NLSV1T34 1-Bit Dual-Supply Non-Inverting Level Translator The NLSV1T34 is a 1−bit configurable dual−supply voltage level translator. The input An and output Bn ports are designed to track two different power supply rails, VCCA and VCCB respectively. Both supply rails are configurable from 0.9 V to 4.5 V allowing universal low−voltage translation from the input An to the output Bn port. http://onsemi.com MARKING DIAGRAMS Features • Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V High−Speed w/ Balanced Propagation Delay Inputs and Outputs have OVT Protection to 4.5 V Non−preferential VCCA and VCCB Sequencing Power−Off Protection Power−Off High Impedance Inputs and Outputs Ultra−Small Packaging: 1.45 mm x 1.0 mm ULLGA6 2.0 mm x 2.1 mm SC−88A 1.2 mm x 1.0 mm UDFN6 1.45 mm x 1.0 mm UDFN6 These are Pb−Free Devices 1 QM 1 ULLGA6 MX1 SUFFIX CASE 613AF 5 SC−88A (SOT−353/SC−70) DF SUFFIX CASE 419A W0 M G G 1 W0 = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. • ESD Protection for All Pins: HBM (Human Body Model) > 3000 V VCCB B A = Specific Device Code = Date Code M 1 Important Information VCCA AM 1 5 • Mobile Phones, PDAs, Other Portable Devices M G UDFN6 MU SUFFIX CASE 517AQ X M Typical Applications Q • • • • • • • UDFN6 MU SUFFIX CASE 517AA PIN ASSIGNMENT VCCA 1 Figure 1. Logic Diagram A 2 GND 3 6 VCCB VCCA 1 5 NC 4 B ULLGA6/UDFN6 (Top View) 5 VCCB A 2 GND 3 4 B SC−88A (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2010 April, 2010 − Rev. 5 1 Publication Order Number: NLSV1T34/D NLSV1T34 PIN ASSIGNMENT TRUTH TABLE PIN FUNCTION INPUTS OUTPUTS VCCA Input Port DC Power Supply A B VCCB Output Port DC Power Supply L L GND Ground H H A Input Port B Output Port MAXIMUM RATINGS Symbol VCCA, VCCB Rating Value DC Supply Voltage VI DC Input Voltage VO DC Output Voltage Condition Unit −0.5 to +5.5 V A −0.5 to +5.5 V (Power Down) B −0.5 to +5.5 (Active Mode) B −0.5 to +5.5 VCCA = VCCB = 0 V V IIK DC Input Diode Current −20 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA IO DC Output Source/Sink Current ±50 mA ICCA, ICCB DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCCA, VCCB VI VIO TA Dt / DV Parameter Positive DC Supply Voltage Bus Input Voltage Bus Output Voltage Min Max Unit 0.9 4.5 V GND 4.5 V (Power Down Mode) B GND 4.5 V (Active Mode) B GND VCCB V −40 +85 °C 0 10 nS Operating Temperature Range Input Transition Rise or Rate VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V http://onsemi.com 2 NLSV1T34 DC ELECTRICAL CHARACTERISTICS −405C to +855C Symbol VIH VIL VOH Parameter Test Conditions Input HIGH Voltage Input LOW Voltage Output HIGH Voltage Min Max Unit 3.6 – 4.5 0.9 – 4.5 V 2.2 − 2.7 – 3.6 2.0 − 2.3 – 2.7 1.6 − 1.4 − 2.3 0.65 * VCCA − 0.9 – 1.4 0.9 * VCCA − 0.9 – 4.5 − 0.8 2.7 – 3.6 − 0.8 2.3 – 2.7 − 0.7 1.4 − 2.3 − 0.35 * VCCA 0.9 – 1.4 − 0.1 * VCCA IOH = −100 mA; VI = VIH 0.9 – 4.5 0.9 – 4.5 VCCB – 0.2 − IOH = −0.5 mA; VI = VIH 0.9 0.9 0.75 * VCCB − IOH = −2 mA; VI = VIH 1.4 1.4 1.05 − IOH = −6 mA; VI = VIH 1.65 1.65 1.25 − 2.3 2.3 2.0 − 2.3 2.3 1.8 − 2.7 2.7 2.2 − 2.3 2.3 1.7 − IOH = −18 mA; VI = VIH Output LOW Voltage VCCB (V) 3.6 – 4.5 IOH = −12 mA; VI = VIH VOL VCCA (V) 3.0 3.0 2.4 − IOH = −24 mA; VI = VIH 3.0 3.0 2.2 − IOL = 100 mA; VI = VIL 0.9 – 4.5 0.9 – 4.5 − 0.2 IOL = 0.5 mA; VI = VIH 1.1 1.1 − 0.3 IOL = 2 mA; VI = VIH 1.4 1.4 − 0.35 IOL = 6 mA; VI = VIL 1.65 1.65 − 0.3 IOL = 12 mA; VI = VIL 2.3 2.3 − 0.4 2.7 2.7 − 0.4 2.3 2.3 − 0.6 3.0 3.0 − 0.4 IOL = 18 mA; VI = VIL IOL = 24 mA; VI = VIL V V V 3.0 3.0 − 0.55 Input Leakage Current VI = VCCA or GND 0.9 – 4.5 0.9 – 4.5 −1.0 1.0 mA ICCA Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCA + ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 – 4.5 − 4.0 mA 0 0 − 5.0 mA II IOFF Power OFF Leakage Current VI = 4.5 V http://onsemi.com 3 NLSV1T34 TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB) −405C to +855C VCCB (V) 4.5 VCCA (V) Min 3.3 Max Min 2.8 Max Min 1.8 Max Min 0.9 Max Min Max Unit 4.5 2 2 2 2 < 1.5 μA 3.3 2 2 2 2 < 1.5 μA 2.8 <2 <1 <1 < 0.5 < 0.5 μA 1.8 <1 <1 < 0.5 < 0.5 < 0.5 μA 0.9 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 μA NOTE: Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up sequence of VCCA and VCCB will not damage the IC. AC ELECTRICAL CHARACTERISTICS −405C to +855C VCCB (V) 4.5 Symbol tPLH, tPHL (Note 1) Min 3.3 Max Min 2.8 Max Min 1.8 Max Max Unit 2.1 2.3 nS 2.3 2.6 2.3 2.5 2.8 2.4 2.5 2.7 3.0 2.7 2.8 3.0 3.3 Parameter VCCA (V) Propagation Delay, 4.5 1.6 1.8 2.0 3.3 1.7 1.9 2.1 A to B 2.8 1.9 2.1 1.8 2.1 1.2 2.4 Min 1.2 Max Min 1. Propagation delays defined per Figure 2. CAPACITANCE Typ (Note 2) Unit CI/O I/O Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 5.0 pF CPD Power Dissipation Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz 5.0 pF Symbol Parameter Test Conditions 2. Typical values are at TA = +25°C. 3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from: ICC(operating) ^ CPD x VCC x fIN where ICC = ICCA + ICCB. http://onsemi.com 4 NLSV1T34 VCC Pulse Generator DUT CL RL Figure 2. AC (Propagation Delay) Test Circuit Test Switch CL = 15 pF or equivalent (includes probe and jig capacitance) RL = 2 kW or equivalent ZOUT of pulse generator = 50 W Input (An) VIH Vm Vm tPLH Output (Bn) tPHL Vm 0V VOH Vm VOL Waveform 1 − Propagation Delays tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC (Propagation Delay) Test Circuit Waveforms VCC Symbol 0.9 V – 4.5 V VmA VCCA/2 VmB VCCB/2 ORDERING INFORMATION Package Shipping† NLSV1T34MUTCG UDFN6 (Pb−Free) 3000 / Tape & Reel NLSV1T34AMUTCG UDFN6 (Pb−Free) 3000 / Tape & Reel NLSV1T34AMX1TCG ULLGA6 (Pb−Free) 3000 / Tape & Reel NLSV1T34DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLSV1T34 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 mm Ǔ ǒinches MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NLSV1T34 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA−01 ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 ÉÉ ÉÉ E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLSV1T34 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ−01 ISSUE O A B D PIN ONE REFERENCE 0.10 C L L1 ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B A1 SIDE VIEW MOLD CMPD OPTIONAL CONSTRUCTIONS A 0.05 C DIM A A1 A2 b D E e L L1 DETAIL B 0.05 C 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C L MOUNTING FOOTPRINT A2 C SEATING PLANE 6X 0.30 PACKAGE OUTLINE e 6X L 1.24 3 1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 DETAIL A 6X 0.53 6 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 8 NLSV1T34 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF−01 ISSUE A PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 0.10 C TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L 5X 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 6X 0.30 6X BOTTOM VIEW b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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