Material Content Data Sheet Sales Product Name IPD90N10S4L-06 MA# MA000939132 Package PG-TO252-3-313 Issued 29. August 2013 Weight* 319.88 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 4.429 1.38 0.166 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.38 13845 13845 520 0.050 0.02 166.274 51.99 52.06 519807 156 520483 4.357 1.36 1.36 13620 13620 1.360 0.43 4252 23.801 7.44 110.846 34.65 42.52 346530 74408 425190 3.740 1.17 1.17 11692 11692 0.003 0.00 1.421 0.44 0.086 0.03 0.069 0.02 3.274 1.02 11 0.44 4441 214 1.07 10236 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4452 268 10718 1000000