TI LMV324QDR Low-voltage rail-to-rail output operational amplifier Datasheet

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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
FEATURES
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
1
•
•
•
•
•
•
•
2.7-V and 5-V Performance
–40°C to 125°C Operation
Low-Power Shutdown Mode (LMV324S)
No Crossover Distortion
Low Supply Current
– LMV321 . . . 130 μA Typ
– LMV358 . . . 210 μA Typ
– LMV324 . . . 410 μA Typ
– LMV324S . . . 410 μA Typ
Rail-to-Rail Output Swing
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/
ORDERING INFORMATION
The LMV321, LMV358, and LMV324/LMV324S are
single, dual, and quad low-voltage (2.7 V to 5.5 V)
operational amplifiers with rail-to-rail output swing.
The LMV324S, which is a variation of the standard
LMV324, includes a power-saving shutdown feature
that reduces supply current to a maximum of 5 μA
per channel when the amplifiers are not needed.
Channels 1 and 2 together are put in shutdown, as
are channels 3 and 4. While in shutdown, the outputs
actively are pulled low.
The LMV321, LMV358, LMV324, and LMV324S are
the most cost-effective solutions for applications
where low-voltage operation, space saving, and low
cost are needed. These amplifiers are designed
specifically for low-voltage (2.7 V to 5 V) operation,
with performance specifications meeting or exceeding
the LM358 and LM324 devices that operate from 5 V
to 30 V. Additional features of the LMV3xx devices
are a common-mode input voltage range that
includes ground, 1-MHz unity-gain bandwidth, and
1-V/μs slew rate.
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
VCC+
2IN+
2IN–
2OUT
1
14
2
13
3
12
4
11
5
10
6
9
7
8
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
VCC
2IN+
2IN–
2OUT
1/2 SHDN
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
3/4 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
GND
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN–
2IN+
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1IN+
1
GND
2
1IN–
3
5
VCC+
4
OUT
The LMV321 is available in the ultra-small DCK
(SC-70) package, which is approximately one-half the
size of the DBV (SOT-23) package. This package
saves space on printed circuit boards and enables
the design of small portable electronic devices. It also
allows the designer to place the device closer to the
signal source to reduce noise pickup and increase
signal integrity.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
ORDERING INFORMATION (1)
PACKAGE (2)
TA
SC-70 – DCK
Single
SOT-23 – DBV
MSOP/VSSOP – DGK
Dual
–40°C to 85°C
SOIC – D
TSSOP – PW
VSSOP – DDU
SOIC – D
Quad
TSSOP – PW
MSOP/VSSOP – DGK
Dual
SOIC – D
TSSOP – PW
–40°C to 125°C
VSSOP – DDU
SOIC – D
Quad
TSSOP – PW
(1)
(2)
(3)
2
TOP-SIDE
MARKING (3)
ORDERABLE PART NUMBER
Reel of 3000
LMV321IDCKR
Reel of 250
LMV321IDCKT
Reel of 3000
LMV321IDBVR
Reel of 250
LMV321IDBVT
Reel of 2500
LMV358IDGKR
R5_
Reel of 250
LMV358IDGKT
PREVIEW
Tube of 75
LMV358ID
Reel of 2500
LMV358IDR
Tube of 150
LMV358IPW
Reel of 2000
LMV358IPWR
Reel of 3000
LMV358IDDUR
Tube of 50
LMV324ID
Reel of 2500
LMV324IDR
Tube of 50
LMV324SID
Reel of 2500
LMV324SIDR
Reel of 2000
LMV324IPWR
MV324I
Reel of 2000
LMV324SIPWR
MV324SI
Reel of 2500
LMV358QDGKR
Reel of 250
LMV358QDGKT
Tube of 75
LMV358QD
Reel of 2500
LMV358QDR
Tube of 150
LMV358QPW
Reel of 2000
LMV358QPWR
Reel of 3000
LMV358QDDUR
Tube of 50
LMV324QD
Reel of 2500
LMV324QDR
Tube of 90
LMV324QPW
Reel of 2000
LMV324QPWR
R3_
RC1_
MV358I
MV358I
RA5_
LMV324I
LMV324SI
RH_
MV358Q
MV358Q
RAH_
LMV324Q
MV324Q
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBV/DCK/DDU/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Copyright © 1999–2007, Texas Instruments Incorporated
www.ti.com
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
SYMBOL (EACH AMPLIFIER)
IN–
–
OUT
IN+
+
LMV324 SIMPLIFIED SCHEMATIC
VCC
VBIAS1
VCC
+
–
VBIAS2
+
Output
–
VCC VCC
VBIAS3
+
ININ+
VBIAS4–
+
–
Copyright © 1999–2007, Texas Instruments Incorporated
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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
Supply voltage (2)
VID
Differential input voltage (3)
VI
Input voltage range (either input)
Duration of output short circuit (one amplifier) to ground
–0.2
(4)
At or below TA = 25°C,
VCC ≤ 5.5 V
D package
θJA
Package thermal impedance (5) (6)
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
UNIT
5.5
V
±5.5
V
5.5
V
Unlimited
8 pin
97
14 pin
86
16 pin
73
DBV package
5 pin
206
DCK package
5 pin
252
DDU package
8 pin
TBD
DGK package
8 pin
172
8 pin
149
14 pin
113
16 pin
108
PW package
TJ
MAX
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage (single-supply operation)
VIH
Amplifier turn-on voltage level (LMV324S) (2)
VIL
Amplifier turn-off voltage level (LMV324S)
TA
Operating free-air temperature
(1)
(2)
4
MIN
MAX
2.7
5.5
VCC = 2.7 V
1.7
VCC = 5 V
3.5
UNIT
V
V
VCC = 2.7 V
0.7
VCC = 5 V
1.5
I temperature
–40
85
Q temperature
–40
125
V
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
VIH should not be allowed to exceed VCC.
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
Electrical Characteristics
VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
1.7
7
UNIT
VIO
Input offset voltage
αVIO
Average temperature coefficient of
input offset voltage
IIB
Input bias current
IIO
Input offset current
CMRR
Common-mode rejection ratio
VCM = 0 to 1.7 V
50
63
dB
kSVR
Supply-voltage rejection ratio
VCC = 2.7 V to 5 V, VO = 1 V
50
60
dB
0
–0.2
Common-mode input voltage
range
CMRR ≥ 50 dB
VO
Output swing
RL = 10 kΩ to 1.35 V
Supply current
B1
Unity-gain bandwidth
Φm
Gm
Vn
Equivalent input noise voltage
In
Equivalent input noise current
(1)
11
250
nA
5
50
nA
1.9
High level
VCC – 100
1.7
VCC – 10
Low level
60
180
80
170
LMV358I (both amplifiers)
140
340
LMV324I/LMV324SI (all four amplifiers)
260
680
LMV321I
ICC
μV/°C
5
VICR
CL = 200 pF
mV
V
mV
μA
1
MHz
Phase margin
60
deg
Gain margin
10
dB
f = 1 kHz
46
nV/√Hz
f = 1 kHz
0.17
pA/√Hz
Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Shutdown Characteristics (LMV324S)
VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
ICC(SHDN)
Supply current in shutdown mode
(per channel)
SHDN ≤ 0.6 V
t(on)
Amplifier turn-on time
AV = 1, RL = Open (measured at 50% point)
2
μs
t(off)
Amplifier turn-off time
AV = 1, RL = Open (measured at 50% point)
40
ns
(1)
5
μA
Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Copyright © 1999–2007, Texas Instruments Incorporated
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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
Electrical Characteristics
VCC+ = 5 V, at specified free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA (1)
MIN
25°C
TYP (2)
MAX
1.7
7
UNIT
VIO
Input offset voltage
αVIO
Average temperature
coefficient of input offset
voltage
IIB
Input bias current
IIO
Input offset current
CMRR
Common-mode rejection
ratio
VCM = 0 to 4 V
25°C
50
65
dB
kSVR
Supply-voltage
rejection ratio
VCC = 2.7 V to 5 V, VO = 1 V,
VCM = 1 V
25°C
50
60
dB
VICR
Common-mode input
voltage range
CMRR ≥ 50 dB
25°C
0
–0.2
Full range
Output swing
High level
RL = 10 kΩ to 2.5 V
Low level
IOS
Output short-circuit
current
RL = 2 kΩ
Sourcing, VO = 0 V
Sinking, VO = 5 V
LMV321I
ICC
Supply current
LMV358I (both amplifiers)
LMV324I/LMV324SI
(all four amplifiers)
B1
Unity-gain bandwidth
Φm
25°C
15
5
VCC – 300
Full range
VCC – 400
25°C
120
VCC – 100
Full range
VCC – 200
25°C
VCC – 10
65
Full range
mV
180
280
25°C
15
Full range
10
100
5
60
10
160
130
Full range
V/mV
mA
250
350
210
Full range
25°C
V
300
400
25°C
25°C
4
nA
VCC – 40
Full range
25°C
50
nA
440
615
410
Full range
μA
830
1160
25°C
1
MHz
Phase margin
25°C
60
deg
Gm
Gain margin
25°C
10
dB
Vn
Equivalent input
noise voltage
f = 1 kHz
25°C
39
nV/√Hz
In
Equivalent input
noise current
f = 1 kHz
25°C
0.21
pA/√Hz
SR
Slew rate
25°C
1
(1)
(2)
6
CL = 200 pF
25°C
25°C
250
150
4.2
mV
μV/°C
500
25°C
Low level
AVD
5
Full range
RL = 2 kΩ to 2.5 V
Large-signal differential
voltage gain
25°C
Full range
High level
VO
9
V/μs
Full range TA = –40°C to 85°C for I temperature and –40°C to 125°C for Q temperature.
Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
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Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
Shutdown Characteristics (LMV324S)
VCC+ = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
ICC(SHDN)
Supply current in shutdown mode
(per channel)
SHDN ≤ 0.6 V, TA = –40°C to 85°C
t(on)
Amplifier turn-on time
AV = 1, RL = Open (measured at 50% point)
2
μs
t(off)
Amplifier turn-off time
AV = 1, RL = Open (measured at 50% point)
40
ns
(1)
5
μA
Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the
application and configuration and may vary over time. Typical values are not ensured on production material.
Copyright © 1999–2007, Texas Instruments Incorporated
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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS
LMV321 FREQUENCY RESPONSE
vs
RESISTIVE LOAD
LMV321 FREQUENCY RESPONSE
vs
RESISTIVE LOAD
Vs = 2.7 V
RL = 100 kΩ, 2 kΩ, 600 Ω
70
Phase
60
Gain − dB
40
70
90
60
75
60
2 kΩ
100 kΩ
30
105
45
Gain
20
30
600 Ω
10
100 kΩ
−10
1k
10 k
100 k
Frequency − Hz
90
600 Ω
Phase
50
75
2 kΩ
60
40
100 kΩ
30
45
Gain
20
15
1M
0
0
−15
10 M
−10
1k
10 k
Figure 2.
70
100
100
Phase
Phase
0 pF
80
80
60
60
50
0 pF
60
50
100 pF
−20
Vs = 5.0 V
RL = 600 Ω
CL = 0 pF
100 pF
500 pF
1000 pF
−30
10 k
−20
100 pF
0 pF
1000 pF
100 k
1M
Frequency − Hz
Figure 3.
8
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−40
500 pF
−60
−80
−100
10 M
Gain − dB
Gain − dB
Gain
40
40
30
500 pF
Gain
20
20
0
10
−20
Vs = 5.0 V
RL = 100 kΩ
−10 CL = 0 pF
100 pF
−20
500 pF
1000 pF
−30
10 k
100 k
0
−40
0 pF
100 pF
500 pF
Phase Margin − Deg
0
20
−10
20
Phase Margin − Deg
500 pF
1000 pF
100 pF
1000 pF
40
40
0
−15
10 M
100 k
1M
Frequency − Hz
LMV321 FREQUENCY RESPONSE
vs
CAPACITIVE LOAD
70
60
0
600 Ω
Figure 1.
10
30
100 kΩ
10
15
LMV321 FREQUENCY RESPONSE
vs
CAPACITIVE LOAD
30
105
2 kΩ
2 kΩ
0
120
Vs = 5.0 V
RL = 100 kΩ, 2 kΩ, 600 Ω
Phase Margin − Deg
600 Ω
80
Phase Margin − Deg
50
120
Gain − dB
80
−60
−80
1000 pF
1M
Frequency − Hz
−100
10 M
Figure 4.
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
STABILITY
vs
CAPACITIVE LOAD
LMV321 FREQUENCY RESPONSE
vs
TEMPERATURE
120
80
Vs = 5.0 V
RL = 2 kΩ
60
75
25°C
60
40
−40°C
45
Gain
20
30
85°C
25°C
10
−10
1k
10 k
100
VCC = ±2.5 V
AV = +1
RL = 2 kΩ
VO = 100 mVPP
10
−2
−15
10 M
100 k
1M
Frequency − Hz
−1.5
−1
10000
2.5 V
_
RL
CL
Capacitive Load − nF
Capacitive Load − pF
VO
+
2.5 V
LMV324S
(25% Overshoot)
100
VCC = ±2.5 V
RL = 2 kΩ
AV = 10
VO = 100 mVPP
1
1.5
−1
−0.5
0
Output Voltage − V
0.5
Figure 7.
Copyright © 1999–2007, Texas Instruments Incorporated
1
LMV324S
(25% Overshoot)
1000
LMV3xx
(25% Overshoot)
100
134 kΩ
1.21 MΩ
+2.5 V
VCC = ±2.5 V
AV = +1
RL = 1 MΩ
VO = 100 mVPP
LMV3xx
(25% Overshoot)
−1.5
0.5
STABILITY
vs
CAPACITIVE LOAD
10000
10
−2.0
0
Figure 6.
STABILITY
vs
CAPACITIVE LOAD
1000
−0.5
Output Voltage − V
Figure 5.
VI
CL
LMV3xx
(25% Overshoot)
0
−40°C
VO
RL
−2.5 V
1000
15
0
_
+
VI
Phase Margin − Deg
Phase
30
2.5 V
LMV324S
(25% Overshoot)
90
85°C
50
Gain − dB
105
Capacitive Load − pF
70
10000
_
VI
VO
+
RL
CL
−2.5 V
1.5
10
−2.0
−1.5
−1
−0.5
0
Output Voltage − V
0.5
1
1.5
Figure 8.
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LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
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SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
STABILITY
vs
CAPACITIVE LOAD
SLEW RATE
vs
SUPPLY VOLTAGE
10000
1.500
RL = 100 kΩ
1.400
LMV3xx
(25% Overshoot)
1.300
Slew Rate − V/µs
Capacitive Load − nF
VCC = ±2.5 V
RL = 1 MΩ
AV = 10
VO = 100 mVPP
1000
LMV324S
(25% Overshoot)
100
134 kΩ
1.21 MΩ
Gain
1.200
NSLEW
1.100
1.000
LMV3xx
PSLEW
0.900
0.800
+2.5 V
NSLEW
_
VI
VO
+
RL
0.700
CL
−2.5 V
10
−2.0
−1.5
−1
LMV324S
0.600
PSLEW
−0.5
0
0.5
1
0.500
2.5
1.5
Output Voltage − V
3.0
4.0
4.5
5.0
V CC − Supply Voltage − V
Figure 10.
Figure 9.
SUPPLY CURRENT
vs
SUPPLY VOLTAGE − QUAD AMPLIFIER
INPUT CURRENT
vs
TEMPERATURE
700
−10
VCC = 5 V
VI = VCC/2
LMV3xx
600
LMV324S
−20
TA = 85°C
500
Input Current − nA
Supply Current − µA
3.5
TA = 25°C
400
300
TA = −40°C
200
−30
LMV3xx
−40
−50
100
LMV324S
0
0
1
2
3
4
VCC − Supply Voltage − V
Figure 11.
10
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5
6
−60
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80
TA − °C
Figure 12.
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
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SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
SOURCE CURRENT
vs
OUTPUT VOLTAGE
SOURCE CURRENT
vs
OUTPUT VOLTAGE
100
100
VCC = 2.7 V
VCC = 5 V
10
Sourcing Current − mA
Sourcing Current − mA
10
LMV3xx
1
LMV324S
0.1
1
LMV324S
0.1
0.01
0.01
0.001
0.001
LMV3xx
0.01
0.1
1
0.001
0.001
10
0.01
Output Voltage Referenced to VCC+ − V
Figure 13.
10
Figure 14.
100
100
VCC = 5 V
VCC = 2.7 V
10
10
LMV324S
Sinking Current − mA
Sinking Current − mA
1
SINKING CURRENT
vs
OUTPUT VOLTAGE
SINKING CURRENT
vs
OUTPUT VOLTAGE
1
LMV3xx
0.1
LMV324S
1
LMV324
0.1
0.01
0.01
0.001
0.001
0.1
Output Voltage Referenced to VCC+ − V
0.01
0.1
1
Output Voltage Referenced to GND − V
Figure 15.
Copyright © 1999–2007, Texas Instruments Incorporated
10
0.001
0.001
0.01
0.1
1
10
Output Voltage Referenced to GND − V
Figure 16.
Submit Documentation Feedback
11
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
120
300
LMV324S
VCC = 5 V
270
Sinking Current − mA
LMV324S
VCC = 5 V
210
Sourcing Current − mA
100
240
LMV3xx
VCC = 5 V
180
150
120
LMV3xx
VCC = 2.7 V
90
60
LMV324S
VCC = 2.7 V
80
LMV3xx
VCC = 5 V
60
LMV3xx
VCC = 2.7 V
40
LMV324S
VCC = 2.7 V
20
30
0
−40 −30 −20 −10 0
0
10 20 30 40 50 60 70 80 90
TA − °C
−40 −30 −20−10 0
TA − °C
Figure 17.
Figure 18.
−kSVR
vs
FREQUENCY
+kSVR
vs
FREQUENCY
80
90
LMV324S
VCC = −5 V
RL = 10 kΩ
70
LMV324S
VCC = 5 V
RL = 10 kΩ
80
70
60
LMV3xx
LMV3xx
60
50
+k SVR − dB
−kSVR − dB
10 20 30 40 50 60 70 80 90
40
30
50
40
30
20
20
10
0
100
10
0
1k
10k
Frequency − Hz
Figure 19.
12
Submit Documentation Feedback
100k
1M
100
1k
10k
100k
1M
Frequency − Hz
Figure 20.
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
−kSVR
vs
FREQUENCY
+kSVR
vs
FREQUENCY
80
80
VCC = −2.7 V
RL = 10 kΩ
LMV324S
70
70
LMV3xx
+k SVR − dB
50
40
30
50
30
20
10
10
100
1k
10k
100k
0
100
1M
LMV3xx
40
20
0
1k
Frequency − Hz
10k
OUTPUT VOLTAGE
vs
FREQUENCY
6
70
RL = 10 kΩ
THD > 5%
AV = 3
RL = 10 kΩ
60
Peak Output Voltage − V OPP
5
LMV3xx
LMV324S
Negative Swing
1M
Figure 22.
OUTPUT VOLTAGE SWING FROM RAILS
vs
SUPPLY VOLTAGE
50
100k
Frequency − Hz
Figure 21.
Output Voltage Swing − mV
VCC = 2.7 V
RL = 10 kΩ
60
60
−kSVR − dB
LMV324S
40
30
20
Positive Swing
LMV3xx
VCC = 5 V
4
LMV324S
VCC = 5 V
3
LMV3xx
VCC = 2.7 V
2
LMV324S
VCC = 2.7 V
1
10
0
0
2.5
3.0
3.5
4.0
VCC − Supply Voltage − V
Figure 23.
Copyright © 1999–2007, Texas Instruments Incorporated
4.5
5.0
1k
10k
100k
1M
10M
Frequency − Hz
Figure 24.
Submit Documentation Feedback
13
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
CROSSTALK REJECTION
vs
FREQUENCY
OPEN-LOOP OUTPUT IMPEDANCE
vs
FREQUENCY
150
110
LMV3xx
VCC = 5 V
Impedance − Ω
90
80
70
LMV324S
VCC = 2.7 V
60
50
LMV324S
VCC = 5 V
40
VCC = 5 V
RL = 5 kΩ
AV = 1
VO = 3 VPP
140
Crosstalk Rejection − dB
100
LMV3xx
VCC = 2.7 V
130
120
110
100
30
20
1
1M
2M
3M
90
100
4M
1k
10k
Frequency − Hz
Frequency − Hz
Figure 25.
Figure 26.
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
LMV3xx
LMV3xx
1 V/Div
1 V/Div
Input
LMV324S
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = 85°C
VCC = ±2.5 V
RL = 2 kΩ
T = 25°C
1 µs/Div
Figure 27.
14
100k
Submit Documentation Feedback
1 µs/Div
Figure 28.
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
NONINVERTING LARGE-SIGNAL
PULSE RESPONSE
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV324S
50 mV/Div
1 V/Div
LMV3xx
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = −40°C
VCC = ±2.5 V
RL = 2 kΩ
TA = 25°C
1 µs/Div
1 µs/Div
Figure 29.
Figure 30.
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
NONINVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
50 mV/Div
50 mV/Div
LMV3xx
LMV3xx
LMV324S
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = 85°C
VCC = ±2.5 V
RL = 2 kΩ
TA = −40°C
1 µs/Div
Figure 31.
Copyright © 1999–2007, Texas Instruments Incorporated
1 µs/Div
Figure 32.
Submit Documentation Feedback
15
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
INVERTING LARGE-SIGNAL
PULSE RESPONSE
INVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
1 V/Div
1 V/Div
LMV3xx
LMV324S
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = 25°C
VCC = ±2.5 V
RL = 2 kΩ
TA = 85°C
1 µs/Div
1 µs/Div
Figure 33.
Figure 34.
INVERTING SMALL-SIGNAL
PULSE RESPONSE
INVERTING LARGE-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
1 V/Div
50 mV/Div
LMV3xx
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = −40°C
16
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = 25°C
1 µs/Div
1 µs/Div
Figure 35.
Figure 36.
Submit Documentation Feedback
Copyright © 1999–2007, Texas Instruments Incorporated
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
INVERTING SMALL-SIGNAL
PULSE RESPONSE
Input
Input
LMV3xx
LMV3xx
50 mV/Div
50 mV/Div
INVERTING SMALL-SIGNAL
PULSE RESPONSE
LMV324S
LMV324S
VCC = ±2.5 V
RL = 2 kΩ
TA = −40°C
VCC = ±2.5 V
RL = 2 kΩ
TA = 85°C
1 µs/Div
1 µs/Div
Figure 37.
Figure 38.
INPUT CURRENT NOISE
vs
FREQUENCY
INPUT CURRENT NOISE
vs
FREQUENCY
0.50
0.80
0.60
0.40
0.20
VCC = 5 V
0.45
Input Current Noise − pA/ Hz
Input Current Noise − pA/ Hz
VCC = 2.7 V
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.00
10
100
1k
Frequency − Hz
Figure 39.
Copyright © 1999–2007, Texas Instruments Incorporated
10k
10
100
1k
10k
Frequency − Hz
Figure 40.
Submit Documentation Feedback
17
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
THD + N
vs
FREQUENCY
INPUT VOLTAGE NOISE
vs
FREQUENCY
10.000
200
160
1.000
140
THD − %
Input Voltage Noise − nV/ Hz
180
VCC = 2.7 V
RL = 10 kΩ
AV = 1
VO = 1 VPP
120
100
LMV3xx
0.100
80
VCC = 2.7 V
60
0.010
LMV324S
40
VCC = 5 V
0.001
20
10
100
1k
10
10k
100
Frequency − Hz
Figure 41.
10000
100000
Figure 42.
THD + N
vs
FREQUENCY
THD + N
vs
FREQUENCY
10.000
10.000
VCC = 2.7 V
RL = 10 kΩ
AV = 10
VO = 1 VPP
1.000
1000
Frequency − Hz
1.000
VCC = 5 V
RL = 10 kΩ
AV = 1
VO = 1 VPP
THD − %
THD − %
LMV324S
0.100
0.100
LMV324S
LMV3xx
0.010
0.010
LMV3xx
0.001
0.001
10
100
1000
Frequency − Hz
Figure 43.
18
Submit Documentation Feedback
10000
100000
10
100
1000
10000
100000
Frequency − Hz
Figure 44.
Copyright © 1999–2007, Texas Instruments Incorporated
www.ti.com
LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
SLOS263T – AUGUST 1999 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
THD + N
vs
FREQUENCY
10.000
VCC = 5 V
RL = 10 kΩ
AV = 10
VO = 2.5 VPP
1.000
THD − %
LMV324S
0.100
0.010
LMV3xx
0.001
10
100
1000
10000
100000
Frequency − Hz
Figure 45.
Copyright © 1999–2007, Texas Instruments Incorporated
Submit Documentation Feedback
19
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV321IDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV321IDCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324ID
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324IDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324IDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324IPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324IPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QD
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324QPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV324SID
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIDE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIDRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIPWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV324SIPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358ID
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDDUR
ACTIVE
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDDURE4
ACTIVE
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDDURG4
ACTIVE
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358IPWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
75
Addendum-Page 2
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LMV358QD
ACTIVE
SOIC
D
8
LMV358QDDUR
ACTIVE
VSSOP
DDU
LMV358QDDURE4
ACTIVE
VSSOP
LMV358QDDURG4
ACTIVE
LMV358QDE4
75
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
VSSOP
DDU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LMV358QPWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV321, LMV324, LMV358 :
• Automotive: LMV321-Q1, LMV324-Q1, LMV358-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
LMV321IDBVR
SOT-23
DBV
5
3000
180.0
LMV321IDBVR
SOT-23
DBV
5
3000
LMV321IDBVT
SOT-23
DBV
5
250
LMV321IDBVT
SOT-23
DBV
5
LMV321IDCKR
SC70
DCK
LMV321IDCKR
SC70
LMV321IDCKT
SC70
LMV321IDCKT
SC70
W
Pin1
(mm) Quadrant
9.2
3.23
3.17
1.37
4.0
8.0
Q3
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
180.0
9.2
3.23
3.17
1.37
4.0
8.0
Q3
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DCK
5
3000
180.0
9.2
2.24
2.34
1.22
4.0
8.0
Q3
DCK
5
250
180.0
9.2
2.24
2.34
1.22
4.0
8.0
Q3
DCK
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
LMV324IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LMV324IPWR
TSSOP
PW
14
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
LMV324QDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LMV324QPWR
TSSOP
PW
14
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
LMV324SIDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
LMV324SIPWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
LMV358IDDUR
VSSOP
DDU
8
3000
180.0
9.2
2.25
3.35
1.05
4.0
8.0
Q3
LMV358IDGKR
MSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV358IDGKR
MSOP
DGK
8
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
LMV358IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LMV358IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV358IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LMV358QDDUR
VSSOP
DDU
8
3000
180.0
9.2
2.25
3.35
1.05
4.0
8.0
Q3
LMV358QDGKR
MSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV358QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV358QPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV321IDBVR
SOT-23
DBV
5
3000
205.0
200.0
33.0
LMV321IDBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
LMV321IDBVT
SOT-23
DBV
5
250
205.0
200.0
33.0
LMV321IDBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
LMV321IDCKR
SC70
DCK
5
3000
180.0
180.0
18.0
LMV321IDCKR
SC70
DCK
5
3000
205.0
200.0
33.0
LMV321IDCKT
SC70
DCK
5
250
205.0
200.0
33.0
LMV321IDCKT
SC70
DCK
5
250
180.0
180.0
18.0
LMV324IDR
SOIC
D
14
2500
346.0
346.0
33.0
LMV324IPWR
TSSOP
PW
14
2000
346.0
346.0
29.0
LMV324QDR
SOIC
D
14
2500
346.0
346.0
33.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV324QPWR
TSSOP
PW
14
2000
346.0
346.0
29.0
LMV324SIDR
SOIC
D
16
2500
333.2
345.9
28.6
LMV324SIPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
LMV358IDDUR
VSSOP
DDU
8
3000
202.0
201.0
28.0
LMV358IDGKR
MSOP
DGK
8
2500
358.0
335.0
35.0
LMV358IDGKR
MSOP
DGK
8
2500
370.0
355.0
55.0
LMV358IDR
SOIC
D
8
2500
340.5
338.1
20.6
LMV358IDR
SOIC
D
8
2500
346.0
346.0
29.0
LMV358IPWR
TSSOP
PW
8
2000
346.0
346.0
29.0
LMV358QDDUR
VSSOP
DDU
8
3000
202.0
201.0
28.0
LMV358QDGKR
MSOP
DGK
8
2500
358.0
335.0
35.0
LMV358QDR
SOIC
D
8
2500
340.5
338.1
20.6
LMV358QPWR
TSSOP
PW
8
2000
346.0
346.0
29.0
Pack Materials-Page 3
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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