MJE13009X9 Rev.E Mar.-2016 描述 / DATA SHEET Descriptions TO-3P 塑封封装 NPN 半导体三极管。Silicon NPN Transistor in a TO-3P Plastic Package. 特征 / Features 快速转换。 High Speed Switching 用途 / Applications 节能灯电路。 High frequency electronic lighting ballast applications. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning PIN1：Base 放大及印章代码 PIN 2：Collector PIN 3：Emitter / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 MJE13009X9 Rev.E Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 700 V Collector to Emitter Voltage VCEO 400 V Emitter to Base Voltage VEBO 9.0 V Collector Current - Continuous IC 8.0 A Collector Power Dissipation PC 2.0 W Collector Power Dissipation PC(Tc=25℃) 90 W Tj 150 ℃ Tstg -55～150 ℃ Junction Temperature Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 典型值 最大值 单位 Min Typ Max Unit Collector to Base Voltage VCBO IC=1mA IE=0 700 V Collector to Emitter Voltage VCEO IC=10mA IB=0 400 V Emitter to Base Voltage VEBO IE=1mA IC=0 9 V Collector Cut-Off Current ICBO VCB=700V IE=0 0.1 mA Collector cut-off current ICEO VCE=400V IB=0 0.1 mA Emitter Base Cut-Off Current IEBO VEB=9.0V IC=0 0.1 mA DC Current Gain hFE VCE=5.0V IC=2.0A 10 40 Collector to Emitter Saturation Voltage VCE(sat) IC=8.0A IB=2.0A 1.5 V Base to Emitter Saturation Voltage VBE(sat) IC=8.0A IB=2.0A 1.5 V VCE=10V f=1.0MHz IC=0.5A VCE=5V (UI9600) IC=0.5A Transition Frequency fT Fall time tf Storage time tS http://www.fsbrec.com 5.0 4.0 MHz 0.8 μs 9.0 μs 2/6 MJE13009X9 Rev.E Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve SOA(DC) hFE-Ic hFE-Ic Vces-IC Vbes-IC tS-Ta http://www.fsbrec.com PC-TC hFE-Ta 3/6 MJE13009X9 Rev.E Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MJE13009X9 Rev.E Mar.-2016 印章说明 / DATA SHEET Marking Instructions BR 13009 X9 **** 说明： 为公司代码 13009： 为型号代码 X9： 为规格代码 ****： 为生产批号代码，随生产批号变化。 BR: Company Code. 13009: X9: BR： Note: ****: http://www.fsbrec.com Product Type. Specifications Code. Lot No. Code, code change with Lot No. 5/6 MJE13009X9 Rev.E Mar.-2016 DATA SHEET 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 255±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 包装规格 Package Type 封装形式 使用说明 Temp.:270±5℃ Time:10±1 sec / Packaging SPEC. 套管包装 TO-3P 时间：10±1 sec. / TUBE Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 30 15 450 5 2250 497.5×46×8 555×164×50 575×290×180 / Notices http://www.fsbrec.com 6/6