MMIC Bi-Directional Coupler Die 50Ω EBDC19-KA-D+ 5 to 43.5 GHz The Big Deal • Ultra-Wide Bandwidth, 5-43.5 GHz • Excellent Coupling Flatness ±0.6 dB typ over 20-40 GHz Product Overview Mini-Circuits’ EBDC19-KA-D+ is a Bi-Directional Coupler die designed for wideband operation from 5 to 43.5 GHz with a nominal coupling of 18.7 dB over 20-40 GHz. Manufactured using GaAs IPD technology, it has excellent repeatability and excellent reliability. Key Features Feature Advantages Wideband, 5 to 43.5 GHz A single Directional Coupler can be used in many applications, saving component count. Also ideal for applications such as 5G, military and instrumentation. DC Passing up to 1.3A DC current passing is helpful in applications where both RF & DC need to pass through the DUT, such as antenna mounted hardware. Unpackaged die Enables user to integrate it directly into hybrids. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 1 of 5 MMIC Bi-Directional Coupler Die 50Ω EBDC19-KA-D+ 5 to 43.5 GHz Product Features • Wide bandwidth, 5 to 43.5 GHz • Excellent Coupling Flatness, ±0.6 dB over 20 to 40 GHz • Nominal Coupling 18.6 dB over 20 to 40 GHz • DC passing +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Typical Applications Ordering Information: Refer to Last Page • 5G • Instrumentation • Military General Description Mini-Circuits’ EBDC19-KA-D+ is a Bi-Directional Coupler die designed for wideband operation from 5 to 43.5 GHz with a nominal coupling of 18.7 dB over 20-40 GHz. Manufactured using GaAs IPD technology, it has excellent repeatability and excellent reliability. Simplified Schematic and Pad description 2 Output 4 Couple Forward 3 Couple Reverse Die Bottom Ground Dimensions in µm, Typical L1 L2 134 392 L3 L4 L5 H1 H2 H3 1199 1456 1590 124 370 921 H4 H5 Bond Pad #2, #4 Size Input Bond Pad #1, #3 Size Function 1 Die Thickness Pad# Bonding Pad Position 1166 1290 100 117 x 167 167 x 117 Note: 1. Bond Pad material - Gold 2. Bottom of Die - Gold plated Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] REV. OR M165761 EBDC19-KA-D+ RS/CP 180220 Page 2 of 5 EBDC19-KA-D+ MMIC Bi-Directional Coupler die Electrical Specifications1 at 25°C Parameter Frequency (GHz) Min. Frequency Range Typ. 5 Main Line Loss Nominal Coupling Coupling Flatness (±) Directivity Return Loss - Input / Output Return loss - CPL-FWD/CPL-REV 5 - 10 0.3 10 - 20 0.6 20 - 40 0.6 40 - 43.5 0.6 5 - 10 25.6 10 - 20 21.0 20 - 40 18.7 40 - 43.5 19.5 5 - 10 2.8 10 - 20 1.9 20 - 40 0.6 40 - 43.5 0.6 5 - 10 8.8 10 - 25 9.1 25 - 30 10 30 - 43.5 6.0 5 - 10 15.6 10 - 20 13.7 20 - 40 14.7 40 - 43.5 16.0 5 - 10 15.8 10 - 20 14.1 20 - 40 14.8 40 - 43.5 15.8 Max. Units 43.5 GHz dB dB dB dB dB dB 1. Measured on Die using MPI TITAN 200µm GSG probe Absolute Maximum Ratings2 Ratings Parameter Operating Temperature -40°C to 85°C Power Input 1W Max. Power into Coupled Port 1W Max. DC Current 1.3A at 25°C. Derate linearly to 0.65A at 85°C 2. Permanent damage may occur if any of these limits are exceeded. Electrical maximum ratings are not intended for continuous normal operation. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 3 of 5 EBDC19-KA-D+ MMIC Bi-Directional Coupler die Assembly Diagram Forward Note: Ground bond wire are optional Reverse Note: Ground bond wires are optional Assembly and Handling Procedure 1. Storage Dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. ESD MMIC coupler dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice. 3. Die Attach The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic die pick up tools only. 4. Wire Bonding Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 4 of 5 EBDC19-KA-D+ MMIC Bi-Directional Coupler die Additional Detailed Technical Information additional information is available on our dash board. Data Table Performance Data Swept Graphs S-Parameter (S4P Files) Case Style Die Ordering and packaging information Die Quantity, Package Model No. Small, Gel - Pak: 5, KGD* Medium†, Partial wafer: 350 KGD* EBDC19-KA-DG+ EBDC19-KA-DP+ † Available upon request contact sales representative Refer to AN-60-067 Environmental Ratings ENV80 *Known Good Dice (“KGD”) means that the dice are taken from PCM good wafer and visually inspected according to Mini-Circuits inspection criteria. While this is not definitive, it does help to provide a higher degree of confidence that dice are capable of meeting typical RF electrical parameters specified by Mini-Circuits. ESD Rating Human Body Model (HBM): Class 1C (Pass 1000V) in accordance with ANSI/ESD STM 5.1 - 2001 Additional Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults. E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental effects on Known Good Dice. F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini- Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party Notes trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. third-party Mini-Circuits or its products. B. Electrical specifications andof performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 5 of 5