of Exception Handling High Reset Synchronized with clock Exception handling starts immediately when RES changes from low to high Interrupt End of instruction execution or end of exception handling* When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence Trap instruction When TRAPA instruction is executed Exception handling starts when a trap (TRAPA) instruction is executed Low Note: * Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling. Figure 2.12 classifies the exception sources. For further details about exception sources, vector numbers, and vector addresses, see section 4, Exception Handling, and section 5, Interrupt Controller. Reset External interrupts Exception sources Interrupt Internal interrupts (from on-chip supporting modules) Trap instruction Figure 2.12 Classification of Exception Sources Rev. 2.00 Sep 20, 2005 page 50 of 800 REJ09B0260-0200 Section 2 CPU Bus request End of bus release Program execution state End of bus release Bus request Exception handling source Bus-released state End of exception handling Exception-handling state Interrupt source NMI, IRQ 0 , IRQ 1, or IRQ 2 interrupt SLEEP instruction with SSBY = 0 Sleep mode SLEEP instruction with SSBY = 1 Software standby mode RES = "High" Reset state*1 STBY="High", RES ="Low" Hardware standby mode*2 Power-down state Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. 2. From any state, a transition to hardware standby mode occurs when STBY goes low. Figure 2.13 State Transitions 2.8.4 Exception Handling Operation Reset Exception Handling: Reset exception handling has the highest priority. The reset state is entered when the RES signal goes low. Reset exception handling starts after that, when RES changes from low to high. When reset exception handling starts the CPU fetches a start address from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during the reset exception-handling sequence and immediately after it ends. Interrupt Exception Handling and Trap Instruction Exception Handling: When these exception-handling sequences begin, the CPU references the stack pointer (ER7) and pushes the program counter and condition code register on the stack. Next, if the UE bit in the system control register (SYSCR) is set to 1, the CPU sets the I bit in the condition code register to 1. If the UE bit Rev. 2.00 Sep 20, 2005 page 51 of 800 REJ09B0260-0200 Section 2 CPU is cleared to 0, the CPU sets both the I bit and the UI bit in the condition code register to 1. Then the CPU fetches a start address from the exception vector table and execution branches to that address. Figure 2.14 shows the stack after the exception-handling sequence. SP–4 SP (ER7) SP–3 SP+1 SP–2 SP+2 SP–1 SP+3 SP (ER7) Stack area Before exception handling starts CCR PC SP+4 Pushed on stack Even address After exception handling ends Legend: CCR: Condition code register SP: Stack pointer Notes: 1. PC is the address of the first instruction executed after the return from the exception-handling routine. 2. Registers must be saved and restored by word access or longword access, starting at an even address. Figure 2.14 Stack Structure after Exception Handling 2.8.5 Bus-Released State In this state the bus is released to a bus master other than the CPU, in response to a bus request. The bus masters other than the CPU is an external bus master. While the bus is released, the CPU halts except for internal operations. Interrupt requests are not accepted. For details see section 6.6, Bus Arbiter. Rev. 2.00 Sep 20, 2005 page 52 of 800 REJ09B0260-0200 Section 2 CPU 2.8.6 Reset State When the RES input goes low all current processing stops and the CPU enters the reset state. The I bit in the condition code register is set to 1 by a reset. All interrupts are masked in the reset state. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details see section 11, Watchdog Timer. 2.8.7 Power-Down State In the power-down state the CPU stops operating to conserve power. There are three modes: sleep mode, software standby mode, and hardware standby mode. Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the SSBY bit is cleared to 0 in the system control register (SYSCR). CPU operations stop immediately after execution of the SLEEP instruction, but the contents of CPU registers are retained. Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit is set to 1 in SYSCR. The CPU and clock halt and all on-chip supporting modules stop operating. The on-chip supporting modules are reset, but as long as a specified voltage is supplied the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. Hardware Standby Mode: A transition to hardware standby mode is made when the STBY input goes low. As in software standby mode, the CPU and all clocks halt and the on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained. For further information see section 20, Power-Down State. 2.9 Basic Operational Timing 2.9.1 Overview The H8/300H CPU operates according to the system clock (ø). The interval from one rise of the system clock to the next rise is referred to as a “state.” A memory cycle or bus cycle consists of two or three states. The CPU uses different methods to access on-chip memory, the on-chip supporting modules, and the external address space. Access to the external address space can be controlled by the bus controller. Rev. 2.00 Sep 20, 2005 page 53 of 800 REJ09B0260-0200 Section 2 CPU 2.9.2 On-Chip Memory Access Timing On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin states. All H8/3024 Group models have a function for changing the method of outputting addresses from the address pins. For details see section 6.3.5, Address Output Method. Bus cycle T1 state T2 state φ Internal address bus Address Internal read signal Internal data bus (read access) Read data Internal write signal Internal data bus (write access) Write data Figure 2.15 On-Chip Memory Access Cycle T1 T2 φ Address bus AS , RD, HWR , LWR Address High High impedance D15 to D0 Figure 2.16 Pin States during On-Chip Memory Access (Address Update Mode 1) Rev. 2.00 Sep 20, 2005 page 54 of 800 REJ09B0260-0200 Section 2 CPU 2.9.3 On-Chip Supporting Module Access Timing The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide, depending on the internal I/O register being accessed. Figure 2.17 shows the on-chip supporting module access timing. Figure 2.18 indicates the pin states. Bus cycle T1 state T2 state T3 state φ Address Address bus Read access Internal read signal Internal data bus Read data Internal write signal Write access Internal data bus Write data Figure 2.17 Access Cycle for On-Chip Supporting Modules T1 T2 T3 φ Address bus AS , RD, HWR , LWR Address High High impedance D15 to D0 Figure 2.18 Pin States during Access to On-Chip Supporting Modules Rev. 2.00 Sep 20, 2005 page 55 of 800 REJ09B0260-0200 Section 2 CPU 2.9.4 Access to External Address Space The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings determine whether each area is accessed via an 8-bit or 16-bit data bus, and whether it is accessed in two or three states. For details see section 6, Bus Controller. Rev. 2.00 Sep 20, 2005 page 56 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes Section 3 MCU Operating Modes 3.1 Overview 3.1.1 Operating Mode Selection The H8/3024 Group has seven operating modes (modes 1 to 7) that are selected by the mode pins (MD2 to MD0) as indicated in table 3.1. The input at these pins determines the size of the address space and the initial bus mode. Table 3.1 Operating Mode Selection Description Operating Mode MD2 Mode Pins MD1 MD0 Address Space Initial Bus On-Chip Mode*1 ROM On-Chip RAM — 0 0 0 Setting prohibited Mode 1 0 0 1 Expanded mode Setting Setting Setting prohibited prohibited prohibited 8 bits Disabled Enabled*2 Mode 2 0 1 0 Expanded mode 16 bits Disabled Mode 3 0 1 1 Expanded mode 8 bits Disabled Mode 4 1 0 0 Expanded mode 16 bits Disabled Mode 5 1 0 1 Expanded mode 8 bits Enabled Enabled*2 Enabled*2 Mode 6 1 1 0 Single-chip normal mode — Enabled Enabled Mode 7 1 1 1 Single-chip advanced mode — Enabled Enabled Enabled*2 Enabled*2 Notes: 1. In modes 1 to 5, an 8-bit or 16-bit data bus can be selected on a per-area basis by settings made in the area bus width control register (ABWCR). For details see section 6, Bus Controller. 2. If the RAME bit in SYSCR is cleared to 0, these addresses become external addresses. For the address space size there are three choices: 64 kbytes, 1 Mbyte, or 16 Mbyte. The external data bus is either 8 or 16 bits wide depending on ABWCR settings. 8-bit bus mode is used only if 8-bit access is selected for all areas. For details see section 6, Bus Controller. Modes 1 to 4 are externally expanded modes that enable access to external memory and peripheral devices and disable access to the on-chip ROM. Modes 1 and 2 support a maximum address space of 1 Mbyte. Modes 3 and 4 support a maximum address space of 16 Mbytes. Rev. 2.00 Sep 20, 2005 page 57 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes Mode 5 is an externally expanded mode that enables access to external memory and peripheral devices and also enables access to the on-chip ROM. Mode 5 supports a maximum address space of 16 Mbytes. Modes 6 and 7 are single-chip modes in which the chip operates using only the on-chip ROM, RAM, and I/O registers. All ports are available in these modes. Mode 6 supports a maximum address space of 64 kbytes. Mode 7 supports a maximum address space of 1 Mbyte. The H8/3024 Group can be used only in modes 1 to 7. The inputs at the mode pins must select one of these seven modes. The inputs at the mode pins must not be changed during operation. Set the reset state before changing the inputs at these pins. 3.1.2 Register Configuration The H8/3024 Group has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR). Table 3.2 summarizes these registers. Table 3.2 Registers Address* Name H'EE011 H'EE012 Abbreviation R/W Initial Value Mode control register MDCR R Undetermined System control register SYSCR R/W H'09 Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 58 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes 3.2 Mode Control Register (MDCR) MDCR is an 8-bit read-only register that indicates the current operating mode of the H8/3024 Group. Bit 7 6 5 4 3 2 1 0 — — — — — MDS2 MDS1 MDS0 Initial value 1 1 0 0 0 —* —* —* Read/Write — — — — — R R R Reserved bits Mode select 2 to 0 Bits indicating the current operating mode Note: * Determined by pins MD2 to MD 0 . Bits 7 and 6—Reserved: These bits can not be modified and are always read as 1. Bits 5 to 3—Reserved: These bits can not be modified and are always read as 0. Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the logic levels at pins MD2 to MD0 (the current operating mode). MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to MDS0 are read-only bits. The mode pin (MD2 to MD0) levels are latched into these bits when MDCR is read. Note: The versions with on-chip flash memory have a boot mode in which flash memory can be programmed. In boot mode, the MDS2 bit value is the inverse of the level at the MD2 pin. Rev. 2.00 Sep 20, 2005 page 59 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes 3.3 System Control Register (SYSCR) SYSCR is an 8-bit register that controls the operation of the H8/3024 Group. Bit 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME Initial value 0 0 0 0 1 0 0 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W RAM enable Enables or disables on-chip RAM Software standby output port enable Selects the output state of the address bus and bus control signals in software standby mode NMI edge select Selects the valid edge of the NMI input User bit enable Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit Standby timer select 2 to 0 These bits select the waiting time at recovery from software standby mode Software standby Enables transition to software standby mode Bit 7—Software Standby (SSBY): Enables transition to software standby mode. (For further information about software standby mode see section 20, Power-Down State.) When software standby mode is exited by an external interrupt, and a transition is made to normal operation, this bit remains set to 1. To clear this bit, write 0. Bit 7 SSBY Description 0 SLEEP instruction causes transition to sleep mode 1 SLEEP instruction causes transition to software standby mode Rev. 2.00 Sep 20, 2005 page 60 of 800 REJ09B0260-0200 (Initial value) Section 3 MCU Operating Modes Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the internal clock oscillator to settle when software standby mode is exited by an external interrupt. When using a crystal oscillator, set these bits so that the waiting time will be at least 7 ms at the system clock rate. For further information about waiting time selection, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby Mode. Bit 6 STS2 Bit 5 STS1 Bit 4 STS0 Description 0 0 0 Waiting time = 8,192 states 0 0 1 Waiting time = 16,384 states 0 1 0 Waiting time = 32,768 states 0 1 1 Waiting time = 65,536 states 1 0 0 Waiting time = 131,072 states 1 0 1 Waiting time = 262,144 states 1 1 0 Waiting time = 1,024 states 1 1 1 Illegal setting (Initial value) Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in the condition code register as a user bit or an interrupt mask bit. Bit 3 UE Description 0 UI bit in CCR is used as an interrupt mask bit 1 UI bit in CCR is used as a user bit (Initial value) Bit 2—NMI Edge Select (NMIEG): Selects the valid edge of the NMI input. Bit 2 NMIEG Description 0 An interrupt is requested at the falling edge of NMI 1 An interrupt is requested at the rising edge of NMI (Initial value) Rev. 2.00 Sep 20, 2005 page 61 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes Bit 1—Software Standby Output Port Enable (SSOE): Specifies whether the address bus and bus control signals (CS0 to CS7, AS, RD, HWR, LWR) are kept as outputs or fixed high, or placed in the high-impedance state in software standby mode. Bit 1 SSOE Description 0 In software standby mode, the address bus and bus control signals are all highimpedance (Initial value) 1 In software standby mode, the address bus retains its output state and bus control signals are fixed high Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized by the rising edge of the RES signal. It is not initialized in software standby mode. Bit 0 RAME Description 0 On-chip RAM is disabled 1 On-chip RAM is enabled (Initial value) 3.4 Operating Mode Descriptions 3.4.1 Mode 1 Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.2 Mode 2 Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. Rev. 2.00 Sep 20, 2005 page 62 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes 3.4.3 Mode 3 Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of the bus release control register (BRCR). (In this mode A20 is always used for address output.) 3.4.4 Mode 4 Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of BRCR. (In this mode A20 is always used for address output.) 3.4.5 Mode 5 Ports 1, 2, and 5 and part of port A can function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space, but following a reset they are input ports. To use ports 1, 2, and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR, and P5DDR) must be set to 1, setting ports 1, 2, and 5 to output mode. For A23 to A20 output, write 0 in bits 7 to 4 of BRCR. The versions with on-chip flash memory support an on-board programming mode in which the flash memory can be programmed. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.6 Mode 6 This mode operates using the on-chip ROM, RAM, and registers. All I/O ports are available. Mode 6 supports a maximum address space of 64 kbytes. 3.4.7 Mode 7 This mode operates using the on-chip ROM, RAM, and registers. All I/O ports are available. Mode 7 supports a 1-Mbyte address space. The versions with on-chip flash memory support an on-board programming mode in which the flash memory can be programmed. Rev. 2.00 Sep 20, 2005 page 63 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes 3.5 Pin Functions in Each Operating Mode The pin functions of ports 1 to 5 and port A vary depending on the operating mode. Table 3.3 indicates their functions in each operating mode. Table 3.3 Port Port 1 Pin Functions in Each Mode Mode 1 A7 to A0 Mode 2 A7 to A0 Mode 3 A7 to A0 Mode 4 Mode 5 A7 to A0 2 P17 to P10 * P17 to P10 Mode 6 Mode 7 P17 to P10 P27 to P20 Port 2 A15 to A8 A15 to A8 A15 to A8 A15 to A8 P27 to P20 *2 P27 to P20 Port 3 D15 to D8 D15 to D8 D15 to D8 D15 to D8 D15 to D8 P37 to P30 P37 to P30 Port 4 1 1 P47 to P40 * D7 to D0 * 1 P47 to P40 * 1 D7 to D0 * 1 P47 to P40 * P47 to P40 P47 to P40 Port 5 A19 to A16 A19 to A16 A19 to A16 A19 to A16 P53 to P50 * 2 P53 to P50 PA7 to PA4 3 3 4 PA6 to PA4, A20* PA6 to PA4, A20* PA7 to PA4* PA7 to PA4 Port A PA7 to PA4 P53 to P50 PA7 to PA4 Notes: 1. Initial state. The bus mode can be switched by settings in ABWCR. These pins function as P47 to P40 in 8-bit bus mode, and as D7 to D0 in 16-bit bus mode. 2. Initial state. These pins become address output pins when the corresponding bits in the data direction registers (P1DDR, P2DDR, P5DDR) are set to 1. 3. Initial state. A20 is always an address output pin. PA6 to PA4 are switched over to A23 to A21 output by writing 0 in bits 7 to 5 of BRCR. 4. Initial state. PA7 to PA4 are switched over to A23 to A20 output by writing 0 in bits 7 to 4 of BRCR. Rev. 2.00 Sep 20, 2005 page 64 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes 3.6 Memory Map in Each Operating Mode Figures 3.1 to 3.2 show memory maps of the H8/3024 Group. In the expanded modes, the address space is divided into eight areas. The initial bus mode differs between modes 1 and 2, and also between modes 3 and 4. The address locations of the on-chip RAM and on-chip registers differ between the 64-kbyte mode (mode 6), the 1-Mbyte modes (modes 1, 2, and 7), and the 16-Mbyte modes (modes 3, 4, and 5). The address range specifiable by the CPU in the 8- and 16-bit absolute addressing modes (@aa:8 and @aa:16) also differs. 3.6.1 Comparison of H8/3024 Group Memory Maps In the H8/3024 Group, the address maps vary according to the size of the on-chip ROM and RAM. The internal I/O register space is the same in all models. Table 3.4 shows the various address maps in mode 5. Table 3.4 On-chip ROM On-chip RAM 3.6.2 Address Maps in Mode 5 H8/3024F-ZTAT H8/3024 Mask H8/3026F-ZTAT ROM Version H8/3026 Mask ROM Version Size 128 kbytes 256 kbytes 128 kbytes 256 kbytes Address area H'000000 to H'01FFFF H'000000 to H'03FFFF H'000000 to H'01FFFF H'000000 to H'03FFFF Size 4 kbytes 8 kbytes 4 kbytes 8 kbytes Address area H'FFEF20 to H'FFFF1F H'FFDF20 to H'FFFF1F H'FFEF20 to H'FFFF1F H'FFDF20 to H'FFFF1F Reserved Areas The H8/3024 Group memory map includes reserved areas to which access (reading or writing) is prohibited. Normal operation cannot be guaranteed if the following reserved areas are accessed. Reserved Area in Internal I/O Register Space: The H8/3024 Group internal I/O register space includes a reserved area to which access is prohibited. For details see Appendix B, Internal I/O Registers. Rev. 2.00 Sep 20, 2005 page 65 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE0FF H'F8000 H'FEF1F H'FEF20 H'FFFE9 H'FFFEA H'FFFFF H'1FFFFF H'200000 Area 1 Area 1 Area 2 H'3FFFFF H'400000 Area 3 Area 2 Area 4 H'5FFFFF H'600000 Area 5 Area 6 H'7FFFFF H'800000 Area 7 Internal I/O registers (1) Internal I/O registers (2) External address space External address space Area 3 Area 4 H'9FFFFF H'A00000 External address space On-chip RAM* 16-bit absolute addresses Area 0 Area 0 H'FFF00 H'FFF1F H'FFF20 H'007FFF Area 5 16-bit absolute addresses H'EE000 H'0000FF H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 Area 7 Internal I/O registers (1) H'FEE0FF H'FF8000 H'FFEF1F H'FFEF20 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF External address space On-chip RAM* Internal I/O registers (2) External address space 16-bit absolute addresses H'07FFF Vector area 8-bit absolute addresses H'000FF H'000000 16-bit absolute addresses Memory-indirect branch addresses Vector area 8-bit absolute addresses H'00000 Memory-indirect branch addresses Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.1 Memory Map of H8/3024F-ZTAT and H8/3024 Mask ROM Version in Each Operating Mode Rev. 2.00 Sep 20, 2005 page 66 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes H'DFFF H'E000 Area 0 On-chip RAM Area 5 H'FF00 Area 6 H'FF1F H'FF20 Area 7 H'FFFF H'FFFFFF Internal I/O registers (2) External address space External address space H'EE000 16-bit absolute addresses Internal I/O registers (1) H'EE0FF H'F8000 H'FEF20 On-chip RAM H'FFF00 16-bit absolute addresses H'FFFFE9 H'FFFFEA H'1FFFF H'EF20 Area 4 Internal I/O registers (1) Internal I/O registers (2) H'07FFF Area 3 8-bit absolute addresses H'FFFF1F H'FFFF20 On-chip ROM H'E0FF Area 2 H'FFE9 H'FFEF1F H'FFEF20 On-chip RAM* H'FFFF00 H'000FF Internal I/O registers (1) Area 1 H'FEE0FF H'FF8000 Vector area H'FFF1F H'FFF20 H'FFFE9 H'FFFFF Internal I/O registers (2) 16-bit absolute addresses H'FEE000 On-chip ROM H'00000 Memory-indirect branch addresses H'007FFF H'01FFFF H'020000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'00FF Mode 7 (single-chip advanced mode) 8-bit absolute addresses On-chip ROM Vector area Memory-indirect branch addresses H'0000FF H'0000 8-bit absolute addresses Vector area Mode 6 (single-chip normal mode) 16-bit absolute addresses H'000000 Memory-indirect branch addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.1 Memory Map of H8/3024F-ZTAT and H8/3024 Mask ROM Version in Each Operating Mode (cont) Rev. 2.00 Sep 20, 2005 page 67 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE0FF H'F8000 H'FDF1F H'FDF20 H'FFFE9 H'FFFEA H'FFFFF H'1FFFFF H'200000 Area 1 Area 1 Area 2 H'3FFFFF H'400000 Area 3 Area 2 Area 4 H'5FFFFF H'600000 Area 5 Area 6 H'7FFFFF H'800000 Area 7 Internal I/O registers (1) Internal I/O registers (2) External address space External address space Area 3 Area 4 H'9FFFFF H'A00000 External address space On-chip RAM* 16-bit absolute addresses Area 0 Area 0 H'FFF00 H'FFF1F H'FFF20 H'007FFF Area 5 16-bit absolute addresses H'EE000 H'0000FF H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 Area 7 Internal I/O registers (1) H'FEE0FF H'FF8000 H'FFDF1F H'FFDF20 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF External address space On-chip RAM* Internal I/O registers (2) External address space 16-bit absolute addresses H'07FFF Vector area 8-bit absolute addresses H'000FF H'000000 16-bit absolute addresses Memory-indirect branch addresses Vector area 8-bit absolute addresses H'00000 Memory-indirect branch addresses Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.2 Memory Map of H8/3026F-ZTAT and H8/3026 Mask ROM Version in Each Operating Mode Rev. 2.00 Sep 20, 2005 page 68 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes H'DFFF H'E000 Area 0 On-chip RAM Area 5 H'FF00 Area 6 H'FF1F H'FF20 Area 7 H'FFFF H'FFFFFF Internal I/O registers (2) External address space External address space H'EE000 16-bit absolute addresses Internal I/O registers (1) H'EE0FF H'F8000 H'FDF20 On-chip RAM H'FFF00 16-bit absolute addresses H'FFFFE9 H'FFFFEA H'3FFFF H'E720 Area 4 Internal I/O registers (1) Internal I/O registers (2) H'07FFF Area 3 8-bit absolute addresses H'FFFF1F H'FFFF20 On-chip ROM (flash memory) H'E0FF Area 2 H'FFE9 H'FFDF1F H'FFDF20 On-chip RAM* H'FFFF00 H'000FF Internal I/O registers (1) Area 1 H'FEE0FF H'FF8000 Vector area H'FFF1F H'FFF20 H'FFFE9 H'FFFFF Internal I/O registers(2) 16-bit absolute addresses H'FEE000 On-chip ROM (flash memory) H'00000 Memory-indirect branch addresses H'007FFF H'03FFFF H'040000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'00FF Mode 7 (single-chip advanced mode) 8-bit absolute addresses On-chip ROM (flash memory) Vector area Memory-indirect branch addresses H'0000FF H'0000 8-bit absolute addresses Vector area Mode 6 (single-chip normal mode) 16-bit absolute addresses H'000000 Memory-indirect branch addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.2 Memory Map of H8/3026F-ZTAT and H8/3026 Mask ROM Version in Each Operating Mode (cont) Rev. 2.00 Sep 20, 2005 page 69 of 800 REJ09B0260-0200 Section 3 MCU Operating Modes Rev. 2.00 Sep 20, 2005 page 70 of 800 REJ09B0260-0200 Section 4 Exception Handling Section 4 Exception Handling 4.1 Overview 4.1.1 Exception Handling Types and Priority As table 4.1 indicates, exception handling may be caused by a reset, interrupt, or trap instruction. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur simultaneously, they are accepted and processed in priority order. Trap instruction exceptions are accepted at all times in the program execution state. Table 4.1 Exception Types and Priority Priority Exception Type High Reset Low 4.1.2 Start of Exception Handling Starts immediately after a low-to-high transition at the RES pin Interrupt Interrupt requests are handled when execution of the current instruction or handling of the current exception is completed Trap instruction (TRAPA) Started by execution of a trap instruction (TRAPA) Exception Handling Operation Exceptions originate from various sources. Trap instructions and interrupts are handled as follows. 1. The program counter (PC) and condition code register (CCR) are pushed onto the stack. 2. The CCR interrupt mask bit is set to 1. 3. A vector address corresponding to the exception source is generated, and program execution starts from that address. Note: For a reset exception, steps 2 and 3 above are carried out. Rev. 2.00 Sep 20, 2005 page 71 of 800 REJ09B0260-0200 Section 4 Exception Handling 4.1.3 Exception Vector Table The exception sources are classified as shown in figure 4.1. Different vectors are assigned to different exception sources. Table 4.2 lists the exception sources and their vector addresses. • Reset External interrupts: NMI, IRQ 0 to IRQ5 Exception sources • Interrupts • Trap instruction Internal interrupts: 27 interrupts from on-chip supporting modules Figure 4.1 Exception Sources Rev. 2.00 Sep 20, 2005 page 72 of 800 REJ09B0260-0200 Section 4 Exception Handling Table 4.2 Exception Vector Table Vector Address*1 Exception Source Vector Number Advanced Mode Normal Mode Reset 0 H'0000 to H'0003 H'0000 to H'0001 Reserved for system use 1 H'0004 to H'0007 H'0002 to H'0003 2 H'0008 to H'000B H'0004 to H'0005 3 H'000C to H'000F H'0006 to H'0007 4 H'0010 to H'0013 H'0008 to H'0009 5 H'0014 to H'0017 H'000A to H'000B 6 H'0018 to H'001B H'000C to H'000D 7 H'001C to H'001F H'000E to H'000F External interrupt (NMI) Trap instruction (4 sources) 8 H'0020 to H'0023 H'0010 to H'0011 9 H'0024 to H'0027 H'0012 to H'0013 10 H'0028 to H'002B H'0014 to H'0015 11 H'002C to H'002F H'0016 to H'0017 External interrupt IRQ0 12 H'0030 to H'0033 H'0018 to H'0019 External interrupt IRQ1 13 H'0034 to H'0037 H'001A to H'001B External interrupt IRQ2 14 H'0038 to H'003B H'001C to H'001D External interrupt IRQ3 15 H'003C to H'003F H'001E to H'001F External interrupt IRQ4 16 H'0040 to H'0043 H'0020 to H'0021 External interrupt IRQ5 17 H'0044 to H'0047 H'0022 to H'0023 Reserved for system use 18 H'0048 to H'004B H'0024 to H'0025 19 H'004C to H'004F H'0026 to H'0027 20 to 63 H'0050 to H'0053 to H'00FC to H'00FF H'0028 to H'0029 to H'007E to H'007F 2 Internal interrupts* Notes: 1. Lower 16 bits of the address. 2. For the internal interrupt vectors, see section 5.3.3, Interrupt Exception Handling Vector Table. Rev. 2.00 Sep 20, 2005 page 73 of 800 REJ09B0260-0200 Section 4 Exception Handling 4.2 Reset 4.2.1 Overview A reset is the highest-priority exception. When the RES pin goes low, all processing halts and the chip enters the reset state. A reset initializes the internal state of the CPU and the registers of the on-chip supporting modules. Reset exception handling begins when the RES pin changes from low to high. The chip can also be reset by overflow of the watchdog timer. For details see section 11, Watchdog Timer. 4.2.2 Reset Sequence The chip enters the reset state when the RES pin goes low. To ensure that the chip is reset, hold the RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the RES pin low for at least 10 system clock (ø) cycles. In the versions with on-chip flash memory, the RES pin must be held low for at least 20 system clock cycles. See appendix D.2, Pin States at Reset, for the states of the pins in the reset state. When the RES pin goes high after being held low for the necessary time, the chip starts reset exception handling as follows. • The internal state of the CPU and the registers of the on-chip supporting modules are initialized, and the I bit is set to 1 in CCR. • The contents of the reset vector address (H'0000 to H'0003 in advanced mode, H'0000 to H'0001 in normal mode) are read, and program execution starts from the address indicated in the vector address. Figure 4.2 shows the reset sequence in modes 1 and 3. Figure 4.3 shows the reset sequence in modes 2 and 4. Figure 4.4 shows the reset sequence in mode 6. Rev. 2.00 Sep 20, 2005 page 74 of 800 REJ09B0260-0200 (2) (4) (3) (6) (5) (8) (7) Internal processing (10) (9) Prefetch of first program instruction Address of reset exception handling vector: (1) = H'000000, (3) = H'000001, (5) = H'000002, (7) = H'000003 Start address (contents of reset exception handling vector address) Start address First instruction of program High (1) Note: After a reset, the wait-state controller inserts three wait states in every bus cycle. (1), (3), (5), (7) (2), (4), (6), (8) (9) (10) D15 to D8 HWR , LWR RD Address bus RES φ Vector fetch Section 4 Exception Handling Figure 4.2 Reset Sequence (Modes 1 and 3) Rev. 2.00 Sep 20, 2005 page 75 of 800 REJ09B0260-0200 Section 4 Exception Handling Internal processing Vector fetch Prefetch of first program instruction φ RES Address bus (1) (3) (5) RD HWR , LWR D15 to D0 (1), (3) (2), (4) (5) (6) High (2) (4) (6) Address of reset exception handling vector: (1) = H'000000, (3) = H'000002 Start address (contents of reset exception handling vector address) Start address First instruction of program Note: After a reset, the wait-state controller inserts three wait states in every bus cycle. Figure 4.3 Reset Sequence (Modes 2 and 4) Rev. 2.00 Sep 20, 2005 page 76 of 800 REJ09B0260-0200 Section 4 Exception Handling Vector fetch Internal processing Prefetch of first program instruction φ RES Internal address bus (1) (2) Internal read signal Internal write signal Internal data bus (16 bits wide) (2) (3) (1) Address of reset exception handling vector (H'0000) (2) Start address (contents of reset exception handling vector address) (3) First instruction of program Figure 4.4 Reset Sequence (Mode 6) 4.2.3 Interrupts after Reset If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset exception handling. The first instruction of the program is always executed immediately after the reset state ends. This instruction should initialize the stack pointer (example: MOV.L #xx:32, SP). 4.3 Interrupts Interrupt exception handling can be requested by seven external sources (NMI, IRQ0 to IRQ5), and 27 internal sources in the on-chip supporting modules. Figure 4.5 classifies the interrupt sources and indicates the number of interrupts of each type. Rev. 2.00 Sep 20, 2005 page 77 of 800 REJ09B0260-0200 Section 4 Exception Handling The on-chip supporting modules that can request interrupts are the watchdog timer (WDT), 16-bit timer, 8-bit timer, serial communication interface (SCI), and A/D converter. Each interrupt source has a separate vector address. NMI is the highest-priority interrupt and is always accepted*. Interrupts are controlled by the interrupt controller. The interrupt controller can assign interrupts other than NMI to two priority levels, and arbitrate between simultaneous interrupts. Interrupt priorities are assigned in interrupt priority registers A and B (IPRA and IPRB) in the interrupt controller. For details on interrupts see section 5, Interrupt Controller. External interrupts NMI (1) IRQ 0 to IRQ 5 (6) Internal interrupts WDT* (1) 16-bit timer (9) 8-bit timer (8) SCI (8) A/D converter (1) Interrupts Note: Numbers in parentheses are the number of interrupt sources. * When the watchdog timer is used as an interval timer, it generates an interrupt request at every counter overflow. Figure 4.5 Interrupt Sources and Number of Interrupts Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.9, NMI Input Disabling Conditions. 4.4 Trap Instruction Trap instruction exception handling starts when a TRAPA instruction is executed. If the UE bit is set to 1 in the system control register (SYSCR), the exception handling sequence sets the I bit to 1 in CCR. If the UE bit is 0, the I and UI bits are both set to 1 in CCR. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, which is specified in the instruction code. Rev. 2.00 Sep 20, 2005 page 78 of 800 REJ09B0260-0200 Section 4 Exception Handling 4.5 Stack Status after Exception Handling Figure 4.6 shows the stack after completion of trap instruction exception handling and interrupt exception handling. SP–4 SP–3 SP–2 SP–1 SP (ER7) → SP (ER7) → SP+1 SP+2 SP+3 SP+4 Stack area Before exception handling CCR CCR* PC H PC L Even address After exception handling Pushed on stack a. Normal mode SP–4 SP–3 SP–2 SP–1 SP (ER7) → SP (ER7) → SP+1 SP+2 SP+3 SP+4 Stack area Before exception handling CCR PC E PC H PC L Even address After exception handling Pushed on stack b. Advanced mode Legend PCE: Bits 23 to 16 of program counter (PC) PCH: Bits 15 to 8 of program counter (PC) PCL: Bits 7 to 0 of program counter (PC) CCR: Condition code register SP: Stack pointer Notes: * Ignored at return. 1. PC indicates the address of the first instruction that will be executed after return. 2. Registers must be saved in word or longword size at even addresses. Figure 4.6 Stack after Completion of Exception Handling Rev. 2.00 Sep 20, 2005 page 79 of 800 REJ09B0260-0200 Section 4 Exception Handling 4.6 Notes on Stack Usage When accessing word data or longword data, the H8/3024 Group regards the lowest address bit as 0. The stack should always be accessed by word access or longword access, and the value of the stack pointer (SP:ER7) should always be kept even. Use the following instructions to save registers: PUSH.W Rn PUSH.L ERn (or MOV.W Rn, @–SP) (or MOV.L ERn, @–SP) Use the following instructions to restore registers: POP.W Rn POP.L ERn (or MOV.W @SP+, Rn) (or MOV.L @SP+, ERn) Setting SP to an odd value may lead to a malfunction. Figure 4.7 shows an example of what happens when the SP value is odd. Rev. 2.00 Sep 20, 2005 page 80 of 800 REJ09B0260-0200 Section 4 Exception Handling SP CCR R1L SP H'FFFEFA H'FFFEFB PC PC H'FFFEFC H'FFFEFD H'FFFEFE H'FFFEFF SP TRAPA instruction executed SP set to H'FFFEFF MOV. B R1L, @-ER7 Data saved above SP CCR contents lost Legend CCR: Condition code register PC: Program counter R1L: General register R1L SP: Stack pointer Note: The diagram illustrates modes 3 to 5. Figure 4.7 Operation when SP Value is Odd Rev. 2.00 Sep 20, 2005 page 81 of 800 REJ09B0260-0200 Section 4 Exception Handling Rev. 2.00 Sep 20, 2005 page 82 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Section 5 Interrupt Controller 5.1 Overview 5.1.1 Features The interrupt controller has the following features: • Interrupt priority registers (IPRs) for setting interrupt priorities Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis in interrupt priority registers A and B (IPRA and IPRB). • Three-level enabling/disabling by the I and UI bits in the CPU’s condition code register (CCR) and the UE bit in the system control register (SYSCR) • Seven external interrupt pins NMI has the highest priority and is always accepted*; either the rising or falling edge can be selected. For each of IRQ0 to IRQ5, sensing of the falling edge or level sensing can be selected independently. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.9, NMI Input Disabling Conditions. Rev. 2.00 Sep 20, 2005 page 83 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.1.2 Block Diagram Figure 5.1 shows a block diagram of the interrupt controller. CPU ISCR IER IPRA, IPRB NMI input IRQ input section ISR IRQ input OVF TME . . . . . . . TEI TEIE Priority decision logic Interrupt request Vector number . . . I UI Interrupt controller UE Legend: ISCR: IER: ISR: IPRA: IPRB: SYSCR: SYSCR IRQ sense control register IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B System control register Figure 5.1 Interrupt Controller Block Diagram Rev. 2.00 Sep 20, 2005 page 84 of 800 REJ09B0260-0200 CCR Section 5 Interrupt Controller 5.1.3 Pin Configuration Table 5.1 lists the interrupt pins. Table 5.1 Interrupt Pins Name Abbreviation I/O Function Nonmaskable interrupt NMI Input Nonmaskable interrupt*, rising edge or falling edge selectable External interrupt request 5 to 0 IRQ5 Input Maskable interrupts, falling edge or level sensing selectable to IRQ0 Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.9, NMI Input Disabling Conditions. 5.1.4 Register Configuration Table 5.2 lists the registers of the interrupt controller. Table 5.2 Interrupt Controller Registers Address*1 Name Abbreviation R/W Initial Value H'EE012 System control register SYSCR R/W H'09 H'EE014 IRQ sense control register ISCR R/W H'00 H'EE015 IRQ enable register IER R/W H'00 H'EE016 IRQ status register ISR R/(W)*2 H'00 H'EE018 Interrupt priority register A IPRA R/W H'00 H'EE019 Interrupt priority register B IPRB R/W H'00 Notes: 1. Lower 20 bits of the address in advanced mode. 2. Only 0 can be written, to clear flags. 5.2 Register Descriptions 5.2.1 System Control Register (SYSCR) SYSCR is an 8-bit readable/writable register that controls software standby mode, selects the action of the UI bit in CCR, selects the NMI edge, and enables or disables the on-chip RAM. Only bits 3 and 2 are described here. For the other bits, see section 3.3, System Control Register (SYSCR). Rev. 2.00 Sep 20, 2005 page 85 of 800 REJ09B0260-0200 Section 5 Interrupt Controller SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME Initial value 0 0 0 0 1 0 0 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W RAM enable Software standby output port enable NMI edge select Selects the NMI input edge Standby timer select 2 to 0 Software standby User bit enable Selects whether to use the UI bit in CCR as a user bit or interrupt mask bit Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit. Bit 3 UE Description 0 UI bit in CCR is used as interrupt mask bit 1 UI bit in CCR is used as user bit (Initial value) Bit 2—NMI Edge Select (NMIEG): Selects the NMI input edge. Bit 2 NMIEG Description 0 Interrupt is requested at falling edge of NMI input 1 Interrupt is requested at rising edge of NMI input 5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB) IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority. Rev. 2.00 Sep 20, 2005 page 86 of 800 REJ09B0260-0200 (Initial value) Section 5 Interrupt Controller Interrupt Priority Register A (IPRA) IPRA is an 8-bit readable/writable register in which interrupt priority levels can be set. Bit 7 6 5 4 3 2 1 0 IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Priority level A0 Selects the priority level of 16-bit timer channel 2 interrupt requests Priority level A1 Selects the priority level of 16-bit timer channel 1 interrupt requests Priority level A2 Selects the priority level of 16-bit timer channel 0 interrupt requests Priority level A3 Selects the priority level of WDT, and A/D converter interrupt requests Priority level A4 Selects the priority level of IRQ 4 and IRQ 5 interrupt requests Priority level A5 Selects the priority level of IRQ 2 and IRQ 3 interrupt requests Priority level A6 Selects the priority level of IRQ 1 interrupt requests Priority level A7 Selects the priority level of IRQ 0 interrupt requests IPRA is initialized to H'00 by a reset and in hardware standby mode. Rev. 2.00 Sep 20, 2005 page 87 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Bit 7—Priority Level A7 (IPRA7): Selects the priority level of IRQ0 interrupt requests. Bit 7 IPRA7 Description 0 IRQ0 interrupt requests have priority level 0 (low priority) 1 IRQ0 interrupt requests have priority level 1 (high priority) (Initial value) Bit 6—Priority Level A6 (IPRA6): Selects the priority level of IRQ1 interrupt requests. Bit 6 IPRA6 Description 0 IRQ1 interrupt requests have priority level 0 (low priority) 1 IRQ1 interrupt requests have priority level 1 (high priority) (Initial value) Bit 5—Priority Level A5 (IPRA5): Selects the priority level of IRQ2 and IRQ3 interrupt requests. Bit 5 IPRA5 Description 0 IRQ2 and IRQ3 interrupt requests have priority level 0 (low priority) 1 IRQ2 and IRQ3 interrupt requests have priority level 1 (high priority) (Initial value) Bit 4—Priority Level A4 (IPRA4): Selects the priority level of IRQ4 and IRQ5 interrupt requests. Bit 4 IPRA4 Description 0 IRQ4 and IRQ5 interrupt requests have priority level 0 (low priority) 1 IRQ4 and IRQ5 interrupt requests have priority level 1 (high priority) (Initial value) Bit 3—Priority Level A3 (IPRA3): Selects the priority level of WDT, and A/D converter interrupt requests. Bit 3 IPRA3 Description 0 WDT, and A/D converter interrupt requests have priority level 0 (low priority) (Initial value) 1 WDT, and A/D converter interrupt requests have priority level 1 (high priority) Rev. 2.00 Sep 20, 2005 page 88 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Bit 2—Priority Level A2 (IPRA2): Selects the priority level of 16-bit timer channel 0 interrupt requests. Bit 2 IPRA2 Description 0 16-bit timer channel 0 interrupt requests have priority level 0 (low priority) (Initial value) 1 16-bit timer channel 0 interrupt requests have priority level 1 (high priority) Bit 1—Priority Level A1 (IPRA1): Selects the priority level of 16-bit timer channel 1 interrupt requests. Bit 1 IPRA1 Description 0 16-bit timer channel 1 interrupt requests have priority level 0 (low priority) (Initial value) 1 16-bit timer channel 1 interrupt requests have priority level 1 (high priority) Bit 0—Priority Level A0 (IPRA0): Selects the priority level of 16-bit timer channel 2 interrupt requests. Bit 0 IPRA0 Description 0 16-bit timer channel 2 interrupt requests have priority level 0 (low priority) (Initial value) 1 16-bit timer channel 2 interrupt requests have priority level 1 (high priority) Rev. 2.00 Sep 20, 2005 page 89 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Interrupt Priority Register B (IPRB) IPRB is an 8-bit readable/writable register in which interrupt priority levels can be set. Bit 7 6 5 4 3 2 1 0 IPRB7 IPRB6 — — IPRB3 IPRB2 — — Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Reserved bit Priority level B2 Selects the priority level of SCI channel 1 interrupt requests Priority level B3 Selects the priority level of SCI channel 0 interrupt requests Reserved bit Priority level B6 Selects the priority level of 8-bit timer channel 2, 3 interrupt requests Priority level B7 Selects the priority level of 8-bit timer channel 0, 1 interrupt requests IPRB is initialized to H'00 by a reset and in hardware standby mode. Bit 7—Priority Level B7 (IPRB7): Selects the priority level of 8-bit timer channel 0, 1 interrupt requests. Bit 7 IPRB7 Description 0 8-bit timer channel 0 and 1 interrupt requests have priority level 0 (low priority) (Initial value) 1 8-bit timer channel 0 and 1 interrupt requests have priority level 1 (high priority) Rev. 2.00 Sep 20, 2005 page 90 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Bit 6—Priority Level B6 (IPRB6): Selects the priority level of 8-bit timer channel 2, 3 interrupt requests. Bit 6 IPRB6 Description 0 8-bit timer channel 2 and 3 interrupt requests have priority level 0 (low priority) (Initial value) 1 8-bit timer channel 2 and 3 interrupt requests have priority level 1 (high priority) Bits 5 and 4—Reserved: This bit can be written and read, but it does not affect interrupt priority. Bit 3—Priority Level B3 (IPRB3): Selects the priority level of SCI channel 0 interrupt requests. Bit 3 IPRB3 Description 0 SCI0 channel 0 interrupt requests have priority level 0 (low priority) 1 SCI0 channel 0 interrupt requests have priority level 1 (high priority) (Initial value) Bit 2—Priority Level B2 (IPRB2): Selects the priority level of SCI channel 1 interrupt requests. Bit 2 IPRB2 Description 0 SCI1 channel 1 interrupt requests have priority level 0 (low priority) 1 SCI1 channel 1 interrupt requests have priority level 1 (high priority) (Initial value) Bits 1 and 0—Reserved: This bit can be written and read, but it does not affect interrupt priority. Rev. 2.00 Sep 20, 2005 page 91 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.2.3 IRQ Status Register (ISR) ISR is an 8-bit readable/writable register that indicates the status of IRQ0 to IRQ5 interrupt requests. Bit Initial value Read/Write 7 6 5 4 3 2 1 0 — — IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F 0 0 0 0 0 0 0 0 — R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* — Reserved bits IRQ 5 to IRQ0 flags These bits indicate IRQ 5 to IRQ 0 flag interrupt request status Note: * Only 0 can be written, to clear flags. ISR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6—Reserved: These bits can not be modified and are always read as 0. Bits 5 to 0—IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to IRQ0 interrupt requests. Bits 5 to 0 IRQ5F to IRQ0F Description 0 [Clearing conditions] (Initial value) 0 is written in IRQnF after reading the IRQnF flag when IRQnF = 1. IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out. IRQnSC = 1 and IRQn interrupt exception handling is carried out. 1 [Setting conditions] IRQnSC = 0 and IRQn input is low. IRQnSC = 1 and IRQn input changes from high to low. Note: n = 5 to 0 Rev. 2.00 Sep 20, 2005 page 92 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.2.4 IRQ Enable Register (IER) IER is an 8-bit readable/writable register that enables or disables IRQ5 to IRQ0 interrupt requests. Bit 7 6 5 4 3 2 1 0 — — IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Reserved bits IRQ 5 to IRQ0 enable These bits enable or disable IRQ 5 to IRQ 0 interrupts IER is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6—Reserved: These bits can be written and read, but they do not enable or disable interrupts. Bits 5 to 0—IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits enable or disable IRQ5 to IRQ0 interrupts. Bits 5 to 0 IRQ5E to IRQ0E Description 0 IRQ5 to IRQ0 interrupts are disabled 1 IRQ5 to IRQ0 interrupts are enabled (Initial value) Rev. 2.00 Sep 20, 2005 page 93 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.2.5 IRQ Sense Control Register (ISCR) ISCR is an 8-bit readable/writable register that selects level sensing or falling-edge sensing of the inputs at pins IRQ5 to IRQ0. Bit 7 6 — — Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W 5 4 3 2 1 0 IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Reserved bits IRQ 5 to IRQ0 sense control These bits select level sensing or falling-edge sensing for IRQ 5 to IRQ 0 interrupts ISCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6—Reserved: These bits can be written and read, but they do not select level or falling-edge sensing. Bits 5 to 0—IRQ5 to IRQ0 Sense Control (IRQ5SC to IRQ0SC): These bits select whether interrupts IRQ5 to IRQ0 are requested by level sensing of pins IRQ5 to IRQ0, or by falling-edge sensing. Bits 5 to 0 IRQ5SC to IRQ0SC Description 0 Interrupts are requested when IRQ5 to IRQ0 inputs are low 1 Interrupts are requested by falling-edge input at IRQ5 to IRQ0 Rev. 2.00 Sep 20, 2005 page 94 of 800 REJ09B0260-0200 (Initial value) Section 5 Interrupt Controller 5.3 Interrupt Sources The interrupt sources include external interrupts (NMI, IRQ0 to IRQ5) and 27 internal interrupts. 5.3.1 External Interrupts There are seven external interrupts: NMI, and IRQ0 to IRQ5. Of these, NMI, IRQ0, IRQ1, and IRQ2 can be used to exit software standby mode. NMI: NMI is the highest-priority interrupt and is always accepted, regardless of the states of the I and UI bits in CCR*. The NMIEG bit in SYSCR selects whether an interrupt is requested by the rising or falling edge of the input at the NMI pin. NMI interrupt exception handling has vector number 7. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.9, NMI Input Disabling Conditions. IRQ0 to IRQ5 Interrupts: These interrupts are requested by input signals at pins IRQ0 to IRQ5. The IRQ0 to IRQ5 interrupts have the following features. • ISCR settings can select whether an interrupt is requested by the low level of the input at pins IRQ0 to IRQ5, or by the falling edge. • IER settings can enable or disable the IRQ0 to IRQ5 interrupts. Interrupt priority levels can be assigned by four bits in IPRA (IPRA7 to IPRA4). • The status of IRQ0 to IRQ5 interrupt requests is indicated in ISR. The ISR flags can be cleared to 0 by software. Figure 5.2 shows a block diagram of interrupts IRQ0 to IRQ5. IRQnSC IRQnE IRQnF Edge/level sense circuit IRQn input S Q IRQn interrupt request R Clear signal Note: n = 5 to 0 Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5 Rev. 2.00 Sep 20, 2005 page 95 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Figure 5.3 shows the timing of the setting of the interrupt flags (IRQnF). φ IRQn input pin IRQnF Note: n = 5 to 0 Figure 5.3 Timing of Setting of IRQnF Interrupts IRQ0 to IRQ5 have vector numbers 12 to 17. These interrupts are detected regardless of whether the corresponding pin is set for input or output. When using a pin for external interrupt input, clear its DDR bit to 0 and do not use the pin for chip select output, SCI input/output, or A/D external trigger input. 5.3.2 Internal Interrupts Twenty-Seven internal interrupts are requested from the on-chip supporting modules. • Each on-chip supporting module has status flags for indicating interrupt status, and enable bits for enabling or disabling interrupts. • Interrupt priority levels can be assigned in IPRA and IPRB. 5.3.3 Interrupt Exception Handling Vector Table Table 5.3 lists the interrupt exception handling sources, their vector addresses, and their default priority order. In the default priority order, smaller vector numbers have higher priority. The priority of interrupts other than NMI can be changed in IPRA and IPRB. The priority order after a reset is the default order shown in table 5.3. Rev. 2.00 Sep 20, 2005 page 96 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Table 5.3 Interrupt Sources, Vector Addresses, and Priority Interrupt Source Origin NMI External pins Vector Address* Vector Number Advanced Mode Normal Mode IPR 7 H'001C to H'001F H'000E to H'000F — 12 H'0030 to H'0033 H'0018 to H'0019 IRQ1 13 H'0034 to H0037 H'001A to H'001B IPRA6 IRQ2 IRQ3 14 15 H'0038 to H'003B H'001C to H'001D IPRA5 H'003C to H'003F H'001E to H'001F IRQ4 IRQ5 16 17 H'0040 to H'0043 H'0044 to H'0047 IRQ0 H'0020 to H'0021 H'0022 to H'0023 Reserved — 18 19 H'0048 to H'004B H'0024 to H'0025 H'004C to H'004F H'0026 to H'0027 WOVI (interval timer) Watchdog timer 20 H'0050 to H'0053 Reserved — 21 22 H'0054 to H'0057 H'002A to H'002B H'0058 to H'005B H'002C to H'002D ADI (A/D end) A/D 23 H'005C to H'005F H'002E to H'002F IMIA0 (compare match/ input capture A0) IMIB0 (compare match/ input capture B0) OVI0 (overflow 0) 16-bit timer 24 channel 0 H'0060 to H'0063 H'0030 to H'0031 25 H'0064 to H'0067 H'0032 to H'0033 26 H'0068 to H'006B H'0034 to H'0035 Reserved — 27 H'006C to H'006F H'0036 to H'0037 IMIA1 (compare match/ inputcapture A1) IMIB1 (compare match/ input capture B1) OVI1 (overflow 1) 16-bit timer 28 channel 1 H'0070 to H'0073 H'0038 to H'0039 29 H'0074 to H'0077 H'003A to H'003B 30 H'0078 to H'007B H'003C to H'003D Reserved — 31 H'007C to H'007F H'003E to H'003F H'0028 to H'0029 Priority High IPRA7 IPRA4 IPRA3 IPRA2 IPRA1 Low Rev. 2.00 Sep 20, 2005 page 97 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Vector Address* Vector Number Advanced Mode Normal Mode Interrupt Source Origin IMIA2 (compare match/ input capture A2) IMIB2 (compare match/ input capture B2) OVI2 (overflow 2) 16-bit timer 32 channel 2 H'0080 to H'0083 H'0040 to H'0041 33 H'0084 to H'0087 H'0042 to H'0043 34 H'0088 to H'008B H'0044 to H'0045 Reserved — 35 H'008C to H'008F H'0046 to H'0047 CMIA0 (compare match A0) CMIB0 (compare match B0) CMIA1/CMIB1 (compare match A1/B1) TOVI0/TOVI1 (overflow 0/1) 8-bit timer 36 channel 0/1 H'0090 to H'0093 H'0048 to H'0049 37 H'0094 to H'0097 H'004A to H'004B 38 H'0098 to H'009B H'004C to H'004D 39 H'009C to H'009F H'004E to H'004F CMIA2 (compare match A2) CMIB2 (compare match B2) CMIA3/CMIB3 (compare match A3/B3) TOVI2/TOVI3 (overflow 2/3) 8-bit timer 40 channel 2/3 H'00A0 to H'00A3 H'0050 to H'0051 41 H'00A4 to H'00A7 H'0052 to H'0053 42 H'00A8 to H'00AB H'0054 to H'0055 43 H'00AC to H'00AF H'0056 to H'0057 Reserved — 44 45 46 47 48 49 50 51 H'00B0 to H'00B3 H'00B4 to H'00B7 H'00B8 to H'00BB H'00BC to H'00BF H'00C0 to H'00C3 H'00C4 to H'00C7 H'00C8 to H'00CB H'00CC to H'00CF Rev. 2.00 Sep 20, 2005 page 98 of 800 REJ09B0260-0200 IPR Priority IPRA0 High IPRB7 IPRB6 H'0058 to H'0059 — H'005A to H'005B H'005C to H'005D H'005E to H'005F H'0060 to H'0061 H'0062 to H'0063 H'0064 to H'0065 H'0066 to H'0067 Low Section 5 Interrupt Controller Interrupt Source Origin ERI0 (receive error 0) RXI0 (receive data full 0) TXI0 (transmit data empty 0) TEI0 (transmit end 0) SCI channel 0 ERI1 (receive error 1) RXI1 (receive data full 1) TXI1 (transmit data empty 1) TEI1 (transmit end 1) SCI channel 1 Reserved — Vector Address* Vector Number Advanced Mode Normal Mode IPR Priority 52 H'00D0 to H'00D3 H'0068 to H'0069 IPRB3 High 53 H'00D4 to H'00D7 H'006A to H'006B 54 H'00D8 to H'00DB H'006C to H'006D 55 H'00DC to H'00DF H'006E to H'006F 56 H'00E0 to H'00E3 H'0070 to H'0071 57 H'00E4 to H'00E7 H'0072 to H'0073 58 H'00E8 to H'00EB H'0074 to H'0075 59 H'00EC to H'00EF H'0076 to H'0077 60 H'00F0 to H'00F3 H'0078 to H'0079 61 H'00F4 to H'00F7 H'007A to H'007B 62 H'00F8 to H'00FB H'007C to H'007D 63 H'00FC to H'00FF H'007E to H'007F IPRB2 — Low Note: * Lower 16 bits of the address. Rev. 2.00 Sep 20, 2005 page 99 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.4 Interrupt Operation 5.4.1 Interrupt Handling Process The H8/3024 Group handles interrupts differently depending on the setting of the UE bit. When UE = 1, interrupts are controlled by the I bit. When UE = 0, interrupts are controlled by the I and UI bits. Table 5.4 indicates how interrupts are handled for all setting combinations of the UE, I, and UI bits. NMI interrupts are always accepted except in the reset and hardware standby states*. IRQ interrupts and interrupts from the on-chip supporting modules have their own enable bits. Interrupt requests are ignored when the enable bits are cleared to 0. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.9, NMI Input Disabling Conditions. Table 5.4 UE, I, and UI Bit Settings and Interrupt Handling SYSCR CCR UE I UI Description 1 0 — All interrupts are accepted. Interrupts with priority level 1 have higher priority. 1 — No interrupts are accepted except NMI. 0 — All interrupts are accepted. Interrupts with priority level 1 have higher priority. 1 0 NMI and interrupts with priority level 1 are accepted. 1 No interrupts are accepted except NMI. 0 UE = 1: Interrupts IRQ0 to IRQ5 and interrupts from the on-chip supporting modules can all be masked by the I bit in the CPU’s CCR. Interrupts are masked when the I bit is set to 1, and unmasked when the I bit is cleared to 0. Interrupts with priority level 1 have higher priority. Figure 5.4 is a flowchart showing how interrupts are accepted when UE = 1. Rev. 2.00 Sep 20, 2005 page 100 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Program execution state No Interrupt requested? Yes Yes NMI No No Pending Priority level 1? Yes IRQ 0 No Yes IRQ 1 IRQ 0 No Yes No IRQ 1 Yes No Yes TEI1 TEI1 Yes Yes No I=0 Yes Save PC and CCR I ←1 Read vector address Branch to interrupt service routine Figure 5.4 Process Up to Interrupt Acceptance when UE = 1 Rev. 2.00 Sep 20, 2005 page 101 of 800 REJ09B0260-0200 Section 5 Interrupt Controller • If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. • When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. • The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted. If the I bit is set to 1, only NMI is accepted; other interrupt requests are held pending. • When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. • In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. • Next the I bit is set to 1 in CCR, masking all interrupts except NMI. • The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address. UE = 0: The I and UI bits in the CPU’s CCR and the IPR bits enable three-level masking of IRQ0 to IRQ5 interrupts and interrupts from the on-chip supporting modules. • Interrupt requests with priority level 0 are masked when the I bit is set to 1, and are unmasked when the I bit is cleared to 0. • Interrupt requests with priority level 1 are masked when the I and UI bits are both set to 1, and are unmasked when either the I bit or the UI bit is cleared to 0. For example, if the interrupt enable bits of all interrupt requests are set to 1, IPRA is set to H'20, and IPRB is set to H'00 (giving IRQ2 and IRQ3 interrupt requests priority over other interrupts), interrupts are masked as follows: a. If I = 0, all interrupts are unmasked (priority order: NMI > IRQ2 > IRQ3 > IRQ0 …). b. If I = 1 and UI = 0, only NMI, IRQ2, and IRQ3 are unmasked. c. If I = 1 and UI = 1, all interrupts are masked except NMI. Figure 5.5 shows the transitions among the above states. Rev. 2.00 Sep 20, 2005 page 102 of 800 REJ09B0260-0200 Section 5 Interrupt Controller I←0 a. All interrupts are unmasked I←0 b. Only NMI, IRQ 2 , and IRQ 3 are unmasked I ← 1, UI ← 0 Exception handling, or I ← 1, UI ← 1 UI ← 0 Exception handling, or UI ← 1 c. All interrupts are masked except NMI Figure 5.5 Interrupt Masking State Transitions (Example) Figure 5.6 is a flowchart showing how interrupts are accepted when UE = 0. • If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. • When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. • The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted regardless of its IPR setting, and regardless of the UI bit. If the I bit is set to 1 and the UI bit is cleared to 0, only interrupts with priority level 1 are accepted; interrupt requests with priority level 0 are held pending. If the I bit and UI bit are both set to 1, all other interrupt requests are held pending. • When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. • In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. • The I and UI bits are set to 1 in CCR, masking all interrupts except NMI. • The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address. Rev. 2.00 Sep 20, 2005 page 103 of 800 REJ09B0260-0200 Section 5 Interrupt Controller Program execution state No Interrupt requested? Yes Yes NMI No No Pending Priority level 1? Yes IRQ 0 No IRQ 0 Yes IRQ 1 No Yes No IRQ 1 Yes No Yes TEI1 TEI1 Yes Yes No I=0 No I=0 Yes Yes No UI = 0 Yes Save PC and CCR I ← 1, UI ← 1 Read vector address Branch to interrupt service routine Figure 5.6 Process Up to Interrupt Acceptance when UE = 0 Rev. 2.00 Sep 20, 2005 page 104 of 800 REJ09B0260-0200 (2) (1) (4) High (3) Instruction Internal prefetch processing (8) (7) (10) (9) (12) (11) Vector fetch (14) (13) (6), (8) PC and CCR saved to stack (9), (11) Vector address (10), (12) Starting address of interrupt service routine (contents of vector address) (13) Starting address of interrupt service routine; (13) = (10), (12) (14) First instruction of interrupt service routine (6) (5) Stack Prefetch of interrupt Internal service routine processing instruction Note: Mode 2, with program code and stack in external memory area accessed in two states via 16-bit bus. Instruction prefetch address (not executed; return address, same as PC contents) (2), (4) Instruction code (not executed) (3) Instruction prefetch address (not executed) (5) SP Ð 2 (7) SP Ð 4 (1) D15 to D8 HWR , LWR RD Address bus Interrupt request signal φ Interrupt level decision and wait for end of instruction 5.4.2 Interrupt accepted Section 5 Interrupt Controller Interrupt Exception Handling Sequence Figure 5.7 shows the interrupt exception handling sequence in mode 2 when the program code and stack are in an external memory area accessed in two states via a 16-bit bus. Figure 5.7 Interrupt Exception Handling Sequence Rev. 2.00 Sep 20, 2005 page 105 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.4.3 Interrupt Response Time Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until the first instruction of the interrupt service routine is executed. Table 5.5 Interrupt Response Time External Memory No. On-Chip Memory Item *1 8-Bit Bus 2 States 3 States 2 States 3 States 2*1 2 2 Maximum number of states until end of current instruction 1 to 23 1 to 27 1 to 31*4 1 to 23 1 to 25*4 3 Saving PC and CCR to stack 4 8 12*4 4 6*4 4 Vector fetch 4 8 4 4 8 12*4 12*4 4 6*4 6*4 4 4 4 4 4 19 to 41 31 to 57 43 to 73 19 to 41 25 to 49 Instruction fetch 6 Internal processing*3 Total 2 *1 Interrupt priority decision 5 2 *1 1 *2 2 *1 16-Bit Bus Notes: 1. 1 state for internal interrupts. 2. Prefetch after the interrupt is accepted and prefetch of the first instruction in the interrupt service routine. 3. Internal processing after the interrupt is accepted and internal processing after vector fetch. 4. The number of states increases if wait states are inserted in external memory access. Rev. 2.00 Sep 20, 2005 page 106 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.5 Usage Notes 5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction When an instruction clears an interrupt enable bit to 0 to disable the interrupt, the interrupt is not disabled until after execution of the instruction is completed. If an interrupt occurs while a BCLR, MOV, or other instruction is being executed to clear its interrupt enable bit to 0, at the instant when execution of the instruction ends the interrupt is still enabled, so its interrupt exception handling is carried out. If a higher-priority interrupt is also requested, however, interrupt exception handling for the higher-priority interrupt is carried out, and the lower-priority interrupt is ignored. This also applies to the clearing of an interrupt flag to 0. Figure 5.8 shows an example in which an IMIEA bit is cleared to 0 in the 16-bit timer’s TISRA register. TISRA write cycle by CPU IMIA exception handling φ Internal address bus TISRA address Internal write signal IMIEA IMIA IMFA interrupt signal Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction This type of contention will not occur if the interrupt is masked when the interrupt enable bit or flag is cleared to 0. Rev. 2.00 Sep 20, 2005 page 107 of 800 REJ09B0260-0200 Section 5 Interrupt Controller 5.5.2 Instructions that Inhibit Interrupts The LDC, ANDC, ORC, and XORC instructions inhibit interrupts. When an interrupt occurs, after determining the interrupt priority, the interrupt controller requests a CPU interrupt. If the CPU is currently executing one of these interrupt-inhibiting instructions, however, when the instruction is completed the CPU always continues by executing the next instruction. 5.5.3 Interrupts during EEPMOV Instruction Execution The EEPMOV.B and EEPMOV.W instructions differ in their reaction to interrupt requests. When the EEPMOV.B instruction is executing a transfer, no interrupts are accepted until the transfer is completed, not even NMI. When the EEPMOV.W instruction is executing a transfer, interrupt requests other than NMI are not accepted until the transfer is completed. If NMI is requested, NMI exception handling starts at a transfer cycle boundary. The PC value saved on the stack is the address of the next instruction. Programs should be coded as follows to allow for NMI interrupts during EEPMOV.W execution: L1: EEPMOV.W MOV.W R4,R4 BNE L1 Rev. 2.00 Sep 20, 2005 page 108 of 800 REJ09B0260-0200 Section 6 Bus Controller Section 6 Bus Controller 6.1 Overview The H8/3024 Group has an on-chip bus controller (BSC) that manages the external address space divided into eight areas. The bus specifications, such as bus width and number of access states, can be set independently for each area, enabling multiple memories to be connected easily. The bus controller also has a bus arbitration function that controls the operation of the internal bus masters—the CPU can release the bus to an external device. 6.1.1 Features The features of the bus controller are listed below. • Manages external address space in area units Manages the external space as eight areas (0 to 7) of 128 kbytes in 1M-byte modes, or 2 Mbytes in 16-Mbyte modes Bus specifications can be set independently for each area • Basic bus interface Chip select (CS0 to CS7) can be output for areas 0 to 7 8-bit access or 16-bit access can be selected for each area Two-state access or three-state access can be selected for each area Program wait states can be inserted for each area Pin wait insertion capability is provided • Idle cycle insertion An idle cycle can be inserted in case of an external read cycle between different areas An idle cycle can be inserted when an external read cycle is immediately followed by an external write cycle • Bus arbitration function A built-in bus arbiter grants the bus right to the CPU, or an external bus master • Other features Choice of two address update modes Rev. 2.00 Sep 20, 2005 page 109 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.1.2 Block Diagram Figure 6.1 shows a block diagram of the bus controller. CS0 to CS7 ABWCR ASTCR BCR Area decoder Chip select control signals CSCR Internal signals ADRCR Bus mode control signal Bus size control signal Bus control circuit Access state control signal Internal data bus Internal address bus Wait state controller WAIT WCRH WCRL Internal signals CPU bus request signal CPU bus acknowledge signal BRCR Bus arbiter BACK BREQ Legend: ABWCR: ASTCR: WCRH: WCRL: BRCR: CSCR: ADRCR: BCR: Bus width control register Access state control register Wait control register H Wait control register L Bus release control register Chip select control register Address control register Bus control register Figure 6.1 Block Diagram of Bus Controller Rev. 2.00 Sep 20, 2005 page 110 of 800 REJ09B0260-0200 Wait request signal Section 6 Bus Controller 6.1.3 Pin Configuration Table 6.1 summarizes the input/output pins of the bus controller. Table 6.1 Bus Controller Pins Name Abbreviation I/O Function Output Strobe signals selecting areas 0 to 7 Output Strobe signal indicating valid address output on the address bus Address strobe CS0 to CS7 AS Read RD Output Strobe signal indicating reading from the external address space High write HWR Output Strobe signal indicating writing to the external address space, with valid data on the upper data bus (D15 to D8) Low write LWR Output Strobe signal indicating writing to the external address space, with valid data on the lower data bus (D7 to D0) Wait WAIT Input Wait request signal for access to external three-state access areas Bus request BREQ Input Request signal for releasing the bus to an external device Bus acknowledge BACK Output Acknowledge signal indicating release of the bus to an external device Chip select 0 to 7 Rev. 2.00 Sep 20, 2005 page 111 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.1.4 Register Configuration Table 6.2 summarizes the bus controller’s registers. Table 6.2 Bus Controller Registers Address*1 Name Abbreviation R/W Initial Value H'EE020 Bus width control register ABWCR R/W H'FF* H'EE021 Access state control register ASTCR R/W H'FF H'EE022 Wait control register H WCRH R/W H'FF H'EE023 Wait control register L WCRL R/W H'FF H'EE013 Bus release control register BRCR R/W H'FE*3 H'EE01F Chip select control register CSCR R/W H'0F H'EE01E Address control register ADRCR R/W H'FF H'EE024 Bus control register BCR R/W H'C6 2 Notes: 1. Lower 20 bits of the address in advanced mode. 2. In modes 2 and 4, the initial value is H'00. 3. In modes 3 and 4, the initial value is H'EE. 6.2 Register Descriptions 6.2.1 Bus Width Control Register (ABWCR) ABWCR is an 8-bit readable/writable register that selects 8-bit or 16-bit access for each area. 7 Bit ABW7 Modes Initial value 1 1, 3, 5, 6, and 7 Read/Write R/W Modes 2 and 4 Initial value 0 Read/Write R/W 6 5 4 3 2 1 0 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W When ABWCR contains H'FF (selecting 8-bit access for all areas), the chip operates in 8-bit bus mode: the upper data bus (D15 to D8) is valid, and port 4 is an input/output port. When at least one bit is cleared to 0 in ABWCR, the chip operates in 16-bit bus mode with a 16-bit data bus (D15 to D0). In modes 1, 3, 5, 6, and 7, ABWCR is initialized to H'FF by a reset and in hardware standby mode. In modes 2 and 4, ABWCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Rev. 2.00 Sep 20, 2005 page 112 of 800 REJ09B0260-0200 Section 6 Bus Controller Bits 7 to 0—Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select 8-bit access or 16-bit access for the corresponding areas. Bits 7 to 0 ABW7 to ABW0 Description 0 Areas 7 to 0 are 16-bit access areas 1 Areas 7 to 0 are 8-bit access areas ABWCR specifies the data bus width of external memory areas. The data bus width of on-chip memory and registers is fixed, and does not depend on ABWCR settings. These settings are therefore invalid in the single-chip modes (modes 6 and 7). 6.2.2 Access State Control Register (ASTCR) ASTCR is an 8-bit readable/writable register that selects whether each area is accessed in two states or three states. 7 6 5 4 3 2 1 0 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W Bit R/W R/W Bits selecting number of states for access to each area ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0—Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is accessed in two or three states. Bits 7 to 0 AST7 to AST0 Description 0 Areas 7 to 0 are accessed in two states 1 Areas 7 to 0 are accessed in three states (Initial value) ASTCR specifies the number of states in which external areas are accessed. On-chip memory and registers are accessed in a fixed number of states that does not depend on ASTCR settings. These settings are therefore meaningless in the single-chip modes (modes 6 and 7). Rev. 2.00 Sep 20, 2005 page 113 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.2.3 Wait Control Registers H and L (WCRH, WCRL) WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait states for each area. On-chip memory and registers are accessed in a fixed number of states that does not depend on WCRH/WCRL settings. WCRH and WCRL are initialized to H'FF by a reset and in hardware standby mode. They are not initialized in software standby mode. WCRH 7 6 5 4 3 2 1 0 W71 W70 W61 W60 W51 W50 W41 W40 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W Bit R/W R/W Bits 7 and 6—Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set to 1. Bit 7 W71 Bit 6 W70 Description 0 0 Program wait not inserted when external space area 7 is accessed 1 1 program wait state inserted when external space area 7 is accessed 0 2 program wait states inserted when external space area 7 is accessed 1 3 program wait states inserted when external space area 7 is accessed (Initial value) 1 Rev. 2.00 Sep 20, 2005 page 114 of 800 REJ09B0260-0200 Section 6 Bus Controller Bits 5 and 4—Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set to 1. Bit 5 W61 Bit 4 W60 Description 0 0 Program wait not inserted when external space area 6 is accessed 1 1 program wait state inserted when external space area 6 is accessed 0 2 program wait states inserted when external space area 6 is accessed 1 3 program wait states inserted when external space area 6 is accessed (Initial value) 1 Bits 3 and 2—Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set to 1. Bit 3 W51 Bit 2 W50 Description 0 0 Program wait not inserted when external space area 5 is accessed 1 1 program wait state inserted when external space area 5 is accessed 0 2 program wait states inserted when external space area 5 is accessed 1 3 program wait states inserted when external space area 5 is accessed (Initial value) 1 Bits 1 and 0—Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set to 1. Bit 1 W41 Bit 0 W40 Description 0 0 Program wait not inserted when external space area 4 is accessed 1 1 program wait state inserted when external space area 4 is accessed 0 2 program wait states inserted when external space area 4 is accessed 1 3 program wait states inserted when external space area 4 is accessed (Initial value) 1 Rev. 2.00 Sep 20, 2005 page 115 of 800 REJ09B0260-0200 Section 6 Bus Controller WCRL 7 6 5 4 3 2 1 0 W31 W30 W21 W20 W11 W10 W01 W00 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W Bit R/W R/W Bits 7 and 6—Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set to 1. Bit 7 W31 Bit 6 W30 0 0 Program wait not inserted when external space area 3 is accessed 1 1 program wait state inserted when external space area 3 is accessed 0 2 program wait states inserted when external space area 3 is accessed 1 3 program wait states inserted when external space area 3 is accessed (Initial value) 1 Description Bits 5 and 4—Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set to 1. Bit 5 W21 Bit 4 W20 Description 0 0 Program wait not inserted when external space area 2 is accessed 1 1 program wait state inserted when external space area 2 is accessed 0 2 program wait states inserted when external space area 2 is accessed 1 3 program wait states inserted when external space area 2 is accessed (Initial value) 1 Rev. 2.00 Sep 20, 2005 page 116 of 800 REJ09B0260-0200 Section 6 Bus Controller Bits 3 and 2—Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set to 1. Bit 3 W11 Bit 2 W10 Description 0 0 Program wait not inserted when external space area 1 is accessed 1 1 program wait state inserted when external space area 1 is accessed 0 2 program wait states inserted when external space area 1 is accessed 1 3 program wait states inserted when external space area 1 is accessed (Initial value) 1 Bits 1 and 0—Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set to 1. Bit 1 W01 Bit 0 W00 Description 0 0 Program wait not inserted when external space area 0 is accessed 1 1 program wait state inserted when external space area 0 is accessed 0 2 program wait states inserted when external space area 0 is accessed 1 3 program wait states inserted when external space area 0 is accessed (Initial value) 1 Rev. 2.00 Sep 20, 2005 page 117 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.2.4 Bus Release Control Register (BRCR) BRCR is an 8-bit readable/writable register that enables address output on bus lines A23 to A20 and enables or disables release of the bus to an external device. Bit Modes 1, 2, 6, and 7 7 6 5 4 3 2 1 0 A23E A22E A21E A20E — — — BRLE 1 1 1 1 1 1 1 0 Read/Write — — — — — — — R/W 1 1 0 1 1 1 0 R/W R/W — — — — R/W Initial value Modes Initial value 1 3 and 4 Read/Write R/W Mode 5 Initial value 1 1 1 1 1 1 0 R/W R/W R/W — — — R/W 1 Read/Write R/W Reserved bits Address 23 to 20 enable These bits enable PA7 to PA4 to be used for A23 to A20 address output Bus release enable Enables or disables release of the bus to an external device BRCR is initialized to H'FE in modes 1, 2, 5, 6, and 7, and to H'EE in modes 3 and 4, by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Address 23 Enable (A23E): Enables PA4 to be used as the A23 address output pin. Writing 0 in this bit enables A23 output from PA4. In modes other than 3, 4, and 5, this bit cannot be modified and PA4 has its ordinary port functions. Bit 7 A23E Description 0 PA4 is the A23 address output pin 1 PA4 is an input/output pin Rev. 2.00 Sep 20, 2005 page 118 of 800 REJ09B0260-0200 (Initial value) Section 6 Bus Controller Bit 6—Address 22 Enable (A22E): Enables PA5 to be used as the A22 address output pin. Writing 0 in this bit enables A22 output from PA5. In modes other than 3, 4, and 5, this bit cannot be modified and PA5 has its ordinary port functions. Bit 6 A22E Description 0 PA5 is the A22 address output pin 1 PA5 is an input/output pin (Initial value) Bit 5—Address 21 Enable (A21E): Enables PA6 to be used as the A21 address output pin. Writing 0 in this bit enables A21 output from PA6. In modes other than 3, 4, and 5, this bit cannot be modified and PA6 has its ordinary port functions. Bit 5 A21E Description 0 PA6 is the A21 address output pin 1 PA6 is an input/output pin (Initial value) Bit 4—Address 20 Enable (A20E): Enables PA7 to be used as the A20 address output pin. Writing 0 in this bit enables A20 output from PA7. This bit can only be modified in mode 5. Bit 4 A20E Description 0 PA7 is the A20 address output pin (Initial value when in mode 3 or 4) 1 PA7 is an input/output pin (Initial value when in mode 1, 2, 5, 6 or 7) Bits 3 to 1—Reserved: These bits cannot be modified and are always read as 1. Bit 0—Bus Release Enable (BRLE): Enables or disables release of the bus to an external device. Bit 0 BRLE 0 1 Description The bus cannot be released to an external device BREQ and BACK can be used as input/output pins (Initial value) The bus can be released to an external device Rev. 2.00 Sep 20, 2005 page 119 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.2.5 Bus Control Register (BCR) 7 6 5 4 3 2 1 0 ICIS1 ICIS0 — — — — RDEA WAITE Initial value 1 1 0* 0* 0* 1 1 0 Read/Write R/W R/W — — — — R/W Bit R/W Note: * 1 must not be written in bits 5 to 3. BCR is an 8-bit readable/writable register that enables or disables idle cycle insertion, selects the area division unit, and enables or disables WAIT pin input. BCR is initialized to H'C6 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Idle Cycle Insertion 1 (ICIS1): Selects whether one idle cycle state is to be inserted between bus cycles in case of consecutive external read cycles for different areas. Bit 7 ICIS1 Description 0 No idle cycle inserted in case of consecutive external read cycles for different areas 1 Idle cycle inserted in case of consecutive external read cycles for different areas (Initial value) Bit 6—Idle Cycle Insertion 0 (ICIS0): Selects whether one idle cycle state is to be inserted between bus cycles in case of consecutive external read and write cycles. Bit 6 ICIS0 Description 0 No idle cycle inserted in case of consecutive external read and write cycles 1 Idle cycle inserted in case of consecutive external read and write cycles (Initial value) Bits 5 to 3—Reserved (must not be set to 1): These bits can be read and written, but must not be set to 1. Normal operation cannot be guaranteed if 1 is written in these bits. Bit 2—Reserved: Read-only bit, always read as 1. Rev. 2.00 Sep 20, 2005 page 120 of 800 REJ09B0260-0200 Section 6 Bus Controller Bit 1—Area Division Unit Select (RDEA): Selects the memory map area division units. This bit is valid in modes 3, 4, and 5, and is invalid in modes 1, 2, 6, and 7. Bit 1 RDEA Description 0 Area divisions are as follows: 1 Area 0: 2 Mbytes Area 4: 1.93 Mbytes Area 1: 2 Mbytes Area 5: 4 kbytes Area 2: 8 Mbytes Area 6: 23.75 kbytes (19.75 kbytes)* Area 3: 2 Mbytes Area 7: 22 bytes Areas 0 to 7 are the same size (2 Mbytes) (Initial value) Note: * Division in the H8/3024F-ZTAT and H8/3024 mask ROM version. Bit 0—WAIT Pin Enable (WAITE): Enables or disables wait insertion by means of the WAIT pin. Bit 0 WAITE Description 0 WAIT pin wait input is disabled, and the WAIT pin can be used as an input/output port 1 (Initial value) WAIT pin wait input is enabled Rev. 2.00 Sep 20, 2005 page 121 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.2.6 Chip Select Control Register (CSCR) CSCR is an 8-bit readable/writable register that enables or disables output of chip select signals (CS7 to CS4). If output of a chip select signal CS7 to CS4 is enabled by a setting in this register, the corresponding pin functions a chip select signal (CS7 to CS4) output regardless of any other settings. CSCR cannot be modified in single-chip mode. Bit 7 6 5 4 3 2 1 0 CS7E CS6E CS5E CS4E — — — — Initial value 0 0 0 0 1 1 1 1 Read/Write R/W R/W R/W — — — — R/W Chip select 7 to 4 enable These bits enable or disable chip select signal output Reserved bits CSCR is initialized to H'0F by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4—Chip Select 7 to 4 Enable (CS7E to CS4E): These bits enable or disable output of the corresponding chip select signal. Bit n CSnE Description 0 Output of chip select signal 1 CSn is disabled Output of chip select signal CSn is enabled Note: n = 7 to 4 Bits 3 to 0—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 122 of 800 REJ09B0260-0200 (Initial value) Section 6 Bus Controller 6.2.7 Address Control Register (ADRCR) ADRCR is an 8-bit readable/writable register that selects either address update mode 1 or address update mode 2 as the address output method. Bit 7 6 5 4 3 2 1 0 — — — — — — — ADRCTL Initial value 1 1 1 1 1 1 1 1 Read/Write — — — — — — — Reserved bits R/W Address control Selects address update mode 1 or address update mode 2 ADRCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 1—Reserved: Read-only bits, always read as 1. Bit 0—Address Control (ADRCTL): Selects the address output method. Bit 0 ADRCTL Description 0 Address update mode 2 is selected 1 Address update mode 1 is selected (Initial value) Rev. 2.00 Sep 20, 2005 page 123 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.3 Operation 6.3.1 Area Division The external address space is divided into areas 0 to 7. Each area has a size of 128 kbytes in the 1Mbyte modes, or 2 Mbytes in the 16-Mbyte modes. Figure 6.2 shows a general view of the memory map. H'00000 H'000000 Area 0 (128 kbytes) H'1FFFF Area 0 (2 Mbytes) H'1FFFFF H'20000 H'200000 Area 1 (128 kbytes) H'3FFFF Area 1 (2 Mbytes) H'3FFFFF H'40000 H'400000 Area 2 (128 kbytes) H'5FFFF Area 2 (2 Mbytes) H'5FFFFF H'60000 H'600000 Area 3 (128 kbytes) H'7FFFF Area 3 (2 Mbytes) H'7FFFFF H'80000 H'800000 Area 4 (128 kbytes) H'9FFFF Area 4 (2 Mbytes) H'9FFFFF H'A0000 H'A00000 Area 5 (128 kbytes) H'BFFFF H'C0000 H'DFFFF H'E0000 Area 5 (2 Mbytes) H'BFFFFF H'C00000 Area 6 (128 kbytes) Area 7 (128 Mbytes) H'FFFFF H'DFFFFF H'E00000 Area 6 (2 Mbytes) Area 7 (2 Mbytes) H'FFFFFF (a) 1-Mbyte modes (modes 1 and 2) (b) 16-Mbyte modes (modes 3 to 5) Figure 6.2 Access Area Map for Each Operating Mode Chip select signals (CS0 to CS7) can be output for areas 0 to 7. The bus specifications for each area are selected in ABWCR, ASTCR, WCRH, and WCRL. In 16-Mbyte mode, the area division units can be selected with the RDEA bit in BCR. Rev. 2.00 Sep 20, 2005 page 124 of 800 REJ09B0260-0200 Section 6 Bus Controller Area 0 2 Mbytes Area 0 2 Mbytes Area 1 2 Mbytes Area 1 2 Mbytes 2 Mbytes H'000000 H'1FFFFF 2 Mbytes H'200000 H'3FFFFF H'5FFFFF H'600000 Area 2 8 Mbytes 2 Mbytes Area 2 2 Mbytes 2 Mbytes H'400000 Area 3 2 Mbytes H'7FFFFF 2 Mbytes H'800000 Area 4 2 Mbytes H'9FFFFF 2 Mbytes H'A00000 Area 5 2 Mbytes H'DFFFFF H'E00000 Area 6 2 Mbytes Area 3 2 Mbytes Area 7 1.93 Mbytes Area 4 1.93 Mbytes Internal I/O registers (1) Internal I/O registers (1) 2 Mbytes H'BFFFFF H'C00000 H'FEE000 H'FEE0FF H'FEE100 Reserved 39.75 kbytes H'FF7FFF H'FF8000 Area 6 23.75 kbytes On-chip RAM 4 kbytes On-chip RAM 4 kbytes* Internal I/O registers (2) Internal I/O registers (2) Area 7 22 bytes Area 7 22 bytes (A) Memory map when RDEA = 1 (b) Memory map when RDEA = 0 H'FFEF1F H'FFEF20 2 Mbytes Area 7 67.5 kbytes Absolute address 16 bits Area 5 4 kbytes H'FF8FFF H'FF9000 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF Absolute address 8 bits H'FFFEFF H'FFFF00 Note: * Area 6 when the RAME bit is cleared. Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3024F-ZTAT, H8/3024 Mask ROM Verion) (1) Rev. 2.00 Sep 20, 2005 page 125 of 800 REJ09B0260-0200 Section 6 Bus Controller Area 0 2 Mbytes Area 0 2 Mbytes Area 1 2 Mbytes Area 1 2 Mbytes 2 Mbytes H'000000 H'1FFFFF 2 Mbytes H'200000 H'3FFFFF Area 2 2 Mbytes H'5FFFFF 2 Mbytes H'400000 Area 2 8 Mbytes 2 Mbytes H'600000 Area 3 2 Mbytes H'7FFFFF 2 Mbytes H'800000 Area 4 2 Mbytes 2 Mbytes H'9FFFFF H'A00000 Area 5 2 Mbytes H'DFFFFF H'E00000 Area 6 2 Mbytes Area 3 2 Mbytes Area 7 1.93 Mbytes Area 4 1.93 Mbytes Internal I/O registers (1) Internal I/O registers (1) 2 Mbytes H'BFFFFF H'C00000 H'FEE000 H'FEE0FF H'FEE100 Reserved 39.75 kbytes H'FF7FFF H'FF8000 Area 6 19.75 kbytes On-chip RAM 8 kbytes On-chip RAM 8 kbytes* Internal I/O registers (2) Internal I/O registers (2) Area 7 22 bytes Area 7 22 bytes (A) Memory map when RDEA = 1 (b) Memory map when RDEA = 0 H'FFDF1F H'FFDF20 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF Note: * Area 6 when the RAME bit is cleared. Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3026F-ZTAT, H8/3026 Mask ROM Verion) (2) Rev. 2.00 Sep 20, 2005 page 126 of 800 REJ09B0260-0200 Absolute address 8 bits H'FFFEFF H'FFFF00 2 Mbytes Area 7 63.5 kbytes Absolute address 16 bits Area 5 4 kbytes H'FF8FFF H'FF9000 Section 6 Bus Controller 6.3.2 Bus Specifications The external space bus specifications consist of three elements: bus width, number of access states, and number of program wait states. The bus width and number of access states for on-chip memory and registers are fixed, and are not affected by the bus controller. Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected functions as a16-bit access space. If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16bit access, 16-bit bus mode is set. Number of Access States: Two or three access states can be selected with ASTCR. An area for which two-state access is selected functions as a two-state access space, and an area for which three-state access is selected functions as a three-state access space. When two-state access space is designated, wait insertion is disabled. Number of Program Wait States: When three-state access space is designated in ASTCR, the number of program wait states to be inserted automatically is selected with WCRH and WCRL. From 0 to 3 program wait states can be selected. Table 6.3 shows the bus specifications for each basic bus interface area. Rev. 2.00 Sep 20, 2005 page 127 of 800 REJ09B0260-0200 Section 6 Bus Controller Table 6.3 Bus Specifications for Each Area (Basic Bus Interface) ABWCR ASTCR WCRH/WCRL Bus Specifications (Basic Bus Interface) ABWn ASTn Wn1 Wn0 Bus Width Access States Program Wait States 0 0 — — 16 2 0 1 0 0 3 0 1 1 1 1 0 2 1 3 0 — — 1 0 0 8 1 1 2 0 3 0 1 0 2 1 3 Note: n = 0 to 7 6.3.3 Memory Interfaces As its memory interface, the H8/3024 Group has only a basic bus interface that allows direct connection of ROM, SRAM, and so on. It is not possible to select a DRAM interface that allows direct connection of DRAM, or a burst ROM interface that allows direct connection of burst ROM. Rev. 2.00 Sep 20, 2005 page 128 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.3.4 Chip Select Signals For each of areas 0 to 7, the H8/3024 Group can output a chip select signal (CS0 to CS7) that goes low when the corresponding area is selected in expanded mode. Figure 6.4 shows the output timing of a CSn signal. Output of CS0 to CS3: Output of CS0 to CS3 is enabled or disabled in the data direction register (DDR) of the corresponding port. In the expanded modes with on-chip ROM disabled, a reset leaves pin CS0 in the output state and pins CS1 to CS3 in the input state. To output chip select signals CS1 to CS3, the corresponding DDR bits must be set to 1. In the expanded modes with on-chip ROM enabled, a reset leaves pins CS0 to CS3 in the input state. To output chip select signals CS0 to CS3, the corresponding DDR bits must be set to 1. For details, see section 7, I/O Ports. Output of CS4 to CS7: Output of CS4 to CS7 is enabled or disabled in the chip select control register (CSCR). A reset leaves pins CS4 to CS7 in the input state. To output chip select signals CS4 to CS7, the corresponding CSCR bits must be set to 1. For details, see section 7, I/O Ports. φ Address bus External address in area n CSn Figure 6.4 CSn Signal Output Timing (n = 0 to 7) When the on-chip ROM, on-chip RAM, and internal I/O registers are accessed, CS0 to CS7 remain high. The CSn signals are decoded from the address signals. They can be used as chip select signals for SRAM and other devices. Rev. 2.00 Sep 20, 2005 page 129 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.3.5 Address Output Method The H8/3024 Group provides a choice of two address update methods: either the same method as in the previous H8/300H Series (address update mode 1), or a method in which address updating is restricted to external space accesses (address update mode 2). Figure 6.5 shows examples of address output in these two update modes. On-chip memory cycle External read cycle On-chip memory cycle External read cycle On-chip memory cycle Address bus (Address update mode 1) Address bus (Address update mode 2) RD Figure 6.5 Sample Address Output in Each Address Update Mode (Basic Bus Interface, 3-State Space) Address Update Mode 1: Address update mode 1 is compatible with the previous H8/300H Series. Addresses are always updated between bus cycles. Address Update Mode 2: In address update mode 2, address updating is performed only in external space accesses. In this mode, the address can be retained between an external space read cycle and an instruction fetch cycle (on-chip memory) by placing the program in on-chip memory. Address update mode 2 is therefore useful when connecting a device that requires address hold time with respect to the rise of the RD strobe. Switching between address update modes 1 and 2 is performed by means of the ADRCTL bit in ADRCR. The initial value of ADRCR is the address update mode 1 setting, providing compatibility with the previous H8/300H Series. Rev. 2.00 Sep 20, 2005 page 130 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.4 Basic Bus Interface 6.4.1 Overview The basic bus interface enables direct connection of ROM, SRAM, and so on. The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL (see table 6.3). 6.4.2 Data Size and Data Alignment Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications for the area being accessed (8-bit access area or 16-bit access area) and the data size. 8-Bit Access Areas: Figure 6.6 illustrates data alignment control for 8-bit access space. With 8bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte: a word access is performed as two byte accesses, and a longword access, as four byte accesses. Upper data bus Lower data bus D15 D8 D7 D0 Byte size Word size 1st bus cycle 2nd bus cycle 1st bus cycle Longword size 2nd bus cycle 3rd bus cycle 4th bus cycle Figure 6.6 Access Sizes and Data Alignment Control (8-Bit Access Area) Rev. 2.00 Sep 20, 2005 page 131 of 800 REJ09B0260-0200 Section 6 Bus Controller 16-Bit Access Areas: Figure 6.7 illustrates data alignment control for 16-bit access areas. With 16-bit access areas, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be accessed at one time is one byte or one word, and a longword access is executed as two word accesses. In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd address. Upper data bus Lower data bus D15 D8 D7 D0 Byte size • Even address Byte size • Odd address Word size Longword size 1st bus cycle 2nd bus cycle Figure 6.7 Access Sizes and Data Alignment Control (16-Bit Access Area) 6.4.3 Valid Strobes Table 6.4 shows the data buses used, and the valid strobes, for the access spaces. In a read, the RD signal is valid for both the upper and the lower half of the data bus. In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half. Rev. 2.00 Sep 20, 2005 page 132 of 800 REJ09B0260-0200 Section 6 Bus Controller Table 6.4 Data Buses Used and Valid Strobes Access Size Read/ Write Address 8-bit access area Byte Read — Write — 16-bit access area Byte Read Even Area Valid Strobe RD HWR RD Odd Write Even Odd Word Read — Write — HWR LWR RD HWR, LWR Upper Data Bus (D15 to D8) Lower Data Bus (D7 to D0) Valid Invalid Undetermined data Valid Invalid Invalid Valid Valid Undetermined data Undetermined data Valid Valid Valid Valid Valid Notes: 1. Undetermined data means that unpredictable data is output. 2. Invalid means that the bus is in the input state and the input is ignored. 6.4.4 Memory Areas The initial state of each area is basic bus interface, three-state access space. The initial bus width is selected according to the operating mode. Area 0: Area 0 includes on-chip ROM, and in ROM-disabled expansion mode, all of area 0 is external space. In ROM-enabled expansion mode, the space excluding on-chip ROM is external space. When area 0 external space is accessed, the CS0 signal can be output. The size of area 0 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. Areas 1 to 6: In external expansion mode, areas 1 to 6 are entirely external space. When area 1 to 6 external space is accessed, the CS1 to CS6 pin signals respectively can be output. The size of areas 1 to 6 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. Area 7: Area 7 includes the on-chip RAM and registers. In external expansion mode, the space excluding the on-chip RAM and registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes external space . When area 7 external space is accessed, the CS7 signal can be output. The size of area 7 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. Rev. 2.00 Sep 20, 2005 page 133 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.4.5 Basic Bus Control Signal Timing 8-Bit, Three-State-Access Areas: Figure 6.8 shows the timing of bus control signals for an 8-bit, three-state-access area. The upper data bus (D15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states can be inserted. Bus cycle T1 T2 T3 φ Address bus External address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write access D15 to D8 D7 to D0 Valid Undetermined data Note: n = 7 to 0 Figure 6.8 Bus Control Signal Timing for 8-Bit, Three-State-Access Area Rev. 2.00 Sep 20, 2005 page 134 of 800 REJ09B0260-0200 Section 6 Bus Controller 8-Bit, Two-State-Access Areas: Figure 6.9 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper data bus (D15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states cannot be inserted. Bus cycle T2 T1 φ Address bus External address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write access D15 to D8 Valid D7 to D0 Undetermined data Note: n = 7 to 0 Figure 6.9 Bus Control Signal Timing for 8-Bit, Two-State-Access Area Rev. 2.00 Sep 20, 2005 page 135 of 800 REJ09B0260-0200 Section 6 Bus Controller 16-Bit, Three-State-Access Areas: Figures 6.10 to 6.12 show the timing of bus control signals for a 16-bit, three-state-access area. In these areas, the upper data bus (D15 to D8) is used in accesses to even addresses and the lower data bus (D7 to D0) in accesses to odd addresses. Wait states can be inserted. Bus cycle T1 T2 T3 φ Address bus Even external address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write access D15 to D8 Valid D7 to D0 Undetermined data Note: n = 7 to 0 Figure 6.10 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1) (Byte Access to Even Address) Rev. 2.00 Sep 20, 2005 page 136 of 800 REJ09B0260-0200 Section 6 Bus Controller Bus cycle T1 T2 T3 φ Address bus Odd external address in area n CSn AS RD Read access D15 to D8 Invalid D7 to D0 Valid HWR High LWR Write access D15 to D8 Undetermined data D7 to D0 Valid Note: n = 7 to 0 Figure 6.11 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2) (Byte Access to Odd Address) Rev. 2.00 Sep 20, 2005 page 137 of 800 REJ09B0260-0200 Section 6 Bus Controller Bus cycle T1 T2 T3 φ Address bus External address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Valid HWR LWR Write access D15 to D8 Valid D7 to D0 Valid Note: n = 7 to 0 Figure 6.12 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3) (Word Access) Rev. 2.00 Sep 20, 2005 page 138 of 800 REJ09B0260-0200 Section 6 Bus Controller 16-Bit, Two-State-Access Areas: Figures 6.13 to 6.15 show the timing of bus control signals for a 16-bit, two-state-access area. In these areas, the upper data bus (D15 to D8) is used in accesses to even addresses and the lower data bus (D7 to D0) in accesses to odd addresses. Wait states cannot be inserted. Bus cycle T1 T2 φ Address bus Even external address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Invalid HWR LWR High Write access D15 to D8 Valid D7 to D0 Undetermined data Note: n = 7 to 0 Figure 6.13 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1) (Byte Access to Even Address) Rev. 2.00 Sep 20, 2005 page 139 of 800 REJ09B0260-0200 Section 6 Bus Controller Bus cycle T1 T2 φ Address bus Odd external address in area n CSn AS RD Read access D15 to D8 Invalid D7 to D0 Valid HWR High LWR Write access D15 to D8 Undetermined data D7 to D0 Valid Note: n = 7 to 0 Figure 6.14 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2) (Byte Access to Odd Address) Rev. 2.00 Sep 20, 2005 page 140 of 800 REJ09B0260-0200 Section 6 Bus Controller Bus cycle T1 T2 φ Address bus External address in area n CSn AS RD Read access D15 to D8 Valid D7 to D0 Valid HWR LWR Write access D15 to D8 Valid D7 to D0 Valid Note: n = 7 to 0 Figure 6.15 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3) (Word Access) 6.4.6 Wait Control When accessing external space, the H8/3024 Group can extend the bus cycle by inserting wait states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait insertion using the WAIT pin. Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2 state and T3 state on an individual area basis in three-state access space, according to the settings of WCRH and WCRL. Rev. 2.00 Sep 20, 2005 page 141 of 800 REJ09B0260-0200 Section 6 Bus Controller Pin Wait Insertion: Setting the WAITE bit in BCR to 1 enables wait insertion by means of the WAIT pin. When external space is accessed in this state, a program wait is first inserted. If the WAIT pin is low at the falling edge of φ in the last T2 or TW state, another TW state is inserted. If the WAIT pin is held low, TW states are inserted until it goes high. This is useful when inserting four or more TW states, or when changing the number of TW states for different external devices. The WAITE bit setting applies to all areas. Figure 6.16 shows an example of the timing for insertion of one program wait state in 3-state space. T1 Inserted by program wait Inserted by WAIT pin T2 Tw Tw Tw T3 φ WAIT Address bus AS RD Read access Data bus Read data HWR, LWR Write access Data bus Note: Write data indicates the timing of WAIT pin sampling. Figure 6.16 Example of Wait State Insertion Timing Rev. 2.00 Sep 20, 2005 page 142 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.5 Idle Cycle 6.5.1 Operation When the H8/3024 Group chip accesses external space, it can insert a 1-state idle cycle (Ti) between bus cycles in the following cases: when read accesses between different areas occur consecutively, and when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, which has a long output floating time, and high-speed memory, I/O interfaces, and so on. The initial value of the ICIS1 and ICIS0 bits in BCR is 1, so that idle cycle insertion is performed in the initial state. If there are no data collisions, the ICIS bits can be cleared. Consecutive Reads between Different Areas: If consecutive reads between different areas occur while the ICIS1 bit is set to 1 in BCR, an idle cycle is inserted at the start of the second read cycle. Figure 6.17 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM, each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in bus cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted, and a data collision is prevented. Bus cycle A Bus cycle B φ T1 T2 T3 T1 Bus cycle A Bus cycle B T2 φ Address bus Address bus RD RD Data bus Data bus Data collision Long buffer-off time (a) Idle cycle not inserted T1 T2 T3 Ti T1 T2 (b) Idle cycle inserted Figure 6.17 Example of Idle Cycle Operation (ICIS1 = 1) Rev. 2.00 Sep 20, 2005 page 143 of 800 REJ09B0260-0200 Section 6 Bus Controller Write after Read: If an external write occurs after an external read while the ICIS0 bit is set to 1 in BCR, an idle cycle is inserted at the start of the write cycle. Figure 6.18 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs in bus cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented. Bus cycle A Bus cycle B φ T1 T2 T3 T1 Bus cycle A Bus cycle B T2 φ Address bus Address bus RD RD HWR HWR Data bus Data bus Long buffer-off time (a) Idle cycle not inserted T1 T2 T3 Ti T1 Data collision (b) Idle cycle inserted Figure 6.18 Example of Idle Cycle Operation (ICIS0 = 1) Rev. 2.00 Sep 20, 2005 page 144 of 800 REJ09B0260-0200 T2 Section 6 Bus Controller Usage Note: When non-insertion of an idle cycle is specified, the rise (negation) of RD and fall (assertion) of CSn may occur simultaneously. Figure 6.19 shows an example of the operation in this case. If consecutive reads to a different external area occur while the ICIS1 bit in BCR is cleared to 0, or if an external read is followed by a write cycle for a different external area while the ICIS0 bit is cleared to 0, negation of RD in the first read cycle and assertion of CSn in the following bus cycle will occur simultaneously. Depending on the output delay time of each signal, therefore, it is possible that the RD low output in the previous read cycle and the CSn low output in the following bus cycle will overlap. As long as RD and CSn do not change simultaneously, or if there is no problem even if they do, non-insertion of an idle cycle can be specified. Bus cycle A Bus cycle B φ T1 T2 T3 T1 T2 Bus cycle A Bus cycle B φ Address bus Address bus RD RD CSn CSn T1 T2 T3 Ti T1 T2 Simultaneous change of RD and CSn: possibility of mutual overlap (a) Idle cycle not inserted (b) Idle cycle inserted Figure 6.19 Example of Idle Cycle Operation Rev. 2.00 Sep 20, 2005 page 145 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.5.2 Pin States in Idle Cycle Table 6.5 shows the pin states in an idle cycle. Table 6.5 Pin States in Idle Cycle Pins Pin State A23 to A0 Next cycle address value D15 to D0 High-impedance CSn AS RD HWR LWR 6.6 High High High High High Bus Arbiter The bus controller has a built-in bus arbiter that arbitrates between different bus masters. The bus master can be either the CPU or an external bus master. When a bus master has the bus right it can carry out read and write operations. Each bus master uses a bus request signal to request the bus right. At fixed times the bus arbiter determines priority and uses a bus acknowledge signal to grant the bus to a bus master, which can the operate using the bus. The bus arbiter checks whether the bus request signal from a bus master is active or inactive, and returns an acknowledge signal to the bus master. When two or more bus masters request the bus, the highest-priority bus master receives an acknowledge signal. The bus master that receives an acknowledge signal can continue to use the bus until the acknowledge signal is deactivated. The bus master priority order is: (High) External bus master > CPU (Low) The bus arbiter samples the bus request signals and determines priority at all times, but it does not always grant the bus immediately, even when it receives a bus request from a bus master with higher priority than the current bus master. Each bus master has certain times at which it can release the bus to a higher-priority bus master. Rev. 2.00 Sep 20, 2005 page 146 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.6.1 Operation CPU: The CPU is the lowest-priority bus master. If an external bus master requests the bus while the CPU has the bus right, the bus arbiter transfers the bus right to the bus master that requested it. The bus right is transferred at the following times: • The bus right is transferred at the boundary of a bus cycle. If word data is accessed by two consecutive byte accesses, however, the bus right is not transferred between the two byte accesses. • If another bus master requests the bus while the CPU is performing internal operations, such as executing a multiply or divide instruction, the bus right is transferred immediately. The CPU continues its internal operations. • If another bus master requests the bus while the CPU is in sleep mode, the bus right is transferred immediately. External Bus Master: When the BRLE bit is set to 1 in BRCR, the bus can be released to an external bus master. The external bus master has highest priority, and requests the bus right from the bus arbiter driving the BREQ signal low. Once the external bus master acquires the bus, it keeps the bus until the BREQ signal goes high. While the bus is released to an external bus master, the H8/3024 Group chip holds the address bus, data bus, bus control signals (AS, RD, HWR, and LWR), and chip select signals (CSn: n = 7 to 0) in the high-impedance state, and holds the BACK pin in the low output state. The bus arbiter samples the BREQ pin at the rise of the system clock (φ). If BREQ is low, the bus is released to the external bus master at the appropriate opportunity. The BREQ signal should be held low until the BACK signal goes low. When the BREQ pin is high in two consecutive samples, the BACK pin is driven high to end the bus-release cycle. Figure 6.20 shows the timing when the bus right is requested by an external bus master during a read cycle in a two-state access area. There is a minimum interval of three states from when the BREQ signal goes low until the bus is released. Rev. 2.00 Sep 20, 2005 page 147 of 800 REJ09B0260-0200 Section 6 Bus Controller CPU cycles T0 φ T1 External bus released High-impedance Address Address bus CPU cycles T2 High-impedance Data bus High-impedance AS RD High-impedance High High-impedance HWR, LWR BREQ BACK Minimum 3 cycles (1) (2) (3) (4) (5) (6) Figure 6.20 Example of External Bus Master Operation When making a transition to software standby mode, if there is contention with a bus request from an external bus master, the BACK and strobe states may be indefinite when the transition is made. When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the SLEEP instruction. Rev. 2.00 Sep 20, 2005 page 148 of 800 REJ09B0260-0200 Section 6 Bus Controller 6.7 Register and Pin Input Timing 6.7.1 Register Write Timing ABWCR, ASTCR, WCRH, and WCRL Write Timing: Data written to ABWCR, ASTCR, WCRH, and WCRL takes effect starting from the next bus cycle. Figure 6.21 shows the timing when an instruction fetched from area 0 changes area 0 from three-state access to two-state access. T1 T2 T3 T1 T2 T3 T1 T2 φ Address bus ASTCR address 3-state access to area 0 2-state access to area 0 Figure 6.21 ASTCR Write Timing DDR and CSCR Write Timing: Data written to DDR or CSCR for the port corresponding to the CSn pin to switch between CSn output and generic input takes effect starting from the T3 state of the DDR write cycle. Figure 6.22 shows the timing when the CS1 pin is changed from generic input to CS1 output. T1 T2 T3 φ Address bus P8DDR address CS1 High-impedance Figure 6.22 DDR Write Timing Rev. 2.00 Sep 20, 2005 page 149 of 800 REJ09B0260-0200 Section 6 Bus Controller BRCR Write Timing: Data written to BRCR to switch between A23, A22, A21, or A20 output and generic input or output takes effect starting from the T3 state of the BRCR write cycle. Figure 6.23 shows the timing when a pin is changed from generic input to A23, A22, A21, or A20 output. T1 T2 T3 φ Address bus BRCR address PA7 to PA4 (A23 to A20) High-impedance Figure 6.23 BRCR Write Timing 6.7.2 BREQ Pin Input Timing After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high level before BACK goes lows, the bus arbiter may operate incorrectly. To terminate the external-bus-released state, hold the BREQ signal high for at least three states. BREQ is high for too short an interval, the bus arbiter may operate incorrectly. Rev. 2.00 Sep 20, 2005 page 150 of 800 REJ09B0260-0200 If Section 7 I/O Ports Section 7 I/O Ports 7.1 Overview The H8/3024 Group has 10 input/output ports (ports 1, 2, 3, 4, 5, 6, 8, 9, A, and B) and one inputonly port (port 7). Table 7.1 summarizes the port functions. The pins in each port are multiplexed as shown in table 7.1. Each port has a data direction register (DDR) for selecting input or output, and a data register (DR) for storing output data. In addition to these registers, ports 2, 4, and 5 have an input pull-up control register (PCR) for switching input pull-up transistors on and off. Ports 1 to 6 and port 8 can drive one TTL load and a 90-pF capacitive load. Ports 9, A, and B can drive one TTL load and a 30-pF capacitive load. Ports 1 to 6 and 8 to B can drive a darlington pair. Ports 1, 2, and 5 can drive LEDs (with 10-mA current sink). Pins P82 to P80, PA7 to PA0 have Schmitt-trigger input circuits. For block diagrams of the ports see appendix C, I/O Port Block Diagrams. Table 7.1 Port Port Functions Description Pins Mode 1 Mode 2 Mode 3 Mode 4 Port 1 • 8-bit I/O port P17 to P10/ A7 to A0 Single-Chip Modes Expanded Modes Address output pins (A7 to A0) • Can drive LEDs Mode 5 Mode 6 Mode 7 Address output Generic input/ (A7 to A0) and output generic input DDR = 0: generic input DDR = 1: address output Port 2 • 8-bit I/O port P27 to P20/ A15 to A8 Address output pins (A15 to A8) • Built-in input pull-up transistors DDR = 0: generic input DDR = 1: address output • Can drive LEDs Port 3 • 8-bit I/O port Address output Generic input/ (A15 to A8) and output generic input P37 to P30/ D15 to D8 Data input/output (D15 to D8) Generic input/ output Rev. 2.00 Sep 20, 2005 page 151 of 800 REJ09B0260-0200 Section 7 I/O Ports Port Description Mode 1 Mode 2 Mode 3 Mode 4 Port 4 • 8-bit I/O port P47 to P40/ D7 to D0 • Built-in input pull-up transistors Port 5 • 4-bit I/O port Mode 5 Data input/output (D7 to D0) and 8-bit generic input/output Mode 6 Mode 7 Generic input/ output 8-bit bus mode: generic input/output 16-bit bus mode: data input/output P53 to P50/ A19 to A16 Address output (A19 to A16) • Built-in input pull-up transistors Address output Generic input/ (A19 to A16) and output 4-bit generic input DDR = 0: generic input • Can drive LEDs Port 6 • 8-bit I/O port Single-Chip Modes Expanded Modes Pins DDR = 1: address output P67/φ Clock output (φ) and generic input P66/LWR Bus control signal output (LWR, HWR, RD, AS) Generic input/ output Bus control signal input/output (BACK, BREQ, WAIT) and 3-bit generic input/output Generic input/ output P65/HWR P64/RD P63/AS P62/BACK P61/BREQ P60/WAIT Port 7 • 8-bit I/O port P77/AN7/ DA1 Analog input (AN7, AN6) to A/D converter, analog output (DA1, DA0) from D/A converter, and generic input P76/AN6/ DA0 Port 8 • 5-bit I/O port • P82 to P80 have Schmitt inputs P75 to P70/ AN5 to AN0 Analog input (AN5 to AN0) to A/D converter, and generic input P84/CS0 DDR = 0: generic input DDR = 1 (reset value): CS0 output DDR = 0 (after reset): generic input Generic input/ output DDR = 1: CS0 output P83/IRQ3/ IRQ3 input, CS1 output, external trigger input (ADTRG) CS1/ADTRG to A/D converter, and generic input DDR = 0 (after reset): generic input DDR = 1: CS1 output Rev. 2.00 Sep 20, 2005 page 152 of 800 REJ09B0260-0200 IRQ3 input, external trigger input (ADTRG) to A/D converter, and generic input/output Section 7 I/O Ports Port Description Mode 1 Mode 2 Mode 3 Mode 4 Port 8 • 5-bit I/O port • P82 to P80 have Schmitt inputs Port 9 • 6-bit I/O port P82/IRQ2/ Single-Chip Modes Expanded Modes Pins Mode 5 Mode 6 Mode 7 IRQ2 and IRQ1 input, CS2 and CS3 output, and generic IRQ2 and IRQ1 CS2 input P81/IRQ1/ DDR = 0 (after reset): generic input input and generic input/output CS3 DDR = 1: CS2 and CS3 output P80/IRQ0 IRQ0 input, and generic input/output P95/IRQ5 / SCK1 Input and output (SCK1, SCK0, RxD1, RxD0, TxD1, TxD0) for serial communication interfaces 1 and 0 (SCI1/0), IRQ5 and IRQ4 input, and 6-bit generic input/output P94/IRQ4 / SCK0 P93/RxD1 P92/RxD0 P91/TxD1 P90/TxD0 Port A • 8-bit I/O port PA7/TP7/ TIOCB2/A20 Output (TP7) from Address output (A20) pro-grammable timing pattern controller (TPC), input or output (TIOCB2) for 16-bit timer and generic input/ output PA6/TP6/ TIOCA2/A21 PA4/TP4/ TIOCA1/A23 TPC output (TP6 to TP4), 16-bit timer input and output (TIOCA2, TIOCB1, TIOCA1), and generic input/output PA3/TP3/ TIOCB0/ TCLKD TPC output (TP3 to TP0), 16-bit timer input and output (TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA), 8-bit timer input (TCLKD, TCLKC, TCLKB, TCLKA), and generic input/output • Schmitt inputs PA5/TP5/ TIOCB1/A22 Address output (A20), TPC output (TP7), input or output (TIOCB2) for 16-bit timer, and generic input/output TPC output (TP6 to TP4),16-bit timer input and output (TIOCA2, TIOCB1, TIOCA1), address output (A23 to A21), and generic input/ output TPC output (TP7), 16-bit timer input or output (TIOCB2), and generic input/output TPC output (TP6 to TP4), 16-bit timer input and output (TIOCA2, TIOCB1, TIOCA1) and generic input/output PA2/TP2/ TIOCA0/ TCLKC PA1/TP1/ TCLKB PA0/TP0/ TCLKA Rev. 2.00 Sep 20, 2005 page 153 of 800 REJ09B0260-0200 Section 7 I/O Ports Port Description Mode 1 Mode 2 Mode 3 Mode 4 Port B • 8-bit I/O port PB7/TP15 Single-Chip Modes Expanded Modes Pins Mode 5 Mode 6 Mode 7 TPC output (TP15 to TP12) and generic input/output PB6/TP14 PB5/TP13 PB4/TP12 PB3/TP11/ TMIO3/CS4 PB2/TP10/ TMO2/CS5 TPC output (TP11 to TP8), 8-bit timer input and output (TMIO3, TMO2, TMIO1, TMO0), CS7 to CS4 output, and generic input/output PB1/TP9/ TMIO1/CS6 PB0/TP8/ TMO0/CS7 Legend: SCI0: Serial communication interface channel 0 16TIM: 16-bit timer SCI1: Serial communication interface channel 1 8TIM: 8-bit timer TPC: Programmable timing pattern controller Rev. 2.00 Sep 20, 2005 page 154 of 800 REJ09B0260-0200 TPC output (TP11 to TP8), 8-bit timer input and output (TMIO3, TMO2, TMIO1, TMO0), and generic input/output Section 7 I/O Ports 7.2 Port 1 7.2.1 Overview Port 1 is an 8-bit input/output port also used for address output, with the pin configuration shown in figure 7.1. The pin functions differ according to the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), they are address bus output pins (A7 to A0). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 1 data direction register (P1DDR) can designate pins for address bus output (A7 to A0) or generic input. In modes 6 and 7 (single-chip mode), port 1 is a generic input/output port. Pins in port 1 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 1 pins Port 1 Modes 1 to 4 Mode 5 Modes 6 and 7 P17 /A 7 A 7 (output) P17 (input)/A 7 (output) P17 (input/output) P16 /A 6 A 6 (output) P16 (input)/A 6 (output) P16 (input/output) P15 /A 5 A 5 (output) P15 (input)/A 5 (output) P15 (input/output) P14 /A 4 A 4 (output) P14 (input)/A 4 (output) P14 (input/output) P13 /A 3 A 3 (output) P13 (input)/A 3 (output) P13 (input/output) P12 /A 2 A 2 (output) P12 (input)/A 2 (output) P12 (input/output) P11 /A 1 A 1 (output) P11 (input)/A 1 (output) P11 (input/output) P10 /A 0 A 0 (output) P10 (input)/A 0 (output) P10 (input/output) Figure 7.1 Port 1 Pin Configuration Rev. 2.00 Sep 20, 2005 page 155 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.2.2 Register Descriptions Table 7.2 summarizes the registers of port 1. Table 7.2 Port 1 Registers Initial Value Address* Name Abbreviation R/W Modes 1 to 4 Modes 5 to 7 H'EE000 Port 1 data direction register P1DDR W H'FF H'00 H'FFFD0 Port 1 data register R/W H'00 H'00 P1DR Note: * Lower 20 bits of the address in advanced mode. Port 1 Data Direction Register (P1DDR): P1DDR is an 8-bit write-only register that can select input or output for each pin in port 1. Bit 7 6 5 4 3 2 1 0 P1 7 DDR P1 6 DDR P1 5 DDR P1 4 DDR P1 3 DDR P1 2 DDR P1 1 DDR P1 0 DDR Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 1 1 1 1 1 1 1 1 — — — — — — — — 0 0 0 0 0 0 0 0 W W W W W W W W Port 1 data direction 7 to 0 These bits select input or output for port 1 pins • Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P1DDR values are fixed at 1. Port 1 functions as an address bus. • Mode 5 (Expanded Modes with On-Chip ROM Enabled) After a reset, port 1 functions as an input port. A pin in port 1 becomes an address output pin if the corresponding P1DDR bit is set to 1, and a generic input pin if this bit is cleared to 0. • Modes 6 and 7 (Single-Chip Mode) Port 1 functions as an input/output port. A pin in port 1 becomes an output port if the corresponding P1DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P1DDR bits are always read as 1, and cannot be modified. In modes 5 to 7, P1DDR is a write-only register. Its value cannot be read. All bits return 1 when read. Rev. 2.00 Sep 20, 2005 page 156 of 800 REJ09B0260-0200 Section 7 I/O Ports P1DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 to 7, by a reset and in hardware standby mode. In sofware standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 1 is functioning as an input/output port and a P1DDR bit is set to 1, the corresponding pin maintains its output state. Port 1 Data Register (P1DR): P1DR is an 8-bit readable/writable register that stores port 1 output data. When port 1 functions as an output port, the value of this register is output. When this register is read, the pin logic level is read for bits for which the P1DDR setting is 0, and the P1DR value is read for bits for which the P1DDR setting is 1. Bit 7 6 5 4 3 2 1 0 P17 P16 P15 P14 P13 P12 P11 P10 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 1 data 7 to 0 These bits store data for port 1 pins P1DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 157 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.3 Port 2 7.3.1 Overview Port 2 is an 8-bit input/output port which also has an address output function. It’s pin configuration is shown in figure 7.2. The pin functions differ according to the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 2 consists of address bus output pins (A15 to A8). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 2 data direction register (P2DDR) can designate pins for address bus output (A15 to A8) or generic input. In modes 6 and 7 (single-chip mode), port 2 is a generic input/output port. Port 2 has software-programmable built-in pull-up transistors. Pins in port 2 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 2 Port 2 pins Modes 1 to 4 Mode 5 Modes 6 and 7 P27 /A 15 A15 (output) P27 (input)/A15 (output) P27 (input/output) P26 /A 14 A14 (output) P26 (input)/A14 (output) P26 (input/output) P25 /A 13 A13 (output) P25 (input)/A13 (output) P25 (input/output) P24 /A 12 A12 (output) P24 (input)/A12 (output) P24 (input/output) P23 /A 11 A11 (output) P23 (input)/A11 (output) P23 (input/output) P22 /A 10 A10 (output) P22 (input)/A10 (output) P22 (input/output) P21 /A 9 A9 (output) P21 (input)/A9 (output) P21 (input/output) P20 /A 8 A8 (output) P20 (input)/A8 (output) P20 (input/output) Figure 7.2 Port 2 Pin Configuration Rev. 2.00 Sep 20, 2005 page 158 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.3.2 Register Descriptions Table 7.3 summarizes the registers of port 2. Table 7.3 Port 2 Registers Initial Value Address* Name Abbreviation R/W Modes 1 to 4 Modes 5 to 7 H'EE001 Port 2 data direction register P2DDR W H'FF H'00 H'FFFD1 Port 2 data register P2DR R/W H'00 H'00 H'EE03C Port 2 input pull-up MOS control register P2PCR R/W H'00 H'00 Note: * Lower 20 bits of the address in advanced mode. Port 2 Data Direction Register (P2DDR): P2DDR is an 8-bit write-only register that can select input or output for each pin in port 2. Bit 7 6 5 4 3 2 1 0 P2 7 DDR P2 6 DDR P2 5 DDR P2 4 DDR P2 3 DDR P2 2 DDR P2 1 DDR P2 0 DDR Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 1 1 1 1 1 1 1 1 — — — — — — — — 0 0 0 0 0 0 0 0 W W W W W W W W Port 2 data direction 7 to 0 These bits select input or output for port 2 pins • Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P2DDR values are fixed at 1. Port 2 functions as an address bus. • Mode 5 (Expanded Modes with On-Chip ROM Enabled) Following a reset, port 2 is an input port. A pin in port 2 becomes an address output pin if the corresponding P2DDR bit is set to 1, and a generic input port if this bit is cleared to 0. • Modes 6 and 7 (Single-Chip Mode) Port 2 functions as an input/output port. A pin in port 2 becomes an output port if the corresponding P2DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P2DDR bits are always read as 1, and cannot be modified. Rev. 2.00 Sep 20, 2005 page 159 of 800 REJ09B0260-0200 Section 7 I/O Ports In modes 5 to 7, P2DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P2DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 2 is functioning as an input/output port and a P2DDR bit is set to 1, the corresponding pin maintains its output state. Port 2 Data Register (P2DR): P2DR is an 8-bit readable/writable register that stores output data for Port 2. When port 2 functions as an output port, the value of this register is output. When a bit in P2DDR is set to 1, if port 2 is read the value of the corresponding P2DR bit is returned. When a bit in P2DDR is cleared to 0, if port 2 is read the corresponding pin logic level is read. Bit 7 6 5 4 3 2 1 0 P2 7 P2 6 P2 5 P2 4 P2 3 P2 2 P2 1 P2 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 2 data 7 to 0 These bits store data for port 2 pins P2DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 2 Input Pull-Up MOS Control Register (P2PCR): P2PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 2. Bit 7 6 5 4 3 2 1 0 P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 2 input pull-up MOS control 7 to 0 These bits control input pull-up transistors built into port 2 In modes 5 to 7, when a P2DDR bit is cleared to 0 (selecting generic input), if the corresponding bit in P2PCR is set to 1, the input pull-up transistor is turned on. P2PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 160 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.4 summarizes the states of the input pull-ups in each mode. Table 7.4 Input Pull-Up Transistor States (Port 2) Mode Reset Hardware Standby Mode Software Standby Mode Other Modes 1 2 3 4 Off Off Off Off 5 6 7 Off Off On/off On/off Legend: Off: The input pull-up transistor is always off. On/off: The input pull-up transistor is on if P2PCR = 1 and P2DDR = 0. Otherwise, it is off. Rev. 2.00 Sep 20, 2005 page 161 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.4 Port 3 7.4.1 Overview Port 3 is an 8-bit input/output port which also functions as a data bus. It’s pin configuration is shown in figure 7.3. Port 3 is a data bus in modes 1 to 5 (expanded modes) and a generic input/output port in modes 6 and 7 (single-chip mode). Pins in port 3 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Port 3 Port 3 pins Modes 1 to 5 Modes 6 and 7 P37 /D15 D15 (input/output) P37 (input/output) P36 /D14 D14 (input/output) P36 (input/output) P35 /D13 D13 (input/output) P35 (input/output) P34 /D12 D12 (input/output) P34 (input/output) P33 /D11 D11 (input/output) P33 (input/output) P32 /D10 D10 (input/output) P32 (input/output) P31 /D9 D9 (input/output) P31 (input/output) P30 /D8 D8 (input/output) P30 (input/output) Figure 7.3 Port 3 Pin Configuration 7.4.2 Register Descriptions Table 7.5 summarizes the registers of port 3. Table 7.5 Port 3 Registers Address* Name Abbreviation R/W Initial Value H'EE002 Port 3 data direction register P3DDR W H'00 H'FFFD2 Port 3 data register P3DR R/W H'00 Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 162 of 800 REJ09B0260-0200 Section 7 I/O Ports Port 3 Data Direction Register (P3DDR): P3DDR is an 8-bit write-only register that can select input or output for each pin in port 3. Bit 7 6 5 4 3 2 1 0 P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR Initial value 0 0 0 0 0 0 0 0 Read/Write W W W W W W W W Port 3 data direction 7 to 0 These bits select input or output for port 3 pins • Modes 1 to 5 (Expanded Modes) Port 3 functions as a data bus, regardless of the P3DDR settings. • Modes 6 and 7 (Single-Chip Mode) Port 3 functions as an input/output port. A pin in port 3 becomes an output port if the corresponding P3DDR bit is set to 1, and an input port if this bit is cleared to 0. P3DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P3DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 3 is functioning as an input/output port and a P3DDR bit is set to 1, the corresponding pin maintains its output state. Port 3 Data Register (P3DR): P3DR is an 8-bit readable/writable register that stores output data for port 3. When port 3 functions as an output port, the value of this register is output. When a bit in P3DDR is set to 1, if port 3 is read the value of the corresponding P3DR bit is returned. When a bit in P3DDR is cleared to 0, if port 3 is read the corresponding pin logic level is read. Bit 7 6 5 4 3 2 1 0 P3 7 P3 6 P3 5 P3 4 P3 3 P3 2 P3 1 P3 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 3 data 7 to 0 These bits store data for port 3 pins P3DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 163 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.5 Port 4 7.5.1 Overview Port 4 is an 8-bit input/output port which also functions as a data bus. It’s pin configuration is shown in figure 7.4. The pin functions differ depending on the operating mode. In modes 1 to 5 (expanded modes), when the bus width control register (ABWCR) designates areas 0 to 7 all as 8-bit-access areas, the chip operates in 8-bit bus mode and port 4 is a generic input/output port. When at least one of areas 0 to 7 is designated as a 16-bit-access area, the chip operates in 16-bit bus mode and port 4 becomes part of the data bus. In modes 6 and 7 (single-chip mode), port 4 is a generic input/output port. Port 4 has software-programmable built-in pull-up transistors. Pins in port 4 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Port 4 Port 4 pins Modes 1 to 5 Modes 6 and 7 P47 /D7 P47 (input/output)/D7 (input/output) P47 (input/output) P46 /D6 P46 (input/output)/D6 (input/output) P46 (input/output) P45 /D5 P45 (input/output)/D5 (input/output) P45 (input/output) P44 /D4 P44 (input/output)/D4 (input/output) P44 (input/output) P43 /D3 P43 (input/output)/D3 (input/output) P43 (input/output) P42 /D2 P42 (input/output)/D2 (input/output) P42 (input/output) P41 /D1 P41 (input/output)/D1 (input/output) P41 (input/output) P40 /D0 P40 (input/output)/D0 (input/output) P40 (input/output) Figure 7.4 Port 4 Pin Configuration Rev. 2.00 Sep 20, 2005 page 164 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.5.2 Register Descriptions Table 7.6 summarizes the registers of port 4. Table 7.6 Address* Port 4 Registers Name Abbreviation R/W Initial Value H'EE003 Port 4 data direction register P4DDR W H'00 H'FFFD3 Port 4 data register P4DR R/W H'00 H'EE03E Port 4 input pull-up MOS control register P4PCR R/W H'00 Note: * Lower 20 bits of the address in advanced mode. Port 4 Data Direction Register (P4DDR): P4DDR is an 8-bit write-only register that can select input or output for each pin in port 4. Bit 7 6 5 4 3 2 1 0 P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR Initial value 0 0 0 0 0 0 0 0 Read/Write W W W W W W W W Port 4 data direction 7 to 0 These bits select input or output for port 4 pins • Modes 1 to 5 (Expanded Modes) When all areas are designated as 8-bit-access areas by the bus controller’s bus width control register (ABWCR), selecting 8-bit bus mode, port 4 functions as an input/output port. In this case, a pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. When at least one area is designated as a 16-bit-access area, selecting 16-bit bus mode, port 4 functions as part of the data bus, regardless of the P4DDR settings. • Modes 6 and 7 (Single-Chip Mode) Port 4 functions as an input/output port. A pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. P4DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P4DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 165 of 800 REJ09B0260-0200 Section 7 I/O Ports ABWCR and P4DDR are not initialized in software standby mode. Therefore, if a transition is made to software standby mode while port 4 is functioning as an input/output port and a P4DDR bit is set to 1, the corresponding pin maintains its output state. Port 4 Data Register (P4DR): P4DR is an 8-bit readable/writable register that stores output data for port 4. When port 4 functions as an output port, the value of this register is output. When a bit in P4DDR is set to 1, if port 4 is read the value of the corresponding P4DR bit is returned. When a bit in P4DDR is cleared to 0, if port 4 is read the corresponding pin logic level is read. Bit 7 6 5 4 3 2 1 0 P4 7 P4 6 P4 5 P4 4 P4 3 P4 2 P4 1 P4 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 4 data 7 to 0 These bits store data for port 4 pins P4DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 4 Input Pull-Up MOS Control Register (P4PCR): P4PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 4. Bit 7 6 5 4 3 2 1 0 P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port 4 input pull-up MOS control 7 to 0 These bits control input pull-up transistors built into port 4 In modes 6 and 7 (single-chip mode), and in 8-bit bus mode in modes 1 to 5 (expanded modes), when a P4DDR bit is cleared to 0 (selecting generic input), if the corresponding P4PCR bit is set to 1, the input pull-up transistor is turned on. P4PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 7.7 summarizes the states of the input pull-up MOS in each operating mode. Rev. 2.00 Sep 20, 2005 page 166 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.7 Input Pull-Up Transistor States (Port 4) Mode 1 to 5 8-bit bus mode Reset Hardware Standby Mode Software Standby Mode Other Modes Off Off On/off On/off Off Off On/off On/off 16-bit bus mode 6 and 7 Legend: Off: The input pull-up transistor is always off. On/off: The input pull-up transistor is on if P4PCR = 1 and P4DDR = 0. Otherwise, it is off. 7.6 Port 5 7.6.1 Overview Port 5 is a 4-bit input/output port which also has an address output function. It’s pin configuration is shown in figure 7.5. The pin functions differ depending on the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 5 consists of address output pins (A19 to A16). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 5 data direction register (P5DDR) designate pins for address bus output (A19 to A16) or generic input. In modes 6 and 7 (single-chip mode), port 5 is a generic input/output port. Port 5 has software-programmable built-in pull-up transistors. Pins in port 5 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 5 Port 5 pins Modes 1 to 4 Mode 5 Modes 6 and 7 P53 /A 19 A19 (output) P5 3 (input)/A19 (output) P5 3 (input/output) P52 /A 18 A18 (output) P5 2 (input)/A18 (output) P5 2 (input/output) P51 /A 17 A17 (output) P5 1 (input)/A17 (output) P5 1 (input/output) P50 /A 16 A16 (output) P5 0 (input)/A16 (output) P5 0 (input/output) Figure 7.5 Port 5 Pin Configuration Rev. 2.00 Sep 20, 2005 page 167 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.6.2 Register Descriptions Table 7.8 summarizes the registers of port 5. Table 7.8 Port 5 Registers Initial Value Address* Name Abbreviation R/W Modes 1 to 4 Modes 5 to 7 H'EE004 Port 5 data direction register P5DDR W H'FF H'F0 H'FFFD4 Port 5 data register P5DR R/W H'F0 H'F0 H'EE03F Port 5 input pull-up MOS control register P5PCR R/W H'F0 H'F0 Note: * Lower 20 bits of the address in advanced mode. Port 5 Data Direction Register (P5DDR): P5DDR is an 8-bit write-only register that can select input or output for each pin in port 5. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 4 — — — — 3 2 1 0 P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR Modes Initial value 1 to 4 Read/Write 1 1 1 1 1 1 1 1 — — — — — — — — Modes Initial value 5 to 7 Read/Write 1 1 1 1 0 0 0 0 — — — — W W W W Reserved bits Port 5 data direction 3 to 0 These bits select input or output for port 5 pins • Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P5DDR values are fixed at 1. Port 5 functions as an address bus output. • Mode 5 (Expanded Modes with On-Chip ROM Enabled) Following a reset, port 5 is an input port. A pin in port 5 becomes an address output pin if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0. • Modes 6 and 7 (Single-Chip Mode) Port 5 functions as an input/output port. A pin in port 5 becomes an output port if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P5DDR bits are always read as 1, and cannot be modified. Rev. 2.00 Sep 20, 2005 page 168 of 800 REJ09B0260-0200 Section 7 I/O Ports In modes 5 to 7, P5DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P5DDR is initialized to H'FF in modes 1 to 4, and to H'F0 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 5 is functioning as an input/output port and a P5DDR bit is set to 1, the corresponding pin maintains its output state. Port 5 Data Register (P5DR): P5DR is an 8-bit readable/writable register that stores output data for port 5. When port 5 functions as an output port, the value of this register is output. When a bit in P5DDR is set to 1, if port 5 is read the value of the corresponding P5DR bit is returned. When a bit in P5DDR is cleared to 0, if port 5 is read the corresponding pin logic level is read. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 4 3 2 1 0 — — — — P5 3 P5 2 P5 1 P5 0 Initial value 1 1 1 1 0 0 0 0 Read/Write — — — — R/W R/W R/W R/W Reserved bits Port 5 data 3 to 0 These bits store data for port 5 pins P5DR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 5 Input Pull-Up MOS Control Register (P5PCR): P5PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 5. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 4 — — — — 3 2 1 0 P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR Initial value 1 1 1 1 0 0 0 0 Read/Write — — — — R/W R/W R/W R/W Reserved bits Port 5 input pull-up MOS control 3 to 0 These bits control input pull-up transistors built into port 5 Rev. 2.00 Sep 20, 2005 page 169 of 800 REJ09B0260-0200 Section 7 I/O Ports In modes 5 to 7, when a P5DDR bit is cleared to 0 (selecting generic input), if the corresponding bit in P5PCR is set to 1, the input pull-up transistor is turned on. P5PCR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 7.9 summarizes the states of the input pull-ups in each mode. Table 7.9 Input Pull-Up Transistor States (Port 5) Mode Reset Hardware Standby Mode Software Standby Mode Other Modes 1 2 3 4 Off Off Off Off 5 6 7 Off Off On/off On/off Legend: Off: The input pull-up transistor is always off. On/off: The input pull-up transistor is on if P5PCR = 1 and P5DDR = 0. Otherwise, it is off. Rev. 2.00 Sep 20, 2005 page 170 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.7 Port 6 7.7.1 Overview Port 6 is an 8-bit input/output port that is also used for input and output of bus control signals (LWR, HWR, RD, AS, BACK, BREQ, WAIT) and for clock (φ) output. The port 6 pin configuration is shown in figure 7.6. See table 7.11 for the selection of the pin functions. Pins in port 6 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Port 6 pins P6 7 / φ Port 6 Modes 6 and 7 (single-chip mode) Modes 1 to 5 (expanded modes) P67 (input)/ φ (output) P6 7 (input) / φ(output) P6 6 / LWR LWR (output) P6 6 (input/output) P6 5 / HWR HWR (output) P6 5 (input/output) P6 4 / RD RD (output) P6 4 (input/output) P6 3 / AS AS (output) P6 3 (input/output) P6 2 / BACK P62 (input/output) BACK (output) P6 2 (input/output) P6 1 / BREQ P61 (input/output)/ BREQ (input) P6 1 (input/output) P6 0 / WAIT P60 (input/output)/ WAIT (input) P6 0 (input/output) Figure 7.6 Port 6 Pin Configuration Rev. 2.00 Sep 20, 2005 page 171 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.7.2 Register Descriptions Table 7.10 summarizes the registers of port 6. Table 7.10 Port 6 Registers Address* Name Abbreviation R/W Initial Value H'EE005 Port 6 data direction register P6DDR W H'80 H'FFFD5 Port 6 data register P6DR R/W H'80 Note: * Lower 20 bits of the address in advanced mode. Port 6 Data Direction Register (P6DDR): P6DDR is an 8-bit write-only register that can select input or output for each pin in port 6. Bit 7 is reserved. It is fixed at 1, and cannot be modified. Bit 7 — 6 5 4 3 2 1 0 P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR Initial value 1 0 0 0 0 0 0 0 Read/Write — W W W W W W W Reserved bit Port 6 data direction 6 to 0 These bits select input or output for port 6 pins • Modes 1 to 5 (Expanded Modes) P67 functions as the clock output pin (φ) or an input port. P67 is the clock output pin (ø) if the PSTOP bit in MSTRCH is cleared to 0 (initial value), and an input port if this bit is set to 1. P66 to P63 function as bus control output pins (LWR, HWR, RD, and AS), regardless of the settings of bits P66DDR to P63DDR. P62 to P60 function as bus control input/output pins (BACK, BREQ, and WAIT) or input/output ports. For the method of selecting the pin functions, see table 7.11. When P62 to P60 function as input/output ports, the pin becomes an output port if the corresponding P6DDR bit is set to 1, and an input port if this bit is cleared to 0. Rev. 2.00 Sep 20, 2005 page 172 of 800 REJ09B0260-0200 Section 7 I/O Ports • Modes 6 and 7 (Single-Chip Mode) P67 functions as the clock output pin (φ) or an input port. P66 to P60 function as generic input/output ports. P67 is the clock output pin (φ) if the PSTOP bit in MSTCRH is cleared to 0 (initial value), and an input port if this bit is set to 1. A pin in port 6 becomes an output port if the corresponding bit of P66DDR to P60DDR is set to 1, and an input port if this pin is cleared to 0. P6DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P6DDR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 6 is functioning as an input/output port and a P6DDR bit is set to 1, the corresponding pin maintains its output state. Port 6 Data Register (P6DR): P6DR is an 8-bit readable/writable register that stores output data for port 6. When port 6 functions as an output port, the value of this register is output. For bit 7, a value of 1 is returned if the bit is read while the PSTOP bit in MSTCRH is cleared to 0, and the P67 pin logic level is returned if the bit is read while the PSTOP bit is set to 1. Bit 7 cannot be modified. For bits 6 to 0, the pin logic level is returned if the bit is read while the corresponding bit in P6DDR is cleared to 0, and the P6DR value is returned if the bit is read while the corresponding bit in P6DDR is set to 1. Bit 7 6 5 4 3 2 1 0 P67 P6 6 P6 5 P6 4 P6 3 P6 2 P6 1 P6 0 Initial value 1 0 0 0 0 0 0 0 Read/Write R R/W R/W R/W R/W R/W R/W R/W Port 6 data 7 to 0 These bits store data for port 6 pins P6DR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 173 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.11 Port 6 Pin Functions in Modes 1 to 5 Pin Pin Functions and Selection Method P67/φ Bit PSTOP in MSTCRH selects the pin function. PSTOP Pin function LWR 0 1 φ output P67 input Functions as LWR regardless of the setting of bit P66DDR P66DDR 0 1 LWR output Pin function HWR Functions as HWR regardless of the setting of bit P65DDR P65DDR 0 HWR output Pin function RD 1 Functions as RD regardless of the setting of bit P64DDR P64DDR 0 1 RD output Pin function AS Functions as AS regardless of the setting of bit P63DDR P63DDR 0 1 AS output Pin function P62/BACK Bit BRLE in BRCR and bit P62DDR select the pin function as follows. BRLE P62DDR Pin function P61/BREQ 0 1 0 1 — P62 input P62 output BACK output Bit BRLE in BRCR and bit P61DDR select the pin function as follows. BRLE P61DDR Pin function Rev. 2.00 Sep 20, 2005 page 174 of 800 REJ09B0260-0200 0 1 0 1 — P61 input P61 output BREQ input Section 7 I/O Ports Pin Pin Functions and Selection Method P60/WAIT Bit WAITE in BCR and bit P60DDR select the pin function as follows. WAITE P60DDR Pin function 0 0 1 1 0* P60 input P60 output WAIT input Note: * Do not set bit P60DDR to 1. 7.8 Port 7 7.8.1 Overview Port 7 is an 8-bit input port that is also used for analog input to the A/D converter and analog output from the D/A converter. The pin functions are the same in all operating modes. Figure 7.7 shows the pin configuration of port 7. See section 14, A/D Converter, for details of the A/D converter analog input pins, and section 15, D/A Converter, for details of the D/A converter analog output pins. Port 7 pins P77 (input)/AN 7 (input)/DA 1 (output) P76 (input)/AN 6 (input)/DA 0 (output) P75 (input)/AN 5 (input) Port 7 P74 (input)/AN 4 (input) P73 (input)/AN 3 (input) P72 (input)/AN 2 (input) P71 (input)/AN 1 (input) P70 (input)/AN 0 (input) Figure 7.7 Port 7 Pin Configuration Rev. 2.00 Sep 20, 2005 page 175 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.8.2 Register Description Table 7.12 summarizes the port 7 register. Port 7 is an input port, and port 7 has no data direction register. Table 7.12 Port 7 Data Register Address* Name Abbreviation R/W Initial Value H'FFFD6 Port 7 data register P7DR R Undetermined Note: * Lower 20 bits of the address in advanced mode. Port 7 Data Register (P7DR) Bit 7 6 5 4 3 2 1 0 P77 P76 P75 P74 P73 P72 P71 P70 Initial value —* —* —* —* —* —* —* —* Read/Write R R R R R R R R Note: * Determined by pins P77 to P70. When port 7 is read, the pin logic levels are always read. P7DR cannot be modified. 7.9 Port 8 7.9.1 Overview Port 8 is a 5-bit input/output port that is also used for CS3 to CS0 output, IRQ3 to IRQ0 input, and A/D converter ADTRG input. Figure 7.8 shows the pin configuration of port 8. In modes 1 to 5 (expanded modes), port 8 can provide CS3 to CS0 output, IRQ3 to IRQ0 input, and ADTRG input. See table 7.14 for the selection of pin functions in expanded modes. In modes 6 and 7 (single-chip modes), port 8 can provide IRQ3 to IRQ0 input and ADTRG input. See table 7.15 for the selection of pin functions in single-chip mode. See section 14, A/D Converter, for a description of the A/D converter’s ADTRG input pin. The IRQ3 to IRQ0 functions are selected by IER settings, regardless of whether the pin is used for input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts. Rev. 2.00 Sep 20, 2005 page 176 of 800 REJ09B0260-0200 Section 7 I/O Ports Pins in port 8 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Pins P82 to P80 have Schmitt-trigger inputs. Port 8 Port 8 pins Pin functions in modes 1 to 5 (expanded modes) P84 / CS 0 P84 (input)/ CS 0 (output) P83 / CS 1 / IRQ 3 / ADTRG P83 (input)/ CS 1 (output)/ IRQ 3 (input) / ADTRG (input) P82 / CS 2 / IRQ 2 P82 (input)/ CS 2 (output)/ IRQ 2 (input) P81 / CS 3 / IRQ 1 P81 (input)/ CS 3 (output)/ IRQ 1 (input) P80 / IRQ 0 P80 (input/output)/ IRQ 0 (input) Pin functions in modes 6 and 7 (single-chip mode) P84 /(input/output) P83 /(input/output)/ IRQ 3 (input) / ADTRG (input) P82 /(input/output)/ IRQ 2 (input) P81 /(input/output)/ IRQ 1 (input) P80 /(input/output)/ IRQ 0 (input) Figure 7.8 Port 8 Pin Configuration 7.9.2 Register Descriptions Table 7.13 summarizes the registers of port 8. Table 7.13 Port 8 Registers Initial Value Address* Name Abbreviation R/W Modes 1 to 4 Modes 5 to 7 H'EE007 Port 8 data direction register P8DDR W H'F0 H'E0 H'FFFD7 Port 8 data register P8DR R/W H'E0 H'E0 Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 177 of 800 REJ09B0260-0200 Section 7 I/O Ports Port 8 Data Direction Register (P8DDR): P8DDR is an 8-bit write-only register that can select input or output for each pin in port 8. Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 — — — 4 3 2 1 0 P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR Modes Initial value 1 to 4 Read/Write 1 1 1 1 0 0 0 0 — — — W W W W W Modes Initial value 5 to 7 Read/Write 1 1 1 0 0 0 0 0 — — — W W W W W Reserved bits Port 8 data direction 4 to 0 These bits select input or output for port 8 pins • Modes 1 to 5 (Expanded Modes) When bits in P8DDR bit are set to 1, P84 to P81 become CS0 to CS3 output pins. When bits in P8DDR are cleared to 0, the corresponding pins become input ports. In modes 1 to 4 (expanded modes with on-chip ROM disabled), following a reset P84 functions as the CS0 output, while CS1 to CS3 are input ports. In mode 5 (expanded mode with on-chip ROM enabled), following a reset CS0 to CS3 are all input ports. • Modes 6 and 7 (Single-Chip Mode) Port 8 is a generic input/output port. A pin in port 8 becomes an output port if the corresponding P8DDR bit is set to 1, and an input port if this bit is cleared to 0. P8DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P8DDR is initialized to H'F0 in modes 1 to 4, and to H'E0 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode P8DDR retains its previous setting. Therefore, if a transition is made to software standby mode while port 8 is functioning as an input/output port and a P8DDR bit is set to 1, the corresponding pin maintains its output state. Rev. 2.00 Sep 20, 2005 page 178 of 800 REJ09B0260-0200 Section 7 I/O Ports Port 8 Data Register (P8DR): P8DR is an 8-bit readable/writable register that stores output data for port 8. When port 8 functions as an output port, the value of this register is output. When a bit in P8DDR is set to 1, if port 8 is read the value of the corresponding P8DR bit is returned. When a bit in P8DDR is cleared to 0, if port 8 is read the corresponding pin logic level is read. Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 4 3 2 1 0 — — — P8 4 P8 3 P8 2 P8 1 P8 0 Initial value 1 1 1 0 0 0 0 0 Read/Write — — — R/W R/W R/W R/W R/W Reserved bits Port 8 data 4 to 0 These bits store data for port 8 pins P8DR is initialized to H'E0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 179 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.14 Port 8 Pin Functions in Modes 1 to 5 Pin Pin Functions and Selection Method P84/CS0 Bit P84DDR selects the pin function as follows. P84DDR Pin function P83/CS1/IRQ3/ ADTRG 0 1 P84 input CS0 output Bit P83DDR selects the pin function as follows P83DDR Pin function 0 1 P83 input CS1 output IRQ3 input ADTRG input P82/CS2/IRQ2 Bit P82DDR selects the pin function as follows. P82DDR Pin function 0 1 P82 input CS2 output IRQ2 input P81/CS3/IRQ1 Bit P81DDR selects the pin function as follows. P81DDR Pin function 0 1 P81 input CS3 output IRQ1 input P80/IRQ0 Bit P80DDR selects the pin function as follows. P80DDR Pin function 0 1 P80 input P80 output IRQ0 input Rev. 2.00 Sep 20, 2005 page 180 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.15 Port 8 Pin Functions in Modes 6 and 7 Pin Pin Functions and Selection Method P84 Bit P84DDR selects the pin function as follows. P84DDR Pin function P83/IRQ3/ADTRG 0 1 P84 input P84 output Bit P83DDR selects the pin function as follows. P83DDR Pin function 0 1 P83 input P83 output IRQ3 input ADTRG input P82/IRQ2 Bit P82DDR selects the pin function as follows. P82DDR Pin function 0 1 P82 input P82 output IRQ2 input P81/IRQ1 Bit P81DDR selects the pin function as follows. P81DDR Pin function 0 1 P81 input P81 output IRQ1 input P80/IRQ0 Bit P80DDR select the pin function as follows. P80DDR Pin function 0 1 P80 input P80 output IRQ0 input Rev. 2.00 Sep 20, 2005 page 181 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.10 Port 9 7.10.1 Overview Port 9 is a 6-bit input/output port that is also used for input and output (TxD0, TxD1, RxD0, RxD1, SCK0, SCK1) by serial communication interface channels 0 and 1 (SCI0 and SCI1), and for IRQ5 and IRQ4 input. See table 7.17 for the selection of pin functions. The IRQ5 and IRQ4 functions are selected by IER settings, regardless of whether the pin is used for input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts. Port 9 has the same set of pin functions in all operating modes. Figure 7.9 shows the pin configuration of port 9. Pins in port 9 can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair. Port 9 pins P95 (input/output)/SCK 1 (input/output)/IRQ 5 (input) P94 (input/output)/SCK 0 (input/output)/IRQ 4 (input) Port 9 P93 (input/output)/RxD1 (input) P92 (input/output)/RxD0 (input) P91 (input/output)/TxD1 (output) P90 (input/output)/TxD0 (output) Figure 7.9 Port 9 Pin Configuration Rev. 2.00 Sep 20, 2005 page 182 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.10.2 Register Descriptions Table 7.16 summarizes the registers of port 9. Table 7.16 Port 9 Registers Address* Name Abbreviation R/W Initial Value H'EE008 Port 9 data direction register P9DDR W H'C0 H'FFFD8 Port 9 data register P9DR R/W H'C0 Note: * Lower 20 bits of the address in advanced mode. Port 9 Data Direction Register (P9DDR): P9DDR is an 8-bit write-only register that can select input or output for each pin in port 9. Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 — — Initial value 1 1 0 0 0 0 0 0 Read/Write — — W W W W W W Reserved bits 5 4 3 2 1 0 P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR Port 9 data direction 5 to 0 These bits select input or output for port 9 pins When port 9 functions as an input/output port, a pin in port 9 becomes an output port if the corresponding P9DDR bit is set to 1, and an input port if this bit is cleared to 0. For the method of selecting the pin functions, see table 7.17. P9DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P9DDR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 9 is functioning as an input/output port and a P9DDR bit is set to 1, the corresponding pin maintains its output state. Rev. 2.00 Sep 20, 2005 page 183 of 800 REJ09B0260-0200 Section 7 I/O Ports Port 9 Data Register (P9DR): P9DR is an 8-bit readable/writable register that stores output data for port 9. When port 9 functions as an output port, the value of this register is output. When a bit in P9DDR is set to 1, if port 9 is read the value of the corresponding P9DR bit is returned. When a bit in P9DDR is cleared to 0, if port 9 is read the corresponding pin logic level is read. Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified. Bit 7 6 5 4 3 2 1 0 — — P9 5 P9 4 P9 3 P9 2 P9 1 P9 0 Initial value 1 1 0 0 0 0 0 0 Read/Write — — R/W R/W R/W R/W R/W R/W Reserved bits Port 9 data 5 to 0 These bits store data for port 9 pins P9DR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 184 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.17 Port 9 Pin Functions Pin Pin Functions and Selection Method P95/SCK1/IRQ5 Bit C/A in SMR of SCI1, bits CKE0 and CKE1 in SCR, and bit P95DDR select the pin function as follows. CKE1 0 C/A 0 CKE0 P95DDR Pin function 1 0 1 — 1 — — 0 1 — — — P95 input P95 output SCK1 output SCK1 output SCK1 input IRQ5 input P94/SCK0/IRQ4 Bit C/A in SMR of SCI0, bits CKE0 and CKE1 in SCR, and bit P94DDR select the pin function as follows. CKE1 0 C/A 0 CKE0 P94DDR Pin function 1 0 1 — 1 — — 0 1 — — — P94 input P94 output SCK0 output SCK0 output SCK0 input IRQ4 input P93/RxD1 Bit RE in SCR of SCI1, bit SMIF in SCMR, and bit P93DDR select the pin function as follows. SMIF 0 RE P93DDR Pin function 0 1 1 — 0 1 — — P93 input P93 output RxD1 input RxD1 input Rev. 2.00 Sep 20, 2005 page 185 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method P92/RxD0 Bit RE in SCR of SCI0, bit SMIF in SCMR, and bit P92DDR select the pin function as follows. SMIF 0 RE P92DDR Pin function P91/TxD1 0 1 1 — 0 1 — — P92 input P92 output RxD0 input RxD0 input Bit TE in SCR of SCI1, bit SMIF in SCMR, and bit P91DDR select the pin function as follows. SMIF 0 TE P91 DDR Pin function 0 0 1 P91 input P91 output 1 1 — — — TxD1 output TxD1 output* Note: * Functions as the TxD1 output pin, but there are two states: one in which the pin is driven, and another in which the pin is at highimpedance. P90/TxD0 Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P90DDR select the pin function as follows. SMIF 0 TE P90DDR Pin function 0 0 1 P90 input P90 output 1 1 — — — TxD0 output TxD0 output* Note: * Functions as the TxD0 output pin, but there are two states: one in which the pin is driven, and another in which the pin is at highimpedance. Rev. 2.00 Sep 20, 2005 page 186 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.11 Port A 7.11.1 Overview Port A is an 8-bit input/output port that is also used for output (TP7 to TP0) from the programmable timing pattern controller (TPC), input and output (TIOCB2, TIOCA2, TIOCB1, TIOCA1, TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA) by the 16-bit timer, clock input (TCLKD, TCLKC, TCLKB, TCLKA) to the 8-bit timer, and address output (A23 to A20). A reset or hardware standby transition leaves port A as an input port, except that in modes 3 and 4, one pin is always used for A20 output. See table 7.19 to 7.21 for the selection of pin functions. Usage of pins for TPC, 16-bit timer, and 8-bit timer input and output is described in the sections on those modules. For output of address bits A23 to A20 in modes 3, 4, and 5, see section 6.2.4, Bus Release Control Register (BRCR). Pins not assigned to any of these functions are available for generic input/output. Figure 7.10 shows the pin configuration of port A. Pins in port A can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair. Port A has Schmitt-trigger inputs. Rev. 2.00 Sep 20, 2005 page 187 of 800 REJ09B0260-0200 Section 7 I/O Ports Port A pins PA 7 /TP7 /TIOCB2 /A 20 PA 6 /TP6 /TIOCA2 /A 21 PA 5 /TP5 /TIOCB1 /A 22 PA 4 /TP4 /TIOCA1 /A 23 Port A PA 3 /TP3 /TIOCB0 /TCLKD PA 2 /TP2 /TIOCA0 /TCLKC PA 1 /TP1 /TCLKB PA 0 /TP0 /TCLKA Pin functions in modes 1, 2, 6 and 7 PA 7 (input/output)/TP7 (output)/TIOCB 2 (input/output) PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output) PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output) PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output) PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TCLKA (input) Pin functions in modes 3 and 4 A 20 (output) PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output)/A 21(output) PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output)/A 22(output) PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output)/A 23(output) PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TCLKA (input) Pin functions in mode 5 PA 7 (input/output)/TP7 (output)/TIOCB2 (input/output)/A 20 (output) PA 6 (input/output)/TP6 (output)/TIOCA2 (input/output)/A 21 (output) PA 5 (input/output)/TP5 (output)/TIOCB1 (input/output)/A 22 (output) PA 4 (input/output)/TP4 (output)/TIOCA1 (input/output)/A 23 (output) PA 3 (input/output)/TP3 (output)/TIOCB0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TCLKA (input) Figure 7.10 Port A Pin Configuration Rev. 2.00 Sep 20, 2005 page 188 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.11.2 Register Descriptions Table 7.18 summarizes the registers of port A. Table 7.18 Port A Registers Initial Value Address* Name H'EE009 Port A data direction register H'FFFD9 Port A data register R/W Modes 1, 2, 5, 6 and 7 Modes 3, 4 PADDR W H'00 H'80 PADR R/W H'00 H'00 Note: * Lower 20 bits of the address in advanced mode. Port A Data Direction Register (PADDR): PADDR is an 8-bit write-only register that can select input or output for each pin in port A. When pins are used for TPC output, the corresponding PADDR bits must also be set. Bit 7 6 5 4 3 2 1 0 PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR Modes Initial value 1 3 and 4 Read/Write — Modes Initial value 0 1, 2, 5, 6 and 7 Read/Write W 0 0 0 0 0 0 0 W W W W W W W 0 0 0 0 0 0 0 W W W W W W W Port A data direction 7 to 0 These bits select input or output for port A pins The pin functions that can be selected for pins PA7 to PA4 differ between modes 1, 2, 6, and 7, and modes 3 to 5. For the method of selecting the pin functions, see tables 7.19 and 7.20. The pin functions that can be selected for pins PA3 to PA0 are the same in modes 1 to 7. For the method of selecting the pin functions, see table 7.21. When port A functions as an input/output port, a pin in port A becomes an output port if the corresponding PADDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 3 and 4, PA7DDR is fixed at 1 and PA7 functions as the A20 address output pin. PADDR is a write-only register. Its value cannot be read. All bits return 1 when read. Rev. 2.00 Sep 20, 2005 page 189 of 800 REJ09B0260-0200 Section 7 I/O Ports PADDR is initialized to H'00 by a reset and in hardware standby mode in modes 1, 2, 5, 6, and 7. It is initialized to H'80 by a reset and in hardware standby mode in modes 3 and 4. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port A is functioning as an input/output port and a PADDR bit is set to 1, the corresponding pin maintains its output state. Port A Data Register (PADR): PADR is an 8-bit readable/writable register that stores output data for port A. When port A functions as an output port, the value of this register is output. When a bit in PADDR is set to 1, if port A is read the value of the corresponding PADR bit is returned. When a bit in PADDR is cleared to 0, if port A is read the corresponding pin logic level is read. Bit 7 6 5 4 3 2 1 0 PA 7 PA 6 PA 5 PA 4 PA 3 PA 2 PA 1 PA 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port A data 7 to 0 These bits store data for port A pins PADR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 190 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.19 Port A Pin Functions (Modes 1, 2, 6, and 7) Pin Pin Functions and Selection Method PA7/TP7/ TIOCB2 Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, and bit PA7DDR select the pin function as follows. 16-bit timer channel 2 settings (1) in table below (2) in table below PA7DDR — 0 1 1 NDER7 — — 0 1 TIOCB2 output PA7 input PA7 output TP7 output Pin function TIOCB2 input* Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0. 16-bit timer channel 2 settings (2) IOB2 PA6/TP6/ TIOCA2 (1) (2) 0 1 IOB1 0 0 1 — IOB0 0 1 — — Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, and bit PA6DDR select the pin function as follows. 16-bit timer channel 2 settings (1) in table below (2) in table below PA6DDR — 0 1 1 NDER6 — — 0 1 TIOCA2 output PA6 input PA6 output TP6 output Pin function TIOCA2 input* Note: * TIOCA2 input when IOA2 = 1. 16-bit timer channel 2 settings (2) (1) PWM2 (2) 0 IOA2 (1) 1 0 1 — IOA1 0 0 1 — — IOA0 0 1 — — — Rev. 2.00 Sep 20, 2005 page 191 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PA5/TP5/ TIOCB1 Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, and bit PA5DDR select the pin function as follows. 16-bit timer channel 1 settings (1) in table below (2) in table below PA5DDR — 0 1 1 NDER5 — — 0 1 TIOCB1 output PA5 input PA5 output TP5 output Pin function TIOCB1 input* Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0. 16-bit timer channel 1 settings (2) (1) IOB2 PA4/TP4/ TIOCA1 (2) 0 1 IOB1 0 0 1 — IOB0 0 1 — — Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, and bit PA4DDR select the pin function as follows. 16-bit timer channel 1 settings (1) in table below PA4DDR (2) in table below — NDER4 Pin function 0 1 1 — — 0 1 TIOCA1 output PA4 input PA4 output TP4 output TIOCA1 input* Note: * TIOCA1 input when IOA2 = 1. 16-bit timer channel 1 settings (2) (1) PWM1 (2) 0 IOA2 (1) 1 0 1 — IOA1 0 0 1 — — IOA0 0 1 — — — Rev. 2.00 Sep 20, 2005 page 192 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.20 Port A Pin Functions (Modes 3 to 5) Pin Pin Functions and Selection Method Modes 3 and 4: Always used as A20 output. PA7/TP7/ TIOCB2/ A20 Pin function A20 output Mode 5: Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, bit A20E in BRCR, and bit PA7DDR select the pin function as follows. A20E 16-bit timer channel 2 settings 1 (1) in table below 0 (2) in table below — PA7DDR — 0 1 1 — NDER7 — — 0 1 — TIOCB2 output PA7 input PA7 output TP7 output A20 output Pin function TIOCB2 input* Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0. 16-bit timer channel 2 settings (2) IOB2 (1) (2) 0 1 IOB1 0 0 1 — IOB0 0 1 — — Rev. 2.00 Sep 20, 2005 page 193 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PA6/TP6/ Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, bit A21E in TIOCA2/A21 BRCR, and bit PA6DDR select the pin function as follows. A21E 16-bit timer channel 2 settings 1 (1) in table below PA6DDR Pin function (2) in table below — NDER6 0 0 1 — 1 — — — 0 1 — TIOCA2 output PA6 input PA6 output TP6 output A21 output TIOCA2 input* Note: * TIOCA2 input when IOA2 = 1. 16-bit timer channel 2 settings (2) (1) PWM2 (2) (1) 0 IOA2 1 0 1 — IOA1 0 0 1 — — IOA0 0 1 — — — PA5/TP5/ Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, bit A22E in TIOCB1/A22 BRCR, and bit PA5DDR select the pin function as follows. A22E 16-bit timer channel 1 settings 1 (1) in table below 0 (2) in table below — PA5DDR — 0 1 1 — NDER5 — — 0 1 — TIOCB1 output PA5 input PA5 output TP5 output A22 output Pin function TIOCB1 input* Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0. 16-bit timer channel 1 settings (2) IOB2 (1) (2) 0 1 IOB1 0 0 1 — IOB0 0 1 — — Rev. 2.00 Sep 20, 2005 page 194 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PA4/TP4/ Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, bit A23E in TIOCA1/A23 BRCR, and bit PA4DDR select the pin function as follows. A23E 16-bit timer channel 1 settings 1 (1) in table below PA4DDR Pin function (2) in table below — NDER4 0 0 1 — 1 — — — 0 1 — TIOCA1 output PA4 input PA4 output TP4 output A23 output TIOCA1 input* Note: * TIOCA1 input when IOA2 = 1. 16-bit timer channel 1 settings (2) (1) PWM1 (2) 0 IOA2 (1) 1 0 1 — IOA1 0 0 1 — — IOA0 0 1 — — — Rev. 2.00 Sep 20, 2005 page 195 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.21 Port A Pin Functions (Modes 1 to 7) Pin Pin Functions and Selection Method PA3/TP3/ TIOCB0/ TCLKD Bit PWM0 in TMDR, bits IOB2 to IOB0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR2 of the 8-bit timer, bit NDER3 in NDERA, and bit PA3DDR select the pin function as follows. 16-bit timer channel 0 settings (1) in table below (2) in table below PA3DDR — 0 1 1 NDER3 — — 0 1 TIOCB0 output PA3 input PA3 output TP3 output Pin function TIOCB0 input*1 TCLKD input*2 Notes: 1. TIOCB0 input when IOB2 = 1 and PWM0 = 0. 2. TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR2 are as shown in (3) in the table below. 16-bit timer channel 0 settings (2) (1) IOB2 (2) 0 1 IOB1 0 0 1 — IOB0 0 1 — — 8-bit timer channel 2 settings (4) CKS2 0 CKS1 — CKS0 — Rev. 2.00 Sep 20, 2005 page 196 of 800 REJ09B0260-0200 (3) 1 0 0 1 1 — Section 7 I/O Ports Pin Pin Functions and Selection Method PA2/TP2/ TIOCA0/ TCLKC Bit PWM0 in TMDR, bits IOA2 to IOA0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR0 of the 8-bit timer, bit NDER2 in NDERA, and bit PA2DDR select the pin function as follows. 16-bit timer channel 0 settings (1) in table below PA2DDR (2) in table below — NDER2 Pin function 0 1 1 — — 0 1 TIOCA0 output PA2 input PA2 output TP2 output TIOCA0 input*1 TCLKC input*2 Notes: 1. TIOCA0 input when IOA2 = 1. 2. TCLKC input when TPSC2 = TPSC1 = 1 and TPSC0 = 0 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR0 are as shown in (3) in the table below. 16-bit timer channel 0 settings (2) (1) PWM0 (2) (1) 0 IOA2 1 0 1 — IOA1 0 0 1 — — IOA0 0 1 — — — 8-bit timer channel 0 settings (4) CKS2 0 CKS1 — CKS0 — (3) 1 0 0 1 1 — Rev. 2.00 Sep 20, 2005 page 197 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PA1/TP1/ TCLKB Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR3 of the 8-bit timer, bit NDER1 in NDERA, and bit PA1DDR select the pin function as follows. PA1DDR 0 1 1 NDER1 — 0 1 PA1 input PA1 output TP1 output Pin function TCLKB input* Note: * CLKB input when MDF = 1 in TMDR, or TPSC2 = 1, TPSC1 = 0, and TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR3 are as shown in (1) in the table below. 8-bit timer channel 3 settings PA0/TP0/ TCLKA (2) CKS2 0 CKS1 — CKS0 — (1) 1 0 0 1 1 — Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR1 of the 8-bit timer, bit NDER0 in NDERA, and bit PA0DDR select the pin function as follows. PA0DDR 0 NDER0 — 0 1 PA0 input PA0 output TP0 output Pin function 1 TCLKA input* Note: * TCLKA input when MDF = 1 in TMDR, or TPSC2 = 1 and TPSC1 = 0, and TPSC0 = 0 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR1 are as shown in (1) in the table below. 8-bit timer channel 1 settings (2) CKS2 0 CKS1 — CKS0 — Rev. 2.00 Sep 20, 2005 page 198 of 800 REJ09B0260-0200 (1) 1 0 0 1 1 — Section 7 I/O Ports 7.12 Port B 7.12.1 Overview Port B is an 8-bit input/output port that is also used for output (TP15 to TP8) from the programmable timing pattern controller (TPC), input/output (TMIO3, TMO2, TMIO1, TMO0) by the 8-bit timer, and CS7 to CS4 output. See tables 7.23 and 7.24 for the selection of pin functions. A reset or hardware standby transition leaves port B as an input/output port. For output of CS7 to CS4 in modes 1 to 5, see section 6.3.4, Chip Select Signals. Pins not assigned to any of these functions are available for generic input/output. Figure 7.11 shows the pin configuration of port B. Pins in port B can drive one TTL load and a 30-pF capacitive load. They can also drive darlington transistor pair. Rev. 2.00 Sep 20, 2005 page 199 of 800 REJ09B0260-0200 Section 7 I/O Ports Port B pins PB7/TP15 PB6/TP14 PB5/TP13 PB4/TP12 Port B PB3/TP11 /TMIO3/CS4 PB2/TP10 /TMO2/CS5 PB1/TP9 /TMIO1/CS6 PB0/TP8 /TMO0/CS7 Pin functions in modes 1 to 5 PB7 (input/output)/TP15 (output) PB6 (input/output)/TP14 (output) PB5 (input/output)/TP13 (output) PB4 (input/output)/TP12 (output) PB3 (input/output)/TP11 (output) /TMIO3 (input/output) /CS4 (output) PB2 (input/output)/TP10 (output) /TMO2 (output) /CS5 (output) PB1 (input/output)/TP9 (output) /TMIO1 (input/output) /CS6 (output) PB0 (input/output)/TP8 (output) /TMO0 (output) /CS7 (output) Pin functions in modes 6 and 7 PB7 (input/output)/TP15 (output) PB6 (input/output)/TP14 (output) PB5 (input/output)/TP13 (output) PB4 (input/output)/TP12 (output) PB3 (input/output)/TP11 (output) /TMIO3 (input/output) PB2 (input/output)/TP10 (output) /TMO2 (output) PB1 (input/output)/TP9 (output) /TMIO1 (input/output) PB0 (input/output)/TP8 (output) /TMO0 (output) Figure 7.11 Port B Pin Configuration Rev. 2.00 Sep 20, 2005 page 200 of 800 REJ09B0260-0200 Section 7 I/O Ports 7.12.2 Register Descriptions Table 7.22 summarizes the registers of port B. Table 7.22 Port B Registers Address* Name Abbreviation R/W Initial Value H'EE00A Port B data direction register PBDDR W H'00 H'FFFDA Port B data register PBDR R/W H'00 Note: * Lower 20 bits of the address in advanced mode. Port B Data Direction Register (PBDDR): PBDDR is an 8-bit write-only register that can select input or output for each pin in port B. When pins are used for TPC output, the corresponding PBDDR bits must also be set. Bit 7 6 5 4 3 2 1 0 PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR Initial value 0 0 0 0 0 0 0 0 Read/Write W W W W W W W W Port B data direction 7 to 0 These bits select input or output for port B pins The pin functions that can be selected for port B differ between modes 1 to 5, and modes 6 and 7. For the method of selecting the pin functions, see tables 7.23 and 7.24. When port B functions as an input/output port, a pin in port B becomes an output port if the corresponding PBDDR bit is set to 1, and an input port if this bit is cleared to 0. PBDDR is a write-only register. Its value cannot be read. All bits return 1 when read. PBDDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port B is functioning as an input/output port and a PBDDR bit is set to 1, the corresponding pin maintains its output state. Rev. 2.00 Sep 20, 2005 page 201 of 800 REJ09B0260-0200 Section 7 I/O Ports Port B Data Register (PBDR): PBDR is an 8-bit readable/writable register that stores output data for pins port B. When port B functions as an output port, the value of this register is output. When a bit in PBDDR is set to 1, if port B is read the value of the corresponding PBDR bit is returned. When a bit in PBDDR is cleared to 0, if port B is read the corresponding pin logic level is read. Bit 7 6 5 4 3 2 1 0 PB 7 PB 6 PB 5 PB 4 PB 3 PB 2 PB 1 PB 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Port B data 7 to 0 These bits store data for port B pins PBDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Rev. 2.00 Sep 20, 2005 page 202 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.23 Port B Pin Functions (Modes 1 to 5) Pin Pin Functions and Selection Method PB7/TP15 Bit NDER15 in NDERB and bit PB7DDR select the pin function as follows. PB7DDR 0 1 1 NDER15 — 0 1 PB7 input PB7 output TP15 output Pin function PB6/TP14 Bit NDER14 in NDERB and bit PB6DDR select the pin function as follows. PB6DDR 0 1 1 NDER14 — 0 1 PB6 input PB6 output TP14 output Pin function PB5/TP13 Bit NDER13 in NDERB and bit PB5DDR select the pin function as follows. PB5DDR 0 1 1 NDER13 — 0 1 PB5 input PB5 output TP13 output Pin function PB4/TP12 Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows. PB4DDR 0 1 1 NDER12 — 0 1 PB4 input PB4 output TP12 output Pin function PB3/TP11/ Bits OIS3/2 and OS1/0 in 8TCSR3, bit CS4E in CSCR, bit NDER11 in NDERB, and TMIO3/CS4 bit PB3DDR select the pin function as follows. All 0 OIS3/2 and OS1/0 CS4E Not all 0 1 — PB3DDR 0 1 1 — — NDER11 — 0 1 — — PB3 input PB3 output TP11 output CS4 TMIO3 output Pin function 0 output TMIO3 input* Note: * TMIO3 input when bit ICE = 1 in 8TCSR3. Rev. 2.00 Sep 20, 2005 page 203 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PB2/TP10/ TMO2/CS5 Bits OIS3/2 and OS1/0 in 8TCSR2, bit CS5E in CSCR, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows. OIS3/2 and OS1/0 All 0 CS5E PB2DDR NDER10 Pin function Not all 0 0 0 1 1 1 — — — — 0 1 — — PB2 input PB2 output TP10 output CS5 TMIO2 output output PB1/TP9/ Bits OIS3/2 and OS1/0 in 8TCSR1, bit CS6E in CSCR, bit NDER9 in NDERB, and bit TMIO1/CS6 PB1DDR select the pin function as follows. All 0 OIS3/2 and OS1/0 CS6E PB1DDR NDER9 Pin function Not all 0 0 0 1 1 1 — — — — 0 1 — — PB1 input PB1 output TP9 output CS6 TMIO1 output output TMIO1 input* Note: * TMIO1 input when bit ICE = 1 in 8TCSR1. PB0/TP8/ TMO0/CS7 Bits OIS3/2 and OS1/0 in 8TCSR0, bit CS7E in CSCR, bit NDER8 in NDERB, and bit PB0DDR select the pin function as follows. OIS3/2 and OS1/0 All 0 CS7E Not all 0 0 1 — PB0DDR 0 1 1 — — NDER8 — 0 1 — — PB0 input PB0 output TP8 output CS7 output TMO0 output Pin function Rev. 2.00 Sep 20, 2005 page 204 of 800 REJ09B0260-0200 Section 7 I/O Ports Table 7.24 Port B Pin Functions (Modes 6 and 7) Pin Pin Functions and Selection Method PB7/TP15 Bit NDER15 in NDERB and bit PB7DDR select the pin function as follows. PB7DDR 0 1 1 NDER15 — 0 1 PB7 input PB7 output TP15 output Pin function PB6/TP14 Bit NDER14 in NDERB and bit PB6DDR select the pin function as follows. PB6DDR 0 1 1 NDER14 — 0 1 PB6 input PB6 output TP14 output Pin function PB5/TP13 Bit NDER13 in NDERB and bit PB5DDR select the pin function as follows. PB5DDR 0 1 1 NDER13 — 0 1 PB5 input PB5 output TP13 output Pin function PB4/TP12 Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows. PB4DDR 0 1 1 NDER12 — 0 1 PB4 input PB4 output TP12 output Pin function PB3/TP11/ TMIO3 Bits OIS3/2 and OS1/0 in 8TCSR3, bit NDER11 in NDERB, and bit PB3DDR select the pin function as follows. All 0 OIS3/2 and OS1/0 Not all 0 PB3DDR 0 1 1 — NDER11 — 0 1 — PB3 input PB3 output Pin function TP11 output TMIO3 input* TMIO3 output Note: * TMIO3 input when bit ICE = 1 in 8TCSR3. Rev. 2.00 Sep 20, 2005 page 205 of 800 REJ09B0260-0200 Section 7 I/O Ports Pin Pin Functions and Selection Method PB2/TP10/ TMO2 Bits OIS3/2 and OS1/0 in 8TCSR2, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows. OIS3/2 and OS1/0 Not all 0 PB2DDR 0 1 1 — NDER10 — 0 1 — PB2 input PB2 output TP10 output TMO2 output Pin function PB1/TP9/ TMIO1 All 0 Bits OIS3/2 and OS1/0 in 8TCSR1, bit NDER9 in NDERB, and bit PB1DDR select the pin function as follows. OIS3/2 and OS1/0 All 0 Not all 0 PB1DDR 0 1 1 — NDER9 — 0 1 — PB1 input PB1 output Pin function TP9 output TMIO1 input* TMIO1 output Note: * TMIO1 input when bit ICE = 1 in 8TCSR1. PB2/TP8/ TMO0 Bits OIS3/2 and OS1/0 in 8TCSR0, bit NDER8 in NDERB, and bit PB0DDR select the pin function as follows. OIS3/2 and OS1/0 All 0 Not all 0 PB2DDR 0 1 1 — NDER8 — 0 1 — PB0 input PB0 output TP8 output TMO0 output Pin function Rev. 2.00 Sep 20, 2005 page 206 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Section 8 16-Bit Timer 8.1 Overview The H8/3024 Group has built-in 16-bit timer module with three 16-bit counter channels. 8.1.1 Features 16-bit timer features are listed below. • Capability to process up to 6 pulse outputs or 6 pulse inputs • Six general registers (GRs, two per channel) with independently-assignable output compare or input capture functions • Selection of eight counter clock sources for each channel: Internal clocks: φ, φ/2, φ/4, φ/8 External clocks: TCLKA, TCLKB, TCLKC, TCLKD • Five operating modes selectable in all channels: Waveform output by compare match Selection of 0 output, 1 output, or toggle output (only 0 or 1 output in channel 2) Input capture function Rising edge, falling edge, or both edges (selectable) Counter clearing function Counters can be cleared by compare match or input capture Synchronization Two or more timer counters (16TCNTs) can be preset simultaneously, or cleared simultaneously by compare match or input capture. Counter synchronization enables synchronous register input and output. PWM mode PWM output can be provided with an arbitrary duty cycle. With synchronization, up to three-phase PWM output is possible • Phase counting mode selectable in channel 2 Two-phase encoder output can be counted automatically. • High-speed access via internal 16-bit bus The 16TCNTs and GRs can be accessed at high speed via a 16-bit bus. • Any initial timer output value can be set Rev. 2.00 Sep 20, 2005 page 207 of 800 REJ09B0260-0200 Section 8 16-Bit Timer • Nine interrupt sources Each channel has two compare match/input capture interrupts and an overflow interrupt. All interrupts can be requested independently. • Output triggering of programmable timing pattern controller (TPC) Compare match/input capture signals from channels 0 to 2 can be used as TPC output triggers. Table 8.1 summarizes the 16-bit timer functions. Table 8.1 16-bit timer Functions Item Channel 0 Channel 1 Channel 2 Internal clocks: φ, φ/2, φ/4, φ/8 Clock sources External clocks: TCLKA, TCLKB, TCLKC, TCLKD, selectable independently General registers (output compare/input capture registers) GRA0, GRB0 GRA1, GRB1 GRA2, GRB2 Input/output pins TIOCA0, TIOCB0 TIOCA1, TIOCB1 TIOCA2, TIOCB2 Counter clearing function GRA0/GRB0 compare match or input capture GRA1/GRB1 compare match or input capture GRA2/GRB2 compare match or input capture Initial output value setting function Available Available Available Compare match output 0 Available Available Available 1 Available Available Available Toggle Available Available Not available Input capture function Available Available Available Synchronization Available Available Available PWM mode Available Available Available Phase counting mode Not available Not available Available Interrupt sources Three sources Three sources Three sources • Compare match/ input capture A0 • Compare match/ input capture A1 • Compare match/ input capture A2 • Compare match/ input capture B0 • Compare match/ input capture B1 • Compare match/ input capture B2 • Overflow • Overflow • Overflow Rev. 2.00 Sep 20, 2005 page 208 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.1.2 Block Diagrams 16-bit timer Block Diagram (Overall): Figure 8.1 is a block diagram of the 16-bit timer. TCLKA to TCLKD IMIA0 to IMIA2 IMIB0 to IMIB2 OVI0 to OVI2 Clock selector φ, φ/2, φ/4, φ/8 Control logic TIOCA0 to TIOCA2 TIOCB0 to TIOCB2 TOLR TISRA TISRB On-chip data bus TMDR Bus interface TSNR 16-bit timer channel 0 16-bit timer channel 1 16-bit timer channel 2 TSTR TISRC Module data bus Legend: TSTR: Timer start register (8 bits) TSNR: Timer synchro register (8 bits) TMDR: Timer mode register (8 bits) TOLR: Timer output level setting register (8 bits) TISRA: Timer interrupt status register A (8 bits) TISRB: Timer interrupt status register B (8 bits) TISRC: Timer interrupt status register C (8 bits) Figure 8.1 16-bit timer Block Diagram (Overall) Rev. 2.00 Sep 20, 2005 page 209 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Block Diagram of Channels 0 and 1: 16-bit timer channels 0 and 1 are functionally identical. Both have the structure shown in figure 8.2. TCLKA to TCLKD φ, φ/2, φ/4, φ/8 TIOCA0 TIOCB0 Clock selector Control logic IMIA0 IMIB0 OVI0 TIOR 16TCR GRB GRA 16TCNT Comparator Module data bus Legend: 16TCNT: GRA, GRB: TCR: TIOR: Timer counter (16 bits) General registers A and B (input capture/output compare registers) (16 bits × 2) Timer control register (8 bits) Timer I/O control register (8 bits) Figure 8.2 Block Diagram of Channels 0 and 1 Rev. 2.00 Sep 20, 2005 page 210 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Block Diagram of Channel 2: Figure 8.3 is a block diagram of channel 2 TCLKA to TCLKD φ, φ/2, φ/4, φ/8 TIOCA2 TIOCB2 Clock selector Control logic IMIA2 IMIB2 OVI2 TIOR2 16TCR2 GRB2 GRA2 16TCNT2 Comparator Module data bus Legend: Timer counter 2 (16 bits) 16TCNT2: GRA2, GRB2: General registers A2 and B2 (input capture/output compare registers) (16 bits × 2) Timer control register 2 (8 bits) TCR2: Timer I/O control register 2 (8 bits) TIOR2: Figure 8.3 Block Diagram of Channel 2 Rev. 2.00 Sep 20, 2005 page 211 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.1.3 Pin Configuration Table 8.2 summarizes the 16-bit timer pins. Table 8.2 16-bit timer Pins Channel Name Abbreviation Input/ Output Common Clock input A TCLKA Input External clock A input pin (phase-A input pin in phase counting mode) Clock input B TCLKB Input External clock B input pin (phase-B input pin in phase counting mode) Clock input C TCLKC Input External clock C input pin Clock input D TCLKD Input External clock D input pin Input capture/output TIOCA0 compare A0 Input/ output GRA0 output compare or input capture pin PWM output pin in PWM mode Input capture/output TIOCB0 compare B0 Input/ output GRB0 output compare or input capture pin Input capture/output TIOCA1 compare A1 Input/ output GRA1 output compare or input capture pin PWM output pin in PWM mode Input capture/output TIOCB1 compare B1 Input/ output GRB1 output compare or input capture pin Input capture/output TIOCA2 compare A2 Input/ output GRA2 output compare or input capture pin PWM output pin in PWM mode Input capture/output TIOCB2 compare B2 Input/ output GRB2 output compare or input capture pin 0 1 2 Rev. 2.00 Sep 20, 2005 page 212 of 800 REJ09B0260-0200 Function Section 8 16-Bit Timer 8.1.4 Register Configuration Table 8.3 summarizes the 16-bit timer registers. Table 8.3 16-bit timer Registers Channel Address*1 Name Abbreviation R/W Initial Value Common H'FFF60 Timer start register TSTR R/W H'F8 H'FFF61 Timer synchro register TSNC R/W H'F8 0 1 H'FFF62 Timer mode register TMDR R/W H'98 H'FFF63 Timer output level setting register TOLR W H'C0 H'FFF64 Timer interrupt status register A TISRA H'88 H'FFF65 Timer interrupt status register B TISRB R/(W)*2 R/(W)*2 TISRC R/(W)*2 H'88 H'88 H'FFF66 Timer interrupt status register C H'FFF68 Timer control register 0 16TCR0 R/W H'80 H'FFF69 Timer I/O control register 0 TIOR0 R/W H'88 H'FFF6A Timer counter 0H 16TCNT0H R/W H'00 H'FFF6B Timer counter 0L 16TCNT0L R/W H'00 H'FFF6C General register A0H GRA0H R/W H'FF H'FFF6D General register A0L GRA0L R/W H'FF H'FFF6E General register B0H GRB0H R/W H'FF H'FFF6F General register B0L GRB0L R/W H'FF H'FFF70 Timer control register 1 16TCR1 R/W H'80 H'FFF71 Timer I/O control register 1 TIOR1 R/W H'88 H'FFF72 Timer counter 1H 16TCNT1H R/W H'00 H'FFF73 Timer counter 1L 16TCNT1L R/W H'00 H'FFF74 General register A1H GRA1H R/W H'FF H'FFF75 General register A1L GRA1L R/W H'FF H'FFF76 General register B1H GRB1H R/W H'FF H'FFF77 General register B1L GRB1L R/W H'FF Rev. 2.00 Sep 20, 2005 page 213 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Abbreviation Initial Value Channel Address*1 Name 2 H'FFF78 Timer control register 2 16TCR2 R/W H'80 H'FFF79 Timer I/O control register 2 TIOR2 R/W H'88 H'FFF7A Timer counter 2H 16TCNT2H R/W H'00 H'FFF7B Timer counter 2L 16TCNT2L R/W H'00 H'FFF7C General register A2H GRA2H R/W H'FF H'FFF7D General register A2L GRA2L R/W H'FF R/W H'FFF7E General register B2H GRB2H R/W H'FF H'FFF7F General register B2L GRB2L R/W H'FF Notes: 1. The lower 20 bits of the address in advanced mode are indicated. 2. Only 0 can be written in bits 3 to 0, to clear the flags. 8.2 Register Descriptions 8.2.1 Timer Start Register (TSTR) TSTR is an 8-bit readable/writable register that starts and stops the timer counter (16TCNT) in channels 0 to 2. Bit 7 6 5 4 3 2 1 0 — — — — — STR2 STR1 STR0 Initial value 1 1 1 1 1 0 0 0 Read/Write — — — — — R/W R/W R/W Reserved bits Counter start 2 to 0 These bits start and stop 16TCNT2 to 16TCNT0 TSTR is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 214 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 2—Counter Start 2 (STR2): Starts and stops timer counter 2 (16TCNT2). Bit 2 STR2 Description 0 16TCNT2 is halted 1 16TCNT2 is counting (Initial value) Bit 1—Counter Start 1 (STR1): Starts and stops timer counter 1 (16TCNT1). Bit 1 STR1 Description 0 16TCNT1 is halted 1 16TCNT1 is counting (Initial value) Bit 0—Counter Start 0 (STR0): Starts and stops timer counter 0 (16TCNT0). Bit 0 STR0 Description 0 16TCNT0 is halted 1 16TCNT0 is counting 8.2.2 (Initial value) Timer Synchro Register (TSNC) TSNC is an 8-bit readable/writable register that selects whether channels 0 to 2 operate independently or synchronously. Channels are synchronized by setting the corresponding bits to 1. Bit 7 6 5 4 3 2 1 0 — — — — — SYNC2 SYNC1 SYNC0 Initial value 1 1 1 1 1 0 0 0 Read/Write — — — — — R/W R/W R/W Reserved bits Timer sync 2 to 0 These bits synchronize channels 2 to 0 TSNC is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 215 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 2—Timer Sync 2 (SYNC2): Selects whether channel 2 operates independently or synchronously. Bit 2 SYNC2 Description 0 Channel 2’s timer counter (16TCNT2) operates independently 16TCNT2 is preset and cleared independently of other channels 1 Channel 2 operates synchronously 16TCNT2 can be synchronously preset and cleared (Initial value) Bit 1—Timer Sync 1 (SYNC1): Selects whether channel 1 operates independently or synchronously. Bit 1 SYNC1 Description 0 Channel 1’s timer counter (16TCNT1) operates independently 16TCNT1 is preset and cleared independently of other channels 1 Channel 1 operates synchronously 16TCNT1 can be synchronously preset and cleared (Initial value) Bit 0—Timer Sync 0 (SYNC0): Selects whether channel 0 operates independently or synchronously. Bit 0 SYNC0 Description 0 Channel 0’s timer counter (16TCNT0) operates independently 16TCNT0 is preset and cleared independently of other channels 1 Channel 0 operates synchronously 16TCNT0 can be synchronously preset and cleared Rev. 2.00 Sep 20, 2005 page 216 of 800 REJ09B0260-0200 (Initial value) Section 8 16-Bit Timer 8.2.3 Timer Mode Register (TMDR) TMDR is an 8-bit readable/writable register that selects PWM mode for channels 0 to 2. It also selects phase counting mode and the overflow flag (OVF) setting conditions for channel 2. Bit 7 6 5 4 3 2 1 0 — MDF FDIR — — PWM2 PWM1 PWM0 Initial value 1 0 0 1 1 0 0 0 Read/Write — R/W R/W — — R/W R/W R/W Reserved bit PWM modes 2 to 0 These bits select PWM mode for channels 2 to 0 Flag direction Selects the setting condition for the overflow flag (OVF) in TISRC Phase counting mode flag Selects phase counting mode for channel 2 Reserved bit TMDR is initialized to H'98 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Bit 6—Phase Counting Mode Flag (MDF): Selects whether channel 2 operates normally or in phase counting mode. Bit 6 MDF Description 0 Channel 2 operates normally 1 Channel 2 operates in phase counting mode (Initial value) When MDF is set to 1 to select phase counting mode, 16TCNT2 operates as an up/down-counter and pins TCLKA and TCLKB become counter clock input pins. 16TCNT2 counts both rising and falling edges of TCLKA and TCLKB, and counts up or down as follows. Counting Direction Down-Counting TCLKA pin TCLKB pin Up-Counting High Low Low High Low High High Low Rev. 2.00 Sep 20, 2005 page 217 of 800 REJ09B0260-0200 Section 8 16-Bit Timer In phase counting mode, external clock edge selection by bits CKEG1 and CKEG0 in 16TCR2 and counter clock selection by bits TPSC2 to TPSC0 are invalid, and the above phase counting mode operations take precedence. The counter clearing condition selected by the CCLR1 and CCLR0 bits in 16TCR2 and the compare match/input capture settings and interrupt functions of TIOR2, TISRA, TISRB, TISRC remain effective in phase counting mode. Bit 5—Flag Direction (FDIR): Designates the setting condition for the OVF flag in TISRC. The FDIR designation is valid in all modes in channel 2. Bit 5 FDIR Description 0 OVF is set to 1 in TISRC when 16TCNT2 overflows or underflows 1 OVF is set to 1 in TISRC when 16TCNT2 overflows (Initial value) Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1. Bit 2—PWM Mode 2 (PWM2): Selects whether channel 2 operates normally or in PWM mode. Bit 2 PWM2 Description 0 Channel 2 operates normally 1 Channel 2 operates in PWM mode (Initial value) When bit PWM2 is set to 1 to select PWM mode, pin TIOCA2 becomes a PWM output pin. The output goes to 1 at compare match with GRA2, and to 0 at compare match with GRB2. Bit 1—PWM Mode 1 (PWM1): Selects whether channel 1 operates normally or in PWM mode. Bit 1 PWM1 Description 0 Channel 1 operates normally 1 Channel 1 operates in PWM mode (Initial value) When bit PWM1 is set to 1 to select PWM mode, pin TIOCA1 becomes a PWM output pin. The output goes to 1 at compare match with GRA1, and to 0 at compare match with GRB1. Rev. 2.00 Sep 20, 2005 page 218 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 0—PWM Mode 0 (PWM0): Selects whether channel 0 operates normally or in PWM mode. Bit 0 PWM0 Description 0 Channel 0 operates normally 1 Channel 0 operates in PWM mode (Initial value) When bit PWM0 is set to 1 to select PWM mode, pin TIOCA0 becomes a PWM output pin. The output goes to 1 at compare match with GRA0, and to 0 at compare match with GRB0. 8.2.4 Timer Interrupt Status Register A (TISRA) TISRA is an 8-bit readable/writable register that indicates GRA compare match or input capture and enables or disables GRA compare match and input capture interrupt requests. Bit 7 — Initial value Read/Write 1 — 3 2 1 0 IMIEA2 IMIEA1 IMIEA0 — IMFA2 IMFA1 IMFA0 0 1 0 0 0 — R/(W)* R/(W)* R/(W)* 6 0 R/W 5 R/W 4 0 R/W Input capture/compare match flags A2 to A0 Status flags indicating GRA compare match or input capture Reserved bit Input capture/compare match interrupt enable A2 to A0 These bits enable or disable interrupts by the IMFA flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRA is initialized to H'88 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Rev. 2.00 Sep 20, 2005 page 219 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 6—Input Capture/Compare Match Interrupt Enable A2 (IMIEA2): Enables or disables the interrupt requested by the IMFA2 when IMFA2 flag is set to 1. Bit 6 IMIEA2 Description 0 IMIA2 interrupt requested by IMFA2 flag is disabled 1 IMIA2 interrupt requested by IMFA2 flag is enabled (Initial value) Bit 5—Input Capture/Compare Match Interrupt Enable A1 (IMIEA1): Enables or disables the interrupt requested by the IMFA1 flag when IMFA1 is set to 1. Bit 5 IMIEA1 Description 0 IMIA1 interrupt requested by IMFA1 flag is disabled 1 IMIA1 interrupt requested by IMFA1 flag is enabled (Initial value) Bit 4—Input Capture/Compare Match Interrupt Enable A0 (IMIEA0): Enables or disables the interrupt requested by the IMFA0 flag when IMFA0 is set to 1. Bit 4 IMIEA0 Description 0 IMIA0 interrupt requested by IMFA0 flag is disabled 1 IMIA0 interrupt requested by IMFA0 flag is enabled (Initial value) Bit 3—Reserved: This bit cannot be modified and is always read as 1. Bit 2—Input Capture/Compare Match Flag A2 (IMFA2): This status flag indicates GRA2 compare match or input capture events. Bit 2 IMFA2 Description 0 [Clearing condition] (Initial value) Read IMFA2 flag when IMFA2 =1, then write 0 in IMFA2 flag 1 [Setting conditions] • 16TCNT2 = GRA2 when GRA2 functions as an output compare register • 16TCNT2 value is transferred to GRA2 by an input capture signal when GRA2 functions as an input capture register Rev. 2.00 Sep 20, 2005 page 220 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 1—Input Capture/Compare Match Flag A1 (IMFA1): This status flag indicates GRA1 compare match or input capture events. Bit 1 IMFA1 Description 0 [Clearing condition] (Initial value) Read IMFA1 flag when IMFA1 =1, then write 0 in IMFA1 flag 1 [Setting conditions] • 16TCNT1 = GRA1 when GRA1 functions as an output compare register • 16TCNT1 value is transferred to GRA1 by an input capture signal when GRA1 functions as an input capture register Bit 0—Input Capture/Compare Match Flag A0 (IMFA0): This status flag indicates GRA0 compare match or input capture events. Bit 0 IMFA0 Description 0 [Clearing condition] (Initial value) Read IMFA0 flag when IMFA0 =1, then write 0 in IMFA0 flag 1 [Setting conditions] • 16TCNT0 = GRA0 when GRA0 functions as an output compare register • 16TCNT0 value is transferred to GRA0 by an input capture signal when GRA0 functions as an input capture register Rev. 2.00 Sep 20, 2005 page 221 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.2.5 Timer Interrupt Status Register B (TISRB) TISRB is an 8-bit readable/writable register that indicates GRB compare match or input capture and enables or disables GRB compare match and input capture interrupt requests. Bit 7 — Initial value Read/Write 1 — 6 5 4 IMIEB2 IMIEB1 IMIEB0 0 R/W 0 R/W 0 R/W 3 2 1 0 — IMFB2 IMFB1 IMFB0 1 0 0 0 — R/(W)* R/(W)* R/(W)* Input capture/compare match flags B2 to B0 Status flags indicating GRB compare match or input capture Reserved bit Input capture/compare match interrupt enable B2 to B0 These bits enable or disable interrupts by the IMFB flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRB is initialized to H'88 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Bit 6—Input Capture/Compare Match Interrupt Enable B2 (IMIEB2): Enables or disables the interrupt requested by the IMFB2 when IMFB2 flag is set to 1. Bit 6 IMIEB2 Description 0 IMIB2 interrupt requested by IMFB2 flag is disabled 1 IMIB2 interrupt requested by IMFB2 flag is enabled Rev. 2.00 Sep 20, 2005 page 222 of 800 REJ09B0260-0200 (Initial value) Section 8 16-Bit Timer Bit 5—Input Capture/Compare Match Interrupt Enable B1 (IMIEB1): Enables or disables the interrupt requested by the IMFB1 when IMFB1 flag is set to 1. Bit 5 IMIEB1 Description 0 IMIB1 interrupt requested by IMFB1 flag is disabled 1 IMIB1 interrupt requested by IMFB1 flag is enabled (Initial value) Bit 4—Input Capture/Compare Match Interrupt Enable B0 (IMIEB0): Enables or disables the interrupt requested by the IMFB0 when IMFB0 flag is set to 1. Bit 4 IMIEB0 Description 0 IMIB0 interrupt requested by IMFB0 flag is disabled 1 IMIB0 interrupt requested by IMFB0 flag is enabled (Initial value) Bit 3—Reserved: This bit cannot be modified and is always read as 1. Bit 2—Input Capture/Compare Match Flag B2 (IMFB2): This status flag indicates GRB2 compare match or input capture events. Bit 2 IMFB2 Description 0 [Clearing condition] (Initial value) Read IMFB2 flag when IMFB2 =1, then write 0 in IMFB2 flag 1 [Setting conditions] • 16TCNT2 = GRB2 when GRB2 functions as an output compare register • 16TCNT2 value is transferred to GRB2 by an input capture signal when GRB2 functions as an input capture register Rev. 2.00 Sep 20, 2005 page 223 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 1—Input Capture/Compare Match Flag B1 (IMFB1): This status flag indicates GRB1 compare match or input capture events. Bit 1 IMFB1 Description 0 [Clearing condition] (Initial value) Read IMFB1 flag when IMFB1 =1, then write 0 in IMFB1 flag 1 [Setting conditions] • 16TCNT1 = GRB1 when GRB1 functions as an output compare register • 16TCNT1 value is transferred to GRB1 by an input capture signal when GRB1 functions as an input capture register Bit 0—Input Capture/Compare Match Flag B0 (IMFB0): This status flag indicates GRB0 compare match or input capture events. Bit 0 IMFB0 Description 0 [Clearing condition] (Initial value) Read IMFB0 flag when IMFB0 =1, then write 0 in IMFB0 flag 1 [Setting conditions] • 16TCNT0 = GRB0 when GRB0 functions as an output compare register • 16TCNT0 value is transferred to GRB0 by an input capture signal when GRB0 functions as an input capture register Rev. 2.00 Sep 20, 2005 page 224 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.2.6 Timer Interrupt Status Register C (TISRC) TISRC is an 8-bit readable/writable register that indicates 16TCNT overflow or underflow and enables or disables overflow interrupt requests. Bit 7 6 5 4 3 2 1 0 — OVIE2 OVIE1 OVIE0 — OVF2 OVF1 OVF0 0 0 R/(W)* R/(W)* 0 R/(W)* Initial value 1 0 0 0 1 Read/Write — R/W R/W R/W — Overflow flags 2 to 0 Status flags indicating interrupts by OVF flags Reserved bit Overflow interrupt enable 2 to 0 These bits enable or disable interrupts by the OVF flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRC is initialized to H'88 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Bit 6—Overflow Interrupt Enable 2 (OVIE2): Enables or disables the interrupt requested by the OVF2 when OVF2 flag is set to 1. Bit 6 OVIE2 Description 0 OVI2 interrupt requested by OVF2 flag is disabled 1 OVI2 interrupt requested by OVF2 flag is enabled (Initial value) Rev. 2.00 Sep 20, 2005 page 225 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 5—Overflow Interrupt Enable 1 (OVIE1): Enables or disables the interrupt requested by the OVF1 when OVF1 flag is set to 1. Bit 5 OVIE1 Description 0 OVI1 interrupt requested by OVF1 flag is disabled 1 OVI1 interrupt requested by OVF1 flag is enabled (Initial value) Bit 4—Overflow Interrupt Enable 0 (OVIE0): Enables or disables the interrupt requested by the OVF0 when OVF0 flag is set to 1. Bit 4 OVIE0 Description 0 OVI0 interrupt requested by OVF0 flag is disabled 1 OVI0 interrupt requested by OVF0 flag is enabled (Initial value) Bit 3—Reserved: This bit cannot be modified and is always read as 1. Bit 2—Overflow Flag 2 (OVF2): This status flag indicates 16TCNT2 overflow. Bit 2 OVF2 Description 0 [Clearing condition] (Initial value) Read OVF2 flag when OVF2 =1, then write 0 in OVF2 flag 1 [Setting condition] 16TCNT2 overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF Note: 16TCNT underflow occurs when 16TCNT operates as an up/down-counter. Underflow occurs only when channel 2 operates in phase counting mode (MDF = 1 in TMDR). Bit 1—Overflow Flag 1 (OVF1): This status flag indicates 16TCNT1 overflow. Bit 1 OVF1 Description 0 [Clearing condition] Read OVF1 flag when OVF1 =1, then write 0 in OVF1 flag 1 [Setting condition] 16TCNT1 overflowed from H'FFFF to H'0000 Rev. 2.00 Sep 20, 2005 page 226 of 800 REJ09B0260-0200 (Initial value) Section 8 16-Bit Timer Bit 0—Overflow Flag 0 (OVF0): This status flag indicates 16TCNT0 overflow. Bit 0 OVF0 Description 0 [Clearing condition] (Initial value) Read OVF0 flag when OVF0 =1, then write 0 in OVF0 flag 1 [Setting condition] 16TCNT0 overflowed from H'FFFF to H'0000 8.2.7 Timer Counters (16TCNT) 16TCNT is a 16-bit counter. The 16-bit timer has three 16TCNTs, one for each channel. Channel Abbreviation Function 0 16TCNT0 Up-counter 1 16TCNT1 2 16TCNT2 Phase counting mode: up/down-counter Other modes: up-counter Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Each 16TCNT is a 16-bit readable/writable register that counts pulse inputs from a clock source. The clock source is selected by bits TPSC2 to TPSC0 in 16TCR. 16TCNT0 and 16TCNT1 are up-counters. 16TCNT2 is an up/down-counter in phase counting mode and an up-counter in other modes. 16TCNT can be cleared to H'0000 by compare match with GRA or GRB or by input capture to GRA or GRB (counter clearing function). When 16TCNT overflows (changes from H'FFFF to H'0000), the OVF flag is set to 1 in TISRC of the corresponding channel. When 16TCNT underflows (changes from H'0000 to H'FFFF), the OVF flag is set to 1 in TISRC of the corresponding channel. Rev. 2.00 Sep 20, 2005 page 227 of 800 REJ09B0260-0200 Section 8 16-Bit Timer The 16TCNTs are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. Each 16TCNT is initialized to H'0000 by a reset and in standby mode. 8.2.8 General Registers (GRA, GRB) The general registers are 16-bit registers. The 16-bit timer has 6 general registers, two in each channel. Channel Abbreviation Function 0 GRA0, GRB0 Output compare/input capture register 1 GRA1, GRB1 2 GRA2, GRB2 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W A general register is a 16-bit readable/writable register that can function as either an output compare register or an input capture register. The function is selected by settings in TIOR. When a general register is used as an output compare register, its value is constantly compared with the 16TCNT value. When the two values match (compare match), the IMFA or IMFB flag is set to 1 in TISRA/TISRB. Compare match output can be selected in TIOR. When a general register is used as an input capture register, an external input capture signal are detected and the current 16TCNT value is stored in the general register. The corresponding IMFA or IMFB flag in TISRA/TISRB is set to 1 at the same time. The edges of the input capture signal are selected in TIOR. TIOR settings are ignored in PWM mode. General registers are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. General registers are set as output compare registers (with no pin output) and initialized to H'FFFF by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 228 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.2.9 Timer Control Registers (16TCR) 16TCR is an 8-bit register. The 16-bit timer has three 16TCRs, one in each channel. Channel Abbreviation Function 0 16TCR0 1 16TCR1 2 16TCR2 16TCR controls the timer counter. The 16TCRs in all channels are functionally identical. When phase counting mode is selected in channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2 to TPSC0 in 16TCR2 are ignored. Bit 7 6 5 4 3 2 1 0 — CCLR1 CCLR0 TPSC2 TPSC1 TPSC0 Initial value 1 0 0 0 0 0 0 0 Read/Write — R/W R/W R/W R/W R/W R/W R/W CKEG1 CKEG0 Timer prescaler 2 to 0 These bits select the timer counter clock Clock edge 1/0 These bits select external clock edges Counter clear 1/0 These bits select the counter clear source Reserved bit Each 16TCR is an 8-bit readable/writable register that selects the timer counter clock source, selects the edge or edges of external clock sources, and selects how the counter is cleared. 16TCR is initialized to H'80 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Bits 6 and 5—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select how 16TCNT is cleared. Rev. 2.00 Sep 20, 2005 page 229 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 6 CCLR1 0 1 Bit 5 CCLR0 Description 0 16TCNT is not cleared 1 16TCNT is cleared by GRA compare match or input capture*1 16TCNT is cleared by GRB compare match or input capture*1 0 1 (Initial value) Synchronous clear: 16TCNT is cleared in synchronization with other synchronized timers*2 Notes: 1. 16TCNT is cleared by compare match when the general register functions as an output compare register, and by input capture when the general register functions as an input capture register. 2. Selected in TSNC. Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select external clock input edges when an external clock source is used. Bit 4 CKEG1 Bit 3 CKEG0 Description 0 0 Count rising edges 1 Count falling edges — Count both edges 1 (Initial value) When channel 2 is set to phase counting mode, bits CKEG1 and CKEG0 in 16TCR2 are ignored. Phase counting takes precedence. Bits 2 to 0—Timer Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the counter clock source. Bit 2 TPSC2 Bit 1 TPSC1 Bit 0 TPSC0 Function 0 0 0 Internal clock: φ 1 Internal clock: φ/2 0 Internal clock: φ/4 1 Internal clock: φ/8 0 External clock A: TCLKA input 1 External clock B: TCLKB input 0 External clock C: TCLKC input 1 External clock D: TCLKD input 1 1 0 1 Rev. 2.00 Sep 20, 2005 page 230 of 800 REJ09B0260-0200 (Initial value) Section 8 16-Bit Timer When bit TPSC2 is cleared to 0 an internal clock source is selected, and the timer counts only falling edges. When bit TPSC2 is set to 1 an external clock source is selected, and the timer counts the edges selected by bits CKEG1 and CKEG0. When channel 2 is set to phase counting mode (MDF = 1 in TMDR), the settings of bits TPSC2 to TPSC0 in 16TCR2 are ignored. Phase counting takes precedence. 8.2.10 Timer I/O Control Register (TIOR) TIOR is an 8-bit register. The 16-bit timer has three TIORs, one in each channel. Channel Abbreviation Function 0 TIOR0 1 TIOR1 2 TIOR2 Bit TIOR controls the general registers. Some functions differ in PWM mode. 7 6 5 4 3 2 1 0 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 Initial value 1 0 0 0 1 0 0 0 Read/Write — R/W R/W R/W — R/W R/W R/W I/O control A2 to A0 These bits select GRA functions Reserved bit I/O control B2 to B0 These bits select GRB functions Reserved bit Each TIOR is an 8-bit readable/writable register that selects the output compare or input capture function for GRA and GRB, and specifies the functions of the TIORA and TIORB pins. If the output compare function is selected, TIOR also selects the type of output. If input capture is selected, TIOR also selects the edges of the input capture signal. TIOR is initialized to H'88 by a reset and in standby mode. Bit 7—Reserved: This bit cannot be modified and is always read as 1. Rev. 2.00 Sep 20, 2005 page 231 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bits 6 to 4—I/O Control B2 to B0 (IOB2 to IOB0): These bits select the GRB function. Bit 6 IOB2 Bit 5 IOB1 Bit 4 IOB0 0 0 0 1 1 1 0 GRB is an output compare register No output at compare match (Initial value) 0 output at GRB compare match*1 0 1 output at GRB compare match*1 1 Output toggles at GRB compare match 1 2 (1 output in channel 2)* * 0 1 1 Function GRB is an input compare register 0 GRB captures rising edge of input GRB captures falling edge of input GRB captures both edges of input 1 Notes: 1. After a reset, the output conforms to the TOLR setting until the first compare match. 2. Channel 2 output cannot be toggled by compare match. When this setting is made, 1 output is selected automatically. Bit 3—Reserved: This bit cannot be modified and is always read as 1. Bits 2 to 0—I/O Control A2 to A0 (IOA2 to IOA0): These bits select the GRA function. Bit 2 IOA2 Bit 1 IOA1 Bit 0 IOA0 0 0 0 1 1 1 0 GRA is an output compare register No output at compare match (Initial value) 0 output at GRA compare match*1 0 1 output at GRA compare match*1 1 Output toggles at GRA compare match (1 output in channel 2)*1 *2 0 1 1 Function GRA is an input compare register 0 GRA captures rising edge of input GRA captures falling edge of input GRA captures both edges of input 1 Notes: 1. After a reset, the output conforms to the TOLR setting until the first compare match. 2. Channel 2 output cannot be toggled by compare match. When this setting is made, 1 output is selected automatically. Rev. 2.00 Sep 20, 2005 page 232 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.2.11 Timer Output Level Setting Register C (TOLR) TOLR is an 8-bit write-only register that selects the timer output level for channels 0 to 2. Bit 7 6 5 4 3 2 1 0 — — TOB2 TOA2 TOB1 TOA1 TOB0 TOA0 Initial value 1 1 0 0 0 0 0 0 Read/Write — — W W W W W W Output level setting A2 to A0, B2 to B0 These bits set the levels of the timer outputs (TIOCA2 to TIOCA0, and TIOCB2 to TIOCB0) Reserved bits A TOLR setting can only be made when the corresponding bit in TSTR is 0. TOLR is a write-only register, and cannot be read. If it is read, all bits will return a value of 1. TOLR is initialized to H'C0 by a reset and in standby mode. Bits 7 and 6—Reserved: These bits cannot be modified. Bit 5—Output Level Setting B2 (TOB2): Sets the value of timer output TIOCB2. Bit 5 TOB2 Description 0 TIOCB2 is 0 1 TIOCB2 is 1 (Initial value) Bit 4—Output Level Setting A2 (TOA2): Sets the value of timer output TIOCA2. Bit 4 TOA2 Description 0 TIOCA2 is 0 1 TIOCA2 is 1 (Initial value) Rev. 2.00 Sep 20, 2005 page 233 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Bit 3—Output Level Setting B1 (TOB1): Sets the value of timer output TIOCB1. Bit 3 TOB1 Description 0 TIOCB1 is 0 1 TIOCB1 is 1 (Initial value) Bit 2—Output Level Setting A1 (TOA1): Sets the value of timer output TIOCA1. Bit 2 TOA1 Description 0 TIOCA1 is 0 1 TIOCA1 is 1 (Initial value) Bit 1—Output Level Setting B0 (TOB0): Sets the value of timer output TIOCB0. Bit 0 TOB0 Description 0 TIOCB0 is 0 1 TIOCB0 is 1 (Initial value) Bit 0—Output Level Setting A0 (TOA0): Sets the value of timer output TIOCA0. Bit 0 TOA0 Description 0 TIOCA0 is 0 1 TIOCA0 is 1 Rev. 2.00 Sep 20, 2005 page 234 of 800 REJ09B0260-0200 (Initial value) Section 8 16-Bit Timer 8.3 CPU Interface 8.3.1 16-Bit Accessible Registers The timer counters (16TCNTs), general registers A and B (GRAs and GRBs) are 16-bit registers, and are linked to the CPU by an internal 16-bit data bus. These registers can be written or read a word at a time, or a byte at a time. Figures 8.4 and 8.5 show examples of word read/write access to a timer counter (16TCNT). Figures 8.6 to 8.9 show examples of byte read/write access to 16TCNTH and 16TCNTL. On-chip data bus H CPU H L Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.4 16TCNT Access Operation [CPU → 16TCNT (Word)] On-chip data bus H CPU L H Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.5 Access to Timer Counter (CPU Reads 16TCNT, Word) Rev. 2.00 Sep 20, 2005 page 235 of 800 REJ09B0260-0200 Section 8 16-Bit Timer On-chip data bus H CPU L H Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.6 Access to Timer Counter H (CPU Writes to 16TCNTH, Upper Byte) On-chip data bus H CPU L H Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.7 Access to Timer Counter L (CPU Writes to 16TCNTL, Lower Byte) On-chip data bus H CPU L H Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.8 Access to Timer Counter H (CPU Reads 16TCNTH, Upper Byte) Rev. 2.00 Sep 20, 2005 page 236 of 800 REJ09B0260-0200 Section 8 16-Bit Timer On-chip data bus H CPU H L Bus interface L 16TCNTH Module data bus 16TCNTL Figure 8.9 Access to Timer Counter L (CPU Reads 16TCNTL, Lower Byte) 8.3.2 8-Bit Accessible Registers The registers other than the timer counters and general registers are 8-bit registers. These registers are linked to the CPU by an internal 8-bit data bus. Figures 8.10 and 8.11 show examples of byte read and write access to a 16TCR. If a word-size data transfer instruction is executed, two byte transfers are performed. On-chip data bus H CPU L H Bus interface L Module data bus 16TCR Figure 8.10 16TCR Access (CPU Writes to 16TCR) Rev. 2.00 Sep 20, 2005 page 237 of 800 REJ09B0260-0200 Section 8 16-Bit Timer On-chip data bus H CPU L H Bus interface L Module data bus 16TCR Figure 8.11 16TCR Access (CPU Reads 16TCR) 8.4 Operation 8.4.1 Overview A summary of operations in the various modes is given below. Normal Operation: Each channel has a timer counter and general registers. The timer counter counts up, and can operate as a free-running counter, periodic counter, or external event counter. GRA and GRB can be used for input capture or output compare. Synchronous Operation: The timer counters in designated channels are preset synchronously. Data written to the timer counter in any one of these channels is simultaneously written to the timer counters in the other channels as well. The timer counters can also be cleared synchronously if so designated by the CCLR1 and CCLR0 bits in the TCRs. PWM Mode: A PWM waveform is output from the TIOCA pin. The output goes to 1 at compare match A and to 0 at compare match B. The duty cycle can be varied from 0% to 100% depending on the settings of GRA and GRB. When a channel is set to PWM mode, its GRA and GRB automatically become output compare registers. Phase Counting Mode: The phase relationship between two clock signals input at TCLKA and TCLKB is detected and 16TCNT2 counts up or down accordingly. When phase counting mode is selected TCLKA and TCLKB become clock input pins and 16TCNT2 operates as an up/downcounter. Rev. 2.00 Sep 20, 2005 page 238 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.4.2 Basic Functions Counter Operation: When one of bits STR0 to STR2 is set to 1 in the timer start register (TSTR), the timer counter (16TCNT) in the corresponding channel starts counting. The counting can be free-running or periodic. • Sample setup procedure for counter Figure 8.12 shows a sample procedure for setting up a counter. Counter setup Select counter clock Count operation 1 No Yes Free-running counting Periodic counting Select counter clear source 2 Select output compare register function 3 Set period 4 Start counter 5 Periodic counter Start counter 5 Free-running counter Figure 8.12 Counter Setup Procedure (Example) Rev. 2.00 Sep 20, 2005 page 239 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 1. Set bits TPSC2 to TPSC0 in 16TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in 16TCR to select the desired edge(s) of the external clock signal. 2. For periodic counting, set CCLR1 and CCLR0 in 16TCR to have 16TCNT cleared at GRA compare match or GRB compare match. 3. Set TIOR to select the output compare function of GRA or GRB, whichever was selected in step 2. 4. Write the count period in GRA or GRB, whichever was selected in step 2. 5. Set the STR bit to 1 in TSTR to start the timer counter. • Free-running and periodic counter operation A reset leaves the counters (16TCNTs) in 16-bit timer channels 0 to 2 all set as free-running counters. A free-running counter starts counting up when the corresponding bit in TSTR is set to 1. When the count overflows from H'FFFF to H'0000, the OVF flag is set to 1 in TISRC. After the overflow, the counter continues counting up from H'0000. Figure 8.13 illustrates free-running counting. 16TCNT value H'FFFF H'0000 Time STR0 to STR2 bit OVF Figure 8.13 Free-Running Counter Operation When a channel is set to have its counter cleared by compare match, in that channel 16TCNT operates as a periodic counter. Select the output compare function of GRA or GRB, set bit CCLR1 or CCLR0 in 16TCR to have the counter cleared by compare match, and set the count period in GRA or GRB. After these settings, the counter starts counting up as a periodic counter when the corresponding bit is set to 1 in TSTR. When the count matches GRA or GRB, the IMFA or IMFB flag is set to 1 in TISRA/TISRB and the counter is cleared to H'0000. If the corresponding IMIEA or IMIEB bit is set to 1 in TISRA/TISRB, a CPU interrupt is requested at this time. After the compare match, 16TCNT continues counting up from H'0000. Figure 8.14 illustrates periodic counting. Rev. 2.00 Sep 20, 2005 page 240 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 16TCNT value Counter cleared by general register compare match GR Time H'0000 STR bit IMF Figure 8.14 Periodic Counter Operation • 16TCNT count timing Internal clock source Bits TPSC2 to TPSC0 in 16TCR select the system clock (φ) or one of three internal clock sources obtained by prescaling the system clock (φ/2, φ/4, φ/8). Figure 8.15 shows the timing. φ Internal clock 16TCNT input clock 16TCNT N–1 N N+1 Figure 8.15 Count Timing for Internal Clock Sources External clock source The external clock pin (TCLKA to TCLKD) can be selected by bits TPSC2 to TPSC0 in 16TCR, and the detected edge by bits CKEG1 and CKEG0. The rising edge, falling edge, or both edges can be selected. The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be counted correctly. Figure 8.16 shows the timing when both edges are detected. Rev. 2.00 Sep 20, 2005 page 241 of 800 REJ09B0260-0200 Section 8 16-Bit Timer φ External clock input 16TCNT input clock 16TCNT N–1 N N+1 Figure 8.16 Count Timing for External Clock Sources (when Both Edges are Detected) Waveform Output by Compare Match: In 16-bit timer channels 0, 1 compare match A or B can cause the output at the TIOCA or TIOCB pin to go to 0, go to 1, or toggle. In channel 2 the output can only go to 0 or go to 1. • Sample setup procedure for waveform output by compare match Figure 8.17 shows an example of the setup procedure for waveform output by compare match. Output setup 1. Select the compare match output mode (0, 1, or toggle) in TIOR. When a waveform output mode is selected, the pin switches from its generic input/ output function to the output compare function (TIOCA or TIOCB). An output compare pin outputs the value set in TOLR until the first compare match occurs. Select waveform output mode 1 Set output timing 2 2. Set a value in GRA or GRB to designate the compare match timing. Start counter 3 3. Set the STR bit to 1 in TSTR to start the timer counter. Waveform output Figure 8.17 Setup Procedure for Waveform Output by Compare Match (Example) Rev. 2.00 Sep 20, 2005 page 242 of 800 REJ09B0260-0200 Section 8 16-Bit Timer • Examples of waveform output Figure 8.18 shows examples of 0 and 1 output. 16TCNT operates as a free-running counter, 0 output is selected for compare match A, and 1 output is selected for compare match B. When the pin is already at the selected output level, the pin level does not change. 16TCNT value H'FFFF GRB GRA H'0000 TIOCB TIOCA Time No change No change No change No change 1 output 0 output Figure 8.18 0 and 1 Output (TOA = 1, TOB = 0) Figure 8.19 shows examples of toggle output. 16TCNT operates as a periodic counter, cleared by compare match B. Toggle output is selected for both compare match A and B. 16TCNT value Counter cleared by compare match with GRB GRB GRA H'0000 Time TIOCB Toggle output TIOCA Toggle output Figure 8.19 Toggle Output (TOA = 1, TOB = 0) Rev. 2.00 Sep 20, 2005 page 243 of 800 REJ09B0260-0200 Section 8 16-Bit Timer • Output compare output timing The compare match signal is generated in the last state in which 16TCNT and the general register match (when 16TCNT changes from the matching value to the next value). When the compare match signal is generated, the output value selected in TIOR is output at the output compare pin (TIOCA or TIOCB). When 16TCNT matches a general register, the compare match signal is not generated until the next counter clock pulse. Figure 8.20 shows the output compare timing. φ 16TCNT input clock 16TCNT N GR N N+1 Compare match signal TIOCA, TIOCB Figure 8.20 Output Compare Output Timing Input Capture Function: The 16TCNT value can be transferred to a general register when an input edge is detected at an input capture input/output compare pin (TIOCA or TIOCB). Risingedge, falling-edge, or both-edge detection can be selected. The input capture function can be used to measure pulse width or period. Rev. 2.00 Sep 20, 2005 page 244 of 800 REJ09B0260-0200 Section 8 16-Bit Timer • Sample setup procedure for input capture Figure 8.21 shows a sample procedure for setting up input capture. Input selection 1. Set TIOR to select the input capture function of a general register and the rising edge, falling edge, or both edges of the input capture signal. Clear the DDR bit to 0 before making these TIOR settings. Select input-capture input 1 Start counter 2 2. Set the STR bit to 1 in TSTR to start the timer counter. Input capture Figure 8.21 Setup Procedure for Input Capture (Example) • Examples of input capture Figure 8.22 illustrates input capture when the falling edge of TIOCB and both edges of TIOCA are selected as capture edges. 16TCNT is cleared by input capture into GRB. 16TCNT value H'0180 H'0160 H'0005 H'0000 TIOCB TIOCA GRA H'0005 H'0160 GRB H'0180 Figure 8.22 Input Capture (Example) Rev. 2.00 Sep 20, 2005 page 245 of 800 REJ09B0260-0200 Section 8 16-Bit Timer • Input capture signal timing Input capture on the rising edge, falling edge, or both edges can be selected by settings in TIOR. Figure 8.23 shows the timing when the rising edge is selected. The pulse width of the input capture signal must be at least 1.5 system clocks for single-edge capture, and 2.5 system clocks for capture of both edges. φ Input-capture input Input capture signal N 16TCNT N GRA, GRB Figure 8.23 Input Capture Signal Timing 8.4.3 Synchronization The synchronization function enables two or more timer counters to be synchronized by writing the same data to them simultaneously (synchronous preset). With appropriate 16TCR settings, two or more timer counters can also be cleared simultaneously (synchronous clear). Synchronization enables additional general registers to be associated with a single time base. Synchronization can be selected for all channels (0 to 2). Rev. 2.00 Sep 20, 2005 page 246 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Sample Setup Procedure for Synchronization: Figure 8.24 shows a sample procedure for setting up synchronization. Setup for synchronization Select synchronization 1 Synchronous preset Write to 16TCNT Synchronous clear 2 Clearing synchronized to this channel? No Yes Synchronous preset Select counter clear source 3 Select counter clear source 4 Start counter 5 Start counter 5 Counter clear Synchronous clear 1. Set the SYNC bits to 1 in TSNC for the channels to be synchronized. 2. When a value is written in 16TCNT in one of the synchronized channels, the same value is simultaneously written in 16TCNT in the other channels. 3. Set the CCLR1 or CCLR0 bit in 16TCR to have the counter cleared by compare match or input capture. 4. Set the CCLR1 and CCLR0 bits in 16TCR to have the counter cleared synchronously. 5. Set the STR bits in TSTR to 1 to start the synchronized counters. Figure 8.24 Setup Procedure for Synchronization (Example) Rev. 2.00 Sep 20, 2005 page 247 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Example of Synchronization: Figure 8.25 shows an example of synchronization. Channels 0, 1, and 2 are synchronized, and are set to operate in PWM mode. Channel 0 is set for counter clearing by compare match with GRB0. Channels 1 and 2 are set for synchronous counter clearing. The timer counters in channels 0, 1, and 2 are synchronously preset, and are synchronously cleared by compare match with GRB0. A three-phase PWM waveform is output from pins TIOCA0, TIOCA1, and TIOCA2. For further information on PWM mode, see section 8.4.4, PWM Mode. Value of 16TCNT0 to 16TCNT2 Cleared by compare match with GRB0 GRB0 GRB1 GRA0 GRB2 GRA1 GRA2 H'0000 TIOCA0 TIOCA1 TIOCA2 Figure 8.25 Synchronization (Example) 8.4.4 PWM Mode In PWM mode GRA and GRB are paired and a PWM waveform is output from the TIOCA pin. GRA specifies the time at which the PWM output changes to 1. GRB specifies the time at which the PWM output changes to 0. If either GRA or GRB compare match is selected as the counter clear source, a PWM waveform with a duty cycle from 0% to 100% is output at the TIOCA pin. PWM mode can be selected in all channels (0 to 2). Table 8.4 summarizes the PWM output pins and corresponding registers. If the same value is set in GRA and GRB, the output does not change when compare match occurs. Rev. 2.00 Sep 20, 2005 page 248 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Table 8.4 PWM Output Pins and Registers Channel Output Pin 1 Output 0 Output 0 TIOCA0 GRA0 GRB0 1 TIOCA1 GRA1 GRB1 2 TIOCA2 GRA2 GRB2 Sample Setup Procedure for PWM Mode: Figure 8.26 shows a sample procedure for setting up PWM mode. PWM mode Select counter clock 1 Select counter clear source 2 1. Set bits TPSC2 to TPSC0 in 16TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in 16TCR to select the desired edge(s) of the external clock signal. 2. Set bits CCLR1 and CCLR0 in 16TCR to select the counter clear source. 3. Set the time at which the PWM waveform should go to 1 in GRA. Set GRA 3 Set GRB 4 Select PWM mode 5 Start counter 6 PWM mode 4. Set the time at which the PWM waveform should go to 0 in GRB. 5. Set the PWM bit in TMDR to select PWM mode. When PWM mode is selected, regardless of the TIOR contents, GRA and GRB become output compare registers specifying the times at which the PWM output goes to 1 and 0. The TIOCA pin automatically becomes the PWM output pin. The TIOCB pin conforms to the settings of bits IOB1 and IOB0 in TIOR. If TIOCB output is not desired, clear both IOB1 and IOB0 to 0. 6. Set the STR bit to 1 in TSTR to start the timer counter. Figure 8.26 Setup Procedure for PWM Mode (Example) Rev. 2.00 Sep 20, 2005 page 249 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Examples of PWM Mode: Figure 8.27 shows examples of operation in PWM mode. In PWM mode TIOCA becomes an output pin. The output goes to 1 at compare match with GRA, and to 0 at compare match with GRB. In the examples shown, 16TCNT is cleared by compare match with GRA or GRB. Synchronized operation and free-running counting are also possible. 16TCNT value Counter cleared by compare match A GRA GRB Time H'0000 TIOCA a. Counter cleared by GRA (TOA = 1) 16TCNT value Counter cleared by compare match B GRB GRA Time H'0000 TIOCA b. Counter cleared by GRB (TOA = 0) Figure 8.27 PWM Mode (Example 1) Rev. 2.00 Sep 20, 2005 page 250 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Figure 8.28 shows examples of the output of PWM waveforms with duty cycles of 0% and 100%. If the counter is cleared by compare match with GRB, and GRA is set to a higher value than GRB, the duty cycle is 0%. If the counter is cleared by compare match with GRA, and GRB is set to a higher value than GRA, the duty cycle is 100%. 16TCNT value Counter cleared by compare match B GRB GRA Time H'0000 TIOCA Write to GRA Write to GRA a. 0% duty cycle (TOA = 0) 16TCNT value Counter cleared by compare match A GRA GRB Time H'0000 TIOCA Write to GRB Write to GRB b. 100% duty cycle (TOA = 1) Figure 8.28 PWM Mode (Example 2) Rev. 2.00 Sep 20, 2005 page 251 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.4.5 Phase Counting Mode In phase counting mode the phase difference between two external clock inputs (at the TCLKA and TCLKB pins) is detected, and 16TCNT2 counts up or down accordingly. In phase counting mode, the TCLKA and TCLKB pins automatically function as external clock input pins and 16TCNT2 becomes an up/down-counter, regardless of the settings of bits TPSC2 to TPSC0, CKEG1, and CKEG0 in 16TCR2. Settings of bits CCLR1, CCLR0 in 16TCR2, and settings in TIOR2, TISRA, TISRB, TISRC, setting of STR2 bit in TSTR, GRA2, and GRB2 are valid. The input capture and output compare functions can be used, and interrupts can be generated. Phase counting is available only in channel 2. Sample Setup Procedure for Phase Counting Mode: Figure 8.29 shows a sample procedure for setting up phase counting mode. Phase counting mode Select phase counting mode 1 1. Set the MDF bit in TMDR to 1 to select phase counting mode. 2. Select the flag setting condition with the FDIR bit in TMDR. Select flag setting condition 2 Start counter 3 3. Set the STR2 bit to 1 in TSTR to start the timer counter. Phase counting mode Figure 8.29 Setup Procedure for Phase Counting Mode (Example) Rev. 2.00 Sep 20, 2005 page 252 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Example of Phase Counting Mode: Figure 8.30 shows an example of operations in phase counting mode. Table 8.5 lists the up-counting and down-counting conditions for 16TCNT2. In phase counting mode both the rising and falling edges of TCLKA and TCLKB are counted. The phase difference between TCLKA and TCLKB must be at least 1.5 states, the phase overlap must also be at least 1.5 states, and the pulse width must be at least 2.5 states. 16TCNT2 value Counting up Counting down TCLKB TCLKA Figure 8.30 Operation in Phase Counting Mode (Example) Table 8.5 Up/Down Counting Conditions Counting Direction Up-Counting TCLKB pin Down-Counting High TCLKA pin Low Phase difference Low High Phase difference High Low Low Pulse width High Pulse width TCLKA TCLKB Overlap Overlap Phase difference and overlap: at least 1.5 states Pulse width: at least 2.5 states Figure 8.31 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode Rev. 2.00 Sep 20, 2005 page 253 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.4.6 16-Bit Timer Output Timing The initial value of 16-bit timer output when a timer count operation begins can be specified arbitrarily by making a setting in TOLR. Figure 8.32 shows the timing for setting the initial value with TOLR. Only write to TOLR when the corresponding bit in TSTR is cleared to 0. T1 T3 T2 φ Address bus TOLR 16-bit timer output pin TOLR address N N Figure 8.32 Timing for Setting 16-Bit Timer Output Level by Writing to TOLR Rev. 2.00 Sep 20, 2005 page 254 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.5 Interrupts The 16-bit timer has two types of interrupts: input capture/compare match interrupts, and overflow interrupts. 8.5.1 Setting of Status Flags Timing of Setting of IMFA and IMFB at Compare Match: IMFA and IMFB are set to 1 by a compare match signal generated when 16TCNT matches a general register (GR). The compare match signal is generated in the last state in which the values match (when 16TCNT is updated from the matching count to the next count). Therefore, when 16TCNT matches a general register, the compare match signal is not generated until the next 16TCNT clock input. Figure 8.33 shows the timing of the setting of IMFA and IMFB. φ 16TCNT input clock 16TCNT GR N N+1 N Compare match signal IMF IMI Figure 8.33 Timing of Setting of IMFA and IMFB by Compare Match Rev. 2.00 Sep 20, 2005 page 255 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Timing of Setting of IMFA and IMFB by Input Capture: IMFA and IMFB are set to 1 by an input capture signal. The 16TCNT contents are simultaneously transferred to the corresponding general register. Figure 8.34 shows the timing. φ Input capture signal IMF N 16TCNT GR N IMI Figure 8.34 Timing of Setting of IMFA and IMFB by Input Capture Rev. 2.00 Sep 20, 2005 page 256 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Timing of Setting of Overflow Flag (OVF): OVF is set to 1 when 16TCNT overflows from H'FFFF to H'0000 or underflows from H'0000 to H'FFFF. Figure 8.35 shows the timing. φ 16TCNT Overflow signal OVF OVI Figure 8.35 Timing of Setting of OVF 8.5.2 Timing of Clearing of Status Flags If the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag is cleared. Figure 8.36 shows the timing. TISR write cycle T1 T2 T3 φ Address TISR address IMF, OVF Figure 8.36 Timing of Clearing of Status Flags Rev. 2.00 Sep 20, 2005 page 257 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.5.3 Interrupt Sources Each 16-bit timer channel can generate a compare match/input capture A interrupt, a compare match/input capture B interrupt, and an overflow interrupt. In total there are nine interrupt sources of three kinds, all independently vectored. An interrupt is requested when the interrupt request flag are set to 1. The priority order of the channels can be modified in interrupt priority registers A (IPRA). For details see section 5, Interrupt Controller. Table 8.6 lists the interrupt sources. Table 8.6 16-bit timer Interrupt Sources Channel Interrupt Source Description Priority* 0 IMIA0 IMIB0 OVI0 Compare match/input capture A0 Compare match/input capture B0 Overflow 0 High 1 IMIA1 IMIB1 OVI1 Compare match/input capture A1 Compare match/input capture B1 Overflow 1 2 IMIA2 IMIB2 OVI2 Compare match/input capture A2 Compare match/input capture B2 Overflow 2 Low Note: * The priority immediately after a reset is indicated. Inter-channel priorities can be changed by settings in IPRA. Rev. 2.00 Sep 20, 2005 page 258 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 8.6 Usage Notes This section describes contention and other matters requiring special attention during 16-bit timer operations. Contention between 16TCNT Write and Clear: If a counter clear signal occurs in the T3 state of a 16TCNT write cycle, clearing of the counter takes priority and the write is not performed. See figure 8.37. 16TCNT write cycle T2 T1 T3 φ Address bus 16TCNT address Internal write signal Counter clear signal 16TCNT N H'0000 Figure 8.37 Contention between 16TCNT Write and Clear Rev. 2.00 Sep 20, 2005 page 259 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between 16TCNT Word Write and Increment: If an increment pulse occurs in the T3 state of a 16TCNT word write cycle, writing takes priority and 16TCNT is not incremented. Figure 8.38 shows the timing in this case. 16TCNT word write cycle T2 T1 T3 φ Address bus 16TCNT address Internal write signal 16TCNT input clock 16TCNT N M 16TCNT write data Figure 8.38 Contention between 16TCNT Word Write and Increment Rev. 2.00 Sep 20, 2005 page 260 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between 16TCNT Byte Write and Increment: If an increment pulse occurs in the T2 or T3 state of a 16TCNT byte write cycle, writing takes priority and 16TCNT is not incremented. The byte data for which a write was not performed is not incremented, and retains its pre-write value. See figure 8.39, which shows an increment pulse occurring in the T2 state of a byte write to 16TCNTH. 16TCNTH byte write cycle T1 T2 T3 φ 16TCNTH address Address bus Internal write signal 16TCNT input clock 16TCNTH N M 16TCNT write data 16TCNTL X X+1 X Figure 8.39 Contention between 16TCNT Byte Write and Increment Rev. 2.00 Sep 20, 2005 page 261 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between General Register Write and Compare Match: If a compare match occurs in the T3 state of a general register write cycle, writing takes priority and the compare match signal is inhibited. See figure 8.40. General register write cycle T1 T2 T3 φ GR address Address bus Internal write signal 16TCNT N GR N N+1 M General register write data Compare match signal Inhibited Figure 8.40 Contention between General Register Write and Compare Match Rev. 2.00 Sep 20, 2005 page 262 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between 16TCNT Write and Overflow or Underflow: If an overflow occurs in the T3 state of a 16TCNT write cycle, writing takes priority and the counter is not incremented. OVF is set to 1.The same holds for underflow. See figure 8.41. 16TCNT write cycle T1 T2 T3 φ Address bus 16TCNT address Internal write signal 16TCNT input clock Overflow signal 16TCNT H'FFFF M 16TCNT write data OVF Figure 8.41 Contention between 16TCNT Write and Overflow Rev. 2.00 Sep 20, 2005 page 263 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between General Register Read and Input Capture: If an input capture signal occurs during the T3 state of a general register read cycle, the value before input capture is read. See figure 8.42. General register read cycle T2 T1 T3 φ GR address Address bus Internal read signal Input capture signal GR Internal data bus X M X Figure 8.42 Contention between General Register Read and Input Capture Rev. 2.00 Sep 20, 2005 page 264 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between Counter Clearing by Input Capture and Counter Increment: If an input capture signal and counter increment signal occur simultaneously, the counter is cleared according to the input capture signal. The counter is not incremented by the increment signal. The value before the counter is cleared is transferred to the general register. See figure 8.43. φ Input capture signal Counter clear signal 16TCNT input clock 16TCNT GR N H'0000 N Figure 8.43 Contention between Counter Clearing by Input Capture and Counter Increment Rev. 2.00 Sep 20, 2005 page 265 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Contention between General Register Write and Input Capture: If an input capture signal occurs in the T3 state of a general register write cycle, input capture takes priority and the write to the general register is not performed. See figure 8.44. General register write cycle T1 T2 T3 φ Address bus GR address Internal write signal Input capture signal 16TCNT GR M M Figure 8.44 Contention between General Register Write and Input Capture Rev. 2.00 Sep 20, 2005 page 266 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Note on Waveform Period Setting: When a counter is cleared by compare match, the counter is cleared in the last state at which the 16TCNT value matches the general register value, at the time when this value would normally be updated to the next count. The actual counter frequency is therefore given by the following formula: f= φ (N+1) (f: counter frequency. φ: system clock frequency. N: value set in general register.) Note on Writes in Synchronized Operation: When channels are synchronized, if a 16TCNT value is modified by byte write access, all 16 bits of all synchronized counters assume the same value as the counter that was addressed. (Example) When channels 1 and 2 are synchronized • Byte write to channel 1 or byte write to channel 2 16TCNT1 W X 16TCNT2 Y Z Upper byte Lower byte Write A to upper byte of channel 1 16TCNT1 A X 16TCNT2 A X Upper byte Lower byte Write A to lower byte of channel 2 16TCNT1 Y A 16TCNT2 Y A Upper byte Lower byte • Word write to channel 1 or word write to channel 2 16TCNT1 W X 16TCNT2 Y Z Upper byte Lower byte Write AB word to channel 1 or 2 16TCNT1 A B 16TCNT2 A B Upper byte Lower byte Rev. 2.00 Sep 20, 2005 page 267 of 800 REJ09B0260-0200 Section 8 16-Bit Timer 16-bit timer Operating Modes Table 8.7 (a) 16-bit timer Operating Modes (Channel 0) Register Settings TSNC TMDR TIOR0 16TCR0 Operating Mode Synchronization Synchronous preset SYNC0 = 1 — — PWM mode — — PWM0 = 1 — Output compare A — — PWM0 = 0 IOA2 = 0 Other bits unrestricted Output compare B — — Input capture A — — PWM0 = 0 Input capture B — — PWM0 = 0 Counter By compare clearing match/input capture A — — CCLR1 = 0 CCLR0 = 1 By compare match/input capture B — — CCLR1 = 1 CCLR0 = 0 SYNC0 = 1 — — CCLR1 = 1 CCLR0 = 1 Synchronous clear Legend: MDF FDIR PWM IOA IOB Clear Select Clock Select * IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted Setting available (valid). — Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. Rev. 2.00 Sep 20, 2005 page 268 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Table 8.7 (b) 16-bit timer Operating Modes (Channel 1) Register Settings TSNC TMDR TIOR1 16TCR1 Operating Mode Synchronization Synchronous preset SYNC1 = 1 — — PWM mode — — PWM1 = 1 — Output compare A — — PWM1 = 0 IOA2 = 0 Other bits unrestricted Output compare B — — Input capture A — — PWM1 = 0 Input capture B — — PWM1 = 0 Counter By compare clearing match/input capture A — — CCLR1 = 0 CCLR0 = 1 By compare match/input capture B — — CCLR1 = 1 CCLR0 = 0 SYNC1 = 1 — — CCLR1 = 1 CCLR0 = 1 Synchronous clear MDF FDIR PWM IOA IOB Clear Select Clock Select * IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted Legend: Setting available (valid). — Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. Rev. 2.00 Sep 20, 2005 page 269 of 800 REJ09B0260-0200 Section 8 16-Bit Timer Table 8.7 (c) 16-bit timer Operating Modes (Channel 2) Register Settings TSNC Operating Mode Synchronization Synchronous preset SYNC2 = 1 TMDR MDF FDIR PWM TIOR2 IOA IOB 16TCR2 Clear Select — * PWM mode — PWM2 = 1 — Output compare A — PWM2 = 0 IOA2 = 0 Other bits unrestricted Output compare B — Input capture A — PWM2 = 0 Input capture B — PWM2 = 0 Counter By compare clearing match/input capture A — CCLR1 = 0 CCLR0 = 1 By compare match/input capture B — CCLR1 = 1 CCLR0 = 0 — CCLR1 = 1 CCLR0 = 1 Synchronous clear Phase counting mode Clock Select SYNC2 = 1 MDF = 1 IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted — Legend: Setting available (valid). — Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. Rev. 2.00 Sep 20, 2005 page 270 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Section 9 8-Bit Timers 9.1 Overview The H8/3024 Group has a built-in 8-bit timer module with four channels (TMR0, TMR1, TMR2, and TMR3), based on 8-bit counters. Each channel has an 8-bit timer counter (8TCNT) and two 8-bit time constant registers (TCORA and TCORB) that are constantly compared with the 8TCNT value to detect compare match events. The timers can be used as multifunctional timers in a variety of applications, including the generation of a rectangular-wave output with an arbitrary duty cycle. 9.1.1 Features The features of the 8-bit timer module are listed below. • Selection of four clock sources The counters can be driven by one of three internal clock signals (φ/8, φ/64, or φ/8192) or an external clock input (enabling use as an external event counter). • Selection of three ways to clear the counters The counters can be cleared on compare match A or B, or input capture B. • Timer output controlled by two compare match signals The timer output signal in each channel is controlled by two independent compare match signals, enabling the timer to generate output waveforms with an arbitrary duty cycle or PWM output. • A/D converter can be activated by a compare match • Two channels can be cascaded Channels 0 and 1 can be operated as the upper and lower halves of a 16-bit timer (16-bit count mode). Channels 2 and 3 can be operated as the upper and lower halves of a 16-bit timer (16-bit count mode). Channel 1 can count channel 0 compare match events (compare match count mode). Channel 3 can count channel 2 compare match events (compare match count mode). • Input capture function can be set 8-bit or 16-bit input capture operation is available. Rev. 2.00 Sep 20, 2005 page 271 of 800 REJ09B0260-0200 Section 9 8-Bit Timers • Twelve interrupt sources There are twelve interrupt sources: four compare match sources, four compare match/input capture sources, four overflow sources. Two of the compare match sources and two of the combined compare match/input capture sources each have an independent interrupt vector. The remaining compare match interrupts, combined compare match/input capture interrupts, and overflow interrupts have one interrupt vector for two sources. Rev. 2.00 Sep 20, 2005 page 272 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.1.2 Block Diagram The 8-bit timers are divided into two groups of two channels each: group 0 comprising channels 0 and 1, and group 1 comprising channels 2 and 3. Figure 9.1 shows a block diagram of 8-bit timer group 0. External clock sources TCLKA TCLKC Internal clock sources φ/8 φ/64 φ/8192 Clock 1 Clock 0 Clock select TCORA0 TCORA1 Compare match A1 Compare match A0 Comparator A0 Comparator A1 Overflow 1 TMO0 TMIO1 8TCNT0 8TCNT1 Internal bus Overflow 0 Compare match B1 Control logic Compare match B0 Comparator B0 Input capture B1 Legend: TCORA: TCORB: 8TCNT: 8TCSR: 8TCR: Comparator B1 TCORB0 TCORB1 8TCSR0 8TCSR1 8TCR0 8TCR1 CMIA0 CMIB0 CMIA1/CMIB1 OVI0/OVI1 Interrupt signals Time constant register A Time constant register B Timer counter Timer control/status register Timer control register Figure 9.1 Block Diagram of 8-Bit Timer Unit (Two Channels: Group 0) Rev. 2.00 Sep 20, 2005 page 273 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.1.3 Pin Configuration Table 9.1 summarizes the input/output pins of the 8-bit timer module. Table 9.1 8-Bit Timer Pins Group Channel Name Abbreviation I/O Function 0 0 Timer output TMO0 Output Compare match output Timer clock input TCLKC Input Counter external clock input Timer input/output TMIO1 I/O Compare match output/input capture input Timer clock input TCLKA Input Counter external clock input Timer output TMO2 Output Compare match output Timer clock input TCLKD Input Counter external clock input Timer input/output TMIO3 I/O Compare match output/input capture input Timer clock input TCLKB Input Counter external clock input 1 1 2 3 Rev. 2.00 Sep 20, 2005 page 274 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.1.4 Register Configuration Table 9.2 summarizes the registers of the 8-bit timer module. Table 9.2 8-Bit Timer Registers Channel Address*1 Name Abbreviation R/W 0 H'FFF80 Timer control register 0 8TCR0 R/W H'FFF82 Timer control/status register 0 8TCSR0 H'00 2 * R/(W) H'00 H'FFF84 Time constant register A0 TCORA0 R/W H'FFF86 Time constant register B0 TCORB0 R/W H'FF H'FFF88 Timer counter 0 8TCNT0 R/W H'00 H'FFF81 Timer control register 1 8TCR1 R/W 1 2 3 Initial value H'FF H'00 *2 H'FFF83 Timer control/status register 1 8TCSR1 R/(W) H'00 H'FFF85 Time constant register A1 TCORA1 R/W H'FF H'FFF87 Time constant register B1 TCORB1 R/W H'FF H'FFF89 Timer counter 1 8TCNT1 R/W H'00 H'FFF90 Timer control register 2 8TCR2 R/W H'00 *2 H'FFF92 Timer control/status register 2 8TCSR2 R/(W) H'10 H'FFF94 Time constant register A2 TCORA2 R/W H'FF H'FFF96 Time constant register B2 TCORB2 R/W H'FF H'FFF98 Timer counter 2 8TCNT2 R/W H'00 H'FFF91 Timer control register 3 8TCR3 R/W H'00 *2 H'FFF93 Timer control/status register 3 8TCSR3 R/(W) H'00 H'FFF95 Time constant register A3 TCORA3 R/W H'FF H'FFF97 Time constant register B3 TCORB3 R/W H'FF H'FFF99 Timer counter 3 8TCNT3 R/W H'00 Notes: 1. Indicates the lower 20 bits of the address in advanced mode. 2. Only 0 can be written to bits 7 to 5, to clear these flags. Each pair of registers for channel 0 and channel 1 comprises a 16-bit register with the channel 0 register as the upper 8 bits and the channel 1 register as the lower 8 bits, so they can be accessed together by word access. Similarly, each pair of registers for channel 2 and channel 3 comprises a 16-bit register with the channel 2 register as the upper 8 bits and the channel 3 register as the lower 8 bits, so they can be accessed together by word access. Rev. 2.00 Sep 20, 2005 page 275 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.2 Register Descriptions 9.2.1 Timer Counters (8TCNT) 8TCNT0 8TCNT1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 8TCNT2 8TCNT3 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W The timer counters (8TCNT) are 8-bit readable/writable up-counters that increment on pulses generated from an internal or external clock source. The clock source is selected by clock select bits 2 to 0 (CKS2 to CKS0) in the timer control register (8TCR). The CPU can always read or write to the timer counters. The 8TCNT0 and 8TCNT1 pair, and the 8TCNT2 and 8TCNT3 pair, can each be accessed as a 16-bit register by word access. 8TCNT can be cleared by an input capture signal or compare match signal. Counter clear bits 1 and 0 (CCLR1 and CCLR0) in 8TCR select the method of clearing. When 8TCNT overflows from H'FF to H'00, the overflow flag (OVF) in the timer control/status register (8TCSR) is set to 1. Each 8TCNT is initialized to H'00 by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 276 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.2.2 Time Constant Registers A (TCORA) TCORA0 to TCORA3 are 8-bit readable/writable registers. TCORA0 TCORA1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORA2 TCORA3 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W The TCORA0 and TCORA1 pair, and the TCORA2 and TCORA3 pair, can each be accessed as a 16-bit register by word access. The TCORA value is constantly compared with the 8TCNT value. When a match is detected, the corresponding compare match flag A (CMFA) is set to 1 in 8TCSR. The timer output can be freely controlled by these compare match signals and the settings of output select bits 1 and 0 (OS1, OS0) in 8TCSR. Each TCORA register is initialized to H'FF by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 277 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.2.3 Time Constant Registers B (TCORB) TCORB0 TCORB1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB2 TCORB3 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB0 to TCORB3 are 8-bit readable/writable registers. The TCORB0 and TCORB1 pair, and the TCORB2 and TCORB3 pair, can each be accessed as a 16-bit register by word access. The TCORB value is constantly compared with the 8TCNT value. When a match is detected, the corresponding compare match flag B (CMFB) is set to 1 in 8TCSR*. The timer output can be freely controlled by these compare match signals and the settings of output/input capture edge select bits 3 and 2 (OIS3, OIS2) in 8TCSR. When TCORB is used for input capture, it stores the 8TCNT value on detection of an external input capture signal. At this time, the CMFB flag is set to 1 in the corresponding 8TCSR register. The detected edge of the input capture signal is set in 8TCSR. Each TCORB register is initialized to H'FF by a reset and in standby mode. Note: * When channel 1 and channel 3 are designated for TCORB input capture, the CMFB flag is not set by a channel 0 or channel 2 compare match B. Rev. 2.00 Sep 20, 2005 page 278 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.2.4 Timer Control Register (8TCR) Bit 7 6 5 4 3 2 1 0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W 8TCR is an 8-bit readable/writable register that selects the 8TCNT input clock, gives the 8TCNT clearing specification, and enables interrupt requests. 8TCR is initialized to H'00 by a reset and in standby mode. For the timing, see section 9.4, Operation. Bit 7—Compare Match Interrupt Enable B (CMIEB): Enables or disables the CMIB interrupt request when the CMFB flag is set to 1 in 8TCSR. Bit 7 CMIEB Description 0 CMIB interrupt requested by CMFB is disabled 1 CMIB interrupt requested by CMFB is enabled (Initial value) Bit 6—Compare Match Interrupt Enable A (CMIEA): Enables or disables the CMIA interrupt request when the CMFA flag is set to 1 in 8TCSR. Bit 6 CMIEA Description 0 CMIA interrupt requested by CMFA is disabled 1 CMIA interrupt requested by CMFA is enabled (Initial value) Bit 5—Timer Overflow Interrupt Enable (OVIE): Enables or disables the OVI interrupt request when the OVF flag is set to 1 in 8TCSR. Bit 5 OVIE Description 0 OVI interrupt requested by OVF is disabled 1 OVI interrupt requested by OVF is enabled (Initial value) Rev. 2.00 Sep 20, 2005 page 279 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Bits 4 and 3—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits specify the 8TCNT clearing source. Compare match A or B, or input capture B, can be selected as the clearing source. Bit 4 CCLR1 0 1 Bit 3 CCLR0 Description 0 Clearing is disabled 1 Cleared by compare match A 0 Cleared by compare match B/input capture B 1 Cleared by input capture B (Initial value) Note: When input capture B is set as the 8TCNT1 and 8TCNT3 counter clear source, 8TCNT0 and 8TCNT2 are not cleared by compare match B. Bits 2 to 0—Clock Select 2 to 0 (CSK2 to CSK0): These bits select whether the clock input to 8TCNT is an internal or external clock. Three internal clocks can be selected, all divided from the system clock (φ): φ/8, φ/64, and φ/8192. The rising edge of the selected internal clock triggers the count. When use of an external clock is selected, three types of count can be selected: at the rising edge, the falling edge, and both rising and falling edges. When CKS2, CKS1, CKS0 = 1, 0, 0, channels 0 and 1 and channels 2 and 3 are cascaded. The incrementing clock source is different when 8TCR0 and 8TCR2 are set, and when 8TCR1 and 8TCR3 are set. Rev. 2.00 Sep 20, 2005 page 280 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Bit 2 CSK2 Bit 1 CSK1 0 0 1 1 0 Bit 0 CSK0 Description 0 Clock input disabled 1 Internal clock, counted on falling edge of φ/8 (Initial value) 0 Internal clock, counted on falling edge of φ/64 1 Internal clock, counted on falling edge of φ/8192 0 Channel 0 (16-bit count mode): Count on 8TCNT1 overflow signal*1 Channel 1 (compare match count mode): Count on 8TCNT0 compare match A*1 Channel 2 (16-bit count mode): Count on 8TCNT3 overflow signal*2 Channel 3 (compare match count mode): Count on 8TCNT2 compare match A*2 1 1 External clock, counted on rising edge 0 External clock, counted on falling edge 1 External clock, counted on both rising and falling edges Notes: 1. If the clock input of channel 0 is the 8TCNT1 overflow signal and that of channel 1 is the 8TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting. 2. If the clock input of channel 2 is the 8TCNT3 overflow signal and that of channel 3 is the 8TCNT2 compare match signal, no incrementing clock is generated. Do not use this setting. Rev. 2.00 Sep 20, 2005 page 281 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.2.5 Timer Control/Status Registers (8TCSR) 8TCSR0 Bit 7 6 5 4 3 2 1 0 CMFB CMFA OVF ADTE OIS3 OIS2 OS1 OS0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0 CMFB CMFA OVF — OIS3 OIS2 OS1 OS0 0 R/(W)* 0 R/(W)* 0 R/(W)* 1 0 0 0 0 — R/W R/W R/W R/W 6 5 4 3 2 1 0 8TCSR2 Bit Initial value Read/Write 8TCSR1, 8TCSR3 7 Bit CMFB CMFA OVF ICE OIS3 OIS2 OS1 OS0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W R/W Note: * Only 0 can be written to bits 7 to 5, to clear these flags. The timer control/status registers 8TCSR are 8-bit registers that indicate compare match/input capture and overflow statuses, and control compare match output/input capture edge selection. 8TCSR2 is initialized to H'10, and 8TCSR0, 8TCSR1, and 8TCSR3 to H'00, by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 282 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Bit 7—Compare Match/Input Capture Flag B (CMFB): Status flag that indicates the occurrence of a TCORB compare match or input capture. Bit 7 CMFB Description 0 [Clearing condition] Read CMFB when CMFB = 1, then write 0 in CMFB 1 [Setting conditions] • 8TCNT = TCORB* • (Initial value) The 8TCNT value is transferred to TCORB by an input capture signal when TCORB functions as an input capture register Note: * When bit ICE is set to 1 in 8TCSR1 and 8TCSR3, the CMFB flag is not set when 8TCNT0 = TCORB0 or 8TCNT2 = TCORB2. Bit 6—Compare Match Flag A (CMFA): Status flag that indicates the occurrence of a TCORA compare match. Bit 6 CMFA Description 0 [Clearing condition] Read CMFA when CMFA = 1, then write 0 in CMFA 1 [Setting condition] 8TCNT = TCORA (Initial value) Bit 5—Timer Overflow Flag (OVF): Status flag that indicates that the 8TCNT has overflowed from H'FF to H'00. Bit 5 OVF Description 0 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF 1 [Setting condition] 8TCNT overflows from H'FF to H'00 (Initial value) Rev. 2.00 Sep 20, 2005 page 283 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Bit 4—A/D Trigger Enable (ADTE) (In 8TCSR0): In combination with TRGE in the A/D control register (ADCR), enables or disables A/D converter start requests by compare match A or an external trigger. TRGE* Bit 4 ADTE 0 0 A/D converter start requests by compare match A or external trigger pin (ADTRG) input are disabled (Initial value) 1 A/D converter start requests by compare match A or external trigger pin (ADTRG) input are disabled 1 0 1 Description A/D converter start requests by external trigger pin (ADTRG) input are enabled, and A/D converter start requests by compare match A are disabled A/D converter start requests by compare match A are enabled, and A/D converter start requests by external trigger pin (ADTRG) input are disabled Note: * TRGE is bit 7 of the A/D control register (ADCR). Bit 4—Reserved (In 8TCSR1): This bit is a reserved bit, but can be read and written. Bit 4—Input Capture Enable (ICE) (In 8TCSR1 and 8TCSR3): Selects the function of TCORB1 and TCORB3. Bit 4 ICE Description 0 TCORB1 and TCORB3 are compare match registers 1 TCORB1 and TCORB3 are input capture registers (Initial value) When bit ICE is set to 1 in 8TCSR1 or 8TCSR3, the operation of the TCORA and TCORB registers in channels 0 to 3 is as shown in the tables below. Rev. 2.00 Sep 20, 2005 page 284 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Table 9.3 Operation of Channels 0 and 1 when Bit ICE is Set to 1 in 8TCSR1 Register Register Register Function Status Flag Change Timer Output Capture Input Interrupt Request TCORA0 Compare match CMFA changed from 0 TMO0 output controllable operation to 1 in 8TCSR0 by compare match CMIA0 interrupt request generated by compare match TCORB0 Compare match CMFB not changed No output from operation from 0 to 1 in 8TCSR0 TMO0 by compare match CMIB0 interrupt request not generated by compare match TCORA1 Compare match CMFA changed from 0 TMIO1 is operation to 1 in 8TCSR1 by dedicated input compare match capture pin CMIA1 interrupt request generated by compare match TCORB1 Input capture operation CMIB1 interrupt request generated by input capture Table 9.4 CMFB changed from 0 TMIO1 is to 1 in 8TCSR1 by dedicated input input capture capture pin Operation of Channels 2 and 3 when Bit ICE is Set to 1 in 8TCSR3 Register Register Register Function Status Flag Change Timer Output Capture Input Interrupt Request TCORA2 Compare match CMFA changed from 0 TMO2 output operation to 1 in 8TCSR2 by controllable compare match CMIA2 interrupt request generated by compare match TCORB2 Compare match CMFB not changed No output from operation from 0 to 1 in 8TCSR2 TMO2 by compare match CMIB2 interrupt request not generated by compare match TCORA3 Compare match CMFA changed from 0 TMIO3 is operation to 1 in 8TCSR3 by dedicated input compare match capture pin CMIA3 interrupt request generated by compare match TCORB3 Input capture operation CMIB3 interrupt request generated by input capture CMFB changed from 0 TMIO3 is to 1 in 8TCSR3 by dedicated input input capture capture pin Bits 3 and 2—Output/Input Capture Edge Select B3 and B2 (OIS3, OIS2): In combination with the ICE bit in 8TCSR1 (8TCSR3), these bits select the compare match B output level or the input capture input detected edge. The function of TCORB1 (TCORB3) depends on the setting of bit 4 of 8TCSR1 (8TCSR3). Rev. 2.00 Sep 20, 2005 page 285 of 800 REJ09B0260-0200 Section 9 8-Bit Timers ICE Bit in 8TCSR1 (8TCSR3) Bit 3 OIS3 Bit 2 OIS2 Description 0 0 0 No change when compare match B occurs 1 0 is output when compare match B occurs 0 1 is output when compare match B occurs 1 Output is inverted when compare match B occurs (toggle output) 1 1 0 1 0 TCORB input capture on rising edge 1 TCORB input capture on falling edge 0 TCORB input capture on both rising and falling edges (Initial value) 1 • When the compare match register function is used, the timer output priority order is: toggle output > 1 output > 0 output. • If compare match A and B occur simultaneously, the output changes in accordance with the higher-priority compare match. • When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled. Bits 1 and 0—Output Select A1 and A0 (OS1, OS0): These bits select the compare match A output level. Bit 1 OS1 Bit 0 OS0 Description 0 0 No change when compare match A occurs 1 0 is output when compare match A occurs 0 1 is output when compare match A occurs 1 Output is inverted when compare match A occurs (toggle output) 1 (Initial value) • When the compare match register function is used, the timer output priority order is: toggle output > 1 output > 0 output. • If compare match A and B occur simultaneously, the output changes in accordance with the higher-priority compare match. • When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled. Rev. 2.00 Sep 20, 2005 page 286 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.3 CPU Interface 9.3.1 8-Bit Registers 8TCNT, TCORA, TCORB, 8TCR, and 8TCSR are 8-bit registers. These registers are connected to the CPU by an internal 16-bit data bus and can be read and written a word at a time or a byte at a time. Figures 9.2 and 9.3 show the operation in word read and write accesses to 8TCNT. Figures 9.4 to 9.7 show the operation in byte read and write accesses to 8TCNT0 and 8TCNT1. Internal data bus H C P U H Bus interface L L Module data bus 8TCNT0 8TCNT1 Figure 9.2 8TCNT Access Operation (CPU Writes to 8TCNT, Word) Internal data bus H C P U L H Bus interface L Module data bus 8TCNT0 8TCNT1 Figure 9.3 8TCNT Access Operation (CPU Reads 8TCNT, Word) Rev. 2.00 Sep 20, 2005 page 287 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Internal data bus H C P U L H Bus interface L Module data bus 8TCNTH0 8TCNTL1 Figure 9.4 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte) Internal data bus H C P U L H Bus interface L Module data bus 8TCNTH0 8TCNTL1 Figure 9.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte) Internal data bus H C P U L H Bus interface L Module data bus 8TCNT0 8TCNT1 Figure 9.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte) Internal data bus H C P U L H Bus interface L Module data bus 8TCNT0 8TCNT1 Figure 9.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte) Rev. 2.00 Sep 20, 2005 page 288 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.4 Operation 9.4.1 8TCNT Count Timing 8TCNT is incremented by input clock pulses (either internal or external). Internal Clock: Three different internal clock signals (φ/8, φ/64, or φ/8192) divided from the system clock (φ) can be selected, by setting bits CKS2 to CKS0 in 8TCR. Figure 9.8 shows the count timing. φ Internal clock 8TCNT input clock 8TCNT N–1 N N+1 Note: Even if the same internal clock is selected for the 16-bit timer and the 8-bit timer, the same operation will not be performed since the incrementing edge is different in each case. Figure 9.8 Count Timing for Internal Clock Input External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in 8TCR: on the rising edge, the falling edge, and both rising and falling edges. The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be counted correctly. Figure 9.9 shows the timing for incrementation on both edges of the external clock signal. Rev. 2.00 Sep 20, 2005 page 289 of 800 REJ09B0260-0200 Section 9 8-Bit Timers φ External clock input 8TCNT input clock 8TCNT N–1 N N+1 Figure 9.9 Count Timing for External Clock Input (Both-Edge Detection) 9.4.2 Compare Match Timing Timer Output Timing: When compare match A or B occurs, the timer output is as specified by the OIS3, OIS2, OS1, and OS0 bits in 8TCSR (unchanged, 0 output, 1 output, or toggle output). Figure 9.10 shows the timing when the output is set to toggle on compare match A. φ Compare match A signal Timer output Figure 9.10 Timing of Timer Output Rev. 2.00 Sep 20, 2005 page 290 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Clear by Compare Match: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR, 8TCNT can be cleared when compare match A or B occurs, Figure 9.11 shows the timing of this operation. φ Compare match signal 8TCNT N H'00 Figure 9.11 Timing of Clear by Compare Match Clear by Input Capture: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR, 8TCNT can be cleared when input capture B occurs. Figure 9.12 shows the timing of this operation. φ Input capture input Input capture signal 8TCNT N H'00 Figure 9.12 Timing of Clear by Input Capture 9.4.3 Input Capture Signal Timing Input capture on the rising edge, falling edge, or both edges can be selected by settings in 8TCSR. Figure 9.13 shows the timing when the rising edge is selected. The pulse width of the input capture input signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Rev. 2.00 Sep 20, 2005 page 291 of 800 REJ09B0260-0200 Section 9 8-Bit Timers φ Input capture input Input capture signal 8TCNT N TCORB N Figure 9.13 Timing of Input Capture Input Signal 9.4.4 Timing of Status Flag Setting Timing of CMFA/CMFB Flag Setting when Compare Match Occurs: The CMFA and CMFB flags in 8TCSR are set to 1 by the compare match signal output when the TCORA or TCORB and 8TCNT values match. The compare match signal is generated in the last state of the match (when the matched 8TCNT count value is updated). Therefore, after the 8TCNT and TCORA or TCORB values match, the compare match signal is not generated until an incrementing clock pulse signal is generated. Figure 9.14 shows the timing in this case. φ 8TCNT N TCOR N N+1 Compare match signal CMF Figure 9.14 CMF Flag Setting Timing when Compare Match Occurs Rev. 2.00 Sep 20, 2005 page 292 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Timing of CMFB Flag Setting when Input Capture Occurs: On generation of an input capture signal, the CMFB flag is set to 1 and at the same time the 8TCNT value is transferred to TCORB. Figure 9.15 shows the timing in this case. φ 8TCNT N TCORB N Input capture signal CMFB Figure 9.15 CMFB Flag Setting Timing when Input Capture Occurs Timing of Overflow Flag (OVF) Setting: The OVF flag in 8TCSR is set to 1 by the overflow signal generated when 8TCNT overflows (from H'FF to H'00). Figure 9.16 shows the timing in this case. φ 8TCNT H'FF H'00 Overflow signal OVF Figure 9.16 Timing of OVF Setting Rev. 2.00 Sep 20, 2005 page 293 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.4.5 Operation with Cascaded Connection If bits CKS2 to CKS0 are set to (100) in either 8TCR0 or 8TCR1, the 8-bit timers of channels 0 and 1 are cascaded. With this configuration, the two timers can be used as a single 16-bit timer (16-bit timer mode), or channel 0 8-bit timer compare matches can be counted in channel 1 (compare match count mode). Similarly, if bits CKS2 to CKS0 are set to (100) in either 8TCR2 or 8TCR3, the 8-bit timers of channels 2 and 3 are cascaded. With this configuration, the two timers can be used as a single 16-bit timer (16-bit timer mode),or channel 2 8-bit timer compare matches can be counted in channel 3 (compare match count mode). In this case, the timer operates as below. 16-Bit Count Mode • Channels 0 and 1: When bits CKS2 to CKS0 are set to (100) in 8TCR0, the timer functions as a single 16-bit timer with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits. Setting when Compare Match Occurs • The CMFA or CMFB flag is set to 1 in 8TCSR0 when a 16-bit compare match occurs. • The CMFA or CMFB flag is set to 1 in 8TCSR1 when a lower 8-bit compare match occurs. • TMO0 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR0 is in accordance with the 16-bit compare match conditions. • TMIO1 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR1 is in accordance with the lower 8-bit compare match conditions. Setting when Input Capture Occurs • The CMFB flag is set to 1 in 8TCSR0 and 8TCSR1 when the ICE bit is 1 in TCSR1 and input capture occurs. • TMIO1 pin input capture input signal edge detection is selected by bits OIS3 and OIS2 in 8TCSR0. Counter Clear Specification • If counter clear on compare match or input capture has been selected by the CCLR1 and CCLR0 bits in 8TCR0, the 16-bit counter (both 8TCNT0 and 8TCNT1) is cleared. • The settings of the CCLR1 and CCLR0 bits in 8TCR1 are ignored. The lower 8 bits cannot be cleared independently. OVF Flag Operation • The OVF flag is set to 1 in 8TCSR0 when the 16-bit counter (8TCNT0 and 8TCNT1) overflows (from H'FFFF to H'0000). • The OVF flag is set to 1 in 8TCSR1 when the 8-bit counter (8TCNT1) overflows (from H'FF to H'00). Rev. 2.00 Sep 20, 2005 page 294 of 800 REJ09B0260-0200 Section 9 8-Bit Timers • Channels 2 and 3: When bits CKS2 to CKS0 are set to (100) in 8TCR2, the timer functions as a single 16-bit timer with channel 2 occupying the upper 8 bits and channel 3 occupying the lower 8 bits. Setting when Compare Match Occurs • The CMFA or CMFB flag is set to 1 in 8TCSR2 when a 16-bit compare match occurs. • The CMFA or CMFB flag is set to 1 in 8TCSR3 when a lower 8-bit compare match occurs. • TMO2 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR2 is in accordance with the 16-bit compare match conditions. • TMIO3 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR3 is in accordance with the lower 8-bit compare match conditions. Setting when Input Capture Occurs • The CMFB flag is set to 1 in 8TCSR2 and 8TCSR3 when the ICE bit is 1 in TCSR3 and input capture occurs. • TMIO3 pin input capture input signal edge detection is selected by bits OIS3 and OIS2 in 8TCSR2. Counter Clear Specification • If counter clear on compare match has been selected by the CCLR1 and CCLR0 bits in 8TCR2, the 16-bit counter (both 8TCNT2 and 8TCNT3) is cleared. • The settings of the CCLR1 and CCLR0 bits in 8TCR3 are ignored. The lower 8 bits cannot be cleared independently. OVF Flag Operation • The OVF flag is set to 1 in 8TCSR2 when the 16-bit counter (8TCNT2 and 8TCNT3) overflows (from H'FFFF to H'0000). • The OVF flag is set to 1 in 8TCSR3 when the 8-bit counter (8TCNT3) overflows (from H'FF to H'00). Rev. 2.00 Sep 20, 2005 page 295 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Compare Match Count Mode • Channels 0 and 1: When bits CKS2 to CKS0 are set to (100) in 8TCR1, 8TCNT1 counts channel 0 compare match A events. CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in accordance with the settings for each channel. Note: When bit ICE = 1 in 8TCSR1, the compare match register function of TCORB0 in channel 0 cannot be used. • Channels 2 and 3: When bits CKS2 to CKS0 are set to (100) in 8TCR3, 8TCNT3 counts channel 2 compare match A events. CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in accordance with the settings for each channel. Note: When bit ICE = 1 in 8TCSR3, the compare match register function of TCORB2 in channel 2 cannot be used. Caution Do not set 16-bit counter mode and compare match count mode simultaneously within the same group, as the 8TCNT input clock will not be generated and the counters will not operate. 9.4.6 Input Capture Setting The 8TCNT value can be transferred to TCORB on detection of an input edge on the input capture/output compare pin (TMIO1 or TMIO3). Rising edge, falling edge, or both edge detection can be selected. In 16-bit count mode, 16-bit input capture can be used. Rev. 2.00 Sep 20, 2005 page 296 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Setting Input Capture Operation in 8-Bit Timer Mode (Normal Operation) • Channel 1: Set TCORB1 as an 8-bit input capture register with the ICE bit in 8TCSR1. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR1. Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count. • Channel 3: Set TCORB3 as an 8-bit input capture register with the ICE bit in 8TCSR3. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR3. Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count. Note: When TCORB1 in channel 1 is used for input capture, TCORB0 in channel 0 cannot be used as a compare match register. Similarly, when TCORB3 in channel 3 is used for input capture, TCORB2 in channel 2 cannot be used as a compare match register. Setting Input Capture Operation in 16-Bit Count Mode • Channels 0 and 1: In 16-bit count mode, TCORB0 and TCORB1 function as a 16-bit input capture register when the ICE bit is set to 1 in 8TCSR1. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR0. (In 16-bit count mode, the settings of bits OIS3 and OIS2 in 8TCSR1 are ignored.) Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count. • Channels 2 and 3: In 16-bit count mode, TCORB2 and TCORB3 function as a 16-bit input capture register when the ICE bit is set to 1 in 8TCSR3. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR2. (In 16-bit count mode, the settings of bits OIS3 and OIS2 in 8TCSR3 are ignored.) Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count. Rev. 2.00 Sep 20, 2005 page 297 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.5 Interrupt 9.5.1 Interrupt Sources The 8-bit timer unit can generate three types of interrupt: compare match A and B (CMIA and CMIB) and overflow (TOVI). Table 9.5 shows the interrupt sources and their priority order. Each interrupt source is enabled or disabled by the corresponding interrupt enable bit in 8TCR. A separate interrupt request signal is sent to the interrupt controller by each interrupt source. Table 9.5 Types of 8-Bit Timer Interrupt Sources and Priority Order Interrupt Source Description Priority CMIA Interrupt by CMFA High CMIB Interrupt by CMFB TOVI Interrupt by OVF Low For compare match interrupts CMIA1/CMIB1 and CMIA3/CMIB3 andg the overflow interrupts (TOVI0/TOVI1 and TOVI2/TOVI3), one vector is shared by two interrupts. Table 9.6 lists the interrupt sources. Table 9.6 8-Bit Timer Interrupt Sources Channel Interrupt Source Description 0 CMIA0 TCORA0 compare match CMIB0 TCORB0 compare match/input capture 1 CMIA1/CMIB1 TCORA1 compare match, or TCORB1 compare match/input capture 0, 1 TOVI0/TOVI1 Counter 0 or counter 1 overflow 2 CMIA2 TCORA2 compare match CMIB2 TCORB2 compare match/input capture 3 CMIA3/CMIB3 TCORA3 compare match, or TCORB3 compare match/input capture 2, 3 TOVI2/TOVI3 Counter 2 or counter 3 overflow Rev. 2.00 Sep 20, 2005 page 298 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.5.2 A/D Converter Activation The A/D converter can only be activated by channel 0 compare match A. If the ADTE bit setting is 1 when the CMFA flag in 8TCSR0 is set to 1 by generation of channel 0 compare match A, an A/D conversion start request will be issued to the A/D converter. If the TRGE bit in ADCR is 1 at this time, the A/D converter will be started. If the ADTE bit in 8TCSR0 is 1, A/D converter external trigger pin (ADTRG) input is disabled. 9.6 8-Bit Timer Application Example Figure 9.17 shows how the 8-bit timer module can be used to output pulses with any desired duty cycle. The settings for this example are as follows: • Clear the CCLR1 bit to 0 and set the CCLR0 bit to 1 in 8TCR so that 8TCNT is cleared by a TCORA compare match. • Set bits OIS3, OIS2, OS1, and OS0 to (0110) in 8TCSR so that 1 is output on a TCORA compare match and 0 is output on a TCORB compare match. The above settings enable a waveform with the cycle determined by TCORA and the pulse width detected by TCORB to be output without software intervention. 8TCNT H'FF Counter clear TCORA TCORB H'00 TMO Figure 9.17 Example of Pulse Output Rev. 2.00 Sep 20, 2005 page 299 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7 Usage Notes Note that the following kinds of contention can occur in 8-bit timer operation. 9.7.1 Contention between 8TCNT Write and Clear If a timer counter clear signal occurs in the T3 state of a 8TCNT write cycle, clearing of the counter takes priority and the write is not performed. Figure 9.18 shows the timing in this case. 8TCNT write cycle T1 T2 T3 φ Address bus 8TCNT address Internal write signal Counter clear signal 8TCNT N H'00 Figure 9.18 Contention between 8TCNT Write and Clear Rev. 2.00 Sep 20, 2005 page 300 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.2 Contention between 8TCNT Write and Increment If an increment pulse occurs in the T3 state of a 8TCNT write cycle, writing takes priority and 8TCNT is not incremented. Figure 9.19 shows the timing in this case. 8TCNT write cycle T1 T2 T3 φ Address bus 8 TCNT address Internal write signal 8TCNT input clock 8TCNT N M 8TCNT write data Figure 9.19 Contention between 8TCNT Write and Increment Rev. 2.00 Sep 20, 2005 page 301 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.3 Contention between TCOR Write and Compare Match If a compare match occurs in the T3 state of a TCOR write cycle, writing takes priority and the compare match signal is inhibited. Figure 9.20 shows the timing in this case. TCOR write cycle T1 T2 T3 φ TCOR address Address bus Internal write signal 8TCNT N TCOR N N+1 M TCOR write data Compare match signal Figure 9.20 Contention between TCOR Write and Compare Match Rev. 2.00 Sep 20, 2005 page 302 of 800 REJ09B0260-0200 Inhibited Section 9 8-Bit Timers 9.7.4 Contention between TCOR Read and Input Capture If an input capture signal occurs in the T3 state of a TCOR read cycle, the value before input capture is read. Figure 9.21 shows the timing in this case. TCORB read cycle T1 T2 T3 φ Address bus TCORB address Internal read signal Input capture signal TCORB Internal data bus N M N Figure 9.21 Contention between TCOR Read and Input Capture Rev. 2.00 Sep 20, 2005 page 303 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.5 Contention between Counter Clearing by Input Capture and Counter Increment If an input capture signal and counter increment signal occur simultaneously, counter clearing by the input capture signal takes priority and the counter is not incremented. The value before the counter is cleared is transferred to TCORB. Figure 9.22 shows the timing in this case. T1 T2 T3 φ Input capture signal Counter clear signal 8TCNT internal clock 8TCNT N TCORB X H'00 N Figure 9.22 Contention between Counter Clearing by Input Capture and Counter Increment Rev. 2.00 Sep 20, 2005 page 304 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.6 Contention between TCOR Write and Input Capture If an input capture signal occurs in the T3 state of a TCOR write cycle, input capture takes priority and the write to TCOR is not performed. Figure 9.23 shows the timing in this case. TCOR write cycle T1 T2 T3 φ Address bus TCOR address Internal write signal Input capture signal M 8TCNT TCOR X M Figure 9.23 Contention between TCOR Write and Input Capture Rev. 2.00 Sep 20, 2005 page 305 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.7 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode (Cascaded Connection) If an increment pulse occurs in the T3 state of an 8TCNT byte write cycle in 16-bit count mode, the counter write takes priority and the byte data for which the write was performed is not incremented. The byte data for which a write was not performed is incremented. Figure 9.24 shows the timing when an increment pulse occurs in the T2 state of a byte write to 8TCNT (upper byte). If an increment pulse occurs in the T2 state, on the other hand, the increment takes priority. 8TCNT (upper byte) byte write cycle T1 T2 T3 φ 8TCNTH address Address bus Internal write signal 8TCNT input clock 8TCNT (upper byte) N 8TCNT (lower byte) X N+1 8TCNT write data X+1 Figure 9.24 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode Rev. 2.00 Sep 20, 2005 page 306 of 800 REJ09B0260-0200 Section 9 8-Bit Timers 9.7.8 Contention between Compare Matches A and B If compare matches A and B occur at the same time, the 8-bit timer operates according to the relative priority of the output states set for compare match A and compare match B, as shown in Table 9.7. Table 9.7 Timer Output Priority Order Output Setting Priority Toggle output High 1 output 0 output No change 9.7.9 Low 8TCNT Operation and Internal Clock Source Switchover Switching internal clock sources may cause 8TCNT to increment, depending on the switchover timing. Table 9.8 shows the relation between the time of the switchover (by writing to bits CKS1 and CKS0) and the operation of 8TCNT. The 8TCNT input clock is generated from the internal clock source by detecting the rising edge of the internal clock. If a switchover is made from a low clock source to a high clock source, as in case No. 3 in Table 9.8, the switchover will be regarded as a falling edge, a 8TCNT clock pulse will be generated, and 8TCNT will be incremented. 8TCNT may also be incremented when switching between internal and external clocks. Rev. 2.00 Sep 20, 2005 page 307 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Table 9.8 Internal Clock Switchover and 8TCNT Operation No. CKS1 and CKS0 Write Timing 1 High → high switchover*1 8TCNT Operation Old clock source New clock source 8TCNT clock 8TCNT N N+1 CKS bits rewritten 2 High → low switchover *2 Old clock source New clock source 8TCNT clock 8TCNT N N+1 N+2 CKS bits rewritten 3 Low → high switchover*3 Old clock source New clock source *4 8TCNT clock 8TCNT N N+1 CKS bits rewritten Rev. 2.00 Sep 20, 2005 page 308 of 800 REJ09B0260-0200 N+2 Section 9 8-Bit Timers No. CKS1 and CKS0 Write Timing 4 4 Low → low switchover* 8TCNT Operation Old clock source New clock source 8TCNT clock 8TCNT N N+1 N+2 CKS bits rewritten Notes: 1. Including switchovers from the high level to the halted state, and from the halted state to the high level. 2. Including switchover from the halted state to the low level. 3. Including switchover from the low level to the halted state. 4. The switchover is regarded as a rising edge, causing 8TCNT to increment. Rev. 2.00 Sep 20, 2005 page 309 of 800 REJ09B0260-0200 Section 9 8-Bit Timers Rev. 2.00 Sep 20, 2005 page 310 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Section 10 Programmable Timing Pattern Controller (TPC) 10.1 Overview The H8/3024 Group has a built-in programmable timing pattern controller (TPC) that provides pulse outputs by using the 16-bit timer as a time base. The TPC pulse outputs are divided into 4bit groups (group 3 to group 0) that can operate simultaneously and independently. 10.1.1 Features TPC features are listed below. • 16-bit output data Maximum 16-bit data can be output. TPC output can be enabled on a bit-by-bit basis. • Four output groups Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit outputs. • Selectable output trigger signals • Output trigger signals can be selected for each group from the compare match signals of three 16-bit timer channels. • Non-overlap mode A non-overlap margin can be provided between pulse outputs. Rev. 2.00 Sep 20, 2005 page 311 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.1.2 Block Diagram Figure 10.1 shows a block diagram of the TPC. 16-bit timer compare match signals Control logic TP15 TP14 TP13 TP12 TP11 TP10 TP 9 TP 8 TP 7 TP 6 TP 5 TP 4 TP 3 TP 2 TP 1 TP 0 Legend: TPMR: TPCR: NDERB: NDERA: PBDDR: PADDR: NDRB: NDRA: PBDR: PADR: PADDR PBDDR NDERA NDERB TPMR TPCR Internal data bus Pulse output pins, group 3 PBDR NDRB PADR NDRA Pulse output pins, group 2 Pulse output pins, group 1 Pulse output pins, group 0 TPC output mode register TPC output control register Next data enable register B Next data enable register A Port B data direction register Port A data direction register Next data register B Next data register A Port B data register Port A data register Figure 10.1 TPC Block Diagram Rev. 2.00 Sep 20, 2005 page 312 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.1.3 Pin Configuration Table 10.1 summarizes the TPC output pins. Table 10.1 TPC Pins Name Symbol I/O Function TPC output 0 TP0 Output Group 0 pulse output TPC output 1 TP1 Output TPC output 2 TP2 Output TPC output 3 TP3 Output TPC output 4 TP4 Output TPC output 5 TP5 Output TPC output 6 TP6 Output TPC output 7 TP7 Output TPC output 8 TP8 Output TPC output 9 TP9 Output TPC output 10 TP10 Output TPC output 11 TP11 Output TPC output 12 TP12 Output TPC output 13 TP13 Output TPC output 14 TP14 Output TPC output 15 TP15 Output Group 1 pulse output Group 2 pulse output Group 3 pulse output Rev. 2.00 Sep 20, 2005 page 313 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.1.4 Register Configuration Table 10.2 summarizes the TPC registers. Table 10.2 TPC Registers Address*1 Name Abbreviation R/W Initial Value H'EE009 Port A data direction register PADDR W H'00 H'00 H'FFFD9 Port A data register PADR R/(W)*2 H'EE00A Port B data direction register PBDDR W H'00 H'00 H'FFFDA Port B data register PBDR R/(W)*2 H'FFFA0 TPC output mode register TPMR R/W H'F0 H'FFFA1 TPC output control register TPCR R/W H'FF H'FFFA2 Next data enable register B NDERB R/W H'00 H'FFFA3 Next data enable register A NDERA R/W H'00 H'FFFA5/ H'FFFA7*3 Next data register A NDRA R/W H'00 H'FFFA4/ H'FFFA6*3 Next data register B NDRB R/W H'00 Notes: 1. Lower 20 bits of the address in advanced mode. 2. Bits used for TPC output cannot be written. 3. The NDRA address is H'FFFA5 when the same output trigger is selected for TPC output groups 0 and 1 by settings in TPCR. When the output triggers are different, the NDRA address is H'FFFA7 for group 0 and H'FFFA5 for group 1. Similarly, the address of NDRB is H'FFFA4 when the same output trigger is selected for TPC output groups 2 and 3 by settings in TPCR. When the output triggers are different, the NDRB address is H'FFFA6 for group 2 and H'FFFA4 for group 3. Rev. 2.00 Sep 20, 2005 page 314 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.2 Register Descriptions 10.2.1 Port A Data Direction Register (PADDR) PADDR is an 8-bit write-only register that selects input or output for each pin in port A. Bit 7 6 5 4 3 2 1 0 PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR Initial value 0 0 0 0 0 0 0 0 Read/Write W W W W W W W W Port A data direction 7 to 0 These bits select input or output for port A pins Port A is multiplexed with pins TP7 to TP0. Bits corresponding to pins used for TPC output must be set to 1. For further information about PADDR, see section 7.11, Port A. 10.2.2 Port A Data Register (PADR) PADR is an 8-bit readable/writable register that stores TPC output data for groups 0 and 1, when these TPC output groups are used. Bit 7 6 5 4 3 2 1 0 PA 7 PA 6 PA 5 PA 4 PA 3 PA 2 PA 1 PA 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Port A data 7 to 0 These bits store output data for TPC output groups 0 and 1 Note: * Bits selected for TPC output by NDERA settings become read-only bits. For further information about PADR, see section 7.11, Port A. Rev. 2.00 Sep 20, 2005 page 315 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.3 Port B Data Direction Register (PBDDR) PBDDR is an 8-bit write-only register that selects input or output for each pin in port B. Bit 7 6 5 4 3 2 1 0 PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR Initial value 0 0 0 0 0 0 0 0 Read/Write W W W W W W W W Port B data direction 7 to 0 These bits select input or output for port B pins Port B is multiplexed with pins TP15 to TP8. Bits corresponding to pins used for TPC output must be set to 1. For further information about PBDDR, see section 7.12, Port B. 10.2.4 Port B Data Register (PBDR) PBDR is an 8-bit readable/writable register that stores TPC output data for groups 2 and 3, when these TPC output groups are used. Bit 7 6 5 4 3 2 1 0 PB 7 PB 6 PB 5 PB 4 PB 3 PB 2 PB 1 PB 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* Port B data 7 to 0 These bits store output data for TPC output groups 2 and 3 Note: * Bits selected for TPC output by NDERB settings become read-only bits. For further information about PBDR, see section 7.12, Port B. Rev. 2.00 Sep 20, 2005 page 316 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.5 Next Data Register A (NDRA) NDRA is an 8-bit readable/writable register that stores the next output data for TPC output groups 1 and 0 (pins TP7 to TP0). During TPC output, when an 16-bit timer compare match event specified in TPCR occurs, NDRA contents are transferred to the corresponding bits in PADR. The address of NDRA differs depending on whether TPC output groups 0 and 1 have the same output trigger or different output triggers. NDRA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered by the same compare match event, the NDRA address is H'FFFA5. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FFFA7 consists entirely of reserved bits that cannot be modified and always read 1. Address H'FFFA5 Bit 7 6 5 4 3 2 1 0 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Next data 7 to 4 These bits store the next output data for TPC output group 1 Next data 3 to 0 These bits store the next output data for TPC output group 0 Address H'FFFA7 Bit 7 6 5 4 3 2 1 0 — — — — — — — — Initial value 1 1 1 1 1 1 1 1 Read/Write — — — — — — — — Reserved bits Rev. 2.00 Sep 20, 2005 page 317 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Different Triggers for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered by different compare match events, the address of the upper 4 bits of NDRA (group 1) is H'FFFA5 and the address of the lower 4 bits (group 0) is H'FFFA7. Bits 3 to 0 of address H'FFFA5 and bits 7 to 4 of address H'FFFA7 are reserved bits that cannot be modified and always read 1. Address H'FFFA5 Bit 7 6 5 4 3 2 1 0 NDR7 NDR6 NDR5 NDR4 — — — — Initial value 0 0 0 0 1 1 1 1 Read/Write R/W R/W R/W R/W — — — — Next data 7 to 4 These bits store the next output data for TPC output group 1 Reserved bits Address H'FFFA7 Bit 7 6 5 4 3 2 1 0 — — — — NDR3 NDR2 NDR1 NDR0 Initial value 1 1 1 1 0 0 0 0 Read/Write — — — — R/W R/W R/W R/W Reserved bits Rev. 2.00 Sep 20, 2005 page 318 of 800 REJ09B0260-0200 Next data 3 to 0 These bits store the next output data for TPC output group 0 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.6 Next Data Register B (NDRB) NDRB is an 8-bit readable/writable register that stores the next output data for TPC output groups 3 and 2 (pins TP15 to TP8). During TPC output, when an 16-bit timer compare match event specified in TPCR occurs, NDRB contents are transferred to the corresponding bits in PBDR. The address of NDRB differs depending on whether TPC output groups 2 and 3 have the same output trigger or different output triggers. NDRB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered by the same compare match event, the NDRB address is H'FFFA4. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FFFA6 consists entirely of reserved bits that cannot be modified and always read 1. Address H'FFFA4 Bit 7 6 5 4 3 2 1 0 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Next data 15 to 12 These bits store the next output data for TPC output group 3 Next data 11 to 8 These bits store the next output data for TPC output group 2 Address H'FFFA6 Bit 7 6 5 4 3 2 1 0 — — — — — — — — Initial value 1 1 1 1 1 1 1 1 Read/Write — — — — — — — — Reserved bits Rev. 2.00 Sep 20, 2005 page 319 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Different Triggers for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered by different compare match events, the address of the upper 4 bits of NDRB (group 3) is H'FFFA4 and the address of the lower 4 bits (group 2) is H'FFFA6. Bits 3 to 0 of address H'FFFA4 and bits 7 to 4 of address H'FFFA6 are reserved bits that cannot be modified and always read 1. Address H'FFFA4 Bit 7 6 5 4 3 2 1 0 NDR15 NDR14 NDR13 NDR12 — — — — Initial value 0 0 0 0 1 1 1 1 Read/Write R/W R/W R/W R/W — — — — Next data 15 to 12 These bits store the next output data for TPC output group 3 Reserved bits Address H'FFFA6 Bit 7 6 5 4 3 2 1 0 — — — — NDR11 NDR10 NDR9 NDR8 Initial value 1 1 1 1 0 0 0 0 Read/Write — — — — R/W R/W R/W R/W Reserved bits Rev. 2.00 Sep 20, 2005 page 320 of 800 REJ09B0260-0200 Next data 11 to 8 These bits store the next output data for TPC output group 2 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.7 Next Data Enable Register A (NDERA) NDERA is an 8-bit readable/writable register that enables or disables TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis. Bit 7 6 5 4 3 2 1 0 NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Next data enable 7 to 0 These bits enable or disable TPC output groups 1 and 0 If a bit is enabled for TPC output by NDERA, then when the 16-bit timer compare match event selected in the TPC output control register (TPCR) occurs, the NDRA value is automatically transferred to the corresponding PADR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRA to PADR and the output value does not change. NDERA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0—Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis. Bits 7 to 0 NDER7 to NDER0 Description 0 TPC outputs TP7 to TP0 are disabled (NDR7 to NDR0 are not transferred to PA7 to PA0) 1 TPC outputs TP7 to TP0 are enabled (NDR7 to NDR0 are transferred to PA7 to PA0) (Initial value) Rev. 2.00 Sep 20, 2005 page 321 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.8 Next Data Enable Register B (NDERB) NDERB is an 8-bit readable/writable register that enables or disables TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis. Bit 7 6 5 4 3 2 1 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 0 NDER8 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Next data enable 15 to 8 These bits enable or disable TPC output groups 3 and 2 If a bit is enabled for TPC output by NDERB, then when the 16-bit timer compare match event selected in the TPC output control register (TPCR) occurs, the NDRB value is automatically transferred to the corresponding PBDR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRB to PBDR and the output value does not change. NDERB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0—Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis. Bits 7 to 0 NDER15 to NDER8 Description 0 TPC outputs TP15 to TP8 are disabled (NDR15 to NDR8 are not transferred to PB7 to PB0) 1 TPC outputs TP15 to TP8 are enabled (NDR15 to NDR8 are transferred to PB7 to PB0) Rev. 2.00 Sep 20, 2005 page 322 of 800 REJ09B0260-0200 (Initial value) Section 10 Programmable Timing Pattern Controller (TPC) 10.2.9 TPC Output Control Register (TPCR) TPCR is an 8-bit readable/writable register that selects output trigger signals for TPC outputs on a group-by-group basis. Bit 7 6 5 4 3 2 1 0 G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Group 3 compare match select 1 and 0 These bits select the compare match Group 2 compare event that triggers match select 1 and 0 TPC output group 3 These bits select (TP15 to TP12) the compare match event that triggers TPC output group 2 (TP11 to TP8) Group 1 compare match select 1 and 0 These bits select the compare match Group 0 compare event that triggers match select 1 and 0 TPC output group 1 These bits select (TP7 to TP4) the compare match event that triggers TPC output group 0 (TP3 to TP0) TPCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Rev. 2.00 Sep 20, 2005 page 323 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Bits 7 and 6—Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits select the compare match event that triggers TPC output group 3 (TP15 to TP12). Bit 7 G3CMS1 Bit 6 G3CMS0 0 0 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 0 1 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 1 0 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 2 1 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 2 1 Description (Initial value) Bits 5 and 4—Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits select the compare match event that triggers TPC output group 2 (TP11 to TP8). Bit 5 G2CMS1 Bit 4 G2CMS0 0 0 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 0 1 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 1 0 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 2 1 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 2 1 Description Rev. 2.00 Sep 20, 2005 page 324 of 800 REJ09B0260-0200 (Initial value) Section 10 Programmable Timing Pattern Controller (TPC) Bits 3 and 2—Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits select the compare match event that triggers TPC output group 1 (TP7 to TP4). Bit 3 G1CMS1 Bit 2 G1CMS0 0 0 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 0 1 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 1 0 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 2 1 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 2 1 Description (Initial value) Bits 1 and 0—Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits select the compare match event that triggers TPC output group 0 (TP3 to TP0). Bit 1 G0CMS1 Bit 0 G0CMS0 0 0 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 0 1 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 1 0 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 2 1 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 2 1 Description (Initial value) Rev. 2.00 Sep 20, 2005 page 325 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.2.10 TPC Output Mode Register (TPMR) TPMR is an 8-bit readable/writable register that selects normal or non-overlapping TPC output for each group. Bit 7 6 5 4 — — — — Initial value 1 1 1 1 0 0 0 0 Read/Write — — — — R/W R/W R/W R/W 3 2 G3NOV G2NOV 1 0 G1NOV G0NOV Reserved bits Group 3 non-overlap Selects non-overlapping TPC output for group 3 (TP15 to TP12) Group 2 non-overlap Selects non-overlapping TPC output for group 2 (TP11 to TP8 ) Group 1 non-overlap Selects non-overlapping TPC output for group 1 (TP7 to TP4 ) Group 0 non-overlap Selects non-overlapping TPC output for group 0 (TP3 to TP0 ) The output trigger period of a non-overlapping TPC output waveform is set in general register B (GRB) in the 16-bit timer channel selected for output triggering. The non-overlap margin is set in general register A (GRA). The output values change at compare match A and B. For details see section 10.3.4, Non-Overlapping TPC Output. TPMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 326 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Bit 3—Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping TPC output for group 3 (TP15 to TP12). Bit 3 G3NOV Description 0 Normal TPC output in group 3 (output values change at compare match A in the selected 16-bit timer channel) 1 Non-overlapping TPC output in group 3 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 2—Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping TPC output for group 2 (TP11 to TP8). Bit 2 G2NOV Description 0 Normal TPC output in group 2 (output values change at compare match A in the selected 16-bit timer channel) 1 Non-overlapping TPC output in group 2 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 1—Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping TPC output for group 1 (TP7 to TP4). Bit 1 G1NOV Description 0 Normal TPC output in group 1 (output values change at compare match A in the selected 16-bit timer channel) 1 Non-overlapping TPC output in group 1 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 0—Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping TPC output for group 0 (TP3 to TP0). Bit 0 G0NOV Description 0 Normal TPC output in group 0 (output values change at compare match A in the selected 16-bit timer channel) 1 Non-overlapping TPC output in group 0 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Rev. 2.00 Sep 20, 2005 page 327 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.3 Operation 10.3.1 Overview When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents. When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit contents are transferred to PADR or PBDR to update the output values. Figure 10.2 illustrates the TPC output operation. Table 10.3 summarizes the TPC operating conditions. DDR NDER Q Q Output trigger signal C Q DR D Q NDR D Internal data bus TPC output pin Figure 10.2 TPC Output Operation Table 10.3 TPC Operating Conditions NDER DDR Pin Function 0 0 Generic input port 1 Generic output port 0 Generic input port (but the DR bit is a read-only bit, and when compare match occurs, the NDR bit value is transferred to the DR bit) 1 TPC pulse output 1 Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and NDRB before the next compare match. For information on non-overlapping operation, see section 10.3.4, Non-Overlapping TPC Output. Rev. 2.00 Sep 20, 2005 page 328 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.3.2 Output Timing If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output when the selected compare match event occurs. Figure 10.3 shows the timing of these operations for the case of normal output in groups 2 and 3, triggered by compare match A. φ N TCNT N+1 N GRA Compare match A signal n NDRB PBDR m n TP8 to TP15 m n Figure 10.3 Timing of Transfer of Next Data Register Contents and Output (Example) Rev. 2.00 Sep 20, 2005 page 329 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.3.3 Normal TPC Output Sample Setup Procedure for Normal TPC Output: Figure 10.4 shows a sample procedure for setting up normal TPC output. Normal TPC output 16-bit timer setup Port and TPC setup 16-bit timer setup Select GR functions 1 1. Set TIOR to make GRA an output compare register (with output inhibited). Set GRA value 2 2. Set the TPC output trigger period. Select counting operation 3 3. Select interrupt request 4 Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. 4. Enable the IMFA interrupt in TISRA. Set initial output data 5 5. Select port output 6 Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. Enable TPC output 7 6. Set the DDR bits of the input/output port pins to be used for TPC output to 1. Select TPC output trigger 8 7. Set the NDER bits of the pins to be used for TPC output to 1. Set next TPC output data 9 8. Select the 16-bit timer compare match event to be used as the TPC output trigger in TPCR. Start counter 10 9. Set the next TPC output values in the NDR bits. Compare match? No Yes Set next TPC output data 11 10. Set the STR bit to 1 in TSTR to start the timer counter. 11. At each IMFA interrupt, set the next output values in the NDR bits. Figure 10.4 Setup Procedure for Normal TPC Output (Example) Rev. 2.00 Sep 20, 2005 page 330 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Example of Normal TPC Output (Example of Five-Phase Pulse Output): Figure 10.5 shows an example in which the TPC is used for cyclic five-phase pulse output. TCNT value Compare match TCNT GRA Time H'0000 NDRB 80 PBDR 00 C0 80 40 C0 60 40 20 60 30 20 10 30 18 10 08 18 88 08 80 88 C0 80 40 C0 TP15 TP14 TP13 TP12 TP11 1. The 16-bit timer channel to be used as the output trigger channel is set up so that GRA is an output compare register and the counter will be cleared by compare match A. The trigger period is set in GRA. The IMIEA bit is set to 1 in TISRA to enable the compare match A interrupt. 2. H'F8 is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger. Output data H'80 is written in NDRB. 3. The timer counter in this 16-bit timer channel is started. When compare match A occurs, the NDRB contents are transferred to PBDR and output. The compare match/input capture A (IMFA) interrupt service routine writes the next output data (H'C0) in NDRB. 4. Five-phase overlapping pulse output (one or two phases active at a time) can be obtained by writing H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88… at successive IMFA interrupts. Figure 10.5 Normal TPC Output Example (Five-Phase Pulse Output) Rev. 2.00 Sep 20, 2005 page 331 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.3.4 Non-Overlapping TPC Output Sample Setup Procedure for Non-Overlapping TPC Output: Figure 10.6 shows a sample procedure for setting up non-overlapping TPC output. Non-overlapping TPC output 16-bit timer setup Select GR functions 1 1. Set TIOR to make GRA and GRB output compare registers (with output inhibited). Set GR values 2 2. Set the TPC output trigger period in GRB and the non-overlap margin in GRA. Select counting operation 3 Select interrupt requests 4 Set initial output data 5 Set up TPC output 6 Enable TPC transfer 7 6. Set the DDR bits of the input/output port pins to be used for TPC output to 1. Select TPC transfer trigger 8 7. Set the NDER bits of the pins to be used for TPC output to 1. Select non-overlapping groups 9 Set next TPC output data 10 8. In TPCR, select the 16-bit timer compare match event to be used as the TPC output trigger. 3. Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. 4. Enable the IMFA interrupt in TISRA. Port and TPC setup 16-bit timer setup 5. Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. 9. In TPMR, select the groups that will operate in non-overlap mode. 11 Start counter Compare match A? No Yes Set next TPC output data 10. Set the next TPC output values in the NDR bits. 11. Set the STR bit to 1 in TSTR to start the timer counter. 12. At each IMFA interrupt, write the next output value in the NDR bits. 12 Figure 10.6 Setup Procedure for Non-Overlapping TPC Output (Example) Rev. 2.00 Sep 20, 2005 page 332 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Example of Non-Overlapping TPC Output (Example of Four-Phase Complementary NonOverlapping Output): Figure 10.7 shows an example of the use of TPC output for four-phase complementary non-overlapping pulse output. TCNT value GRB TCNT GRA Time H'0000 NDRB 95 PBDR 00 65 95 59 05 65 56 41 59 95 50 56 65 14 95 05 65 Non-overlap margin TP15 TP14 TP13 TP12 TP11 TP10 TP9 TP8 1. The 16-bit timer channel to be used as the output trigger channel is set up so that GRA and GRB are output compare registers and the counter will be cleared by compare match B. The TPC output trigger period is set in GRB. The non-overlap margin is set in GRA. The IMIEA bit is set to 1 in TISRA to enable IMFA interrupts. 2. H'FF is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger. Bits G3NOV and G2NOV are set to 1 in TPMR to select non-overlapping output. Output data H'95 is written in NDRB. 3. The timer counter in this 16-bit timer channel is started. When compare match B occurs, outputs change from 1 to 0. When compare match A occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed by the value of GRA). The IMFA interrupt service routine writes the next output data (H'65) in NDRB. 4. Four-phase complementary non-overlapping pulse output can be obtained by writing H'59, H'56, H'95… at successive IMFA interrupts. Figure 10.7 Non-Overlapping TPC Output Example (Four-Phase Complementary Non-Overlapping Pulse Output) Rev. 2.00 Sep 20, 2005 page 333 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.3.5 TPC Output Triggering by Input Capture TPC output can be triggered by 16-bit timer input capture as well as by compare match. If GRA functions as an input capture register in the 16-bit timer channel selected in TPCR, TPC output will be triggered by the input capture signal. Figure 10.8 shows the timing. φ TIOC pin Input capture signal N NDR DR M N Figure 10.8 TPC Output Triggering by Input Capture (Example) Rev. 2.00 Sep 20, 2005 page 334 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) 10.4 Usage Notes 10.4.1 Operation of TPC Output Pins TP0 to TP15 are multiplexed with 16-bit timer, address bus, and other pin functions. When 16-bit timer, or address bus output is enabled, the corresponding pins cannot be used for TPC output. The data transfer from NDR bits to DR bits takes place, however, regardless of the usage of the pin. Pin functions should be changed only under conditions in which the output trigger event will not occur. 10.4.2 Note on Non-Overlapping Output During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as follows. 1. NDR bits are always transferred to DR bits at compare match A. 2. At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred if their value is 1. Figure 10.9 illustrates the non-overlapping TPC output operation. DDR NDER Q Q Compare match A Compare match B C Q DR D Q NDR D TPC output pin Figure 10.9 Non-Overlapping TPC Output Rev. 2.00 Sep 20, 2005 page 335 of 800 REJ09B0260-0200 Section 10 Programmable Timing Pattern Controller (TPC) Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before compare match A. NDR contents should not be altered during the interval from compare match B to compare match A (the non-overlap margin). This can be accomplished by having the IMFA interrupt service routine write the next data in NDR. The next data must be written before the next compare match B occurs. Figure 10.10 shows the timing relationships. Compare match A Compare match B NDR write NDR write NDR DR 0 output 0/1 output 0 output Write to NDR in this interval Do not write to NDR in this interval 0/1 output Write to NDR in this interval Do not write to NDR in this interval Figure 10.10 Non-Overlapping Operation and NDR Write Timing Rev. 2.00 Sep 20, 2005 page 336 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Section 11 Watchdog Timer 11.1 Overview The H8/3024 Group has an on-chip watchdog timer (WDT). The WDT has two selectable functions: it can operate as a watchdog timer to supervise system operation, or it can operate as an interval timer. As a watchdog timer, it generates a reset signal for the H8/3024 chip if a system crash allows the timer counter (TCNT) to overflow before being rewritten. In interval timer operation, an interval timer interrupt is requested at each TCNT overflow. 11.1.1 Features WDT features are listed below. • Selection of eight counter clock sources φ/2, φ /32, φ /64, φ /128, φ /256, φ /512, φ /2048, or φ /4096 • Interval timer option • Timer counter overflow generates a reset signal or interrupt. The reset signal is generated in watchdog timer operation. An interval timer interrupt is generated in interval timer operation. • Watchdog timer reset signal resets the entire H8/3024 internally, and can also be output externally. The reset signal generated by timer counter overflow during watchdog timer operation resets the entire H8/3024 internally. An external reset signal can be output from the RESO pin to reset other system devices simultaneously. In the versions with on-chip flash memory, the RESO pin functions as the FWE pin, and therefore there is no function for outputting a reset signal externally. Rev. 2.00 Sep 20, 2005 page 337 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.1.2 Block Diagram Figure 11.1 shows a block diagram of the WDT. Overflow TCNT Interrupt signal (interval timer) Interrupt control TCSR Reset control Internal data bus Internal clock sources φ/2 RSTCSR Reset (internal, external) Read/ write control φ/32 φ/64 Clock Clock selector φ/128 φ/256 φ/512 Legend: TCNT: Timer counter TCSR: Timer control/status register RSTCSR: Reset control/status register φ/2048 φ/4096 Figure 11.1 WDT Block Diagram 11.1.3 Pin Configuration Table 11.1 describes the WDT output pin*. Note: * Not present in the versions with on-chip flash memory. Table 11.1 WDT Pin Name Abbreviation I/O Function Reset output RESO Output* External output of the watchdog timer reset signal Note: * Open-drain output. Rev. 2.00 Sep 20, 2005 page 338 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.1.4 Register Configuration Table 11.2 summarizes the WDT registers. Table 11.2 WDT Registers Address*1 Write*2 H'FFF8C H'FFF8E Read Name Abbreviation R/W Initial Value *3 H'FFF8C Timer control/status register TCSR R/(W) H'18 H'FFF8D Timer counter TCNT R/W H'00 RSTCSR R/(W)*3 H'3F H'FFF8F Reset control/status register Notes: 1. Lower 20 bits of the address in advanced mode. 2. Write word data starting at this address. 3. Only 0 can be written in bit 7, to clear the flag. 11.2 Register Descriptions 11.2.1 Timer Counter (TCNT) TCNT is an 8-bit readable and writable up-counter. Bit 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Note: The method for writing to TCNT is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from an internal clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from H'FF to H'00), the OVF bit is set to 1 in TCSR. TCNT is initialized to H'00 by a reset and when the TME bit is cleared to 0. Rev. 2.00 Sep 20, 2005 page 339 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.2.2 Timer Control/Status Register (TCSR) TCSR is an 8-bit readable and writable register. Its functions include selecting the timer mode and clock source. Bit Initial value Read/Write 7 6 5 4 3 2 1 0 OVF WT/IT TME — — CKS2 CKS1 CKS0 0 R/(W)* 0 0 1 1 0 0 0 R/W R/W — — R/W R/W R/W Clock select These bits select the TCNT clock source Reserved bits Timer enable Selects whether TCNT runs or halts Timer mode select Selects the mode Overflow flag Status flag indicating overflow Notes: The method for writing to TCSR is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. * Only 0 can be written, to clear the flag. Bits 7 to 5 are initialized to 0 by a reset and in standby mode. Bits 2 to 0 are initialized to 0 by a reset. In software standby mode bits 2 to 0 are not initialized, but retain their previous values. Rev. 2.00 Sep 20, 2005 page 340 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Bit 7—Overflow Flag (OVF): This status flag indicates that the timer counter has overflowed from H'FF to H'00. Bit 7 OVF Description 0 [Clearing condition] Cleared by reading OVF when OVF = 1, then writing 0 in OVF 1 (Initial value) [Setting condition] Set when TCNT changes from H'FF to H'00 Bit 6—Timer Mode Select (WT/IT): Selects whether to use the WDT as a watchdog timer or interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request when TCNT overflows. If used as a watchdog timer, the WDT generates a reset signal when TCNT overflows. Bit 6 WT/IT Description 0 Interval timer: requests interval timer interrupts 1 Watchdog timer: generates a reset signal (Initial value) Bit 5—Timer Enable (TME): Selects whether TCNT runs or is halted. When WT/IT = 1, clear the software standby bit (SSBY) to 0 in SYSCR before setting TME. When setting SSBY to 1, TME should be cleared to 0. Bit 5 TME Description 0 TCNT is initialized to H'00 and halted 1 TCNT is counting (Initial value) Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 341 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock sources, obtained by prescaling the system clock (φ), for input to TCNT. Bit 2 CKS2 Bit 1 CKS1 0 0 1 1 0 1 11.2.3 Bit 0 CKS0 Description 0 φ/2 1 φ /32 0 φ /64 1 φ /128 0 φ /256 1 φ /512 0 φ /2048 1 φ /4096 (Initial value) Reset Control/Status Register (RSTCSR) RSTCSR is an 8-bit readable and writable register that indicates when a reset signal has been generated by watchdog timer overflow, and controls external output of the reset signal. Bit 7 6 5 4 3 2 1 0 WRST RSTOE — — — — — — Initial value 0 0 1 1 1 1 1 1 Read/Write R/(W)* R/W — — — — — — Reserved bits Reset output enable Enables or disables external output of the reset signal Watchdog timer reset Indicates that a reset signal has been generated Notes: The method for writing to RSTCSR is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. * Only 0 can be written in bit 7, to clear the flag. Bits 7 and 6 are initialized by input of a reset signal at the RES pin. They are not initialized by reset signals generated by watchdog timer overflow. Rev. 2.00 Sep 20, 2005 page 342 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Bit 7—Watchdog Timer Reset (WRST): During watchdog timer operation, this bit indicates that TCNT has overflowed and generated a reset signal. This reset signal resets the entire H8/3024 chip internally. If bit RSTOE is set to 1, this reset signal is also output (low) at the RESO pin to initialize external system devices. Note that there is no RESO pin in the versions with on-chip flash memory. Bit 7 WRST Description 0 [Clearing conditions] 1 • Reset signal at RES pin. • Read WRST when WRST =1, then write 0 in WRST. (Initial value) [Setting condition] Set when TCNT overflow generates a reset signal during watchdog timer operation Bit 6—Reset Output Enable (RSTOE): Enables or disables external output at the RESO pin of the reset signal generated if TCNT overflows during watchdog timer operation. Note that there is no RESO pin in the versions with on-chip flash memory. Bit 6 RSTOE Description 0 Reset signal is not output externally 1 Reset signal is output externally (Initial value) Bits 5 to 0—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 343 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.2.4 Notes on Register Access The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being more difficult to write. The procedures for writing and reading these registers are given below. Writing to TCNT and TCSR: These registers must be written by a word transfer instruction. They cannot be written by byte instructions. Figure 11.2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the same write address. The write data must be contained in the lower byte of the written word. The upper byte must contain H'5A (password for TCNT) or H'A5 (password for TCSR). This transfers the write data from the lower byte to TCNT or TCSR. 15 TCNT write Address H'FFF8C* H'5A 15 TCSR write Address 8 7 H'FFF8C* 0 Write data 8 7 H'A5 0 Write data Note: * Lower 20 bits of the address in advanced mode. Figure 11.2 Format of Data Written to TCNT and TCSR Rev. 2.00 Sep 20, 2005 page 344 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Writing to RSTCSR: RSTCSR must be written by a word transfer instruction. It cannot be written by byte transfer instructions. Figure 11.3 shows the format of data written to RSTCSR. To write 0 in the WRST bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. The data (H'00) in the lower byte is written to RSTCSR, clearing the WRST bit to 0. To write to the RSTOE bit, the upper byte must contain H'5A and the lower byte must contain the write data. Writing this word transfers a write data value into the RSTOE bit. Writing 0 in WRST bit Address H'FFF8E* Writing to RSTOE bit Address 15 H'FFF8E* 8 7 H'A5 0 H'00 15 8 7 H'5A 0 Write data Note: * Lower 20 bits of the address in advanced mode. Figure 11.3 Format of Data Written to RSTCSR Reading TCNT, TCSR, and RSTCSR: For reads of TCNT, TCSR, and RSTCSR, address H'FFF8C is assigned to TCSR, address H'FFF8D to TCNT, and address H'FFF8F to RSTCSR. These registers are therefore read like other registers. Byte transfer instructions can be used for reading. Table 11.3 lists the read addresses of TCNT, TCSR, and RSTCSR. Table 11.3 Read Addresses of TCNT, TCSR, and RSTCSR Address* Register H'FFF8C TCSR H'FFF8D TCNT H'FFF8F RSTCSR Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 345 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.3 Operation Operations when the WDT is used as a watchdog timer and as an interval timer are described below. 11.3.1 Watchdog Timer Operation Figure 11.4 illustrates watchdog timer operation. To use the WDT as a watchdog timer, set the WT/IT and TME bits to 1 in TCSR. Software must prevent TCNT overflow by rewriting the TCNT value (normally by writing H'00) before overflow occurs. If TCNT fails to be rewritten and overflows due to a system crash etc., the H8/3024 is internally reset for a duration of 518 states. The watchdog reset signal can be externally output from the RESO pin to reset external system devices. The reset signal is output externally for 132 states. External output can be enabled or disabled by the RSTOE bit in RSTCSR. Note that there is no RESO pin in the versions with onchip flash memory. A watchdog reset has the same vector as a reset generated by input at the RES pin. Software can distinguish a RES reset from a watchdog reset by checking the WRST bit in RSTCSR. If a RES reset and a watchdog reset occur simultaneously, the RES reset takes priority. WDT overflow H'FF TME set to 1 TCNT count value H'00 OVF = 1 Start Internal reset signal H'00 written in TCNT Reset 518 states RESO 132 states Figure 11.4 Operation in Watchdog Timer Mode Rev. 2.00 Sep 20, 2005 page 346 of 800 REJ09B0260-0200 H'00 written in TCNT Section 11 Watchdog Timer 11.3.2 Interval Timer Operation Figure 11.5 illustrates interval timer operation. To use the WDT as an interval timer, clear bit WT/IT to 0 and set bit TME to 1 in TCSR. An interval timer interrupt request is generated at each TCNT overflow. This function can be used to generate interval timer interrupts at regular intervals. H'FF TCNT count value Time t H'00 WT/ IT = 0 TME = 1 Interval timer interrupt Interval timer interrupt Interval timer interrupt Interval timer interrupt Figure 11.5 Interval Timer Operation 11.3.3 Timing of Setting of Overflow Flag (OVF) Figure 11.6 shows the timing of setting of the OVF flag. The OVF flag is set to 1 when TCNT overflows. At the same time, a reset signal is generated in watchdog timer operation, or an interval timer interrupt is generated in interval timer operation. φ TCNT H'FF H'00 Overflow signal OVF Figure 11.6 Timing of Setting of OVF Rev. 2.00 Sep 20, 2005 page 347 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) The WRST bit in RSTCSR is valid when bits WT/IT and TME are both set to 1 in TCSR. Figure 11.7 shows the timing of setting of WRST and the internal reset timing. The WRST bit is set to 1 when TCNT overflows and OVF is set to 1. At the same time an internal reset signal is generated for the entire H8/3024 chip. This internal reset signal clears OVF to 0, but the WRST bit remains set to 1. The reset routine must therefore clear the WRST bit. φ H'FF TCNT H'00 Overflow signal OVF WDT internal reset WRST Figure 11.7 Timing of Setting of WRST Bit and Internal Reset Rev. 2.00 Sep 20, 2005 page 348 of 800 REJ09B0260-0200 Section 11 Watchdog Timer 11.4 Interrupts During interval timer operation, an overflow generates an interval timer interrupt (WOVI). The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. 11.5 Usage Notes Contention between TCNT Write and Increment: If a timer counter clock pulse is generated during the T3 state of a write cycle to TCNT, the write takes priority and the timer count is not incremented. See figure 11.8. CPU: TCNT write cycle T1 T2 T3 φ TCNT Internal write signal TCNT input clock TCNT N M Counter write data Figure 11.8 Contention between TCNT Write and Count up Changing CKS2 to CKS0 Bit: Halt TCNT by clearing the TME bit to 0 in TCSR before changing the values of bits CKS2 to CKS0. Rev. 2.00 Sep 20, 2005 page 349 of 800 REJ09B0260-0200 Section 11 Watchdog Timer Rev. 2.00 Sep 20, 2005 page 350 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Section 12 Serial Communication Interface 12.1 Overview The H8/3024 Group has a serial communication interface (SCI) with two independent channels. The two channels have identical functions. The SCI can communicate in both asynchronous and synchronous mode. It also has a multiprocessor communication function for serial communication among two or more processors. When the SCI is not used, it can be halted to conserve power. Each SCI channel can be halted independently. For details, see section 20.6, Module Standby Function. The SCI also has a smart card interface function conforming to the ISO/IEC 7816-3 (Identification Card) standard. This function supports serial communication with a smart card. Switching between the normal serial communication interface and the smart card interface is carried out by means of a register setting. 12.1.1 Features SCI features are listed below. • Selection of synchronous or asynchronous mode for serial communication Asynchronous mode Serial data communication is synchronized one character at a time. The SCI can communicate with a universal asynchronous receiver/transmitter (UART), asynchronous communication interface adapter (ACIA), or other chip that employs standard asynchronous communication. It can also communicate with two or more other processors using the multiprocessor communication function. There are twelve selectable serial data transfer formats. Data length: 7 or 8 bits Stop bit length: 1 or 2 bits Parity: even/odd/none Multiprocessor bit: 1 or 0 Receive error detection: parity, overrun, and framing errors Break detection: by reading the RxD level directly when a framing error occurs Synchronous mode Serial data communication is synchronized with a clock signal. The SCI can communicate with other chips having a synchronous communication function. Rev. 2.00 Sep 20, 2005 page 351 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • • • • • There is a single serial data communication format. Data length: 8 bits Receive error detection: overrun errors Full-duplex communication The transmitting and receiving sections are independent, so the SCI can transmit and receive simultaneously. The transmitting and receiving sections are both double-buffered, so serial data can be transmitted and received continuously. The following settings can be made for the serial data to be transferred: LSB-first or MSB-first transfer Inversion of data logic level Built-in baud rate generator with selectable bit rates Selectable transmit/receive clock sources: internal clock from baud rate generator, or external clock from the SCK pin Four types of interrupts Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are requested independently. Features of the smart card interface are listed below. • Asynchronous communication Data length: 8 bits Parity bits generated and checked Error signal output in receive mode (parity error) Error signal detect and automatic data retransmit in transmit mode Supports both direct convention and inverse convention • Built-in baud rate generator with selectable bit rates • Three types of interrupts Transmit-data-empty, receive-data-full, and transmit/receive-error interrupts are requested independently. Rev. 2.00 Sep 20, 2005 page 352 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.1.2 Block Diagram Bus interface Figure 12.1 shows a block diagram of the SCI. Module data bus RDR TDR SSR BRR SCR RxD TxD RSR TSR φ SMR Baud rate generator SCMR Transmit/receive control Parity generate Parity check SCK Internal data bus φ/4 φ/16 φ/64 Clock External clock TEI TXI RXI ERI Legend: RSR: Receive shift register RDR: Receive data register TSR: Transmit shift register TDR: Transmit data register SMR: Serial mode register SCR: Serial control register SSR: Serial status register BRR: Bit rate register SCMR: Smart card mode register Figure 12.1 SCI Block Diagram Rev. 2.00 Sep 20, 2005 page 353 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.1.3 Pin Configuration The SCI has serial pins for each channel as listed in table 12.1. Table 12.1 SCI Pins Channel Name Abbreviation I/O Function 0 Serial clock pin SCK0 Input/output SCI0 clock input/output Receive data pin RxD0 Input SCI0 receive data input Transmit data pin TxD0 Output SCI0 transmit data output 1 Serial clock pin SCK1 Input/output SCI1 clock input/output Receive data pin RxD1 Input SCI1 receive data input Transmit data pin TxD1 Output SCI1 transmit data output Rev. 2.00 Sep 20, 2005 page 354 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.1.4 Register Configuration The SCI has internal registers as listed in table 12.2. These registers select asynchronous or synchronous mode, specify the data format and bit rate, control the transmitter and receiver sections, and specify switching between the serial communication interface and smart card interface. Table 12.2 SCI Registers Channel Address*1 Name Abbreviation R/W Initial Value 0 H'FFFB0 Serial mode register SMR R/W H'00 H'FFFB1 Bit rate register BRR R/W H'FF H'FFFB2 Serial control register SCR R/W H'00 H'FFFB3 Transmit data register TDR R/W 1 H'FF *2 H'FFFB4 Serial status register SSR R/(W) H'84 H'FFFB5 Receive data register RDR R H'00 H'FFFB6 Smart card mode register SCMR R/W H'F2 H'FFFB8 Serial mode register SMR R/W H'00 H'FFFB9 Bit rate register BRR R/W H'FF H'FFFBA Serial control register SCR R/W H'00 H'FFFBB Transmit data register TDR R/W H'FF SSR R/(W)*2 H'84 H'FFFBC Serial status register H'FFFBD Receive data register RDR R H'00 H'FFFBE Smart card mode register SCMR R/W H'F2 Notes: 1. Indicates the lower 20 bits of the address in advanced mode. 2. Only 0 can be written, to clear flags. Rev. 2.00 Sep 20, 2005 page 355 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.2 Register Descriptions 12.2.1 Receive Shift Register (RSR) RSR is the register that receives serial data. Bit 7 6 5 4 3 2 1 0 Read/Write — — — — — — — — The SCI loads serial data input at the RxD pin into RSR in the order received, LSB (bit 0) first, thereby converting the data to parallel data. When one byte of data has been received, it is automatically transferred to RDR. The CPU cannot read or write RSR directly. 12.2.2 Receive Data Register (RDR) RDR is the register that stores received serial data. Bit 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R R R R R R R R When the SCI has received one byte of serial data, it transfers the received data from RSR into RDR for storage, completing the receive operation. RSR is then ready to receive the next data. This double-buffering allows data to be received continuously. RDR is a read-only register. Its contents cannot be modified by the CPU. RDR is initialized to H'00 by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 356 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.2.3 Transmit Shift Register (TSR) TSR is the register that transmits serial data. Bit 7 6 5 4 3 2 1 0 Read/Write — — — — — — — — The SCI loads transmit data from TDR to TSR, then transmits the data serially from the TxD pin, LSB (bit 0) first. After transmitting one data byte, the SCI automatically loads the next transmit data from TDR into TSR and starts transmitting it. If the TDRE flag is set to 1 in SSR, however, the SCI does not load the TDR contents into TSR. The CPU cannot read or write RSR directly. 12.2.4 Transmit Data Register (TDR) TDR is an 8-bit register that stores data for serial transmission. Bit 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W When the SCI detects that TSR is empty, it moves transmit data written in TDR from TDR into TSR and starts serial transmission. Continuous serial transmission is possible by writing the next transmit data in TDR during serial transmission from TSR. The CPU can always read and write TDR. TDR is initialized to H'FF by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 357 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.2.5 Serial Mode Register (SMR) SMR is an 8-bit register that specifies the SCI's serial communication format and selects the clock source for the baud rate generator. 7 6 5 4 3 2 1 0 C/A CHR PE O/E STOP MP CKS1 CKS0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Bit Clock select 1/0 These bits select the baud rate generator's clock source Multiprocessor mode Selects the multiprocessor function Stop bit length Selects the stop bit length Parity mode Selects even or odd parity Parity enable Selects whether a parity bit is added Character length Selects character length in asynchronous mode Communication mode Selects asynchronous or synchronous mode The CPU can always read and write SMR. SMR is initialized to H'00 by a reset and in standby mode. Bit 7—Communication Mode (C/A)/GSM Mode (GM): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. Rev. 2.00 Sep 20, 2005 page 358 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • For Serial Communication Interface (SMIF Bit in SCMR Cleared to 0) Selects whether the SCI operates in asynchronous or synchronous mode. Bit 7 C/A Description 0 Asynchronous mode 1 Synchronous mode (Initial value) • For Smart Card Interface (SMIF Bit in SCMR Set to 1) Selects GSM mode for the smart card interface. Bit 7 GM Description 0 The TEND flag is set 12.5 etu after the start bit 1 The TEND flag is set 11.0 etu after the start bit (Initial value) Note: etu: Elementary time unit (time required to transmit one bit) Bit 6—Character Length (CHR): Selects 7-bit or 8-bits data length in asynchronous mode. In synchronous mode, the data length is 8 bits regardless of the CHR setting. Bit 6 CHR Description 0 8-bit data 1 7-bit data* (Initial value) Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Bit 5—Parity Enable (PE): In asynchronous mode, this bit enables or disables the addition of a parity bit to transmit data, and the checking of the parity bit in receive data. In synchronous mode, the parity bit is neither added nor checked, regardless of the PE bit setting. Bit 5 PE 0 1 Description Parity bit not added or checked Parity bit added and checked* (Initial value) Note: * When PE bit is set to 1, an even or odd parity bit is added to transmit data according to the even or odd parity mode selection by the O/E bit, and the parity bit in receive data is checked to see that it matches the even or odd mode selected by the O/E bit. Rev. 2.00 Sep 20, 2005 page 359 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 4—Parity Mode (O/E): Specifies whether even parity or odd parity is used for parity addition and checking. The O/E bit setting is only valid when the PE bit is set to 1, enabling parity bit addition and checking, in asynchronous mode. The O/E bit setting is ignored in synchronous mode, or when parity addition and checking is disabled in asynchronous mode. Bit 4 O/E 0 1 Description 1 Even parity* Odd parity*2 (Initial value) Notes: 1. When even parity is selected, the parity bit added to transmit data makes an even number of 1s in the transmitted character and parity bit combined. Receive data must have an even number of 1s in the received character and parity bit combined. 2. When odd parity is selected, the parity bit added to transmit data makes an odd number of 1s in the transmitted character and parity bit combined. Receive data must have an odd number of 1s in the received character and parity bit combined. Bit 3—Stop Bit Length (STOP): Selects one or two stop bits in asynchronous mode. This setting is used only in asynchronous mode. In synchronous mod no stop bit is added, so the STOP bit setting is ignored. Bit 3 STOP 0 1 Description 1 stop bit*1 2 stop bits*2 (Initial value) Notes: 1. One stop bit (with value 1) is added to the end of each transmitted character. 2. Two stop bits (with value 1) are added to the end of each transmitted character. In receiving, only the first stop bit is checked, regardless of the STOP bit setting. If the second stop bit is 1, it is treated as a stop bit. If the second stop bit is 0, it is treated as the start bit of the next incoming character. Rev. 2.00 Sep 20, 2005 page 360 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 2—Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor format is selected, parity settings made by the PE and O/E bits are ignored. The MP bit setting is valid only in asynchronous mode. It is ignored in synchronous mode. For further information on the multiprocessor communication function, see section 12.3.3, Multiprocessor Communication. Bit 2 MP Description 0 Multiprocessor function disabled 1 Multiprocessor format selected (Initial value) Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the onchip baud rate generator. Four clock sources can be selected by the CKS1 and CKS0 bits: φ, φ/4, φ/16, and φ/64. For the relationship between the clock source, bit rate register setting, and baud rate, see section 12.2.8, Bit Rate Register (BRR). Bit 1 CKS1 Bit 0 CKS0 Description 0 0 φ 0 1 φ/4 1 0 φ/16 1 1 φ/64 12.2.6 (Initial value) Serial Control Register (SCR) SCR register enables or disables the SCI transmitter and receiver, enables or disables serial clock output in asynchronous mode, enables or disables interrupts, and selects the transmit/receive clock source. Rev. 2.00 Sep 20, 2005 page 361 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Bit Clock enable 1/0 These bits select the SCI clock source Transmit-end interrupt enable Enables or disables transmit-end interrupts (TEI) Multiprocessor interrupt enable Enables or disables multiprocessor interrupts Receive enable Enables or disables the receiver Transmit enable Enables or disables the transmitter Receive interrupt enable Enables or disables receive-data-full interrupts (RxI) and receive-error interrupts (ERI) Transmit interrupt enable Enables or disables transmit-data-empty interrupts (TxI) The CPU can always read and write SCR. SCR is initialized to H'00 by a reset and in standby mode. Bit 7—Transmit Interrupt Enable (TIE): Enables or disables the transmit-data-empty interrupt (TXI) requested when the TDRE flag in SSR is set to 1 due to transfer of serial transmit data from TDR to TSR. Bit 7 TIE Description 0 Transmit-data-empty interrupt request (TXI) is disabled* 1 Transmit-data-empty interrupt request (TXI) is enabled (Initial value) Note: * TXI interrupt requests can be cleared by reading the value 1 from the TDRE flag, then clearing it to 0; or by clearing the TIE bit to 0. Rev. 2.00 Sep 20, 2005 page 362 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 6—Receive Interrupt Enable (RIE): Enables or disables the receive-data-full interrupt (RXI) requested when the RDRF flag in SSR is set to 1 due to transfer of serial receive data from RSR to RDR; also enables or disables the receive-error interrupt (ERI). Bit 6 RIE Description 0 Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled* (Initial value) 1 Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled Note: * RXI and ERI interrupt requests can be cleared by reading the value 1 from the RDRF, FER, PER, or ORER flag, then clearing the flag to 0; or by clearing the RIE bit to 0. Bit 5—Transmit Enable (TE): Enables or disables the start of SCI serial transmitting operations. Bit 5 TE 0 1 Description Transmitting disabled*1 Transmitting enabled*2 (Initial value) Notes: 1. The TDRE flag is fixed at 1 in SSR. 2. In the enabled state, serial transmission starts when the TDRE flag in SSR is cleared to 0 after writing of transmit data into TDR. Select the transmit format in SMR before setting the TE bit to 1. Bit 4—Receive Enable (RE): Enables or disables the start of SCI serial receiving operations. Bit 4 RE 0 1 Description Receiving disabled*1 Receiving enabled*2 (Initial value) Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags. These flags retain their previous values. 2. In the enabled state, serial receiving starts when a start bit is detected in asynchronous mode, or serial clock input is detected in synchronous mode. Select the receive format in SMR before setting the RE bit to 1. Rev. 2.00 Sep 20, 2005 page 363 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts. The MPIE bit setting is valid only in asynchronous mode, and only if the MP bit is set to 1 in SMR. The MPIE bit setting is ignored in synchronous mode or when the MP bit is cleared to 0. Bit 3 MPIE Description 0 Multiprocessor interrupts are disabled (normal receive operation) (Initial value) [Clearing conditions] 1 • The MPIE bit is cleared to 0 • MPB = 1 in received data Multiprocessor interrupts are enabled* Receive-data-full interrupts (RXI), receive-error interrupts (ERI), and setting of the RDRF, FER, and ORER status flags in SSR are disabled until data with the multiprocessor bit set to 1 is received. Note: * The SCI does not transfer receive data from RSR to RDR, does not detect receive errors, and does not set the RDRF, FER, and ORER flags in SSR. When it receives data in which MPB = 1, the SCI sets the MPB bit to 1 in SSR, automatically clears the MPIE bit to 0, enables RXI and ERI interrupts (if the TIE and RIE bits in SCR are set to 1), and allows the FER and ORER flags to be set. Bit 2—Transmit-End interrupt Enable (TEIE): Enables or disables the transmit-end interrupt (TEI) requested if TDR does not contain valid transmit data when the MSB is transmitted. Bit 2 TEIE 0 1 Description Transmit-end interrupt requests (TEI) are disabled* Transmit-end interrupt requests (TEI) are enabled* (Initial value) Note: * TEI interrupt requests can be cleared by reading the value 1 from the TDRE flag in SSR, then clearing the TDRE flag to 0, thereby also clearing the TEND flag to 0; or by clearing the TEIE bit to 0. Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): The function of these bits differs for the normal serial communication interface and for the smart card interface. Their function is switched with the SMIF bit in SCMR. Rev. 2.00 Sep 20, 2005 page 364 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • For serial communication interface (SMIF bit in SCMR cleared to 0) These bits select the SCI clock source and enable or disable clock output from the SCK pin. Depending on the settings of CKE1 and CKE0, the SCK pin can be used for generic input/output, serial clock output, or serial clock input. The CKE0 setting is valid only in asynchronous mode, and only when the SCI is internally clocked (CKE1 = 0). The CKE0 setting is ignored in synchronous mode, or when an external clock source is selected (CKE1 = 1). Select the SCI operating mode in SMR before setting the CKE1 and CKE0 bits . For further details on selection of the SCI clock source, see table 12.9 in section 12.3, Operation. Bit 1 CKE1 Bit 0 CKE0 Description 0 0 Asynchronous mode Internal clock, SCK pin available for generic input/output*1 Synchronous mode Internal clock, SCK pin used for serial clock output*1 Internal clock, SCK pin used for clock output*2 0 1 Asynchronous mode 1 0 Asynchronous mode Synchronous mode Synchronous mode 1 1 Internal clock, SCK pin used for serial clock output External clock, SCK pin used for clock input*3 Asynchronous mode External clock, SCK pin used for serial clock input External clock, SCK pin used for clock input*3 Synchronous mode External clock, SCK pin used for serial clock input Notes: 1. Initial value 2. The output clock frequency is the same as the bit rate. 3. The input clock frequency is 16 times the bit rate. • For smart card interface (SMIF bit in SCMR set to 1) These bits, together with the GM bit in SMR, determine whether the SCK pin is used for generic input/output or as the serial clock output pin. SMR GM Bit 1 CKE1 Bit 0 CKE0 Description 0 0 0 SCK pin available for generic input/output 0 0 1 SCK pin used for clock output 1 0 0 SCK pin output fixed low 1 0 1 SCK pin used for clock output 1 1 0 SCK pin output fixed high 1 1 1 SCK pin used for clock output (Initial value) Rev. 2.00 Sep 20, 2005 page 365 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.2.7 Serial Status Register (SSR) SSR is an 8-bit register containing multiprocessor bit values, and status flags that indicate the operating status of the SCI. Bit Initial value Read/Write 5 7 6 TDRE RDRF 1 0 4 ORER FER/ERS 0 0 R/(W)*1 R/(W)*1 R/(W)*1 R/(W)*1 3 2 1 0 PER TEND MPB MPBT 0 1 0 0 R R R/W R/(W)*1 Multiprocessor bit transfer Value of multiprocessor bit to be transmitted Multiprocessor bit Stores the received multiprocessor bit value Transmit end*2 Status flag indicating end of transmission Parity error Status flag indicating detection of a receive parity error Framing error (FER)/Error signal status (ERS)*2 Status flag indicating detection of a receive framing error, or flag indicating detection of an error signal Overrun error Status flag indicating detection of a receive overrun error Receive data register full Status flag indicating that data has been received and stored in RDR Transmit data register empty Status flag indicating that transmit data has been transferred from TDR into TSR and new data can be written in TDR Notes: 1. Only 0 can be written, to clear the flag. 2. Function differs between the normal serial communication interface and the smart card interface. The CPU can always read and write SSR, but cannot write 1 in the TDRE, RDRF, ORER, PER, and FER flags. These flags can be cleared to 0 only if they have first been read while set to 1. The TEND and MPB flags are read-only bits that cannot be written. SSR is initialized to H'84 by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 366 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 7—Transmit Data Register Empty (TDRE): Indicates that the SCI has loaded transmit data from TDR into TSR and the next serial data can be written in TDR. Bit 7 TDRE Description 0 TDR contains valid transmit data [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE 1 TDR does not contain valid transmit data (Initial value) [Setting conditions] • The chip is reset or enters standby mode • The TE bit in SCR is cleared to 0 • TDR contents are loaded into TSR, so new data can be written in TDR Bit 6—Receive Data Register Full (RDRF): Indicates that RDR contains new receive data. Bit 6 RDRF Description 0 RDR does not contain new receive data (Initial value) [Clearing conditions] 1 • The chip is reset or enters standby mode • Read RDRF when RDRF = 1, then write 0 in RDRF RDR contains new receive data [Setting condition] Serial data is received normally and transferred from RSR to RDR Note: The RDR contents and the RDRF flag are not affected by detection of receive errors or by clearing of the RE bit to 0 in SCR. They retain their previous values. If the RDRF flag is still set to 1 when reception of the next data ends, an overrun error will occur and the receive data will be lost. Rev. 2.00 Sep 20, 2005 page 367 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 5—Overrun Error (ORER): Indicates that data reception ended abnormally due to an overrun error. Bit 5 ORER Description 0 Receiving is in progress or has ended normally* 1 (Initial value) [Clearing conditions] • The chip is reset or enters standby mode • 1 Read ORER when ORER = 1, then write 0 in ORER A receive overrun error occurred*2 [Setting condition] Reception of the next serial data ends when RDRF = 1 Notes: 1. Clearing the RE bit to 0 in SCR does not affect the ORER flag, which retains its previous value. 2. RDR continues to hold the receive data prior to the overrun error, so subsequent receive data is lost. Serial receiving cannot continue while the ORER flag is set to 1. In synchronous mode, serial transmitting is also disabled. Bit 4—Framing Error (FER)/Error Signal Status (ERS): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. Rev. 2.00 Sep 20, 2005 page 368 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • For serial communication interface (SMIF bit in SCMR cleared to 0) Indicates that data reception ended abnormally due to a framing error in asynchronous mode. Bit 4 FER Description 0 Receiving is in progress or has ended normally*1 (Initial value) [Clearing conditions] 1 • The chip is reset or enters standby mode • Read FER when FER = 1, then write 0 in FER A receive framing error occurred [Setting condition] The stop bit at the end of the receive data is checked for a value of 1, and is found to be 0.*2 Notes: 1. Clearing the RE bit to 0 in SCR does not affect the FER flag, which retains its previous value. 2. When the stop bit length is 2 bits, only the first bit is checked for a value of 1. The second stop bit is not checked. When a framing error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the FER flag is set to 1. In synchronous mode, serial transmitting is also disabled. • For Smart Card Interface (SMIF Bit in SCMR Set to 1) Indicates the status of the error signal sent back from the receiving side during transmission. Framing errors are not detected in smart card interface mode. Bit 4 ERS Description 0 Normal reception, no error signal* (Initial value) [Clearing conditions] 1 • The chip is reset or enters standby mode • Read ERS when ERS = 1, then write 0 in ERS An error signal has been sent from the receiving side indicating detection of a parity error [Setting condition] The error signal is low when sampled Note: * Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous value. Rev. 2.00 Sep 20, 2005 page 369 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 3—Parity Error (PER): Indicates that reception of data with parity added ended abnormally due to a parity error in asynchronous mode. Bit 3 PER Description 0 Receiving is in progress or has ended normally*1 (Initial value) [Clearing conditions] The chip is reset or enters standby mode • 1 Read PER when PER = 1, then write 0 in PER A receive parity error occurred*2 [Setting condition] The number of 1s in receive data, including the parity bit, does not match the even or odd parity setting of O/E in SMR Notes: 1. Clearing the RE bit to 0 in SCR does not affect the PER flag, which retains its previous value. 2. When a parity error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the PER flag is set to 1. In synchronous mode, serial transmitting is also disabled. Bit 2—Transmit End (TEND): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. • For Serial Communication Interface (SMIF Bit in SCMR Cleared to 0) Indicates that when the last bit of a serial character was transmitted TDR did not contain valid transmit data, so transmission has ended. The TEND flag is a read-only bit and cannot be written. Bit 2 TEND Description 0 Transmission is in progress [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE 1 End of transmission (Initial value) [Setting conditions] • The chip is reset or enters standby mode • The TE bit in SCR is cleared to 0 • TDRE is 1 when the last bit of a 1-byte serial transmit character is transmitted Rev. 2.00 Sep 20, 2005 page 370 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • For Smart Card Interface (SMIF Bit in SCMR Set to 1) Indicates that when the last bit of a serial character was transmitted TDR did not contain valid transmit data, so transmission has ended. The TEND flag is a read-only bit and cannot be written. Bit 2 TEND 0 Description Transmission is in progress [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE 1 End of transmission (Initial value) [Setting conditions] • The chip is reset or enters standby mode • The TE bit is cleared to 0 in SCR and the FER/ERS bit is also cleared to 0 • TDRE is 1 and FER/ERS is 0 (normal transmission) 2.5 etu (when GM = 0) or 1.0 etu (when GM = 1) after a 1-byte serial character is transmitted Note: etu: Elementary time unit (time required to transmit one bit) Bit 1—Multiprocessor bit (MPB): Stores the value of the multiprocessor bit in the receive data when a multiprocessor format is used in asynchronous mode. MPB is a read-only bit, and cannot be written. Bit 1 MPB Description 0 Multiprocessor bit value in receive data is 0* 1 Multiprocessor bit value in receive data is 1 (Initial value) Note: * If the RE bit in SCR is cleared to 0 when a multiprocessor format is selected, MPB retains its previous value. Bit 0—Multiprocessor Bit Transfer (MPBT): Stores the value of the multiprocessor bit added to transmit data when a multiprocessor format in selected for transmitting in asynchronous mode. The MPBT bit setting is ignored in synchronous mode, when a multiprocessor format is not selected, or when the SCI cannot transmit. Rev. 2.00 Sep 20, 2005 page 371 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Bit 0 MPBT Description 0 Multiprocessor bit value in transmit data is 0 1 Multiprocessor bit value in transmit data is 1 12.2.8 (Initial value) Bit Rate Register (BRR) BRR is an 8-bit register that sets the serial transmit/receive bit rate in accordance with the baud rate generator operating clock selected by bits CKS0 and CKS1 in SMR. Bit 7 6 5 4 3 2 1 0 Initial value 1 1 1 1 1 1 1 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W BRR can be read or written to by the CPU at all times. BRR is initialized to H'FF by a reset and in standby mode. As baud rate generator control is performed independently for each channel, different values can be set for each channel. Table 12.3 shows examples of BRR settings in asynchronous mode. Table 12.4 shows examples of BRR settings in synchronous mode. Rev. 2.00 Sep 20, 2005 page 372 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode φ (MHz) 2 2.097152 2.4576 3 Bit Rate (bit/s) n N 110 1 141 0.03 1 148 -0.04 1 174 -0.26 1 212 0.03 150 1 103 0.16 1 108 0.21 1 127 0.00 1 155 0.16 300 0 207 0.16 0 217 0.21 0 255 0.00 1 77 600 0 103 0.16 0 108 0.21 0 127 0.00 0 155 0.16 1200 0 51 0.16 0 54 -0.70 0 63 0.00 0 77 0.16 2400 0 25 0.16 0 26 1.14 0 31 0.00 0 38 0.16 4800 0 12 0.16 0 13 -2.48 0 15 0.00 0 19 -2.34 9600 0 6 -6.99 0 6 -2.48 0 7 0.00 0 9 -2.34 Error (%) n N Error (%) n N Error (%) n N Error (%) 0.16 19200 0 2 8.51 0 2 13.78 0 3 0.00 0 4 -2.34 31250 0 1 0.00 0 1 4.86 0 1 22.88 0 2 0.00 38400 0 1 -18.62 0 1 -14.67 0 1 0.00 — — — φ (MHz) 3.6864 4 Bit Rate (bit/s) n N Error (%) n 110 2 64 0.70 150 1 191 0.00 300 1 95 0.00 600 0 1200 2400 4.9152 N Error (%) n 2 70 0.03 1 207 0.16 1 103 0.16 191 0.00 0 0 95 0.00 0 47 0.00 5 N Error (%) n 2 86 0.31 2 88 -0.25 1 255 0.00 2 64 0.16 1 127 0.00 1 129 0.16 207 0.16 0 255 0.00 1 64 0 103 0.16 0 127 0.00 0 129 0.16 0 51 0 63 0 64 0.16 0.00 N Error (%) 0.16 0.16 4800 0 23 0.00 0 25 0.16 0 31 0.00 0 32 -1.36 9600 0 11 0.00 0 12 0.16 0 15 0.00 0 15 1.73 19200 0 5 0.00 0 6 -6.99 0 7 0.00 0 7 1.73 31250 — — — 0 3 0.00 0 4 -1.70 0 4 0.00 38400 0 2 0.00 0 2 8.51 0 3 0.00 0 3 1.73 Rev. 2.00 Sep 20, 2005 page 373 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface φ (MHz) 6 6.144 7.3728 8 Bit Rate (bit/s) n N 110 2 106 -0.44 150 2 77 0.16 2 79 0.00 2 95 0.00 2 103 0.16 300 1 155 0.16 1 159 0.00 1 191 0.00 1 207 0.16 600 1 77 0.16 1 79 0.00 1 95 0.00 1 103 0.16 1200 0 155 0.16 0 159 0.00 0 191 0.00 0 207 0.16 2400 0 77 0.16 0 79 0.00 0 95 0.00 0 103 0.16 4800 0 38 0.16 0 39 0.00 0 47 0.00 0 51 0.16 9600 0 19 -2.34 0 19 0.00 0 23 0.00 0 25 0.16 19200 0 9 -2.34 0 9 0.00 0 11 0.00 0 12 0.16 31250 0 5 0.00 0 5 2.40 0 6 5.33 0 7 0.00 38400 0 4 -2.34 0 4 0.00 0 5 0.00 0 6 -6.99 Error (%) n 2 N Error (%) n 108 0.08 2 N Error (%) n 130 -0.07 2 N Error (%) 141 0.03 φ (MHz) 9.8304 10 12 12.288 Bit Rate (bit/s) n N 110 2 174 -0.26 2 177 -0.25 2 212 0.03 2 217 0.08 150 2 127 0.00 2 129 0.16 2 155 0.16 2 159 0.00 300 1 255 0.00 2 64 0.16 2 77 0.16 2 79 600 1 127 0.00 1 129 0.16 1 155 0.16 1 159 0.00 1200 0 255 0.00 1 64 0.16 1 77 0.16 1 79 2400 0 127 0.00 0 129 0.16 0 155 0.16 0 159 0.00 4800 0 63 0.00 0 64 0.16 0 77 0.16 0 79 0.00 9600 0 31 0.00 0 32 -1.36 0 38 0.16 0 39 0.00 19200 0 15 0.00 0 15 1.73 0 19 -2.34 0 19 0.00 31250 0 9 -1.70 0 9 0.00 0 11 0.00 0 11 2.40 38400 0 7 0.00 0 7 1.73 0 9 -2.34 0 9 0.00 Error (%) n N Rev. 2.00 Sep 20, 2005 page 374 of 800 REJ09B0260-0200 Error (%) n N Error (%) n N Error (%) 0.00 0.00 Section 12 Serial Communication Interface φ (MHz) 13 14 Bit Rate (bit/s) n N 110 230 -0.08 2 248 -0.17 2 Error (%) n N 14.7456 Error (%) n 16 N Error (%) n N Error (%) 3 64 0.70 3 70 0.03 150 2 168 0.16 2 181 0.16 2 191 0.00 2 207 0.16 300 2 84 2 90 0.16 2 95 0.00 2 103 0.16 600 1 168 0.16 1 181 0.16 1 191 0.00 1 207 0.16 1200 1 84 1 90 0.16 1 95 0.00 1 103 0.16 2400 0 168 0.16 0 181 0.16 0 191 0.00 0 207 0.16 4800 0 84 -0.43 0 90 0.16 0 95 0.00 0 103 0.16 9600 0 41 0.76 0 45 -0.93 0 47 0.00 0 51 0.16 19200 0 20 0.76 0 22 -0.93 0 23 0.00 0 25 0.16 31250 0 12 0.00 0 13 0.00 0 14 -1.70 0 15 0.00 38400 0 10 -3.82 0 10 3.57 0 11 0.00 0 12 0.16 -0.43 -0.43 φ (MHz) 18 20 25 Bit Rate (bit/s) n N Error (%) n N Error (%) n N 110 3 79 -0.12 3 88 -0.25 3 110 -0.02 150 2 233 0.16 3 64 0.16 3 80 300 2 116 0.16 2 129 0.16 2 162 0.15 600 1 233 0.16 2 64 0.16 2 80 1200 1 116 0.16 1 129 0.16 1 162 0.15 2400 0 233 0.16 1 64 0.16 1 80 4800 0 116 0.16 0 129 0.16 0 162 0.15 9600 0 58 -0.69 0 64 0.16 0 80 -0.47 19200 0 28 1.02 0 32 -1.36 0 40 -0.76 31250 0 17 0.00 0 19 0.00 0 24 0.00 38400 0 14 -2.34 0 15 1.73 0 19 1.73 Error (%) -0.47 -0.47 -0.47 Rev. 2.00 Sep 20, 2005 page 375 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.4 Examples of Bit Rates and BRR Settings in Synchronous Mode φ (MHz) Bit Rate (bit/s) n 2 4 8 10 13 16 18 20 25 N n N n N n N n N n N n N n N n N — — — — — — — — — — — — — — — — — — — — 110 3 70 250 2 124 2 249 3 124 — — 3 202 3 249 — — 500 1 249 2 124 2 249 — — 3 101 3 124 3 140 3 155 — — 1k 1 124 1 249 2 124 — — 2 202 2 249 3 69 77 97 2.5k 0 199 1 99 199 1 249 2 80 99 2 112 2 124 2 155 5k 0 99 0 199 1 99 1 124 1 162 1 199 1 224 1 249 2 77 10k 0 49 0 99 0 199 0 249 1 80 99 1 112 1 124 1 155 25k 0 19 0 39 0 79 0 99 0 129 0 159 0 179 0 199 0 249 50k 0 9 0 19 0 39 0 49 0 64 0 79 0 89 0 99 0 124 100k 0 4 0 9 0 19 0 24 — — 0 39 0 44 0 49 0 62 250k 0 1 0 3 0 7 0 9 0 12 0 15 0 17 0 19 0 24 0 0* 0 1 0 3 0 4 — — 0 7 0 8 0 9 — — 0 0* 0 1 — — — — 0 3 0 4 0 4 — — 2M 0 0* — — 0 1 — — — — — — — — 0 — 0* — 2.5M — — — — 0* — — — — — — — — — — — — 500k 1M 1 4M 2 1 0 Note: Settings with an error of 1% or less are recommended. Legend: Blank: No setting available —: Setting possible, but error occurs *: Continuous transmission/reception not possible Rev. 2.00 Sep 20, 2005 page 376 of 800 REJ09B0260-0200 3 3 Section 12 Serial Communication Interface The BRR setting is calculated as follows: Asynchronous mode: N= φ 64 × 22n–1 ×B × 106 – 1 Synchronous mode: N= B: N: φ: n: φ 8 × 22n–1 × B × 106 – 1 Bit rate (bit/s) BRR setting for baud rate generator (0 ≤ N ≤ 255) System clock frequency (MHz) Baud rate generator input clock (n = 0, 1, 2, 3) (For the clock sources and values of n, see the following table.) SMR Settings n Clock Source CKS1 CKS0 0 φ 0 0 1 φ/4 0 1 2 φ/16 1 0 3 φ/64 1 1 The bit rate error in asynchronous mode is calculated as follows: Error (%) = φ × 106 (N + 1) × B × 64 × 22n–1 – 1 × 100 Rev. 2.00 Sep 20, 2005 page 377 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.5 shows the maximum bit rates in asynchronous mode for various system clock frequencies. Tables 12.6 and 12.7 show the maximum bit rates with external clock input. Table 12.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode) Settings φ (MHz) Maximum Bit Rate (bit/s) n N 2 62500 0 0 2.097152 65536 0 0 2.4576 76800 0 0 3 93750 0 0 3.6864 115200 0 0 4 125000 0 0 4.9152 153600 0 0 5 156250 0 0 6 187500 0 0 6.144 192000 0 0 7.3728 230400 0 0 8 250000 0 0 9.8304 307200 0 0 10 312500 0 0 12 375000 0 0 12.288 384000 0 0 14 437500 0 0 14.7456 460800 0 0 16 500000 0 0 17.2032 537600 0 0 18 562500 0 0 20 625000 0 0 25 781250 0 0 Rev. 2.00 Sep 20, 2005 page 378 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode) φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bit/s) 2 0.5000 31250 2.097152 0.5243 32768 2.4576 0.6144 38400 3 0.7500 46875 3.6864 0.9216 57600 4 1.0000 62500 4.9152 1.2288 76800 5 1.2500 78125 6 1.5000 93750 6.144 1.5360 96000 7.3728 1.8432 115200 8 2.0000 125000 9.8304 2.4576 153600 10 2.5000 156250 12 3.0000 187500 12.288 3.0720 192000 14 3.5000 218750 14.7456 3.6864 230400 16 4.0000 250000 17.2032 4.3008 268800 18 4.5000 281250 20 5.0000 312500 25 6.2500 390625 Rev. 2.00 Sep 20, 2005 page 379 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.7 Maximum Bit Rates with External Clock Input (Synchronous Mode) φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bit/s) 2 0.3333 333333.3 4 0.6667 666666.7 6 1.0000 1000000.0 8 1.3333 1333333.3 10 1.6667 1666666.7 12 2.0000 2000000.0 14 2.3333 2333333.3 16 2.6667 2666666.7 18 3.0000 3000000.0 20 3.3333 3333333.3 25 4.1667 4166666.7 12.3 Operation 12.3.1 Overview The SCI can carry out serial communication in two modes: asynchronous mode in which synchronization is achieved character by character, and synchronous mode in which synchronization is achieved with clock pulses. A smart card interface is also supported as a serial communication function for an IC card interface. Selection of asynchronous or synchronous mode and the transmission format for the normal serial communication interface is made in SMR, as shown in table 12.8. The SCI clock source is selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 12.9. For details of the procedures for switching between LSB-first and MSB-first mode and inverting the data logic level, see section 13.2.1, Smart Card Mode Register (SCMR). For selection of the smart card interface format, see section 13.3.3, Data Format. Rev. 2.00 Sep 20, 2005 page 380 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Asynchronous Mode • Data length is selectable: 7 or 8 bits • Parity and multiprocessor bits are selectable, and so is the stop bit length (1 or 2 bits). These selections determine the communication format and character length. • In receiving, it is possible to detect framing errors, parity errors, overrun errors, and the break state. • An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and can output a serial clock signal with a frequency matching the bit rate. When an external clock is selected, the external clock input must have a frequency 16 times the bit rate. (The on-chip baud rate generator is not used.) Synchronous Mode • The communication format has a fixed 8-bit data length. • In receiving, it is possible to detect overrun errors. • An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and can output a serial clock signal to external devices. When an external clock is selected, the SCI operates on the input serial clock. The on-chip baud rate generator is not used. Smart Card Interface • One frame consists of 8-bit data and a parity bit. • In transmitting, a guard time of at least two elementary time units (2 etu) is provided between the end of the parity bit and the start of he next frame. (An elementary time unit is the time required to transmit one bit.) • In receiving, if a parity error is detected, a low error signal level is output for 1 etu, beginning 10.5 etu after the start bit.. • In transmitting, if an error signal is received, the same data is automatically transmitted again after at least 2 etu. • Only asynchronous communication is supported. There is no synchronous communication function. For details of smart card interface operation, see section 13, Smart Card Interface. Rev. 2.00 Sep 20, 2005 page 381 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.8 SMR Settings and Serial Communication Formats SMR Settings SCI Communication Format Bit 7 C/A Bit 6 CHR Bit 2 MP Bit 5 PE Bit 3 STOP 0 0 0 0 0 1 1 Mode Asynchronous mode Data Length Multiprocessor Bit Parity Bit Stop Bit Length 8-bit data Absent Absent 1 bit 2 bits 0 Present 1 1 0 2 bits 0 7-bit data Absent 1 1 1 0 1 1 — — — 0 — 1 — 0 — 1 — — 1 bit 2 bits Present 1 0 1 bit 1 bit 2 bits Asynchronous mode (multiprocessor format) 8-bit data Present Absent 1 bit 2 bits 7-bit data 1 bit 2 bits Synchronous mode 8-bit data Absent None Table 12.9 SMR and SCR Settings and SCI Clock Source Selection SMR SCR Setting SCI Transmit/Receive clock Bit 7 C/A Bit 1 Bit 0 CKE1 CKE0 Mode Clock Source SCK Pin Function 0 0 Internal SCI does not use the SCK pin 0 1 1 Asynchronous mode 0 Outputs clock with frequency matching the bit rate External Inputs clock with frequency 16 times the bit rate Internal Outputs the serial clock External Inputs the serial clock 1 1 0 0 1 1 0 Synchronous mode 1 Rev. 2.00 Sep 20, 2005 page 382 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.3.2 Operation in Asynchronous Mode In asynchronous mode, each transmitted or received character begins with a start bit and ends with one or two stop bits. Serial communication is synchronized one character at a time. The transmitting and receiving sections of the SCI are independent, so full-duplex communication is possible. The transmitter and the receiver are both double-buffered, so data can be written and read while transmitting and receiving are in progress, enabling continuous transmitting and receiving. Figure 12.2 shows the general format of asynchronous serial communication. In asynchronous serial communication the communication line is normally held in the mark (high) state. The SCI monitors the line and starts serial communication when the line goes to the space (low) state, indicating a start bit. One serial character consists of a start bit (low), data (LSB first), parity bit (high or low), and one or two stop bits (high), in that order. When receiving in asynchronous mode, the SCI synchronizes at the falling edge of the start bit. The SCI samples each data bit on the eighth pulse of a clock with a frequency 16 times the bit rate. Receive data is latched at the center of each bit. Idle (mark) state (LSB) 1 Serial data 0 D0 1 (MSB) D1 Start bit D2 D3 D4 D5 D6 0/1 Parity bit Transmit or receive data 7 or 8 bits 1 bit D7 One unit of data (character or frame) 1 bit, or none 1 1 Stop bit(s) 1 or 2 bits Figure 12.2 Data Format in Asynchronous Communication (Example: 8-Bit Data with Parity and 2 Stop Bits) Communication Formats Table 12.10 shows the 12 communication formats that can be selected in asynchronous mode. The format is selected by settings in SMR. Rev. 2.00 Sep 20, 2005 page 383 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Table 12.10 Serial Communication Formats (Asynchronous Mode) SMR Settings Serial Communication Format and Frame Length CHR PE MP STOP 1 0 0 0 0 S 8-bit data STOP 0 0 0 1 S 8-bit data STOP STOP 0 1 0 0 S 8-bit data P STOP 0 1 0 1 S 8-bit data P STOP STOP 1 0 0 0 S 7-bit data 1 0 0 1 S 7-bit data STOP STOP 1 1 0 0 S 7-bit data P STOP 1 1 0 1 S 7-bit data P STOP STOP 0 — 1 0 S 8-bit data MPB STOP 0 — 1 1 S 8-bit data MPB STOP STOP 1 — 1 0 S 7-bit data MPB STOP 1 — 1 1 S 7-bit data MPB STOP STOP Legend: S: Start bit STOP: Stop bit P: Parity bit MPB: Multiprocessor bit Rev. 2.00 Sep 20, 2005 page 384 of 800 REJ09B0260-0200 2 3 4 5 6 7 8 9 10 11 12 STOP Section 12 Serial Communication Interface Clock An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected as the SCI transmit/receive clock. The clock source is selected by the C/A bit in SMR and bits CKE1 and CKE0 in SCR. For details of SCI clock source selection, see table 12.9. When an external clock is input at the SCK pin, it must have a frequency 16 times the desired bit rate. When the SCI is operated on an internal clock, it can output a clock signal at the SCK pin. The frequency of this output clock is equal to the bit rate. The phase is aligned as shown in figure 12.3 so that the rising edge of the clock occurs at the center of each transmit data bit. 0 D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1 1 frame Figure 12.3 Phase Relationship between Output Clock and Serial Data (Asynchronous Mode) Transmitting and Receiving Data SCI Initialization (Asynchronous Mode): Before transmitting or receiving data, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags, or RDR, which retain their previous contents. When an external clock is used the clock should not be stopped during initialization or subsequent operation, since operation will be unreliable in this case. Rev. 2.00 Sep 20, 2005 page 385 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Figure 12.4 shows a sample flowchart for initializing the SCI. Start of initialization Clear TE and RE bits to 0 in SCR Set CKE1 and CKE0 bits in SCR (leaving TE and RE bits cleared to 0) (1) (1) Set the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0. If clock output is selected in asynchronous mode, clock output starts immediately after the setting is made in SCR. (2) Select the communication format in SMR. Select communication format in SMR (2) Set value in BRR (3) Wait No 1-bit interval elapsed? Yes Set TE or RE bit to 1 in SCR Set the RIE, TIE, TEIE, and MPIE bits (4) (3) Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. (4) Wait for at least the interval required to transmit or receive one bit, then set the TE or RE bit to 1 in SCR. Set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin. <End of initialization> Figure 12.4 Sample Flowchart for SCI Initialization Rev. 2.00 Sep 20, 2005 page 386 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Transmitting Serial Data (Asynchronous Mode): Figure 12.5 shows a sample flowchart for transmitting serial data and indicates the procedure to follow. (1) Initialize Start transmitting (2) Read TDRE flag in SSR (2) SCI status check and transmit data write: read SSR and check that the TDRE flag is set to 1, then write transmit data in TDR and clear the TDRE flag to 0. No TDRE = 1 Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. No All data transmitted? Yes (3) Read TEND flag in SSR TEND = 1 (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. After the TE bit is set to 1, one frame of 1s is output, then transmission is possible. No (4) To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0, then clear the TE bit to 0 in SCR. Yes Output break signal? No (4) Yes Clear DR bit to 0 and set DDR bit to 1 Clear TE bit to 0 in SCR <End> Figure 12.5 Sample Flowchart for Transmitting Serial Data Rev. 2.00 Sep 20, 2005 page 387 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface In transmitting serial data, the SCI operates as follows: • The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. • After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: Start bit: One 0 bit is output. Transmit data: 7 or 8 bits are output, LSB first. Parity bit or multiprocessor bit: One parity bit (even or odd parity),or one multiprocessor bit is output. Formats in which neither a parity bit nor a multiprocessor bit is output can also be selected. Stop bit(s): One or two 1 bits (stop bits) are output. Mark state: Output of 1 bits continues until the start bit of the next transmit data. • The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. Figure 12.6 shows an example of SCI transmit operation in asynchronous mode. 1 0 Parity Stop Start bit bit bit Data Start bit D0 D1 D7 0/1 1 0 Parity Stop bit bit Data D0 D1 D7 0/1 TDRE TEND 1 frame TXI interrupt request TXI interrupt handler writes data in TDR and clears TDRE flag to 0 TXI interrupt request TEI interrupt request Figure 12.6 Example of SCI Transmit Operation in Asynchronous Mode (8-Bit Data with Parity and One Stop Bit) Rev. 2.00 Sep 20, 2005 page 388 of 800 REJ09B0260-0200 1 1 Idle state (mark state) Section 12 Serial Communication Interface Receiving Serial Data (Asynchronous Mode): Figure 12.7 shows a sample flowchart for receiving serial data and indicates the procedure to follow. (1) Initialize Start receiving Read ORER, PER, and FER flags in SSR PER ∨ FER ∨ OPER = 1 (2) Yes (3) (1) SCI initialization: the receive data input function of the RxD pin is selected automatically. (2)(3) Receive error handling and break detection: if a receive error occurs, read the ORER, PER, and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER, PER, and FER flags all to 0. Receiving cannot resume if any of these flags remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state. Error handling No (continued on next page) Read RDRF flag in SSR No (4) SCI status check and receive data read: read SSR, check that the RDRF flag is set to 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. (5) To continue receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the stop bit of the current frame is received. RDRF = 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR No (4) All data received? (5) Yes Clear RE bit to 0 in SCR <End> Figure 12.7 Sample Flowchart for Receiving Serial Data Rev. 2.00 Sep 20, 2005 page 389 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface (3) Error handling No ORER = 1 Yes Overrun error handling No FER = 1 Yes Break? Yes No Framing error handling No Clear RE bit to 0 in SCR PER = 1 Yes Parity error handling Clear ORER, PER, and FER flags to 0 in SSR <End> Figure 12.7 Sample Flowchart for Receiving Serial Data (cont) Rev. 2.00 Sep 20, 2005 page 390 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface In receiving, the SCI operates as follows: • The SCI monitors the communication line. When it detects a start bit (0 bit), the SCI synchronizes internally and starts receiving. • Receive data is stored in RSR in order from LSB to MSB. • The parity bit and stop bit are received. After receiving these bits, the SCI carries out the following checks: Parity check: The number of 1s in the receive data must match the even or odd parity setting of in the O/E bit in SMR. Stop bit check: The stop bit value must be 1. If there are two stop bits, only the first is checked. Status check: The RDRF flag must be 0, indicating that the receive data can be transferred from RSR into RDR. If these all checks pass, the RDRF flag is set to 1 and the received data is stored in RDR. If one of the checks fails (receive error*), the SCI operates as shown in table 12.11. Note: * When a receive error occurs, further receiving is disabled. In receiving, the RDRF flag is not set to 1. Be sure to clear the error flags to 0. • When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt (RXI) is requested. If the ORER, PER, or FER flag is set to 1 and the RIE bit in SCR is also set to 1, a receive-error interrupt (ERI) is requested. Table 12.11 Receive Error Conditions Receive Error Abbreviation Condition Data Transfer Overrun error ORER Receiving of next data ends while RDRF flag is still set to 1 in SSR Receive data is not transferred from RSR to RDR Framing error FER Stop bit is 0 Receive data is transferred from RSR to RDR Parity error PER Parity of received data differs from even/odd parity setting in SMR Receive data is transferred from RSR to RDR Rev. 2.00 Sep 20, 2005 page 391 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Figure 12.8 shows an example of SCI receive operation in asynchronous mode. 1 Start bit 0 Parity Stop bit bit Data D0 D1 D7 0/1 1 Start bit 0 Parity Stop bit bit Data D0 D1 D7 0/1 1 1 Idle (mark) state RDRF FER RXI interrupt request 1 frame RXI interrupt handler reads data in RDR and clears RDRF flag to 0 Framing error, ERI interrupt request Figure 12.8 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit) 12.3.3 Multiprocessor Communication The multiprocessor communication function enables several processors to share a single serial communication line. The processors communicate in asynchronous mode using a format with an additional multiprocessor bit (multiprocessor format). In multiprocessor communication, each receiving processor is addressed by an ID. A serial communication cycle consists of an ID-sending cycle that identifies the receiving processor, and a data-sending cycle. The multiprocessor bit distinguishes ID-sending cycles from data-sending cycles. The transmitting processor starts by sending the ID of the receiving processor with which it wants to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends transmit data with the multiprocessor bit cleared to 0. Receiving processors skip incoming data until they receive data with the multiprocessor bit set to 1. When they receive data with the multiprocessor bit set to 1, receiving processors compare the data with their IDs. Processors with IDs not matching the received data skip further incoming data until they again receive data with the multiprocessor bit set to 1. Multiple processors can send and receive data in this way. Figure 12.9 shows an example of communication among different processors using a multiprocessor format. Rev. 2.00 Sep 20, 2005 page 392 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Communication Formats Four formats are available. Parity bit settings are ignored when a multiprocessor format is selected. For details see table 12.10. Clock See the description of asynchronous mode. Transmitting processor Serial communication line Serial data Receiving processor A Receiving processor B Receiving processor C Receiving processor D (ID = 01) (ID = 02) (ID = 03) (ID = 04) H'AA H'01 (MPB = 1) ID-sending cycle: receiving processor address (MPB = 0) Data-sending cycle: data sent to receiving processor specified by ID Legend MPB: Multiprocessor bit Figure 12.9 Example of Communication among Processors using Multiprocessor Format (Sending Data H'AA to Receiving Processor A) Transmitting and Receiving Data Transmitting Multiprocessor Serial Data: Figure 12.10 shows a sample flowchart for transmitting multiprocessor serial data and indicates the procedure to follow. Rev. 2.00 Sep 20, 2005 page 393 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface (1) Initialize Start transmitting Read TDRE flag in SSR TDRE = 1 (2) No (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR. Also set the MPBT flag to 0 or 1 in SSR. Finally, clear the TDRE flag to 0. (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. Yes Write transmit data in TDR and set MPBT bit in SSR Clear TDRE flag to 0 All data transmitted? (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. No (3) (4) To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0, then clear the TE bit to 0 in SCR. Yes Read TEND flag in SSR TEND = 1 No Yes Output break signal? No (4) Yes Clear DR bit to 0 and set DDR to 1 Clear TE bit to 0 in SCR <End> Figure 12.10 Sample Flowchart for Transmitting Multiprocessor Serial Data Rev. 2.00 Sep 20, 2005 page 394 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface In transmitting serial data, the SCI operates as follows: • The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. • After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: Start bit: One 0 bit is output. Transmit data: 7 or 8 bits are output, LSB first. Multiprocessor bit: One multiprocessor bit (MPBT value) is output. Stop bit(s): One or two 1 bits (stop bits) are output. Mark state: Output of 1 bits continues until the start bit of the next transmit data. • The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. Figure 12.11 shows an example of SCI transmit operation using a multiprocessor format. 1 Start bit 0 Data D0 D1 Multiprocessor Stop Start bit bit bit D7 0/1 1 0 Data D0 D1 Multiprocessor Stop bit bit D7 0/1 1 Idle (mark) state TDRE TEND TXI interrupt TXI interrupt handler writes data in TDR and request clears TDRE flag to 0 TXI interrupt request TEI interrupt request 1 frame Figure 12.11 Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) Receiving Multiprocessor Serial Data: Figure 12.12 shows a sample flowchart for receiving multiprocessor serial data and indicates the procedure to follow. Rev. 2.00 Sep 20, 2005 page 395 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface (1) Initialize (1) SCI initialization: the receive data input function of the RxD pin is selected automatically. Start receiving (2) ID receive cycle: set the MPIE bit to 1 in SCR. (2) Set MPIE bit to 1 in SCR (3) SCI status check and ID check: read SSR, check that the RDRF flag is set to 1, then read data from RDR and compare it with the processor's own ID. If the ID does not match, set the MPIE bit to 1 again and clear the RDRF flag to 0. If the ID matches, clear the RDRF flag to 0. Read ORER and FER flags in SSR FER ∨ ORER = 1 Yes No Read RDRF flag in SSR No (3) (4) SCI status check and data receiving: read SSR, check that the RDRF flag is set to 1, then read data from RDR. RDRF = 1 (5) Receive error handling and break detection: if a receive error occurs, read the ORER and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER and FER flags both to 0. Receiving cannot resume while either the ORER or FER flag remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state. Yes Read RDRF flag in SSR No Own ID? Yes Read ORER and FER flags in SSR FER ∨ ORER = 1 Yes No (4) Read RDRF flag in SSR RDRF = 1 No Yes Read receive data from RDR No Finished receiving? Yes (5) Error handling Clear RE bit to 0 in SCR (continued on next page) <End> Figure 12.12 Sample Flowchart for Receiving Multiprocessor Serial Data Rev. 2.00 Sep 20, 2005 page 396 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface (5) Error handling No ORER = 1 Yes Overrun error handling No FER = 1 Yes Break? Yes No Clear RE bit to 0 in SCR Framing error handling Clear ORER, PER, and FER flags to 0 in SSR <End> Figure 12.12 Sample Flowchart for Receiving Multiprocessor Serial Data (cont) Rev. 2.00 Sep 20, 2005 page 397 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Figure 12.13 shows an example of SCI receive operation using a multiprocessor format. 1 Start bit 0 Stop MPB bit Data (ID1) D0 D1 D7 Start bit 0 1 1 Stop MPB bit Data (data1) D0 D1 D7 1 0 1 Idle (mark) state MPIE RDRF RDR value ID1 MPB detection MPIE = 0 RXI interrupt request (multiprocessor interrupt) RXI interrupt handler reads RDR data and clears RDRF flag to 0 Not own ID, so MPIE bit is set to 1 again No RXI interrupt request, RDR not updated a. Own ID does not match data 1 Start bit 0 Data (ID2) D0 D1 MPB D7 1 Stop bit 1 Start bit Data (data2) 0 D0 D1 MPB D7 0 Stop bit 1 1 Idle (mark) state MPIE RDRF RDR value MPB detection MPIE = 0 ID1 ID2 RXI interrupt request (multiprocessor interrupt) RXI interrupt handler reads RDR data and clears RDRF flag to 0 Own ID, so receiving MPIE bit is set to continues, with data 1 again received by RXI interrupt handler b. Own ID matches data Figure 12.13 Example of SCI Receive Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) Rev. 2.00 Sep 20, 2005 page 398 of 800 REJ09B0260-0200 Data2 Section 12 Serial Communication Interface 12.3.4 Synchronous Operation In synchronous mode, the SCI transmits and receives data in synchronization with clock pulses. This mode is suitable for high-speed serial communication. The SCI transmitter and receiver share the same clock but are otherwise independent, so fullduplex communication is possible. The transmitter and the receiver are also double-buffered, so continuous transmitting or receiving is possible by reading or writing data while transmitting or receiving is in progress. Figure 12.14 shows the general format in synchronous serial communication. One unit (character or frame) of transfer data * * Serial clock LSB Bit 0 Serial data MSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Don't care Don't care Note: * High except in continuous transmitting or receiving Figure 12.14 Data Format in Synchronous Communication In synchronous serial communication, each data bit is placed on the communication line from one falling edge of the serial clock to the next. Data is guaranteed valid at the rise of the serial clock. In each character, the serial data bits are transferred in order from LSB (first) to MSB (last). After output of the MSB, the communication line remains in the state of the MSB. In synchronous mode the SCI receives data by synchronizing with the rise of the serial clock. Communication Format The data length is fixed at 8 bits. No parity bit or multiprocessor bit can be added. Rev. 2.00 Sep 20, 2005 page 399 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Clock An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected by means of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. See table 12.9 for details of SCI clock source selection. When the SCI operates on an internal clock, it outputs the clock source at the SCK pin. Eight clock pulses are output per transmitted or received character. When the SCI is not transmitting or receiving, the clock signal remains in the high state. If receiving in single-character units is required, an external clock should be selected. Transmitting and Receiving Data SCI Initialization (Synchronous Mode): Before transmitting or receiving data, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags, or RDR, which retain their previous contents. Figure 12.15 shows a sample flowchart for initializing the SCI. Rev. 2.00 Sep 20, 2005 page 400 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Start of initialization (1) Set the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0.* Clear TE and RE bits to 0 in SCR Set RIE, TIE, MPIE, CKE1 and CKE0 bits in SCR (leaving TE and (1) RE bits cleared to 0) Select communication format in SMR Set value in BRR Wait 1-bit interval elapsed? (2) Set the communication format in SMR. (3) Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. (2) (3) Yes (4) Wait for at least the interval required to transmit or receive one bit, then set the TE or RE bit to 1 in SCR.* Set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin. Yes Set TE or RE bit to 1 in SCR Set RIE, TIE, TEIE, and MPIE bits as necessary (4) <Start transmitting or receiving> Note: * In simultaneous transmitting and receiving, the TE and RE bits should be cleared to 0 or set to 1 simultaneously. Figure 12.15 Sample Flowchart for SCI Initialization Rev. 2.00 Sep 20, 2005 page 401 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Transmitting Serial Data (Synchronous Mode): Figure 12.16 shows a sample flowchart for transmitting serial data and indicates the procedure to follow. (1) Initialize Start transmitting Read TDRE flag in SSR TDRE = 1 (2) No Write transmit data in TDR and clear TDRE flag to 0 in SSR No (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. Yes All data transmitted? (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. (3) Yes Read TEND flag in SSR TEND = 1 No Yes Clear TE bit to 0 in SCR <End> Figure 12.16 Sample Flowchart for Serial Transmitting Rev. 2.00 Sep 20, 2005 page 402 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface In transmitting serial data, the SCI operates as follows. • The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. • After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. If clock output is selected, the SCI outputs eight serial clock pulses. If an external clock source is selected, the SCI outputs data in synchronization with the input clock. Data is output from the TxD pin in order from LSB (bit 0) to MSB (bit 7). • The SCI checks the TDRE flag when it outputs the MSB (bit 7). If the TDRE flag is 0, the SCI loads data from TDR into TSR and begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, and after transmitting the MSB, holds the TxD pin in the MSB state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. • After the end of serial transmission, the SCK pin is held in a constant state. Figure 12.17 shows an example of SCI transmit operation. Transmit direction Serial clock Serial data Bit 0 Bit 1 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 TDRE TEND TXI interrupt request TEI interrupt request TXI interrupt handler TXI interrupt writes data in TDR request and clears TDRE flag to 0 1 frame Figure 12.17 Example of SCI Transmit Operation Receiving Serial Data (Synchronous Mode): Figure 12.18 shows a sample flowchart for receiving serial data and indicates the procedure to follow. When switching from asynchronous to synchronous mode. make sure that the ORER, PER, and FER flags are cleared to 0. If the FER or Rev. 2.00 Sep 20, 2005 page 403 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface PER flag is set to 1 the RDRF flag will not be set and both transmitting and receiving will be disabled. (1) Initialize (1) Start receiving Read ORER flag in SSR (2)(3) Receive error handling: if a receive error occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag remains set to 1. (2) Yes ORER = 1 (3) No Error handling (4) SCI status check and receive data read: read SSR, check that the RDRF flag is set to 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. (5) To continue receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. (continued on next page) Read RDRF flag in SSR No (4) RDRF = 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR No SCI initialization: the receive data input function of the RxD pin is selected automatically. Finished receiving? (5) Yes Clear RE bit to 0 in SCR <End> Figure 12.18 Sample Flowchart for Serial Receiving Rev. 2.00 Sep 20, 2005 page 404 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface (3) Error handling Overrun error handling Clear ORER flag to 0 in SSR <End> Figure 12.18 Sample Flowchart for Serial Receiving (cont) In receiving, the SCI operates as follows: • The SCI synchronizes with serial clock input or output and synchronizes internally. • Receive data is stored in RSR in order from LSB to MSB. After receiving the data, the SCI checks that the RDRF flag is 0, so that receive data can be transferred from RSR to RDR. If this check passes, the RDRF flag is set to 1 and the received data is stored in RDR. If the checks fails (receive error), the SCI operates as shown in table 12.11. When a receive error has been identified in the error check, subsequent transmit and receive operations are disabled. • When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt (RXI) is requested. If the ORER flag is set to 1 and the RIE bit in SCR is also set to 1, a receive-error interrupt (ERI) is requested. Rev. 2.00 Sep 20, 2005 page 405 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Figure 12.19 shows an example of SCI receive operation. Serial clock Serial data Bit 7 Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 RDRF ORER RXI interrupt request RXI interrupt handler reads data in RDR and clears RDRF flag to 0 RXI interrupt request 1 frame Figure 12.19 Example of SCI Receive Operation Rev. 2.00 Sep 20, 2005 page 406 of 800 REJ09B0260-0200 Overrun error, ERI interrupt request Section 12 Serial Communication Interface Transmitting and Receiving Data Simultaneously (Synchronous Mode): Figure 12.20 shows a sample flowchart for transmitting and receiving serial data simultaneously and indicates the procedure to follow. Initialize (1) SCI initialization: the transmit data output function of the TxD pin and the read data input function of the TxD pin are selected, enabling simultaneous transmitting and receiving. (1) Start of transmitting and receiving Read TDRE flag in SSR No (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. Notification that the TDRE flag has changed from 0 to 1 can also be given by the TXI interrupt. (2) TDRE = 1 (3) Receive error handling: if a receive error occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag remains set to 1. Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR (4) SCI status check and receive data read: read SSR, check that the RDRF flag is 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. Read ORER flag in SSR ORER = 1 Yes (3) No Error handling Read RDRF flag in SSR No (4) (5) To continue transmitting and receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. Also check that the TDRE flag is set to 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0 before the MSB (bit 7) of the current frame is transmitted. RDRF = 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR No End of transmitting and receiving? (5) Yes Clear TE and RE bits to 0 in SCR <End> Note: When switching from transmitting or receiving to simultaneous transmitting and receiving, clear both the TE bit and the RE bit to 0, then set both bits to 1 simultaneously. Figure 12.20 Sample Flowchart for Simultaneous Serial Transmitting and Receiving Rev. 2.00 Sep 20, 2005 page 407 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface 12.4 SCI Interrupts The SCI has four interrupt request sources: transmit-end interrupt (TEI), receive-error (ERI), receive-data-full (RXI), and transmit-data-empty interrupt (TXI). Table 12.12 lists the interrupt sources and indicates their priority. These interrupts can be enabled or disabled by the TIE, RIE, and TEIE bits in SCR. Each interrupt request is sent separately to the interrupt controller. A TXI interrupt is requested when the TDRE flag is set to 1 in SSR. A TEI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or FER flag is set to 1 in SSR. Table 12.12 SCI Interrupt Sources Interrupt Source Description Priority ERI Receive error (ORER, FER, or PER) High RXI Receive data register full (RDRF) TXI Transmit data register empty (TDRE) TEI Transmit end (TEND) Rev. 2.00 Sep 20, 2005 page 408 of 800 REJ09B0260-0200 Low Section 12 Serial Communication Interface 12.5 Usage Notes 12.5.1 Notes on Use of SCI Note the following points when using the SCI. TDR Write and TDRE Flag: The TDRE flag in SSR is a status flag indicating the loading of transmit data from TDR to TSR. The SCI sets the TDRE flag to 1 when it transfers data from TDR to TSR. Data can be written into TDR regardless of the state of the TDRE flag. If new data is written in TDR when the TDRE flag is 0, the old data stored in TDR will be lost because this data has not yet been transferred to TSR. Before writing transmit data in TDR, be sure to check that the TDRE flag is set to 1. Simultaneous Multiple Receive Errors: Table 12.13 shows the state of the SSR status flags when multiple receive errors occur simultaneously. When an overrun error occurs the RSR contents are not transferred to RDR, so receive data is lost. Table 12.13 SSR Status Flags and Transfer of Receive Data SSR Status Flags RDRF ORER FER PER Receive Data Transfer RSR → RDR Receive Errors 1 1 0 0 × Overrun error 0 0 1 0 Framing error 0 0 0 1 Parity error 1 1 1 0 × Overrun error + framing error 1 1 0 1 × Overrun error + parity error 0 0 1 1 1 1 1 1 Notes: Framing error + parity error × Overrun error + framing error + parity error : Receive data is transferred from RSR to RDR. ×: Receive data is not transferred from RSR to RDR. Rev. 2.00 Sep 20, 2005 page 409 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Break Detection and Processing: Break signals can be detected by reading the RxD pin directly when a framing error (FER) is detected. In the break state the input from the RxD pin consists of all 0s, so the FER flag is set and the parity error flag (PER) may also be set. In the break state the SCI receiver continues to operate, so if the FER flag is cleared to 0 it will be set to 1 again. Sending a Break Signal: The input/output condition and level of the TxD pin are determined by DR and DDR bits. This feature can be used to send a break signal. After the serial transmitter is initialized, the DR value substitutes for the mark state until the TE bit is set to 1 (the TxD pin function is not selected until the TE bit is set to 1). The DDR and DR bits should therefore be set to 1 beforehand. To send a break signal during serial transmission, clear the DR bit to 0 , then clear the TE bit to 0. When the TE bit is cleared to 0 the transmitter is initialized, regardless of its current state, so the TxD pin becomes an input/output outputting the value 0. Receive Error Flags and Transmitter Operation (Synchronous Mode Only): When a receive error flag (ORER, PER, or FER) is set to 1 the SCI will not start transmitting, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 when starting to transmit. Note that clearing the RE bit to 0 does not clear the receive error flags to 0. Receive Data Sampling Timing in Asynchronous Mode and Receive Margin: In asynchronous mode the SCI operates on a base clock with 16 times the bit rate frequency. In receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the eighth base clock pulse. See figure 12.21. 16 clocks 8 clocks 0 7 15 0 7 15 0 Internal base clock Receive data (RxD) Start bit D0 Synchronization sampling timing Data sampling timing Figure 12.21 Receive Data Sampling Timing in Asynchronous Mode Rev. 2.00 Sep 20, 2005 page 410 of 800 REJ09B0260-0200 D1 Section 12 Serial Communication Interface The receive margin in asynchronous mode can therefore be expressed as shown in equation (1). M = (0.5 – 1 ) – (L – 0.5) F – D – 0.5 2N M: N: D: L: F: (1 + F) × 100% . . . . . . . . (1) N Receive margin (%) Ratio of clock frequency to bit rate (N = 16) Clock duty cycle (D = 0 to 1.0) Frame length (L = 9 to 12) Absolute deviation of clock frequency From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2). When D = 0.5 and F = 0: M = (0.5 – 1 2 × 16 = 46.875% ) × 100% . . . . . . . . (2) This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%. Restrictions on Use of an External Clock Source: • When an external clock source is used for the serial clock, after updates TDR, allow an inversion of at least five system clock (φ) cycles before input of the serial clock to start transmitting. If the serial clock is input within four states of the TDR update, a malfunction may occur. (See figure 12.22) SCK t TDRE D0 D1 D2 D3 D4 D5 D6 D7 Note: In operation with an external clock source, be sure that t >4 states. Figure 12.22 Example of Synchronous Transmission Rev. 2.00 Sep 20, 2005 page 411 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Switching from SCK Pin Function to Port Pin Function: • Problem in Operation: When switching the SCK pin function to the output port function (highlevel output) by making the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1 (synchronous mode), low-level output occurs for one half-cycle. 1. End of serial data transmission 2. TE bit = 0 3. C/A bit = 0 ... switchover to port output 4. Occurrence of low-level output (see figure 12.23) Half-cycle low-level output SCK/port 1. End of transmission Data TE Bit 6 4. Low-level output Bit 7 2. TE = 0 C/A 3. C/A = 0 CKE1 CKE0 Figure 12.23 Operation when Switching from SCK Pin Function to Port Pin Function Rev. 2.00 Sep 20, 2005 page 412 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface • Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an external circuit. With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings in the order shown. 1. End of serial data transmission 2. TE bit = 0 3. CKE1 bit = 1 4. C/A bit = 0 ... switchover to port output 5. CKE1 bit = 0 High-level outputTE SCK/port 1. End of transmission Data TE Bit 6 Bit 7 2. TE = 0 4. C/A = 0 C/A 3. CKE1 = 1 CKE1 5. CKE1 = 0 CKE0 Figure 12.24 Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output) Rev. 2.00 Sep 20, 2005 page 413 of 800 REJ09B0260-0200 Section 12 Serial Communication Interface Rev. 2.00 Sep 20, 2005 page 414 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Section 13 Smart Card Interface 13.1 Overview The SCI supports an IC card (smart card) interface handling ISO/IEC7816-3 (Identification Card) character transmission as a serial communication interface expansion function. Switchover between the normal serial communication interface and the smart card interface is controlled by a register setting. 13.1.1 Features Features of the smart card interface supported by the H8/3024 Group are listed below. • Asynchronous communication Data length: 8 bits Parity bit generation and checking Transmission of error signal (parity error) in receive mode Error signal detection and automatic data retransmission in transmit mode Direct convention and inverse convention both supported • Built-in baud rate generator allows any bit rate to be selected • Three interrupt sources There are three interrupt sources—transmit-data-empty, receive-data-full, and transmit/receive error—that can issue requests independently. Rev. 2.00 Sep 20, 2005 page 415 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.1.2 Block Diagram Bus interface Figure 13.1 shows a block diagram of the smart card interface. Module data bus RDR RxD RSR TDR TSR TxD Parity generation SCMR SSR SCR SMR Transmission/ reception control BRR φ Baud rate generator φ/4 φ/16 φ/64 Clock Parity check External clock SCK Legend SCMR: RSR: RDR: TSR: TDR: SMR: SCR: SSR: BRR: Smart card mode register Receive shift register Receive data register Transmit shift register Transmit data register Serial mode register Serial control register Serial status register Bit rate register TXI RXI ERI Figure 13.1 Block Diagram of Smart Card Interface Rev. 2.00 Sep 20, 2005 page 416 of 800 REJ09B0260-0200 Internal data bus Section 13 Smart Card Interface 13.1.3 Pin Configuration Table 13.1 shows the smart card interface pins. Table 13.1 Smart Card Interface Pins Pin Name Abbreviation I/O Function Serial clock pin SCK I/O Clock input/output Receive data pin RxD Input Receive data input Transmit data pin TxD Output Transmit data output 13.1.4 Register Configuration The smart card interface has the internal registers listed in table 13.2. The BRR, TDR, and RDR registers have their normal serial communication interface functions, as described in section 12, Serial Communication Interface. Table 13.2 Smart Card Interface Registers Channel Address*1 Name Abbreviation R/W Initial Value 0 H'FFFB0 Serial mode register SMR R/W H'00 H'FFFB1 Bit rate register BRR R/W H'FF H'FFFB2 Serial control register SCR R/W H'00 1 H'FFFB3 Transmit data register TDR H'FFFB4 Serial status register SSR R/W R/(W)*2 H'84 H'FF H'FFFB5 Receive data register RDR R H'00 H'FFFB6 Smart card mode register SCMR R/W H'F2 H'FFFB8 Serial mode register SMR R/W H'00 H'FFFB9 Bit rate register BRR R/W H'FF H'FFFBA Serial control register SCR R/W H'00 H'FFFBB Transmit data register TDR R/W H'FF *2 H'FFFBC Serial status register SSR R/(W) H'84 H'FFFBD Receive data register RDR R H'00 H'FFFBE Smart card mode register SCMR R/W H'F2 Notes: 1. Lower 20 bits of the address in advanced mode. 2. Only 0 can be written in bits 7 to 3, to clear the flags. Rev. 2.00 Sep 20, 2005 page 417 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.2 Register Descriptions This section describes the new or modified registers and bit functions in the smart card interface. 13.2.1 Smart Card Mode Register (SCMR) SCMR is an 8-bit readable/writable register that selects smart card interface functions. 7 6 5 4 3 2 1 0 — — — — SDIR SINV — SMIF Initial value 1 1 1 1 0 0 1 0 Read/Write — — — — R/W R/W — R/W Bit Reserved bits Reserved bit Smart card interface mode select Enables or disables the smart card interface function Smart card data invert Inverts data logic levels Smart card data transfer direction Selects the serial/parallel conversion format SCMR is initialized to H'F2 by a reset and in standby mode. Bits 7 to 4—Reserved: Read-only bits, always read as 1. Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.*1 Bit 3 SDIR 0 Description TDR contents are transmitted LSB-first Receive data is stored LSB-first in RDR 1 TDR contents are transmitted MSB-first Receive data is stored MSB-first in RDR Rev. 2.00 Sep 20, 2005 page 418 of 800 REJ09B0260-0200 (Initial value) Section 13 Smart Card Interface Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This function is used in combination with the SDIR bit to communicate with inverse-convention cards.*2 The SINV bit does not affect the logic level of the parity bit. For parity settings, see section 13.3.4, Register Settings. Bit 2 SINV Description 0 Unmodified TDR contents are transmitted (Initial value) Receive data is stored unmodified in RDR 1 Inverted TDR contents are transmitted Receive data is inverted before storage in RDR Bit 1—Reserved: Read-only bit, always read as 1. Bit 0—Smart Card Interface Mode Select (SMIF): Enables the smart card interface function. Bit 0 SMIF Description 0 Smart card interface function is disabled 1 Smart card interface function is enabled (Initial value) Notes: 1. The function for switching between LSB-first and MSB-first mode can also be used with the normal serial communication interface. Note that when the communication format data length is set to 7 bits and MSB-first mode is selected for the serial data to be transferred, bit 0 of TDR is not transmitted, and only bits 7 to 1 of the received data are valid. 2. The data logic level inversion function can also be used with the normal serial communication interface. Note that, when inverting the serial data to be transferred, parity transmission and parity checking is based on the number of high-level periods at the serial data I/O pin, and not on the register value. Rev. 2.00 Sep 20, 2005 page 419 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.2.2 Serial Status Register (SSR) The function of SSR bit 4 is modified in smart card interface mode. This change also causes a modification to the setting conditions for bit 2 (TEND). Bit 7 6 5 4 3 2 1 0 TDRE RDRF ORER ERS PER TEND MPB MPBT Initial value 1 0 0 0 0 1 0 0 Read/Write R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W Transmit end Status flag indicating end of transmission Error signal status (ERS) Status flag indicating that an error signal has been received Note: * Only 0 can be written, to clear the flag. Bits 7 to 5: These bits operate as in normal serial communication. For details see section 12.2.7, Serial Status Register (SSR). Bit 4—Error Signal Status (ERS): In smart card interface mode, this flag indicates the status of the error signal sent from the receiving device to the transmitting device. The smart card interface does not detection framing errors. Bit 4 ERS Description 0 Indicates normal transmission, with no error signal returned (Initial value) [Clearing conditions] 1 • The chip is reset, or enters standby mode or module stop mode • Software reads ERS while it is set to 1, then writes 0. Indicates that the receiving device sent an error signal reporting a parity error [Setting condition] A low error signal was sampled. Note: Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous value. Rev. 2.00 Sep 20, 2005 page 420 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Bits 3 to 0: These bits operate as in normal serial communication. For details see section 12.2.7, Serial Status Register (SSR). The setting conditions for transmit end (TEND), however, are modified as follows. Bit 2 TEND Description 0 Transmission is in progress [Clearing condition] Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag. 1 End of transmission [Setting conditions] (Initial value) • The chip is reset or enters standby mode. • The TE bit and FER/ERS bit are both cleared to 0 in SCR. • TDRE is 1 and FER/ERS is 0 at a time 2.5 etu after the last bit of a 1-byte serial character is transmitted (normal transmission). Note: An etu (elementary time unit) is the time needed to transmit one bit. 13.2.3 Serial Mode Register (SMR) The function of SMR bit 7 is modified in smart card interface mode. This change also causes a modification to the function of bits 1 and 0 in the serial control register (SCR). Bit 7 6 5 4 3 2 1 0 GM CHR PE O/E STOP MP CKS1 CKS0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Bit 7—GSM Mode (GM): With the normal smart card interface, this bit is cleared to 0. Setting this bit to 1 selects GSM mode, an additional mode for controlling the timing for setting the TEND flag that indicates completion of transmission, and the type of clock output used. The details of the additional clock output control mode are specified by the CKE1 and CKE0 bits in the serial control register (SCR). Rev. 2.00 Sep 20, 2005 page 421 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Bit 7 GM Description 0 Normal smart card interface mode operation 1 • The TEND flag is set 12.5 etu after the beginning of the start bit. • Clock output on/off control only. (Initial value) GSM mode smart card interface mode operation • The TEND flag is set 11.0 etu after the beginning of the start bit. • Clock output on/off and fixed-high/fixed-low control. Bits 6 to 0: These bits operate as in normal serial communication. For details see section 12.2.5, Serial Mode Register (SMR). 13.2.4 Serial Control Register (SCR) The function of SCR bits 1 and 0 is modified in smart card interface mode. 7 6 5 4 3 2 1 0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Bit Bits 7 to 2: These bits operate as in normal serial communication. For details see section 12.2.6, Serial Control Register (SCR). Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits select the SCI clock source and enable or disable clock output from the SCK pin. In smart card interface mode, it is possible to specify a fixed high level or fixed low level for the clock output, in addition to the usual switching between enabling and disabling of the clock output. Bit 7 GM Bit 1 CKE1 0 0 1 1 Bit 0 CKE0 Description 0 Internal clock/SCK pin is I/O port 1 Internal clock/SCK pin is clock output 0 Internal clock/SCK pin is fixed at low output 1 Internal clock/SCK pin is clock output 0 Internal clock/SCK pin is fixed at high output 1 Internal clock/SCK pin is clock output Rev. 2.00 Sep 20, 2005 page 422 of 800 REJ09B0260-0200 (Initial value) Section 13 Smart Card Interface 13.3 Operation 13.3.1 Overview The main features of the smart card interface are as follows. • One frame consists of 8-bit data plus a parity bit. • In transmission, a guard time of at least 2 etu (elementary time units: the time for transfer of one bit) is provided between the end of the parity bit and the start of the next frame. • If a parity error is detected during reception, a low error signal level is output for 1 etu period 10.5 etu after the start bit. • If an error signal is detected during transmission, the same data is transmitted automatically after the elapse of 2 etu or longer. • Only asynchronous communication is supported; there is no synchronous communication function. 13.3.2 Pin Connections Figure 13.2 shows a pin connection diagram for the smart card interface. In communication with a smart card, since both transmission and reception are carried out on a single data transmission line, the TxD pin and RxD pin should both be connected to this line. The data transmission line should be pulled up to VCC with a resistor. When the smart card uses the clock generated on the smart card interface, the SCK pin output is input to the CLK pin of the smart card. If the smart card uses an internal clock, this connection is unnecessary. The reset signal should be output from one of the H8/3024 Group’s generic ports. In addition to these pin connections. power and ground connections will normally also be necessary. Rev. 2.00 Sep 20, 2005 page 423 of 800 REJ09B0260-0200 Section 13 Smart Card Interface VCC TxD RxD I/O Data line SCK H8/3024 Group Px (port) chip Clock line Reset line CLK RST Smart card Card-processing device Figure 13.2 Smart Card Interface Connection Diagram Note: Setting both TE and RE to 1 without connecting a smart card enables closed transmission/reception, allowing self-diagnosis to be carried out. 13.3.3 Data Format Figure 13.3 shows the smart card interface data format. In reception in this mode, a parity check is carried out on each frame, and if an error is detected an error signal is sent back to the transmitting device to request retransmission of the data. In transmission, the error signal is sampled and the same data is retransmitted. Rev. 2.00 Sep 20, 2005 page 424 of 800 REJ09B0260-0200 Section 13 Smart Card Interface No parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp D7 Dp Output from transmitting device Parity error Ds D0 D1 D2 D3 D4 D5 D6 DE Output from transmitting device Legend Ds: D0 to D7: Dp: DE: Output from receiving device Start bit Data bits Parity bit Error signal Figure 13.3 Smart Card Interface Data Format The operating sequence is as follows. 1. When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor. 2. The transmitting device starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). 3. With the smart card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor. 4. The receiving device carries out a parity check. If there is no parity error and the data is received normally, the receiving device waits for reception of the next data. If a parity error occurs, however, the receiving device outputs an error signal (DE, low-level) to request retransmission of the data. After outputting the error signal for the prescribed length of time, the receiving device places the signal line in the high-impedance state again. The signal line is pulled high again by a pull-up resistor. 5. If the transmitting device does not receive an error signal, it proceeds to transmit the next data frame. If it receives an error signal, however, it returns to step 2 and transmits the same data again. Rev. 2.00 Sep 20, 2005 page 425 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.3.4 Register Settings Table 13.3 shows a bit map of the registers used in the smart card interface. Bits indicated as 0 or 1 must be set to the value shown. The setting of other bits is described in this section. Table 13.3 Smart Card Interface Register Settings Bit Register Address*1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SMR H'FFFB0 GM 0 1 O/E 1 0 CKS1 CKS0 BRR H'FFFB1 BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 SCR H'FFFB2 TIE RIE TE RE 0 0 BRR1 BRR0 2 * CKE1 CKE0 TDR H'FFFB3 TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0 SSR H'FFFB4 TDRE RDRF ORER ERS PER TEND 0 0 RDR H'FFFB5 RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0 SCMR H'FFFB6 — — — — SDIR SINV — SMIF Notes: — Unused bit. 1. Lower 20 bits of the address in advanced mode. 2. When GM is cleared to 0 in SMR, the CKE1 bit must also be cleared to 0. Serial Mode Register (SMR) Settings: Clear the GM bit to 0 when using the normal smart card interface mode, or set to 1 when using GSM mode. Clear the O/E bit to 0 if the smart card is of the direct convention type, or set to 1 if of the inverse convention type. Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator. See section 13.3.5, Clock. Bit Rate Register (BRR) Settings: BRR is used to set the bit rate. See section 13.3.5, Clock, for the method of calculating the value to be set. Serial Control Register (SCR) Settings: The TIE, RIE, TE, and RE bits have their normal serial communication functions. See section 12, Serial Communication Interface, for details. The CKE1 and CKE0 bits specify clock output. To disable clock output, clear these bits to 00; to enable clock output, set these bits to 01. Clock output is performed when the GM bit is set to 1 in SMR. Clock output can also be fixed low or high. Smart Card Mode Register (SCMR) Settings: Clear both the SDIR bit and SINV bit cleared to 0 if the smart card is of the direct convention type, and set both to 1 if of the inverse convention type. To use the smart card interface, set the SMIF bit to 1. Rev. 2.00 Sep 20, 2005 page 426 of 800 REJ09B0260-0200 Section 13 Smart Card Interface The register settings and examples of starting character waveforms are shown below for two smart cards, one following the direct convention and one the inverse convention. 1. Direct Convention (SDIR = SINV = O/E = 0) (Z) A Z Z A Z Z Z A A Z Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (Z) State With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order. In the example above, the first character data is H'3B. The parity bit is 1, following the even parity rule designated for smart cards. 2. Inverse Convention (SDIR = SINV = O/E = 1) (Z) A Z Z A A A A A A Z Ds D7 D6 D5 D4 D3 D2 D1 D0 Dp (Z) State With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to state Z, and transfer is performed in MSB-first order. In the example above, the first character data is H'3F. The parity bit is 0, corresponding to state Z, following the even parity rule designated for smart cards. In the H8/3024 Group, inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit inversion, the O/E bit in SMR must be set to odd parity mode. This applies to both transmission and reception. Rev. 2.00 Sep 20, 2005 page 427 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.3.5 Clock Only an internal clock generated by the on-chip baud rate generator can be used as the transmit/receive clock for the smart card interface. The bit rate is set with the bit rate register (BRR) and the CKS1 and CKS0 bits in the serial mode register (SMR). The equation for calculating the bit rate is shown below. Table 13.5 shows some sample bit rates. If clock output is selected with CKE0 set to 1, a clock with a frequency of 372 times the bit rate is output from the SCK pin. B= φ × 106 1488 × 22n–1 × (N + 1) where, N: BRR setting (0 ≤ N ≤ 255) B: Bit rate (bit/s) φ: Operating frequency (MHz) n: See table 13.4 Table 13.4 n-Values of CKS1 and CKS0 Settings n CKS1 CKS0 0 0 0 1 2 1 1 0 3 1 Note: If the gear function is used to divide the clock frequency, use the divided frequency to calculate the bit rate. The equation above applies directly to 1/1 frequency division. Table 13.5 Bit Rates (bits/s) for Various BRR Settings (When n = 0) φ (MHz) N 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 25.00 0 9600.0 13440.9 14400.0 17473.1 19200.0 21505.4 24193.5 33602.2 1 4800.0 6720.4 7200.0 8736.6 9600.0 10752.7 12096.8 16801.1 2 3200.0 4480.3 4800.0 5824.4 6400.0 7168.5 8064.5 11200.7 Note: Bit rates are rounded off to two decimal places. Rev. 2.00 Sep 20, 2005 page 428 of 800 REJ09B0260-0200 Section 13 Smart Card Interface The following equation calculates the bit rate register (BRR) setting from the operating frequency and bit rate. N is an integer from 0 to 255, specifying the value with the smaller error. N= φ 1488 × 22n–1 × B × 106 – 1 Table 13.6 BRR Settings for Typical Bit Rates (bits/s) (When n = 0) φ (MHz) 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 25.0 bit/s N Error N Error N Error N Error N Error N Error N Error N Error 9600 0 0.00 1 30 1 25 1 8.99 1 0.00 1 12.01 2 15.99 3 12.49 Table 13.7 Maximum Bit Rates for Various Frequencies (Smart Card Interface Mode) φ (MHz) Maximum Bit Rate (bits/s) N n 7.1424 9600 0 0 10.00 13441 0 0 10.7136 14400 0 0 13.00 17473 0 0 14.2848 19200 0 0 16.00 21505 0 0 18.00 24194 0 0 20.00 26882 0 0 25.00 33602 0 0 The bit rate error is given by the following equation: Error (%) = φ 1488 × 22n-1 × B × (N + 1) × 106 – 1 × 100 Rev. 2.00 Sep 20, 2005 page 429 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 13.3.6 Transmitting and Receiving Data Initialization: Before transmitting or receiving data, the smart card interface must be initialized as described below. Initialization is also necessary when switching from transmit mode to receive mode, or vice versa. 1. Clear the TE and RE bits to 0 in the serial control register (SCR). 2. Clear error flags ERS, PER, and ORER to 0 in the serial status register (SSR). 3. Set the parity bit (O/E) and baud rate generator select bits (CKS1 and CKS0) in the serial mode register (SMR). Clear the C/A, CHR, and MP bits to 0, and set the STOP and PE bits to 1. 4. Set the SMIF, SDIR, and SINV bits in the smart card mode register (SCMR). When the SMIF bit is set to 1, the TxD pin and RxD pin are both switched from port to SCI pin functions and go to the high-impedance state. 5. Set a value corresponding to the desired bit rate in the bit rate register (BRR). 6. Set the CKE0 bit in SCR. Clear the TIE, RIE, TE, RE, MPIE, TEIE, and CKE1 bits to 0. If the CKE0 bit is set to 1, the clock is output from the SCK pin. 7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE bit and RE bit at the same time, except for self-diagnosis. Transmitting Serial Data: As data transmission in smart card mode involves error signal sampling and retransmission processing, the processing procedure is different from that for the normal SCI. Figure 13.5 shows a sample transmission processing flowchart. 1. 2. 3. 4. Perform smart card interface mode initialization as described in Initialization above. Check that the ERS error flag is cleared to 0 in SSR. Repeat steps 2 and 3 until it can be confirmed that the TEND flag is set to 1 in SSR. Write the transmit data in TDR, clear the TDRE flag to 0, and perform the transmit operation. The TEND flag is cleared to 0. 5. To continue transmitting data, go back to step 2. 6. To end transmission, clear the TE bit to 0. The above processing may include interrupt handling. If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt requests are enabled, a transmit-data-empty interrupt (TXI) will be requested. If an error occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a transmit/receive-error interrupt (ERI) will be requested. Rev. 2.00 Sep 20, 2005 page 430 of 800 REJ09B0260-0200 Section 13 Smart Card Interface The timing of TEND flag setting depends on the GM bit in SMR. Figure 13.4 shows timing of TEND flag setting. For details, see Interrupt Operations in this section. Serial data Dp Ds DE Guard time (1) GM = 0 TEND (2) GM = 1 TEND 12.5 etu 11.0 etu Figure 13.4 Timing of TEND Flag Setting Rev. 2.00 Sep 20, 2005 page 431 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Start Initialization Start transmitting No FER/ERS = 0? Yes Error handling No TEND = 1? Yes Write transmit data in TDR, and clear TDRE flag to 0 in SSR No All data transmitted? Yes No FER/ERS = 0? Yes Error handling No TEND = 1? Yes Clear TE bit to 0 End Figure 13.5 Sample Transmission Processing Flowchart Rev. 2.00 Sep 20, 2005 page 432 of 800 REJ09B0260-0200 Section 13 Smart Card Interface TSR (shift register) TDR 1. Data write Data 1 2. Transfer from TDR to TSR Data 1 3. Serial data output Data 1 Data 1 Data remains in TDR Data 1 I/O signal output In case of normal transmission: TEND flag is set In case of transmit error: ERS flag is set Steps 2 and 3 above are repeated until the TEND flag is set. Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first transmission, D0 in MSB-first transmission) of the retransmit data to be transmitted next has been completed. Figure 13.6 Relation Between Transmit Operation and Internal Registers I/O data Ds Da Db Dc Dd De Df Dg Dh Dp DE Guard time TXI (TEND interrupt) 12.5 etu When GM = 0 11.0 etu When GM = 1 Figure 13.7 Timing of TEND Flag Setting Receiving Serial Data: Data reception in smart card mode uses the same processing procedure as for the normal SCI. Figure 13.8 shows a sample reception processing flowchart. 1. Perform smart card interface mode initialization as described in Initialization above. 2. Check that the ORER flag and PER flag are cleared to 0 in SSR. If either is set, perform the appropriate receive error handling, then clear both the ORER and the PER flag to 0. 3. Repeat steps 2 and 3 until it can be confirmed that the RDRF flag is set to 1. 4. Read the receive data from RDR. 5. To continue receiving data, clear the RDRF flag to 0 and go back to step 2. Rev. 2.00 Sep 20, 2005 page 433 of 800 REJ09B0260-0200 Section 13 Smart Card Interface 6. To end reception, clear the RE bit to 0. Start Initialization Start receiving ORER = 0 and PER = 0? No Yes Error handling No RDRF = 1? Yes Read RDR and clear RDRF flag to 0 in SSR No All data received? Yes Clear RE bit to 0 Figure 13.8 Sample Reception Processing Flowchart The above procedure may include interrupt handling. If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a receive-data-full interrupt (RXI) will be requested. If an error occurs in reception and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt (ERI) will be requested. For details, see Interrupt Operations in this section. If a parity error occurs during reception and the PER flag is set to 1, the received data is transferred to RDR, so the erroneous data can be read. Rev. 2.00 Sep 20, 2005 page 434 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Switching Modes: When switching from receive mode to transmit mode, first confirm that the receive operation has been completed, then start from initialization, clearing RE to 0 and setting TE to 1. The RDRF, PER, or ORER flag can be used to check that the receive operation has been completed. When switching from transmit mode to receive mode, first confirm that the transmit operation has been completed, then start from initialization, clearing TE to 0 and setting RE to 1. The TEND flag can be used to check that the transmit operation has been completed. Fixing Clock Output: When the GM bit is set to 1 in SMR, clock output can be fixed by means of the CKE1 and CKE0 bits in SCR. The minimum clock pulse width can be set to the specified width in this case. Figure 13.9 shows the timing for fixing clock output. In this example, GM = 1, CKE1 = 0, and the CKE0 bit is controlled. Specified pulse width Specified pulse width CKE1 value SCK SCR write (CKE0 = 0) SCR write (CKE0 = 1) Figure 13.9 Timing for Fixing Cock Output Interrupt Operations: The smart card interface has three interrupt sources: transmit-data-empty (TXI), transmit/receive-error (ERI), and receive-data-full (RXI). The transmit-end interrupt request (TEI) is not available in smart card mode. A TXI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or ERS flag is set to 1 in SSR. These relationships are shown in table 13.8. Rev. 2.00 Sep 20, 2005 page 435 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Table 13.8 Smart Card Interface Mode Operating States and Interrupt Sources Operating State Transmit Mode Receive Mode Flag Enable Bit Interrupt Source Normal operation TEND TIE TXI Error ERS RIE ERI Normal operation RDRF RIE RXI Error PER, ORER RIE ERI Examples of Operation in GSM Mode: When switching between smart card interface mode and software standby mode, use the following procedures to maintain the clock duty cycle. • Switching from smart card interface mode to software standby mode 1. Set the P94 data register (DR) and data direction register (DDR) to the values for the fixed output state in software standby mode. 2. Write 0 in the TE and RE bits in the serial control register (SCR) to stop transmit/receive operations. At the same time, set the CKE1 bit to the value for the fixed output state in software standby mode. 3. Write 0 in the CKE0 bit in SCR to stop the clock. 4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock output is fixed at the specified level. 5. Write H'00 in the serial mode register (SMR) and smart card mode register (SCMR). 6. Make the transition to the software standby state. • Returning from software standby mode to smart card interface mode 1'. Clear the software standby state. 2'. Set the CKE1 bit in SCR to the value for the fixed output state at the start of software standby (the current P94 pin state). 3'. Set smart card interface mode and output the clock. Clock signal generation is started with the normal duty cycle. Software standby Normal operation 1 2 3 4 5 6 Normal operation 1' 2' 3' Figure 13.10 Procedure for Stopping and Restarting the Clock Rev. 2.00 Sep 20, 2005 page 436 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Use the following procedure to secure the clock duty cycle after powering on. 1. The initial state is port input and high-impedance. Use pull-up or pull-down resistors to fix the potential. 2. Fix at the output specified by the CKE1 bit in SCR. 3. Set SMR and SCMR, and switch to smart card interface mode operation. 4. Set the CKE0 bit to 1 in SCR to start clock output. 13.4 Usage Notes The following points should be noted when using the SCI as a smart card interface. Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart card interface mode, the SCI operates on a base clock with a frequency of 372 times the transfer rate. In reception, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. The timing is shown in figure 13.11. 372 clocks 186 clocks 0 185 185 371 0 371 0 Internal base clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 13.11 Receive Data Sampling Timing in Smart Card Interface Mode Rev. 2.00 Sep 20, 2005 page 437 of 800 REJ09B0260-0200 Section 13 Smart Card Interface The receive margin can therefore be expressed as follows. Receive margin in smart card interface mode: M = (0.5 – 1 ) – (L – 0.5) F – 2N M: N: D: L: F: D – 0.5 (1 + F) × 100% N Receive margin (%) Ratio of clock frequency to bit rate (N = 372) Clock duty cycle (L = 0 to 1.0) Frame length (L =10) Absolute deviation of clock frequency From the above equation, if F = 0 and D = 0.5, the receive margin is as follows. When D = 0.5 and F = 0: M = (0.5 – 1/2 × 372) × 100% = 49.866% Rev. 2.00 Sep 20, 2005 page 438 of 800 REJ09B0260-0200 Section 13 Smart Card Interface Retransmission: Retransmission is performed by the SCI in receive mode and transmit mode as described below. • Retransmission when SCI is in Receive Mode Figure 13.12 illustrates retransmission when the SCI is in receive mode. 1. If an error is found when the received parity bit is checked, the PER bit is automatically set to 1. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The PER bit should be cleared to 0 in SSR before the next parity bit sampling timing. 2. The RDRF bit in SSR is not set for the frame in which the error has occurred. 3. If an error is found when the received parity bit is checked, the PER bit is not set to 1 in SSR. 4. If no error is found when the received parity bit is checked, the receive operation is assumed to have been completed normally, and the RDRF bit is automatically set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an RXI interrupt is requested. 5. When a normal frame is received, the data pin is held in three-state at the error signal transmission timing. Frame n Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp Frame n+1 Retransmitted frame DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Ds D0 D1 D2 D3 D4 RDRF [2] [4] [1] [3] PER Figure 13.12 Retransmission in SCI Receive Mode Rev. 2.00 Sep 20, 2005 page 439 of 800 REJ09B0260-0200 Section 13 Smart Card Interface • Retransmission when SCI is in Transmit Mode Figure 13.13 illustrates retransmission when the SCI is in transmit mode. 6. If an error signal is sent back from the receiving device after transmission of one frame is completed, the ERS bit is set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The ERS bit should be cleared to 0 in SSR before the next parity bit sampling timing. 7. The TEND bit in SSR is not set for the frame for which the error signal was received. 8. If an error signal is not sent back from the receiving device, the ERS flag is not set in SSR. 9. If an error signal is not sent back from the receiving device, transmission of one frame, including retransmission, is assumed to have been completed, and the TEND bit is set to 1 in SSR. If the TIE bit in SCR is set to the enable state, a TXI interrupt is requested. Frame n Frame n+1 Retransmitted frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Ds D0 D1 D2 D3 D4 TDRE Transfer from TDR to TSR Transfer from TDR to TSR Transfer from TDR to TSR TEND [7] [9] ERS [6] [8] Figure 13.13 Retransmission in SCI Transmit Mode The smart card interface installed in the H8/3024 Group supports an IC card (smart card) interface with provision for ISO/IEC7816-3 T=0 (character transmission). Therefore, block transfer operations are not supported (error signal transmission, detection, and automatic data retransmission are not performed). Rev. 2.00 Sep 20, 2005 page 440 of 800 REJ09B0260-0200 Section 14 A/D Converter Section 14 A/D Converter 14.1 Overview The H8/3024 Group includes a 10-bit successive-approximations A/D converter with a selection of up to eight analog input channels. When the A/D converter is not used, it can be halted independently to conserve power. For details see section 20.6, Module Standby Function. The H8/3024 Group supports 70/134-state conversion as a high-speed conversion mode. Note that it differs in this respect from the H8/3048 Group, which supports 134/266-state conversion. 14.1.1 Features A/D converter features are listed below. • 10-bit resolution • Eight input channels • Selectable analog conversion voltage range The analog voltage conversion range can be programmed by input of an analog reference voltage at the VREF pin. • High-speed conversion Conversion time: minimum 5.36 µs per channel • Two conversion modes Single mode: A/D conversion of one channel Scan mode: continuous A/D conversion on one to four channels • Four 16-bit data registers A/D conversion results are transferred for storage into data registers corresponding to the channels. • Sample-and-hold function • Three conversion start sources The A/D converter can be activated by software, an external trigger, or an 8-bit timer compare match. • A/D interrupt requested at end of conversion At the end of A/D conversion, an A/D end interrupt (ADI) can be requested. Rev. 2.00 Sep 20, 2005 page 441 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.1.2 Block Diagram Figure 14.1 shows a block diagram of the A/D converter. Internal data bus AVSS AN 0 ADCR ADCSR ADDRD – AN 2 AN 4 ADDRC + AN 1 AN 3 ADDRB 10-bit D/A ADDRA VREF Successiveapproximations register AVCC Bus interface Module data bus Analog multiplexer AN 5 φ/4 Comparator Control circuit Sample-andhold circuit φ/8 AN 6 AN 7 ADI interrupt signal ADTRG Compare match A0 ADTE 8-bit timer 8TCSR0 Legend: ADCR: ADCSR: ADDRA: ADDRB: ADDRC: ADDRD: A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D Figure 14.1 A/D Converter Block Diagram Rev. 2.00 Sep 20, 2005 page 442 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.1.3 Pin Configuration Table 14.1 summarizes the A/D converter’s input pins. The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). AVCC and AVSS are the power supply for the analog circuits in the A/D converter. VREF is the A/D conversion reference voltage. Table 14.1 A/D Converter Pins Pin Name Abbreviation I/O Function Analog power supply pin AVCC Input Analog power supply Analog ground pin AVSS Input Analog ground and reference voltage Reference voltage pin VREF Input Analog reference voltage Analog input pin 0 AN0 Input Group 0 analog inputs Analog input pin 1 AN1 Input Analog input pin 2 AN2 Input Analog input pin 3 AN3 Input Analog input pin 4 AN4 Input Analog input pin 5 AN5 Input Analog input pin 6 AN6 Input Analog input pin 7 AN7 Input A/D external trigger input pin ADTRG Input Group 1 analog inputs External trigger input for starting A/D conversion Rev. 2.00 Sep 20, 2005 page 443 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.1.4 Register Configuration Table 14.2 summarizes the A/D converter’s registers. Table 14.2 A/D Converter Registers Address*1 Name Abbreviation R/W Initial Value H'FFFE0 A/D data register A H ADDRAH R H'00 H'FFFE1 A/D data register A L ADDRAL R H'00 H'FFFE2 A/D data register B H ADDRBH R H'00 H'FFFE3 A/D data register B L ADDRBL R H'00 H'FFFE4 A/D data register C H ADDRCH R H'00 H'FFFE5 A/D data register C L ADDRCL R H'00 H'FFFE6 A/D data register D H ADDRDH R H'00 H'FFFE7 A/D data register D L ADDRDL R H'FFFE8 A/D control/status register ADCSR H'00 2 * R/(W) H'00 H'FFFE9 A/D control register ADCR R/W Notes: 1. Lower 20 bits of the address in advanced mode. 2. Only 0 can be written in bit 7, to clear the flag. Rev. 2.00 Sep 20, 2005 page 444 of 800 REJ09B0260-0200 H'7E Section 14 A/D Converter 14.2 Register Descriptions 14.2.1 A/D Data Registers A to D (ADDRA to ADDRD) ADDRn 14 12 10 8 6 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 — — — — — — 15 Bit 13 11 9 7 Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Read/Write (n = A to D) R R R R R R R R R R R R R R R R A/D conversion data 10-bit data giving an A/D conversion result Reserved bits The four A/D data registers (ADDRA to ADDRD) are 16-bit read-only registers that store the results of A/D conversion. An A/D conversion produces 10-bit data, which is transferred for storage into the A/D data register corresponding to the selected channel. The upper 8 bits of the result are stored in the upper byte of the A/D data register. The lower 2 bits are stored in the lower byte. Bits 5 to 0 of an A/D data register are reserved bits that are always read as 0. Table 14.3 indicates the pairings of analog input channels and A/D data registers. The CPU can always read and write the A/D data registers. The upper byte can be read directly, but the lower byte is read through a temporary register (TEMP). For details see section 14.3, CPU Interface. The A/D data registers are initialized to H'0000 by a reset and in standby mode. Table 14.3 Analog Input Channels and A/D Data Registers (ADDRA to ADDRD) Analog Input Channel Group 0 Group 1 A/D Data Register AN0 AN4 ADDRA AN1 AN5 ADDRB AN2 AN6 ADDRC AN3 AN7 ADDRD Rev. 2.00 Sep 20, 2005 page 445 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.2.2 A/D Control/Status Register (ADCSR) Bit Initial value Read/Write 7 6 5 4 3 2 1 0 ADF ADIE ADST SCAN CKS CH2 CH1 CH0 0 R/(W)* 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W Channel select 2 to 0 These bits select analog input channels Clock select Selects the A/D conversion time Scan mode Selects single mode or scan mode A/D start Starts or stops A/D conversion A/D interrupt enable Enables and disables A/D end interrupts A/D end flag Indicates end of A/D conversion Note: * Only 0 can be written, to clear the flag. ADCSR is an 8-bit readable/writable register that selects the mode and controls the A/D converter. ADCSR is initialized to H'00 by a reset and in standby mode. Bit 7—A/D End Flag (ADF): Indicates the end of A/D conversion. Bit 7 ADF 0 Description [Clearing condition] Read ADF when ADF =1, then write 0 in ADF. 1 [Setting conditions] • Single mode: A/D conversion ends • Scan mode: A/D conversion ends in all selected channels Rev. 2.00 Sep 20, 2005 page 446 of 800 REJ09B0260-0200 (Initial value) Section 14 A/D Converter Bit 6—A/D Interrupt Enable (ADIE): Enables or disables the interrupt (ADI) requested at the end of A/D conversion. Bit 6 ADIE Description 0 A/D end interrupt request (ADI) is disabled 1 A/D end interrupt request (ADI) is enabled (Initial value) Bit 5—A/D Start (ADST): Starts or stops A/D conversion. The ADST bit remains set to 1 during A/D conversion. It can also be set to 1 by external trigger input at the ADTRG pin, or by an 8-bit timer compare match. Bit 5 ADST Description 0 A/D conversion is stopped 1 Single mode: A/D conversion starts; ADST is automatically cleared to 0 when conversion ends. (Initial value) Scan mode: A/D conversion starts and continues, cycling among the selected channels, until ADST is cleared to 0 by software, by a reset, or by a transition to standby mode. Bit 4—Scan Mode (SCAN): Selects single mode or scan mode. For further information on operation in these modes, see section 14.4, Operation. Clear the ADST bit to 0 before switching the conversion mode. Bit 4 SCAN Description 0 Single mode 1 Scan mode (Initial value) Bit 3—Clock Select (CKS): Selects the A/D conversion time. Clear the ADST bit to 0 before switching the conversion time. Bit 3 CKS Description 0 Conversion time = 134 states (maximum) 1 Conversion time = 70 states (maximum) (Initial value) Rev. 2.00 Sep 20, 2005 page 447 of 800 REJ09B0260-0200 Section 14 A/D Converter Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): These bits and the SCAN bit select the analog input channels. Clear the ADST bit to 0 before changing the channel selection. Group Selection Channel Selection Description CH2 CH1 CH0 Single Mode Scan Mode 0 0 0 AN0 (Initial value) AN0 1 AN1 AN0, AN1 0 AN2 AN0 to AN2 1 AN3 AN0 to AN3 0 AN4 AN4 1 AN5 AN4, AN5 0 AN6 AN4 to AN6 1 AN7 AN4 to AN7 1 1 0 1 14.2.3 A/D Control Register (ADCR) Bit 7 6 5 4 3 2 1 0 TRGE — — — — — — — Initial value 0 1 1 1 1 1 1 0 Read/Write R/W — — — — — — R/W Reserved bits Trigger enable Enables or disables starting of A/D conversion by an external trigger or 8-bit timer compare match ADCR is an 8-bit readable/writable register that enables or disables starting of A/D conversion by external trigger input or an 8-bit timer compare match signal. ADCR is initialized to H'7E by a reset and in standby mode. Rev. 2.00 Sep 20, 2005 page 448 of 800 REJ09B0260-0200 Section 14 A/D Converter Bit 7—Trigger Enable (TRGE): Enables or disables starting of A/D conversion by an external trigger or 8-bit timer compare match. Bit 7 TRGE 0 1 Description Starting of A/D conversion by an external trigger or 8-bit timer compare match is disabled (Initial value) A/D conversion is started at the falling edge of the external trigger signal (ADTRG) or by an 8-bit timer compare match External trigger pin and 8-bit timer selection is performed by the 8-bit timer. For details, see section 9, 8-Bit Timers. Bits 6 to 1—Reserved: These bits cannot be modified and are always read as 1. Bit 0—Reserved: This bit can be read or written, but must not be set to 1. 14.3 CPU Interface ADDRA to ADDRD are 16-bit registers, but they are connected to the CPU by an 8-bit data bus. Therefore, although the upper byte can be be accessed directly by the CPU, the lower byte is read through an 8-bit temporary register (TEMP). An A/D data register is read as follows. When the upper byte is read, the upper-byte value is transferred directly to the CPU and the lower-byte value is transferred into TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading an A/D data register, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 14.2 shows the data flow for access to an A/D data register. Rev. 2.00 Sep 20, 2005 page 449 of 800 REJ09B0260-0200 Section 14 A/D Converter Upper-byte read Module data bus CPU (H'AA) Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Lower-byte read CPU (H'40) Module data bus Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Figure 14.2 A/D Data Register Access Operation (Reading H'AA40) Rev. 2.00 Sep 20, 2005 page 450 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.4 Operation The A/D converter operates by successive approximations with 10-bit resolution. It has two operating modes: single mode and scan mode. 14.4.1 Single Mode (SCAN = 0) Single mode should be selected when only one A/D conversion on one channel is required. A/D conversion starts when the ADST bit is set to 1 by software, or by external trigger input. The ADST bit remains set to 1 during A/D conversion and is automatically cleared to 0 when conversion ends. When conversion ends the ADF flag is set to 1. If the ADIE bit is also set to 1, an ADI interrupt is requested at this time. To clear the ADF flag to 0, first read ADCSR, then write 0 in ADF. When the mode or analog input channel must be switched during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the mode or channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 14.3 shows a timing diagram for this example. 1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). 2. When A/D conversion is completed, the result is transferred into ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. 3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The routine reads ADCSR, then writes 0 in the ADF flag. 6. The routine reads and processes the conversion result (ADDRB). 7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps 2 to 7 are repeated. Rev. 2.00 Sep 20, 2005 page 451 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 452 of 800 REJ09B0260-0200 Note: * Vertical arrows ( ) indicate instructions executed by software. ADDRD ADDRC ADDRB Read conversion result A/D conversion result (2) Idle Clear * A/D conversion result (1) A/D conversion (2) Set * Read conversion result Idle State of channel 3 (AN 3) ADDRA Idle State of channel 2 (AN 2) Idle Clear * State of channel 1 (AN 1) A/D conversion (1) Set * Idle Idle A/D conversion starts State of channel 0 (AN 0) ADF ADST ADIE Set * Section 14 A/D Converter Figure 14.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) Section 14 A/D Converter 14.4.2 Scan Mode (SCAN = 1) Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by software or external trigger input, A/D conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1 or AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the A/D data registers corresponding to the channels. When the mode or analog input channel selection must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1. A/D conversion will start again from the first channel in the group. The ADST bit can be set at the same time as the mode or channel selection is changed. Typical operations when three channels in group 0 (AN0 to AN2) are selected in scan mode are described next. Figure 14.4 shows a timing diagram for this example. 1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1). 2. When A/D conversion of the first channel (AN0) is completed, the result is transferred into ADDRA. Next, conversion of the second channel (AN1) starts automatically. 3. Conversion proceeds in the same way through the third channel (AN2). 4. When conversion of all selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1, an ADI interrupt is requested when A/D conversion ends. 5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0). Rev. 2.00 Sep 20, 2005 page 453 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 454 of 800 REJ09B0260-0200 Figure 14.4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected) Idle Idle Idle A/D conversion (1) Transfer Idle A/D conversion (3) Idle Idle Clear*1 Idle A/D conversion result (3) A/D conversion result (2) A/D conversion result (4) Idle A/D conversion (5)*2 A/D conversion time A/D conversion (4) A/D conversion result (1) A/D conversion (2) Idle Notes: 1. Vertical arrows ( ) indicate instructions executed by software. 2. Data currently being converted is ignored. ADDRD ADDRC ADDRB ADDRA State of channel 3 (AN 3) State of channel 2 (AN 2) State of channel 1 (AN 1) State of channel 0 (AN 0) ADF ADST Set *1 Continuous A/D conversion Clear*1 Section 14 A/D Converter Section 14 A/D Converter 14.4.3 Input Sampling and A/D Conversion Time The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 14.5 shows the A/D conversion timing. Table 14.4 indicates the A/D conversion time. As indicated in figure 14.5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 14.4. In scan mode, the values given in table 14.4 apply to the first conversion. In the second and subsequent conversions the conversion time is fixed at 128 states when CKS = 0 or 66 states when CKS = 1. (1) φ Address bus (2) Write signal Input sampling timing ADF t SPL tD t CONV Legend: ADCSR write cycle (1): ADCSR address (2): Synchronization delay tD : t SPL : Input sampling time t CONV : A/D conversion time Figure 14.5 A/D Conversion Timing Rev. 2.00 Sep 20, 2005 page 455 of 800 REJ09B0260-0200 Section 14 A/D Converter Table 14.4 A/D Conversion Time (Single Mode) CKS = 0 CKS = 1 Symbol Min Typ Max Min Typ Max Synchronization delay tD 6 — 9 4 — 5 Input sampling time tSPL — 31 — — 15 — A/D conversion time tCONV 131 — 134 69 — 70 Note: Values in the table are numbers of states. 14.4.4 External Trigger Input Timing A/D conversion can be externally triggered When the TRGE bit is set to 1 in ADCR and the 8-bit timer's ADTE bit is cleared to 0, external trigger input is enabled at the ADTRG pin. A high-tolow transition at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as if the ADST bit had been set to 1 by software. Figure 14.6 shows the timing. φ ADTRG Internal trigger signal ADST A/D conversion Figure 14.6 External Trigger Input Timing 14.5 Interrupts The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt request can be enabled or disabled by the ADIE bit in ADCSR. Rev. 2.00 Sep 20, 2005 page 456 of 800 REJ09B0260-0200 Section 14 A/D Converter 14.6 Usage Notes When using the A/D converter, note the following points: 1. Analog Input Voltage Range During A/D conversion, the voltages input to the analog input pins ANn should be in the range AVSS ≤ ANn ≤ VREF. 2. Relationships of AVCC and AVSS to VCC and VSS AVCC, AVSS, VCC, and VSS should be related as follows: AVSS = VSS. AVCC and AVSS must not be left open, even if the A/D converter is not used. 3. VREF Programming Range The reference voltage input at the VREF pin should be in the range VREF ≤ AVCC. 4. Note on Board Design In board layout, separate the digital circuits from the analog circuits as much as possible. Particularly avoid layouts in which the signal lines of digital circuits cross or closely approach the signal lines of analog circuits. Induction and other effects may cause the analog circuits to operate incorrectly, or may adversely affect the accuracy of A/D conversion. The analog input signals (AN0 to AN7), analog reference voltage (VREF), and analog supply voltage (AVCC) must be separated from digital circuits by the analog ground (AVSS). The analog ground (AVSS) should be connected to a stable digital ground (VSS) at one point on the board. 5. Note on Noise To prevent damage from surges and other abnormal voltages at the analog input pins (AN0 to AN7) and analog reference voltage pin (VREF), connect a protection circuit like the one in figure 14.7 between AVCC and AVSS. The bypass capacitors connected to AVCC and VREF and the filter capacitors connected to AN0 to AN7 must be connected to AVSS. If filter capacitors like the ones in figure 14.7 are connected, the voltage values input to the analog input pins (AN0 to AN7) will be smoothed, which may give rise to error. Error can also occur if A/D conversion is frequently performed in scan mode so that the current that charges and discharges the capacitor in the sample-and-hold circuit of the A/D converter becomes greater than that input to the analog input pins via input impedance (Rin). The circuit constants should therefore be selected carefully. Rev. 2.00 Sep 20, 2005 page 457 of 800 REJ09B0260-0200 Section 14 A/D Converter AV CC VREF Rin*2 *1 100 Ω AN0 to AN7 *1 0.1 µF AV SS Notes: 1. 10 µF 0.01 µF 2. Rin: input impedance Figure 14.7 Example of Analog Input Protection Circuit Table 14.5 Analog Input Pin Ratings Item Min Max Unit Analog input capacitance — 20 pF — 10* kΩ Allowable signal-source impedance Note: * When conversion time = 134 states, VCC = 4.0 V to 5.5 V, and φ ≤ 13 MHz. For details, see section 21, Electrical Characteristics. 10 kΩ AN0 to AN7 To A/D converter 20 pF Figure 14.8 Analog Input Pin Equivalent Circuit Note: Numeric values are approximate, except in table 14.5 Rev. 2.00 Sep 20, 2005 page 458 of 800 REJ09B0260-0200 Section 14 A/D Converter 6. A/D Conversion Accuracy Definitions A/D conversion accuracy in the H8/3024 Group is defined as follows: • Resolution Digital output code length of A/D converter • Offset error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from minimum voltage value 0000000000 to 0000000001 (figure 14.10) • Full-scale error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from 1111111110 to 1111111111 (figure 14.10) • Quantization error • • Intrinsic error of the A/D converter; 1/2 LSB (figure 14.9) Nonlinearity error Deviation from ideal A/D conversion characteristic in range from zero volts to full scale, exclusive of offset error, full-scale error, and quantization error. Absolute accuracy Deviation of digital value from analog input value, including offset error, full-scale error, quantization error, and nonlinearity error. Rev. 2.00 Sep 20, 2005 page 459 of 800 REJ09B0260-0200 Section 14 A/D Converter Digital output 111 Ideal A/D conversion characteristic 110 101 100 011 010 Quantization error 001 000 1/8 2/8 3/8 4/8 5/8 6/8 7/8 FS Analog input voltage Figure 14.9 A/D Converter Accuracy Definitions (1) Full-scale error Digital output Ideal A/D conversion characteristic Nonlinearity error Actual A/D conversion characteristic FS Offset error Analog input voltage Figure 14.10 A/D Converter Accuracy Definitions (2) Rev. 2.00 Sep 20, 2005 page 460 of 800 REJ09B0260-0200 Section 14 A/D Converter 7. Allowable Signal-Source Impedance The analog inputs of the H8/3024 Group are designed to assure accurate conversion of input signals with a signal-source impedance not exceeding 10 kΩ. The reason for this rating is that it enables the input capacitor in the sample-and-hold circuit in the A/D converter to charge within the sampling time. If the sensor output impedance exceeds 10 kΩ, charging may be inadequate and the accuracy of A/D conversion cannot be guaranteed. If a large external capacitor is provided in single mode, then the internal 10-kΩ input resistance becomes the only significant load on the input. In this case the impedance of the signal source is not a problem. A large external capacitor, however, acts as a low-pass filter. This may make it impossible to track analog signals with high dv/dt (e.g. a variation of 5 mV/µs) (figure 14.11). To convert high-speed analog signals or to use scan mode, insert a low-impedance buffer. 8. Effect on Absolute Accuracy Attaching an external capacitor creates a coupling with ground, so if there is noise on the ground line, it may degrade absolute accuracy. The capacitor must be connected to an electrically stable ground, such as AVSS. If a filter circuit is used, be careful of interference with digital signals on the same board, and make sure the circuit does not act as an antenna. H8/3024 Group Sensor output impedance Sensor input 10 kΩ Up to 10 kΩ Low-pass filter C up to 0.1 µF Equivalent circuit of A/D converter Cin = 15 pF 20 pF Figure 14.11 Analog Input Circuit (Example) Rev. 2.00 Sep 20, 2005 page 461 of 800 REJ09B0260-0200 Section 14 A/D Converter Rev. 2.00 Sep 20, 2005 page 462 of 800 REJ09B0260-0200 Section 15 D/A Converter Section 15 D/A Converter 15.1 Overview The H8/3024 Group includes a D/A converter with two channels. 15.1.1 Features D/A converter features are listed below. • • • • • Eight-bit resolution Two output channels Conversion time: maximum 10 µs (with 20-pF capacitive load) Output voltage: 0 V to VREF D/A outputs can be sustained in software standby mode Rev. 2.00 Sep 20, 2005 page 463 of 800 REJ09B0260-0200 Section 15 D/A Converter 15.1.2 Block Diagram Bus interface Figure 15.1 shows a block diagram of the D/A converter. Module data bus DACR 8-bit D/A DADR1 DA 0 DADR0 AVCC DASTCR VREF DA 1 AVSS Control circuit Legend: DACR: DADR0: DADR1: DASTCR: D/A control register D/A data register 0 D/A data register 1 D/A standby control register Figure 15.1 D/A Converter Block Diagram Rev. 2.00 Sep 20, 2005 page 464 of 800 REJ09B0260-0200 Internal data bus Section 15 D/A Converter 15.1.3 Pin Configuration Table 15.1 summarizes the D/A converter's input and output pins. Table 15.1 D/A Converter Pins Pin Name Abbreviation I/O Analog power supply pin AVSS Input Analog power supply and reference voltage Analog ground pin AVSS Input Analog ground and reference voltage Analog output pin 0 DA0 Output Analog output, channel 0 Analog output pin 1 DA1 Output Analog output, channel 1 Reference voltage input pin VREF Input Analog reference voltage 15.1.4 Function Register Configuration Table 15.2 summarizes the D/A converter's registers. Table 15.2 D/A Converter Registers Address* Name Abbreviation R/W Initial Value H'FFF9C D/A data register 0 DADR0 R/W H'00 H'FFF9D D/A data register 1 DADR1 R/W H'00 H'FFF9E D/A control register DACR R/W H'1F H'EE01A D/A standby control register DASTCR R/W H'FE Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 465 of 800 REJ09B0260-0200 Section 15 D/A Converter 15.2 Register Descriptions 15.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) Bit 7 6 5 4 3 2 1 0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W The D/A data registers (DADR0 and DADR1) are 8-bit readable/writable registers that store the data to be converted. When analog output is enabled, the D/A data register values are constantly converted and output at the analog output pins. The D/A data registers are initialized to H'00 by a reset and in standby mode. When the DASTE bit is set to 1 in the D/A standby control register (DASTCR), the D/A registers are not initialized in software standby mode. 15.2.2 D/A Control Register (DACR) Bit 7 6 5 4 3 2 1 0 DAOE1 DAOE0 DAE — — — — — Initial value 0 0 0 1 1 1 1 1 Read/Write R/W R/W R/W — — — — — D/A enable Controls D/A conversion D/A output enable 0 Controls D/A conversion and analog output D/A output enable 1 Controls D/A conversion and analog output DACR is an 8-bit readable/writable register that controls the operation of the D/A converter. DACR is initialized to H'1F by a reset and in standby mode. When the DASTE bit is set to 1 in the D/A standby control register (DASTCR), the D/A registers are not initialized in software standby mode. Rev. 2.00 Sep 20, 2005 page 466 of 800 REJ09B0260-0200 Section 15 D/A Converter Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output. Bit 7 DAOE1 Description 0 DA1 analog output is disabled 1 Channel-1 D/A conversion and DA1 analog output are enabled Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output. Bit 6 DAOE0 Description 0 DA0 analog output is disabled 1 Channel-0 D/A conversion and DA0 analog output are enabled Bit 5—D/A Enable (DAE): Controls D/A conversion, together with bits DAOE0 and DAOE1. When the DAE bit is cleared to 0, analog conversion is controlled independently in channels 0 and 1. When the DAE bit is set to 1, analog conversion is controlled together in channels 0 and 1. Output of the conversion results is always controlled independently by DAOE0 and DAOE1. Bit 7 DAOE1 Bit 6 Bit 5 DAOE0 DAE Description 0 0 — D/A conversion is disabled in channels 0 and 1 0 1 0 D/A conversion is enabled in channel 0 0 1 1 D/A conversion is enabled in channels 0 and 1 1 0 0 D/A conversion is disabled in channel 0 D/A conversion is disabled in channel 1 D/A conversion is enabled in channel 1 1 0 1 D/A conversion is enabled in channels 0 and 1 1 1 — D/A conversion is enabled in channels 0 and 1 When the DAE bit is set to 1, even if bits DAOE0 and DAOE1 in DACR and the ADST bit in ADCSR are cleared to 0, the same current is drawn from the analog power supply as during A/D and D/A conversion. Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 467 of 800 REJ09B0260-0200 Section 15 D/A Converter 15.2.3 D/A Standby Control Register (DASTCR) DASTCR is an 8-bit readable/writable register that enables or disables D/A output in software standby mode. Bit 7 6 5 4 3 2 1 0 — — — — — — — DASTE Initial value 1 1 1 1 1 1 1 0 Read/Write — — — — — — — R/W Reserved bits D/A standby enable Enables or disables D/A output in software standby mode DASTCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 1—Reserved: These bits cannot be modified and are always read as 1. Bit 0—D/A Standby Enable (DASTE): Enables or disables D/A output in software standby mode. Bit 0 DASTE Description 0 D/A output is disabled in software standby mode 1 D/A output is enabled in software standby mode 15.3 (Initial value) Operation The D/A converter has two built-in D/A conversion circuits that can perform conversion independently. D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value is modified, conversion of the new data begins immediately. The conversion results are output when bits DAOE0 and DAOE1 are set to 1. Rev. 2.00 Sep 20, 2005 page 468 of 800 REJ09B0260-0200 Section 15 D/A Converter An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 15.2. 1. Data to be converted is written in DADR0. 2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The converted result is output after the conversion time. The output value is DADR contents × VREF 256 Output of this conversion result continues until the value in DADR0 is modified or the DAOE0 bit is cleared to 0. 3. If the DADR0 value is modified, conversion starts immediately, and the result is output after the conversion time. 4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin. DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle φ Address Conversion data 1 DADR0 Conversion data 2 DAOE0 DA 0 Conversion result 2 Conversion result 1 High-impedance state t DCONV t DCONV Legend: t DCONV : D/A conversion time Figure 15.2 Example of D/A Converter Operation Rev. 2.00 Sep 20, 2005 page 469 of 800 REJ09B0260-0200 Section 15 D/A Converter 15.4 D/A Output Control In the H8/3024 Group, D/A converter output can be enabled or disabled in software standby mode. When the DASTE bit is set to 1 in DASTCR, D/A converter output is enabled in software standby mode. The D/A converter registers retain the values they held prior to the transition to software standby mode. When D/A output is enabled in software standby mode, the reference supply current is the same as during normal operation. Rev. 2.00 Sep 20, 2005 page 470 of 800 REJ09B0260-0200 Section 16 RAM Section 16 RAM 16.1 Overview The H8/3024 Group has high-speed static RAM on-chip. The RAM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, making the RAM useful for rapid data transfer. The on-chip RAM can be enabled or disabled with the RAM enable bit (RAME) in the system control register (SYSCR). When the on-chip RAM is disabled, that area is assigned to external space in the expanded modes. The on-chip RAM specifications for the product lineup are shown in table 16.1. Table 16.1 H8/3024 Group On-Chip RAM Specifications H8/3024 Mask H8/3024F-ZTAT ROM Version H8/3026 Mask H8/3026F-ZTAT ROM Version RAM size 4 kbytes 4 kbytes 8 kbytes 8 kbytes Address Modes 1, 2, 7 assignment H'FEF20 to H'FFF1F H'FEF20 to H'FFF1F H'FDF20 to H'FFF1F H'FDF20 to H'FFF1F Modes 3, 4, 5 H'FFEF20 to H'FFFF1F H'FFEF20 to H'FFFF1F H'FFDF20 to H'FFFF1F H'FFDF20 to H'FFFF1F Mode 6 H'FE20 to H'FF1F H'FE20 to H'FF1F H'FD20 to H'FF1F H'FD20 to H'FF1F Rev. 2.00 Sep 20, 2005 page 471 of 800 REJ09B0260-0200 Section 16 RAM 16.1.1 Block Diagram Figure 16.1 shows a block diagram of the on-chip RAM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) Bus interface H'FEF20* H'FEF21* H'FEF22* H'FEF23* SYSCR On-chip RAM H'FFF1E* Even addresses Legend: SYSCR: System control register H'FFF1F* Odd addresses Note: * This example is of the H8/3024 mask ROM version operating in mode 7. The lower 20 bits of the address are shown. Figure 16.1 RAM Block Diagram 16.1.2 Register Configuration The on-chip RAM is controlled by SYSCR. Table 16.2 gives the address and initial value of SYSCR. Table 16.2 System Control Register Address* Name Abbreviation R/W Initial Value H'EE012 System control register SYSCR R/W H'09 Note: * Lower 20 bits of the address in advanced mode. Rev. 2.00 Sep 20, 2005 page 472 of 800 REJ09B0260-0200 Section 16 RAM 16.2 System Control Register (SYSCR) Bit 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME Initial value 0 0 0 0 1 0 0 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W RAM enable bit Enables or disables on-chip RAM Software standby output port enable NMI edge select User bit enable Standby timer select 2 to 0 Software standby One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3, System Control Register (SYSCR). Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized at the rising edge of the input at the RES pin. It is not initialized in software standby mode. Bit 0 RAME Description 0 On-chip RAM is disabled 1 On-chip RAM is enabled (Initial value) Rev. 2.00 Sep 20, 2005 page 473 of 800 REJ09B0260-0200 Section 16 RAM 16.3 Operation When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to the addresses shown in table 16.1 are directed to the on-chip RAM. In modes 1 to 5 (expanded modes), when the RAME bit is cleared to 0, the off-chip address space is accessed. In mode 6, 7 (single-chip mode), when the RAME bit is cleared to 0, the on-chip RAM is not accessed: read access always results in H'FF data, and write access is ignored. Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written and read by word access. It can also be written and read by byte access. Byte data is accessed in two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed in two states using all 16 bits of the data bus. Rev. 2.00 Sep 20, 2005 page 474 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.1 Overview The H8/3026F-ZTAT version has 256 kbytes of on-chip flash memory. The flash memory is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) as shown in table 17.1. The on-chip flash memory product (H8/3026F-ZTAT version) can be erased and programmed onboard, as well as with a special-purpose PROM programmer. Table 17.1 Operating Modes and ROM Mode Pins Mode MD2 MD1 MD0 On-Chip ROM Mode 1 (expanded 1-Mbyte mode with on-chip ROM disabled) 0 0 1 Disabled (external address area) Mode 2 (expanded 1-Mbyte mode with on-chip ROM disabled) 0 1 0 Mode 3 (expanded 16-Mbyte mode with on-chip ROM disabled) 0 1 1 Mode 4 (expanded 16-Mbyte mode with on-chip ROM disabled) 1 0 0 Mode 5 (expanded 16-Mbyte mode with on-chip ROM enabled) 1 0 1 Mode 6 (single-chip normal mode) 1 1 0 Mode 7 (single-chip advanced mode) 1 1 1 Enabled Rev. 2.00 Sep 20, 2005 page 475 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.2 Features The H8/3026F-ZTAT version has 256 kbytes of on-chip flash memory. The features of the flash memory are summarized below. • Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed in block units. To erase the entire flash memory, each block must be erased in turn. In block erasing, 4-kbyte, 32kbyte, and 64-kbyte blocks can be set arbitrarily. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent approximately to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.) per block. • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode • Automatic bit rate adjustment For data transfer in boot mode, the H8/3026F-ZTAT version chip’s bit rate can be automatically adjusted to match the transfer bit rate of the host. • Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. • Protect modes There are three protect modes—hardware, software, and error—which allow protected status to be designated for flash memory program/erase/verify operations • PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. Rev. 2.00 Sep 20, 2005 page 476 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.2.1 Block Diagram Internal address bus Module bus Internal data bus (16 bits) FLMCR1 FLMCR2 EBR1 Bus interface/controller Operating mode FWE pin Mode pins EBR2 RAMCR Flash memory (256 kbytes) Legend FLMCR1: FLMCR2: EBR1: EBR2: RAMCR: Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM control register Figure 17.1 Block Diagram of Flash Memory Rev. 2.00 Sep 20, 2005 page 477 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.2.2 Pin Configuration The flash memory is controlled by means of the pins shown in table 17.2. Table 17.2 Flash Memory Pins Pin Name Abbreviation I/O Function Reset RES Input Reset Flash write enable FWE Input Flash program/erase protection by hardware Mode 2 MD2 Input Sets H8/3026F-ZTAT version operating mode Mode 1 MD1 Input Sets H8/3026F-ZTAT version operating mode Mode 0 MD0 Input Sets H8/3026F-ZTAT version operating mode Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input 17.2.3 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 17.3. Table 17.3 Flash Memory Registers Register Name Abbreviation R/W Initial Value Address*1 Flash memory control register 1 FLMCR1 R/W H'00*2 H'EE030 Flash memory control register 2 FLMCR2 R H'00 H'EE031 Erase block register 1 EBR1 R/W H'00 H'EE032 Erase block register 2 EBR2 R/W H'00 H'EE033 RAM control register RAMCR R/W H'F0 H'EE077 Notes: FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR are 8-bit registers, and should be accessed by byte access. These registers are used only in the versions with on-chip flash memory, and are not provided in the versions with on-chip mask ROM. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are invalid. 1. Lower 16 bits of address in advanced mode. 2. When a high level is input to the FWE pin, the initial value is H'80. Rev. 2.00 Sep 20, 2005 page 478 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.3 Register Descriptions 17.3.1 Flash Memory Control Register 1 (FLMCR1) Bit 7 6 5 4 3 2 1 0 SWE ESU PSU EV PV E P Initial value FWE —* 0 0 0 0 0 0 0 Read/Write R R/W R/W R/W R/W R/W R/W R/W Note: * Determined by the state of the FWE pin. FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. In mode 6 the FWE pin must be fixed low since flash memory on-board programming modes are not supported. When the on-chip flash memory is disabled, a read access to this register will return H'00, and writes are invalid. When setting bits 6 to 0 in this register, one bit must be set one at a time. Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to bits ESU, PSU, EV, and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this register to prevent erroneous programming or erasing. 2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as normal on-chip ROM, bits 6 to 0 in this register must be cleared. Rev. 2.00 Sep 20, 2005 page 479 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Bit 7—Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE Description 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Bit 6—Software Write Enable (SWE): Enables or disables flash memory programming and erasing. (This bit should be set when setting bits 5 to 0, EBR1 bits 7 to 0, and EBR2 bits 3 to 0.) Bit 6 SWE Description 0 Programming/erasing disabled 1 Programming/erasing enabled (Initial value) [Setting condition] When FWE = 1 Note: Do not execute a SLEEP instruction while the SWE bit is set to 1. Bit 5—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1 (do not set the SWE, PSU, EV, PV, E, or P bit at the same time). Bit 5 ESU Description 0 Erase setup cleared 1 Erase setup [Setting condition] When FWE = 1 and SWE = 1 Rev. 2.00 Sep 20, 2005 page 480 of 800 REJ09B0260-0200 (Initial value) Section 17 Flash Memory [H8/3026F-ZTAT Version] Bit 4—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1 (do not set the SWE, ESU, EV, PV, E, or P bit at the same time). Bit 4 PSU Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 3—Erase-Verify Mode (EV): Selects erase-verify mode transition or clearing. (Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.) Bit 3 EV Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 2—Program-Verify Mode (PV): Selects program-verify mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.) Bit 2 PV Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Rev. 2.00 Sep 20, 2005 page 481 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Bit 1—Erase Mode (E): Selects erase mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.) Bit 1 E Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Note: Do not access the flash memory while the E bit is set. Bit 0—Program (P): Selects program mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, PV, or E bit at the same time.) Bit 0 P Description 0 Program mode cleared 1 Transition to program mode (Initial value) [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Note: Do not access the flash memory while the P bit is set. 17.3.2 Flash Memory Control Register 2 (FLMCR2) Bit 7 6 5 4 3 2 1 0 FLER — — — — — — — Initial value 0 0 0 0 0 0 0 0 Read/Write R R R R R R R R FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When the on-chip flash memory is disabled, a read will return H'00. Note: FLMCR2 is a read-only register, and should not be written to. Rev. 2.00 Sep 20, 2005 page 482 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER Description 0 Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset (RES pin or WDT reset) or hardware standby mode 1 (Initial value) An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting conditions] • When flash memory is read during programming/erasing (including a vector read or instruction fetch, but excluding a read of the RAM area overlapping flash memory space) • Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) • When a SLEEP instruction (including software standby) is executed during programming/erasing • When the bus is released during programming/erasing Bits 6 to 0—Reserved: These bits are always read as 0. 17.3.3 Erase Block Register 1 (EBR1) Bit 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one bit can be set in EBR1 and EBR2 together; do not set two or Rev. 2.00 Sep 20, 2005 page 483 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] more bits at the same time. When the on-chip flash memory is disabled, a read access to this register will return H'00, and erasing is disabled. The flash memory block configuration is shown in table 17.4. To erase the entire flash memory, each block must be erased in turn. As the H8/3026F-ZTAT version does not support on-board programming modes in mode 6, EBR1 register bits cannot be set to 1 in this mode. 17.3.4 Erase Block Register 2 (EBR2) Bit 7 6 5 4 3 2 1 0 — — — — EB11 EB10 EB9 EB8 Initial value 0 0 0 0 0 0 0 0 Read/Write R R R R R/W R/W R/W R/W EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, and when a low level is input to the FWE pin. When a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set, it is initialized to bit 0. When a bit in EBR2 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one bit can be set in EBR1 and EBR2 together; do not set two or more bits at the same time. When the on-chip flash memory is disabled, a read will return H'00, and erasing is disabled. The flash memory block configuration is shown in table 17.4. To erase the entire flash memory, each block must be erased in turn. As the H8/3026F-ZTAT version does not support on-board programming modes in mode 6, EBR2 register bits cannot be set to 1 in this mode. Note: Bits 7 to 4 in this register are read-only. These bits must not be set to 1. If bits 7 to 4 are set when an EBR1/EBR2 bit is set, EBR1/EBR2 will be initialized to H'00. Rev. 2.00 Sep 20, 2005 page 484 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Table 17.4 Flash Memory Erase Blocks Block (Size) Addresses EB0 (4 kbytes) H'000000 to H'000FFF EB1 (4 kbytes) H'001000 to H'001FFF EB2 (4 kbytes) H'002000 to H'002FFF EB3 (4 kbytes) H'003000 to H'003FFF EB4 (4 kbytes) H'004000 to H'004FFF EB5 (4 kbytes) H'005000 to H'005FFF EB6 (4 kbytes) H'006000 to H'006FFF EB7 (4 kbytes) H'007000 to H'007FFF EB8 (32 kbytes) H'008000 to H'00FFFF EB9 (64 kbytes) H'010000 to H'01FFFF EB10 (64 kbytes) H'020000 to H'02FFFF EB11 (64 kbytes) H'030000 to H'03FFFF 17.3.5 RAM Control Register (RAMCR) Bit 7 6 5 4 3 2 1 0 — — — — RAMS RAM2 RAM1 RAM0 Initial value 1 1 1 1 0 0 0 0 Read/Write R R R R R/W R/W R/W R/W RAMCR specifies the area of flash memory to be overlapped with part of RAM when emulating realtime flash memory programming. RAMCR is initialized to H'00 by a reset and in hardware standby mode. RAMCR settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 17.5. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 485 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS Description 0 Emulation not selected Program/erase-protection of all flash memory blocks is disabled 1 (Initial value) Emulation selected Program/erase-protection of all flash memory blocks is enabled Bits 2 to 0—Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM. (See table 17.5.) Table 17.5 Flash Memory Area Divisions RAM Area Block Name RAMS RAM2 RAM1 RAM0 H'FFE000 to H'FFEFFF 4-kbyte RAM area 0 * * * H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0 H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1 H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0 H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1 H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0 H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1 H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0 H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1 *: Don’t care Note: Flash memory emulation by RAM is not supported in mode 6 (single-chip normal mode); therefore, although these bits can be written, they should not be set to 1. When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. Rev. 2.00 Sep 20, 2005 page 486 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.4 Overview of Operation 17.4.1 Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the H8/3026F-ZTAT version enters one of the operating modes shown in figure 17.2. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. Boot mode and user program mode cannot be used in the H8/3026F-ZTAT version’s mode 6 (normal mode with on-chip ROM enabled). Rev. 2.00 Sep 20, 2005 page 487 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Reset state *3 *1 User mode with on-chip ROM enabled RES = 0 RES = 0 *2 *4 RES = 0 FWE = 0 *5 RES = 0 *4 PROM mode User program mode *1 Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. RAM emulation possible 2. The H8/3026F-ZTAT is placed in PROM mode by means of a dedicated PROM writer. 3. MD2, MD1, MD0 = (1, 0, 1) (1, 1, 0) (1, 1, 1) FWE = 0 4. MD2, MD1, MD0 = (1, 0, 1) (1, 1, 1) FWE = 1 5. MD2, MD1, MD0 (0, 0, 1) (0, 1, 1) FWE = 1 Figure 17.2 Flash Memory Related State Transitions State transitions between the normal and user modes and on-board programming mode are performed by changing the FWE pin level from high to low or from low to high. To prevent misoperation (erroneous programming or erasing) in these cases, the bits in the flash memory control register (FLMCR1) should be cleared to 0 before making such a transition. After the bits are cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is insufficient. Rev. 2.00 Sep 20, 2005 page 488 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.4.2 On-Board Programming Modes Example of Boot Mode Operation 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. Host 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3026F-ZTAT version (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Programming control program New application program New application program H8/3026F-ZTAT version H8/3026F-ZTAT version SCI Boot program Flash memory SCI Boot program Flash memory RAM RAM Boot program area Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard Host Programming control program 4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program H8/3026F-ZTAT version H8/3026F-ZTAT version SCI Boot program Flash memory RAM Flash memory Boot program area Flash memory prewrite-erase Programming control program SCI Boot program RAM Boot program area New application program Programming control program Program execution state Rev. 2.00 Sep 20, 2005 page 489 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Example of User Program Mode Operation 1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/ erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory. 2. Programming/erase control program transfer When user program mode is entered, user software recognizes this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host Host Programming/erase control program New application program New application program H8/3026F-ZTAT version H8/3026F-ZTAT version SCI Boot program Flash memory SCI Boot program Flash memory RAM FWE assessment program FWE assessment program Transfer program Transfer program RAM Programming/erase control program Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host Host New application program H8/3026F-ZTAT version H8/3026F-ZTAT version SCI Boot program Flash memory RAM FWE assessment program SCI Boot program Flash memory RAM FWE assessment program Transfer program Transfer program Programming/erase control program Flash memory erase Programming/erase control program New application program Program execution state Rev. 2.00 Sep 20, 2005 page 490 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.4.3 Flash Memory Emulation in RAM In the H8/3026F-ZTAT version, flash memory programming can be emulated in real time by overlapping the flash memory with part of RAM (“overlap RAM”). When the emulation block set in RAMCR is accessed while the emulation function is being executed, data written in the overlap RAM is read. Emulation should be performed in user mode or user program mode. SCI Flash memory RAM Emulation block Overlap RAM Application program (Emulation is performed on data written in RAM) Execution state Figure 17.3 Reading Overlap RAM Data in User Mode/User Program Mode When overlap RAM data is confirmed, clear the RAMS bit to cancel RAM overlap, and actually perform writes to the flash memory in user program mode. When the programming control program is transferred to RAM in on-board programming mode, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. Rev. 2.00 Sep 20, 2005 page 491 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] SCI RAM Flash memory Program data Overlap RAM (program data) Application program Programming control program Execution state Figure 17.4 Writing Overlap RAM Data in User Program Mode 17.4.4 Block Configuration The flash memory in the H8/3026F-ZTAT version is divided into three 64-kbyte blocks, one 32kbyte block, and eight 4-kbyte blocks. Erasing can be carried out in block units. Address H'00000 4 kbytes × 8 32 kbytes 64 kbytes 256 kbytes 64 kbytes 64 kbytes Address H'3FFFF Rev. 2.00 Sep 20, 2005 page 492 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.5 On-Board Programming Mode When pins are set to on-board programming mode and a reset-start is executed, the chip enters the on-board programming state in which on-chip flash memory programming, erasing, and verifying can be carried out. There are two operating modes in this mode—boot mode and user program mode. The pin settings for entering each mode are shown in table 17.6. For a diagram of the transitions to the various flash memory modes, see figure 17.2. Boot mode and user program mode cannot be used in the H8/3026F-ZTAT version’s mode 6 (onchip ROM enabled). Table 17.6 On-Board Programming Mode Settings Mode Boot mode User program mode FWE MD2 MD1 MD0 *1 *2 0 1 Mode 7 0*2 1 1 Mode 5 1 0 1 Mode 7 1 1 1 Mode 5 1 0 Notes: 1. For the High level input timing, see items 6 and 7 of Notes on Using the Boot Mode. 2. In boot mode, the MD2 setting should be the inverse of the input. In the boot mode in the H8/3026F-ZTAT version, the levels of the mode pins (MD2 to MD0) are reflected in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control register (MDCR). Rev. 2.00 Sep 20, 2005 page 493 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.5.1 Boot Mode When boot mode is used, a flash memory programming control program must be prepared beforehand in the host, and SCI channel 1, which is to be used, must be set to asynchronous mode. When a reset-start is executed after setting the H8/3026F-ZTAT version’s pins to boot mode, the boot program already incorporated in the MCU is activated, and the programming control program prepared beforehand in the host is transmitted sequentially to the H8/3026F-ZTAT version, using the SCI. In the H8/3026F-ZTAT version, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address (H'FFE720) of the programming control program area and the programming control program execution state is entered (flash memory programming/erasing can be performed). Figure 17.5 shows a system configuration diagram when using boot mode, and figure 17.6 shows the boot program mode execution procedure. H8/3026F-ZTAT version Flash memory Host Reception of programming data Transmission of verify data RxD1 SCI1 TxD1 On-chip RAM Figure 17.5 System Configuration When Using Boot Mode Rev. 2.00 Sep 20, 2005 page 494 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate H8/3026F-ZTAT version measure low period of H'00 data transmitted by host H8/3026F-ZTAT version calculate bit rate and sets value in bit rate register After bit rate adjustment, H8/3026F-ZTAT version transmit one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, H8/3026F-ZTAT version transmit one H'AA byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte H8/3026F-ZTAT version transmit received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units H8/3026F-ZTAT version transmit received programming control program to host as verify data (echo-back) n+1→n Transfer received programming control program to on-chip RAM n = N? No Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, H8/3026F-ZTAT version transmit one H'AA byte to host Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error indication, and the erase operation and subsequent operations are halted. Figure 17.6 Boot Mode Execution Procedure Rev. 2.00 Sep 20, 2005 page 495 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Automatic SCI Bit Rate Adjustment: Start bit D0 D1 D2 D3 D4 D5 D6 Low period (9 bits) measured (H'00 data) D7 Stop bit High period (1 or more bits) When boot mode is initiated, the H8/3026F-ZTAT version measure the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as 8-bit data, 1 stop bit, no parity. The H8/3026F-ZTAT version calculate the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the H8/3026F-ZTAT version. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the H8/3026F-ZTAT version’s system clock frequency, there will be a discrepancy between the bit rates of the host and the H8/3026F-ZTAT version. To ensure correct SCI operation, the host’s transfer bit rate should be set to 4800, 9600, or 19,200 bps*. Table 17.7 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the H8/3026F-ZTAT version bit rate is possible. The boot program should be executed within this system clock range. Table 17.7 System Clock Frequencies for which Automatic Adjustment of H8/3026F-ZTAT Version Bit Rate is Possible Host Bit Rate (bps) System Clock Frequency for which Automatic Adjustment of H8/3026F-ZTAT Version Bit Rate is Possible (MHz) 19,200 16 to 25 9,600 8 to 25 4,800 4 to 25 Note: * Only use a setting of 4800, 9600, or 19200 bps for the host’s bit rate. No other settings can be used. Although the H8/3026F-ZTAT version may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 17.7, a degree of error will arise between the bit rates of the host and the H8/3026F-ZTAT version, and subsequent transfer will not be performed normally. Therefore, only a combination of bit rate and system clock frequency within one of the ranges shown in table 17.7 can be used for boot mode execution. Rev. 2.00 Sep 20, 2005 page 496 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the user program is transferred via the SCI, as shown in figure 17.7. The boot program area becomes available when a transition is made to the execution state for the user program transferred to RAM. H'FFDF20 Boot program area H'FFE71F H'FFE720 User program transfer area H'FFFF1F Note: The boot program area cannot be used until a transition is made to the execution state for the user program transferred to RAM. Note also that the boot program remains in this area in RAM even after control branches to the user program. Figure 17.7 RAM Areas in Boot Mode Notes on Use of Boot Mode: 1. When the H8/3026F-ZTAT version chip comes out of reset in boot mode, it measures the low period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD1 input. 2. In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. 3. Interrupts cannot be used while the flash memory is being programmed or erased. 4. The RxD1 and TxD1 lines should be pulled up on the board. 5. Before branching to the user program the H8/3026F-ZTAT version terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits to 0 in the serial control register (SCR)), but the adjusted bit rate value remains set in the bit rate register Rev. 2.00 Sep 20, 2005 page 497 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] (BRR). The transmit data output pin, TxD1, goes to the high-level output state (P91DDR = 1 in P9DDR, P91DR = 1 in P9DR). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the user program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the user program. The initial values of other on-chip registers are not changed. 6. Boot mode can be entered by setting pins MD0 to MD2 and FWE in accordance with the mode setting conditions shown in table 17.6, and then executing a reset-start. a. When switching from boot mode to normal mode, the boot mode state within the chip must first be cleared by reset input via the RES pin*1. The RES pin must be held low for at least 20 system clock cycles.*3 b. Do not change the input levels of the mode pins (MD2 to MD0) or the FWE pin in boot mode. To change the mode, the RES pin must first be driven low to set the reset state. Also, if a watchdog timer reset occurs in the boot mode state, the MCU’s internal state will not be cleared, and the on-chip boot program will be restarted regardless of the mode pin states. c. The FWE pin must not be driven low while the boot program is running or flash memory is being programmed or erased*2. 7. If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output signals (CSn, AS, RD, LWR, HWR) may also change according to the change in the MCU’s operating mode. Therefore, care must be taken to make pin settings to prevent these pins from being used directly as output signal pins during a reset, or to prevent collision with signals outside the MCU. H8/3026F-ZTAT version CSn MD2 MD1 MD0 FWE RES Rev. 2.00 Sep 20, 2005 page 498 of 800 REJ09B0260-0200 External memory, etc. System control unit Section 17 Flash Memory [H8/3026F-ZTAT Version] Notes: 1. Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. 2. For further information on FWE application and disconnection, see section 17.11, Flash Memory Programming and Erasing Precautions. 3. See section 4.2.2, Reset Sequence, and section 17.11, Flash Memory Programming and Erasing Precautions. The H8/3026F-ZTAT version requires a minimum of 20 system clock cycles for a reset during operation. 17.5.2 User Program Mode When set to user program mode, the H8/3026F-ZTAT version can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip ROM (mode 5 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 5 and 7. Flash memory programming/erasing should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. The flash memory itself cannot be read while being programmed or erased, so the program that performs programming should be placed in external memory or transferred to RAM and executed there. Figure 17.8 shows the execution procedure when user program mode is entered during program execution in RAM. It is also possible to start from user program mode in a reset-start. Rev. 2.00 Sep 20, 2005 page 499 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Write FWE assessment program and transfer program (and programming/erase control program if necessary) beforehand MD2–MD0 = 101 or 111 Reset-start Transfer programming/erase control program to RAM Branch to programming/erase control program in RAM area FWE = high (user program mode) Execute programming/erase control program in RAM (flash memory rewriting) Clear SWE bit, then release FWE (user program mode clearing) Branch to application program in flash memory Notes: 1. Do not apply a constant high level to the FWE pin. A high level should be applied to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation by RAM). Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. For further information on FWE application and disconnection, see section 17.11, Flash Memory Programming and Erasing Precautions. 3. In order to execute a normal read of flash memory in user program mode, the programming/erase program must not be executing. It is thus necessary to ensure that bits 6 to 0 in FLMCR1 are cleared to 0. Figure 17.8 Example of User Program Mode Execution Procedure Rev. 2.00 Sep 20, 2005 page 500 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.6 Flash Memory Programming/Erasing A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes for addresses H'000000 to H'03FFFF are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. See section 17.11, Flash Memory Programming and Erasing Precautions, for points to be noted when programming or erasing the flash memory. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 21.2.6, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming must be executed in the erased state. Do not perform additional programming on addresses that have already been programmed. Rev. 2.00 Sep 20, 2005 page 501 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] *3 E=1 Erase setup state Erase mode E=0 Normal mode FWE = 1 ESU = 1 ESU = 0 *1 FWE = 0 EV = 1 *2 On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state Erase-verify mode EV = 0 PSU = 1 *4 P=1 PSU = 0 Program setup state Program mode P=0 PV = 1 PV = 0 Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state. Figure 17.9 FLMCR1 Bit Settings and State Transitions Rev. 2.00 Sep 20, 2005 page 502 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.6.1 Program Mode When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 17.10 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 21.19 in section 21.2.6, Flash Memory Characteristics. Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) µs. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see “Notes on Program/Program-Verify Mode.” 17.6.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write Rev. 2.00 Sep 20, 2005 page 503 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 17.10) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE. Notes on Program/Program-Verify Procedure 1. The program/program-verify procedure for the H8/3026F-ZTAT version uses a 128-byte-unit programming algorithm. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the H8/3026F-ZTAT version, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the H8/3026F-ZTAT version, the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N). b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. Rev. 2.00 Sep 20, 2005 page 504 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 21.2.6, Flash Memory Characteristics. Item Symbol Item Symbol Wait time after P bit setting tsp When reprogramming loop count (n) is 1 to 6 tsp30 When reprogramming loop count (n) is 7 or more In case of additional programming processing* tsp200 tsp10 Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6. 6. The program/program-verify flowchart for the H8/3026F-ZTAT version is shown in figure 17.10. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM. Rev. 2.00 Sep 20, 2005 page 505 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Reprogram Data Computation Table (D) Result of Verify-Read after Write Pulse (X) Application (V) Result of Operation 0 0 1 Programming completed: reprogramming processing not to be executed 0 1 0 Programming incomplete: reprogramming processing to be executed 1 0 1 1 1 1 Still in erased state: no action Comments Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed Additional-Programming Data Computation Table Result of Verify-Read after Write Pulse (Y) (X') Application (V) Result of Operation Comments 0 0 0 Programming by write pulse application judged to be completed: additional programming processing to be executed 0 1 1 Programming by write pulse application incomplete: additional programming processing not to be executed 1 0 1 Programming already completed: additional programming processing not to be executed 1 1 1 Still in erased state: no action Legend: (Y): Data of bits on which additional programming is executed (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop 7. It is necessary to execute additional programming processing during the course of the H8/3026F-ZTAT version program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished. Rev. 2.00 Sep 20, 2005 page 506 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Write pulse application subroutine Start of programming Sub-Routine Write Pulse START Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. Set SWE bit in FLMCR1 WDT enable Wait (tsswe) µs Set PSU bit in FLMCR1 Wait (tspsu) µs *7 *4 n=1 Start of programming Set P bit in FLMCR1 *7 Store 128-byte program data in program data area and reprogram data area m=0 Wait (tsp) µs * 5* 7 Consecutively write 128-byte data in reprogram data area in RAM to flash memory Programming halted Clear P bit in FLMCR1 *1 Sub-Routine-Call Wait (tcp) µs *7 Clear PSU bit in FLMCR1 Wait (tcpsu) µs See Note 6 for pulse width Write pulse Set PV bit in FLMCR1 Wait (tspv) µs *7 *7 H'FF dummy write to verify address Disable WDT Wait (tspvr) µs End Sub *2 Write data = verify data? NG Increment address Note 6: Write Pulse Width Number of Writes (n) Write Time (tsp) µs 1 2 3 4 5 6 7 8 9 10 11 12 13 30 30 30 30 30 30 200 200 200 200 200 200 200 998 999 1000 n←n+1 *7 Read verify data m=1 OK 6≥n? NG OK Additional-programming data computation Transfer additional-programming data to additional-programming data area *4 *3 Reprogram data computation Transfer reprogram data to reprogram data area NG 200 200 200 *4 128-byte data verification completed? OK Clear PV bit in FLMCR1 Reprogram Note: Use a 10 µs write pulse for additional programming. Wait (tcpv) µs RAM 6 ≥ n? *7 NG OK Consecutively write 128-byte data in additional1 programming data area in RAM to flash memory * Program data storage area (128 bytes) Sub-Routine-Call Reprogram data storage area (128 bytes) Write Pulse (Additional programming) Additional-programming data storage area (128 bytes) m = 0? NG *7 n ≥ N? NG OK Clear SWE bit in FLMCR1 OK Clear SWE bit in FLMCR1 Wait (tcswe) µs Wait (tcswe) µs Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. End of programming Programming failure 2. Verify data is read in 16-bit (word) units. 3. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. 4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional-programming data must be provided in RAM. The contents of the reprogram data area and additional-programming data area are modified as programming proceeds. 5. A write pulse of 30 µs or 200 µs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 µs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. 7. The wait times and value of N are shown in section 21.2.6, Flash Memory Characteristics. *7 Additional-Programming Data Computation Table Reprogram Data Computation Table Original Data (D) 0 Verify Data (V) 0 Reprogram Data (X) 1 0 1 0 1 0 1 1 1 1 Comments Reprogram Data Verify Data Additional(X') (V) Programming Data (Y) Comments Programming completed 0 0 0 Additional programming to be executed Programming incomplete; reprogram 0 1 1 Additional programming not to be executed 1 0 1 Additional programming not to be executed 1 1 1 Additional programming not to be executed Still in erased state; no action Figure 17.10 Program/Program-Verify Flowchart (128-Byte Programming) Rev. 2.00 Sep 20, 2005 page 507 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.6.3 Erase Mode When erasing flash memory, the single-block erase flowchart shown in figure 17.11 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in table 21.19 in section 21.2.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register 1 and 2 (EBR1, EBR2) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than (tse) ms + (tsesu + tce + tcesu) µs as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. Rev. 2.00 Sep 20, 2005 page 508 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.6.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) µs. If erasing multiple blocks, set a single bit in EBR1/EBR2 for the next block to be erased, and repeat the erase/erase-verify sequence as before. Rev. 2.00 Sep 20, 2005 page 509 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Start *1 Perform erasing in block units. Set SWE bit in FLMCR1 Wait (tsswe) µs *5 n=1 Set EBR1 or EBR2 *3, *4 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) µs *5 Start of erase Set E bit in FLMCR1 Wait (tse) ms *5 Clear E bit in FLMCR1 End of erase Wait (tce) µs *5 Clear ESU bit in FLMCR1 Wait (tcesu) µs *5 Disable WDT Set EV bit in FLMCR1 Wait (tsev) µs n←n+1 *5 Set block start address as verify address H'FF dummy write to verify address Increment address Wait (tsevr) µs *5 Read verify data *2 Verify data = all 1s? No Yes No Last address of block? Re-erase Yes Clear EV bit in FLMCR1 Wait (tcev) µs Clear EV bit in FLMCR1 *5 Wait (tcev) µs *5 *5 n ≥ N? Yes Clear SWE bit in FLMCR1 Clear SWE bit in FLMCR1 Wait (tcswe) µs End of erasing Notes: 1. 2. 3. 4. 5. No *5 Wait (tcswe) µs *5 Erase failure Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block registers (EBR1 and EBR2). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 21.2.6, Flash Memory Characteristics. Figure 17.11 Erase/Erase-Verify Flowchart (Single-Block Erasing) Rev. 2.00 Sep 20, 2005 page 510 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.7 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware, software, and error protection. 17.7.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. In this state, the settings in flash memory control register 1 (FLMCR1) and erase block registers 1 and 2 (EBR1, EBR2) are reset. In the error protection state, the FLMCR1, EBR1, and EBR2 settings are retained; the P bit and E bit can be set, but a transition is not made to program mode or erase mode. (See table 17.8.) Table 17.8 Hardware Protection Function Item Description Program FWE pin protection • When a low level is input to the FWE pin, FLMCR1, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Not Not Not possible*1 possible*3 possible Reset/ standby protection • In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. Not possible Not Not possible*3 possible • In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section.*4 • When a microcomputer operation error (error generation (FLER = 1)) was detected while flash memory was being programmed/erased, error protection is enabled. At this time, the FLMCR1, EBR1, and EBR2 settings are held, but programming/erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. Not possible Not Possible possible*3 *2 Error protection Erase Verify Notes: 1. The RAM area that overlapped flash memory is deleted. Rev. 2.00 Sep 20, 2005 page 511 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify operation on the block being erased. 3. All blocks are unerasable and block-by-block specification is not possible. 4. See section 4.2.2, Reset Sequence, and section 17.11, Flash Memory Programming and Erasing Precautions. The H8/3026F-ZTAT version requires a minimum of 20 system clock cycles for a reset during operation. 17.7.2 Software Protection Software protection can be implemented by setting the erase block register 1 (EBR1), erase block register 2 (EBR2), and the RAMS bit in the RAM control register (RAMCR). With software protection, setting the P or E bit in the flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 17.9.) Table 17.9 Software Protection Functions Item Description Block protection • — Erase protection can be set for individual blocks by settings in erase block register 1 (EBR1) and erase block register 2 (EBR2)*2. However, programming protection is disabled. • Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. • Setting the RAMS bit 1 in RAMCR places all blocks in the program/erase-protected state. Emulation protection Program Erase Verify Not possible Possible Not Not 1 3 possible* possible* Notes: 1. The RAM area overlapping flash memory can be written to. 2. When not erasing, set EBR1 and EBR2 to H'00. 3. All blocks are unerasable and block-by-block specification is not possible. Rev. 2.00 Sep 20, 2005 page 512 of 800 REJ09B0260-0200 Possible Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.7.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing*1, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in the flash memory status register (FLMSR2) and the error protection state is entered. FLMCR1, FLMCR2, EBR1, and EBR2 settings*3 are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by resetting the P or E bit in FLMCR. However, PV and EV bit setting is enabled, and a transition can be made to verify mode*2. FLER bit setting conditions are as follows: 1. When flash memory is read during programming/erasing (including a vector read or instruction fetch) 2. Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the bus is released during programming/erasing Error protection is released only by a RES pin or WDT reset, or in hardware standby mode. Notes: 1. State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled in this state. 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify on the block being erased. 3. FLMCR1, EBR1, and EBR2 can be written to. However, the registers are initialized if a transition is made to software standby mode while in the error protection state. Figure 17.12 shows the flash memory state transition diagram. Rev. 2.00 Sep 20, 2005 page 513 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Program mode Erase mode Reset or standby (hardware protection) RES = 0 or STBY = 0 RD VF PR ER INIT FLER = 0 RD VF PR ER FLER = 0 Error occurrence (software standby) RES = 0 or STBY = 0 Error occurrence RES = 0 or STBY = 0 Software standby mode Error protection mode RD VF PR ER FLER = 1 Software standby mode release FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode (software standby) RD VF PR ER INIT FLER = 1 FLMCR1, EBR1, EBR2 initialization state RD: VF: PR: ER: Memory read possible Verify-read possible Programming possible Erasing possible RD: VF: PR: ER: INIT: Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register initialization state Figure 17.12 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing. Rev. 2.00 Sep 20, 2005 page 514 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.8 Flash Memory Emulation in RAM Making a setting in the RAM control register (RAMCR) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMCR setting has been made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 17.13 shows an example of emulation of realtime flash memory programming. Start of emulation program Set RAMCR Write tuning data to overlap RAM Execute application program No Tuning OK? Yes Clear RAMCR Write to flash memory emulation block End of emulation program Figure 17.13 Flowchart of Flash Memory Emulation in RAM Rev. 2.00 Sep 20, 2005 page 515 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] This area can be accessed from both the RAM area and flash memory area H'00000 EB0 H'01000 EB1 H'02000 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 EB7 H'08000 H'FFE000 H'FFEFFF Flash memory EB8 to EB11 On-chip RAM H'FFFF1F H'3FFFF Figure 17.14 Example of RAM Overlap Operation Rev. 2.00 Sep 20, 2005 page 516 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Example of Flash Memory Block Area EB0 Overlapping 1. Set bits RAMS and RAM2 to RAM0 in RAMCR to 1,0, 0, 0, to overlap part of RAM onto the area (EB0) for which realtime programming is required. 2. Realtime programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB0). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in FLMCR1 will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM. 4. As in on-board programming mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit is set to 1 in FLMCR1, even while the emulation function is being used. 5. When the emulation function is used, NMI input is prohibited when the P bit or E bit is set to 1 in FLMCR1, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0 while a high level is being input to the FWE pin. Rev. 2.00 Sep 20, 2005 page 517 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.9 NMI Input Disabling Conditions All interrupts, including NMI input, should be disabled while flash memory is being programmed or erased (while the P bit or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. NMI input during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the NMI exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If NMI input occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling NMI input, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests (exception handling and bus release), including NMI, must therefore be restricted inside and outside the MCU during FWE application. NMI input is also disabled in the error protection state and while the P or E bit remains set in FLMCR1 during flash memory emulation in RAM. Notes: 1. This is the interval until a branch is made to the boot program area in the on-chip RAM (This branch takes place immediately after transfer of the user program is completed). Consequently, after the branch to the RAM area, NMI input is enabled except during programming and erasing. Interrupt requests must therefore be disabled inside and outside the MCU until the user program has completed initial programming (including the vector table and the NMI interrupt handling routine). 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P bit or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). • If the entry in the interrupt vector table has not been programmed yet, interrupt exception handling will not be executed correctly. Rev. 2.00 Sep 20, 2005 page 518 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.10 Flash Memory PROM Mode The H8/3026F-ZTAT version have a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Renesas Technology microcomputer device type with 256-kbyte on-chip flash memory. 17.10.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 17.10. In the H8/3026F-ZTAT version PROM mode, only the socket adapters shown in this table should be used. Table 17.10 H8/3026F-ZTAT Version Socket Adapter Product Codes Product Code Package Socket Adapter Product Code HD64F3026F 100-pin QFP (FP-100B) TBD HD64F3026TE 100-pin TQFP (TFP-100B) TBD HD64F3026FP 100-pin QFP (FP-100A) TBD HD64F3026F 100-pin QFP (FP-100B) TBD HD64F3026TE 100-pin TQFP (TFP-100B) TBD HD64F3026FP 100-pin QFP (FP-100A) TBD Manufacturer MINATO ELECTRONICS INC. DATA I/O JAPAN CO. Figure 17.15 shows the memory map in PROM mode. MCU mode H'000000 H8/3026F-ZTAT version PROM mode H'00000 On-chip ROM H'03FFFF H'3FFFF Figure 17.15 Memory Map in PROM Mode Rev. 2.00 Sep 20, 2005 page 519 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.10.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Renesas Technology. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3026F-ZTAT version does not support a product identification mode as used with general-purpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3026F-ZTAT version. 17.11 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Renesas Technology microcomputer device type with 256-kbyte on-chip flash memory. 2. Powering on and off (see figures 17.16 to 17.18) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Failure to do so may result in overprogramming or overerasing due to MCU runaway, and loss of normal memory cell operation. Rev. 2.00 Sep 20, 2005 page 520 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 3. FWE application/disconnection FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: • Apply FWE when the VCC voltage has stabilized within its rated voltage range. If FWE is applied when the MCU’s VCC power supply is not within its rated voltage range, MCU operation will be unstable and flash memory may be erroneously programmed or erased. • Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). When VCC power is turned on, hold the RES pin low for the duration of the oscillation settling time before applying FWE. Do not apply FWE when oscillation has stopped or is unstable. • In boot mode, apply and disconnect FWE during a reset. In a transition to boot mode, FWE = 1 input and MD2–MD0 setting should be performed while the RES input is low. FWE and MD2–MD0 pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. When making a transition from boot mode to another mode, also, a mode programming setup time is necessary with respect to the reset release timing. In a reset during operation, the RES pin must be held low for a minimum of 20 system clock cycles. • In user program mode, FWE can be switched between high and low level regardless of RES input. FWE input can also be switched during execution of a program in flash memory. • Do not apply FWE if program runaway has occurred. During FWE application, the program execution state must be monitored using the watchdog timer or some other means. • Disconnect FWE only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, E, and P bits are not set by mistake when applying or disconnecting FWE. Rev. 2.00 Sep 20, 2005 page 521 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 4. Do not apply a constant high level to the FWE pin. T prevent erroneous programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation using RAM). A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Also note that access to the flash memory space by means of a MOV instruction, etc., is not permitted while the P bit or E bit is set. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. A wait time is necessary after the SWE bit is cleared. For details see table 21.19 in section 21.2.6, Flash Memory Characteristics. 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations (including emulation in RAM). Bus release must also be disabled. 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. 9. Before programming, check that the chip is correctly mounted in the PROM writer. Overcurrent damage to the device can result if the index marks on the PROM writer socket, socket adapter, and chip are not correctly aligned. Rev. 2.00 Sep 20, 2005 page 522 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors. 11. A wait time of 100 µs or more is necessary when performing a read after a transition to normal mode from program, erase, or verify mode. 12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR). Wait time: x Programming/ erasing possible Wait time: y φ Min 0 µs tOSC1 VCC tMDS FWE Min 0 µs MD2 to MD0*1 tMDS RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 21.2.6, Flash Memory Characteristics. Figure 17.16 Power-On/Off Timing (Boot Mode) Rev. 2.00 Sep 20, 2005 page 523 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] Wait time: x Programming/ erasing possible Wait time: y φ Min 0 µs tOSC1 VCC FWE MD2 to MD0*1 tMDS RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 21.2.6, Flash Memory Characteristics. Figure 17.17 Power-On/Off Timing (User Program Mode) Rev. 2.00 Sep 20, 2005 page 524 of 800 REJ09B0260-0200 Programming/ erasing possible Wait time: x Wait time: x Programming/ erasing possible Wait time: y Wait time: x Programming/ erasing possible Wait time: y Wait time: y Wait time: x Programming/ erasing possible Section 17 Flash Memory [H8/3026F-ZTAT Version] φ tOSC1 VCC Min 0µs FWE *2 tMDS tMDS MD2 to MD0 tMDS tRESW RES SWE cleared SWE set SWE bit Mode change*1 Boot mode Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. 2. When making a transition from boot mode to another mode, the mode programming setup time tMDS must be satisfied with respect to RES clearance timing. 3. See section 21.2.6, Flash Memory Characteristics. Figure 17.18 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode) Rev. 2.00 Sep 20, 2005 page 525 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.12 Mask ROM (H8/3026 Mask ROM Version) Overview 17.12.1 Block Diagram Figure 17.19 shows a block diagram of the ROM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'00000 H'00001 H'00002 H'00003 On-chip ROM H'1FFFE H'1FFFF Even addresses Odd addresses Figure 17.19 ROM Block Diagram (H8/3026 Mask ROM Version) Rev. 2.00 Sep 20, 2005 page 526 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.13 Notes on Ordering Mask ROM Version Chip When ordering H8/3026 with mask ROM, note the following. 1. When ordering by means of an EPROM, use a 512-kbyte one. 2. Fill all unused addresses with H'FF as shown in figure 17.20 to make the ROM data size 512kbytes for the H8/3026 mask ROM version. This applies to ordering by means of an EPROM and by means of data transmission. HD6433026 (ROM: 256 kbytes) Addresses: H'00000–7FFFF H'00000 H'3FFFF H'40000 Not used* H'7FFFF Note: * Write H'FF in all addresses in these areas. Figure 17.20 Mask ROM Addresses and Data 3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2, EBR1, and EBR2) used by the version with on-chip flash memory are not provided in the mask ROM version. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. This must be borne in mind when switching from a flash memory version to a mask ROM version. Rev. 2.00 Sep 20, 2005 page 527 of 800 REJ09B0260-0200 Section 17 Flash Memory [H8/3026F-ZTAT Version] 17.14 Notes when Converting the F-ZTAT Application Software to the Mask ROM Versions Please note the following when converting the F-ZTAT application software to the mask ROM versions. The values read from the internal registers for the flash ROM or the mask ROM version and F-ZTAT version differ as follows. Status Register Bit Value F-ZTAT Version Mask ROM Version FLMCR FWE 0 Application software running — (Is not read out) 1 Programming Application software running (Always read as 1) Note: This difference applies to all the F-ZTAT versions and all the mask ROM versions that have different ROM size. Rev. 2.00 Sep 20, 2005 page 528 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.1 Overview The H8/3024F-ZTAT version has 128 kbytes of on-chip flash memory. The flash memory is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) as shown in table 18.1. The on-chip flash memory product (H8/3024F-ZTAT version) can be erased and programmed onboard, as well as with a special-purpose PROM programmer. Table 18.1 Operating Modes and ROM Mode Pins Mode MD2 MD1 MD0 On-Chip ROM Mode 1 (expanded 1-Mbyte mode with on-chip ROM disabled) 0 0 1 Disabled (external address area) Mode 2 (expanded 1-Mbyte mode with on-chip ROM disabled) 0 1 0 Mode 3 (expanded 16-Mbyte mode with on-chip ROM disabled) 0 1 1 Mode 4 (expanded 16-Mbyte mode with on-chip ROM disabled) 1 0 0 Mode 5 (expanded 16-Mbyte mode with on-chip ROM enabled) 1 0 1 Mode 6 (single-chip normal mode) 1 1 0 Mode 7 (single-chip advanced mode) 1 1 1 Enabled Rev. 2.00 Sep 20, 2005 page 529 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.2 Features The H8/3024F-ZTAT version has 128 kbytes of on-chip flash memory. The features of the flash memory are summarized below. • Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed in block units. To erase the entire flash memory, each block must be erased in turn. In block erasing, 1-kbyte, 28kbyte, and 32-kbyte blocks can be set arbitrarily. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent approximately to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.) per block. • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board. A function is also provided specially in boot mode for identifying a program transferred from the host side: Boot mode User program mode • Automatic bit rate adjustment For data transfer in boot mode, the H8/3024F-ZTAT version chip’s bit rate can be automatically adjusted to match the transfer bit rate of the host. • Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. • Protect modes There are three protect modes—hardware, software, and error—which allow protected status to be designated for flash memory program/erase/verify operations Rev. 2.00 Sep 20, 2005 page 530 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] • PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 18.2.1 Block Diagram Internal address bus Module bus Internal data bus (16 bits) FLMCR1 FLMCR2 EBR Bus interface/controller Operating mode FWE pin Mode pins RAMCR Flash memory (128 kbytes) Legend FLMCR1: FLMCR2: EBR: RAMCR: Flash memory control register 1 Flash memory control register 2 Erase block register RAM control register Figure 18.1 Block Diagram of Flash Memory Rev. 2.00 Sep 20, 2005 page 531 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.2.2 Pin Configuration The flash memory is controlled by means of the pins shown in table 18.2. Table 18.2 Flash Memory Pins Pin Name Abbreviation I/O Function Reset RES Input Reset Flash write enable FWE Input Flash program/erase protection by hardware Mode 2 MD2 Input Sets H8/3024F-ZTAT version operating mode Mode 1 MD1 Input Sets H8/3024F-ZTAT version operating mode Mode 0 MD0 Input Sets H8/3024F-ZTAT version operating mode Transmit data TxD1 Output Serial transmit data output Receive data RxD1 Input Serial receive data input 18.2.3 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 18.3. Table 18.3 Flash Memory Registers Register Name Abbreviation R/W Initial Value Address*1 Flash memory control register 1 FLMCR1 R/W H'00*2 H'EE030 Flash memory control register 2 FLMCR2 R H'00 H'EE031 Erase block register EBR R/W H'00 H'EE032 RAM control register RAMCR R/W H'F1 H'EE077 Notes: FLMCR1, FLMCR2, EBR, and RAMCR are 8-bit registers, and should be accessed by byte access. These registers are used only in the versions with on-chip flash memory, and are not provided in the versions with on-chip mask ROM. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are invalid. 1. Lower 20 bits of address in advanced mode. 2. When a high level is input to the FWE pin, the initial value is H'80. Rev. 2.00 Sep 20, 2005 page 532 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.3 Register Descriptions 18.3.1 Flash Memory Control Register 1 (FLMCR1) Bit 7 6 5 4 3 2 1 0 SWE ESU PSU EV PV E P Initial value FWE —* 0 0 0 0 0 0 0 Read/Write R R/W R/W R/W R/W R/W R/W R/W Note: * Determined by the state of the FWE pin. FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. In mode 6 the FWE pin must be fixed low since flash memory on-board programming modes are not supported. When the on-chip flash memory is disabled, a read access to this register will return H'00, and writes are invalid. When setting bits 6 to 0 in this register, one bit must be set one at a time. Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to bits ESU, PSU, EV, and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this register to prevent erroneous programming or erasing. 2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as normal on-chip ROM, bits 6 to 0 in this register must be cleared. Rev. 2.00 Sep 20, 2005 page 533 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Bit 7—Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE Description 0 When a low level is input to the FWE pin (hardware-protected state) 1 When a high level is input to the FWE pin Bit 6—Software Write Enable (SWE): Enables or disables flash memory programming and erasing. (This bit should be set when setting bits 5 to 0 and EBR bits 7 to 0.) Bit 6 SWE Description 0 Programming/erasing disabled 1 Programming/erasing enabled (Initial value) [Setting condition] When FWE = 1 Note: Do not execute a SLEEP instruction while the SWE bit is set to 1. Bit 5—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1 (do not set the SWE, PSU, EV, PV, E, or P bit at the same time). Bit 5 ESU Description 0 Erase setup cleared 1 Erase setup [Setting condition] When FWE = 1 and SWE = 1 Rev. 2.00 Sep 20, 2005 page 534 of 800 REJ09B0260-0200 (Initial value) Section 18 Flash Memory [H8/3024F-ZTAT Version] Bit 4—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1 (do not set the SWE, ESU, EV, PV, E, or P bit at the same time). Bit 4 PSU Description 0 Program setup cleared 1 Program setup (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 3—Erase-Verify Mode (EV): Selects erase-verify mode transition or clearing. (Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.) Bit 3 EV Description 0 Erase-verify mode cleared 1 Transition to erase-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Bit 2—Program-Verify Mode (PV): Selects program-verify mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.) Bit 2 PV Description 0 Program-verify mode cleared 1 Transition to program-verify mode (Initial value) [Setting condition] When FWE = 1 and SWE = 1 Rev. 2.00 Sep 20, 2005 page 535 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Bit 1—Erase Mode (E): Selects erase mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.) Bit 1 E Description 0 Erase mode cleared 1 Transition to erase mode (Initial value) [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Note: Do not access the flash memory while the E bit is set. Bit 0—Program (P): Selects program mode transition or clearing. (Do not set the SWE, ESU, PSU, EV, PV, or E bit at the same time.) Bit 0 P Description 0 Program mode cleared 1 Transition to program mode (Initial value) [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Note: Do not access the flash memory while the P bit is set. 18.3.2 Flash Memory Control Register 2 (FLMCR2) Bit 7 6 5 4 3 2 1 0 FLER — — — — — — — Initial value 0 0 0 0 0 0 0 0 Read/Write R R R R R R R R FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When the on-chip flash memory is disabled, a read will return H'00. Note: FLMCR2 is a read-only register, and should not be written to. Rev. 2.00 Sep 20, 2005 page 536 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER Description 0 Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset (RES pin or WDT reset) or hardware standby mode 1 (Initial value) An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting conditions] • When flash memory is read during programming/erasing (including a vector read or instruction fetch, but excluding a read of the RAM area overlapping flash memory space) • Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) • When a SLEEP instruction (including software standby) is executed during programming/erasing • When the bus is released during programming/erasing Bits 6 to 0—Reserved: These bits are always read as 0. Rev. 2.00 Sep 20, 2005 page 537 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.3.3 Erase Block Register (EBR) EBR is an 8-bit register that designates the flash memory block for erasure. EBR is initialized to H'00 by a reset, in hardware standby mode or software standby mode, when a high level is not input to the FWE pin, or when the SWE bit in FLMCR1 is 0 when a high level is applied to the FWE pin. When a bit is set in EBR, the corresponding block can be erased. Other blocks are eraseprotected. The blocks are erased block by block. Therefore, set only one bit in EBR; do not set bits in EBR to erase two or more blocks at the same time. Each bit in EBR cannot be set until the SWE bit in FLMCR1 is set. The flash memory block configuration is shown in table 18.4. To erase all the blocks, erase each block sequentially. The H8/3024F-ZTAT version does not support the on-board programming mode in mode 6, so bits in this register cannot be set to 1 in mode 6. Bit 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 Initial value Modes 1 to 4, and 6 Read/Write 0 0 0 0 0 0 0 0 R R R R R R R R Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Modes 5 and 7 Bits 7 to 0—Block 7 to Block 0 (EB7 to EB0): Setting one of these bits specifies the corresponding block (EB7 to EB0) for erasure. Bits 7–0 EB7–EB0 Description 0 Corresponding block (EB7 to EB0) not selected 1 Corresponding block (EB7 to EB0) selected Note: When not performing an erase, clear all EBR bits to 0. Rev. 2.00 Sep 20, 2005 page 538 of 800 REJ09B0260-0200 (Initial value) Section 18 Flash Memory [H8/3024F-ZTAT Version] Table 18.4 Flash Memory Erase Blocks Block (Size) Address EB0 (1 kbyte) H'000000–H'0003FF EB1 (1 kbyte) H'000400–H'0007FF EB2 (1 kbyte) H'000800–H'000BFF EB3 (1 kbyte) H'000C00–H'000FFF EB4 (28 kbytes) H'001000–H'007FFF EB5 (32 kbytes) H'008000–H'00FFFF EB6 (32 kbytes) H'010000–H'017FFF EB7 (32 kbytes) H'018000–H'01FFFF 18.3.4 RAM Control Register (RAMCR) RAMCR selects the RAM area to be used when emulating real-time flash memory programming. Bit 7 6 5 4 3 2 1 0 — — — — RAMS RAM2 RAM1 — Modes 1 Initial value to 4 Read/Write 1 1 1 1 0 0 0 1 — — — — R R R — Modes 5 Initial value to 7 Read/Write 1 1 1 1 — — — — 0 R/W* 0 R/W* 0 R/W* — Reserved bits 1 Reserved bit RAM2, RAM1 Used together with bit 3 to select a flash memory area RAM select Used together with bits 2 and 1 to select a flash memory area Note: * Cannot be set to 1 in mode 6. Bits 7 to 4—Reserved: Read-only bits, always read as 1. Rev. 2.00 Sep 20, 2005 page 539 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Bit 3—RAM Select (RAMS): Used with bits 2 to 1 to reassign an area to RAM (see table 18.5). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled.* In modes other than 5 to 7, 0 is always read and writing is disabled. This bit is initialized by a reset and in hardware standby mode. It is not initialized in software standby mode. When 1 is written to the RAMS bit, all flash memory blocks are protected from programming and erasing. Bits 2 and 1—RAM2 and RAM1: These bits are used with bit 3 to reassign an area to RAM (see table 18.5). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled.* In modes other than 5 to 7, 0 is always read and writing is disabled. These bits are initialized by a reset and in hardware standby mode. They are not initialized in software standby mode. Bit 0—Reserved: This bit cannot be modified and is always read as 1. Note: * Flash memory emulation by RAM is not supported for mode 6 (single chip normal mode), so programming is possible, but do not set 1. When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. Table 18.5 RAM Area Setting Bit 3 Bit 2 Bit 1 RAM Area RAMS RAM2 RAM1 RAM Emulation Status H'FFF000–H'FFF3FF 0 0/1 0/1 No emulation H'000000–H'0003FF 1 0 0 Mapping RAM H'000400–H'0007FF 1 0 1 H'000800–H'000BFF 1 1 0 H'000C00–H'000FFF 1 1 1 Rev. 2.00 Sep 20, 2005 page 540 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] ROM area RAM area H'000000 H'FFEF20 EB0 ROM blocks EB0–EB3 (H'000000– H'000FFF) H'0003FF H'000400 H'FFEFFF H'FFF000 EB1 H'0007FF H'000800 H'000BFF H'000C00 Mapping RAM EB2 H'000FFF ROM selection area RAM selection area Actual RAM H'FFF3FF H'FFF400 RAM overlap area (H'FFF000– H'FFF3FF) H'FFFF1F EB3 Figure 18.2 Example of ROM Area/RAM Area Overlap 18.4 Overview of Operation 18.4.1 Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the H8/3024F-ZTAT version enters one of the operating modes shown in figure 18.3. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. Boot mode and user program mode cannot be used in the H8/3024F-ZTAT version’s mode 6 (normal mode with on-chip ROM enabled). Rev. 2.00 Sep 20, 2005 page 541 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Reset state *3 *1 User mode with on-chip ROM enabled RES = 0 RES = 0 *2 *4 RES = 0 FWE = 0 *5 RES = 0 *4 PROM mode User program mode *1 Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. RAM emulation possible 2. The H8/3024F-ZTAT version is placed in PROM mode by means of a dedicated PROM writer. 3. MD2, MD1, MD0 = (1, 0, 1) (1, 1, 0) (1, 1, 1) FWE = 0 4. MD2, MD1, MD0 = (1, 0, 1) (1, 1, 1) FWE = 1 5. MD2, MD1, MD0 (0, 0, 1) (0, 1, 1) FWE = 1 Figure 18.3 Flash Memory Related State Transitions State transitions between the normal and user modes and on-board programming mode are performed by changing the FWE pin level from high to low or from low to high. To prevent misoperation (erroneous programming or erasing) in these cases, the bits in the flash memory control register (FLMCR1) should be cleared to 0 before making such a transition. After the bits are cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is insufficient. Rev. 2.00 Sep 20, 2005 page 542 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.4.2 On-Board Programming Modes Example of Boot Mode Operation 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. Host 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3024F-ZTAT version (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Programming control program New application program New application program H8/3024F-ZTAT version H8/3024F-ZTAT version SCI Boot program Flash memory SCI Boot program Flash memory RAM RAM Boot program area Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard Host Programming control program 4. Writing new application program An identification check is carried out to see if the programming control program is compatible with the H8/3024F-ZTAT version. The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program H8/3024F-ZTAT version H8/3024F-ZTAT version SCI Boot program Flash memory RAM Flash memory Boot program area Flash memory prewrite-erase Programming control program SCI Boot program RAM Boot program area New application program Programming control program Program execution state Rev. 2.00 Sep 20, 2005 page 543 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Example of User Program Mode Operation 1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/ erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory. 2. Programming/erase control program transfer When user program mode is entered, user software recognizes this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host Host Programming/erase control program New application program New application program H8/3024F-ZTAT version H8/3024F-ZTAT version SCI Boot program Flash memory SCI Boot program Flash memory RAM FWE assessment program FWE assessment program Transfer program Transfer program RAM Programming/erase control program Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host Host New application program H8/3024F-ZTAT version H8/3024F-ZTAT version SCI Boot program Flash memory RAM FWE assessment program Transfer program SCI Boot program Flash memory RAM FWE assessment program Transfer program Programming/erase control program Flash memory erase Programming/erase control program New application program Program execution state Rev. 2.00 Sep 20, 2005 page 544 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.4.3 Flash Memory Emulation in RAM In the H8/3024F-ZTAT version, flash memory programming can be emulated in real time by overlapping the flash memory with part of RAM (“overlap RAM”). When the emulation block set in RAMCR is accessed while the emulation function is being executed, data written in the overlap RAM is read. Emulation should be performed in user mode or user program mode. SCI Flash memory RAM Emulation block Overlap RAM Application program (Emulation is performed on data written in RAM) Execution state Figure 18.4 Reading Overlap RAM Data in User Mode/User Program Mode When overlap RAM data is confirmed, clear the RAMS bit to cancel RAM overlap, and actually perform writes to the flash memory in user program mode. When the programming control program is transferred to RAM in on-board programming mode, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. Rev. 2.00 Sep 20, 2005 page 545 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] SCI Flash memory RAM Program data Overlap RAM (program data) Application program Programming control program Execution state Figure 18.5 Writing Overlap RAM Data in User Program Mode 18.4.4 Block Configuration The flash memory in the H8/3024F-ZTAT version is divided into three 32-kbyte blocks, one 28kbyte block, and four 1-kbyte blocks. Erasing can be carried out in block units. Address H'00000 1 kbyte × 4 28 kbytes 32 kbytes 128 kbytes 32 kbytes 32 kbytes Address H'1FFFF Rev. 2.00 Sep 20, 2005 page 546 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.5 On-Board Programming Mode When pins are set to on-board programming mode and a reset-start is executed, the chip enters the on-board programming state in which on-chip flash memory programming, erasing, and verifying can be carried out. There are two operating modes in this mode—boot mode and user program mode. The pin settings for entering each mode are shown in table 18.6. For a diagram of the transitions to the various flash memory modes, see figure 18.3. Boot mode and user program mode cannot be used in the H8/3024F-ZTAT version’s mode 6 (onchip ROM enabled). Table 18.6 On-Board Programming Mode Settings Mode Boot mode User program mode FWE MD2 MD1 MD0 *1 *2 0 1 Mode 7 0*2 1 1 Mode 5 1 0 1 Mode 7 1 1 1 Mode 5 1 0 Notes: 1. For the High level input timing, see items 6 and 7 of Notes on Use of Boot Mode. 2. In boot mode, the MD2 setting should be the inverse of the input. In the boot mode in the H8/3024F-ZTAT version, the levels of the mode pins (MD2 to MD0) are reflected in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control register (MDCR). Rev. 2.00 Sep 20, 2005 page 547 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.5.1 Boot Mode When boot mode is used, a flash memory programming control program must be prepared beforehand in the host, and SCI channel 1, which is to be used, must be set to asynchronous mode. When a reset-start is executed after setting the H8/3024F-ZTAT version’ pins to boot mode, the boot program already incorporated in the MCU is activated, and the programming control program prepared beforehand in the host is transmitted sequentially to the H8/3024F-ZTAT version, using the SCI. In the H8/3024F-ZTAT version, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address (H'FFF520) of the programming control program area and the programming control program execution state is entered (flash memory programming/erasing can be performed). Figure 18.6 shows a system configuration diagram when using boot mode, and figure 18.7 shows the boot program mode execution procedure. H8/3024F-ZTAT version Flash memory Host Reception of programming data Transmission of verify data RxD1 SCI1 TxD1 On-chip RAM Figure 18.6 System Configuration When Using Boot Mode Rev. 2.00 Sep 20, 2005 page 548 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate H8/3024F-ZTAT version measures low period of H'00 data transmitted by host H8/3024F-ZTAT version calculates bit rate and sets value in bit rate register After bit rate adjustment, H8/3024F-ZTAT version transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, H8/3024F-ZTAT version transmits one H'AA byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte H8/3024F-ZTAT version transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units H8/3024F-ZTAT version transmits received programming control program to host as verify data (echo-back) n+1→n Transfer received programming control program to on-chip RAM No n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks Confirm that all flash memory data has been erased Check ID code at beginning of user program transfer area (Match) Transmit one H'AA byte to host (Mismatch) Transmit H'FF as error notification Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error indication, and the erase operation and subsequent operations are halted. Figure 18.7 Boot Mode Execution Procedure Rev. 2.00 Sep 20, 2005 page 549 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Automatic SCI Bit Rate Adjustment: Start bit D0 D1 D2 D3 D4 D5 D6 Low period (9 bits) measured (H'00 data) D7 Stop bit High period (1 or more bits) When boot mode is initiated, the H8/3024F-ZTAT version measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as 8-bit data, 1 stop bit, no parity. The H8/3024F-ZTAT version calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the H8/3024F-ZTAT version. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the H8/3024F-ZTAT version’s system clock frequency, there will be a discrepancy between the bit rates of the host and the H8/3024F-ZTAT version. To ensure correct SCI operation, the host’s transfer bit rate should be set to 4800, 9600, or 19,200 bps*. Table 18.7 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the H8/3024F-ZTAT version bit rate is possible. The boot program should be executed within this system clock range. Table 18.7 System Clock Frequencies for which Automatic Adjustment of H8/3024F-ZTAT Version Bit Rate is Possible Host Bit Rate (bps) System Clock Frequency for which Automatic Adjustment of H8/3024F-ZTAT Version Bit Rate is Possible (MHz) 19,200 16 to 25 9,600 8 to 25 4,800 4 to 25 Note: * Only use a setting of 4800, 9600, or 19200 for the host’s bit rate. No other settings can be used. Although the H8/3024F-ZTAT version may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 18.7, a degree of error will arise between the bit rates of the host and the MCU, and subsequent transfer will not be performed normally. Therefore, only a combination of bit rate and system clock frequency within one of the ranges shown in table 18.7 can be used for boot mode execution. Rev. 2.00 Sep 20, 2005 page 550 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the user program is transferred via the SCI, as shown in figure 18.8. The boot program area becomes available when a transition is made to the execution state for the user program transferred to RAM. H'FFEF20 Boot program area H'FFF51F User program transfer area H'FFFF1F Note: The boot program area cannot be used until a transition is made to the execution state for the user program transferred to RAM. Note also that the boot program remains in this area in RAM even after control branches to the user program. Figure 18.8 RAM Areas in Boot Mode Notes on Use of Boot Mode: 1. When the H8/3024F-ZTAT version chip comes out of reset in boot mode, it measures the low period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD1 input. 2. In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. 3. Interrupts cannot be used while the flash memory is being programmed or erased. 4. The RxD1 and TxD1 lines should be pulled up on the board. 5. Before branching to the user program the H8/3024F-ZTAT version terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits to 0 in the serial control register (SCR)), but the adjusted bit rate value remains set in the bit rate register Rev. 2.00 Sep 20, 2005 page 551 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] (BRR). The transmit data output pin, TxD1, goes to the high-level output state (P91DDR = 1 in P9DDR, P91DR = 1 in P9DR). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the user program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the user program. The initial values of other on-chip registers are not changed. 6. Boot mode can be entered by setting pins MD0 to MD2 and FWE in accordance with the mode setting conditions shown in table 18.6, and then executing a reset-start. a. When switching from boot mode to normal mode, the boot mode state within the chip must first be cleared by reset input via the RES pin*1. The RES pin must be held low for at least 20 system clock cycles.*2 b. Do not change the input levels of the mode pins (MD2 to MD0) or the FWE pin in boot mode. To change the mode, the RES pin must first be driven low to set the reset state. Also, if a watchdog timer reset occurs in the boot mode state, the MCU’s internal state will not be cleared, and the on-chip boot program will be restarted regardless of the mode pin states. c. The FWE pin must not be driven low while the boot program is running or flash memory is being programmed or erased.*3 7. If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output signals (CSn, AS, RD, LWR, HWR) may also change according to the change in the MCU’s operating mode. Therefore, care must be taken to make pin settings to prevent these pins from being used directly as output signal pins during a reset, or to prevent collision with signals outside the MCU. H8/3024F-ZTAT version CSn MD2 MD1 MD0 FWE RES Rev. 2.00 Sep 20, 2005 page 552 of 800 REJ09B0260-0200 External memory, etc. System control unit Section 18 Flash Memory [H8/3024F-ZTAT Version] Notes: 1. Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. 2. See section 4.2.2, Reset Sequence, and section 18.11, Flash Memory Programming and Erasing Precautions. The H8/3024F-ZTAT version requires a minimum of 20 system clock cycles for a reset during operation. 3. For further information on FWE application and disconnection, see section 18.11, Flash Memory Programming and Erasing Precautions. 18.5.2 User Program Mode When set to user program mode, the H8/3024F-ZTAT version can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip ROM (mode 5 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 5 and 7. Flash memory programming/erasing should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. The flash memory itself cannot be read while being programmed or erased, so the program that performs programming should be placed in external memory or transferred to RAM and executed there. Figure 18.9 shows the execution procedure when user program mode is entered during program execution in RAM. It is also possible to start from user program mode in a reset-start. Rev. 2.00 Sep 20, 2005 page 553 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Write FWE assessment program and transfer program (and programming/erase control program if necessary) beforehand MD2–MD0 = 101 or 111 Reset-start Transfer programming/erase control program to RAM Branch to programming/erase control program in RAM area FWE = high (user program mode) Execute programming/erase control program in RAM (flash memory rewriting) Clear SWE bit, then release FWE (user program mode clearing) Branch to application program in flash memory Notes: 1. Do not apply a constant high level to the FWE pin. A high level should be applied to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation by RAM). Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. For further information on FWE application and disconnection, see section 18.11, Flash Memory Programming and Erasing Precautions. 3. In order to execute a normal read of flash memory in user program mode, the programming/erase program must not be executing. It is thus necessary to ensure that bits 6 to 0 in FLMCR1 are cleared to 0. Figure 18.9 Example of User Program Mode Execution Procedure Rev. 2.00 Sep 20, 2005 page 554 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.6 Flash Memory Programming/Erasing A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes for addresses H'000000 to H'01FFFF are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. See section 18.11, Flash Memory Programming and Erasing Precautions, for points to be noted when programming or erasing the flash memory. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 21.2.6, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming must be executed in the erased state. Do not perform additional programming on addresses that have already been programmed. Rev. 2.00 Sep 20, 2005 page 555 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] *3 E=1 Erase setup state Erase mode E=0 Normal mode FWE = 1 ESU = 1 ESU = 0 *1 FWE = 0 EV = 1 *2 On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state Erase-verify mode EV = 0 PSU = 1 *4 P=1 PSU = 0 Program setup state Program mode P=0 PV = 1 PV = 0 Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state. Figure 18.10 FLMCR1 Bit Settings and State Transitions Rev. 2.00 Sep 20, 2005 page 556 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.6.1 Program Mode When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 18.11 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 21.19 in section 21.2.6, Flash Memory Characteristics. Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) µs. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see “Notes on Program/Program-Verify Procedure” below. 18.6.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write Rev. 2.00 Sep 20, 2005 page 557 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 18.11) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE. Notes on Program/Program-Verify Procedure 1. The program/program-verify procedure for the H8/3024F-ZTAT version uses a 128-byte-unit programming algorithm. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the H8/3024F-ZTAT version, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the H8/3024F-ZTAT version, the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N). b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. Rev. 2.00 Sep 20, 2005 page 558 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 21.2.6, Flash Memory Characteristics. Item Symbol Item Symbol Wait time after P bit setting tsp When reprogramming loop count (n) is 1 to 6 tsp30 When reprogramming loop count (n) is 7 or more In case of additional programming processing* tsp200 tsp10 Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6. 6. The program/program-verify flowchart for the H8/3024F-ZTAT version is shown in figure 18.11. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM. Rev. 2.00 Sep 20, 2005 page 559 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Reprogram Data Computation Table (D) Result of Verify-Read after Write Pulse (X) Application (V) Result of Operation 0 0 1 Programming completed: reprogramming processing not to be executed 0 1 0 Programming incomplete: reprogramming processing to be executed 1 0 1 1 1 1 Still in erased state: no action Comments Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed Additional-Programming Data Computation Table Result of Verify-Read after Write Pulse (Y) (X') Application (V) Result of Operation Comments 0 0 0 Programming by write pulse application judged to be completed: additional programming processing to be executed 0 1 1 Programming by write pulse application incomplete: additional programming processing not to be executed 1 0 1 Programming already completed: additional programming processing not to be executed 1 1 1 Still in erased state: no action Legend: (Y): Data of bits on which additional programming is executed (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop 7. It is necessary to execute additional programming processing during the course of the H8/3024F-ZTAT version program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished. Rev. 2.00 Sep 20, 2005 page 560 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Write pulse application subroutine Start of programming Sub-Routine Write Pulse START Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. Set SWE bit in FLMCR1 WDT enable Wait (tsswe) µs Set PSU in FLMCR1 Wait (tspsu) µs *7 Set P bit in FLMCR1 *7 Store 128-byte program data in program data area and reprogram data area *4 n=1 Start of programming m=0 Wait (tsp) µs * 5* 7 Clear P bit in FLMCR1 Write 128-byte data in RAM reprogram data area consecutively to flash memory Programming halted *1 Sub-Routine-Call Wait (tcp) µs *7 Clear PSU bit in FLMCR1 Wait (tcpsu) µs See Note 6 for pulse width Write pulse Set PV bit in FLMCR1 Wait (tspv) µs *7 *7 H'FF dummy write to verify address Disable WDT Wait (tspvr) µs End Sub Read verify data *2 Write data = verify data? NG Increment address Note 6: Write Pulse Width Number of Writes n Write Time (tsp) µsec 1 2 3 4 5 6 7 8 9 10 11 12 13 30 30 30 30 30 30 200 200 200 200 200 200 200 998 999 1000 n←n+1 *7 m=1 OK 6≥n? NG OK Additional-programming data computation Transfer additional-programming data to additional-programming data area *4 *3 Reprogram data computation Transfer reprogram data to reprogram data area NG 200 200 200 *4 128-byte data verification completed? OK Clear PV bit in FLMCR1 Reprogram Note: Use a 10 µs write pulse for additional programming. Wait (tcpv) µs RAM 6 ≥ n? *7 NG OK Successively write 128-byte data from additional*1 programming data area in RAM to flash memory Program data storage area (128 bytes) Sub-Routine-Call Reprogram data storage area (128 bytes) Write Pulse (Additional programming) Additional-programming data storage area (128 bytes) m = 0? NG OK Clear SWE bit in FLMCR1 *7 n ≥ N? NG OK Clear SWE bit in FLMCR1 Wait (tcswe) µs Wait (tcswe) µs Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. End of programming Programming failure 2. Verify data is read in 16-bit (longword) units. 3. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. 4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. 5. A write pulse of 30 µs or 200 µs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 µs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. 7. The wait times and value of N are shown in section 21.2.6, Flash Memory Characteristics. *7 Additional-Programming Data Computation Table Reprogram Data Computation Table Original Data (D) 0 Verify Data (V) 0 Reprogram Data (X) 1 0 1 0 1 0 1 1 1 1 Comments Reprogram Data Verify Data Additional(X') (V) Programming Data (Y) Comments Programming completed 0 0 0 Additional programming to be executed Programming incomplete; reprogram 0 1 1 Additional programming not to be executed 1 0 1 Additional programming not to be executed 1 1 1 Additional programming not to be executed Still in erased state; no action Figure 18.11 Program/Program-Verify Flowchart (128-Byte Programming) Rev. 2.00 Sep 20, 2005 page 561 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.6.3 Erase Mode When erasing flash memory, the single-block erase flowchart shown in figure 18.12 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in table 21.19 in section 21.2.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register (EBR) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than (tse) ms + (tsesu + tce + tcesu) µs as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. Rev. 2.00 Sep 20, 2005 page 562 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.6.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) µs. If erasing multiple blocks, set a single bit in EBR for the next block to be erased, and repeat the erase/erase-verify sequence as before. Rev. 2.00 Sep 20, 2005 page 563 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Start *1 Perform erasing in block units. Set SWE bit in FLMCR1 Wait (tsswe) µs *5 n=1 Set EBR *3, *4 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) µs *5 Start of erase Set E bit in FLMCR1 Wait (tse) ms *5 Clear E bit in FLMCR1 Erase halted Wait (tce) µs *5 Clear ESU bit in FLMCR1 Wait (tcesu) µs *5 Disable WDT Set EV bit in FLMCR1 Wait (tsev) µs n←n+1 *5 Set block start address as verify address H'FF dummy write to verify address Increment address Wait (tsevr) µs *5 Read verify data *2 Verify data = all 1s? No Yes No Last address of block? Yes Clear EV bit in FLMCR1 *5 Wait (tcev) µs Clear EV bit in FLMCR1 *5 n ≥ N? Clear SWE bit in FLMCR1 Notes: 1. 2. 3. 4. 5. *5 Wait (tcev) µs *5 No Yes Clear SWE bit in FLMCR1 Wait (tcswe) µs Wait (tcswe) µs End of erasing Erase failure Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block register (EBR). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 21.2.6, Flash Memory Characteristics. Figure 18.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) Rev. 2.00 Sep 20, 2005 page 564 of 800 REJ09B0260-0200 *5 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.7 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware, software, and error protection. 18.7.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. In this state, the settings in flash memory control register 1 (FLMCR1) and erase block register (EBR) are reset. In the error protection state, the FLMCR1 and EBR settings are retained; the P bit and E bit can be set, but a transition is not made to program mode or erase mode. (See table 18.8.) Table 18.8 Hardware Protection Function Item Description Program FWE pin protection • When a low level is input to the FWE pin, FLMCR1 and EBR are initialized, and the program/erase-protected state is entered. Not Not Not possible*1 possible*3 possible Reset/ standby protection • In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, and EBR are initialized, and the program/eraseprotected state is entered. Not possible Not Not possible*3 possible • In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section.*4 • Not When a microcomputer operation error (error possible generation (FLER = 1)) was detected while flash memory was being programmed/erased, error protection is enabled. At this time, the FLMCR1 and EBR settings are held, but programming/erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. Not Possible possible*3 *2 Error protection Erase Verify Notes: 1. The RAM area that overlapped flash memory is deleted. Rev. 2.00 Sep 20, 2005 page 565 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify operation on the block being erased. 3. All blocks are unerasable and block-by-block specification is not possible. 4. See section 4.2.2, Reset Sequence, and section 18.11, Flash Memory Programming and Erasing Precautions. The H8/3024F-ZTAT version requires a minimum of 20 system clock cycles for a reset during operation. 18.7.2 Software Protection Software protection can be implemented by setting the erase block register (EBR) and the RAMS bit in the RAM control register (RAMCR). With software protection, setting the P or E bit in the flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 18.9.) Table 18.9 Software Protection Functions Item Description Program Erase Verify Block protection • Erase protection can be set for individual blocks by settings in erase block register (EBR)*2. However, programming protection is disabled. — Not possible Possible • Setting EBR to H'00 places all blocks in the erase-protected state. • Setting the RAMS bit 1 in RAMCR places all blocks in the program/erase-protected state. Emulation protection Not Not possible*1 possible*3 Notes: 1. The RAM area overlapping flash memory can be written to. 2. When not erasing, set EBR to H'00. 3. All blocks are unerasable and block-by-block specification is not possible. Rev. 2.00 Sep 20, 2005 page 566 of 800 REJ09B0260-0200 Possible Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.7.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing*1, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in the flash memory status register (FLMSR2) and the error protection state is entered. FLMCR1, FLMCR2, and EBR settings*3 are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit in FLMCR. However, PV and EV bit setting is enabled, and a transition can be made to verify mode*2. FLER bit setting conditions are as follows: 1. When flash memory is read during programming/erasing (including a vector read or instruction fetch) 2. Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the bus is released during programming/erasing Error protection is released only by a RES pin or WDT reset, or in hardware standby mode. Notes: 1. State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled in this state. 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify on the block being erased. 3. FLMCR1 and EBR can be written to. However, the registers are initialized if a transition is made to software standby mode while in the error protection state. Figure 18.13 shows the flash memory state transition diagram. Rev. 2.00 Sep 20, 2005 page 567 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Program mode Erase mode Reset or standby (hardware protection) RES = 0 or STBY = 0 RD VF PR ER INIT FLER = 0 RD VF PR ER FLER = 0 Error occurrence (software standby) RES = 0 or STBY = 0 Error occurrence RES = 0 or STBY = 0 Software standby mode Error protection mode RD VF PR ER FLER = 1 Software standby mode release FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode (software standby) RD VF PR ER INIT FLER = 1 FLMCR1, EBR initialization state RD: VF: PR: ER: Memory read possible Verify-read possible Programming possible Erasing possible RD: VF: PR: ER: INIT: Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register initialization state Figure 18.13 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing. Rev. 2.00 Sep 20, 2005 page 568 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.8 Flash Memory Emulation in RAM As flash memory programming and erasing takes time, it may be difficult to carry out tuning by writing parameters and other data in real time. In this case, real-time programming of flash memory can be emulated by overlapping part of RAM (H'FFF000–H'FFF3FF) onto a small block area in flash memory. This RAM area change is executed by means of bits 3 to 1 in the RAM control register (RAMCR). After the RAM area change, access is possible both from the area overlapped onto flash memory and from the original area (H'FFF000–H'FFF3FF). For details of RAMCR and the RAM area setting method, see section 18.3.4, RAM Control Register (RAMCR). Example of Emulation of Real-Time Flash Memory Programming: In the following example, RAM area H'FFF000–H'FFF3FF is overlapped onto flash memory area EB2 (H'000800– H'000BFF). Procedure: H'000000 1. Part of RAM (H'FFF000–H'FFF3FF) is overlapped onto the area (EB2) requiring real-time programming. Flash memory space Block area (RAMCR bits 3–1 are set to 1, 1, 0, and the flash memory area to be overlapped (EB2) is selected.) Overlapping ram EB2 H'000800 area H'000BFF H'000FFF * (Mapping RAM area) Real-time programming is performed using the overlapping RAM. 3. The programmed data is checked, then RAM overlapping is cleared. (RAMS bit is cleared.) H'FFEF20 On-chip RAM area H'FFEFFF H'FFF000 H'FFF3FF H'FFF400 2. 4. The data written in RAM area H'FFF000–H'FFF3FF is written to flash memory space. (Actual RAM area) H'FFFF1F Note: * When part of RAM (H'FFF000–H'FFF3FF) is overlapped onto a flash memory small block area, the flash memory in the overlapped area cannot be accessed. It can be accessed when the overlapping is cleared. Figure 18.14 Example of RAM Overlap Operation Rev. 2.00 Sep 20, 2005 page 569 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Notes on Use of Emulation in RAM: 1. Flash write enable (FWE) application and releasing As in on-board program mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit is set to 1 in FLMCR1, even while the emulation function is being used. For details, see section 18.11, Flash Memory Programming and Erasing Precautions. 2. NMI input disabling conditions When the emulation function is used, NMI input is disabled when the P bit or E bit is set to 1 in FLMCR1, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0 while a high level is being input to the FWE pin. 3. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in FLMCR1 will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 4. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 5. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM. 18.9 NMI Input Disabling Conditions All interrupts, including NMI input, should be disabled while flash memory is being programmed or erased (while the P bit or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. NMI input during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the NMI exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If NMI input occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. Rev. 2.00 Sep 20, 2005 page 570 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] For these reasons, in on-board programming mode alone there are conditions for disabling NMI input, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests (exception handling and bus release), including NMI, must therefore be restricted inside and outside the MCU during FWE application. NMI input is also disabled in the error protection state and while the P or E bit remains set in FLMCR1 during flash memory emulation in RAM. Notes: 1. This is the interval until a branch is made to the boot program area in the on-chip RAM (This branch takes place immediately after transfer of the user program is completed). Consequently, after the branch to the RAM area, NMI input is enabled except during programming and erasing. Interrupt requests must therefore be disabled inside and outside the MCU until the user program has completed initial programming (including the vector table and the NMI interrupt handling routine). 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P bit or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). • If the entry in the interrupt vector table has not been programmed yet, interrupt exception handling will not be executed correctly. 18.10 Flash Memory PROM Mode The H8/3024F-ZTAT version has a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Renesas Technology microcomputer device type with 128-kbyte on-chip flash memory. 18.10.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 18.10. In the H8/3024F-ZTAT version PROM mode, only the socket adapters shown in this table should be used. Rev. 2.00 Sep 20, 2005 page 571 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Table 18.10 H8/3024F-ZTAT Version Socket Adapter Product Codes Product Code Package Socket Adapter Product Code HD64F3024F 100-pin QFP (FP-100B) TBD HD64F3024TE 100-pin TQFP (TFP-100B) TBD HD64F3024FP 100-pin QFP (FP-100A) TBD HD64F3024F 100-pin QFP (FP-100B) TBD HD64F3024TE 100-pin TQFP (TFP-100B) TBD HD64F3024FP 100-pin QFP (FP-100A) TBD Manufacturer MINATO ELECTRONICS INC. DATA I/O JAPAN CO. Figure 18.15 shows the memory map in PROM mode. MCU mode H'000000 H8/3024F-ZTAT version PROM mode H'00000 On-chip ROM H'01FFFF H'1FFFF Figure 18.15 Memory Map in PROM Mode 18.10.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Renesas Technology. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3024F-ZTAT version does not support a product identification mode as used with general-purpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3024F-ZTAT version. Rev. 2.00 Sep 20, 2005 page 572 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.11 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Renesas Technology microcomputer device type with 128-kbyte on-chip flash memory. 2. Powering on and off (see figures 18.16 to 18.18) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Failure to do so may result in overprogramming or overerasing due to MCU runaway, and loss of normal memory cell operation. 3. FWE application/disconnection FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: • Apply FWE when the VCC voltage has stabilized within its rated voltage range. If FWE is applied when the MCU’s VCC power supply is not within its rated voltage range, MCU operation will be unstable and flash memory may be erroneously programmed or erased. • Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). When VCC power is turned on, hold the RES pin low for the duration of the oscillation settling time before applying FWE. Do not apply FWE when oscillation has stopped or is unstable. • In boot mode, apply and disconnect FWE during a reset. In a transition to boot mode, FWE = 1 input and MD2–MD0 setting should be performed while the RES input is low. FWE and MD2–MD0 pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. When making a transition from boot mode to another mode, also, a mode programming setup time is necessary with respect to the reset release timing. Rev. 2.00 Sep 20, 2005 page 573 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] • • • In a reset during operation, the RES pin must be held low for a minimum of 20 system clock cycles. In user program mode, FWE can be switched between high and low level regardless of RES input. FWE input can also be switched during execution of a program in flash memory. Do not apply FWE if program runaway has occurred. During FWE application, the program execution state must be monitored using the watchdog timer or some other means. Disconnect FWE only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, E, and P bits are not set by mistake when applying or disconnecting FWE. 4. Do not apply a constant high level to the FWE pin. T prevent erroneous programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation using RAM). A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Also note that access to the flash memory space by means of a MOV instruction, etc., is not permitted while the P bit or E bit is set. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. A wait time is necessary after the SWE bit is cleared. For details see table 21.19 in section 21.2.6, Flash Memory Characteristics. Rev. 2.00 Sep 20, 2005 page 574 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations (including emulation in RAM). Bus release must also be disabled. 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. 9. Before programming, check that the chip is correctly mounted in the PROM writer. Overcurrent damage to the device can result if the index marks on the PROM writer socket, socket adapter, and chip are not correctly aligned. 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors. 11. A wait time of 100 µs or more is necessary when performing a read after a transition to normal mode from program, erase, or verify mode. 12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2, EBR, and RAMCR). Rev. 2.00 Sep 20, 2005 page 575 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Wait time: x Programming/ erasing possible Wait time: y φ Min 0 µs tOSC1 VCC tMDS FWE Min 0 µs MD2 to MD0*1 tMDS RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 21.2.6, Flash Memory Characteristics. Figure 18.16 Power-On/Off Timing (Boot Mode) Rev. 2.00 Sep 20, 2005 page 576 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Wait time: x Programming/ erasing possible Wait time: y φ Min 0 µs tOSC1 VCC FWE MD2 to MD0*1 tMDS RES SWE set SWE cleared SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 21.2.6, Flash Memory Characteristics. Figure 18.17 Power-On/Off Timing (User Program Mode) Rev. 2.00 Sep 20, 2005 page 577 of 800 REJ09B0260-0200 Programming/ erasing possible Wait time: x Wait time: x Programming/ erasing possible Wait time: y Wait time: x Programming/ erasing possible Wait time: y Wait time: y Wait time: x Programming/ erasing possible Section 18 Flash Memory [H8/3024F-ZTAT Version] φ tOSC1 VCC Min 0µs FWE *2 tMDS tMDS MD2 to MD0 tMDS tRESW RES SWE cleared SWE set SWE bit Mode change*1 Boot mode Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. 2. When making a transition from boot mode to another mode, the mode programming setup time tMDS must be satisfied with respect to RES clearance timing. 3. See section 21.2.6, Flash Memory Characteristics. Figure 18.18 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode) Rev. 2.00 Sep 20, 2005 page 578 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] 18.12 Notes when Converting the F-ZTAT Application Software to the Mask ROM Versions Please note the following when converting the F-ZTAT application software to the mask ROM versions. The values read from the internal registers for the flash ROM or the mask ROM version and F-ZTAT version differ as follows. Status Register Bit Value F-ZTAT Version Mask ROM Version FLMCR1 FWE 0 Application software running — (Is not read out) 1 Programming Application software running (Always read as 1) Note: This difference applies to all the F-ZTAT versions and all the mask ROM versions that have different ROM size. Rev. 2.00 Sep 20, 2005 page 579 of 800 REJ09B0260-0200 Section 18 Flash Memory [H8/3024F-ZTAT Version] Rev. 2.00 Sep 20, 2005 page 580 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator Section 19 Clock Pulse Generator 19.1 Overview The H8/3024 Group has a built-in clock pulse generator (CPG) that generates the system clock (φ) and other internal clock signals (φ/2 to φ/4096). After duty adjustment, a frequency divider divides the clock frequency to generate the system clock (φ). The system clock is output at the φ pin*1 and furnished as a master clock to prescalers that supply clock signals to the on-chip supporting modules. Frequency division ratios of 1/1, 1/2, 1/4, and 1/8 can be selected for the frequency divider by settings in a division control register (DIVCR)*2. Power consumption in the chip is reduced in almost direct proportion to the frequency division ratio. Notes: 1. Usage of the φ pin differs depending on the chip operating mode and the PSTOP bit setting in the module standby control register (MSTCR). For details, see section 20.7, System Clock Output Disabling Function. 2. The division ratio of the frequency divider can be changed dynamically during operation. The clock output at the φ pin also changes when the division ratio is changed. The frequency output at the φ pin is shown below. φ = EXTAL × n where, EXTAL: Frequency of crystal resonator or external clock signal n: Frequency division ratio (n = 1/1, 1/2, 1/4, or 1/8) Rev. 2.00 Sep 20, 2005 page 581 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator 19.1.1 Block Diagram Figure 19.1 shows a block diagram of the clock pulse generator. CPG XTAL Oscillator EXTAL Duty adjustment circuit Frequency divider φ Prescalers Division control register Data bus φ pin Figure 19.1 Block Diagram of Clock Pulse Generator Rev. 2.00 Sep 20, 2005 page 582 of 800 REJ09B0260-0200 φ/2 to φ/4096 Section 19 Clock Pulse Generator 19.2 Oscillator Circuit Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock signal. 19.2.1 Connecting a Crystal Resonator Circuit Configuration: A crystal resonator can be connected as in the example in figure 19.2. Damping resistance Rd should be selected according to table 19.1 (1), and external capacitances CL1 and CL2 according to table 19.1 (2). An AT-cut parallel-resonance crystal should be used. CL1 EXTAL XTAL Rd CL2 Figure 19.2 Connection of Crystal Resonator (Example) If a crystal resonator with a frequency higher than 20 MHz is connected, the external load capacitance values in table 19.1 (2) should not exceed 10 [pF]. Also, in order to improve the accuracy of the oscillation frequency, a thorough study of oscillation matching evaluation, etc., should be carried out when deciding the circuit constants. Table 19.1 (1) Damping Resistance Value Damping Resistance Value 2 2 < f ≤ 4 4 < f ≤8 8 < f ≤ 10 10 < f ≤ 13 13 < f ≤ 16 16 < f ≤ 18 18 < f ≤ 25 Rd (Ω) 500 1k Frequency f (MHz) 200 0 0 0 0 0 Note: A crystal resonator between 2 MHz and 25 MHz can be used. Table 19.1 (2) External Capacitance Values External Capacitance Value 3.3 V Version Frequency f (MHz) 16 < f ≤ 25 2 ≤ f ≤ 16 CL1 = CL2 (pF) 10 to 22 22 Rev. 2.00 Sep 20, 2005 page 583 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator Crystal Resonator: Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal resonator should have the characteristics listed in table 19.2. CL L Rs XTAL EXTAL AT-cut parallel-resonance type C0 Figure 19.3 Crystal Resonator Equivalent Circuit Table 19.2 Crystal Resonator Parameters Frequency (MHz) 2 4 8 10 12 16 18 20 25 Rs max (Ω) 500 120 80 70 60 50 40 40 40 Co (pF) 7 pF max Use a crystal resonator with a frequency equal to the system clock frequency (φ). Notes on Board Design: When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 19.4. When the board is designed, the crystal resonator and its load capacitors should be placed as close as possible to the XTAL and EXTAL pins. Avoid Signal A C L2 Signal B H8/3024 Group XTAL EXTAL C L1 Figure 19.4 Oscillator Circuit Block Board Design Precautions Rev. 2.00 Sep 20, 2005 page 584 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator 19.2.2 External Clock Input Circuit Configuration: An external clock signal can be input as shown in the examples in figure 19.5. If the XTAL pin is left open, the stray capacitance should not exceed 10 pF. If the stray capacitance at the XTAL pin exceeds 10 pF in configuration a, use the connection shown in configuration b instead, and hold the external clock high in standby mode. External clock input EXTAL XTAL Open a. XTAL pin left open External clock input EXTAL XTAL b. Complementary clock input at XTAL pin Figure 19.5 External Clock Input (Examples) External Clock: The external clock frequency should be equal to the system clock frequency when not divided by the on-chip frequency divider. Table 19.3 shows the clock timing, figure 19.6 shows the external clock input timing, and figure 19.7 shows the external clock output settling delay timing. When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the on-chip oscillator and duty adjustment circuit. When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the on-chip oscillator and duty adjustment circuit. The resulting stable clock is output to external devices after the external clock settling time (tDEXT) has passed after the clock input. The system must remain reset with the reset signal low during tDEXT, while the clock output is unstable. Rev. 2.00 Sep 20, 2005 page 585 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator Table 19.3 (1) Clock Timing for On-Chip Flash Memory Versions VCC = 3.0 V to 3.6 V Item Symbol Min External clock input low pulse width tEXL External clock input high pulse width tEXH 55 External clock rise time tEXr — External clock fall time tEXf — 8 ns Clock low pulse width tCL 0.4 0.6 tcyc φ ≥ 5 MHz 80 — ns φ < 5 MHz 0.4 0.6 tcyc φ ≥ 5 MHz 80 — ns φ < 5 MHz 500 — µs Figure 19.7 Clock high pulse width External clock output settling delay time tCH tDEXT* Max Unit Test Conditions tcyc / 2 - 5 — ns φ > 8 MHz 55 — ns φ ≤ 8 MHz tcyc / 2 - 5 — ns φ > 8 MHz — ns φ ≤ 8 MHz 8 ns Figure 19.6 Figure 21.11 Note: * tDEXT includes a RES pulse width (tRESW ). tRESW = 20 tcyc Table 19.3 (2) Clock Timing for On-Chip Mask ROM Versions VCC = 3.0 V to 3.6 V Item Symbol Min External clock input low pulse width tEXL External clock input high pulse width tEXH External clock rise time Unit Test Conditions tcyc / 2 - 5 — ns φ > 8 MHz 55 — ns φ ≤ 8 MHz tcyc / 2 - 5 — ns φ > 8 MHz 55 — ns φ ≤ 8 MHz tEXr — 8 ns External clock fall time tEXf — 8 ns Clock low pulse width tCL 0.4 0.6 tcyc φ ≥ 5 MHz 80 — ns φ < 5 MHz 0.4 0.6 tcyc φ ≥ 5 MHz 80 — ns φ < 5 MHz 500 — µs Figure 19.7 Clock high pulse width External clock output settling delay time tCH tDEXT* Max Note: * tDEXT includes the RES pulse width (tRESW ). tRESW = 20 tcyc. Rev. 2.00 Sep 20, 2005 page 586 of 800 REJ09B0260-0200 Figure 19.6 Figure 21.11 Section 19 Clock Pulse Generator tEXH tEXL VCC × 0.7 EXTAL VCC × 0.5 0.3 V tEXr tEXf Figure 19.6 External Clock Input Timing VCC STBY VIH EXTAL φ (internal or external) RES tDEXT Figure 19.7 External Clock Output Settling Delay Timing 19.3 Duty Adjustment Circuit When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to generate φ. 19.4 Prescalers The prescalers divide the system clock (φ) to generate internal clocks (φ/2 to φ/4096). Rev. 2.00 Sep 20, 2005 page 587 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator 19.5 Frequency Divider The frequency divider divides the duty-adjusted clock signal to generate the system clock (φ). The frequency division ratio can be changed dynamically by modifying the value in DIVCR, as described below. Power consumption in the chip is reduced in almost direct proportion to the frequency division ratio. The system clock generated by the frequency divider can be output at the φ pin. 19.5.1 Register Configuration Table 19.4 summarizes the frequency division register. Table 19.4 Frequency Division Register Address* Name Abbreviation R/W Initial Value H'EE01B Division control register DIVCR R/W H'FC Note: * Lower 20 bits of the address in advanced mode. 19.5.2 Division Control Register (DIVCR) DIVCR is an 8-bit readable/writable register that selects the division ratio of the frequency divider. Bit 7 6 5 4 3 2 1 0 — — — — — — DIV1 DIV0 Initial value 1 1 1 1 1 1 0 0 Read/Write — — — — — — R/W R/W Reserved bits Divide bits 1 and 0 These bits select the frequency division ratio DIVCR is initialized to H'FC by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 2—Reserved: These bits cannot be modified and are always read as 1. Rev. 2.00 Sep 20, 2005 page 588 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator Bits 1 and 0—Divide (DIV1, DIV0): These bits select the frequency division ratio, as follows. Bit 1 DIV1 Bit 0 DIV0 Frequency Division Ratio 0 0 1/1 0 1 1/2 1 0 1/4 1 1 1/8 19.5.3 Usage Notes (Initial value) The DIVCR setting changes the φ frequency, so note the following points. • Select a frequency division ratio that stays within the assured operation range specified for the clock cycle time tcyc in the AC electrical characteristics. Note that ømin = lower limit of the operating frequency range. Ensure that ø is not below this lower limit. • All on-chip module operations are based on φ. Note that the timing of timer operations, serial communication, and other time-dependent processing differs before and after any change in the division ratio. The waiting time for exit from software standby mode also changes when the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby Mode. Rev. 2.00 Sep 20, 2005 page 589 of 800 REJ09B0260-0200 Section 19 Clock Pulse Generator Rev. 2.00 Sep 20, 2005 page 590 of 800 REJ09B0260-0200 Section 20 Power-Down State Section 20 Power-Down State 20.1 Overview The H8/3024 Group has a power-down state that greatly reduces power consumption by halting the CPU, and a module standby function that reduces power consumption by selectively halting on-chip modules. The power-down state includes the following three modes: • Sleep mode • Software standby mode • Hardware standby mode The module standby function can halt on-chip supporting modules independently of the powerdown state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, and A/D converter. Table 20.1 indicates the methods of entering and exiting the power-down modes and module standby mode, and gives the status of the CPU and on-chip supporting modules in each mode. Rev. 2.00 Sep 20, 2005 page 591 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 592 of 800 REJ09B0260-0200 Halted Halted Active Halted Halted Active SLEEP instruction executed while SSBY = 1 in SYSCR Low input at STBY pin Corresponding bit set to 1 in MSTCRH and MSTCRL Software standby mode Hardware standby mode Module standby — Undetermined Held Held CPU Registers Halted and reset Halted and reset Active 8-Bit Timer Halted and reset Halted and reset Active SCI0 Halted and reset Halted and reset Active SCI1 State Halted and reset Halted and reset Active A/D Halted and reset Halted and reset Active Other Modules Halted*1 Halted*1 Halted*1 Halted*1 Halted*1 Active and and and and and reset reset reset reset reset Halted and reset Halted and reset Active 16-Bit Timer High output Held — • NMI • IRQ0 to IRQ2 • RES • STBY • Interrupt • RES • STBY Exiting Conditions • STBY • RES • Clear MSTCR bit to 0*4 • STBY High impedance • RES — High impedance*1 Held*2 High impedance Held φ output Held Held I/O Ports φ clock Output*3 RAM Legend SYSCR: SSBY: MSTCRH: MSTCRL: System control register Software standby bit Module standby control register H Module standby control register L Notes: 1. State in which the corresponding MSTCR bit was set to 1. For details see section 20.2.2, Module Standby Control Register H (MSTCRH) and section 20.2.3, Module Standby Control Register L (MSTCRL). 2. The RAME bit must be cleared to 0 in SYSCR before the transition from the program execution state to hardware standby mode. 3. When P67 is used as the φ output pin. 4. When a MSTCR bit is set to 1, the registers of the corresponding on-chip supporting module are initialized. To restart the module, first clear the MSTCR bit to 0, then set up the module registers again. Halted Active SLEEP instruction executed while SSBY = 0 in SYSCR CPU Clock Sleep mode Mode Entering Conditions Section 20 Power-Down State Table 20.1 Power-Down State and Module Standby Function Section 20 Power-Down State 20.2 Register Configuration The H8/3024 Group has a system control register (SYSCR) that controls the power-down state, and module standby control registers H (MSTCRH) and L (MSTCRL) that control the module standby function. Table 20.2 summarizes these registers. Table 20.2 Control Register Address* Name Abbreviation R/W Initial Value H'EE012 System control register SYSCR R/W H'09 H'EE01C Module standby control register H MSTCRH R/W H'78 H'EE01D Module standby control register L MSTCRL R/W H'00 Note: * Lower 20 bits of the address in advanced mode. 20.2.1 System Control Register (SYSCR) Bit 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME Initial value 0 0 0 0 1 0 0 1 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W RAM enable Software standby output port enable NMI edge select User bit enable Standby timer select 2 to 0 These bits select the waiting time of the CPU and peripheral functions Software standby Enables transition to software standby mode SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY), bits 6 to 4 (STS2 to STS0), and bit 1 (SSOE) control the power-down state. For information on the other SYSCR bits, see section 3.3, System Control Register (SYSCR). Rev. 2.00 Sep 20, 2005 page 593 of 800 REJ09B0260-0200 Section 20 Power-Down State Bit 7—Software Standby (SSBY): Enables transition to software standby mode. When software standby mode is exited by an external interrupt, this bit remains set to 1 after the return to normal operation. To clear this bit, write 0. Bit 7 SSBY Description 0 SLEEP instruction causes transition to sleep mode 1 SLEEP instruction causes transition to software standby mode (Initial value) Bits 6 to 4—Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the clock to settle when software standby mode is exited by an external interrupt. If the clock is generated by a crystal resonator, set these bits according to the clock frequency so that the waiting time will be at least 7 ms. See table 20.3. If an external clock is used, choose a setting, according to the operating frequency, that gives a wait time of at least 100 µs. Bit 6 STS2 Bit 5 STS1 0 0 1 Bit 4 STS0 Description 0 Waiting time = 8,192 states 1 Waiting time = 16,384 states 0 Waiting time = 32,768 states 1 Waiting time = 65,536 states 1 0 0 Waiting time = 131,072 states 1 0 1 Waiting time = 262,144 states 1 1 0 Waiting time = 1,024 states 1 1 1 Illegal setting (Initial value) Bit 1—Software Standby Output Port Enable (SSOE): Specifies whether the address bus and bus control signals (CS0 to CS7, AS, RD, HWR, and LWR) are kept as outputs or fixed high, or placed in the high-impedance state in software standby mode. Bit 1 SSOE Description 0 In software standby mode, the address bus and bus control signals are all highimpedance (Initial value) 1 In software standby mode, the address bus retains its output state and bus control signals are fixed high Rev. 2.00 Sep 20, 2005 page 594 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.2.2 Module Standby Control Register H (MSTCRH) MSTCRH is an 8-bit readable/writable register that controls output of the system clock (φ). It also controls the module standby function, which places individual on-chip supporting modules in the standby state. Module standby can be designated for the SCI0, SCI1. Bit 7 6 5 4 3 2 PSTOP — — — — — Initial value 0 1 1 1 1 0 0 0 Read/Write R/W — — — — R/W R/W R/W Reserved bits 1 0 MSTPH1 MSTPH0 Module standby H1 to 0 These bits select modules to be placed in standby φ clock stop Enables or disables output of the system clock MSTCRH is initialized to H'78 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—φ φ Clock Stop (PSTOP): Enables or disables output of the system clock (φ). Bit 7 PSTOP Description 0 System clock output is enabled 1 System clock output is disabled (Initial value) Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 1. Bit 2—Reserved: This bit can be written and read. Bit 1—Module Standby H1 (MSTPH1): Selects whether to place the SCI1 in standby. Bit 1 MSTPH1 Description 0 SCI1 operates normally 1 SCI1 is in standby state (Initial value) Rev. 2.00 Sep 20, 2005 page 595 of 800 REJ09B0260-0200 Section 20 Power-Down State Bit 0—Module Standby H0 (MSTPH0): Selects whether to place the SCI0 in standby. Bit 0 MSTPH0 Description 0 SCI0 operates normally 1 SCI0 is in standby state 20.2.3 (Initial value) Module Standby Control Register L (MSTCRL) MSTCRL is an 8-bit readable/writable register that controls the module standby function, which places individual on-chip supporting modules in the standby state. Module standby can be designated for 16-bit timer, 8-bit timer, and A/D converter modules. Bit 7 6 5 4 3 2 MSTPL4 MSTPL3 MSTPL2 1 0 — — — — MSTPL0 Initial value 0 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W R/W Module standby L4 to L2, L0 These bits select modules to be placed in standby Reserved bits MSTCRL is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 5—Reserved: This bit can be written and read. Bit 4—Module Standby L4 (MSTPL4): Selects whether to place the 16-bit timer in standby. Bit 4 MSTPL4 Description 0 16-bit timer operates normally 1 16-bit timer is in standby state Rev. 2.00 Sep 20, 2005 page 596 of 800 REJ09B0260-0200 (Initial value) Section 20 Power-Down State Bit 3—Module Standby L3 (MSTPL3): Selects whether to place 8-bit timer channels 0 and 1 in standby. Bit 3 MSTPL3 Description 0 8-bit timer channels 0 and 1 operate normally 1 8-bit timer channels 0 and 1 are in standby state (Initial value) Bit 2—Module Standby L2 (MSTPL2): Selects whether to place 8-bit timer channels 2 and 3 in standby. Bit 2 MSTPL2 Description 0 8-bit timer channels 2 and 3 operate normally 1 8-bit timer channels 2 and 3 are in standby state (Initial value) Bit 1—Reserved: This bit can be written and read. Bit 0—Module Standby L0 (MSTPL0): Selects whether to place the A/D converter in standby. Bit 0 MSTPL0 Description 0 A/D converter operates normally 1 A/D converter is in standby state (Initial value) Rev. 2.00 Sep 20, 2005 page 597 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.3 Sleep Mode 20.3.1 Transition to Sleep Mode When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a transition from the program execution state to sleep mode. Immediately after executing the SLEEP instruction the CPU halts, but the contents of its internal registers are retained. On-chip supporting modules do not halt in sleep mode. Modules which have been placed in standby by the module standby function, however, remain halted. 20.3.2 Exit from Sleep Mode Sleep mode is exited by an interrupt, or by input at the RES or STBY pin. Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by an interrupt other than NMI if the interrupt is masked by interrupt priority settings and the settings of the I and UI bits in CCR, IPR. Exit by RES Input: Low input at the RES pin exits from sleep mode to the reset state. Exit by STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby mode. 20.4 Software Standby Mode 20.4.1 Transition to Software Standby Mode To enter software standby mode, execute the SLEEP instruction while the SSBY bit is set to 1 in SYSCR. In software standby mode, current dissipation is reduced to an extremely low level because the CPU, clock, and on-chip supporting modules all halt. On-chip supporting modules are reset and halted. As long as the specified voltage is supplied, however, CPU register contents and on-chip RAM data are retained. The settings of the I/O ports also held. When the WDT is used as a watchdog timer (WT/IT = 1), the TME bit must be cleared to 0 before setting SSBY. Also, when setting TME to 1, SSBY should be cleared to 0. Rev. 2.00 Sep 20, 2005 page 598 of 800 REJ09B0260-0200 Section 20 Power-Down State Clear the BRLE bit in BRCR (inhibiting bus release) before making a transition to software standby mode. 20.4.2 Exit from Software Standby Mode Software standby mode can be exited by input of an external interrupt at the NMI, IRQ0, IRQ1, or IRQ2 pin, or by input at the RES or STBY pin. Exit by Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is received, the clock oscillator begins operating. After the oscillator settling time selected by bits STS2 to STS0 in SYSCR, stable clock signals are supplied to the entire chip, software standby mode ends, and interrupt exception handling begins. Software standby mode is not exited if the interrupt enable bits of interrupts IRQ0, IRQ1, and IRQ2 are cleared to 0, or if these interrupts are masked in the CPU. Exit by RES Input: When the RES input goes low, the clock oscillator starts and clock pulses are supplied immediately to the entire chip. The RES signal must be held low long enough for the clock oscillator to stabilize. When RES goes high, the CPU starts reset exception handling. Exit by STBY Input: Low input at the STBY pin causes a transition to hardware standby mode. 20.4.3 Selection of Waiting Time for Exit from Software Standby Mode Bits STS2 to STS0 in SYSCR and bits DIV1 and DIV0 in DIVCR should be set as follows. Crystal Resonator: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time (for the clock to stabilize) is at least 7 ms. Table 20.3 indicates the waiting times that are selected by STS2 to STS0, DIV1, and DIV0 settings at various system clock frequencies. When Using an External Clock: Set bits STS2 to STS0 and bits DIV0 and DIV1 to give a wait time of at least 100 µs. Rev. 2.00 Sep 20, 2005 page 599 of 800 REJ09B0260-0200 Section 20 Power-Down State Table 20.3 Clock Frequency and Waiting Time for Clock to Settle DIV1 DIV0 STS2 STS1 STS0 Waiting Time 0 0 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 0 1 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 1 0 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 1 1 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 *: Recommended setting 25 MHz 0.3 0.7 1.3 2.6 5.2 10.5* 0.04 20 MHz 0.4 0.8 1.6 3.3 6.6 13.1* 0.05 18 MHz 0.46 0.91 1.8 3.6 7.3* 14.6 0.057 16 MHz 0.51 1.0 2.0 4.1 8.2* 16.4 0.064 0.7 1.3 2.6 5.2 10.5* 21.0 0.08 0.8 1.6 3.3 6.6 13.1* 26.2 0.10 0.91 1.8 3.6 7.3* 1.02 2.0 4.1 8.2* 14.6 29.1 0.11 16.4 32.8 0.13 1.3 2.6 5.2 10.5* 21.0 41.9 0.16 1.6 3.3 6.6 13.1* 26.2 52.4 0.20 1.8 3.6 7.3* 14.6 29.1 58.3 0.23 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 2.6 5.2 10.5 21.0* 41.9 83.9 0.33 3.3 6.6 13.1* 26.2 52.4 104.9 0.41 3.6 7.3* 14.6 29.1 58.3 116.5 0.46 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 Rev. 2.00 Sep 20, 2005 page 600 of 800 REJ09B0260-0200 12 MHz 10 MHz 0.65 0.8 1.3 1.6 2.7 3.3 5.5 6.6 10.9* 13.1* 21.8 26.2 0.085 0.10 Illegal setting 1.4 1.6 2.7 3.3 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 0.17 0.20 Illegal setting 2.7 3.3 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 87.4 104.9 0.34 0.41 Illegal setting 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 87.4 104.9 174.8 209.7 0.68 0.82 Illegal setting 8 MHz 6 MHz 4 MHz 1.0 1.3 2.0 2.0 2.7 4.1 4.1 5.5 8.2* 8.2* 10.9* 16.4 16.4 21.8 32.8 32.8 43.7 65.5 0.13 0.17 0.26 2 MHz 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 Unit ms 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 2.7 5.5 10.9* 21.8 43.7 87.4 0.34 4.0 8.2* 16.4 32.8 65.5 131.1 0.51 8.2* 16.4 32.8 65.5 131.1 262.1 1.0 ms 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 5.5 10.9* 21.8 43.7 87.4 174.8 0.68 8.2* 16.4 32.8 65.5 131.1 262.1 1.02 16.4* 32.8 65.5 131.1 262.1 524.3 2.0 ms 8.2* 16.4 32.8 65.5 131.1 262.1 1.0 10.9* 21.8 43.7 87.4 174.8 349.5 1.4 16.4* 32.8 65.5 131.1 262.1 524.3 2.0 32.8* ms 65.5 131.1 262.1 524.3 1048.6 4.1 Section 20 Power-Down State 20.4.4 Sample Application of Software Standby Mode Figure 20.1 shows an example in which software standby mode is entered at the fall of NMI and exited at the rise of NMI. With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit is set to 1; then the SLEEP instruction is executed to enter software standby mode. Software standby mode is exited at the next rising edge of the NMI signal. Clock oscillator φ NMI NMIEG SSBY NMI interrupt handler NMIEG = 1 SSBY = 1 Software standby mode (powerdown state) Oscillator settling time (tosc2) NMI exception handling SLEEP instruction Figure 20.1 NMI Timing for Software Standby Mode (Example) 20.4.5 Usage Notes The I/O ports retain their existing states in software standby mode. If a port is in the high output state, its output current is not reduced. Rev. 2.00 Sep 20, 2005 page 601 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.5 Hardware Standby Mode 20.5.1 Transition to Hardware Standby Mode Regardless of its current state, the chip enters hardware standby mode whenever the STBY pin goes low. Hardware standby mode reduces power consumption drastically by halting all functions of the CPU, and on-chip supporting modules. All modules are reset except the on-chip RAM. As long as the specified voltage is supplied, on-chip RAM data is retained. I/O ports are placed in the high-impedance state. Clear the RAME bit to 0 in SYSCR before STBY goes low to retain on-chip RAM data. The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby mode. 20.5.2 Exit from Hardware Standby Mode Hardware standby mode is exited by inputs at the STBY and RES pins. While RES is low, when STBY goes high, the clock oscillator starts running. RES should be held low long enough for the clock oscillator to settle. When RES goes high, reset exception handling begins, followed by a transition to the program execution state. Rev. 2.00 Sep 20, 2005 page 602 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.5.3 Timing for Hardware Standby Mode Figure 20.2 shows the timing relationships for hardware standby mode. To enter hardware standby mode, first drive RES low, then drive STBY low. To exit hardware standby mode, first drive STBY high, wait for the clock to settle, then bring RES from low to high. Clock oscillator RES STBY Oscillator settling time Reset exception handling Figure 20.2 Hardware Standby Mode Timing Rev. 2.00 Sep 20, 2005 page 603 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.6 Module Standby Function 20.6.1 Module Standby Timing The module standby function can halt several of the on-chip supporting modules (SCI1, SCI0, 16bit timer, 8-bit timer, and A/D converter) independently in the power-down state. This standby function is controlled by bits MSTPH2 to MSTPH0 in MSTCRH and bits MSTPL7 to MSTPL0 in MSTCRL. When one of these bits is set to 1, the corresponding on-chip supporting module is placed in standby and halts at the beginning of the next bus cycle after the MSTCR write cycle. 20.6.2 Read/Write in Module Standby When an on-chip supporting module is in module standby, read/write access to its registers is disabled. Read access always results in H'FF data. Write access is ignored. 20.6.3 Usage Notes When using the module standby function, note the following points. On-chip Supporting Module Interrupts: Before setting a module standby bit, first disable interrupts by that module. When an on-chip supporting module is placed in standby by the module standby function, its registers are initialized, including registers with interrupt request flags. Pin States: Pins used by an on-chip supporting module lose their module functions when the module is placed in module standby. What happens after that depends on the particular pin. For details, see section 7, I/O Ports. Pins that change from the input to the output state require special care. For example, if SCI1 is placed in module standby, the receive data pin loses its receive data function and becomes a port pin. If its port DDR bit is set to 1, the pin becomes a data output pin, and its output may collide with external SCI transmit data. Data collision should be prevented by clearing the port DDR bit to 0 or taking other appropriate action. Register Resetting: When an on-chip supporting module is halted by the module standby function, all its registers are initialized. To restart the module, after its MSTCR bit is cleared to 0, its registers must be set up again. It is not possible to write to the registers while the MSTCR bit is set to 1. Rev. 2.00 Sep 20, 2005 page 604 of 800 REJ09B0260-0200 Section 20 Power-Down State 20.7 System Clock Output Disabling Function Output of the system clock (φ) can be controlled by the PSTOP bit in MSTCRH. When the PSTOP bit is set to 1, output of the system clock halts and the φ pin is placed in the highimpedance state. Figure 20.3 shows the timing of the starting and stopping of system clock output. When the PSTOP bit is cleared to 0, output of the system clock is enabled. Table 20.4 indicates the state of the φ pin in various operating states. MSTCRH write cycle MSTCRH write cycle (PSTOP = 1) (PSTOP = 0) T1 T2 T3 T1 T2 T3 φ pin High-impedance Figure 20.3 Starting and Stopping of System Clock Output Table 20.4 φ Pin State in Various Operating States Operating State PSTOP = 0 PSTOP = 1 Hardware standby High-impedance High-impedance Software standby Always high High-impedance Sleep mode System clock output High-impedance Normal operation System clock output High-impedance Rev. 2.00 Sep 20, 2005 page 605 of 800 REJ09B0260-0200 Section 20 Power-Down State Rev. 2.00 Sep 20, 2005 page 606 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Section 21 Electrical Characteristics 21.1 Electrical Characteristics of H8/3024 Mask ROM Version and H8/3026 Mask ROM Version 21.1.1 Absolute Maximum Ratings Table 21.1 lists the absolute maximum ratings. Table 21.1 Absolute Maximum Ratings Item Symbol Value Unit Power supply voltage VCC –0.3 to +4.6 V Input voltage (except for port 7) Vin –0.3 to VCC +0.3 V Input voltage (port 7) Vin –0.3 to AVCC +0.3 V Reference voltage VREF –0.3 to AVCC +0.3 V Analog power supply voltage AVCC –0.3 to +4.6 V Analog input voltage VAN –0.3 to AVCC +0.3 V Operating temperature Topr Regular specifications: –20 to +75 °C Wide-range specifications: –40 to +85 °C –55 to +125 °C Storage temperature Tstg Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Rev. 2.00 Sep 20, 2005 page 607 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.1.2 DC Characteristics Table 21.2 DC Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Typ Max Unit Test Conditions VT – VCC × 0.2 — — V VT + — — VCC × 0.7 V VCC × 0.05 — — V VCC × 0.9 — VCC + 0.3 V EXTAL VCC × 0.7 — VCC + 0.3 V Port 7 VCC × 0.7 — AVCC + 0.3 V Ports 1 to 6 P83, P84, P90 to P95, port B VCC × 0.7 — VCC + 0.3 V –0.3 — VCC × 0.1 V NMI, EXTAL, ports 1 to 7 P83, P84, P90 to P95, port B –0.3 — Output high voltage All output pins VOH (except RESO) VCC – 0.5 Output low voltage All output pins VOL (except RESO) Ports 1, 2, and 5 Schmitt trigger Port A, input voltages P80 to P82 + VT – VT Input high voltage Input low voltage RES, STBY, – VIH NMI, MD2 to MD0 RES, STBY, VIL MD2 to MD0 VCC × 0.2 V VCC < 4.0 V 0.8 V VCC = 4.0 to 5.5 V — — V IOH = –200 µA VCC – 1.0 — — V IOH = –1 mA — — 0.4 V IOL = 1.6 mA — — 1.0 V IOL = 5 mA (VCC < 4.0 V) IOL = 10 mA (VCC = 4.0 to 5.5 V) RESO Rev. 2.00 Sep 20, 2005 page 608 of 800 REJ09B0260-0200 — — 0.4 V IOL = 1.6 mA Section 21 Electrical Characteristics Item Input leakage STBY, RES, current NMI, MD2 to MD0 Symbol Min Typ Max Unit Test Conditions |Iin| — — 1.0 µA Vin = 0.5 V to VCC – 0.5 V — — 1.0 µA Vin = 0.5 V to AVCC – 0.5 V — — 1.0 µA Vin = 0.5 V to VCC – 0.5 V — — 10.0 µA Vin = 0 V Port 7 Three-state leakage current Ports 1 to 6 Ports 8 to B Input pull-up MOS current Ports 2, 4, and 5 –Ip 10 — 300 µA Vin = 0 V Input capacitance NMI Cin — — 50 pF — — 15 pF Vin = 0 V f = fmin Ta = 25°C Current dissipation*2 Normal operation — 37 58 (3.3 V) mA f = 25 MHz Sleep mode — 29 47 (3.3 V) mA f = 25 MHz Module standby mode — 21 37 (3.3 V) mA f = 25 MHz Standby mode — 1.0 10.0 µA Ta ≤ 50°C — — 20.0 µA 50°C < Ta — 0.6 1.5 mA AVCC = 3.0 V During A/D and D/A conversion — 0.6 1.5 mA AVCC = 3.0 V Idle — 0.01 5.0 µA DASTE = 0 — 0.45 0.8 mA VREF = 3.0 V During A/D and D/A conversion — 2.0 3.0 mA VREF = 3.0 V Idle — 0.01 5.0 µA DASTE = 0 2.0 — — V RESO All input pins except NMI Analog power During A/D supply current conversion Reference current |ITSI| During A/D conversion RAM standby voltage ICC*3 AICC AICC VRAM Notes: 1. Do not open the pin connections of the AVCC, VREF and AVSS pins while the A/D converter is not in use. Connect the AVCC and VREF pins to the VCC and connect the AVSS pin to the VSS, respectively. Rev. 2.00 Sep 20, 2005 page 609 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 2. Given current consumption values are when all the output pins are made to unloaded state and, furthermore, when the on-chip pull-up MOS is turned off under conditions that VIH min = VCC – 0.5 V and VIL max = 0.5 V. Also, the aforesaid current consumption values are when VIH min = VCC × 0.9 and VIL max = 0.3 V under the condition of VRAM ≤ VCC < 3.0 V. 3. ICC max. (under normal operations) = 3.0 (mA) + 0.61 (mA/(MHz × V)) × VCC × f ICC max. (when using the sleeve) = 3.0 (mA) + 0.49 (mA/(MHz × V)) × VCC x f ICC max. (when the sleeve + module are standing by) = 3.0 (mA) + 0.38 (mA/(MHz × V)) × VCC × f Also, the typ. values for current dissipation are reference values. Table 21.3 Permissible Output Currents Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Permissible output low current (per pin) Ports 1, 2, and 5 Permissible output low current (total) Total of 20 pins in Ports 1, 2, and 5 IOL Other output pins ΣIOL Total of all output pins, including the above Min Typ Max Unit — — 10 mA — — 2.0 mA — — 80 mA — — 120 mA Permissible output high current (per pin) All output pins |–IOH| — — 2.0 mA Permissible output high current (total) Total of all output pins |–ΣIOH| — — 40 mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.3. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 21.1 and 21.2. Rev. 2.00 Sep 20, 2005 page 610 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics H8/3024 mask ROM version H8/3026 mask ROM version 2 kΩ Port Darlington pair Figure 21.1 Darlington Pair Drive Circuit (Example) H8/3024 mask ROM version H8/3026 mask ROM version 600 Ω Ports 1, 2, 5 LED Figure 21.2 Sample LED Circuit 21.1.3 AC Characteristics Clock timing parameters are listed in table 21.4, control signal timing parameters in table 21.5, and bus timing parameters in table 21.6. Timing parameters of the on-chip supporting modules are listed in table 21.7. Rev. 2.00 Sep 20, 2005 page 611 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Table 21.4 Clock Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Max Unit Test Conditions Clock cycle time tcyc 40 500 ns Figure 21.11 Clock pulse low width tCL 10 — ns Clock pulse high width tCH 10 — ns Clock rise time tCr — 10 ns Clock fall time tCf — 10 ns Clock oscillator settling time at reset tOSC1 20 — ms Figure 21.7 Clock oscillator settling time in software standby tOSC2 7 — ms Figure 20.1 Table 21.5 Control Signal Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item RES setup time RES pulse width Mode programming setup time RESO output delay time RESO output pulse width NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width (in recovery Symbol Min Max Unit Test Conditions tRESS 150 — ns Figure 21.8 tRESW 20 — tcyc tMDS 200 — ns tRESD — 50 ns tRESOW 132 — tcyc tNMIS 150 — ns tNMIH 10 — ns tNMIW 200 — ns from software standby mode) Rev. 2.00 Sep 20, 2005 page 612 of 800 REJ09B0260-0200 Figure 21.9 Figure 21.10 Section 21 Electrical Characteristics Table 21.6 Bus Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Max Unit Test Conditions Address delay time tAD — 25 ns Address hold time tAH 0.5 tcyc – 20 — ns Figure 21.11, figure 21.12 Read strobe delay time tRSD — 25 ns Address strobe delay time tASD — 25 ns Write strobe delay time tWSD — 25 ns Strobe delay time tSD — 25 ns Write strobe pulse width 1 tWSW1 1.0 tcyc – 25 — ns Write strobe pulse width 2 tWSW2 1.5 tcyc – 25 — ns Address setup time 1 tAS1 0.5 tcyc – 20 — ns Address setup time 2 tAS2 1.0 tcyc – 20 — ns Read data setup time tRDS 25 — ns Read data hold time tRDH 0 — ns Write data delay time tWDD — 35 ns Write data setup time 1 tWDS1 1.0 tcyc – 30 — ns Write data setup time 2 tWDS2 2.0 tcyc – 30 — ns Write data hold time tWDH 0.5 tcyc – 15 — ns Read data access time 1 tACC1 — 2.0 tcyc – 45 ns Read data access time 2 tACC2 — 3.0 tcyc – 45 ns Read data access time 3 tACC3 — 1.5 tcyc – 45 ns Read data access time 4 tACC4 — 2.5 tcyc – 45 ns Precharge time 1 tPCH1 1.0 tcyc – 20 — ns Precharge time 2 tPCH2 0.5 tcyc – 20 — ns Wait setup time tWTS 25 — ns Wait hold time tWTH 5 — ns Bus request setup time tBRQS 25 — ns Bus acknowledge delay time 1 tBACD1 — 30 ns Bus acknowledge delay time 2 tBACD2 — 30 ns Bus-floating time — 30 ns tBZD Figure 21.13 Figure 21.14 Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. Rev. 2.00 Sep 20, 2005 page 613 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Table 21.7 Timing of On-Chip Supporting Modules Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Module Item Symbol Min Max Unit Test Conditions Ports and TPC Output data delay time tPWD — 50 ns Figure 21.15 Input data setup time tPRS 50 — ns Input data hold time tPRH 50 — ns Timer output delay time tTOCD — 50 ns Timer input setup time tTICS 50 — ns Timer clock input setup time tTCKS 50 — ns Single edge tTCKWH 1.5 — tcyc Both edges tTCKWL 2.5 — tcyc Timer output delay time tTOCD — 50 ns Timer input setup time tTICS 50 — ns Timer clock input setup time tTCKS 50 — ns Timer clock pulse width Single edge tTCKWH 1.5 — tcyc Both edges tTCKWL 2.5 — tcyc Input clock cycle Asynchronous tScyc 4 — tcyc Synchronous 6 — tcyc 16-bit timer Timer clock pulse width 8-bit timer SCI Input clock rise time tSCKr 1.5 — tcyc Input clock fall time tSCKf 1.5 — tcyc Input clock pulse width tSCKW 0.4 0.6 tScyc Transmit data delay time tTXD — 100 ns Receive data setup time (synchronous) tRXS 100 — ns Receive data hold time (synchronous) tRXH 100 — ns 0 — ns Clock input Clock output Rev. 2.00 Sep 20, 2005 page 614 of 800 REJ09B0260-0200 Figure 21.16 Figure 21.17 Figure 21.16 Figure 21.17 Figure 21.18 Figure 21.19 Section 21 Electrical Characteristics RL C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B, RESO Chip output pin R L = 2.4 k Ω R H = 12 k Ω C RH Input/output timing measurement levels • Low: 0.8 V • High: 2.0 V Figure 21.3 Output Load Circuit Rev. 2.00 Sep 20, 2005 page 615 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.1.4 A/D Conversion Characteristics Table 21.8 lists the A/D conversion characteristics. Table 21.8 A/D Conversion Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Conversion time: 134 states Min Typ Max Unit Resolution 10 10 10 bits Conversion time (single mode) 5.36 — — µs Analog input capacitance — — 20 pF φ ≤ 13 MHz — — 10 kΩ φ > 13 MHz Permissible signalsource impedance Conversion time: 70 states — — 5 kΩ Nonlinearity error — — ±3.5 LSB Offset error — — ±3.5 LSB Full-scale error — — ±3.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Resolution 10 10 10 bits Conversion time (single mode) 5.36 — — µs Analog input capacitance — — 20 pF φ ≤ 13 MHz — — 5 kΩ φ > 13 MHz — — 3 kΩ Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Permissible signalsource impedance Rev. 2.00 Sep 20, 2005 page 616 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.1.5 D/A Conversion Characteristics Table 21.9 lists the D/A conversion characteristics. Table 21.9 D/A Conversion Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Min Typ Max Unit Resolution 8 8 8 bits Test Conditions Conversion time (centering time) — — 10 µs 20 pF capacitive load Absolute accuracy — ±2.0 ±3.0 LSB 2 MΩ resistive load — — ±2.0 LSB 4 MΩ resistive load Rev. 2.00 Sep 20, 2005 page 617 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.2 Electrical Characteristics of H8/3024F-ZTAT Version and H8/3026F-ZTAT Version 21.2.1 Absolute Maximum Ratings Table 21.10 lists the absolute maximum ratings. Table 21.10 Absolute Maximum Ratings Item Symbol Value Unit Power supply voltage VCC –0.3 to +4.6 V Input voltage (except for port 7) Vin –0.3 to VCC +0.3 V Input voltage (port 7) Vin –0.3 to AVCC +0.3 V Reference voltage VREF –0.3 to AVCC +0.3 V Analog power supply voltage AVCC –0.3 to +4.6 V Analog input voltage VAN –0.3 to AVCC +0.3 V Operating temperature Topr Regular specifications: –20 to +75 °C Wide-range specifications: –40 to +85 °C –55 to +125 °C Storage temperature Tstg Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Rev. 2.00 Sep 20, 2005 page 618 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.2.2 DC Characteristics Table 21.11 DC Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Typ Max VT – VCC × 0.2 — — V VT + — — VCC × 0.7 V VCC × 0.05 — — V VCC × 0.9 — VCC + 0.3 V EXTAL VCC × 0.7 — VCC + 0.3 V Port 7 VCC × 0.7 — AVCC + 0.3 V Ports 1 to 6 P83, P84, P90 to P95, port B VCC × 0.7 — VCC + 0.3 V –0.3 — VCC × 0.1 V NMI, EXTAL, ports 1 to 7 P83, P84, P90 to P95, port B –0.3 — VCC × 0.2 V VCC < 4.0 V 0.8 V VCC = 4.0 to 5.5 V Output high voltage All output pins VOH (except RESO) VCC – 0.5 — — V IOH = –200 µA VCC – 1.0 — — V IOH = –1 mA Output low voltage All output pins VOL (except RESO) — — 0.4 V IOL = 1.6 mA Ports 1, 2, and 5 — — 1.0 V IOL = 5 mA (VCC < 4.0 V) Schmitt trigger Port A, input voltages P80 to P82 + VT – VT Input high voltage Input low voltage RES, STBY, VIH – Unit Test Conditions NMI, MD2 to MD0 RES, STBY, VIL MD2 to MD0 IOL = 10 mA (VCC = 4.0 to 5.5 V) RESO — — 0.4 V IOL = 1.6 mA Rev. 2.00 Sep 20, 2005 page 619 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Item Input leakage STBY, RES, current NMI, MD2 to MD0 Symbol Min Typ Max Unit Test Conditions |Iin| — — 1.0 µA Vin = 0.5 V to VCC – 0.5 V — — 1.0 µA Vin = 0.5 V to AVCC – 0.5 V — — 1.0 µA Vin = 0.5 V to VCC – 0.5 V — — 10.0 µA Vin = 0 V Port 7 Three-state leakage current Ports 1 to 6 Ports 8 to B Input pull-up MOS current Ports 2, 4, and 5 –Ip 10 — 300 µA Vin = 0 V Input capacitance NMI Cin — — 50 pF — — 15 pF Vin = 0 V f = fmin Ta = 25°C Current dissipation*2 Normal operation — 37 58 (3.3 V) mA f = 25 MHz Sleep mode — 29 47 (3.3 V) mA f = 25 MHz Module standby mode — 21 37 (3.3 V) mA f = 25 MHz Standby mode — 1.0 µA Ta ≤ 50°C — — 20.0 µA 50°C < Ta — 0.6 1.5 mA AVCC = 3.0 V During A/D and D/A conversion — 0.6 1.5 mA AVCC = 3.0 V Idle — 0.01 5.0 µA DASTE = 0 — 0.45 0.8 mA VREF = 3.0 V During A/D and D/A conversion — 2.0 3.0 mA VREF = 3.0 V Idle — 0.01 5.0 µA DASTE = 0 2.0 — — V RESO All input pins except NMI Analog power During A/D supply current conversion Reference current |ITSI| During A/D conversion RAM standby voltage ICC*3 AICC AICC VRAM 10.0 Notes: 1. Do not open the pin connections of the AVCC, VREF and AVSS pins while the A/D converter is not in use. Connect the AVCC and VREF pins to the VCC and connect the AVSS pin to the VSS, respectively. Rev. 2.00 Sep 20, 2005 page 620 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 2. Given current consumption values are when all the output pins are made to unloaded state and, furthermore, when the on-chip pull-up MOS is turned off under conditions that VIH min = VCC – 0.5 V and VIL max = 0.5 V. Also, the aforesaid current consumption values are when VIH min = VCC × 0.9 and VIL max = 0.3 V under the condition of VRAM ≤ VCC < 3.0 V. 3. ICC max. (under normal operations) = 3.0 (mA) + 0.61 (mA/(MHz × V)) × VCC × f ICC max. (when using the sleeve) = 3.0 (mA) + 0.49 (mA/(MHz × V)) × VCC x f ICC max. (when the sleeve + module are standing by) = 3.0 (mA) + 0.38 (mA/(MHz × V)) × VCC × f Also, the typ. values for current dissipation are reference values. Table 21.12 Permissible Output Currents Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Permissible output low current (per pin) Ports 1, 2, and 5 Permissible output low current (total) Total of 20 pins in Ports 1, 2, and 5 IOL Other output pins ΣIOL Total of all output pins, including the above Min Typ Max Unit — — 10 mA — — 2.0 mA — — 80 mA — — 120 mA Permissible output high current (per pin) All output pins |–IOH| — — 2.0 mA Permissible output high current (total) Total of all output pins |–ΣIOH| — — 40 mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.12. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 21.4 and 21.5. Rev. 2.00 Sep 20, 2005 page 621 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics H8/3024F-ZTAT version H8/3026F-ZTAT version 2 kΩ Port Darlington pair Figure 21.4 Darlington Pair Drive Circuit (Example) H8/3024F-ZTAT version H8/3026F-ZTAT version 600 Ω Ports 1, 2, 5 LED Figure 21.5 Sample LED Circuit 21.2.3 AC Characteristics Clock timing parameters are listed in table 21.13, control signal timing parameters in table 21.14, and bus timing parameters in table 21.15. Timing parameters of the on-chip supporting modules are listed in table 21.16. Rev. 2.00 Sep 20, 2005 page 622 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Table 21.13 Clock Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Max Unit Test Conditions Clock cycle time tcyc 40 500 ns Figure 21.11 Clock pulse low width tCL 10 — ns Clock pulse high width tCH 10 — ns Clock rise time tCr — 10 ns Clock fall time tCf — 10 ns Clock oscillator settling time at reset tOSC1 20 — ms Figure 21.7 Clock oscillator settling time in software standby tOSC2 7 — ms Figure 20.1 Table 21.14 Control Signal Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item RES setup time RES pulse width Mode programming setup time RESO output delay time RESO output pulse width NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width (in recovery Symbol Min Max Unit Test Conditions tRESS 150 — ns Figure 21.8 tRESW 20 — tcyc tMDS 200 — ns tRESD — 50 ns tRESOW 132 — tcyc tNMIS 150 — ns tNMIH 10 — ns tNMIW 200 — ns Figure 21.9 Figure 21.10 from software standby mode) Rev. 2.00 Sep 20, 2005 page 623 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Table 21.15 Bus Timing Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Symbol Min Max Unit Test Conditions Address delay time tAD — 25 ns Address hold time tAH 0.5 tcyc – 20 — ns Figure 21.11, figure 21.12 Read strobe delay time tRSD — 25 ns Address strobe delay time tASD — 25 ns Write strobe delay time tWSD — 25 ns Strobe delay time tSD — 25 ns Write strobe pulse width 1 tWSW1 1.0 tcyc – 25 — ns Write strobe pulse width 2 tWSW2 1.5 tcyc – 25 — ns Address setup time 1 tAS1 0.5 tcyc – 20 — ns Address setup time 2 tAS2 1.0 tcyc – 20 — ns Read data setup time tRDS 40 — ns Read data hold time tRDH 0 — ns Write data delay time tWDD — 35 ns Write data setup time 1 tWDS1 1.0 tcyc – 30 — ns Write data setup time 2 tWDS2 2.0 tcyc – 30 — ns Write data hold time tWDH 0.5 tcyc – 15 — ns Read data access time 1 tACC1 — 2.0 tcyc – 45 ns Read data access time 2 tACC2 — 3.0 tcyc – 45 ns Read data access time 3 tACC3 — 1.5 tcyc – 45 ns Read data access time 4 tACC4 — 2.5 tcyc – 45 ns Precharge time 1 tPCH1 1.0 tcyc – 20 — ns Precharge time 2 tPCH2 0.5 tcyc – 20 — ns Wait setup time tWTS 25 — ns Wait hold time tWTH 5 — ns Bus request setup time tBRQS 25 — ns Bus acknowledge delay time 1 tBACD1 — 30 ns Bus acknowledge delay time 2 tBACD2 — 30 ns Bus-floating time — 30 ns tBZD Figure 21.13 Figure 21.14 Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. Rev. 2.00 Sep 20, 2005 page 624 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Table 21.16 Timing of On-Chip Supporting Modules Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Module Item Symbol Min Max Unit Test Conditions Ports and TPC Output data delay time tPWD — 50 ns Figure 21.15 Input data setup time tPRS 50 — ns Input data hold time tPRH 50 — ns Timer output delay time tTOCD — 50 ns Timer input setup time tTICS 50 — ns Timer clock input setup time tTCKS 50 — ns Single edge tTCKWH 1.5 — tcyc Both edges tTCKWL 2.5 — tcyc Timer output delay time tTOCD — 50 ns Timer input setup time tTICS 50 — ns Timer clock input setup time tTCKS 50 — ns Timer clock pulse width Single edge tTCKWH 1.5 — tcyc Both edges tTCKWL 2.5 — tcyc Input clock cycle Asynchronous tScyc 4 — tcyc Synchronous 6 — tcyc 16-bit timer Timer clock pulse width 8-bit timer SCI Input clock rise time tSCKr 1.5 — tcyc Input clock fall time tSCKf 1.5 — tcyc Input clock pulse width tSCKW 0.4 0.6 tScyc Transmit data delay time tTXD — 100 ns Receive data setup time (synchronous) tRXS 100 — ns Receive data hold time (synchronous) tRXH 100 — ns 0 — ns Clock input Clock output Figure 21.16 Figure 21.17 Figure 21.16 Figure 21.17 Figure 21.18 Figure 21.19 Rev. 2.00 Sep 20, 2005 page 625 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics RL C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B, RESO Chip output pin R L = 2.4 k Ω R H = 12 k Ω C RH Input/output timing measurement levels • Low: 0.8 V • High: 2.0 V Figure 21.6 Output Load Circuit Rev. 2.00 Sep 20, 2005 page 626 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.2.4 A/D Conversion Characteristics Table 21.17 lists the A/D conversion characteristics. Table 21.17 A/D Conversion Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Conversion time: 134 states Min Typ Max Unit Resolution 10 10 10 bits Conversion time (single mode) 5.36 — — µs Analog input capacitance — — 20 pF φ ≤ 13 MHz — — 10 kΩ φ > 13 MHz Permissible signalsource impedance Conversion time: 70 states — — 5 kΩ Nonlinearity error — — ±3.5 LSB Offset error — — ±3.5 LSB Full-scale error — — ±3.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Resolution 10 10 10 bits Conversion time (single mode) 5.36 — — µs Analog input capacitance — — 20 pF φ ≤ 13 MHz — — 5 kΩ φ > 13 MHz — — 3 kΩ Nonlinearity error — — ±7.5 LSB Offset error — — ±7.5 LSB Full-scale error — — ±7.5 LSB Quantization error — — ±0.5 LSB Absolute accuracy — — ±4.0 LSB Permissible signalsource impedance Rev. 2.00 Sep 20, 2005 page 627 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.2.5 D/A Conversion Characteristics Table 21.18 lists the D/A conversion characteristics. Table 21.18 D/A Conversion Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Item Min Typ Max Unit Resolution 8 8 8 bits Conversion time (centering time) — — 10 µs 20 pF capacitive load Absolute accuracy — ±2.0 ±3.0 LSB 2 MΩ resistive load — — ±2.0 LSB 4 MΩ resistive load Rev. 2.00 Sep 20, 2005 page 628 of 800 REJ09B0260-0200 Test Conditions Section 21 Electrical Characteristics 21.2.6 Flash Memory Characteristics Table 21.19 shows the flash memory characteristics. Table 21.19 Flash Memory Characteristics Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VSS = AVSS = 0 V, Ta = 0°C to +75°C (operating temperature range for programming/erasing) Item Symbol Min 1 2 4 Programming time* * * tP — Erase time*1 *3 *5 tE — Reprogramming count NWEC Typ 10 100 6 100* 8 Max Unit 200 ms/ 128 bytes 1200 ms/block 7 10,000* — Times Notes Data retention period tDRP 10* — — Years Programming Wait time after SWE bit setting *1 Wait time after PSU bit setting *1 tsswe 1 1 — µs tspsu 50 50 — µs tsp30 28 30 32 µs Programming time wait tsp200 198 200 202 µs Programming time wait tsp10 8 10 12 µs Additionalprogramming time wait tcp 5 5 — µs tcpsu 5 5 — µs tspv 4 4 — µs 2 2 — µs 2 2 — µs µs Wait time after P bit setting *1 *4 Wait time after P bit clear *1 1 Wait time after PSU bit clear * Wait time after PV bit setting *1 1 Wait time after H'FF dummy write* tspvr Wait time after PV bit clear *1 tcpv 1 * Wait time after SWE bit clear tcswe 100 100 — Maximum programming count* * Wait time after SWE bit setting *1 N — — 1000 Times tsswe 1 1 — µs Wait time after ESU bit setting *1 1 5 Wait time after E bit setting * * tsesu 100 100 — µs tse 10 10 100 ms Wait time after E bit clear *1 tce 10 10 — µs Wait time after ESU bit clear *1 Wait time after EV bit setting *1 tcesu 10 10 — µs tsev 20 20 — µs Wait time after H'FF dummy write*1 tsevr Wait time after EV bit clear *1 tcev 2 2 — µs 4 4 — µs Wait time after SWE bit clear*1 Maximum erase count*1 *5 tcswe 100 100 — µs N 12 — 120 Times 1 Erase 4 Erase time wait Rev. 2.00 Sep 20, 2005 page 629 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR) is set. It does not include the programming verification time.) 3. Block erase time (Shows the total period for which the E-bit in FLMCR is set. It does not include the erase verification time.) 4. To specify the maximum programming time (tP(max)) in the 128-byte programming flowchart, set the maximum value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 µs Programming counter (n) = 7 to 1000: tsp200 = 200 µs Programming counter (n) [in additional programming] = 1 to 6: tsp10 = 10 µs 5. For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE(max) = Wait time after E bit setting (tse) × maximum erase count (N) To set the maximum erase time, the values of tse and N should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times 6. Minimum number of times at which all characteristics are guaranteed after reprogramming. (Reprogramming count from 1 to minimum value is guaranteed.) 7. Reference characteristics at 25°C. (This is an indication that reprogramming operations can normally be performed up to this figure.) 8. Data retention characteristics when reprogramming is performed correctly within the specification values, including the minimum data retention period. Rev. 2.00 Sep 20, 2005 page 630 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.3 Operational Timing This section shows timing diagrams. 21.3.1 Clock Timing Clock timing is shown as follows: • Oscillator settling timing Figure 21.7 shows the oscillator settling timing. φ VCC STBY tOSC1 tOSC1 RES Figure 21.7 Oscillator Settling Timing Rev. 2.00 Sep 20, 2005 page 631 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics 21.3.2 Control Signal Timing Control signal timing is shown as follows: • Reset input timing Figure 21.8 shows the reset input timing. • Reset output timing* Figure 21.9 shows the reset output timing. • Interrupt input timing Figure 21.10 shows the interrupt input timing for NMI and IRQ5 to IRQ0. φ tRESS tRESS RES tMDS tRESW FWE MD2 to MD0 Figure 21.8 Reset Input Timing φ tRESD tRESD RESO tRESOW Figure 21.9 Reset Output Timing* Note: * This function is used only in mask ROM models, and is not provided in flash memory models. Rev. 2.00 Sep 20, 2005 page 632 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics φ tNMIS tNMIH tNMIS tNMIH NMI IRQ E tNMIS IRQ L IRQ E : Edge-sensitive IRQ i IRQ L : Level-sensitive IRQ i (i = 0 to 5) tNMIW NMI IRQ j (j = 0 to 5) Figure 21.10 Interrupt Input Timing 21.3.3 Bus Timing Bus timing is shown as follows: • Basic bus cycle: two-state access Figure 21.11 shows the timing of the external two-state access cycle. • Basic bus cycle: three-state access Figure 21.12 shows the timing of the external three-state access cycle. • Basic bus cycle: three-state access with one wait state Figure 21.13 shows the timing of the external three-state access cycle with one wait state inserted. • Bus-release mode timing Figure 21.14 shows the bus-release mode timing. Rev. 2.00 Sep 20, 2005 page 633 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics T1 tcyc T2 tCH tCL φ tCf tAD tcyc tCr A23 to A0, CSn tPCH1 AS RD (read) tASD tACC3 tASD tACC3 tSD tAH tAS1 tRSD tPCH2 tAS1 tACC1 tRDH* tRDS D15 to D0 (read) tPCH1 tASD HWR, LWR (write) tSD tAH tAS1 tWDD tWSW1 tWDS1 tWDH D15 to D0 (write) Note: * Specification from the earliest negation timing of A23 to A0, CSn, and RD. Figure 21.11 Basic Bus Cycle: Two-State Access Rev. 2.00 Sep 20, 2005 page 634 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics T1 T2 T3 φ A23 to A0, CSn tACC4 AS tACC4 RD (read) tACC2 tRDS D15 to D0 (read) tWSD HWR, LWR (write) tWSW2 tAS2 tWDD tWDS2 D15 to D0 (write) Figure 21.12 Basic Bus Cycle: Three-State Access Rev. 2.00 Sep 20, 2005 page 635 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics T1 T2 TW T3 φ A23 to A0, CSn AS RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) tWTS tWTH tWTS tWTH WAIT Figure 21.13 Basic Bus Cycle: Three-State Access with One Wait State φ tBRQS tBRQS BREQ tBACD2 tBACD1 BACK tBZD A23 to A0, AS, RD, HWR, LWR Figure 21.14 Bus-Release Mode Timing Rev. 2.00 Sep 20, 2005 page 636 of 800 REJ09B0260-0200 tBZD Section 21 Electrical Characteristics 21.3.4 TPC and I/O Port Timing Figure 21.15 shows the TPC and I/O port input/output timing. T1 T2 T3 φ tPRS tPRH Port 1 to B (read) tPWD Port 1 to 6, 8 to B (write) Figure 21.15 TPC and I/O Port Input/Output Timing 21.3.5 Timer Input/Output Timing 16-bit timer and 8-bit timer timing is shown below. • Timer input/output timing Figure 21.16 shows the timer input/output timing. • Timer external clock input timing Figure 21.17 shows the timer external clock input timing. φ tTOCD Output compare*1 tTICS Input capture*2 Notes: 1. TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMO0, TMO2, TMIO1, TMIO3 2. TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMIO1, TMIO3 Figure 21.16 Timer Input/Output Timing Rev. 2.00 Sep 20, 2005 page 637 of 800 REJ09B0260-0200 Section 21 Electrical Characteristics tTCKS φ tTCKS TCLKA to TCLKD tTCKWL tTCKWH Figure 21.17 Timer External Clock Input Timing 21.3.6 SCI Input/Output Timing SCI timing is shown as follows: • SCI input clock timing Figure 21.18 shows the SCI input clock timing. • SCI input/output timing (synchronous mode) Figure 21.19 shows the SCI input/output timing in synchronous mode. tSCKW tSCKr tSCKf SCK0, SCK1 tScyc Figure 21.18 SCI Input Clock Timing tScyc SCK0, SCK1 tTXD TxD0, TxD1 (transmit data) tRXS tRXH RxD0, RxD1 (receive data) Figure 21.19 SCI Input/Output Timing in Synchronous Mode Rev. 2.00 Sep 20, 2005 page 638 of 800 REJ09B0260-0200 Appendix A Instruction Set Appendix A Instruction Set A.1 Instruction List Operand Notation Symbol Description Rd General destination register Rs General source register Rn General register ERd General destination register (address register or 32-bit register) ERs General source register (address register or 32-bit register) ERn General register (32-bit register) (EAd) Destination operand (EAs) Source operand PC Program counter SP Stack pointer CCR Condition code register N N (negative) flag in CCR Z Z (zero) flag in CCR V V (overflow) flag in CCR C C (carry) flag in CCR disp Displacement → Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right + Addition of the operands on both sides – Subtraction of the operand on the right from the operand on the left × Multiplication of the operands on both sides ÷ Division of the operand on the left by the operand on the right ∧ Logical AND of the operands on both sides ∨ Logical OR of the operands on both sides ⊕ Exclusive logical OR of the operands on both sides ¬ NOT (logical complement) ( ), < > Contents of operand Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers (R0 to R7 and E0 to E7). Rev. 2.00 Sep 20, 2005 page 639 of 800 REJ09B0260-0200 Appendix A Instruction Set Condition Code Notation Symbol Description Changed according to execution result * Undetermined (no guaranteed value) 0 Cleared to 0 1 Set to 1 — Not affected by execution of the instruction ∆ Varies depending on conditions, described in notes Rev. 2.00 Sep 20, 2005 page 640 of 800 REJ09B0260-0200 Appendix A Instruction Set Table A.1 Instruction Set 1. Data transfer instructions I H N Z ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 0 — ↔ ↔ 0 — ↔ ↔ 0 — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 0 — ↔ ↔ 0 — ↔ ↔ 0 — MOV.W @(d:16, ERs), W Rd 4 @(d:16, ERs) → Rd16 — — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 0 — MOV.W @(d:24, ERs), W Rd 8 @(d:24, ERs) → Rd16 — — ↔ ↔ 0 — @ERs → Rd16 ERs32+2 → @ERd32 — — ↔ ↔ — — 0 — @aa:16 → Rd16 — — ↔ — — Rs8 → Rd8 C ↔ #xx:8 → Rd8 V 0 — 2 @ERs → Rd8 — — MOV.B @(d:16, ERs), B Rd 4 @(d:16, ERs) → Rd8 — — MOV.B @(d:24, ERs), B Rd 8 @(d:24, ERs) → Rd8 — — @ERs → Rd8 ERs32+1 → ERs32 — — 2 MOV.B @ERs+, Rd B MOV.B @aa:8, Rd B 2 @aa:8 → Rd8 — — MOV.B @aa:16, Rd B 4 @aa:16 → Rd8 — — MOV.B @aa:24, Rd B 6 @aa:24 → Rd8 — — MOV.B Rs, @ERd B Rs8 → @ERd — — MOV.B Rs, @(d:16, ERd) B 4 Rs8 → @(d:16, ERd) — — MOV.B Rs, @(d:24, ERd) B 8 Rs8 → @(d:24, ERd) — — MOV.B Rs, @–ERd B ERd32–1 → ERd32 Rs8 → @ERd — — MOV.B Rs, @aa:8 B 2 Rs8 → @aa:8 — — MOV.B Rs, @aa:16 B 4 Rs8 → @aa:16 — — MOV.B Rs, @aa:24 B 6 Rs8 → @aa:24 — — MOV.W #xx:16, Rd W 4 #xx:16 → Rd16 — — MOV.W Rs, Rd W MOV.W @ERs, Rd W MOV.W @ERs+, Rd W MOV.W @aa:16, Rd W 2 2 2 2 2 2 4 Rs16 → Rd16 — — @ERs → Rd16 — — Normal Condition Code Operation Advanced No. of States*1 — @@aa @(d, PC) B @aa MOV.B @ERs, Rd @–ERn/@ERn+ 2 B @(d, ERn) B MOV.B Rs, Rd @ERn #xx MOV.B #xx:8, Rd Rn Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 0 — 2 0 — 2 0 — 4 6 10 6 0 — 4 0 — 6 0 — 8 0 — 4 6 10 6 0 — 4 0 — 6 0 — 8 0 — 4 0 — 2 0 — 4 6 10 6 6 Rev. 2.00 Sep 20, 2005 page 641 of 800 REJ09B0260-0200 Appendix A Instruction Set MOV.W Rs, @(d:24, ERd) W 8 MOV.W Rs, @–ERd W MOV.W Rs, @aa:16 W 4 MOV.W Rs, @aa:24 W 6 MOV.L #xx:32, Rd L MOV.L ERs, ERd L MOV.L @ERs, ERd L MOV.L @(d:16, ERs), ERd L 6 MOV.L @(d:24, ERs), ERd L 10 MOV.L @ERs+, ERd L MOV.L @aa:16, ERd L MOV.L @aa:24, ERd L MOV.L ERs, @ERd L MOV.L ERs, @(d:16, ERd) L 6 MOV.L ERs, @(d:24, ERd) L 10 MOV.L ERs, @–ERd L MOV.L ERs, @aa:16 L 6 MOV.L ERs, @aa:24 L 8 POP.W Rn W 2 @SP → Rn16 SP+2 → SP POP.L ERn L 4 @SP → ERn32 SP+4 → SP ERs32 → @(d:24, ERd) — — ERd32–4 → ERd32 ERs32 → @ERd — — ERs32 → @aa:16 — — ERs32 → @aa:24 — — — — — — 4 Rev. 2.00 Sep 20, 2005 page 642 of 800 REJ09B0260-0200 ↔ ↔ ↔ ERs32 → @(d:16, ERd) — — ↔ ↔ ↔ — — ↔ — — ERs32 → @ERd ↔ @aa:24 → ERd32 ↔ 8 4 ↔ — — — — ↔ ↔ ↔ ↔ ↔ ↔ @aa:16 → ERd32 @ERs → ERd32 ↔ ↔ ↔ ↔ ↔ ↔ 6 — — 0 — ↔ — — 4 — — ERs32 → ERd32 ↔ @ERs → ERd32 ERs32+4 → ERs32 4 #xx:32 → Rd32 0 — ↔ @(d:24, ERs) → ERd32 — — 2 ↔ @(d:16, ERs) → ERd32 — — 6 0 — ↔ ↔ ↔ ↔ — — 0 — ↔ ↔ ↔ ↔ — — Rs16 → @aa:24 0 — 0 — 0 — ↔ Rs16 → @aa:16 0 — ↔ — — C 0 — ↔ ERd32–2 → ERd32 Rs16 → @ERd V ↔ — — 2 I — — 0 — ↔ ↔ ↔ Rs16 → @(d:24, ERd) @aa:24 → Rd16 ↔ ↔ ↔ — — 2 Operation 0 — 10 0 — 12 0 — 6 ↔ Z ↔ — H N 6 Normal Rs16 → @(d:16, ERd) @@aa — — 4 @(d, PC) Rs16 → @ERd W @aa W MOV.W Rs, @(d:16, ERd) @(d, ERn) MOV.W Rs, @ERd @ERn W Rn MOV.W @aa:24, Rd #xx Mnemonic Condition Code Advanced No. of States*1 Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 0 — 10 0 — 8 0 — 4 6 10 6 0 — 6 0 — 8 0 — 6 0 — 2 0 — 8 10 14 10 10 0 — 12 0 — 8 10 14 10 Appendix A Instruction Set — — MOVFPE @aa:16, Rd B 4 Cannot be used in the H8/3024 Group Cannot be used in the H8/3024 Group MOVTPE Rs, @aa:16 B 4 Cannot be used in the H8/3024 Group Cannot be used in the H8/3024 Group C ↔ V 0 — 6 ↔ — Rn I Advanced 4 SP–4 → SP ERn32 → @SP Condition Code Operation Normal ↔ L @@aa PUSH.L ERn @(d, PC) — — @aa 2 SP–2 → SP Rn16 → @SP @(d, ERn) Z W @ERn H N PUSH.W Rn #xx Mnemonic ↔ No. of States*1 Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 0 — 10 2. Arithmetic instructions L ADDX.B #xx:8, Rd B ADDX.B Rs, Rd B 2 ADDS.L #1, ERd L ADDS.L #2, ERd L ADDS.L #4, ERd — (1) Rd16+Rs16 → Rd16 — (1) ERd32+#xx:32 → ERd32 — (2) ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ERd32+ERs32 → ERd32 — (2) ↔ ↔ 2 Rd8+#xx:8 +C → Rd8 — (3) — ↔ ↔ ↔ ↔ 2 Rd8+Rs8 +C → Rd8 2 ERd32+1 → ERd32 — — — — — — 2 2 ERd32+2 → ERd32 — — — — — — 2 L 2 ERd32+4 → ERd32 — — — — — — 2 INC.B Rd B 2 Rd8+1 → Rd8 — — INC.W #1, Rd W 2 Rd16+1 → Rd16 — — 2 Rd16+2 → Rd16 — — W 6 2 2 (3) ↔ ↔ ↔ INC.W #2, Rd 2 ↔ ↔ ↔ Rd16+#xx:16 → Rd16 ↔ ↔ ↔ ↔ ↔ 2 — ↔ ↔ — 2 ↔ ↔ ↔ Rd8+#xx:8 → Rd8 Rd8+Rs8 → Rd8 ↔ C ↔ ↔ ↔ ↔ ↔ V ↔ Z ↔ ↔ H N ↔ ↔ I Advanced ADD.L ERs, ERd Condition Code Operation Normal L No. of States*1 — ADD.L #xx:32, ERd @@aa W @(d, PC) W 4 ADD.W Rs, Rd @aa ADD.W #xx:16, Rd @–ERn/@ERn+ 2 B @(d, ERn) B ADD.B Rs, Rd @ERn #xx ADD.B #xx:8, Rd Rn Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 4 2 6 2 — 2 — 2 — 2 Rev. 2.00 Sep 20, 2005 page 643 of 800 REJ09B0260-0200 Appendix A Instruction Set 2 SUB.B Rs, Rd B 2 SUB.W #xx:16, Rd W 4 SUB.W Rs, Rd W SUB.L #xx:32, ERd L SUB.L ERs, ERd L SUBX.B #xx:8, Rd B SUBX.B Rs, Rd B 2 SUBS.L #1, ERd L SUBS.L #2, ERd L SUBS.L #4, ERd DEC.B Rd DEC.W #1, Rd DEC.W #2, Rd H N Z V C ↔ ↔ ↔ ↔ ↔ ↔ — 2 — — — 2 Rd8 decimal adjust → Rd8 — * ↔ ↔ * — 2 Rd8–Rs8 → Rd8 — ↔ — (1) Rd16–Rs16 → Rd16 — (1) ERd32–#xx:32 → ERd32 — (2) ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ 2 Rd16–#xx:16 → Rd16 ERd32–ERs32 → ERd32 — (2) ↔ ↔ ↔ ↔ 2 Rd8–#xx:8–C → Rd8 — ↔ ↔ ↔ ↔ ↔ ↔ 2 — ↔ ↔ (3) Rd8–Rs8–C → Rd8 2 ERd32–1 → ERd32 — — — — — — 2 2 ERd32–2 → ERd32 — — — — — — 2 L 2 ERd32–4 → ERd32 — — — — — — 2 B 2 Rd8–1 → Rd8 — — W 2 Rd16–1 → Rd16 — — ↔ ↔ ↔ ↔ ↔ ↔ W 2 Rd16–2 → Rd16 — — DEC.L #1, ERd L 2 ERd32–1 → ERd32 — — DEC.L #2, ERd L 2 ERd32–2 → ERd32 — — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ DAS.Rd B 2 Rd8 decimal adjust → Rd8 — * ↔ ↔ — Condition Code MULXU. B Rs, Rd B MULXU. W Rs, ERd 2 6 2 2 6 2 — 2 2 2 — 2 — 2 * — 2 2 Rd8 × Rs8 → Rd16 — — — — — — (unsigned multiplication) 14 W 2 Rd16 × Rs16 → ERd32 — — — — — — (unsigned multiplication) 22 MULXS. B Rs, Rd B 4 Rd8 × Rs8 → Rd16 (signed multiplication) — — ↔ — — — — 16 MULXS. W Rs, ERd W 4 Rd16 × Rs16 → ERd32 (signed multiplication) — — ↔ (3) 4 ↔ I ↔ 2 Operation Normal B @@aa DAA Rd @(d, PC) — — ERd32+2 → ERd32 @aa ERd32+1 → ERd32 2 @(d, ERn) 2 L @ERn L INC.L #2, ERd Rn INC.L #1, ERd #xx Mnemonic Advanced No. of States*1 Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) — — 24 DIVXU. B Rs, Rd B 2 Rd16 ÷ Rs8 → Rd16 (RdH: remainder, RdL: quotient) (unsigned division) — — (6) (7) — — 14 Rev. 2.00 Sep 20, 2005 page 644 of 800 REJ09B0260-0200 Appendix A Instruction Set No. of States*1 4 Rd16 ÷ Rs8 → Rd16 (RdH: remainder, RdL: quotient) (signed division) — — (8) (7) — — 16 DIVXS. W Rs, ERd W 4 ERd32 ÷ Rs16 → ERd32 — — (8) (7) — — (Ed: remainder, Rd: quotient) (signed division) 24 CMP.B #xx:8, Rd B CMP.B Rs, Rd B CMP.W #xx:16, Rd W 4 CMP.W Rs, Rd W CMP.L #xx:32, ERd L CMP.L ERs, ERd L 2 NEG.B Rd B NEG.W Rd W NEG.L ERd EXTU.W Rd EXTU.L ERd ERd32–#xx:32 — (2) ERd32–ERs32 — (2) 2 0–Rd8 → Rd8 — 2 0–Rd16 → Rd16 — L 2 0–ERd32 → ERd32 — W 2 0 → (<bits 15 to 8> of Rd16) — — 0 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ L 2 0 → (<bits 31 to 16> of ERd32) — — 0 EXTS.W Rd W 2 (<bit 7> of Rd16) → — — (<bits 15 to 8> of Rd16) EXTS.L ERd L 2 (<bit 15> of ERd32) → (<bits 31 to 16> of ERd32) — — Normal ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ — (1) ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ — (1) Rd16–Rs16 6 2 0 — 2 ↔ Rd16–#xx:16 2 C 0 — 2 ↔ — ↔ ↔ ↔ — Rd8–Rs8 2 V 0 — 2 ↔ Z Rd8–#xx:8 2 ↔ ↔ H N ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ I ↔ Operation ↔ — Condition Code Advanced B @@aa DIVXS. B Rs, Rd @(d, PC) 22 @aa ERd32 ÷ Rs16 → ERd32 — — (6) (7) — — (Ed: remainder, Rd: quotient) (unsigned division) @(d, ERn) 2 @ERn W Rn DIVXU. W Rs, ERd #xx Mnemonic Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 0 — 2 2 4 2 6 2 2 2 2 Rev. 2.00 Sep 20, 2005 page 645 of 800 REJ09B0260-0200 Appendix A Instruction Set 3. Logic instructions 2 H N Z — — Rd8∧Rs8 → Rd8 — — Rd16∧#xx:16 → Rd16 — — Rd16∧Rs16 → Rd16 — — AND.B Rs, Rd B AND.W #xx:16, Rd W 4 AND.W Rs, Rd W AND.L #xx:32, ERd L AND.L ERs, ERd L OR.B #xx:8, Rd B OR.B Rs, Rd B OR.W #xx:16, Rd W 4 OR.W Rs, Rd W OR.L #xx:32, ERd L OR.L ERs, ERd L XOR.B #xx:8, Rd B XOR.B Rs, Rd B XOR.W #xx:16, Rd W 4 XOR.W Rs, Rd W XOR.L #xx:32, ERd L XOR.L ERs, ERd L 4 ERd32⊕ERs32 → ERd32 — — NOT.B Rd B 2 ¬Rd8 → Rd8 — — NOT.W Rd W 2 ¬Rd16 → Rd16 — — NOT.L ERd L 2 ¬Rd32 → Rd32 — — 2 ERd32∧#xx:32 → ERd32 — — 6 4 2 2 2 ERd32∧ERs32 → ERd32 — — Rd8∨#xx:8 → Rd8 — — Rd8∨Rs8 → Rd8 — — Rd16∨#xx:16 → Rd16 — — Rd16∨Rs16 → Rd16 — — ERd32∨#xx:32 → ERd32 — — 6 4 2 2 2 ERd32∨ERs32 → ERd32 — — Rd8⊕#xx:8 → Rd8 — — Rd8⊕Rs8 → Rd8 — — Rd16⊕#xx:16 → Rd16 — — Rd16⊕Rs16 → Rd16 — — ERd32⊕#xx:32 → ERd32 — — 6 Rev. 2.00 Sep 20, 2005 page 646 of 800 REJ09B0260-0200 V C Normal I ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ Operation Rd8∧#xx:8 → Rd8 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ Condition Code Advanced No. of States*1 — @@aa @(d, PC) @aa @–ERn/@ERn+ 2 @(d, ERn) B @ERn #xx AND.B #xx:8, Rd Rn Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 4 0 — 2 0 — 6 0 — 4 0 — 2 0 — 2 0 — 2 Appendix A Instruction Set 4. Shift instructions W 2 SHAL.L ERd L 2 SHAR.B Rd B 2 SHAR.W Rd W 2 SHAR.L ERd L 2 SHLL.B Rd B 2 SHLL.W Rd W 2 SHLL.L ERd L 2 SHLR.B Rd B 2 SHLR.W Rd W 2 SHLR.L ERd L 2 ROTXL.B Rd B 2 ROTXL.W Rd W 2 ROTXL.L ERd L 2 ROTXR.B Rd B 2 ROTXR.W Rd W 2 ROTXR.L ERd L 2 ROTL.B Rd B 2 ROTL.W Rd W 2 ROTL.L ERd L 2 ROTR.B Rd B 2 ROTR.W Rd W 2 ROTR.L ERd L 2 C 0 MSB LSB — — — — — — C MSB LSB — — — — — — C 0 MSB LSB — — — — — — 0 C MSB LSB — — — — — — C — — MSB LSB — — — — C MSB LSB — — — — — — C — — MSB LSB — — — — C MSB LSB — — — — V C 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Normal Z ↔ ↔ ↔ SHAL.W Rd H N — — ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ I ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ Operation 2 ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ Condition Code Advanced No. of States*1 — @@aa @(d, PC) @aa @–ERn/@ERn+ @(d, ERn) @ERn B Rn SHAL.B Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Rev. 2.00 Sep 20, 2005 page 647 of 800 REJ09B0260-0200 Appendix A Instruction Set 5. Bit manipulation instructions B BCLR #xx:3, @aa:8 B BCLR Rn, Rd B BCLR Rn, @ERd B BCLR Rn, @aa:8 B BNOT #xx:3, Rd B BNOT #xx:3, @ERd B BNOT #xx:3, @aa:8 B BNOT Rn, Rd B BNOT Rn, @ERd B BNOT Rn, @aa:8 B BTST #xx:3, Rd B BTST #xx:3, @ERd B BTST #xx:3, @aa:8 B BTST Rn, Rd B BTST Rn, @ERd B BTST Rn, @aa:8 B BLD #xx:3, Rd B 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 Rev. 2.00 Sep 20, 2005 page 648 of 800 REJ09B0260-0200 H N Z V C Advanced BCLR #xx:3, @ERd 4 2 I Normal B 4 Operation (#xx:3 of Rd8) ← 1 — — — — — — 2 (#xx:3 of @ERd) ← 1 — — — — — — 8 (#xx:3 of @aa:8) ← 1 — — — — — — 8 (Rn8 of Rd8) ← 1 — — — — — — 2 (Rn8 of @ERd) ← 1 — — — — — — 8 (Rn8 of @aa:8) ← 1 — — — — — — 8 (#xx:3 of Rd8) ← 0 — — — — — — 2 (#xx:3 of @ERd) ← 0 — — — — — — 8 (#xx:3 of @aa:8) ← 0 — — — — — — 8 (Rn8 of Rd8) ← 0 — — — — — — 2 (Rn8 of @ERd) ← 0 — — — — — — 8 (Rn8 of @aa:8) ← 0 — — — — — — 8 (#xx:3 of Rd8) ← ¬(#xx:3 of Rd8) — — — — — — 2 (#xx:3 of @ERd) ← ¬(#xx:3 of @ERd) — — — — — — 8 (#xx:3 of @aa:8) ← ¬(#xx:3 of @aa:8) — — — — — — 8 (Rn8 of Rd8) ← ¬(Rn8 of Rd8) — — — — — — 2 (Rn8 of @ERd) ← ¬(Rn8 of @ERd) — — — — — — 8 (Rn8 of @aa:8) ← ¬(Rn8 of @aa:8) — — — — — — 8 ¬(#xx:3 of Rd8) → Z — — — ¬(#xx:3 of @ERd) → Z — — — — — 2 — — 6 — — 6 — — 2 — — 6 — — 6 ↔ B BCLR #xx:3, Rd 2 Condition Code ↔ ↔ ↔ ↔ ↔ ↔ BSET Rn, @aa:8 4 No. of States*1 — B 4 @@aa B BSET Rn, @ERd 2 @(d, PC) BSET Rn, Rd @aa B @–ERn/@ERn+ B BSET #xx:3, @aa:8 @(d, ERn) BSET #xx:3, @ERd @ERn B Rn BSET #xx:3, Rd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 2 ¬(#xx:3 of @aa:8) → Z — — — ¬(Rn8 of @Rd8) → Z — — — ¬(Rn8 of @ERd) → Z — — — ¬(Rn8 of @aa:8) → Z — — — (#xx:3 of Rd8) → C — — — — — Appendix A Instruction Set B BIST #xx:3, Rd B BIST #xx:3, @ERd B BIST #xx:3, @aa:8 B BAND #xx:3, Rd B BAND #xx:3, @ERd B BAND #xx:3, @aa:8 B BIAND #xx:3, Rd B 4 4 2 4 4 2 4 4 2 BIAND #xx:3, @ERd B BOR #xx:3, Rd B BOR #xx:3, @ERd B BOR #xx:3, @aa:8 B BIOR #xx:3, Rd B BIOR #xx:3, @ERd B BIOR #xx:3, @aa:8 B BXOR #xx:3, Rd B BXOR #xx:3, @ERd B BXOR #xx:3, @aa:8 B BIXOR #xx:3, Rd B BIXOR #xx:3, @ERd B BIXOR #xx:3, @aa:8 B C — — — — — H N Z 6 (#xx:3 of @aa:8) → C — — — — — ¬(#xx:3 of Rd8) → C — — — — — ¬(#xx:3 of @ERd) → C — — — — — ¬(#xx:3 of @aa:8) → C — — — — — C → (#xx:3 of Rd8) — — — — — — 2 C → (#xx:3 of @ERd24) — — — — — — 8 C → (#xx:3 of @aa:8) — — — — — — 8 ¬C → (#xx:3 of Rd8) — — — — — — 2 ¬C → (#xx:3 of @ERd24) — — — — — — 8 ¬C → (#xx:3 of @aa:8) — — — — — — 8 C∧(#xx:3 of Rd8) → C — — — — — 2 C∧(#xx:3 of @ERd24) → C — — — — — C∧(#xx:3 of @aa:8) → C — — — — — C∧ ¬ (#xx:3 of Rd8) → C — — — — — C∧ ¬ (#xx:3 of @ERd24) → C — — — — — 4 BIAND #xx:3, @aa:8 B I 4 2 4 4 2 C∧ ¬ (#xx:3 of @aa:8) → C — — — — — C∨(#xx:3 of Rd8) → C — — — — — C∨(#xx:3 of @ERd24) → C — — — — — C∨(#xx:3 of @aa:8) → C — — — — — C∨ ¬ (#xx:3 of Rd8) → C — — — — — C∨ ¬ (#xx:3 of @ERd24) → C — — — — — 4 4 2 4 4 2 C∨ ¬ (#xx:3 of @aa:8) → C — — — — — C⊕(#xx:3 of Rd8) → C — — — — — C⊕(#xx:3 of @ERd24) → C — — — — — C⊕(#xx:3 of @aa:8) → C — — — — — C⊕ ¬ (#xx:3 of Rd8) → C — — — — — C⊕ ¬ (#xx:3 of @ERd24) → C — — — — — 4 4 Advanced BST #xx:3, @aa:8 2 Operation Normal B V (#xx:3 of @ERd) → C ↔ ↔ ↔ ↔ ↔ B BST #xx:3, @ERd 4 Condition Code ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ BST #xx:3, Rd 4 No. of States*1 — B 4 2 @@aa B BILD #xx:3, @aa:8 4 @(d, PC) BILD #xx:3, @ERd @aa B @–ERn/@ERn+ B BILD #xx:3, Rd @(d, ERn) BLD #xx:3, @aa:8 @ERn B Rn BLD #xx:3, @ERd #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) C⊕ ¬ (#xx:3 of @aa:8) → C — — — — — 6 2 6 6 6 6 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 Rev. 2.00 Sep 20, 2005 page 649 of 800 REJ09B0260-0200 Appendix A Instruction Set 6. Branching instructions 4 BHI d:8 — 2 BHI d:16 — 4 BLS d:8 — 2 BLS d:16 — 4 BCC d:8 (BHS d:8) — 2 BCC d:16 (BHS d:16) — 4 BCS d:8 (BLO d:8) — 2 BCS d:16 (BLO d:16) — 4 BNE d:8 — 2 BNE d:16 — 4 BEQ d:8 — 2 BEQ d:16 — 4 BVC d:8 — 2 BVC d:16 — 4 BVS d:8 — 2 BVS d:16 — 4 BPL d:8 — 2 BPL d:16 — 4 BMI d:8 — 2 BMI d:16 — 4 BGE d:8 — 2 BGE d:16 — 4 BLT d:8 — 2 BLT d:16 — 4 BGT d:8 — 2 BGT d:16 — 4 Rev. 2.00 Sep 20, 2005 page 650 of 800 REJ09B0260-0200 If condition Always is true then PC ← PC+d else Never next; C∨Z=0 C∨Z=1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 N⊕V = 0 N⊕V = 1 Z ∨ (N⊕V) =0 Condition Code I H N Z V C Advanced 2 — Branch Operation Condition Normal — BRN d:16 (BF d:16) No. of States*1 — BRN d:8 (BF d:8) @@aa 4 @(d, PC) — @aa BRA d:16 (BT d:16) @(d, ERn) 2 @ERn — Rn BRA d:8 (BT d:8) #xx Mnemonic Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 — — — — — — 4 — — — — — — 6 Appendix A Instruction Set — JMP @@aa:8 — BSR d:8 — BSR d:16 — JSR @ERn — JSR @aa:24 — JSR @@aa:8 — RTS — Condition Code I H N Z V C Advanced JMP @aa:24 Branch Operation Condition Normal — No. of States*1 — JMP @ERn @@aa 4 @(d, PC) — @aa BLE d:16 @(d, ERn) 2 @ERn — Rn BLE d:8 #xx Mnemonic Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) If condition Z ∨ (N⊕V) = 1 — — — — — — is true then — — — — — — PC ← PC+d else next; 4 PC ← ERn — — — — — — 4 PC ← aa:24 — — — — — — PC ← @aa:8 — — — — — — 8 10 2 PC → @–SP PC ← PC+d:8 — — — — — — 6 8 4 PC → @–SP PC ← PC+d:16 — — — — — — 8 10 PC → @–SP PC ← @ERn — — — — — — 6 8 PC → @–SP PC ← @aa:24 — — — — — — 8 10 PC → @–SP PC ← @aa:8 — — — — — — 8 12 2 PC ← @SP+ — — — — — — 8 10 2 4 2 2 4 2 6 6 Rev. 2.00 Sep 20, 2005 page 651 of 800 REJ09B0260-0200 Appendix A Instruction Set 7. System control instructions SLEEP — Transition to powerdown — — — — — — state 2 LDC #xx:8, CCR B #xx:8 → CCR H N Z V C Normal I W 6 @(d:16, ERs) → CCR ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ LDC @(d:24, ERs), CCR W 10 @(d:24, ERs) → CCR ↔ ↔ ↔ ↔ 12 LDC @ERs+, CCR W @ERs → CCR ERs32+2 → ERs32 ↔ ↔ ↔ ↔ 8 LDC @aa:16, CCR W 6 @aa:16 → CCR LDC @aa:24, CCR W 8 @aa:24 → CCR ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ LDC @(d:16, ERs), CCR ↔ ↔ W ↔ ↔ B LDC @ERs, CCR ↔ ↔ LDC Rs, CCR ↔ ↔ ↔ ↔ 2 ↔ ↔ 1 — — — — — 14 16 ↔ ↔ Operation ↔ ↔ — Condition Code Advanced 10 @@aa CCR ← @SP+ PC ← @SP+ @(d, PC) — @aa RTE @(d, ERn) 2 PC → @–SP CCR → @–SP <vector> → PC @ERn — Rn TRAPA #x:2 #xx Mnemonic ↔ No. of States*1 Operand Size @–ERn/@ERn+ Addressing Mode and Instruction Length (bytes) 10 CCR → Rd8 — — — — — — 2 CCR → @ERd — — — — — — 6 2 Rs8 → CCR 2 @ERs → CCR 4 6 8 W 6 CCR → @(d:16, ERd) — — — — — — 8 STC CCR, @(d:24, ERd) W 10 CCR → @(d:24, ERd) — — — — — — 12 STC CCR, @–ERd W ERd32–2 → ERd32 CCR → @ERd — — — — — — 8 STC CCR, @aa:16 W 6 CCR → @aa:16 — — — — — — 8 STC CCR, @aa:24 W 8 CCR → @aa:24 — — — — — — 10 ANDC #xx:8, CCR B 2 CCR∧#xx:8 → CCR 2 ORC #xx:8, CCR B 2 CCR∨#xx:8 → CCR XORC #xx:8, CCR B 2 NOP — — — — — — — 2 4 4 Rev. 2.00 Sep 20, 2005 page 652 of 800 REJ09B0260-0200 CCR⊕#xx:8 → CCR 2 PC ← PC+2 ↔ ↔ ↔ STC CCR, @(d:16, ERd) 2 ↔ ↔ ↔ W ↔ ↔ ↔ B STC CCR, @ERd ↔ ↔ ↔ STC CCR, Rd ↔ ↔ ↔ 8 ↔ ↔ ↔ 4 2 2 2 Appendix A Instruction Set 8. Block transfer instructions EEPMOV. W — Operation I H N Z V C 4 if R4L ≠ 0 — — — — — — repeat @R5 → @R6 R5+1 → R5 R6+1 → R6 R4L–1 → R4L until R4L=0 else next; 4 if R4 ≠ 0 repeat @R5 → @R6 R5+1 → R5 R6+1 → R6 R4–1 → R4 until R4L=0 else next; Advanced Condition Code Normal No. of States*1 — @@aa @(d, PC) @aa @–ERn/@ERn+ @(d, ERn) @ERn — Rn EEPMOV. B #xx Mnemonic Operand Size Addressing Mode and Instruction Length (bytes) 8+4n*2 8+4n*2 — — — — — — Notes: 1. The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. For other cases see section A.3, Number of States Required for Execution. 2. n is the value set in register R4L or R4. (1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. (2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. (3) Retains its previous value when the result is zero; otherwise cleared to 0. (4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value. (5) The number of states required for execution of an instruction that transfers data in synchronization with the E clock is variable. (6) Set to 1 when the divisor is negative; otherwise cleared to 0. (7) Set to 1 when the divisor is zero; otherwise cleared to 0. (8) Set to 1 when the quotient is negative; otherwise cleared to 0. Rev. 2.00 Sep 20, 2005 page 653 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 654 of 800 REJ09B0260-0200 MULXU 5 STC LDC 3 SUBX OR XOR AND MOV C D E F BILD BIST BLD BST TRAPA BNQ B BIAND BAND AND RTE BNE CMP BIXOR BXOR XOR BSR BCS A BIOR BOR OR RTS BCC MOV.B Table A.2 (2) LDC 7 ADDX BTST DIVXU BLS AND.B ANDC 6 9 BCLR MULXU BHI XOR.B XORC 5 ADD BNOT DIVXU BRN OR.B ORC 4 8 7 BSET BRA 6 2 1 Table A.2 (2) Table A.2 Table A.2 Table A.2 Table A.2 (2) (2) (2) (2) NOP 4 3 2 1 0 0 MOV BVS 9 A B JMP BPL BMI MOV Table A.2 Table A.2 (2) (2) Table A.2 Table A.2 (2) (2) Table A.2 Table A.2 EEPMOV (2) (2) SUB ADD Table A.2 (2) BVC 8 BSR BGE C CMP MOV Instruction when most significant bit of BH is 1. Instruction when most significant bit of BH is 0. E JSR BGT SUBX ADDX Table A.2 (3) BLT D F BLE Table A.2 (2) Table A.2 (2) Table A.2 AL 1st byte 2nd byte AH AL BH BL A.2 AH Instruction code: Appendix A Instruction Set Operation Code Maps Operation Code Map (1) SUBS DAS BRA MOV MOV 1B 1F 58 79 7A 1 ADD ADD BRN NOT 17 DEC ROTXR 13 1A ROTXL 12 DAA 0F SHLR ADDS 0B 11 INC 0A SHLL MOV 01 10 0 CMP CMP BHI 2 SUB SUB BLS NOT ROTXR ROTXL SHLR SHLL 3 4 OR OR BCC LDC/STC 1st byte 2nd byte AH AL BH BL XOR XOR BCS DEC EXTU INC 5 AND AND BNE 6 BEQ DEC EXTU INC 7 BVC SUBS NEG 9 BVS ROTR ROTL SHAR SHAL ADDS SLEEP 8 BPL A MOV BMI NEG CMP SUB ROTR ROTL SHAR C D BGE BLT DEC EXTS INC Table A.2 Table A.2 (3) (3) ADD SHAL B BGT E BLE DEC EXTS INC Table A.2 (3) F Table A.2 BH AH AL Instruction code: Appendix A Instruction Set Operation Code Map (2) Rev. 2.00 Sep 20, 2005 page 655 of 800 REJ09B0260-0200 Rev. 2.00 Sep 20, 2005 page 656 of 800 REJ09B0260-0200 DIVXS 3 BSET 7Faa7*2 BNOT BNOT BNOT BCLR BCLR BCLR Notes: 1. r is the register designation field. 2. aa is the absolute address field. BSET BSET 7Faa6*2 7Eaa7*2 2 7Eaa6* 7Dr07*1 1 7Dr06* BTST BTST BTST BCLR MULXS 2 7Cr07*1 BNOT DIVIXS 1 BTST BSET MULXS 0 1 7Cr06* 01F06 01D05 01C05 01406 CL BIOR BOR BIOR BOR OR 4 BIXOR BXOR BIXOR BXOR XOR 5 BIAND BAND BIAND BAND AND 6 7 BIST BILD BST BLD BIST BILD BST BLD 1st byte 2nd byte 3rd byte 4th byte AH AL BH BL CH CL DH DL 8 LDC STC 9 A LDC STC B C LDC STC D E LDC STC F Instruction when most significant bit of DH is 1. Instruction when most significant bit of DH is 0. Table A.2 AH ALBH BLCH Instruction code: Appendix A Instruction Set Operation Code Map (3) Appendix A Instruction Set A.3 Number of States Required for Execution The tables in this section can be used to calculate the number of states required for instruction execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states required per cycle according to the bus size. The number of states required for execution of an instruction can be calculated from these two tables as follows: Number of states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN Examples of Calculation of Number of States Required for Execution Examples: Advanced mode, stack located in external address space, on-chip supporting modules accessed with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. BSET #0, @FFFFC7:8 From table A.4, I = L = 2 and J = K = M = N = 0 From table A.3, SI = 4 and SL = 3 Number of states = 2 × 4 + 2 × 3 = 14 JSR @@30 From table A.4, I = J = K = 2 and L = M = N = 0 From table A.3, SI = SJ = SK = 4 Number of states = 2 × 4 + 2 × 4 + 2 × 4 = 24 Rev. 2.00 Sep 20, 2005 page 657 of 800 REJ09B0260-0200 Appendix A Instruction Set Table A.3 Number of States per Cycle Access Conditions Instruction fetch External Device On-Chip Supporting Module Cycle On-Chip Memory 8-Bit Bus 16-Bit Bus SI 2 6 8-Bit Bus 2-State Access 3 3-State 2-State 3-State Access Access Access 4 6 + 2m 2 3+m 4 6 + 2m Branch address read SJ Stack operation SK Byte data access SL 3 Word data access SM 6 Internal operation SN Legend: m: Number of wait states inserted into external device access Rev. 2.00 Sep 20, 2005 page 658 of 800 REJ09B0260-0200 1 16-Bit Bus 2 3+m Appendix A Instruction Set Table A.4 Number of Cycles per Instruction Instruction Mnemonic Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N ADD ADD.B #xx:8, Rd ADD.B Rs, Rd ADD.W #xx:16, Rd ADD.W Rs, Rd ADD.L #xx:32, ERd ADD.L ERs, ERd 1 1 2 1 3 1 ADDS ADDS #1/2/4, ERd 1 ADDX ADDX #xx:8, Rd ADDX Rs, Rd 1 1 AND AND.B #xx:8, Rd AND.B Rs, Rd AND.W #xx:16, Rd AND.W Rs, Rd AND.L #xx:32, ERd AND.L ERs, ERd 1 1 2 1 3 2 ANDC ANDC #xx:8, CCR 1 BAND BAND #xx:3, Rd BAND #xx:3, @ERd BAND #xx:3, @aa:8 1 2 2 BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 BMI d:8 BGE d:8 BLT d:8 BGT d:8 BLE d:8 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Bcc 1 1 Rev. 2.00 Sep 20, 2005 page 659 of 800 REJ09B0260-0200 Appendix A Instruction Set Instruction Mnemonic Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N Bcc BRA d:16 (BT d:16) BRN d:16 (BF d:16) BHI d:16 BLS d:16 BCC d:16 (BHS d:16) BCS d:16 (BLO d:16) BNE d:16 BEQ d:16 BVC d:16 BVS d:16 BPL d:16 BMI d:16 BGE d:16 BLT d:16 BGT d:16 BLE d:16 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BCLR BCLR #xx:3, Rd BCLR #xx:3, @ERd BCLR #xx:3, @aa:8 BCLR Rn, Rd BCLR Rn, @ERd BCLR Rn, @aa:8 1 2 2 1 2 2 BIAND #xx:3, Rd BIAND #xx:3, @ERd BIAND #xx:3, @aa:8 1 2 2 1 1 BILD #xx:3, Rd BILD #xx:3, @ERd BILD #xx:3, @aa:8 1 2 2 1 1 BIOR #xx:8, Rd BIOR #xx:8, @ERd BIOR #xx:8, @aa:8 1 2 2 1 1 BIST #xx:3, Rd BIST #xx:3, @ERd BIST #xx:3, @aa:8 1 2 2 2 2 BIXOR #xx:3, Rd BIXOR #xx:3, @ERd BIXOR #xx:3, @aa:8 1 2 2 1 1 BLD #xx:3, Rd BLD #xx:3, @ERd BLD #xx:3, @aa:8 1 2 2 1 1 BIAND BILD BIOR BIST BIXOR BLD Rev. 2.00 Sep 20, 2005 page 660 of 800 REJ09B0260-0200 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Appendix A Instruction Set Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N Instruction Mnemonic BNOT BOR BSET BSR BST BNOT #xx:3, Rd BNOT #xx:3, @ERd BNOT #xx:3, @aa:8 BNOT Rn, Rd BNOT Rn, @ERd BNOT Rn, @aa:8 1 2 2 1 2 2 BOR #xx:3, Rd BOR #xx:3, @ERd BOR #xx:3, @aa:8 1 2 2 BSET #xx:3, Rd BSET #xx:3, @ERd BSET #xx:3, @aa:8 BSET Rn, Rd BSET Rn, @ERd BSET Rn, @aa:8 1 2 2 1 2 2 BSR d:8 Normal 2 1 Advanced 2 2 BSR d:16 Normal 2 1 2 Advanced 2 2 2 BST #xx:3, Rd BST #xx:3, @ERd BST #xx:3, @aa:8 1 2 2 BTST #xx:3, Rd BTST #xx:3, @ERd BTST #xx:3, @aa:8 BTST Rn, Rd BTST Rn, @ERd BTST Rn, @aa:8 1 2 2 1 2 2 BXOR #xx:3, Rd BXOR #xx:3, @ERd BXOR #xx:3, @aa:8 1 2 2 CMP CMP.B #xx:8, Rd CMP.B Rs, Rd CMP.W #xx:16, Rd CMP.W Rs, Rd CMP.L #xx:32, ERd CMP.L ERs, ERd 1 1 2 1 3 1 DAA DAA Rd 1 BTST BXOR 2 2 2 2 1 1 2 2 2 2 2 2 1 1 1 1 1 1 Rev. 2.00 Sep 20, 2005 page 661 of 800 REJ09B0260-0200 Appendix A Instruction Set Instruction Mnemonic Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N DAS DAS Rd 1 DEC DEC.B Rd DEC.W #1/2, Rd DEC.L #1/2, ERd 1 1 1 DIVXS DIVXS.B Rs, Rd DIVXS.W Rs, ERd 2 2 12 20 DIVXU DIVXU.B Rs, Rd DIVXU.W Rs, ERd 1 1 12 20 EEPMOV EEPMOV.B EEPMOV.W 2 2 EXTS EXTS.W Rd EXTS.L ERd 1 1 EXTU EXTU.W Rd EXTU.L ERd 1 1 INC INC.B Rd INC.W #1/2, Rd INC.L #1/2, ERd 1 1 1 JMP JMP @ERn 2 JMP @aa:24 2 JMP @@aa:8 Normal 2 1 2 Advanced 2 2 2 JSR JSR @ERn Normal 2 2 1 Advanced 2 2 JSR @aa:24 Normal 2 1 2 Advanced 2 2 2 JSR @@aa:8 Normal LDC 1 2n + 2* 1 2n + 2* 2 1 1 Advanced 2 2 2 LDC #xx:8, CCR LDC Rs, CCR LDC @ERs, CCR LDC @(d:16, ERs), CCR LDC @(d:24, ERs), CCR LDC @ERs+, CCR LDC @aa:16, CCR LDC @aa:24, CCR 1 1 2 3 5 2 3 4 Rev. 2.00 Sep 20, 2005 page 662 of 800 REJ09B0260-0200 1 1 1 1 1 1 2 Appendix A Instruction Set Instruction Mnemonic MOV Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N MOV.B #xx:8, Rd MOV.B Rs, Rd MOV.B @ERs, Rd MOV.B @(d:16, ERs), Rd MOV.B @(d:24, ERs), Rd MOV.B @ERs+, Rd MOV.B @aa:8, Rd MOV.B @aa:16, Rd MOV.B @aa:24, Rd MOV.B Rs, @ERd MOV.B Rs, @(d:16, ERd) MOV.B Rs, @(d:24, ERd) MOV.B Rs, @–ERd MOV.B Rs, @aa:8 MOV.B Rs, @aa:16 MOV.B Rs, @aa:24 MOV.W #xx:16, Rd MOV.W Rs, Rd MOV.W @ERs, Rd MOV.W @(d:16, ERs), Rd MOV.W @(d:24, ERs), Rd MOV.W @ERs+, Rd MOV.W @aa:16, Rd MOV.W @aa:24, Rd MOV.W Rs, @ERd MOV.W Rs, @(d:16, ERd) MOV.W Rs, @(d:24, ERd) MOV.W Rs, @–ERd MOV.W Rs, @aa:16 MOV.W Rs, @aa:24 1 1 1 2 4 1 1 2 3 1 2 4 1 1 2 3 2 1 1 2 4 1 2 3 1 2 4 1 2 3 MOV.L #xx:32, ERd MOV.L ERs, ERd MOV.L @ERs, ERd MOV.L @(d:16, ERs), ERd MOV.L @(d:24, ERs), ERd MOV.L @ERs+, ERd MOV.L @aa:16, ERd MOV.L @aa:24, ERd MOV.L ERs, @ERd MOV.L ERs, @(d:16, ERd) MOV.L ERs, @(d:24, ERd) 3 1 2 3 5 2 3 4 2 3 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 Rev. 2.00 Sep 20, 2005 page 663 of 800 REJ09B0260-0200 Appendix A Instruction Set Instruction Mnemonic Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N MOV MOV.L ERs, @–ERd MOV.L ERs, @aa:16 MOV.L ERs, @aa:24 2 3 4 MOVFPE MOVFPE @aa:16, 2 Rd* 2 1 MOVTPE MOVTPE Rs, @aa:16*2 2 1 MULXS MULXS.B Rs, Rd MULXS.W Rs, ERd 2 2 12 20 MULXU MULXU.B Rs, Rd MULXU.W Rs, ERd 1 1 12 20 NEG NEG.B Rd NEG.W Rd NEG.L ERd 1 1 1 NOP NOP 1 NOT NOT.B Rd NOT.W Rd NOT.L ERd 1 1 1 OR OR.B #xx:8, Rd OR.B Rs, Rd OR.W #xx:16, Rd OR.W Rs, Rd OR.L #xx:32, ERd OR.L ERs, ERd 1 1 2 1 3 2 ORC ORC #xx:8, CCR 1 POP POP.W Rn POP.L ERn 1 2 1 2 2 2 PUSH PUSH.W Rn PUSH.L ERn 1 2 1 2 2 2 ROTL ROTL.B Rd ROTL.W Rd ROTL.L ERd 1 1 1 ROTR ROTR.B Rd ROTR.W Rd ROTR.L ERd 1 1 1 Rev. 2.00 Sep 20, 2005 page 664 of 800 REJ09B0260-0200 2 2 2 2 Appendix A Instruction Set Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N Instruction Mnemonic ROTXL ROTXL.B Rd ROTXL.W Rd ROTXL.L ERd 1 1 1 ROTXR ROTXR.B Rd ROTXR.W Rd ROTXR.L ERd 1 1 1 RTE RTE 2 RTS RTS Normal 2 2 1 2 Advanced 2 2 2 SHAL SHAL.B Rd SHAL.W Rd SHAL.L ERd 1 1 1 SHAR SHAR.B Rd SHAR.W Rd SHAR.L ERd 1 1 1 SHLL SHLL.B Rd SHLL.W Rd SHLL.L ERd 1 1 1 SHLR SHLR.B Rd SHLR.W Rd SHLR.L ERd 1 1 1 SLEEP SLEEP 1 STC 1 STC CCR, Rd 2 STC CCR, @ERd STC CCR, @(d:16, ERd) 3 STC CCR, @(d:24, ERd) 5 2 STC CCR, @–ERd 3 STC CCR, @aa:16 4 STC CCR, @aa:24 SUB 2 SUB.B Rs, Rd SUB.W #xx:16, Rd SUB.W Rs, Rd SUB.L #xx:32, ERd SUB.L ERs, ERd 1 1 1 1 1 1 2 1 2 1 3 1 SUBS SUBS #1/2/4, ERd 1 SUBX SUBX #xx:8, Rd SUBX Rs, Rd 1 1 TRAPA TRAPA #x:2 Normal 2 1 2 4 Advanced 2 2 2 4 Rev. 2.00 Sep 20, 2005 page 665 of 800 REJ09B0260-0200 Appendix A Instruction Set Instruction Mnemonic Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N XOR XOR.B #xx:8, Rd XOR.B Rs, Rd XOR.W #xx:16, Rd XOR.W Rs, Rd XOR.L #xx:32, ERd XOR.L ERs, ERd 1 1 2 1 3 2 XORC XORC #xx:8, CCR 1 Notes: 1. n is the value set in register R4L or R4. The source and destination are accessed n + 1 times each. 2. Not available in the H8/3024 Group. Rev. 2.00 Sep 20, 2005 page 666 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Appendix B Internal I/O Registers Table B.1 Comparison of H8/3024 Group Internal I/O Register Specifications Address (Low) H8/3024 Mask ROM, H8/3026 Mask ROM H8/3026F-ZTAT Version H8/3024F-ZTAT Version Module H'EE01E ADRCR ADRCR ADRCR Bus controller H'EE030 — FLMCR1 FLMCR1 Flash memory H'EE031 — FLMCR2 FLMCR2 H'EE032 — EBR1 EBR H'EE033 — EBR2 H'EE077 — RAMCR H'EE07D — RAMCR Notes: 1. A dash (“—”) indicates that an access will always return 1s, and writes are invalid. 2. Shading indicates that access is prohibited. Normal operation is not guaranteed if these addresses are accessed. Rev. 2.00 Sep 20, 2005 page 667 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers B.1 Address List (H8/3026F-ZTAT, H8/3026 Mask ROM Version) Bit Names Address Register (Low) Name Data Bus Width Bit 7 H'EE000 P1DDR 8 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1 H'EE001 P2DDR 8 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2 H'EE002 P3DDR 8 P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3 H'EE003 P4DDR 8 P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4 H'EE004 P5DDR 8 — — H'EE005 P6DDR 8 — P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6 — — — — — — — P84DDR P83DDR P82DDR P81DDR P80DDR Port 8 — P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9 H'EE006 — H'EE007 P8DDR 8 Bit 6 Bit 5 — Bit 4 — Bit 3 Bit 2 Bit 1 Bit 0 Module Name P53DDR P52DDR P51DDR P50DDR Port 5 — — — — H'EE008 P9DDR 8 — H'EE009 PADDR 8 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A H'EE00A PBDDR 8 PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B H'EE00B — — — — — — — — — H'EE00C — — — — — — — — — H'EE00D — — — — — — — — — H'EE00E — — — — — — — — — H'EE00F — — — — — — — — — H'EE010 — — — — — — — — — H'EE011 MDCR 8 — — — — — MDS2 MDS1 MDS0 H'EE012 SYSCR 8 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME H'EE013 BRCR 8 A23E A22E A21E A20E — — — BRLE H'EE014 ISCR 8 — — H'EE015 IER 8 — — IRQ5E H'EE016 ISR 8 — — IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F — — — — — — — — H'EE017 — System control Bus controller IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E controller H'EE018 IPRA 8 IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 H'EE019 IPRB 8 IPRB7 IPRB6 — — IPRB3 IPRB2 — — H'EE01A DASTCR 8 — — — — — — — DASTE D/A converter H'EE01B DIVCR 8 — — — — — — DIV1 DIV0 System control H'EE01C MSTCRH 8 PSTOP — — — — — MSTPH1 MSTPH0 H'EE01D MSTCRL 8 — — — MSTPL4 MSTPL3 MSTPL2 — MSTPL0 H'EE01E ADRCR 8 — — — — — — — ADRCTL Bus controller H'EE01F CSCR 8 CS7E CS6E CS5E CS4E — — — — Rev. 2.00 Sep 20, 2005 page 668 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name Bus controller H'EE020 ABWCR 8 ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 H'EE021 ASTCR 8 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 W40 H'EE022 WCRH 8 W71 W70 W61 W60 W51 W50 W41 H'EE023 WCRL 8 W31 W30 W21 W20 W11 W10 W01 W00 H'EE024 BCR 8 ICIS1 ICIS0 —*2 —*2 —*2 — RDEA WAITE — — — — — — — — H'EE025 — H'EE026 Reserved area (access prohibited) H'EE027 H'EE028 H'EE029 H'EE02A H'EE02B H'EE02C H'EE02D H'EE02E H'EE02F H'EE030 FLMCR1*5 8 FWE SWE ESU PSU EV PV E P H'EE031 FLMCR2*5 8 FLER —*1 —*1 —*1 —*1 —*1 —*1 —*1 H'EE032 EBR1*5 8 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 H'EE033 EBR2*5 8 — — — — EB11 EB10 EB9 EB8 H'EE034 — — — — — — — — — H'EE035 — — — — — — — — — H'EE036 — — — — — — — — — H'EE037 — — — — — — — — — Flash memory H'EE038 Reserved area (access prohibited) H'EE039 H'EE03A H'EE03B H'EE03C P2PCR 8 H'EE03D — P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2 — — — — — — — — H'EE03E P4PCR 8 P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4 H'EE03F P5PCR 8 — — — — P53PCR P52PCR P51PCR P50PCR Port 5 H'EE040 — — — — — — — — — H'EE041 — — — — — — — — — H'EE042 — — — — — — — — — H'EE043 — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 669 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'EE044 — — — — — — — — — H'EE045 — — — — — — — — — H'EE046 — — — — — — — — — H'EE047 — — — — — — — — — H'EE048 — — — — — — — — — H'EE049 — — — — — — — — — H'EE04A — — — — — — — — — H'EE04B — — — — — — — — — H'EE04C — — — — — — — — — H'EE04D — — — — — — — — — H'EE04E — — — — — — — — — H'EE04F — — — — — — — — — H'EE050 — — — — — — — — — H'EE051 — — — — — — — — — H'EE052 — — — — — — — — — H'EE053 — — — — — — — — — H'EE054 — — — — — — — — — H'EE055 — — — — — — — — — H'EE056 — — — — — — — — — H'EE057 — — — — — — — — — H'EE058 — — — — — — — — — H'EE059 — — — — — — — — — H'EE05A — — — — — — — — — H'EE05B — — — — — — — — — H'EE05C — — — — — — — — — H'EE05D — — — — — — — — — H'EE05E — — — — — — — — — H'EE05F — — — — — — — — — H'EE060 — — — — — — — — — H'EE061 — — — — — — — — — H'EE062 — — — — — — — — — H'EE063 — — — — — — — — — H'EE064 — — — — — — — — — H'EE065 — — — — — — — — — H'EE066 — — — — — — — — — H'EE067 — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 670 of 800 REJ09B0260-0200 Module Name Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'EE068 — — — — — — — — — H'EE069 — — — — — — — — — H'EE06A — — — — — — — — — H'EE06B — — — — — — — — — H'EE06C — — — — — — — — — H'EE06D — — — — — — — — — H'EE06E — — — — — — — — — H'EE06F — — — — — — — — — H'EE070 — — — — — — — — — H'EE071 — — — — — — — — — H'EE072 — — — — — — — — — H'EE073 — — — — — — — — — — — RAMS RAM2 RAM1 RAM0 Module Name H'EE074 Reserved area (access prohibited) H'EE075 H'EE076 H'EE077 RAMCR*5 8 — — Flash memory H'EE078 Reserved area (access prohibited) H'EE079 H'EE07A H'EE07B H'EE07C H'EE07D H'EE07E H'EE07F H'EE080 H'EE081 H'FFF20 H'FFF21 H'FFF22 H'FFF23 H'FFF24 H'FFF25 H'FFF26 H'FFF27 H'FFF28 H'FFF29 Rev. 2.00 Sep 20, 2005 page 671 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'FFF2A Reserved area (access prohibited) H'FFF2B H'FFF2C H'FFF2D H'FFF2E H'FFF2F H'FFF30 H'FFF31 H'FFF32 H'FFF33 H'FFF34 H'FFF35 H'FFF36 H'FFF37 H'FFF38 H'FFF39 H'FFF3A H'FFF3B H'FFF3C H'FFF3D H'FFF3E H'FFF3F H'FFF40 — — — — — — — — — H'FFF41 — — — — — — — — — H'FFF42 — — — — — — — — — H'FFF43 — — — — — — — — — H'FFF44 — — — — — — — — — H'FFF45 — — — — — — — — — H'FFF46 — — — — — — — — — H'FFF47 — — — — — — — — — H'FFF48 — — — — — — — — — H'FFF49 — — — — — — — — — H'FFF4A — — — — — — — — — H'FFF4B — — — — — — — — — H'FFF4C — — — — — — — — — H'FFF4D — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 672 of 800 REJ09B0260-0200 Module Name Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'FFF4E — — — — — — — — — H'FFF4F — — — — — — — — — H'FFF50 — — — — — — — — — H'FFF51 — — — — — — — — — H'FFF52 — — — — — — — — — H'FFF53 — — — — — — — — — H'FFF54 — — — — — — — — — H'FFF55 — — — — — — — — — H'FFF56 — — — — — — — — — H'FFF57 — — — — — — — — — H'FFF58 — — — — — — — — — H'FFF59 — — — — — — — — — H'FFF5A — — — — — — — — — H'FFF5B — — — — — — — — — H'FFF5C — — — — — — — — — H'FFF5D — — — — — — — — — H'FFF5E — — — — — — — — — H'FFF5F — — — — — — — — — H'FFF60 TSTR 8 — — — — — STR2 STR1 STR0 H'FFF61 TSNC 8 — — — — — SYNC2 SYNC1 SYNC0 H'FFF62 TMDR 8 — MDF FDIR — — PWM2 PWM1 PWM0 H'FFF63 TOLR 8 — — TOB2 TOA2 TOB1 TOA1 TOB0 TOA0 H'FFF64 TISRA 8 — IMIEA2 IMIEA1 IMIEA0 — IMFA2 IMFA1 IMFA0 H'FFF65 TISRB 8 — IMIEB2 IMIEB1 IMIEB0 — IMFB2 IMFB1 IMFB0 H'FFF66 TISRC 8 — OVIE2 OVIE1 OVIE0 — OVF2 OVF1 OVF0 H'FFF68 16TCR0 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF69 TIOR0 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 Module Name 16-bit timer (all channels) H'FFF67 16-bit timer channel 0 H'FFF6A 16TCNT0H 16 H'FFF6B 16TCNT0L H'FFF6C GRA0H 16 H'FFF6D GRA0L H'FFF6E GRB0H 16 H'FFF6F GRB0L Rev. 2.00 Sep 20, 2005 page 673 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF70 16TCR1 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF71 TIOR1 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 16-bit timer channel 1 H'FFF72 16TCNT1H 16 H'FFF73 16TCNT1L H'FFF74 GRA1H 16 H'FFF75 GRA1L H'FFF76 GRB1H 16 H'FFF77 GRB1L H'FFF78 16TCR2 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF79 TIOR2 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 16-bit timer channel 2 H'FFF7A 16TCNT2H 16 H'FFF7B 16TCNT2L H'FFF7C GRA2H 16 H'FFF7D GRA2L H'FFF7E GRB2H 16 H'FFF7F GRB2L H'FFF80 8TCR0 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF81 8TCR1 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF82 8TCSR0 8 CMFB CMFA OVF ADTE OIS3 OIS2 OS1 OS0 H'FFF83 8TCSR1 8 CMFB CMFA OVF ICE OIS3 OIS2 OS1 OS0 H'FFF84 TCORA0 8 H'FFF85 TCORA1 8 H'FFF86 TCORB0 8 H'FFF87 TCORB1 8 H'FFF88 8TCNT0 8 H'FFF89 8TCNT1 8 H'FFF8A — — — — — — — — — H'FFF8B — — — — — — — — — OVF WT/IT TME — — CKS2 CKS1 CKS0 H'FFF8E — — — — — — — — — H'FFF8F RSTCSR*3 8 WRST — — — — — — — H'FFF8C TCSR*3 8 H'FFF8D TCNT*3 8 Rev. 2.00 Sep 20, 2005 page 674 of 800 REJ09B0260-0200 8-bit timer channels 0 and 1 WDT Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF90 8TCR2 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF91 8TCR3 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 8-bit timer channels 2 and 3 H'FFF92 8TCSR2 8 CMFB CMFA OVF — OIS3 OIS2 OS1 OS0 H'FFF93 8TCSR3 8 CMFB CMFA OVF ICE OIS3 OIS2 OS1 OS0 H'FFF94 TCORA2 8 H'FFF95 TCORA3 8 H'FFF96 TCORB2 8 H'FFF9A — — — — — — — — — H'FFF9B — — — — — — — — — H'FFF97 TCORB3 8 H'FFF98 8TCNT2 8 H'FFF99 8TCNT3 8 H'FFF9C DADR0 8 H'FFF9D DADR1 8 H'FFF9E DACR 8 D/A converter DAOE1 DAOE0 DAE — — — — — — — G3NOV G2NOV G1NOV G0NOV TPC H'FFF9F Reserved area (access prohibited) H'FFFA0 TPMR 8 — H'FFFA1 TPCR 8 G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 — H'FFFA2 NDERB 8 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 H'FFFA3 NDERA 8 NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0 H'FFFA4 NDRB*4 8 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 NDR15 NDR14 NDR13 NDR12 — — — — H'FFFA5 NDRA*4 8 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 NDR7 NDR6 NDR5 NDR4 — — — — — — — — — — — — — — — — NDR11 NDR10 NDR9 NDR8 — — — — — — — — — — — — NDR3 NDR2 NDR1 NDR0 H'FFFA8 — — — — — — — — — H'FFFA9 — — — — — — — — — H'FFFAA — — — — — — — — — H'FFFAB — — — — — — — — — H'FFFAC — — — — — — — — — H'FFFAD — — — — — — — — — H'FFFAE — — — — — — — — — H'FFFAF — — — — — — — — — H'FFFA6 NDRB*4 H'FFFA7 NDRA*4 8 8 Rev. 2.00 Sep 20, 2005 page 675 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFFB0 SMR 8 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 0 H'FFFB1 BRR 8 H'FFFB2 SCR 8 TIE RIE TE RE MPIE TEIE CKE1 CKE0 H'FFFB3 TDR 8 H'FFFB4 SSR 8 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT — — — — SDIR SINV — SMIF H'FFFB5 RDR 8 H'FFFB6 SCMR 8 H'FFFB7 Reserved area (access prohibited) H'FFFB8 SMR 8 H'FFFB9 BRR 8 H'FFFBA SCR 8 H'FFFBB TDR 8 H'FFFBC SSR 8 H'FFFBD RDR 8 H'FFFBE SCMR 8 C/A CHR PE O/E STOP MP CKS1 CKS0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT — — — — SDIR SINV — SMIF SCI channel 1 H'FFFBF Reserved area (access prohibited) H'FFFC0 Reserved area (access prohibited) H'FFFC1 H'FFFC2 H'FFFC3 H'FFFC4 H'FFFC5 H'FFFC6 H'FFFC7 H'FFFC8 — — — — — — — — — H'FFFC9 — — — — — — — — — H'FFFCA — — — — — — — — — H'FFFCB — — — — — — — — — H'FFFCC — — — — — — — — — H'FFFCD — — — — — — — — — H'FFFCE — — — — — — — — — H'FFFCF — — — — — — — — — H'FFFD0 P1DR 8 P17 P16 P15 P14 P13 P12 P11 P10 Port 1 H'FFFD1 P2DR 8 P27 P26 P25 P24 P23 P22 P21 P20 Port 2 H'FFFD2 P3DR 8 P37 P36 P35 P34 P33 P32 P31 P30 Port 3 Rev. 2.00 Sep 20, 2005 page 676 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFFD3 P4DR 8 P47 P46 P45 P44 P43 P42 P41 P40 Port 4 H'FFFD4 P5DR 8 — — — — P53 P52 P51 P50 Port 5 H'FFFD5 P6DR 8 P67 P66 P65 P64 P63 P62 P61 P60 Port 6 H'FFFD6 P7DR 8 P77 P76 P75 P74 P73 P72 P71 P70 Port 7 H'FFFD7 P8DR 8 — — — P84 P83 P82 P81 P80 Port 8 H'FFFD8 P9DR 8 — — P95 P94 P93 P92 P91 P90 Port 9 H'FFFD9 PADR 8 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Port A H'FFFDA PBDR 8 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 Port B H'FFFDB — — — — — — — — — H'FFFDC — — — — — — — — — H'FFFDD — — — — — — — — — H'FFFDE — — — — — — — — — — H'FFFDF — — — — — — — — H'FFFE0 ADDRAH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE1 ADDRAL 8 AD1 AD0 — — — — — — H'FFFE2 ADDRBH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE3 ADDRBL 8 AD1 AD0 — — — — — — H'FFFE4 ADDRCH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE5 ADDRCL 8 AD1 AD0 — — — — — — H'FFFE6 ADDRDH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE7 ADDRDL 8 AD1 AD0 — — — — — — H'FFFE8 ADCSR 8 ADF ADIE ADST SCAN CKS CH2 CH1 CH0 H'FFFE9 ADCR 8 TRGE — — — — — — — A/D converter Notes: 1. Writing to bits 6 to 0 of FLMCR2 is prohibited. 2. Writing to bits 5 to 3 of BCR is prohibited. 3. For the procedure for writing to TCSR, TCNT, and RSTCSR, see section 11.2.4, Notes on Register Access. 4. The address depends on the output trigger setting. 5. Use byte access on FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR. These registers are not available in a mask ROM version. Legend: WDT: Watchdog timer TPC: Programmable timing pattern controller SCI: Serial communication interface Rev. 2.00 Sep 20, 2005 page 677 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers B.2 Address List (H8/3024F-ZTAT, H8/3024 Mask ROM Version) Bit Names Address Register (Low) Name Data Bus Width Bit 7 H'EE000 P1DDR 8 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1 H'EE001 P2DDR 8 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2 H'EE002 P3DDR 8 P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3 H'EE003 P4DDR 8 P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4 H'EE004 P5DDR 8 — — H'EE005 P6DDR 8 — P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6 — — — — — — — P84DDR P83DDR P82DDR P81DDR P80DDR Port 8 — P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9 H'EE006 — H'EE007 P8DDR 8 Bit 6 Bit 5 — Bit 4 — Bit 3 Bit 2 Bit 1 Bit 0 Module Name P53DDR P52DDR P51DDR P50DDR Port 5 — — — — H'EE008 P9DDR 8 — H'EE009 PADDR 8 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A H'EE00A PBDDR 8 PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B H'EE00B — — — — — — — — — H'EE00C — — — — — — — — — H'EE00D — — — — — — — — — H'EE00E — — — — — — — — — H'EE00F — — — — — — — — — H'EE010 — — — — — — — — — H'EE011 MDCR 8 — — — — — MDS2 MDS1 MDS0 H'EE012 SYSCR 8 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME H'EE013 BRCR 8 A23E A22E A21E A20E — — — BRLE H'EE014 ISCR 8 — — H'EE015 IER 8 — — IRQ5E H'EE016 ISR 8 — — IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F — — — — — — — — H'EE017 — System control Bus controller IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E controller H'EE018 IPRA 8 IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 H'EE019 IPRB 8 IPRB7 IPRB6 — — IPRB3 IPRB2 — — H'EE01A DASTCR 8 — — — — — — — DASTE D/A converter H'EE01B DIVCR 8 — — — — — — DIV1 DIV0 System control H'EE01C MSTCRH 8 PSTOP — — — — — MSTPH1 MSTPH0 H'EE01D MSTCRL 8 — — — MSTPL4 MSTPL3 MSTPL2 — MSTPL0 H'EE01E ADRCR 8 — — — — — — — ADRCTL Bus controller H'EE01F CSCR 8 CS7E CS6E CS5E CS4E — — — — Rev. 2.00 Sep 20, 2005 page 678 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name Bus controller H'EE020 ABWCR 8 ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 H'EE021 ASTCR 8 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 W40 H'EE022 WCRH 8 W71 W70 W61 W60 W51 W50 W41 H'EE023 WCRL 8 W31 W30 W21 W20 W11 W10 W01 W00 H'EE024 BCR 8 ICIS1 ICIS0 —*2 —*2 —*2 — RDEA WAITE — — — — — — — — H'EE025 — H'EE026 Reserved area (access prohibited) H'EE027 H'EE028 H'EE029 H'EE02A H'EE02B H'EE02C H'EE02D H'EE02E H'EE02F H'EE030 FLMCR1*5 8 FWE SWE ESU PSU EV PV E P H'EE031 FLMCR2*5 8 FLER —*1 —*1 —*1 —*1 —*1 —*1 —*1 H'EE032 EBR*5 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 8 Flash memory H'EE033 Reserved area (access prohibited) H'EE034 — — — — — — — — — H'EE035 — — — — — — — — — H'EE036 — — — — — — — — — H'EE037 — — — — — — — — — H'EE038 Reserved area (access prohibited) H'EE039 H'EE03A H'EE03B H'EE03C P2PCR 8 H'EE03D — P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2 — — — — — — — — H'EE03E P4PCR 8 P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4 H'EE03F P5PCR 8 — — — — P53PCR P52PCR P51PCR P50PCR Port 5 H'EE040 — — — — — — — — — H'EE041 — — — — — — — — — H'EE042 — — — — — — — — — H'EE043 — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 679 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'EE044 — — — — — — — — — H'EE045 — — — — — — — — — H'EE046 — — — — — — — — — H'EE047 — — — — — — — — — H'EE048 — — — — — — — — — H'EE049 — — — — — — — — — H'EE04A — — — — — — — — — H'EE04B — — — — — — — — — H'EE04C — — — — — — — — — H'EE04D — — — — — — — — — H'EE04E — — — — — — — — — H'EE04F — — — — — — — — — H'EE050 — — — — — — — — — H'EE051 — — — — — — — — — H'EE052 — — — — — — — — — H'EE053 — — — — — — — — — H'EE054 — — — — — — — — — H'EE055 — — — — — — — — — H'EE056 — — — — — — — — — H'EE057 — — — — — — — — — H'EE058 — — — — — — — — — H'EE059 — — — — — — — — — H'EE05A — — — — — — — — — H'EE05B — — — — — — — — — H'EE05C — — — — — — — — — H'EE05D — — — — — — — — — H'EE05E — — — — — — — — — H'EE05F — — — — — — — — — H'EE060 — — — — — — — — — H'EE061 — — — — — — — — — H'EE062 — — — — — — — — — H'EE063 — — — — — — — — — H'EE064 — — — — — — — — — H'EE065 — — — — — — — — — H'EE066 — — — — — — — — — H'EE067 — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 680 of 800 REJ09B0260-0200 Module Name Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'EE068 — — — — — — — — — H'EE069 — — — — — — — — — H'EE06A — — — — — — — — — H'EE06B — — — — — — — — — H'EE06C — — — — — — — — — H'EE06D — — — — — — — — — H'EE06E — — — — — — — — — H'EE06F — — — — — — — — — H'EE070 — — — — — — — — — H'EE071 — — — — — — — — — H'EE072 — — — — — — — — — H'EE073 — — — — — — — — — — — RAMS RAM2 RAM1 RAM0 Module Name H'EE074 Reserved area (access prohibited) H'EE075 H'EE076 H'EE077 RAMCR*5 8 — — Flash memory H'EE078 Reserved area (access prohibited) H'EE079 H'EE07A H'EE07B H'EE07C H'EE07D H'EE07E H'EE07F H'EE080 H'EE081 H'FFF20 H'FFF21 H'FFF22 H'FFF23 H'FFF24 H'FFF25 H'FFF26 H'FFF27 H'FFF28 H'FFF29 Rev. 2.00 Sep 20, 2005 page 681 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'FFF2A Reserved area (access prohibited) H'FFF2B H'FFF2C H'FFF2D H'FFF2E H'FFF2F H'FFF30 H'FFF31 H'FFF32 H'FFF33 H'FFF34 H'FFF35 H'FFF36 H'FFF37 H'FFF38 H'FFF39 H'FFF3A H'FFF3B H'FFF3C H'FFF3D H'FFF3E H'FFF3F H'FFF40 — — — — — — — — — H'FFF41 — — — — — — — — — H'FFF42 — — — — — — — — — H'FFF43 — — — — — — — — — H'FFF44 — — — — — — — — — H'FFF45 — — — — — — — — — H'FFF46 — — — — — — — — — H'FFF47 — — — — — — — — — H'FFF48 — — — — — — — — — H'FFF49 — — — — — — — — — H'FFF4A — — — — — — — — — H'FFF4B — — — — — — — — — H'FFF4C — — — — — — — — — H'FFF4D — — — — — — — — — Rev. 2.00 Sep 20, 2005 page 682 of 800 REJ09B0260-0200 Module Name Appendix B Internal I/O Registers Address Register (Low) Name Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 H'FFF4E — — — — — — — — — H'FFF4F — — — — — — — — — H'FFF50 — — — — — — — — — H'FFF51 — — — — — — — — — H'FFF52 — — — — — — — — — H'FFF53 — — — — — — — — — H'FFF54 — — — — — — — — — H'FFF55 — — — — — — — — — H'FFF56 — — — — — — — — — H'FFF57 — — — — — — — — — H'FFF58 — — — — — — — — — H'FFF59 — — — — — — — — — H'FFF5A — — — — — — — — — H'FFF5B — — — — — — — — — H'FFF5C — — — — — — — — — H'FFF5D — — — — — — — — — H'FFF5E — — — — — — — — — H'FFF5F — — — — — — — — — H'FFF60 TSTR 8 — — — — — STR2 STR1 STR0 H'FFF61 TSNC 8 — — — — — SYNC2 SYNC1 SYNC0 H'FFF62 TMDR 8 — MDF FDIR — — PWM2 PWM1 PWM0 H'FFF63 TOLR 8 — — TOB2 TOA2 TOB1 TOA1 TOB0 TOA0 H'FFF64 TISRA 8 — IMIEA2 IMIEA1 IMIEA0 — IMFA2 IMFA1 IMFA0 H'FFF65 TISRB 8 — IMIEB2 IMIEB1 IMIEB0 — IMFB2 IMFB1 IMFB0 H'FFF66 TISRC 8 — OVIE2 OVIE1 OVIE0 — OVF2 OVF1 OVF0 H'FFF68 16TCR0 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF69 TIOR0 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 Module Name 16-bit timer (all channels) H'FFF67 16-bit timer channel 0 H'FFF6A 16TCNT0H 16 H'FFF6B 16TCNT0L H'FFF6C GRA0H 16 H'FFF6D GRA0L H'FFF6E GRB0H 16 H'FFF6F GRB0L Rev. 2.00 Sep 20, 2005 page 683 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF70 16TCR1 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF71 TIOR1 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 16-bit timer channel 1 H'FFF72 16TCNT1H 16 H'FFF73 16TCNT1L H'FFF74 GRA1H 16 H'FFF75 GRA1L H'FFF76 GRB1H 16 H'FFF77 GRB1L H'FFF78 16TCR2 8 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 H'FFF79 TIOR2 8 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 16-bit timer channel 2 H'FFF7A 16TCNT2H 16 H'FFF7B 16TCNT2L H'FFF7C GRA2H 16 H'FFF7D GRA2L H'FFF7E GRB2H 16 H'FFF7F GRB2L H'FFF80 8TCR0 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF81 8TCR1 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF82 8TCSR0 8 CMFB CMFA OVF ADTE OIS3 OIS2 OS1 OS0 H'FFF83 8TCSR1 8 CMFB CMFA OVF ICE OIS3 OIS2 OS1 OS0 H'FFF84 TCORA0 8 H'FFF85 TCORA1 8 H'FFF86 TCORB0 8 H'FFF87 TCORB1 8 H'FFF88 8TCNT0 8 H'FFF89 8TCNT1 8 H'FFF8A — — — — — — — — — H'FFF8B — — — — — — — — — OVF WT/IT TME — — CKS2 CKS1 CKS0 H'FFF8E — — — — — — — — — H'FFF8F RSTCSR*3 8 WRST — — — — — — — H'FFF8C TCSR*3 8 H'FFF8D TCNT*3 8 Rev. 2.00 Sep 20, 2005 page 684 of 800 REJ09B0260-0200 8-bit timer channels 0 and 1 WDT Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF90 8TCR2 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF91 8TCR3 8 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 H'FFF92 8TCSR2 8 CMFB CMFA OVF — OIS3 OIS2 OS1 OS0 8-bit timer channels 2 and 3 H'FFF93 8TCSR3 8 CMFB CMFA OVF ICE OIS3 OIS2 OS1 OS0 H'FFF94 TCORA2 8 H'FFF95 TCORA3 8 H'FFF96 TCORB2 8 H'FFF9A — — — — — — — — — H'FFF9B — — — — — — — — — H'FFF97 TCORB3 8 H'FFF98 8TCNT2 8 H'FFF99 8TCNT3 8 H'FFF9C DADR0 8 H'FFF9D DADR1 8 H'FFF9E DACR 8 D/A converter DAOE1 DAOE0 DAE — — — — — — — G3NOV G2NOV G1NOV G0NOV TPC H'FFF9F Reserved area (access prohibited) H'FFFA0 TPMR 8 — H'FFFA1 TPCR 8 G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 — H'FFFA2 NDERB 8 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 H'FFFA3 NDERA 8 NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0 H'FFFA4 NDRB*4 8 NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8 NDR15 NDR14 NDR13 NDR12 — — — — H'FFFA5 NDRA*4 8 NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0 NDR7 NDR6 NDR5 NDR4 — — — — — — — — — — — — — — — — NDR11 NDR10 NDR9 NDR8 — — — — — — — — — — — — NDR3 NDR2 NDR1 NDR0 H'FFFA8 — — — — — — — — — H'FFFA9 — — — — — — — — — H'FFFAA — — — — — — — — — H'FFFAB — — — — — — — — — H'FFFAC — — — — — — — — — H'FFFAD — — — — — — — — — H'FFFAE — — — — — — — — — H'FFFAF — — — — — — — — — H'FFFA6 NDRB*4 H'FFFA7 NDRA*4 8 8 Rev. 2.00 Sep 20, 2005 page 685 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFFB0 SMR 8 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 0 H'FFFB1 BRR 8 H'FFFB2 SCR 8 TIE RIE TE RE MPIE TEIE CKE1 CKE0 H'FFFB3 TDR 8 H'FFFB4 SSR 8 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT — — — — SDIR SINV — SMIF H'FFFB5 RDR 8 H'FFFB6 SCMR 8 H'FFFB7 Reserved area (access prohibited) H'FFFB8 SMR 8 H'FFFB9 BRR 8 H'FFFBA SCR 8 H'FFFBB TDR 8 H'FFFBC SSR 8 H'FFFBD RDR 8 H'FFFBE SCMR 8 C/A CHR PE O/E STOP MP CKS1 CKS0 TIE RIE TE RE MPIE TEIE CKE1 CKE0 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT — — — — SDIR SINV — SMIF SCI channel 1 H'FFFBF Reserved area (access prohibited) H'FFFC0 Reserved area (access prohibited) H'FFFC1 H'FFFC2 H'FFFC3 H'FFFC4 H'FFFC5 H'FFFC6 H'FFFC7 H'FFFC8 — — — — — — — — — H'FFFC9 — — — — — — — — — H'FFFCA — — — — — — — — — H'FFFCB — — — — — — — — — H'FFFCC — — — — — — — — — H'FFFCD — — — — — — — — — H'FFFCE — — — — — — — — — H'FFFCF — — — — — — — — — H'FFFD0 P1DR 8 P17 P16 P15 P14 P13 P12 P11 P10 Port 1 H'FFFD1 P2DR 8 P27 P26 P25 P24 P23 P22 P21 P20 Port 2 H'FFFD2 P3DR 8 P37 P36 P35 P34 P33 P32 P31 P30 Port 3 Rev. 2.00 Sep 20, 2005 page 686 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers Bit Names Address Register (Low) Name Data Bus Width Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFFD3 P4DR 8 P46 P45 P44 P43 P42 P41 P40 Port 4 P47 H'FFFD4 P5DR 8 — — — — P53 P52 P51 P50 Port 5 H'FFFD5 P6DR 8 P67 P66 P65 P64 P63 P62 P61 P60 Port 6 H'FFFD6 P7DR 8 P77 P76 P75 P74 P73 P72 P71 P70 Port 7 H'FFFD7 P8DR 8 — — — P84 P83 P82 P81 P80 Port 8 H'FFFD8 P9DR 8 — — P95 P94 P93 P92 P91 P90 Port 9 H'FFFD9 PADR 8 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Port A H'FFFDA PBDR 8 Port B PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 H'FFFDB — — — — — — — — — H'FFFDC — — — — — — — — — H'FFFDD — — — — — — — — — H'FFFDE — — — — — — — — — H'FFFDF — — — — — — — — — H'FFFE0 ADDRAH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE1 ADDRAL 8 AD1 AD0 — — — — — — H'FFFE2 ADDRBH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE3 ADDRBL 8 AD1 AD0 — — — — — — H'FFFE4 ADDRCH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE5 ADDRCL 8 AD1 AD0 — — — — — — H'FFFE6 ADDRDH 8 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 H'FFFE7 ADDRDL 8 AD1 AD0 — — — — — — H'FFFE8 ADCSR 8 ADF ADIE ADST SCAN CKS CH2 CH1 CH0 H'FFFE9 ADCR 8 TRGE — — — — — — — A/D converter Notes: 1. Writing to bits 6 to 0 of FLMCR2 is prohibited. 2. Writing to bits 5 to 3 of BCR is prohibited. 3. For the procedure for writing to TCSR, TCNT, and RSTCSR, see section 11.2.4, Notes on Register Access. 4. The address depends on the output trigger setting. 5. Use byte access on FLMCR1, FLMCR2, EBR, and RAMCR. These registers are not available in a mask ROM version. Legend: WDT: Watchdog timer TPC: Programmable timing pattern controller SCI: Serial communication interface Rev. 2.00 Sep 20, 2005 page 687 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers B.3 Functions Register abbreviation Address to which register is mapped Register name TIER—Timer Interrupt Enable Register H' 90 Name of on-chip supporting module FRT Bit numbers Bit Initial bit values Initial value R/W: 7 6 5 4 ICIAE ICIBE ICICE 0 R/W 0 R/W 0 R/W 3 2 OCIDE OCIAE OCIBE 0 R/W 0 R/W 1 R/W Read only W Write only 0 OVIE — 1 R/W 1 — Names of the bits. Dashes (—) indicate reserved bits. Timer overflow interrupt enable Possible types of access R 1 R/W Read and write 0 Interrupt requested by OVF flag is disabled 1 Interrupt requested by OVF flag is enabled Output compare interrupt B enable 0 Interrupt requested by OCFB flag is disabled 1 Interrupt requested by OCFB flag is enabled Full name of bit Output compare interrupt A enable 0 Interrupt requested by OCFA flag is disabled 1 Interrupt requested by OCFA flag is enabled Input capture interrupt D enable 0 Interrupt requested by ICFD flag is disabled 1 Interrupt requested by ICFD flag is enabled Rev. 2.00 Sep 20, 2005 page 688 of 800 REJ09B0260-0200 Descriptions of bit settings Appendix B Internal I/O Registers P1DDR—Port 1 Data Direction Register Bit 7 6 H'EE000 5 4 Port 1 3 2 1 0 P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Modes 1 to 4 Initial value Read/Write 1 — 1 — 1 — 1 — 1 — 1 — 1 — 1 — Modes 5 to 7 Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 1 input/output select P2DDR—Port 2 Data Direction Register Bit 7 6 0 Generic input 1 Generic output H'EE001 5 4 Port 2 3 2 1 0 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Modes 1 to 4 Initial value Read/Write 1 — 1 — 1 — 1 — 1 — 1 — 1 — 1 — Modes 5 to 7 Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 2 input/output select 0 Generic input 1 Generic output Rev. 2.00 Sep 20, 2005 page 689 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers P3DDR—Port 3 Data Direction Register Bit 7 6 H'EE002 5 4 Port 3 3 2 1 0 P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 3 input/output select 0 Generic input 1 Generic output P4DDR—Port 4 Data Direction Register Bit 7 6 H'EE003 5 4 Port 4 3 2 1 0 P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 4 input/output select 0 Generic input 1 Generic output P5DDR—Port 5 Data Direction Register Bit H'EE004 7 6 5 4 — — — — Port 5 2 3 1 0 P53DDR P52DDR P51DDR P50DDR Modes 1 to 4 Initial value Read/Write 1 — 1 — 1 — 1 — 1 — 1 — 1 — 1 — Modes 5 to 7 Initial value Read/Write 1 — 1 — 1 — 1 — 0 W 0 W 0 W 0 W Port 5 input/output select Rev. 2.00 Sep 20, 2005 page 690 of 800 REJ09B0260-0200 0 Generic input pin 1 Generic output pin Appendix B Internal I/O Registers P6DDR—Port 6 Data Direction Register Bit 7 — Initial value Read/Write H'EE005 5 6 4 Port 6 3 2 1 0 P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR 1 — 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 6 input/output select 0 Generic input 1 Generic output P8DDR—Port 8 Data Direction Register Bit H'EE007 7 6 5 — — — 4 Port 8 3 2 1 0 P84DDR P83DDR P82DDR P81DDR P80DDR Modes 1 to 4 Initial value Read/Write 1 — 1 — 1 — 1 W 0 W 0 W 0 W 0 W Modes 5 to 7 Initial value Read/Write 1 — 1 — 1 — 0 W 0 W 0 W 0 W 0 W Port 8 input/output select P9DDR—Port 9 Data Direction Register Bit Initial value Read/Write 7 6 — — 1 — 1 — 5 0 Generic input 1 Generic output H'EE008 4 3 Port 9 2 1 0 P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR 0 W 0 W 0 W 0 W 0 W 0 W Port 9 input/output select 0 Generic input 1 Generic output Rev. 2.00 Sep 20, 2005 page 691 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers PADDR—Port A Data Direction Register Bit 6 7 H'EE009 5 4 Port A 3 2 1 0 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Modes 3, 4 Initial value Read/Write 1 — 0 W 0 W 0 W 0 W 0 W 0 W 0 W Modes 1, 2, 5, 6, 7 Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port A input/output select PBDDR—Port B Data Direction Register Bit 7 6 0 Generic input 1 Generic output H'EE00A 5 4 3 Port B 2 1 0 PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W Port B input/output select Rev. 2.00 Sep 20, 2005 page 692 of 800 REJ09B0260-0200 0 Generic input 1 Generic output 0 W 0 W 0 W Appendix B Internal I/O Registers MDCR—Mode Control Register Bit Initial value Read/Write H'EE011 System control 7 6 5 4 3 2 1 0 — — — — — MDS2 MDS1 MDS0 1 — 1 — 0 — 0 — 0 — —* R —* R —* R Mode select 2 to 0 Bit 2 Bit 1 Bit 0 MD2 MD1 MD0 0 0 1 0 1 1 Operating Mode 0 — 1 Mode 1 0 Mode 2 1 Mode 3 0 Mode 4 1 Mode 5 0 Mode 6 1 Mode 7 Note: * Determined by the state of the mode pins (MD2 to MD0). Rev. 2.00 Sep 20, 2005 page 693 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers SYSCR—System Control Register Bit Initial value Read/Write H'EE012 System control 7 6 5 4 3 2 1 0 SSBY STS2 STS1 STS0 UE NMIEG SSOE RAME 0 R/W 0 R/W 0 R/W 0 R/W 1 R/W 0 R/W 0 R/W 1 R/W RAM enable 0 1 On-chip RAM is disabled On-chip RAM is enabled Software standby output port enable 0 In software standby mode, all address bus and bus control signals are highimpedance 1 In software standby mode, address bus retains output state and bus control signals are fixed high NMI edge select An interrupt is requested at the falling edge of NMI 0 An interrupt is requested at the rising edge of NMI 1 User bit enable CCR bit 6 (UI) is used as an interrupt mask bit 0 CCR bit 6 (UI) is used as a user bit 1 Standby timer select 2 to 0 Bit 6 STS2 Bit 5 STS1 0 0 1 0 1 1 Bit 4 STS0 0 1 0 1 0 1 0 1 Standby Timer Waiting Time = 8,192 states Waiting Time = 16,384 states Waiting Time = 32,768 states Waiting Time = 65,536 states Waiting Time = 131,072 states Waiting Time = 26,2144 states Waiting Time = 1,024 states Illegal setting Software standby SLEEP instruction causes transition to sleep mode 0 SLEEP instruction causes transition to software standby mode 1 Rev. 2.00 Sep 20, 2005 page 694 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers BRCR—Bus Release Control Register Bit H'EE013 Bus controller 7 6 5 4 3 2 1 0 A23E A22E A21E A20E — — — BRLE Modes 1, 2, 6, 7 Initial value Read/Write 1 — 1 — 1 — 1 — 1 — 1 — 1 — 0 R/W Modes 3, 4 Initial value Read/Write 1 R/W 1 R/W 1 R/W 0 — 1 — 1 — 1 — 0 R/W Mode 5 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 — 1 — 1 — 0 R/W Bus release enable Address 23 to 20 enable 0 Address output 1 Other input/output 0 1 ISCR—IRQ Sense Control Register Bit Initial value Read/Write 7 6 — — 0 R/W 0 R/W 5 H'EE014 4 3 The bus cannot be released to an external device The bus can be released to an external device Interrupt Controller 2 1 0 IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W IRQ5 to IRQ0 sense control 0 Interrupts are requested when IRQ5 to IRQ0 are low 1 Interrupts are requested by falling-edge input at IRQ5 to IRQ0 Rev. 2.00 Sep 20, 2005 page 695 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers IER—IRQ Enable Register Bit Initial value Read/Write H'EE015 Interrupt Controller 7 6 5 4 3 2 1 0 — — IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W IRQ5 to IRQ0 enable 0 IRQ5 to IRQ0 interrupts are disabled 1 IRQ5 to IRQ0 interrupts are enabled ISR—IRQ Status Register Bit Initial value Read/Write H'EE016 Interrupt Controller 7 6 5 4 3 2 1 0 — — IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F 0 — 0 — 0 R/(W)* 0 R/(W)* 0 R/(W)* 0 R/(W)* 0 R/(W)* 0 R/(W)* IRQ5 to IRQ0 flags Bits 5 to 0 Setting and Clearing Conditions IRQ5F to IRQ0F 0 [Clearing conditions] • Read IRQnF when IRQnF = 1, then write 0 in IRQnF. • IRQnSC = 0, IRQn input is high, and interrupt exception handling is being carried out. • IRQnSC = 1 and IRQn interrupt exception handling is being carried out. 1 [Setting conditions] • IRQnSC = 0 and IRQn input is low. • IRQnSC = 1 and IRQn input changes from high to low. (n = 5 to 0) Note: * Only 0 can be written to clear the flag. Rev. 2.00 Sep 20, 2005 page 696 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers IPRA—Interrupt Priority Register A H'EE018 Interrupt Controller 7 6 5 4 3 2 1 0 IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Bit Initial value Read/Write Priority level A7 to A0 0 Priority level 0 (low priority) 1 Priority level 1 (high priority) • Interrupt sources controlled by each bit Bit IPRA Interrupt source Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 IPRA7 IPRA6 IPRA5 IPRA4 IPRA3 IPRA2 IPRA1 IPRA0 IRQ0 IRQ1 IRQ2, IRQ3 IRQ4, IRQ5 WDT, A/D converter IPRB—Interrupt Priority Register B Bit Initial value Read/Write 16-bit 16-bit 16-bit timer timer timer channel 0 channel 1 channel 2 H'EE019 Interrupt Controller 7 6 5 4 3 2 1 0 IPRB7 IPRB6 — — IPRB3 IPRB2 — — 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Priority level B7, B6, B3, and B2 0 Priority level 0 (low priority) 1 Priority level 1 (high priority) • Interrupt sources controlled by each bit Bit IPRB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 IPRB7 IPRB6 — — IPRB3 IPRB2 — — — — — — Interrupt 8-bit timer 8-bit timer source channels channels 0 and 1 2 and 3 SCI SCI channel 0 channel 1 Rev. 2.00 Sep 20, 2005 page 697 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers DASTCR—D/A Standby Control Register Bit Initial value Read/Write H'EE01A D/A 7 6 5 4 3 2 1 0 — — — — — — — DASTE 1 — 1 — 1 — 1 — 1 — 1 — 1 — 0 R/W D/A standby enable 0 D/A output is disabled in software standby mode 1 D/A output is enabled in software standby mode DIVCR—Division Control Register Bit Initial value Read/Write (Initial value) H'EE01B System control 7 6 5 4 3 2 1 0 — — — — — — DIV1 DIV0 1 — 1 — 1 — 1 — 1 — 1 — 0 R/W 0 R/W Division ratio bits 1 and 0 Bit 1 Bit 0 DIV1 DIV0 0 1 Rev. 2.00 Sep 20, 2005 page 698 of 800 REJ09B0260-0200 Frequency Division Ratio 0 1/1 1 1/2 0 1/4 1 1/8 (Initial value) Appendix B Internal I/O Registers MSTCRH—Module Standby Control Register H H'EE01C System control 7 6 5 4 3 2 PSTOP — — — — — Initial value 0 1 1 1 1 0 0 Read/Write R/W — — — — R/W R/W Bit 1 0 MSTPH1 MSTPH0 0 R/W Module standby H1 and H0 Selection bits for placing modules in standby state. Reserved bits φ clock stop Enables or disables ø clock output. MSTCRL—Module Standby Control Register L Bit 7 6 5 — — — 4 H'EE01D 3 System control 2 MSTPL4 MSTPL3 MSTPL2 1 0 — MSTPL0 Initial value 0 0 0 0 0 0 0 Read/Write R/W R/W R/W R/W R/W R/W R/W 0 R/W Module standby L4 to L2, L0 Selection bits for placing modules in standby state. Reserved bits Rev. 2.00 Sep 20, 2005 page 699 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers ADRCR—Address Control Register Bit H'EE01E Bus controller 7 6 5 4 3 2 1 0 — — — — — — — ADRCTL Initial value 1 1 1 1 1 1 1 1 Read/Write — — — — — — — R/W Reserved bits Address control Selects address update mode 1 or address update mode 2. Description ADRCTL Note: 0 Address update mode 2 is selected 1 Address update mode 1 is selected (Initial value) H8/3024F-ZTAT This register not provided H8/3026F-ZTAT This register provided H8/3024 mask ROM version H8/3026 mask ROM version CSCR—Chip Select Control Register Bit Initial value Read/Write H'EE01F Bus controller 7 6 5 4 3 2 1 0 CS7E CS6E CS5E CS4E — — — — 0 R/W 0 R/W 0 R/W 0 R/W 1 — 1 — 1 — 1 — Chip select 7 to 4 enable Bit n Description CSnE 0 Output of chip select signal CSn is disabled (Initial value) 1 Output of chip select signal CSn is enabled (n = 7 to 4) Rev. 2.00 Sep 20, 2005 page 700 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers ABWCR—Bus Width Control Register Bit H'EE020 Bus controller 7 6 5 4 3 2 1 0 ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 Modes 1, 3, 5, 6, and 7 Initial value 1 1 1 1 1 1 1 1 Modes 2 and 4 Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Area 7 to 0 bus width control Bits 7 to 0 Bus Width of Access Area ABW7 to ABW0 0 Areas 7 to 0 are 16-bit access areas 1 Areas 7 to 0 are 8-bit access areas ASTCR—Access State Control Register Bit Initial value Read/Write H'EE021 Bus controller 7 6 5 4 3 2 1 0 AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Area 7 to 0 access state control Bits 7 to 0 AST7 to AST0 Number of States in Access Area 0 Areas 7 to 0 are two-state access areas 1 Areas 7 to 0 are three-state access areas Rev. 2.00 Sep 20, 2005 page 701 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers WCRH—Wait Control Register H Bit Initial value Read/Write H'EE022 Bus controller 7 6 5 4 3 2 1 0 W71 W70 W61 W60 W51 W50 W41 W40 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Area 4 wait control 1 and 0 0 No program wait is inserted 0 1 1 program wait state is inserted 1 0 2 program wait states are inserted 1 3 program wait states are inserted Area 5 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Area 6 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Area 7 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Rev. 2.00 Sep 20, 2005 page 702 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers WCRL—Wait Control Register L Bit Initial value Read/Write H'EE023 Bus controller 7 6 5 4 3 2 1 0 W31 W30 W21 W20 W11 W10 W01 W00 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Area 0 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Area 1 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Area 2 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Area 3 wait control 1 and 0 0 1 0 No program wait is inserted 1 1 program wait state is inserted 0 2 program wait states are inserted 1 3 program wait states are inserted Rev. 2.00 Sep 20, 2005 page 703 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers BCR—Bus Control Register Bit Initial value Read/Write H'EE024 Bus controller 7 6 5 4 3 2 1 0 ICIS1 ICIS0 — — — — RDEA WAITE 1 R/W 1 R/W 0* — 0* — 0* — 1 — 1 R/W 0 R/W Wait pin enable 0 WAIT pin wait input is disabled 1 WAIT pin wait input is enabled Area division unit select 0 Area divisions are as follows: Area 0: 2 MB Area 4: 1.93 MB Area 1: 2 MB Area 5: 4 KB Area 2: 8 MB Area 6: 23.75 KB Area 3: 2 MB Area 7: 22 B 1 Areas 0 to 7 are the same size (2 MB) Idle cycle insertion 0 0 No idle cycle is inserted in case of consecutive external read and write cycles 1 Idle cycle is inserted in case of consecutive external read and write cycles Idle cycle insertion 1 0 No idle cycle is inserted in case of consecutive external read cycles for different areas 1 Idle cycle is inserted in case of consecutive external read cycles for different areas Note: * These bits can be read and written, but must not be set to 1. Normal operation cannot be guaranteed if 1 is written in these bits. Rev. 2.00 Sep 20, 2005 page 704 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers FLMCR (FLMCR1)—Flash Memory Control Register 7 6 5 4 3 2 1 0 FWE SWE ESU PSU EV PV E P 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 1/0 R 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Bit Modes 1 to Initial value Read/Write 4, and 6 Initial value Read/Write Modes 5 and 7 H'EE030 Flash Memory Program mode 0 Program mode cleared (Initial value) 1 Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Erase mode 0 Erase mode cleared (Initial value) 1 Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Program-verify mode 0 Program-verify mode cleared (Initial value) 1 Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 Erase-verify mode 0 Erase-verify mode cleared (Initial value) 1 Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 Program setup 0 Program setup cleared (Initial value) 1 Program setup [Setting condition] When FWE = 1 and SWE = 1 Erase setup 0 Erase setup cleared (Initial value) 1 Erase setup [Setting condition] When FWE = 1 and SWE = 1 Software write enable bit 0 Write/erase disabled (Initial value) 1 Write/erase enabled [Setting condition] When FWE = 1 Flash write enable bit 0 When a low level is input to the FWE pin (hardware protection state)* 1 When a high level is input to the FWE pin Note: * Fix the FWE pin low in mode 6. H8/3024F-ZTAT This register provided H8/3026F-ZTAT This register provided (FLMCR1) H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 705 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers FLMCR (FLMCR2)—Flash Memory Control Register 2 Bit H'EE031 Flash Memory 7 6 5 4 3 2 1 0 FLER — — — — — — — Initial value 0 0 0 0 0 0 0 0 Read/Write R — — — — — — — Reserved bits Flash memory error H8/3024F-ZTAT This register not provided H8/3026F-ZTAT This register provided H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 706 of 800 REJ09B0260-0200 Note: Writes to FLMCR2 are prohibited. Appendix B Internal I/O Registers EBR (EBR1)—Erase Block Register H'EE032 Flash Memory 7 6 5 4 3 2 1 0 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 Modes 1 to Initial value 4, and 6 Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R Modes 5 and 7 0 R 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Bit Initial value Read/Write Block 7 to 0 0 Block EB7 to EB0 is not selected (Initial value) 1 Block EB7 to EB0 is selected Note: When not erasing, clear EBR to H'00. Writes are invalid. A value of 1 cannot be set in this register in mode 6. H8/3024F-ZTAT This register provided H8/3026F-ZTAT This register provided (EBR1) H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 707 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers EBR (EBR2)—Erase Block Register 2 Bit Modes 1 to Initial value 4, and 6 Read/Write Modes 5 and 7 Initial value Read/Write H'EE033 Flash Memory 7 6 5 4 3 2 1 0 — — — — EB11 EB10 EB9 EB8 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Block 11 to 8 0 Block EB11 to EB8 is not selected (Initial value) 1 Block EB11 to EB8 is selected Note: When not erasing, clear EBR to H'00. A value of 1 cannot be set in this register in mode 6. H8/3024F-ZTAT This register not provided H8/3026F-ZTAT This register provided H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 708 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers P4PCR—Port 4 Input Pull-Up Control Register Bit 7 6 5 4 H'EE03E 3 Port 4 2 1 0 P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Port 4 input pull-up control 7 to 0 0 Input pull-up transistor is off 1 Input pull-up transistor is on Note: Valid when the corresponding P4DDR bit is cleared to 0 (designating generic input). P5PCR—Port 5 Input Pull-Up Control Register Bit Initial value Read/Write 7 6 5 4 — — — — 1 — 1 — 1 — 1 — H'EE03F 3 Port 5 2 1 0 P53PCR P52PCR P51PCR P50PCR 0 R/W 0 R/W 0 R/W 0 R/W Port 5 input pull-up control 3 to 0 0 Input pull-up transistor is off 1 Input pull-up transistor is on Note: Valid when the corresponding P5DDR bit is cleared to 0 (designating generic input). Rev. 2.00 Sep 20, 2005 page 709 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers RAMCR—RAM Control Register Bit H'EE077 Flash Memory 7 6 5 4 3 2 1 0 — — — — RAMS RAM2 RAM1 — Modes Initial value 1 to 4 R/W 1 — 1 — 1 — 1 — 0 R 0 R 0 R 1 — Modes Initial value 5 to 7 R/W 1 — 1 — 1 — 1 — 0 R/W* 0 R/W* 0 R/W* 1 — Reserved bits RAM select, RAM2, RAM1 Bit 3 Bit 2 Bit 1 RAM Area RAM Emulation Status RAMS RAM2 RAM1 0 0/1 0/1 H'FFF000 to H'FFF3FF No emulation 1 0 0 H'000000 to H'0003FF Mapping RAM 1 1 H'000400 to H'0007FF 0 H'000800 to H'000BFF 1 H'000C00 to H'000FFF Note: * In mode 6 (single-chip normal mode), flash memory emulation by RAM is not supported; these bits can be modified, but must not be set to 1. H8/3024F-ZTAT This register provided H8/3026F-ZTAT This register provided (bit specification below) H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 710 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers RAMCR (H8/3026F-ZTAT)—RAM Control Register Bit H'EE077 Flash Memory 7 6 5 4 3 2 1 0 — — — — RAMS RAM2 RAM1 RAM0 Modes Initial value 1 to 4 R/W 1 — 1 — 1 — 1 — 0 R 0 R 0 R 0 R Modes Initial value 5 to 7 R/W 1 — 1 — 1 — 1 — 0 R/W 0 R/W 0 R/W 0 R/W Reserved bits Rev. 2.00 Sep 20, 2005 page 711 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers FLMSR-Flash Memory Status Register Bit H'EE07D Flash Memory 7 6 5 4 3 2 1 0 FLER — — — — — — — 0 R 1 — 1 — 1 — 1 — 1 — 1 — 1 — Initial value R/W Reserved bits Flash memory error Bit 7 Description FLER 0 Flash memory program/erase protection (error protection*1) is disabled (Initial value) [Clearing condition] WDT reset, reset via the RES pin, or hardware standby mode 1 An error has occurred during flash memory programming/erasing, and error protection*1 is enabled [Setting conditions] • When flash memory is read*2 during programming/erasing (including a vector read or instruction fetch, but excluding reads in a RAM area overlapping flash memory space) • Immediately after the start of exception handling during programming/erasing (but excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling)*3 • When a SLEEP instruction (including software standby) is executed during programming/erasing • When the bus is released during programming/erasing Notes: 1. See 17.7.3, Error Protection, for details. 2. The read value in this case is undefined. 3. Before the exception handling stack or vector read is performed. H8/3024F-ZTAT This register provided H8/3026F-ZTAT This register not provided (FLER bit in FLMCR2) H8/3024 mask ROM version H8/3026 mask ROM version This register not provided Rev. 2.00 Sep 20, 2005 page 712 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TSTR—Timer Start Register H'FFF60 16-bit timer (all channels) 7 6 5 4 3 2 1 0 — — — — — STR2 STR1 STR0 Initial value 1 1 1 1 1 0 0 0 Read/Write — — — — — R/W R/W R/W Bit Reserved bits Counter start 0 0 16TCNT0 is halted 1 16TCNT0 is counting (Initial value) Counter start 1 0 16TCNT1 is halted 1 16TCNT1 is counting (Initial value) Counter start 2 0 16TCNT2 is halted 1 16TCNT2 is counting (Initial value) Rev. 2.00 Sep 20, 2005 page 713 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TSNC—Timer Synchro Register H'FFF61 16-bit timer (all channels) 7 6 5 4 3 — — — — — Initial value 1 1 1 1 1 0 0 0 Read/Write — — — — — R/W R/W R/W Bit 2 1 0 SYNC2 SYNC1 SYNC0 Reserved bits Timer sync 0 0 Channel 0 timer counter (16TCNT0) operates independently (16TCNT0 presetting/clearing is independent of other channels) (Initial value) 1 Channel 0 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT0 is possible Timer sync 1 0 Channel 1 timer counter (16TCNT1) operates independently (16TCNT1 presetting/clearing is independent of other channels) (Initial value) 1 Channel 1 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT1 is possible Timer sync 2 0 Channel 2 timer counter (16TCNT2) operates independently (16TCNT2 presetting/clearing is independent of other channels) (Initial value) 1 Channel 2 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT2 is possible Rev. 2.00 Sep 20, 2005 page 714 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TMDR—Timer Mode Register H'FFF62 16-bit timer (all channels) 7 6 5 4 3 2 1 0 — MDF FDIR — — PWM2 PWM1 PWM0 Initial value 1 0 0 1 1 0 0 0 Read/Write — R/W R/W — — R/W R/W R/W Bit PWM mode 0 0 Channel 0 operates normally (Initial value) 1 Channel 0 operates in PWM mode PWM mode 1 0 Channel 1 operates normally (Initial value) 1 Channel 1 operates in PWM mode PWM mode 2 0 Channel 2 operates normally (Initial value) 1 Channel 2 operates in PWM mode Flag direction 0 1 OVF is set to 1 in TISRC when 16TCNT2 overflows or underflows (Initial value) OVF is set to 1 in TISRC when 16TCNT2 overflows Phase counting mode 0 Channel 2 operates normally (Initial value) 1 Channel 2 operates in phase counting mode Rev. 2.00 Sep 20, 2005 page 715 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TOLR—Timer Output Level Setting Register H'FFF63 16-bit timer (all channels) 7 6 5 4 3 2 1 0 — — TOB2 TOA2 TOB1 TOA1 TOB0 TOA0 Initial value 1 1 0 0 0 0 0 0 Read/Write — — W W W W W W Bit Output level setting A0 0 TIOCA0 is 0 1 TIOCA0 is 1 (Initial value) Output level setting B0 0 TIOCB0 is 0 1 TIOCB0 is 1 (Initial value) Output level setting A1 0 TIOCA1 is 0 1 TIOCA1 is 1 (Initial value) Output level setting B1 0 TIOCB1 is 0 1 TIOCB1 is 1 (Initial value) Output level setting A2 0 TIOCA2 is 0 1 TIOCA2 is 1 (Initial value) Output level setting B2 0 TIOCB2 is 0 1 TIOCB2 is 1 Rev. 2.00 Sep 20, 2005 page 716 of 800 REJ09B0260-0200 (Initial value) Appendix B Internal I/O Registers TISRA—Timer Interrupt Status Register A Bit: 7 — 6 H'FFF64 5 4 IMIEA2 IMIEA1 IMIEA0 3 16-bit timer (all channels) 2 — Initial value: 1 0 0 0 1 Read/Write: — R/W R/W R/W — 1 0 IMFA2 IMFA1 IMFA0 0 0 0 R/(W)* R/(W)* R/(W)* Input capture/compare match flag A0 0 [Clearing conditions] Read IMFA0 when IMFA0=1, then write 0 in IMFA0 1 [Setting conditions] • 16TCNT0=GRA0 when GRA0 functions as an output compare register. • 16TCNT0 value is transferred to GRA0 by an input capture signal when GRA0 functions as an input capture register. (Initial value) Input capture/compare match flag A1 0 1 [Clearing conditions] Read IMFA1 when IMFA1=1, then write 0 in IMFA1 (Initial value) [Setting conditions] • 16TCNT1=GRA1 when GRA1 functions as an output compare register. • 16TCNT1 value is transferred to GRA1 by an input capture signal when GRA1 functions as an input capture register. Input capture/compare match flag A2 0 [Clearing conditions] Read IMFA2 when IMFA2=1, then write 0 in IMFA2 (Initial value) 1 [Setting conditions] • 16TCNT2=GRA2 when GRA2 functions as an output compare register. • 16TCNT2 value is transferred to GRA2 by an input capture signal when GRA2 functions as an input capture register. Input capture/compare match interrupt enable A0 0 IMIA0 interrupt requested by IMFA0 flag is disabled 1 IMIA0 interrupt requested by IMFA0 is enabled (Initial value) Input capture/compare match interrupt enable A1 0 IMIA1 interrupt requested by IMFA1 flag is disabled 1 IMIA1 interrupt requested by IMFA1 is enabled (Initial value) Input capture/compare match interrupt enable A2 0 IMIA2 interrupt requested by IMFA2 flag is disabled 1 IMIA2 interrupt requested by IMFA2 is enabled (Initial value) Note: * Only 0 can be written to clear the flag. Rev. 2.00 Sep 20, 2005 page 717 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TISRB—Timer Interrupt Status Register B Bit: 7 — 6 5 H'FFF65 4 IMIEB2 IMIEB1 IMIEB0 3 — Initial value: 1 0 0 0 1 Read/Write: — R/W R/W R/W — 2 16-bit timer (all channels) 1 0 IMFB2 IMFB1 IMFB0 0 0 0 R/(W)* R/(W)* R/(W)* Input capture/compare match flag B0 0 [Clearing condition] Read IMFB0 when IMFB0=1, then write 0 in IMFB0. 1 [Setting conditions] • 16TCNT0=GRB0 when GRB0 functions as an output compare register. • 16TCNT0 value is transferred to GRB0 by an input capture signal when GRB0 functions as an input capture register. (Initial value) Input capture/compare match flag B1 0 [Clearing condition] Read IMFB1 when IMFB1=1, then write 0 in IMFB1. 1 [Setting conditions] • 16TCNT1=GRB1 when GRB1 functions as an output compare register. • 16TCNT1 value is transferred to GRB1 by an input capture signal when GRB1 functions as an input capture register. (Initial value) Input capture/compare match flag B2 0 [Clearing condition] Read IMFB2 when IMFB2=1, then write 0 in IMFB2. 1 [Setting conditions] • 16TCNT2=GRB2 when GRB2 functions as an output compare register. • 16TCNT2 value is transferred to GRB2 by an input capture signal when GRB2 functions as an input capture register. (Initial value) Input capture/compare match interrupt enable B0 0 IMIB0 interrupt requested by IMFB0 flag is disabled 1 IMIB0 interrupt requested by IMFB0 is enabled (Initial value) Input capture/compare match interrupt enable B1 0 IMIB1 interrupt requested by IMFB1 flag is disabled 1 IMIB1 interrupt requested by IMFB1 is enabled (Initial value) Input capture/compare match interrupt enable B2 0 IMIB2 interrupt requested by IMFB2 flag is disabled 1 IMIB2 interrupt requested by IMFB2 is enabled Note: * Only 0 can be written to clear the flag. Rev. 2.00 Sep 20, 2005 page 718 of 800 REJ09B0260-0200 (Initial value) Appendix B Internal I/O Registers TISRC—Timer Interrupt Status Register C Bit: 7 — H'FFF66 6 5 4 OVIE2 OVIE1 OVIE0 16-bit timer (all channels) 3 2 — Initial value: 1 0 0 0 1 Read/Write: — R/W R/W R/W — 1 0 OVF2 OVF1 OVF0 0 0 0 R/(W)* R/(W)* R/(W)* Overflow flag 0 0 [Clearing condition] (Initial value) Read OVF0 when OVF0 = 1, then write 0 in OVF0. 1 [Setting condition] 16TCNT0 overflowed from H'FFFF to H'0000. Overflow flag 1 0 (Initial value) [Clearing condition] Read OVF1 when OVF1 = 1, then write 0 in OVF1. 1 [Setting condition] 16TCNT1 overflowed from H'FFFF to H'0000. Overflow flag 2 0 1 [Setting condition] 16TCNT2 overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF. Overflow interrupt enable 0 OVI0 interrupt requested by OVF0 flag is disabled 0 1 (Initial value) OVI1 interrupt requested by OVF1 flag is enabled Overflow interrupt enable 2 OVI2 interrupt requested by OVF2 flag is disabled 0 1 (Initial value) OVI0 interrupt requested by OVF0 flag is enabled Overflow interrupt enable 1 OVI1 interrupt requested by OVF1 flag is disabled 0 1 (Initial value) [Clearing condition] Read OVF2 when OVF2 = 1, then write 0 in OVF2. (Initial value) OVI2 interrupt requested by OVF2 flag is enabled Note: * Only 0 can be written to clear the flag. Rev. 2.00 Sep 20, 2005 page 719 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers 16TCR0—Timer Control Register 0 16-bit timer channel 0 7 6 5 4 3 2 1 0 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 1 — 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Bit Initial value Read/Write H'FFF68 Timer prescaler 2 to 0 Bit 2 Bit 1 Bit 0 TPSC2 TPSC1 TPSC0 0 0 1 0 0 1 1 0 0 1 1 0 1 1 Description Internal clock: φ (Initial value) Internal clock: φ/2 Internal clock: φ/4 Internal clock: φ/8 External clock A: TCLKA input External clock B: TCLKB input External clock C: TCLKC input External clock D: TCLKD input Clock edge 1 and 0 Bit 4 CKEG 0 0 1 Bit 3 CKEG0 0 1 — Description Rising edges counted Falling edges counted Both edges counted (Initial value) Counter clear 1 and 0 Bit 6 CCLR1 0 1 Bit 5 CCLR0 0 1 0 1 Description (Initial value) 16TCNT is not cleared 16TCNT is cleared by GRA compare match or input capture 16TCNT is cleared by GRB compare match or input capture Synchronous clear: 16TCNT is cleared in synchronization with other synchronized timers Rev. 2.00 Sep 20, 2005 page 720 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TIOR0—Timer I/O Control Register 0 Bit: H'FFF69 16-bit timer channel 0 7 6 5 4 3 2 1 0 IOA0 — IOB2 IOB1 IOB0 — IOA2 IOA1 Initial value: 1 0 0 0 1 0 0 0 Read/Write: — R/W R/W R/W — R/W R/W R/W I/O control A2 to A0 Bit 2 Bit 1 IOA2 IOA1 0 0 1 Bit 0 IOA0 0 1 0 Description GRA is an output compare register 0 1 0 1 1 1 (Initial value) 0 output at GRA compare match 1 output at GRA compare match Output toggles at GRA compare match (1 output on channel 2) 1 0 No output at compare match GRA is an input capture register GRA captures rising edges of input GRA captures falling edges of input GRB captures both edges of input I/O control B2 to B0 Bit 6 IOB2 Bit 5 IOB1 0 0 1 0 1 1 Bit 4 IOB0 0 1 0 Description GRB is an output compare register (Initial value) 0 output at GRB compare match 1 output at GRB compare match Output toggles at GRB compare match (1 output on channel 2) 1 0 1 0 1 No output at compare match GRB is an input capture register GRB captures rising edges of input GRB captures falling edges of input GRB captures both edges of input Rev. 2.00 Sep 20, 2005 page 721 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers 16TCNT0 H/L—Timer Counter 0 H/L Bit Initial value Read/Write 15 14 13 12 11 H'FFF6A, H'FFF6B 10 9 8 7 6 5 16-bit timer channel 0 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up-counter GRA0 H/L—General Register A0 H/L Bit Initial value Read/Write 15 14 13 12 11 H'FFF6C, H'FFF6D 10 9 8 7 6 5 16-bit timer channel 0 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register GRB0 H/L—General Register B0 H/L Bit Initial value Read/Write 15 14 13 12 11 H'FFF6E, H'FFF6F 10 9 8 7 6 5 16-bit timer channel 0 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register 16TCR1 Timer Control Register 1 Bit 7 — 6 H'FFF70 5 4 16-bit timer channel 1 3 2 1 0 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 Initial value 1 0 0 0 0 0 0 0 Read/Write — R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. Rev. 2.00 Sep 20, 2005 page 722 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers TIOR1—Timer I/O Control Register 1 H'FFF71 16-bit timer channel 1 7 6 5 4 3 2 1 0 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 Initial value 1 0 0 0 1 0 0 0 Read/Write — R/W R/W R/W — R/W R/W R/W Bit Note: Bit functions are the same as for 16-bit timer channel 0. 16TCNT1 H/L—Timer Counter 1 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF72, H'FFF73 9 8 7 6 5 16-bit timer channel 1 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. GRA1 H/L—General Register A1 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF74, H'FFF75 9 8 7 6 5 16-bit timer channel 1 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. GRB1 H/L—General Register B1 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF76, H'FFF77 9 8 7 6 5 16-bit timer channel 1 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. Rev. 2.00 Sep 20, 2005 page 723 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers 16TCR2 Timer Control Register 2 Bit 7 — H'FFF78 6 5 4 16-bit timer channel 2 3 2 0 1 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 Initial value 1 0 0 0 0 0 0 0 Read/Write — R/W R/W R/W R/W R/W R/W R/W Notes: 1. Bit functions are the same as for 16-bit timer channel 0. 2. When phase counting mode is selected in channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2 to TPSC0 in 16TCR2 are ignored. TIOR2—Timer I/O Control Register 2 H'FFF79 16-bit timer channel 2 7 6 5 4 3 2 1 0 — IOB2 IOB1 IOB0 — IOA2 IOA1 IOA0 Initial value 1 0 0 0 1 0 0 0 Read/Write — R/W R/W R/W — R/W R/W R/W Bit Note: Bit functions are the same as for 16-bit timer channel 0. 16TCNT2 H/L—Timer Counter 2 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF7A, H'FFF7B 9 8 7 6 5 16-bit timer channel 2 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Phase counting mode : Other mode : Rev. 2.00 Sep 20, 2005 page 724 of 800 REJ09B0260-0200 up/down counter up-counter Appendix B Internal I/O Registers GRA2 H/L—General Register A2 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF7C, H'FFF7D 9 8 7 6 5 16-bit timer channel 2 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. GRB2 H/L—General Register B2 H/L Bit Initial value Read/Write 15 14 13 12 11 10 H'FFF7E, H'FFF7F 9 8 7 6 5 16-bit timer channel 2 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Note: Bit functions are the same as for 16-bit timer channel 0. Rev. 2.00 Sep 20, 2005 page 725 of 800 REJ09B0260-0200 Appendix B Internal I/O Registers 8TCR0—Timer Control Register 0 8TCR1—Timer Control Register 1 Bit Initial value Read/Write H'FFF80 H'FFF81 8-bit timer channel 0 8-bit timer channel 1 7 6 5 4 3 2 1 0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 0 R/