LIGITEK LMD5711-2CSR-XX Dot matrix led display(1.2inch) Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DOT MATRIX LED DISPLAY(1.2Inch)
LMD5711/2CSR-XX
DATA SHEET
DOC. NO
:
QW0905- LMD5711/2CSR-XX
REV.
:
A
DATE
: 31 - May - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LMD5711/2CSR-XX
Package Dimensions
4.57X4=18.28
(0.72")
4.57X6=27.42
(1.08")
8.1
(0.319")
31.7
(1.248")
ψ3.0(0.118")
22.6(0.89")
LMD5711/2CSR-XX
LIGITEK
ψ0.51
TYP.
5.9±0.5
2.54X6=15.24
(0.6")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
22.86
(0.9")
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2CSR-XX
Page 2/7
Internal Circuit Diagram
LMD5711CSR-XX
COLUMN
ROW
PIN
1
9
2
14
3
8
4
5
12
5
1
6
7
7
2
1
2
13
3
3
4
5
4,11 10
6
LMD5712CSR-XX
COLUMN
ROW
PIN
1
9
2
14
3
8
4
5
12
5
1
6
7
7
2
1
2
13
3
4
5
4,11 10
6
3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO. LMD5711/2CSR-XX
Electrical Connection
PIN NO.1
LMD5711CSR-XX
PIN NO.1
LMD5712CSR-XX
1
Anode Row 5
1
Cathode Row 5
2
Anode Row 7
2
Cathode Row 7
3
Cathode Column 2
3
Anode Column 2
4
Cathode Column 3
4
Anode Column 3
5
Anode Row 4
5
Cathode Row 4
6
Cathode Column 5
6
Anode Column 5
7
Anode Row 6
7
Cathode Row 6
8
Anode Row 3
8
Cathode Row 3
9
Anode Row 1
9
Cathode Row 1
10
Cathode Column 4
10
Anode Column 4
11
Cathode Column 3
11
Anode Column 3
12
Anode Row 4
12
Cathode Row 4
13
Cathode Column 1
13
Anode Column 1
14
Anode Row 2
14
Cathode Row 2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/7
PART NO. LMD5711/2CSR-XX
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SR
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
mA
Power Dissipation Per Chip
PD
100
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
or
anode
Material Emitted
CHIP
PART NO
LMD5711CSR-XX
GaAlAs
LMD5712CSR-XX
Red
Column
Cathode
Row
Anode
Column
Anode
Row
Cathode
Electrical
λP
(nm)
660
△λ
20
Iv(mcd)
Vf(v)
(nm)
Min.
Typ. Max. Min.
Typ.
1.5
1.7
8.5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.4
5.0
IV-M
2:1
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Page 5/7
PART NO. LMD5711/2CSR-XX
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λp
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
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Property of Ligitek Only
Page 6/7
PART NO. LMD5711CSR-XX
Typical Electro-Optical Characteristics Curve
SR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
1.0
5.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/7
PART NO. LMD5711/2CSR-XX
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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