Material Content Data Sheet Sales Product Name IPC60N04S4-06 MA# MA001255714 Package PG-TDSON-8-23 Issued 15. June 2015 Weight* 99.85 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 0.862 0.86 0.053 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.86 8635 8635 526 0.016 0.02 52.469 52.56 52.63 525474 158 526158 0.958 0.96 0.96 9597 9597 0.085 0.08 847 6.005 6.01 36.198 36.25 42.34 362519 60138 423504 1.535 1.54 1.54 15369 15369 0.002 0.00 0.632 0.63 0.026 0.03 0.021 0.02 0.991 0.99 15 0.63 2. 3. 208 1.04 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6344 260 Important Remarks: 1. 6329 9925 10393 1000000