LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 LM117/LM317A/LM317-N 3-Terminal Adjustable Regulator Check for Samples: LM117, LM317-N FEATURES 1 • 2 • • • • • • • • Specified 1% Output Voltage Tolerance (LM317A) Specified Max. 0.01%/V Line Regulation (LM317A) Specified Max. 0.3% Load Regulation (LM117) Specified 1.5A Output Current Adjustable Output Down to 1.2V Current Limit Constant With Temperature P+ Product Enhancement Tested 80 dB Ripple Rejection Output is Short-Circuit Protected DESCRIPTION The LM117 series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 1.5A over a 1.2V to 37V output range. They are exceptionally easy to use and require only two external resistors to set the output voltage. Further, both line and load regulation are better than standard fixed regulators. Also, the LM117 is packaged in standard transistor packages which are easily mounted and handled. In addition to higher performance than fixed regulators, the LM117 series offers full overload protection available only in IC's. Included on the chip are current limit, thermal overload protection and safe area protection. All overload protection circuitry remains fully functional even if the adjustment terminal is disconnected. Normally, no capacitors are needed unless the device is situated more than 6 inches from the input filter capacitors in which case an input bypass is needed. An optional output capacitor can be added to improve transient response. The adjustment terminal can be bypassed to achieve very high ripple rejection ratios which are difficult to achieve with standard 3-terminal regulators. Besides replacing fixed regulators, the LM117 is useful in a wide variety of other applications. Since the regulator is “floating” and sees only the input-tooutput differential voltage, supplies of several hundred volts can be regulated as long as the maximum input to output differential is not exceeded, i.e., avoid short-circuiting the output. Also, it makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment pin and output, the LM117 can be used as a precision current regulator. Supplies with electronic shutdown can be achieved by clamping the adjustment terminal to ground which programs the output to 1.2V where most loads draw little current. For applications requiring greater output current, see LM150 series (3A) and LM138 series (5A) data sheets. For the negative complement, see LM137 series data sheet. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2011, Texas Instruments Incorporated LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Typical Applications Figure 1. 1.2V–25V Adjustable Regulator Full output current not available at high input-output voltages *Needed if device is more than 6 inches from filter capacitors. †Optional—improves transient response. Output capacitors in the range of 1μF to 1000μF of aluminum or tantalum electrolytic are commonly used to provide improved output impedance and rejection of transients. LM117/LM317A/LM317-N Package Options Part Number Suffix Package Output Current LM117, LM317-N NDS TO-3 1.5A LM317A, LM317-N NDE TO-220 1.5A LM317-N KTT TO-263 1.5A LM317A, LM317-N DCY SOT-223 1.0A LM117, LM317A, LM317-N NDT TO 0.5A LM117 NAJ LCCC 0.5A LM317A, LM317-N NDP PFM 0.5A SOT-223 vs. PFM Packages Figure 2. Scale 1:1 Connection Diagrams TO-3 (NDS) Metal Can Package Figure 5. TO-263 (KTT) Surface-Mount Package Figure 6. Top View CASE IS OUTPUT Figure 3. Bottom View Bottom View Package Number NDS or K TO-263 (KTT) Surface-Mount Package TO (NDT) Metal Can Package Figure 7. Side View Package Number KTT CASE IS OUTPUT Figure 4. Bottom View Package Number NDT 2 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 TO-220 (NDE) Plastic Package 4-Lead SOT-223 (DCY) Figure 10. Front View Package Number DCY PFM (NDP) Figure 8. Front View Package Number NDE Ceramic Leadless Chip Carrier (NAJ) Figure 11. Front View Package Number NDP Figure 9. Top View Package Number NAJ Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 3 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Power Dissipation Internally Limited +40V, −0.3V Input-Output Voltage Differential −65°C to +150°C Storage Temperature Lead Temperature ESD Tolerance (1) (2) (3) Metal Package (Soldering, 10 seconds) 300°C Plastic Package (Soldering, 4 seconds) 260°C (3) 3 kV Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Operating Temperature Range LM117 −55°C ≤ TJ ≤ +150°C LM317A −40°C ≤ TJ ≤ +125°C 0°C ≤ TJ ≤ +125°C LM317-N Preconditioning Thermal Limit Burn-In All Devices 100% LM117 Electrical Characteristics (1) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. Parameter Conditions Reference Voltage 3V ≤ (VIN − VOUT) ≤ 40V, 10 mA ≤ IOUT ≤ IMAX (1) Line Regulation 3V ≤ (VIN − VOUT) ≤ 40V Load Regulation 10 mA ≤ IOUT ≤ IMAX (1) Thermal Regulation 20 ms Pulse LM117 Min Typ Max Units 1.20 1.25 1.30 V 0.01 0.02 0.02 0.05 %/V 0.1 0.3 0.3 1 % 0.03 0.07 %/W 50 100 μA 0.2 5 μA 3.5 5 mA (3) (3) Adjustment Pin Current Adjustment Pin Current Change 10 mA ≤ IOUT ≤ IMAX (1) 3V ≤ (VIN − VOUT) ≤ 40V Temperature Stability TMIN ≤ TJ ≤ TMAX Minimum Load Current (VIN − VOUT) = 40V (VIN − VOUT) ≤ 15V Current Limit (VIN − VOUT) = 40V RMS Output Noise, % of VOUT (1) (2) (3) 4 (2) 1 % NDS Package 1.5 2.2 3.4 NDT, NAJ Package 0.5 0.8 1.8 NDS Package 0.3 0.4 NDT, NAJ Package 0.15 0.20 10 Hz ≤ f ≤ 10 kHz 0.003 A A % IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A for the NDT (TO), MDT (PFM), and NAJ (LCCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL). Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications. Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 LM117 Electrical Characteristics(1) (continued) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. Parameter Ripple Rejection Ratio Long-Term Stability Thermal Resistance, θJC Junction-to-Case Thermal Resistance, θJA Junction-to-Ambient (No Heat Sink) LM117 Conditions Min (2) Typ VOUT = 10V, f = 120 Hz, CADJ = 0 μF Max Units 65 VOUT = 10V, f = 120 Hz, CADJ = 10 μF 66 dB 80 TJ = 125°C, 1000 hrs 0.3 NDS (TO-3) Package 2 NDT (TO) Package 21 NAJ (LCCC) Package 12 NDS (TO-3) Package 39 NDT (TO) Package 186 NAJ (LCCC) Package 88 dB 1 % °C/W °C/W LM317A and LM317-N Electrical Characteristics (1) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. Parameter Conditions Reference Voltage 3V ≤ (VIN − VOUT) ≤ 40V, 10 mA ≤ IOUT ≤ IMAX (1) Line Regulation 3V ≤ (VIN − VOUT) ≤ 40V Load Regulation 10 mA ≤ IOUT ≤ IMAX (1) Thermal Regulation 20 ms Pulse LM317A Min Typ Max Min Typ Max Units 1.238 1.250 1.262 - 1.25 - V 1.225 1.250 1.270 1.20 1.25 1.30 V 0.005 0.01 0.01 0.02 0.01 0.02 0.04 0.07 %/V 0.1 0.3 0.5 1 0.1 0.3 0.5 1.5 % 0.04 0.07 0.04 0.07 %/W 50 100 50 100 μA 0.2 5 0.2 5 μA 10 3.5 10 mA (2) (2) Adjustment Pin Current Adjustment Pin Current Change 10 mA ≤ IOUT ≤ IMAX (1) 3V ≤ (VIN − VOUT) ≤ 40V Temperature Stability TMIN ≤ TJ ≤ TMAX Minimum Load Current (VIN − VOUT) = 40V (VIN − VOUT) ≤ 15V Current Limit (VIN − VOUT) = 40V RMS Output Noise, % of VOUT Ripple Rejection Ratio Long-Term Stability (1) (2) LM317-N 1 3.5 1 % NDS, KTT Packages - - - 1.5 2.2 3.4 DCY, NDE Packages 1.5 2.2 3.4 1.5 2.2 3.4 NDT, MDT Packages 0.5 0.8 1.8 0.5 0.8 1.8 NDS, KTT Packages - - 0.15 0.40 DCY, NDE Packages 0.112 0.30 0.112 0.30 NDT, MDT Packages 0.075 0.20 0.075 0.20 10 Hz ≤ f ≤ 10 kHz 0.003 VOUT = 10V, f = 120 Hz, CADJ = 0 μF VOUT = 10V, f = 120 Hz, CADJ = 10 μF 65 66 TJ = 125°C, 1000 hrs 80 0.3 66 1 A A 0.003 % 65 dB 80 dB 0.3 1 % IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A for the NDT (TO), MDT (PFM), and NAJ (LCCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL). Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 5 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com LM317A and LM317-N Electrical Characteristics(1) (continued) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. Parameter Thermal Resistance, θJC Junction-to-Case Conditions LM317A Min Typ - 2 4 4 KTT (TO-263) Package - 4 23.5 23.5 NDT (TO) Package 21 21 MDT (PFM) Package 12 12 NDS (TO-3) Package - 39 50 50 DCY (SOT-223) Package KTT (TO-263) Package (3) DCY (SOT-223) Package MDT (PFM) Package 6 Min NDE (TO-220) Package (3) NDT (TO) Package (3) LM317-N Max NDS (TO-3) Package NDE (TO-220) Package Thermal Resistance, θJA Junction-to-Ambient (No Heat Sink) Typ (3) - 50 140 140 186 186 103 103 Max Units °C/W °C/W When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink techniques. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Typical Performance Characteristics Output Capacitor = 0 μF unless otherwise noted Load Regulation Current Limit Figure 12. Figure 13. Adjustment Current Dropout Voltage Figure 14. Figure 15. VOUT vs VIN, VOUT = VREF VOUT vs VIN, VOUT = 5V Figure 16. Figure 17. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 7 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Typical Performance Characteristics (continued) Output Capacitor = 0 μF unless otherwise noted 8 Temperature Stability Minimum Operating Current Figure 18. Figure 19. Ripple Rejection Ripple Rejection Figure 20. Figure 21. Ripple Rejection Output Impedance Figure 22. Figure 23. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Typical Performance Characteristics (continued) Output Capacitor = 0 μF unless otherwise noted Line Transient Response Load Transient Response Figure 24. Figure 25. APPLICATION HINTS In operation, the LM117 develops a nominal 1.25V reference voltage, VREF, between the output and adjustment terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a constant current I1 then flows through the output set resistor R2, giving an output voltage of (1) Since the 100μA current from the adjustment terminal represents an error term, the LM117 was designed to minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is returned to the output establishing a minimum load current requirement. If there is insufficient load on the output, the output will rise. External Capacitors An input bypass capacitor is recommended. A 0.1μF disc or 1μF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the possibility of problems. The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μF bypass capacitor 80dB ripple rejection is obtainable at any output level. Increases over 10 μF do not appreciably improve the ripple rejection at frequencies above 120Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 9 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to equal 1μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may seem to work better than a 0.1 μF disc as a bypass. Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μF solid tantalum (or 25 μF aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of the load capacitance larger than 10 μF will merely improve the loop stability and output impedance. Load Regulation The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain maximum performance. The current set resistor connected between the adjustment terminal and the output terminal (usually 240Ω) should be tied directly to the output (case) of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 15V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω × IL. If the set resistor is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this case, 11.5 times worse. Figure 26 shows the effect of resistance between the regulator and 240Ω set resistor. Figure 26. Regulator with Line Resistance in Output Lead With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two separate leads to the case. However, with the TO package, care should be taken to minimize the wire length of the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Protection Diodes When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to prevent the capacitors from discharging through low current points into the regulator. Most 10 μF capacitors have low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is enough energy to damage parts of the IC. When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and the rate of decrease of VIN. In the LM117, this discharge path is through a large junction that is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output capacitors of 25 μF or less, there is no need to use diodes. The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs when either the input, or the output, is shorted. Internal to the LM117 is a 50Ω resistor which limits the peak discharge current. No protection is needed for output voltages of 25V or less and 10 μF capacitance. Figure 27 shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output capacitance. 10 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 D1 protects against C1 D2 protects against C2 Figure 27. Regulator with Protection Diodes Heatsink Requirements The LM317-N regulators have internal thermal shutdown to protect the device from over-heating. Under all operating conditions, the junction temperature of the LM317-N should not exceed the rated maximum junction temperature (TJ) of 150°C for the LM117, or 125°C for the LM317A and LM317-N. A heatsink may be required depending on the maximum device power dissipation and the maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be calculated: PD = ((VIN − VOUT) × IL) + (VIN × IG) (2) Figure 28 shows the voltage and currents which are present in the circuit. The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX): TR(MAX) = TJ(MAX) − TA(MAX) (3) where TJ(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the LM317A/LM317-N), and TA(MAX) is the maximum ambient temperature which will be encountered in the application. Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (θJA) can be calculated: θJA = (TR(MAX) / PD) (4) Figure 28. Power Dissipation Diagram If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual package rating either the power dissipation (PD) needs to be reduced, the maximum ambient temperature TA(MAX) needs to be reduced, the thermal resistance (θJA) must be lowered by adding a heatsink, or some combination of these. If a heatsink is needed, the value can be calculated from the formula: θHA ≤ (θJA - (θCH + θJC)) (5) Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 11 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com where (θCH is the thermal resistance of the contact area between the device case and the heatsink surface, and θJC is thermal resistance from the junction of the die to surface of the package case. When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than, or equal to, this number. The θ(H−A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. Heatsinking Surface Mount Packages The TO-263 (KTT), SOT-223 (DCY) and PFM (MDT) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Heatsinking the SOT-223 Package Figure 29 and Figure 30 show the information for the SOT-223 package. Figure 30 assumes a θ(J−A) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and PFM packages. Figure 29. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 30. Maximum Power Dissipation vs TAMB for the SOT-223 Package Heatsinking the TO-263 Package Figure 31 shows for the TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. 12 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 As shown in Figure 31, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(J−A) for the TO-263 package mounted to a PCB is 32°C/W. Figure 31. θ(J−A) vs Copper (1 ounce) Area for the TO-263 Package As a design aid, Figure 32 shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C). Figure 32. Maximum Power Dissipation vs TAMB for the TO-263 Package Heatsinking the PFM Package If the maximum allowable value for θJA is found to be ≥103°C/W (Typical Rated Value) for PFM package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θJA falls below these limits, a heatsink is required. As a design aid, Table 1 shows the value of the θJA of PFM for different heatsink area. The copper patterns that we used to measure these θJAs are shown in Figure 37. Figure 33 reflects the same test results as what are in Table 1. Figure 34 shows the maximum allowable power dissipation vs. ambient temperature for the PFM device. Figure 35 shows the maximum allowable power dissipation vs. copper area (in2) for the PFM device. Please see AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and PFM packages. Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 13 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Table 1. θJA Different Heatsink Area Layout (1) Copper Area Top Side (in2) (1) Bottom Side (in2) Thermal Resistance (θJA°C/W) PFM 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1.0 0 47 7 0.066 0.2 84 8 0.066 0.4 70 9 0.066 0.6 63 10 0.066 0.8 57 11 0.066 1.0 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Tab of device attached to topside of copper. Figure 33. θJA vs 2oz Copper Area for PFM Figure 34. Maximum Allowable Power Dissipation vs. Ambient Temperature for PFM 14 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Figure 35. Maximum Allowable Power Dissipation vs. 2oz Copper Area for PFM Figure 36. Top View of the Thermal Test Pattern in Actual Scale Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 15 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Figure 37. Bottom View of the Thermal Test Pattern in Actual Scale Schematic Diagram 16 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Typical Applications Note: Min. ≊ output 1.2V Figure 38. 5V Logic Regulator with Electronic Shutdown Figure 39. Slow Turn-On 15V Regulator Figure 40. †Solid tantalum *Discharges C1 if output is shorted to ground Figure 41. Adjustable Regulator with Improved Ripple Rejection Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 17 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Figure 42. High Stability 10V Regulator ‡Optional—improves ripple rejection †Solid tantalum *Minimum load current = 30 mA Figure 43. High Current Adjustable Regulator 18 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Full output current not available at high input-output voltages Figure 44. 0 to 30V Regulator Figure 45. Power Follower Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 19 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com †Solid tantalum *Lights in constant current mode Figure 46. 5A Constant Voltage/Constant Current Regulator Figure 47. 1A Current Regulator *Minimum load current ≊ 4 mA Figure 48. 1.2V–20V Regulator with Minimum Program Current 20 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 Figure 49. High Gain Amplifier †Solid tantalum *Core—Arnold A-254168-2 60 turns Figure 50. Low Cost 3A Switching Regulator Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 21 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com †Solid tantalum *Core—Arnold A-254168-2 60 turns Figure 51. 4A Switching Regulator with Overload Protection Figure 52. Precision Current Limiter Figure 53. Tracking Preregulator 22 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 (Compared to LM117's higher current limit) —At 50 mA output only ¾ volt of drop occurs in R3 and R4 Figure 54. Current Limited Voltage Regulator Note: All outputs within ±100 mV †Minimum load—10 mA Figure 55. Adjusting Multiple On-Card Regulators with Single Control Figure 56. AC Voltage Regulator Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 23 LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Use of RS allows low charging rates with fully charged battery. Figure 57. 12V Battery Charger Figure 58. Figure 59. 50mA Constant Current Battery Charger Figure 60. Adjustable 4A Regulator 24 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N LM117, LM317-N www.ti.com SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 *Sets peak current (0.6A for 1Ω) **The 1000μF is recommended to filter out input transients Figure 61. Current Limited 6V Charger *Sets maximum VOUT Figure 62. Digitally Selected Outputs Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N 25 PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM117H ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM117HP+ LM117H/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM117HP+ LM117K ACTIVE TO-3 NDS 2 50 TBD Call TI Call TI -55 to 125 LM117K STEELP+ LM117K STEEL ACTIVE TO-3 NDS 2 50 TBD Call TI Call TI -55 to 125 LM117K STEELP+ LM117K STEEL/NOPB ACTIVE TO-3 NDS 2 50 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM117K STEELP+ LM317AEMP ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 N07A LM317AEMP/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N07A LM317AEMPX ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI LM317AEMPX/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N07A LM317AH ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM317AHP+ LM317AH/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM317AHP+ LM317AMDT ACTIVE TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM317 AMDT LM317AMDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM317 AMDT LM317AMDTX ACTIVE TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM317 AMDT LM317AMDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM317 AMDT LM317AT ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM317AT P+ LM317AT/NOPB ACTIVE TO-220 NDE 3 45 Pb-Free (RoHS Exempt) CU SN Level-1-NA-UNLIM -40 to 125 LM317AT P+ LM317EMP ACTIVE SOT-223 DCY 4 1000 TBD Call TI Call TI 0 to 125 Addendum-Page 1 N07A N01A Samples PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM317EMP/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N01A LM317EMPX/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N01A LM317H ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 125 LM317HP+ LM317H/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 125 LM317HP+ LM317K STEEL ACTIVE TO-3 NDS 2 50 TBD Call TI Call TI 0 to 125 LM317K STEELP+ LM317K STEEL/NOPB ACTIVE TO-3 NDS 2 50 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 125 LM317K STEELP+ LM317MDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM317 MDT LM317MDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM317 MDT LM317S/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM317S P+ LM317SX/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM317S P+ LM317T ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI LM317T P+ LM317T/LF01 ACTIVE TO-220 NDG 3 45 Pb-Free (RoHS Exempt) CU SN Level-4-260C-72 HR LM317T P+ LM317T/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM317T P+ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM317AEMP SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM317AEMP/NOPB SOT-223 DCY 4 1000 330.0 LM317AEMPX SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 16.4 7.0 7.5 2.2 12.0 16.0 LM317AEMPX/NOPB SOT-223 DCY 4 2000 Q3 330.0 16.4 7.0 7.5 2.2 12.0 16.0 LM317AMDTX TO-252 NDP 3 Q3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM317AMDTX/NOPB TO-252 NDP LM317EMP SOT-223 DCY 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 LM317EMP/NOPB SOT-223 Q3 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM317EMPX/NOPB LM317MDTX/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 LM317SX/NOPB Q2 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM317AEMP SOT-223 DCY 4 1000 367.0 367.0 35.0 LM317AEMP/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM317AEMPX SOT-223 DCY 4 2000 367.0 367.0 35.0 LM317AEMPX/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM317AMDTX TO-252 NDP 3 2500 367.0 367.0 35.0 LM317AMDTX/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM317EMP SOT-223 DCY 4 1000 367.0 367.0 35.0 LM317EMP/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM317EMPX/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM317MDTX/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM317SX/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDT0003A H03A (Rev D) www.ti.com MECHANICAL DATA NDS0002A www.ti.com MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NDG0003F T03F (Rev B) www.ti.com MECHANICAL DATA NDP0003B TD03B (Rev F) www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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