LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOT MATRIX LED DISPLAY(1.2Inch) LMD5711/2CSR-XX DATA SHEET DOC. NO : QW0905- LMD5711/2CSR-XX REV. : A DATE : 31 - May - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LMD5711/2CSR-XX Package Dimensions 4.57X4=18.28 (0.72") 4.57X6=27.42 (1.08") 8.1 (0.319") 31.7 (1.248") ψ3.0(0.118") 22.6(0.89") LMD5711/2CSR-XX LIGITEK ψ0.51 TYP. 5.9±0.5 2.54X6=15.24 (0.6") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 22.86 (0.9") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD5711/2CSR-XX Page 2/7 Internal Circuit Diagram LMD5711CSR-XX COLUMN ROW PIN 1 9 2 14 3 8 4 5 12 5 1 6 7 7 2 1 2 13 3 3 4 5 4,11 10 6 LMD5712CSR-XX COLUMN ROW PIN 1 9 2 14 3 8 4 5 12 5 1 6 7 7 2 1 2 13 3 4 5 4,11 10 6 3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LMD5711/2CSR-XX Electrical Connection PIN NO.1 LMD5711CSR-XX PIN NO.1 LMD5712CSR-XX 1 Anode Row 5 1 Cathode Row 5 2 Anode Row 7 2 Cathode Row 7 3 Cathode Column 2 3 Anode Column 2 4 Cathode Column 3 4 Anode Column 3 5 Anode Row 4 5 Cathode Row 4 6 Cathode Column 5 6 Anode Column 5 7 Anode Row 6 7 Cathode Row 6 8 Anode Row 3 8 Cathode Row 3 9 Anode Row 1 9 Cathode Row 1 10 Cathode Column 4 10 Anode Column 4 11 Cathode Column 3 11 Anode Column 3 12 Anode Row 4 12 Cathode Row 4 13 Cathode Column 1 13 Anode Column 1 14 Anode Row 2 14 Cathode Row 2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7 PART NO. LMD5711/2CSR-XX Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SR Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO LMD5711CSR-XX GaAlAs LMD5712CSR-XX Red Column Cathode Row Anode Column Anode Row Cathode Electrical λP (nm) 660 △λ 20 Iv(mcd) Vf(v) (nm) Min. Typ. Max. Min. Typ. 1.5 1.7 8.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.4 5.0 IV-M 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. LMD5711/2CSR-XX Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λp nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO. LMD5711CSR-XX Typical Electro-Optical Characteristics Curve SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO. LMD5711/2CSR-XX Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11