AVX NB21K00103MBB Ntc smd thermistor Datasheet

NTC SMD Thermistors
With Nickel Barrier Termination NB 21 - NB 23
Chip thermistors are high quality and low cost devices
especially developed for surface mounting applications. They
are widely used for temperature compensation but can also
achieve temperature control of printed circuits.
A nickel barrier metallization provides outstanding qualities of
solderability and enables this chip to meet the requirements
of the most severe soldering processes.
NB 21
IEC SIZE : 0603
Types
NB 23
IEC SIZE : 0402
1.0 ± 0.1 (0.04 ± 0.004)
1.6 (.063) 0.2 (.008)
0.40 ± 0.1
(0.02 ±0.004)
0.8 (.031)
±0.2 (.008)
DIMENSIONS:
millimeters (inches)
0.8 (.031)
±0.2 (.008)
0.60 (0.024) max
0.2 (.008) min
0.25 (0.10) min
0.2 (.008) min
Terminations
0.25 (0.10) min
Nickel Barrier
Marking
On packaging only
Climatic category
40/125/56
Operating temperature
-55°C to +150°C
Tolerance on Rn (25°C)
±5%, ±10%, ±20%
Maximum dissipation at 25°C
Thermal dissipation factor
Thermal time constant
0.07 W
0.06 W
1 mW/°C
0.8 mW/°C
4s
3s
Resistance - Temperature characteristics: pages 36 to 40.
APPLICATIONS
•
•
•
•
•
•
•
•
•
LCD compensation
Battery packs
Mobile phones
CD players
Heating systems
Air-conditioning systems
Temperature control of Switch Mode Power Supplies
Compensation of pressure sensors
Protection of power transistors in various electronic circuits
HOW TO ORDER
14
NB 21
K0
0103
M
BB
Type
Material Code
K
(See tables page 15)
Resistance
10,000 Ω
Tolerance
M (±20%)
J (±5%)
K (±10%)
Suffix: Packaging
– –: Bulk
BB: Cardboard tape
(180mm diam. reel)
BF: Cardboard tape (1/2 reel)
BD: Cardboard tape
(330mm diam. reel)
NTC SMD Thermistors
With Nickel Barrier Termination NB 21 - NB 23
TABLE OF VALUES
NB 23
IEC SIZE : 0402
NB 21
IEC SIZE : 0603
Types
NB 21 KC 0 470
NB 21 KC 0 101
NB 21 KC 0 471
Rn at 25°C
(Ω)
47
100
470
Material
Code
KC
B (K)
(B/B
(1) ± 5%
(2) ± 3%
3470 ± 5%
3910 ± 3%
)
at 25°C
(%/°C)
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
(B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
NB 23 NC 0 103
10,000
NC
4080 ± 3%
– 4.6
– 3.9
NB 23 RC 0 103
10,000
RC
4340 ± 3%
– 4.7
– 4.4
NB 23 NC 0 153
NB 23 NC 0 223
15,000
22,000
NC
4080 ± 3%
– 4.6
NB 23 RC 0 223
NB 23 RC 0 333
22,000
33,000
RC
4340 ± 3%
– 4.7
NB 23 NE 0 473
47,000
NE
4100 ± 3%
– 4.6
NB 23 RC 0 473
NB 23 RC 0 683
NB 23 RC 0 104
47,000
68,000
100,000
RC
4340 ± 3%
– 4.7
NB 21 MC 0 102
1,000
MC
NB 21 J 0 0472
4,700
J
3480 ± 3%
– 3.9
NB 21 J 5 0682
NB 21 J 5 0103
6,800
10,000
J5
3480 ± 3%
3480 ± 3%
– 3.9
– 3.9
NB 21 K 0 0103
NB 21 K 0 0153
10,000
15,000
K
3630 ± 3%
– 4.0
NB 21 L 0 0223
22,000
L
3790 ± 3%
– 4.2
NB 21 M 0 0333
NB 21 M 0 0473
33,000
47,000
M
3950 ± 3%
– 4.4
NB 21 L 2 0683
68,000
L2
3805 ± 3%
– 4.1
NB 21 N 0 0683
68,000
N
4080 ± 3%
– 4.6
NB 21 N 5 0104
100,000
N5
4160 ± 3%
– 4.7
NB 21 P 0 0154
150,000
P
4220 ± 3%
– 4.7
NB 21 Q 0 0334
NB 21 Q 0 0474
330,000
470,000
Q
4300 ± 3%
– 4.7
15
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
5.5 (.217)
±0.2 (.008)
Max
3°
30µ ± 5µ
T
K
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Symbol
W
T
P0
D0
Distance
Distance (center to center)
Distance (center to center)
Sizes of the
NC 12 (0805)
cavities
E
F
P2
A0
B0
K
Value
8
0.4 max.
4
1.5
-0
1.75
3.5
2
1.5
2.4
1.4 max.
NC 20 (1206)
A0
B0
K
1.95
3.55
1.5 max.
A1
B1
B0
F
R = 0.3 (.012) Max.
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
(.008)
Hole 1 (.039) +0.2
-0
Cover Tape
Max
3°
Super 8 Plastic Tape Packaging:
D0
P2
E
P0
Max
3°
Max
3°
A0
Direction of
unreeling
Tolerance
±0.2
±0.1
±0.1
±0.1
±0.05
±0.1
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NC - NB 12
NC 20 - NB 20
16
Suffix
BA
BE
BA
BE
Qty Per Reel
4000
2000
3000
1500
W
Upper side
Bottom side
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
P0
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
BOTTOM
COVER
TAPE
D0
T
P2
E1
TOP
COVER
TAPE
F
W
E2
B0
G
T1
T1
Designation
Symbol
W
T
P0
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Value
8
1.1 max.
4
1.5
-0/+0.1
1.75
3.5
2
0.10 max.
6.25 min.
0.75 min.
4
2
D0
Distance
Distance (center to center)
Distance (center to center)
Cover tape thickness
Distance
Distance
Component pitch
0805/0603
0402
CAVITY SIZE
SEE NOTE 1
A0
CENTER LINES
OF CAVITY
E1
F
P2
T1
E2
G
P1
P1
User Direction of Feed
Tolerance
-.0.1/+0.3
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.1
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Upper side
Bottom side
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NB - NC 12
NB 21
NB 23
Suffix
BB
BF
BB
BF
Qty Per Reel
4000
2000
10000
5000
17
Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Wave
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
300
Preheat
Solder Temp.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
Termination
Type
AgPdPt
Nickel Barrier
NC
NB
Solder
Tin/Lead
60/40
60/40
Solder
Temp ºC
260 ± 5
260 ± 5
T
200
230ºC
to
250ºC
150
100
50
0
Immersion
Time Seconds
15 max
30 ± 1
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Natural
Cooling
250
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
Reflow
300
D2
RECOMMENDED
SOLDERING PAD
LAYOUT
Natural
Cooling
Preheat
Solder Temp.
250
200
D5
REFLOW SOLDERING
100
50
Case
Size
0
1min
1min
Temperature °C
0402
NB23
0603
NB21
0805
NB12
1206
NB20
D1
D2
D3
D4
D5
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
WAVE SOLDERING
50
100
150
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
18
P/N
10 sec. max
(Minimize soldering time)
300
250
200
150
100
50
0
0
D3
D4
Dimensions in
mm (inches)
220ºC
to
250ºC
150
D1
200
250
Time (s)
300
Case
Size
P/N
0603
NB21
0805
NB12
1206
NB20
D1
D2
D3
D4
D5
3.10
(.122)
4.00
(.157)
5.00
(.197)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.70
(.028)
1.00
(.039)
2.00
(.079)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.75
(.030)
1.25
(.049)
1.60
(.063)
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