TI1 BQ27210DRKRG4 Li-ion and li-pol battery gas gauge ic for portable application Datasheet

bq27010, bq27210
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
Li-Ion AND Li-Pol BATTERY GAS GAUGE IC FOR PORTABLE APPLICATIONS
(bqJUNIOR)
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– Ship: < 2 µA (bq27010 only)
– Hibernate: < 1.5 µA
– Data Retention: < 20 nA
2
HDQ (bq27010) or I C (bq27210)
Communication
Reports Accurate Time-to-Empty At Both
Measured and Host-Requested Load Values
Reports Available Capacity Compensated for
Discharge Rate, Temperature, and Age
End-of-Discharge Voltage Compensated for
Discharge Rate and Temperature
Automatic Capacity Reduction with Age
Reports Temperature, Voltage, and Current
High Accuracy Charge and Discharge Current
Integration with Automatic Offset Calibration
Requires No User Calibration
Programmable Input/Output Port
Internal User EEPROM Configuration Memory
Uploadable Coefficients Allows Host-Side Use
with Multiple Pack Characteristics
Stable Oscillator Without External
Components
Dynamic End-of-Discharge Detection Delay to
Allow Use in a High-Dynamic Load
Environment
Automatic Sleep Mode When Communication
Lines are Low
Available in a Small 3 mm x 4 mm QFN
Package
Five Low-Power Operating Modes
– Active: < 90 µA
– Sleep: < 2.5 µA
APPLICATIONS
•
•
•
•
•
•
PDA
Smart Phones
MP3 Players
Digital Cameras
Internet Appliances
Handheld Devices
DESCRIPTION
The bqJUNIOR™ series are highly accurate
stand-alone single-cell Li-Ion and Li-Pol battery
capacity monitoring and reporting devices targeted at
space-limited, portable applications. The IC monitors
a voltage drop across a small current sense resistor
connected in series with the battery to determine
charge and discharge activity of the battery.
Compensations for battery age, temperature,
self-discharge, and discharge rate are applied to the
capacity measurments to provide available
time-to-empty information across a wide range of
operating
conditions.
Battery
capacity
is
automatically recalibrated, or learned, in the course
of a discharge cycle from full to empty. Internal
registers include current, capacity, time-to-empty,
state-of-charge, cell temperature and voltage, status,
and more.
The bqJUNIOR can operate directly from single-cell
Li-Ion and Li-Pol batteries and communicates to the
system over a HDQ one-wire or I2C serial interface.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
bqJUNIOR is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
bq27010, bq27210
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
TYPICAL APPLICATION
PACK+
PGM TP
R3
1 kΩ
1
C4
0.1 µF
Li-Ion
or
Li-Pol
+
R4
10 kΩ
bq27010DRK
2
VCC
3
VSS
GPIO 9
R1
1 kΩ
SRP 8
C3
0.1 µF
C1
0.1 µF
4
R7
100 Ω
PGM 10
RBI
RS
0.02 Ω
SRN 7
D/C
R2
1 kΩ
R8
100 Ω
HDQ
5
HDQ
D2
5.6 V
BAT 6
C3
0.1 µF
C2
0.1 µF
11
ESD Protection
Li-Ion Protector
PACK−
UDG−04096
ORDERING INFORMATION
TA
COMMUNICATION INTERFACE
PACKAGED DEVICES (1)
MARKINGS
HDQ
bq27010DRKR
27010
I2C
bq27210DRKR
27210
-20°C to 70°C
(1)
The DRK package is available taped and reeled only. Quantities are 2,000 devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
bq27010
bq27210
VCC
VIN
2
Supply voltage
Input voltage
(with respect to VSS)
–0.3 to 7
SRP, SRN, RBI, BAT (all with respect to
VSS)
–0.3 to
VCC+0.3
HDQ, SCL, SDA, GPIO (all with respect to
VSS)
–0.3 to 7
PGM (with respect to VSS) during EEPROM
programming
–0.3 to 22
ISINK
Output sink current
TA
Operating free-air temperature range
GPIO, SCL, SDA, HDQ
–20 to 70
Tstg
Storage temperature range
–65 to 150
TJ
Operating junction temperature range
–40 to 125
Lead temperature (soldering, 10 sec)
300
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5
UNITS
V
mA
°C
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
VCC
Supply voltage
2.6
4.5
V
TA
Operating free-air temperature
–20
70
°C
–100
100
mV
Input voltage, SRP and SRN with respect to VSS
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
GENERAL
ICC(VCC)
Active current
ICC(SLP)
Sleep current
ICC(SHP)
Ship current (bq27010 only)
ICC(POR)
Hibernate current
RBI current
V(POR)
52
90
1.0
2.5
0.9
2.0
0 < VCC < 1.5 V
0.6
1.5
RBI pin only, VCC <
VCC(POR)
<1
20
VBAT = VCC
POR threshold
2.0
Input impedance
BAT, SRN, SRP
Pull-down current
HDQ, SCL, SDA
2.6
10
µA
nA
V
MΩ
2.7
4.5
µA
0.7
V
HDQ, SCL, SDA and GPIO
VIH
High-level input voltage
VIL
Low-level input voltage
VOL
VCC < 4.2 V
1.5
VCC > 4.2 V
1.7
Low-level output voltage (GPIO)
IOL = 1 mA
0.4
Low-level output voltage (HDQ, SCL, SDA)
IOL = 2 mA
0.4
VOLTAGE AND TEMPERATURE MEASUREMENT
Measurement range
VCC = V(BAT)
2.6
Reported voltage resolution
4.5
2.7
Reported accuacy
-25
25
Voltage update time
2.56
Reported temperature resolution
0.25
Reported temperature accuracy
-3
Temperature update time
V
mV
s
3
2.56
°K
s
TIME, CURRENT AND CAPACITY (3.0 V ≤ VCC≤ 4.2 V, 0°C ≤ TA≤ 50°C)
fOSC
Internal oscillator frequency
-2.2%
1.5%
Current gain variability
-0.5%
0.5%
Coulometric gain variability
-1.7%
Coulomb counter input offset (1)
-15
VSRP-VSRN differential input
0.5%
0
–100
15
µV
100
mV
EEPROM PROGRAMMING ( VCC≥ 3.0 V, -20°C ≤ TA≤ 35°C) (2)
(1)
(2)
Programming voltage rise time
0.5
1.5
ms
Programming voltage high time
10
100
ms
Programming voltage fall time
0.5
1.5
ms
20
22
V
15
mA
Programming voltage
Applied to PGM pin
EEPROM programming current
VPROGRAM = 21 V
Excludes contributions to the offset due to PCB layout or other factors external to the bq27010/bq27210.
Maximum number of programming cycles on the EEPROM is 10 and data retention time is 10 years at TA = 85°C.
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STANDARD HDQ SERIAL COMMUNICATION TIMING (bq27010 only)
t(B)
Break timing
t(BR)
Break recovery
190
40
t(CYCH)
Host bit window
190
t(HW1)
Host sends 1
0.5
50
t(HW0)
Host sends 0
86
145
t(RSPS)
bqJUNIOR to host response
190
320
t(CYCD)
bqJUNIOR bit window
190
250
t(DW1)
bqJUNIOR sends 1
32
50
t(DW0)
bqJUNIOR sends 0
80
145
µs
STANDARD I2C SERIAL COMMUNICATION TIMING (bq27210 only - Product Preview Data)
4
tr
SCL/SDA rise time
tf
SCL/SDA fall time
tw(H)
SCL pulse width (high)
tw(L)
SCL pulse width (low)
4.7
tsu(STA)
Setup for repeated start
4.7
td(STA)
Start to first falling edge of SCL
tsu(DAT)
Data setup time
250
th(DAT)
Data hold time
300
tsu(STOP)
Setup time for stop
t(BUF)
Bus free time between stop and start
f(SCL)
Clock frequency
t(BUSERR)
Bus error timeout
1
µs
300
ns
4
µs
4
ns
4
17.3
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µs
4.7
100
kHz
21.2
s
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
TIMING DIAGRAMS
t(BR)
t(B)
(a) Break and Break Recovery
t(HW1)
t(DW1)
t(DW0)
t(HW0)
t(CYCH)
t(CYCD)
(b) Host Transmitted Bit
Break
(c) bqJUNIOR Transmitted Bit
1-Bit
R/W
7−Bit Address
8−Bit Data
t(RSPS)
UDG−03039
(d) bqJUNIOR to Host Response
Figure 1. HDQ Bit Timing Diagram
tsu(STA)
tw(H)
tf
tw(L)
tr
t(BUF)
SCL
SDA
td(STA)
tr
tf
th(DAT)
tsu(STOP)
tsu(DAT)
REPEATED
START
STOP
START
UDG−04122
Figure 2. I2C Timing Diagram
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TIMING DIAGRAMS (continued)
BQ27010
DRK PACKAGE
(BOTTOM VIEW)
BQ27210
DRK PACKAGE
(BOTTOM VIEW)
RBI
VCC
VSS
D/C
HDQ
RBI
VCC
VSS
SCL
SDA
1
2
3
4
5
1
2
3
4
5
bq27010DRK
bq27210DRK
11
10
9
11
8
PGM GPIO SRP
7
6
10
SRN
BAT
9
PGM GPIO SRP
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
bq27010
bq27210
(Preview)
I/O
BAT
6
6
I
Battery voltage sense input
D/C
4
-
-
Do not connect. Must be left floating or tied to VSS
GPIO
9
9
I/O
General purpose input/output
HDQ
5
-
I/O
Single wire HDQ serial interface
PGM
10
10
I
EEPROM programming voltage input
RBI
1
1
I
Register back-up input
SCL
-
4
I
Serial clock input (I2C)
SDA
-
5
I/O
Serial data input (I2C)
SRN
7
7
I
Current sense input (negative)
SRP
8
8
I
Current sense input (positive)
VCC
2
2
I
VCC supply input
NAME
6
8
DESCRIPTION
VSS
3
3
-
Ground input
VSS
11
11
-
Ground shield
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7
6
SRN
BAT
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
FUNCTIONAL BLOCK DIAGRAMS
bq27010
VCC
Bandgap,
Reference
and Bias
2
Temperature
Compensated
Precision Oscillator
Clock
Generator
EEPROM
5
HDQ
9
GPIO
System I/O
and Control
SCPU
SRP
8
SRN
7
10 RGM
Autocalibration
and
Autocompensating
Coulomb Counter
RAM
Temperature
Sensor
BAT
1
RBI
3
VSS
ADC
6
UDG−03040
bq27210
VCC
2
Bandgap,
Reference
and Bias
Temperature
Compensated
Precision Oscillator
Clock
Generator
EEPROM
System I/O
and Control
4
SCL
5
SDA
9
GPIO
SCPU
SRP
8
SRN
7
10 RGM
Autocalibration and
Autocompensating
Coulomb Counter
Temperature
Sensor
BAT
RAM
1
RBI
3
VSS
ADC
6
UDG−04123
FUNCTIONAL DESCRIPTION
The bqJUNIOR determines battery capacity by monitoring the amount of charge input to or removed from a
Li-Ion or Li-Pol battery. The bqJUNIOR measures discharge and charge currents, monitors the battery for low
voltage thresholds, and compensates for self-discharge, aging, temperature, and discharge rate. Current is
measured across a small value series resistor between the negative terminal of the battery and the pack ground
(see RS in Figure 3). Available capacity is reported with a resolution of 3.57 µVh. Time-To-Empty reporting in
minutes at standby, actual, and at-rate currents allows the requirements for host-based calculations to be greatly
reduced or eliminated; reading a single register pair provides useful and meaningful information to the end user
of the application.
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
FUNCTIONAL DESCRIPTION (continued)
Figure 3 shows a typical application circuit. Differential sense of the voltage across the current sense resistor,
RS, improves device performance, leading to an improvement in reported time-to-empty accuracy. An internal
3-µA pull-down on the HDQ or SDA and SCL lines ensures that the device detects a logic 0 on the
communication lines and allows the device to automatically enter the low-power sleep mode when the system
power is switched off or the pack is removed. A 100 kΩ pullup to VCC can be added to the communication lines if
this feature needs to be disabled. The bqJUNIOR can operate directly from a single Li-Ion or Li-Pol cell.
PACK+
PGM TP
R3
1 kΩ
1
C4
0.1 µF
GPIO 9
VCC
R1
1 kΩ
3
VSS
C1
0.1 µF
SRN 7
D/C
5
D2
5.6 V
ESD Protection
RS
0.02 Ω
R2
1 kΩ
R8
100 Ω
HDQ
Li-Ion
or
Li-Pol
SRP 8
4
R7
100 Ω
+
R4
10 kΩ
bq27010DRK
2
C3
0.1 µF
PGM 10
RBI
HDQ
BAT 6
C3
0.1 µF
C2
0.1 µF
11
Li-Ion Protector
PACK−
UDG−04096
Figure 3. Typical Application Circuit (bq27010)
Measurements
As shown in the functional block diagram, the bqJUNIOR uses a dedicated fully differential Delta-Sigma
Coulomb Counter (DSCC) for charge and discharge current and coulometric measurements and an
analog-to-digital converter (ADC) for battery voltage and temperature measurements. Both DSCC and ADC are
automatically compensated for offset. No user calibration or compensation is required. An EEPROM offset value
can be programmed to compensate for contributions to the DSCC offset due to the PCB layout.
Charge and Discharge Coulometric and Current Measurements
The bqJUNIOR uses a DSCC to perform a continuous integration of the voltage waveform across a small value
sense resistor in the negative lead of the battery, as shown in Figure 3. The integration of the voltage across the
sense resistor is the charge added or removed from the battery. Because the DSCC does a direct integration of
the waveform, the shape of the current waveform through the sense resistor does not have any effect on the
coulometric measurement accuracy. The low-pass filter that feeds the sense resistor voltage to the bqJUNIOR
SRP and SRN inputs filters out system noise and does not affect the coulometric measurement accuracy,
because the low-pass filter does not change the integrated value of the waveform. The bqJUNIOR also uses the
DSCC to measure current. The reported current is determined by the average voltage across the sense resistor
over a 5.12 second interval.
8
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SLUS707B – APRIL 2006 – REVISED JANUARY 2007
FUNCTIONAL DESCRIPTION (continued)
Offset Calibration
The offset voltage of the DSCC measurement must be very low to be able to measure small signal levels
accurately. The bqJUNIOR provides an auto-calibration feature to cancel the internal voltage offset error across
SRP and SRN for maximum charge measurement accuracy. NO CALIBRATION IS REQUIRED. External
voltage offset error caused by the PCB layout cannot be automatically calibrated out by the gauge, but the
external offset can be determined using a built-in user offset measurement command and can be programmed
into the EEPROM for inclusion in the offset compensation performed by the gauge. See the Layout
Considerations section for details on minimizing PCB induced offset across the SRP and SRN pins.
The bqJUNIOR auto-calibration of the DSCC offset is performed from time-to-time as operating conditions
change, to keep the measurement error small. A Calibration-In-Progress (CALIP) flag is set in FLAGS to indicate
when the operation occurs. Capacity, voltage, and temperature is updated during the 5.12 second offset
calibration time, but other parameters are not updated until the calibration has completed. When there is a full
reset, the gauge makes an initial quick offset calibration and delays the 5.12 second full offset calibration for at
least 40 seconds. This is done to prevent the full 5.12 second calibration operation from interfering with module
test functions that need to be performed immediately after power application during manufacturing test. The
quick offset calibration after a full reset is a 1.28 second offset measurment used as a delay, followed by a 1.28
second offset measurement that is used as the initial offset value. The 1.28 second delay allows VCC to settle
before the initial offset measurement. If manufacturing test does not need the additional VCC settling time or can
use a slightly worse initial offset measurement, the tester may write bit 0 of CTRL (address 0x00) to 1 during the
first 1.28 seconds after the reset and the first offset sample will be used, cutting the initial quick offset calibration
time in half.
Digital Magnitude Filter
The Digital Magnitude Filter (DMF) threshold can be set in EEPROM to indicate a threshold below which any
charge or discharge accumulation is ignored. This allows setting a threshold above the maximum DSCC offset
expected from the IC and PCB combination, so that when no charge or discharge current is present, the
measured capacity change by the bqJUNIOR is zero. Note that even a small offset can add up to a large error
over a long period. In addition to setting the threshold above the largest offset expected, the DMF should be set
below the minimum signal level to be measured. The sense resistor value should be large enough to allow the
minimum current level to provide a signal level substantially higher than the maximum offset voltage.
Conversely, the sense resistor must be small enough to meet the system requirement for insertion loss as well
as keep the maximum voltage across the sense resistor below the 100 mV maximum that the DSCC can
accurately measure.
The DMF threshold is programmed in EEPROM in increments of 4.9 µV. Programming a zero in the DMF value
will disable the DMF function and all non-zero DSCC measurements are counted.
Voltage
The bqJUNIOR monitors the battery voltage through the BAT pin and reports an offset corrected value through
the internal registers. The bqJUNIOR also monitors the voltage for the end-of-discharge (EDV) thresholds. The
EDV threshold levels are used to determine when the battery has been discharged to 6.25% or empty and
synchronizes the reported capacity to these levels when the programmed EDV thresholds are detected.
Temperature
The bqJUNIOR uses an integrated temperature sensor to monitor the pack temperature and is reported through
the internal registers. The temperature measurement is used to adjust compensated available capacity and
self-discharge capacity loss.
RBI Input
The Register Backup Current (RBI) input pin is used with an external capacitor to provide backup potential to the
internal registers when VCC drops below V(POR). VCC is output on RBI through an internal FET switch when VCC is
above V(POR), charging the capacitor. If VCC drops below V(POR), the FET switch from VCC is opened and the
capacitor can supply the small data retention current to the internal registers to retain the data content while VCC
is absent. Register data will be maintained as long as the RBI voltage remains above 1.3 V.
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FUNCTIONAL DESCRIPTION (continued)
Register Initialization and Data Integrity Checks
Checksums of critical internal register data are continually checked during operation of the bqJUNIOR. A failed
checksum comparison will force a hardware reset. After a reset, the bqJUNIOR examines a checksum
containing LMD, CYCL, CYCT, and other critical data. If the checksum is incorrect, NAC, CYCL, and CYCT are
cleared, LMD and other parameters are initialized from EEPROM, the CI bit in FLAGS is set, and the INIT bit in
MODE is set. This process constitutes a full reset. If the checksum is correct, NAC, LMD, CYCL, and CYCT are
retained. In addition, a second checksum containing all user-updateable EEPROM coefficients is checked. If the
second checksum is incorrect, the values are all initialized from the EEPROM, the CI bit in FLAGS is set, and
the INIT bit in MODE is set. The INIT bit is used to inform the host that it may need to reinitialize these values if
the default values are not satisfactory. If the second checksum is correct, the INIT bit in MODE will not be set,
the CI bit in FLAGS will remain unchanged, and the register data that may have been updated by the host will
be retained. This process constitutes a partial reset. It is the host responsibility to clear the INIT bit in MODE
after any updates by the host are completed. See CTRL description for more on host updates. Other register
values not specifically retained are reinitialized on all resets.
GPIO
The GPIO pin can be used as an input or an output. The initial state can be established by programming bit 7 in
the PKCFG EEPROM location. The input/output state can be changed at any time by changing the value in bit 7
of MODE. If unused, the GPIO pin should be tied to VSS.
Layout Considerations
The auto-calibrating DSCC approach effectively cancels the internal offset voltage within the bqJUNIOR, but any
external offset caused by PCB layout must be programmed in the EEPROM to be cancelled. The magnitude and
variability of the external offset makes it critical to pay special attention to the PCB layout. To obtain optimal
performance, the decoupling capacitor from VCC to VSS and the filter capacitors from SRP and SRN to VSS
should be placed as closely as possible to the bqJUNIOR, with short trace runs to both signal and VSS pins. All
low-current VSS connections should be kept separate from the high-current discharge path from the battery and
should tie into the high-current trace at a point directly next to the sense resistor. This should be a trace
connection to the edge or inside of the sense resistor connection, so that no part of the VSS interconnections
carry any load current and no portion of the high-current PCB trace is included in the effective sense resistor
(i.e. Kelvin connection).
Gas Gauge Operation
Figure 4 illustrates an operational overview of the gas gauge function.
The bqJUNIOR reports uncompensated nominal available capacity (NAC), uncompensated last measured
discharge (LMD), compensated available capacity (CAC), and full charge compensated available capacity
(FCAC). The compensated CAC and FCAC values are reduced from their respective uncompensated NAC and
LMD values by an amount that varies with discharge rate, temperature, and cycle count (age). CAC and FCAC
will equal their respective uncompensated NAC and LMD values at light loads and when charging.
The bqJUNIOR learns the capacity of the battery during actual use conditions and will update LMD when a valid
learning cycle occurs. The bqJUNIOR learns the capacity of the battery by measuring the capacity removed
from the battery when it is discharged from full (NAC = LMD) to the first end-of-discharge (EDV1) voltage
threshold without any learning cycle disqualifying event. The EDV1 threshold should be programmed to a value
determined from battery characterization that affords 6.25% of design capacity (DC) remaining before the battery
reaches zero capacity. The measured discharge capacity plus 6.25% of DC is the measured full capacity during
actual use (compensated) conditions. LMD will be updated with the measured discharge plus 6.25% of DC plus
the capacity compensation value due to discharge rate, temperature, and age. Thus the compensated FCAC
value, with the capacity compensation subtracted from it, will match the measured discharge capacity plus the
6.25% of DC unmeasured discharge capacity. The final end-of-discharge (EDVF) threshold is a fixed value and
should be set at a voltage that the system sees as the zero-capacity battery voltage. The bqJUNIOR does not
learn the capacity between the EDV1 and EDVF thresholds, so the EDV1 threshold should be based on actual
battery characterization. The EDV1 threshold can be compensated with discharge rate and temperature to
maintain the 6.25% remaining capacity with different use profiles.
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FUNCTIONAL DESCRIPTION (continued)
When the battery is charged to full (NAC = LMD), the valid discharge flag (VDQ) bit in FLAGS will be set. It will
remain set during the subsequent discharge until the learning discharge cycle completes or an event occurs that
disqualifies the learning cycle. When the battery is discharged to the condition where VOLT ≤ EDV1 threshold,
the learning cycle will terminate and LMD will be updated if VDQ is still set. The bqJUNIOR EDV detection is
designed to prevent premature detection of the EDV threshold due to dynamic load variations. EDV detection
has a dynamically adjusted delay of up to 21.5 seconds with CSOC ≥ 6% and down to 3 seconds when CSOC =
0%. To prevent a severe reduction in LMD due to some abnormal situation, the new LMD value is restricted to a
learn-down maximum of DC/8 during any single learning cycle. When the learning cycle completes, LMD is
updated and the capacity inaccurate (CI) bit in FLAGS is cleared. The CI bit will remain cleared unless there is a
full reset (reset with RAM corruption detected) or the cycle count since the last learning cycle (CYCL) reaches a
count of 32.
A learning cycle can be disqualified by any of the following conditions:
1. Cold temperature: Temperature < 0°C when the EDV1 threshold voltage is reached.
2. Light load: A capacity learning cycle is disqualified if average current is less than or equal to 2 times the
initial standby load when the EDV1 threshold voltage is reached.
3. Excessive charging: Cumulative Charge > 255 NAC counts (910 µVh) during a learning discharge cycle
(alternating discharge/charge/discharge before EDV1 is set).
4. Reset: VDQ is cleared on all resets.
5. Excessive self-discharge: NAC reduction from self-discharge estimate (0.195%) performed 64 times.
6. Self-discharge at termination of learning cycle. If self-discharge estimate causes CAC ≤ DC/16, VDQ is
cleared.
NAC is adjusted by charge and discharge coulometric measurements except when battery full or empty
conditions are detected. NAC = LMD is forced when IMIN = 1 (full detection) unless Temperature ≤
TCOMP[2:0]*2 (°C). During a discharge with VDQ = 1, CAC is not allowed to drop below DC/16 until EDV1 = 1.
If EDV1 = 1 occurs when CAC > DC/16, CAC = DC/16 will be forced. CAC = 0 is forced if EDVF = 1.
INPUTS
Charge
Current
Discharge
Current
Self−Discharge
Timer
Temperature
Compensation
+
COMPUTATIONS
_
_
_
Nominal Available
Charge (NAC)
Last Measured
Discharge (LMD)
Qualified
Transfer
Rate, Age, and
Temperature
Compensation
+
+
Learning Count
Register (LCR)
Temperature, V oltage,
Average Current,
Other Data
OUTPUTS
Compensated
Available Charge
I2C or HDQ Interface
UDG−03042
Figure 4. Operational Overview
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FUNCTIONAL DESCRIPTION (continued)
Register Interface
The bqJUNIOR stores all calculated information in RAM, which is backed up by the voltage on the RBI input.
EEPROM registers store permanent user data. The memory map for bq27010/bq27210 is shown in Table 1.
Table 1. bq27010/bq27210 Memory Map
ADDRESS
NAME
FUNCTION
UNITS
ACCESS
0x7F
TCOMP
Temperature Compensation Constants, OR, ID#1
R/W
0x7E
DCOMP
Discharge Rate Compensation Constants, OR, ID#2
R/W
0x7D
GAF/DEDV
Gain Age Factor / EDVI Rate Compensation
R/W
0x7C
PKCFG
Pack Configuration Values
0x7B
TAPER
LMD Aging Enable, Charge Termination Taper Current
0x7A
DMFSD
Digital Magnitude Filter and Self-Discharge Rate Constants
R/W
0x79
ISLC/EDVT
Initial Standby Load Current / EDVI Temperature Compensation
R/W
0x78
SEDV1
Scaled EDV1 Threshold
R/W
0x77
SEDVF
Scaled EDVF Threshold
EEPROM Registers
0x76
ILMD
0x6F - 0x75
-
Initial Last Measured Discharge High Byte
0x6E
EE_EN
0x2D - 0x6D
-
0x2C
CSOC
Compensated State-of-Charge
0x2B - 0x2A
CYCT
Cycle Count Total High - Low Byte
0x29 - 0x28
CYCL
0x27 - 0x26
TTECP
0x25 - 0x22
RSVD
Reserved
R/W
228 µV (1)
R/W
R/W
914
µVh(1)
RESERVED
R/W
R
EEPROM Program Enable
R/W
RESERVED
R
RAM Registers
(1)
12
%
R
Cycles
R
Cycle Count Since Learning Cycle High - Low Byte
Cycles
R
Time-to-Empty At Constant Power High - Low Byte
Minutes
R
R
0x21 - 0x20
CEDV
Compensated EDV Threshold High - Low Byte
0x1F - 0x1E
RSVD
Reserved
0x1D - 0x1C
STTE
Standby Time-to-Empty High - Low Byte
0x1B - 0x1A
SI
mV
R
R
Standby Current High - Low Byte
Minutes
R
3.57 µV(1)
R
0x19 - 0x18
TTF
Time-to-Full High - Low Byte
Minutes
R
0x17 - 0x16
TTE
Time-to-Empty High - Low Byte
Minutes
R
0x15 - 0x14
AI
3.57 µV(1)
R
µVh(1)
R
Average Current High - Low Byte
0x13 - 0x12
FCAC
Full Compensated Available Capacity High - Low Byte
3.57
0x11 - 0x10
CAC
Compensated Available Capacity High - Low Byte
3.57 µVh(1)
R
0x0F - 0x0E
LMD
Last Measured Discharge High - Low Byte
3.57 µVh(1)
R
µVh(1)
R
%
R
0x0D - 0x0C
NAC
0x0B
RSOC
Nominal Available Capacity High - Low Byte
Relative State-of-Charge
3.57
0x0A
FLAGS
Status Flags
0x09 - 0x08
VOLT
Reported Voltage High - Low Byte
0x07 - 0x06
TEMP
0x05 - 0x04
ARTTE
0x03 - 0x02
AR
0x01
MODE
Device Mode Register
R/W
0x00
CTRL
Device Control Register
R/W
R
mV
R
Reported Temperature High - Low Byte
0.25 °K
R
At-Rate Time-to-Empty High - Low Byte
Minutes
R
3.57 µV(1)
R/W
At-Rate High - Low Byte
Divide by Rs in milliohms to convert µV to mA or µVh to mAh.
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APPLICATION INFORMATION
Control and MODE Registers (CTRL/MODE) — Address 0x00/0x01
The device control register is used by the host system to request special operations by the bqJUNIOR. The
highest priority command set in the MODE register is performed when the host writes data 0xA9, 0x56, or 0xC5
as indicated to the control register. The CTRL register and MODE bits 5, 4, 3, 1, and 0 are cleared when the
command is accepted. The host must set the appropriate command bit in MODE before sending the command
key to CTRL.
Mode Register (MODE) — Address 0x01
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
COMMAND KEY = 0xA9
GPIEN
GPSTAT
WRTNAC
DONE
PRST
INIT
FRST
SHIP (1)
COMMAND KEY = 0x56
GPIEN
GPSTAT
CEO
CIO
WNACCI
INIT
WRTCYC
WRTLMD
COMMAND KEY = 0xC5
GPIEN
GPSTAT
UPDC
UPEDVI
UPDMF
INIT
UPCFG
UPCOMP
(1)
bq27010 only
GPIEN
GPIEN sets the state of the GPIO pin. A 1 configures the GPIO pin as input, while a 0 configures
the GPIO pin as an open-drain output. This bit is initialized to the value of bit 7 of the PKCFG
register in the EEPROM. The user should keep this bit set or cleared as desired when other bits in
this register are written.
GPSTAT
GPSTAT sets the state of the open drain output of the GPIO pin (GPIEN = 0). A 1 turns off the
open drain output, while a 0 turns the output on. This bit is set to 1 on POR. When the GPIO pin is
an input (GPIEN=1), this bit returns the logic state of the GPIO pin. The user should keep this bit
set or cleared as desired when other bits in this register are written.
WRTNAC
WRTNAC is used to transfer data from the AR registers to NAC. Other registers are updated as
appropriate. This command is useful during the pack manufacture and test to initialize the gauge to
match the estimated battery capacity.
DONE
DONE is used to write NAC equal to LMD. Useful if the host uses a charge termination method
that does not allow the monitor to detect the taper current. The host system could use this
command when the charging is complete to force update of internal registers to a full battery
condition.
PRST
Partial reset. This command requests a reset of all RAM registers except NAC, LMD, and the CI bit
in FLAGS. This command is intended for manufacturing use.
INIT
The INIT status bit is set to 1 by the bqJUNIOR if there is a full reset or if data corruption is
detected in the internal memory containing EEPROM coefficients. Either of these events will cause
the bqJUNIOR to update internal memory values. If NAC, LMD, CYCT, or EEPROM-initialized
coefficients need to be modified from their original values, the host should first update the values
and then clear the INIT bit. The INIT bit is not cleared by the bqJUNIOR.
FRST
Full reset. This command bit requests a full reset. A full reset reinitializes all RAM registers,
including the NAC, LMD, and FLAGS registers. This command is intended for manufacturing use.
SHIP
This command bit requests that the device (bq27010 only) should be put in ship mode. See the
Power Mode section for a description of the ship mode. This command is intended for
manufacturing use.
CEO
This command bit requests that the external offset value is measured. Care should be taken to
insure that no charge or discharge current flows during the time this measurement is made. The
external offset value is the total offset of the DSCC plus any external PCB affects. The result can
be read in 0x5f-5e. The result is a signed number with an LSB value of 1.225 µV. The command
takes approximately 5.5 seconds to make the measurement. This command is intended for
manufacturing use. The CIO offset value may be subtracted from the CEO offset value to
determine the external board offset. This value can be programmed into PKCFG[4:2] in the
EEPROM for automatic compensation of this external offset value.
CIO
This command bit requests that the internal offset value is measured. The internal offset value is
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the offset of the DSCC with an internal short applied from SRP to SRN. The result can be read in
0x5f-5e. The result is a signed number with an LSB value of 1.225 µV. The command takes
approximately 5.5 seconds to make the measurement. This command is intended for
manufacturing use, along with the CEO command, to determine the external board offset..
WNACCI
WNACCI is used to transfer data from the AR registers to NAC. It is identical to the WRTNAC
command, but the CI bit in FLAGS is also cleared
The following commands are intended for use by a host-side gauge if the battery pack is changed and the host
can determine that the new pack requires different values loaded into the gauge. They can also be used with a
pack-side gauge if the default EEPROM values in the bqJUNIOR do not match the required values. If the host
only desires to change one of the bytes, the value for the unchanging byte will still have to be read and placed in
the appropriate AR byte, as both bytes will be updated when the command is issued. The EEPROM values used
by the bq27x010 firmware are located in addresses 0x46 to 0x4F. These addresses are a mirror of the
EEPROM values programmed in addresses 0x76 to 0x7F after a full reset, unless DCOMP and/or TCOMP
default values are selected by PKCFG[1:0]. Update commands for the EEPROM coefficients will update the
appropriate value in the 0x46 to 0x4F address space, but will not affect the value in the 0x76 to 0x7F addresses.
WRTCYC
WRTCYC is used to transfer data from the AR registers to CYCT.
WRTLMD
WRTLMD is used to transfer data from the AR registers to LMD.
UPDC
UPDC is used to simultaneously update the ILMD value (DC) from the ARL register and to update
the EDVF value from the ARH register.
UPEDV1
UPEDV1 is used to simultaneously update the EDV1 value from the ARL register and to update
the ISLC/EDVT value from the ARH register.
UPDMF
UPDMF is used to simultaneously update the DMFSD value from the ARL register and to update
the TAPER value from the ARH register.
UPCFG
UPCFG is used to simultaneously update the PKCFG value from the ARL register and to update
the GAF/DEDV value from the ARH register.
UPCOMP
UPCOMP is used to simultaneously update the DCOMP value from the ARL register and to update
the TCOMP value from the ARH register.
At-Rate Registers (ARL/ARH) — Address 0x02/0x03
The host can write the current in units of 3.57 µV per bit to this register for predictive calculation time-to-empty.
The part uses this value to predict the time-to-empty at any desired current; it does not affect the time-to-empty
calculation based on the actual current. The value in AR is always assumed to be a discharge current.
This register is also used during pack manufacturing to input a nominal available-charge value to set NAC to the
approximate initial pack capacity value, and to update other values as described in the CTRL register
description.
At Rate Time-to-Empty Registers (ARTTEL/ARTTEH) — Address 0x04/0x05
This is predicted time-to-empty in minutes at user-entered discharge rate. The discharge current used in the
calculation is entered by the host system in the AR registers. The at-rate capacity (ARCAP) value used can be
larger or smaller than CAC. It is computed using the same compensation formulas as CAC, except the
discharge compensation is computed using AR, instead of AI, for the discharge rate. The equation used to
compute at-rate time-to-empty is:
ARTTE = 60 * ARCAP / AR
The host system has read-only access to this register pair.
Reported Temperature Registers (TEMPL/TEMPH) — Address 0x06/0x07
The TEMPH and the TEMPL registers contain the reported die temperature. The temperature is expressed in
units of 0.25 °K and is updated every 2.56 seconds. The equation to calculate reported pack temperature is:
Temperature = 0.25 * (256 * TEMPH + TEMPL)
The host system has read-only access to this register pair.
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Reported Battery Voltage Registers (VOLTL/VOLTH) — Address 0x08/0x09
The VOLTH and the VOLTL low-byte registers contain the reported battery voltage measured on the BAT pin.
Voltage is expressed in mV with an LSB resolution of 1 mV. Reported voltage cannot exceed 5000 mV. The
host system has read-only access to this register pair. Voltage is updated every 2.56 seconds.
Status Flag Register (FLAGS) — Address 0x0A
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
NAME
CHGS
NOACT
IMIN
CI
CALIP
VDQ
EDV1
EDVF
POR STATUS
0
0
0
1
0
0
0
0
CHGS
Charge State flag. A 1 in the CHGS indicates a charge current (VSRP > VSRN). A 0 indicates a lack
of charge activity. This bit should be read when the host system reads the Average Current
register pair to determine the sign of the average current magnitude. This bit is cleared to 0 on all
resets.
NOACT
No Activity flag. A 1 indicates that the voltage across RS is less than the digital magnitude filter.
See the Digital Magnitude Filter section for more information. This bit is cleared to 0 on all resets.
IMIN
Li-ion taper current detection flag. A 1 indicates that the charge current has tapered to less than
the value set in EEPROM and that the battery voltage is greater than or equal to the value
selected by the QV0 and QV1 bits in the PKCFG register (see EEPROM Data Register description
for more details). Taper current detection is disqualified if AI < 8 (28.6 µV across sense resistor).
The taper detection conditions must be maintained for 4 successive average current
measurements (20-25 s) to qualify as a valid taper current detection. This bit is cleared to 0 on all
resets.
CI
Capacity Inaccurate flag. A 1 indicates that the firmware has not been through a valid learning
cycle and is basing all calculations on initial design values programmed into EEPROM or that there
have been at least 32 cycle-count increments since the last learning cycle. This bit is cleared only
on a LMD update following a learning cycle. This bit is set to 1 on a full reset. The previous value
is retained if no RAM corruption is detected after a reset.
CALIP
Calibration-In-Progress flag. This flag is set whenever an automatic or commanded offset
calibration measurement is being made. This bit is set to 0 on all resets.
VDQ
Valid Discharge flag. A 1 indicates that the bqJUNIOR has met all necessary requirements for the
firmware to learn the battery capacity. This bit clears to 0 on a LMD update or condition that
disqualifies a learning cycle. This bit is cleared to 0 on all resets.
EDV1
First End-of-Discharge-Voltage flag. A 1 indicates that the voltage on the BAT pin is less than or
equal to the EDV1 threshold voltage. LMD updates immediately if the VDQ bit is set when this bit
transitions from 0 to 1. This bit is cleared when charging and on all resets.
EDVF
Final End-of-Discharge-Voltage flag. A 1 indicates that the voltage on the BAT pin is less than or
equal to the EDVF threshold voltage. This bit is cleared when charging and on all resets.
The host system has read-only access to this register.
Relative State-of-Charge (RSOC) — Address 0x0B
RSOC reports the nominal available capacity as a percentage of the last measured discharge value (LMD). The
equation is:
RSOC (%) = 100 * NAC/LMD
The host system has read-only access to this register.
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Nominal Available Capacity Registers (NACL/NACH) — Address 0x0C/0x0D
This register pair reports the light-load, or uncompensated, capacity available from the battery. NAC increments
during charge (VSRP > VSRN) if Voltage > EDVF threshold and decrements during discharge (VSRP < VSRN). The
NAC registers are cleared by a reset if RAM corruption is detected. The register value is retained after a reset if
RAM corruption is not detected. The host system has read-only access to this register pair. NAC is reported in
units of 3.57 µVh per count.
Last Measured Discharge Registers (LMDL/LMDH) – Address 0x0E/0x0F
This register pair reports the light load, or uncompensated, capacity available from the battery when fully
charged. This value is updated after a valid learning cycle, which occurs when the battery is discharged from
fully charged (NAC = LMD) until the EDV1 voltage threshold is detected (EDV1 = 1) without any learning cycle
disqualifying event (VDQ = 1 during entire discharge). LMD will be updated with the measured capacity removed
from the battery during the discharge until the EDV1 threshold is reached plus 6.25% of design capacity (the
unmeasured capacity from EDV1 until the EDVF zero capacity threshold voltage) plus the computed capacity
compensation reduction due to discharge rate, temperature, and age. The host system has read-only access to
this register pair. LMD is reported in units of 3.57 µVh per count.
Compensated Available Capacity (CACL/CACH) – Address 0x10/0x11
This register pair reports the available capacity in the battery at the present discharge rate, temperature, and
age. CAC is equal to NAC minus the capacity compensation reduction based on the compensation coefficients
programmed in DCOMP (discharge compensation coefficients), TCOMP (temperature compensation
coefficients), and GAF/DEDV (gain age compensation coefficient). All compensations are impedance-based and
CAC will equal NAC at very low currents. However, CAC is not allowed to increase as long as there is no
charging current. If the discharge load is reduced, CAC may stop decrementing even though NAC continues to
decrement. When NAC drops sufficiently that the NAC minus CAC difference is equal to the discharge
compensation at the reduced load current, CAC will again start decrementing. CAC will equal NAC when
charging. The host system has read-only access to this register pair. CAC is reported in units of 3.57 µVh per
count.
Fully-Charged Compensated Available Capacity (FCACL/FCACH) – Address 0x12/0x13
This register pair reports the fully-charged capacity of the battery at the present discharge rate, temperature, and
age. FCAC is equal to LMD minus the capacity compensation reduction based on the compensation coefficients
programmed in DCOMP (discharge compensation coefficients), TCOMP (temperature compensation
coefficients), and GAF/DEDV (gain age compensation coefficient). All compensations are impedance-based and
FCAC will converge to LMD as the measured discharge current approaches zero. FCAC will equal LMD when
charging. The host system has read-only access to this register pair. FCAC is reported in units of 3.57 µVh per
count.
Average Current Registers (AIL/AIH) — Address 0x14/0x15
This register pair reports the magnitude of the average current through the sense resistor. The value is reported
with a resolution of 3.57 µV per count. Use the following equation to convert the value to mA, where RS is the
sense resistor value in milliohms:
Average Current = (256 * AIH + AIL) * 3.57 / RS
The current reported is an average over the last 5.12 seconds. The host system has read-only access to this
register pair.
Time-to-Empty Registers (TTEL/TTEH) — Address 0x16/0x17
This register pair reports calculated time-to-empty at the measured discharge rate. This value is based on the
temperature and discharge rate compensated available charge and the average current. The equation to
calculate TTE is:
TTE = 60 * CAC / AI
TTE is reported in minutes. The host system has read-only access to this register pair.
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Time-to-Full Registers (TTFL/TTFH) — Address 0x18/0x19
This register pair reports calculated time-to-full at the measured charge rate. The time computed at the average
current charge rate is extended by 50% to estimate the effect of the current taper. TTF is reported in minutes.
The equation for TTF is:
TTF = 60 * 1.50 * (LMD-NAC) / AI
The host system has read-only access to this register pair.
Standby Current Registers (SIL/SIH) — Address 0x1A/0x1B
This register pair reports measured standby current through the sense resistor. The standby current is an
adaptive measurement. Initially, the register pair reports the standby current programmed in EEPROM and after
spending some time in standby, the register pair reports the measured standby current. The register value is
updated every 5.12 seconds when the measured current is above the DMF threshold and is less than or equal
to 2x the initial programmed standby current value. Each new SI value is computed as follows:
SINEW = (15/16) * SIOLD + (1/16) * AI
This filter function allows the reported standby current to shift towards the actual measured current with a time
constant of approximately 67 seconds. The value is reported with a resolution of 3.57 µV per bit. Use the
following equation to convert the value to mA, where RS is the sense resistor value in milliohms:
Standby Load Current = (256 * SIH + SIL) * (3.57 / RS)
The host system has read-only access to this register pair.
Standby Time-to-Empty Registers (STTEL/STTEH) — Address 0x1C/0x1D
This register pair reports calculated time-to-empty at the measured standby current value. This value is based
on the nominal available charge and the standby current. STTE is reported in minutes. STTE is calculated by:
STTE = 60 * NAC/SI
The host system has read-only access to this register pair.
Compensated End-of-Discharge Registers (CEDVL/CEDVH) – Address 0x20/0x21
The EDV1 threshold can be compensated for discharge rate and temperature. The compensated, or computed,
EDV1 threshold is displayed in this register pair. The CEDV display is only updated during discharge. There is a
floor set for the EDV1 threshold. The EDV1 threshold will be the greater of the computed CEDV threshold and
EDVF + 32 mV. CEDV is displayed in millivolts. The host system has read-only access to this register pair.
Time-to-Empty at Constant Power Registers (TTECPL/TTECPH) – Address 0x26/0x27
TTECP is the time-to-empty in minutes with a constant-power load. TTECP is equal to the TTE constant-current
value scaled to reflect a future drop in battery voltage that would cause the load current to increase. The
calculation assumes a linear voltage drop down to EDVF, yielding a conservative (smaller) run-time than
expected.
TTECP = TTE * (VOLT + EDVF) / (2 * VOLT)
The host system has read-only access to this register pair.
Cycle Count Since Learning Cycle Registers (CYCLL/CYCLH) — Address 0x28/0x29
CYCL is the cycle count since the last learning cycle. Each count indicates an increment of CYCT since there
was a learning cycle. This register is cleared every time there is a learning cycle. When this count reaches 32, it
forces the CI flag in FLAGS to a 1. The host system has read-only access to this register pair.
Cycle Count Total Registers (CYCTL/CYCTH) — Address 0x2A/0x2B
CYCT is the cycle count since a full reset. A full reset clears this register. Each count indicates a cumulative
discharge equal to the Design Capacity (256 * ILMD). The host system has read-only access to this register pair.
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Compensated State-of-Charge (CSOC) — Address 0x2C
CSOC reports the compensated available capacity as a percentage of the last measured discharge value (LMD).
The equation is:
CSOC (%) = 100 * CAC / LMD
The host system has read-only access to this register.
Reserved Registers
Addresses 0x1E, 0x1F, 0x22-0x25, 0x2D-0x6D and 0x6F-0x75 are reserved and cannot be written by the host.
EEPROM Enable Register (EE_EN) — Address 0x6E
This register is used to enable host writes to EEPROM data locations (addresses 0x76 — 0x7F). The host must
write data 0xDD to this register to enable EEPROM programming. See the Programming the EEPROM section
for further information on programming the EEPROM bytes. Care should be taken to insure that no value except
0xDD is written to this location. All bqJUNIOR measurements and computations will be inhibited until 0x00 is
written back to address 0x6E.
EEPROM Data Registers (EE_DATA) — Address 0x76 — 0x7F
The EEPROM data registers contain information vital to the performance of the device. These registers are to be
programmed during pack manufacturing to allow flexibility in the design values of the battery to be monitored.
The EEPROM data registers are listed in Table 2. Detailed descriptions of what should be programmed follow.
See the Programming the EEPROM section for detailed information on writing the values to EEPROM.
Table 2. bq27010/bq27210 EEPROM Memory Map
Address
Name
0x7F
TCOMP
Temperature compensation constants, OR, ID#1
Function
0x7E
DCOMP
Discharge rate compensation constants, OR, ID#2
0x7D
GAF/DEDV
0x7C
PKCFG
Pack configuration values
0x7B
TAPER
Aging estimate enable [7], charge termination taper current [6:0]
0x7A
DMFSD
Digital magnitude filter and self-discharge rate constants
0x79
ISLC/EDVT
0x78
SEDV1
Scaled EDV1 threshold
0x77
SEDVF
Scaled EDVF threshold
0x76
ILMD
Gain Age Factor / EDVI rate compensation
Initial standby load current / EDVI temperature compensation
Initial last measured discharge high byte
Initial Last Measured Discharge High Byte (ILMD) — Address 0x76
This register contains the scaled design capacity of the battery to be monitored. ILMD is programmed in units of
914 µVh per bit. The equation to calculate the initial LMD is:
ILMD = Design Capacity (mAh) * RS (mΩ) / (256 * 3.57)
where RS is the value of the sense resistor used in the system. This value is used to initialize the high byte of
LMD on a full reset. The low byte of LMD is initialized to 0.
Scaled EDVF Threshold (SEDVF) — Address 0x77
This register contains the scaled value of the threshold for zero battery capacity. To calculate the value to
program, use the following equation:
SEDVF = Design EDVF (mV) / 8 – 256
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Scaled EDV1 Threshold (SEDV1) — Address 0x78
This register contains the scaled value of the voltage when the battery has 6.25% remaining capacity at a very
light load. DEDV and EDVT coefficients can be programmed to reduce the EDVI threshold at heavier loads and
at cold temperatures. When the battery reaches this threshold during a valid discharge, the device learns the full
battery capacity, including the remaining unmeasured 6.25%. See the bqJUNIOR Capacity Learning section for
more information on the learning cycles of the device. To calculate the value to program, use the following
equation:
SEDV1 = Design EDV1 (mV) / 8 – 256
Initial Standby Load Current and EDV1 Temperature Compensation (ISLC/EDVT) – Address
0x79
Name
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
ISLC[2]
ISLC[1]
ISLC[0]
EDVT[3]
EDVT[2]
EDVT[1]
EDVT[0]
The most significant nibble in this register contains the initial standby load current (ISLC) that is transferred to SI
on all resets. The gauge will use this initial value, but will learn the actual system standby current by averaging
in measured discharge currents above the DMF threshold and less than or equal to 2 times the ISLC value.
ISLC is programmed in units of 57.1 µV per bit.
A capacity learning cycle is disqualified if average current is less than or equal to 2 times the ISLC programmed
value.
The equation for programming ISLC is:
ISLC = Design Standby Current (mA) * RS (mΩ) / 57.1 µV, where RS is the sense resistor value.
The least significant nibble in this register contains the EDV1 temperature compensation (EDVT) coefficient. The
temperature compensation is impedance-based, so the resulting compensation is proportional to load current.
EDVT is programmed to increase the EDV1 rate compensation (programmed in the DEDV coefficient) by 0.78%
per count for each degree than temperature is below the Toff threshold programmed in TCOMP. See the
GAF/DEDV section for the complete EDV1 compensation equation.
Digital Magnitude Filter and Self-Discharge Values (DMFSD) — Address 0x7A
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
DMF[3]
DMF[2]
DMF[1]
DMF[0]
SD[3]
SD[2]
SD[1]
SD[0]
DMF[3:0]
Sets the digital magnitude filter threshold. See the bqJUNIOR Digital Magnitude Filter section for
more information on the function of the DMF. The value to be programmed is:
DMF[3:0] = Design Threshold / 4.9
SD[3:0]
Sets the self-discharge rate % per day value at 25°C. The value to be programmed is:
SD[3:0] = 1.61 / Design SD
NAC is reduced with an estimated self-discharge correction to adjust for the expected self-discharge of the
battery. This estimation is performed only when the battery is not being charged. The rate programmed in
EEPROM for DMFSD determines the self-discharge when 20°C ≤ TEMP < 30°C. The self-discharge estimation
is doubled for each 10°C decade hotter than the 20-30°C decade, up to a maximum of 16 times the
programmed rate for TEMP ≥ 60°C and is halved for each 10°C decade colder than the 20-30°C decade, down
to a minimum of 1/4th the programmed rate for TEMP < 0°C. The self-discharge estimation is performed by
reducing NAC by NAC / 512 at a time interval that achieves the desired estimation. If DMFSD is programmed
with 8 decimal, the self-discharge rate is 0.195% per day in the 20-30°C decade. This is accomplished by
reducing NAC by NAC / 512 (100 / 512 = 0.195%) a single time every 23.3 hours (0.195 * 24 / 23.3 = 0.2). If
temperature rises by 10°C, the 0.195% NAC reduction is made every 11.65 hours for a 0.4% per day reduction.
If TAPER[7] = 1, capacity aging is enabled, and there is an LMD reduction of 0.1% (Design Capacity / 1024)
every time there are 8 NAC self-discharge estimate reductions without charging the battery to full.
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Taper Current (TAPER) — Address 0x7B
This register contains the enable bit for the capacity aging estimate and the charge taper current value. The
taper current value, in addition to battery voltage, is used to determine when the battery has reached a full
charge state. The equation for programming the taper current is:
TAPER[6-0] = Design Taper Current (mA) * RS(mΩ) / 228 µV
where RS is the value of the sense resistor used in the system.
TAPER[7] should be set to 1 to enable the automatic aging of the LMD full capacity value when there are no
learning cycles. If this feature is enabled, LMD is reduced by Design Capacity / 1024 every time CYCL
increments by 2 and every time that a cumulative NAC self-discharge estimate reduction of 1.56% has been
made without charging the battery to full. If TAPER[7] is set to 0, there is no LMD reduction with cycle count or
self-discharge.
Pack Configuration (PKCFG) — Address 0x7C
NAME
GPIEN
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
GPIEN
QV1
QV0
BOFF(2)
BOFF(1)
BOFF(0)
DCFIX
TCFIX
Allows the pack manufacturer to set the state of the GPIO pin on initial power up. If the bit is 0, the
GPIEN bit is cleared on reset and the GPIO pin acts as a high-impedance output. If the bit is 1, the
GPIEN bit is set on reset and the GPIO pin acts as an input. The state of the GPIO pin can then be
read through the GPSTAT bit in the MODE register. If PKCFG is updated using the UPCFG host
command (see Device Control section), the updated PKCFG value will not reinitialize GPIEN in the
MODE register.
QV1 & QV0 These bits set the minimum qualification voltage for charge termination. The termination voltage
thresholds are set as listed in Table 3.
Table 3. Charge Termination Voltage Settings
BOFF
QV1
QV0
Voltage (mV)
0
0
3968
0
1
4016
1
0
4064
1
1
4112
These bits are used to store a typical board offset value for the gauge. This value is added to the
internal offset measurement and the total applied as an offset correction for the charge and
discharge coulometric measurements made by the DSCC. This is a 2s-complement signed number
with a value of 2.45 µV per bit.
Table 4. Board Offset Voltage Settings
20
Board Offset
BOFF(2)
BOFF(1)
BOFF(0)
7.35 µV
0
1
1
4.9 µV
0
1
0
2.45 µV
0
0
1
0
0
0
0
-2.45 µV
1
1
1
-4.9 µV
1
1
0
-7.35 µV
1
0
1
-9.8 µV
1
0
0
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DCFIX
Fixed discharge compensation. Normal discharge rate compensation (DCOMP register) is used if
this bit is set to 0. If this bit is set to 1, the device assumes a fixed value of 0x6C for DCOMP,
giving a discharge rate compensation gain (DCGN) of 5.08% with a compensation offset threshold
of C/2. Setting the bit to 1 frees the EEPROM location of 0x7E for use as a programmable
identification byte.
TCFIX
Fixed temperature compensation. Normal temperature compensation (TCOMP register) is used if
this bit is set to 0. If this bit is set to 1, the device assumes a fixed value of 0x46 for TCOMP, which
will increase DCGN by 25% per °C below 12°C. Setting this bit to 1 frees the EEPROM location of
0x7F for use as a programmable identification byte.
Gain Age Factor and EDV1 Discharge Rate Compensation (GAF/DEDV) – Address 0x7D
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
GAF[1]
GAF[0]
DEDV[5]
DEDV[4]
DEDV[3]
DEDV[2]
DEDV[1]
DEDV[0]
The two most significant bits in address 0x7d set the gain age factor (GAF). This factor adjusts the discharge
rate compensation with age. The GAF will cause a linear increase in the discharge rate and temperature
compensation with cycle count. GAF = 3 will cause DCGN to increase by same amount as a drop in temperature
of 16°C below the Toff threshold programmed in TCOMP when CYCT = 85. Lower values of GAF will require
proportionally more cycle counts to reach the same level of compensation reduction. The equation for the aged
discharge compensation gain (ADCGN) is:
ADCGN = DCGN * (1 + TCGN * (CYCT/16) * GAF/32)
TCGN is the temperature compensation gain programmed in TCOMP. See the section on DCOMP for the
complete discharge rate compensation equation. There will be no gain aging of the discharge compensation if
GAF = 0. The recommended value for GAF if battery aging data is not available is GAF = 1.
The six least significant bits in address 0x7d set the EDV1 discharge rate compensation (DEDV) gain. The
EDV1 threshold is impedance-based and will be reduced from the no-load EDV1 threshold programmed in
SEDV1 as a function of load current. The EDV1 threshold is reduced linearly with AI at a rate of 8 mV per C-rate
for each DEDV count. The DEDV rate compensation is also increased at cold temperature as described in the
section on ISLC / EDVT. The actual EDV1 threshold used will be the greater of CEDV or EDVF + 32mV. The
equation for the EDV1 threshold compensation is:
CEDV = EDV1 – 8 mV * DEDV * AI / DC * [1 + EDVT * (Toff– T) / 128] , where T < Toff
CEDV = EDV1 – 8 mV * DEDV * AI / DC, where T ≥ Toff
Discharge Rate Compensation Coefficients (DCOMP) – Address 0x7E
This register is used to set the basic discharge compensation coefficients. The basic discharge gain coefficient,
DCGN, is increased at cold temperature and with age (cycle count) to achieve a combined impedance-based
discharge rate, temperature, and age compensation of available capacity. This compensation determines the
reduction in CAC from NAC and the reduction in FCAC from LMD.
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
DCGN[4]
DCGN[3]
DCGN[2]
DCGN[1]
DCGN[0]
DCOFF[2]
DCOFF[1]
DCOFF[0]
DCGN[4:0] The discharge rate compensation gain coefficient sets the slope of the capacity compensation with
discharge current. The slope can be set in increments of 0.39% (DCGN / 256).
DCOFF[2:0] The discharge compensation offset coefficient sets the capacity offset threshold. There is no
capacity compensation reduction if the compensation falls below this threshold. Table 3 lists shows
the discharge compensation threshold is set in multiples of C/8. (A 1C-rate current is the current
that equals the design capacity, or AI = ILMD * 256.)
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Discharge Rate Compensation Threshold
DCOFF Threshold (1)
DCOFF[2:0]
(1)
0
0
1
(DCGN / 256) * 1C / 8
2
(DCGN / 256) * 2C / 8
3
(DCGN / 256) * 3C / 8
4
(DCGN / 256) * 4C / 8
5
(DCGN / 256) * 5C / 8
6
(DCGN / 256) * 6C / 8
7
(DCGN / 256) * 7C / 8
C = ILMD * 256
The discharge compensation capacity reduction (DCMP) is a function of discharge rate, temperature, and age
(cycle count). There is no compensation if the DCGN factor increased for age and temperature times AI is less
than the DCOFF threshold (DCMP ≥ 0). The following is the combined equation for the DCMP reduction:
DCMP = AI * (ADCGN / 256) * (1 + TCGN * (273 + TOFF – T) / 32) – DCGN * DCOFF * ILMD / 8
ADCGN = DCGN * (1 + TCGN * (CYCT / 16) * GAF / 32)
If PKCFG[1] = 1, the bqJUNIOR assumes a fixed value of 0x6C for DCOMP, giving a discharge rate
compensation gain of 5.08% with a compensation offset threshold of C/2. This frees the EEPROM location of
0x7E for use as a programmable identification byte. If DCOMP is updated using the UPCOMP host command
(see Device Control section), the value written by the host for DCOMP will be used regardless of the bit 1 value
in PKCFG.
Temperature Compensation Coefficients (TCOMP) – Address 0x7F
This register is used to set the compensation coefficients for temperature. These coefficients are used to scale
the aged discharge rate compensation for improved accuracy of predicted available capacity at cold
temperatures.
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
TCGN[4]
TCGN[3]
TCGN[2]
TCGN[1]
TCGN[0]
TOFF[2]
TOFF[1]
TOFF[0]
TCGN[4:0]
The temperature compensation gain coefficient is used to scale DCGN when temperature drops
below the Toff threshold. TCGN will increase the ADCGN value in increments of 3.125% (TCGN /
32) for each degree that temperature is below the Toff threshold.
TOFF[2:0]
The temperature compensation offset threshold sets the temperature above which there is no
temperature compensation applied to DCGN. This threshold is also used as the threshold for
application of cold temperature compensation of EDV1 (see GAF/EDVT section) and the threshold
to allow the NAC = LMD capacity adjustment to be made at IMIN detection (see Functional
Description section). The Toff threshold in degrees Celsius is equal to 2 * TOFF.
If PKCFG[0] = 1, the bqJUNIOR assumes a fixed value of 0x46 for TCOMP. This will increase the DCGN factor
by 25% per degree below Toff of 12°C. This frees the EEPROM location of 0x7F for use as a programmable
identification byte. If TCOMP is updated using the UPCOMP host command (see Device Control section), the
value written by the host for TCOMP will be used regardless of the bit 0 value in PKCFG.
Power Modes
The bqJUNIOR has five power modes: Active, Sleep, Ship, Hibernate, and Data Retention (RBI). Figure 5
shows the flow that moves the device between the Active, Sleep, and Ship modes. Hibernate and Data
Retention are special modes not included in the flow. Detailed explanations of each mode follow the diagram in
Figure 5.
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Active Mode
COM low for 18
seconds?
No
Yes
No
Ship
enabled?
No
Yes
Yes
Ship Mode
COM
pulled high?
Yes
VSR
below DMF
threshold?
Sleep Mode
No
COM
pulled high?
No
Yes
No
43.6 minute
wake?
Yes
Device enters active
mode for 18 seconds
UDG−04101
Figure 5. Power Mode Flow Chart
Active Mode
During normal operation, the device is in active mode, which corresponds to the highest power consumption.
Normal gas gauging is performed in this mode. If system requirements mandate that bqJUNIOR should not
enter Sleep or Ship modes, then an external pullup resistor from VCC to keep HDQ or CLK and DTA at a logic 1
is required on the bqJUNIOR side of the system. The resistor value chosen should be small enough to force a
logic 1 even with the internal pulldown current and any external ESD protection circuitry loading.
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Sleep Mode
This low power mode is entered when the HDQ or CLK and/or DTA line is pulled low for at least 18 seconds and
the charge or discharge activity is below the DMF threshold. Normal gas gauging ceases, but battery
self-discharge, based on the temperature when the device entered sleep mode, is maintained internally. The
device wakes every 43.6 minutes to update the temperature measurement and goes back to sleep after about
18 seconds if the HDQ or CLK and/or DTA line is still low and the charge or discharge activity is still below the
DMF threshold. The bqJUNIOR has an internal 3 µA pulldown current on each communication line, eliminating
the need to add external pulldown resistors to force a logic 0 on open communication lines.
When the device wakes, it stays in active mode long enough to confirm that the charge or discharge activity is
still below the digital magnitude filter threshold. This is meant to minimize possible error if the battery pack is
removed from the end equipment for a short period of time and then reinserted, and there is not a transient on
the communication lines to pull the device into the active mode. This is an issue only if the system has some
current drain from the battery even though the communication lines are low. The gauge reenters sleep mode
when the charge or discharge activity falls below the digital magnitude filter threshold.
When all communication lines are pulled high, the device leaves the sleep mode. If the DMF threshold is set to
zero and a communication line is pulled low, the device does not enter sleep mode until the average current
value is less than 3.57 µV/Rsr.
If the battery pack can be removed and placed on an external charger, the charger should have a pull-up
resistor on the HDQ or SCL and SDA lines to wake the part from sleep. A 100 kΩ pullup resistor from
communication line(s) to VCC can be added in the battery pack to disable the sleep function.
Ship Mode (bq27010 only)
This low power mode is to be used when the pack manufacturer has completed assembly and test of the pack.
The ship mode is enabled by setting the SHIP bit in the MODE register and issuing the control command (data
0xA9 to register 0x00). Ship mode is entered only when the ship mode is enabled and the HDQ or CLK and/or
DTA line has been pulled low for at least 18 seconds. This allows the pack manufacturer to enable the ship
mode and pull the pack from the test equipment without any additional overhead. Transients on a
communication line after the ship mode has been enabled but before the device has entered ship mode, do not
cause the device to stay in active mode. Transients on a communication line, after the device has entered ship
mode can wake the part from ship mode, but if there is no charge or discharge activity above the DMF
threshold, the part automatically enters the Sleep mode as previously described.
All device functionality stops in ship mode and it does not start again until the communication lines are pulled
high or the battery voltage drops below and then rises above the V(POR) threshold. A full reset is forced when the
part leaves ship mode. If the current NAC value must be retained after waking, ship mode should not be used.
Hibernate Mode
The device enters hibernate mode when VCC drops below V(POR). VCC must be raised above V(POR) in order to
exit the hibernate mode. If RBI voltage does not drop below 1.3 V, RAM content is maintained and allows
retention of NAC, LMD, CYCL, CYCT, and the CI flag after VCC is raised above V(POR).
Programming the EEPROM
The bqJUNIOR has 10 bytes of EEPROM that are used for firmware control and application data (see the
bqJUNIOR Register Descriptions section for more information). Programming the EEPROM should take place
during pack manufacturing because a 21 V pulse is needed on the PROG pin. The programming mode must be
enabled prior to writing any values to the EEPROM locations. The programming mode is enabled by writing to
the EE_EN register (address 0x6E) with data 0xDD. Once the programming mode is enabled, the desired data
can be written to the appropriate address. Figure 6 shows the method for programming all locations.
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Host enables E2PROM
programming mode. Write data
0xDD to address 0x6E
Host writes data in addresses
0x76 − 0x7F
Host reads data
address 0x76
21−V pulse applied to
PROG pin for 50 ms
Host increments
address and reads
Programmed
0x7F?
No
Yes
Write data 0x00 to
address 0x6E
UDG−04099
Figure 6. EEPROM Programming Flow
It is not required that addresses 0x76 — 0x7F be programmed at the same time or in any particular order. The
programming method illustrated in Figure 6 can be used to program any of the bytes as long as the sequence of
Enable, Write, Read, Apply Programming Pulse, and Disable is followed.
The bqJUNIOR must have a full reset to force the updated EEPROM values into RAM. A full reset will occur
after a POR if RAM data is corrupted (failed checksum), or a full-reset command may be sent using the CTRL
and MODE registers.
Communicating With the bq27010 (HDQ interface)
The bq27010 includes a single-wire HDQ serial data interface. Host processors, configured for either polled or
interrupt processing, can use the interface to access various bq27010 registers. The HDQ pin is an open-drain
device, which requires an external pullup resistor. The interface uses a command-based protocol, where the
host processor sends a command byte to the bq27010. The command directs the bq27010 either to store the
next eight bits of data received to a register specified by the command byte or to output the eight bits of data
from a register specified by the command byte.
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The communication protocol is asynchronous return-to-one and is referenced to VSS. Command and data bytes
consist of a stream of eight bits that have a maximum transmission rate of 5 Kbits/s. The least-significant bit of a
command or data byte is transmitted first. Data input from the bqJUNIOR can be sampled using the pulse-width
capture timers available on some microcontrollers. A UART can also be configured to communicate with the
bq27010.
If a communication timeout occurs (for example, if the host waits longer than T(RSPS) for the bq27010 to respond)
or if this is the first access command, then a BREAK should be sent by the host. The host may then resend the
command. The bq27010 detects a BREAK when the HDQ pin is driven to a logic-low state for a time T(B) or
greater. The HDQ pin then returns to its normal ready-high logic state for a time T(BR).The bq27010 is then ready
for a command from the host processor.
The return-to-one data-bit frame consists of three distinct sections:
1. The first section starts the transmission by either the host or the bq27010 taking the HDQ pin to a
logic-low state for a period equal to T(HW1) or T(DW1).
2. The next section is the actual data transmission, where the data should be valid for T(HW0)- T(HW1) or
T(DW0)- T(DW1).
3. The final section stops the transmission by returning the HDQ pin to a logic-high state and holding it high
until the time from bit start to bit end is equal to T(CYCH) or T(CYCD).
The HDQ line can remain high for an indefinite period of time between each bit of address or between each bit
of data on a write cycle. After the last bit of address is sent on a read cycle, the bq27010 starts outputting the
data after T(RSPS) with timing as specified. The serial communication timing specification and illustration sections
give the timings for data and break communication. Communication with the bq27010 always occurs with the
least-significant bit being transmitted first.
Plugging in the battery pack can be seen as the start of a communication due to contact bounce. It is
recommended that each communication or string of communications be preceded by a break to reset the HDQ
engine.
Command byte
The Command byte of the bqJUNIOR consists of eight contiguous valid command bits. The command byte
contains two fields: W/R Command and address. The Command byte values are shown as follows:
7
6
5
4
3
2
1
0
W/R
AD6
AD5
AD4
AD3
AD2
AD1
AD0
W/R
Indicates whether the command bytes is a read or write command. A 1 indicates a write command
and that the following eight bits should be written to the register specified by the address field of
the Command byte, whereas a 0 indicates that the command is a read. On a read command, the
bqJUNIOR outputs the requested register contents specified by the address field portion of the
Command byte.
AD6-AD0
The seven bits labeled AD6—AD0 containing the address portion of the register to be accessed.
Reading 16-bit Registers
Because 16-bit values are read only 8 bits at a time with the HDQ interface, it is possible that the device can
update the register value between the time the host reads the first and second bytes. To prevent any system
issues, any 16-bit values read by the host should be read with the following procedure.
1. Read high byte (H0).
2. Read low byte (L0).
3. Read high byte (H1).
4. If H1=H0, then valid result is H0, L0.
5. Otherwise, read low byte (L1) and valid result is H1, L1.
This procedure assumes that the 3 or 4 reads are made more quickly than the update rate of the value. The
maximum update rate of any value in the bq27010/bq27210 is 1.28 seconds.
The bq27210 circumvents this issue if a 16-bit value is read using the I2C incremental read procedure. Both low
and high bytes are captured simultaneously when the low byte is read.
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Communicating with the bq27210 (I2C interface - Product Preview)
The bq27210 supports the standard I2C read, incremental read, quick read, and one byte write functions. The
7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The 8-bit
device address is therefore 0xAA or 0xAB for write or read, respectively. (S = Start, Sr = Repeated Start, A =
Acknowledge, N = No Acknowledge, and P = Stop)
Host generated
S
ADDR[6:0]
0
A
bq27210 generated
CMD[7:0]
A
DATA[7:0]
A
P
S
ADDR[6:0]
1
A
(a)
S
ADDR[6:0]
DATA[7:0]
N
P
N
P
(b)
0
A
CMD[7:0]
Sr
A
ADDR[6:0]
1
A
DATA[7:0]
N
P
(c)
S
ADDR[6:0]
0
A
CMD[7:0]
A
Sr
ADDR[6:0]
1
A
DATA[7:0]
A
...
DATA[7:0]
(d)
Figure 7. Supported I2C formats :
(a) 1-byte write; (b) quick read; (c) 1-byte read; (d) incremental read
The incremental read protocol is recommended for reading all 16-bit values, as this ensures that the 16-bit value
is not updated during the time interval between reading the two bytes of data (see previous section on reading
16-bit values). The quick read returns data at the address indicated by the internal address pointer. The address
pointer is incremented after each data byte is read or written. Reading an even address causes the
communication engine to simultaneously capture the data byte from the requested even address and the data
byte from the next odd address, and the address pointer is incremented twice. The data byte captured from the
next odd address is output if the communication continues, without a stop, after the host acknowledges the even
address byte.
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Due to the memory map setup of the device, several boundary conditions must be enforced by the
communication engine.
Attempt to write a read-only address (NACK after data sent by master):
S
ADDR[6:0]
0
A
CMD[7:0]
A
DATA[7:0]
N
P
Attempt to read an address above 0x7F (NACK command):
S
ADDR[6:0]
0
A
CMD[7:0]
N
P
Attempt at incremental writes (NACK all extra data bytes sent):
S
ADDR[6:0]
0 A
CMD[7:0]
A
DATA[7:0]
A
DATA[7:0]
N
...
N P
Incremental read at the maximum allowed read address:
S
ADDR[6:0]
0 A
CMD[7:0]
A Sr
ADDR[6:0]
1 A
DATA[7:0]
Address
0x7F
A
Data from
addr 0x7F
DATA[7:0]
N P
Data from
addr 0x00
The I2C engine releases both SDA and SCL if the I2C bus is held low for T(BUSERR). If the bq27210 is holding the
lines, releasing them frees the master to drive the lines. If an external condition is holding either of the lines low,
the I2C engine enters the low-power sleep mode if the measured charge/discharge activity level is less than the
DMF threshold.
Submit Documentation Feedback
27
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
BQ27010DRKR
ACTIVE
VSON
DRK
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 70
27010
BQ27010DRKRG4
ACTIVE
VSON
DRK
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 70
27010
BQ27210DRKR
ACTIVE
VSON
DRK
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 70
27210
BQ27210DRKRG4
ACTIVE
VSON
DRK
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-20 to 70
27210
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ27010DRKR
VSON
DRK
10
3000
330.0
12.4
3.3
4.3
1.6
8.0
12.0
Q2
BQ27210DRKR
VSON
DRK
10
3000
330.0
12.4
3.3
4.3
1.6
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ27010DRKR
VSON
DRK
10
3000
338.1
338.1
20.6
BQ27210DRKR
VSON
DRK
10
3000
338.1
338.1
20.6
Pack Materials-Page 2
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