F75383M/F75383S/F75384M/F75384S ±1oC Accuracy Temperature Sensor IC Datasheet Release Date: July, 2007 Revision: V0.32P F75383/F75384 F75383/F75384 Datasheet Revision History Version Date Page Revision History 0.21P Mar.,2004 Original version (Confidential) 0.22P Mar.,2004 Revised version ID/vendor ID, AC/DC spec. 0.23P Mar.,2004 Add 8-SOP(F75383) package supporting 0.24P Mar.,2004 1-2 Add additional description of 8-SOP(F75383S)/8-MSOP(F75383M) 0.25P Apr.,2004 8,13 Add PCB Layout guide and update DC specification 0.26P Jul.,2004 0.27P Sep.,2004 Add F75384 description 6 Revise(1)High Byte of 1°C value (0000 0001) 12 (2) Read address (high byte) of VT2 low limit (08h (00h) ) 0.28P Jan.,2005 15 Revise serial bus timing 0.29P Aug.,2005 4 Modify alert response address 0.30P Dec.,2005 0.31P Dec.,2006 0.32P July,2007 Revise typo and updated patent no. 1 Add Patent Note - Revise typo ( VDD Æ VCC) - Company readdress Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from such improper use or sales. F75383/F75384 -I- July, 2007 V0.32P F75383/F75384 Table of Contents General Description................................................................................................................. 1 Features .................................................................................................................................. 1 Key Specifications ................................................................................................................... 2 Pin Configuration..................................................................................................................... 2 Pin Descriptions ...................................................................................................................... 2 Functional Description............................................................................................................. 3 6.1 General Description.......................................................................................................... 3 6.2 The warning message ...................................................................................................... 3 6.3 Access Interface............................................................................................................... 3 6.4 Typical Operating Characteristics ...................................................................................... 5 6.5 Temperature Monitoring ..................................................................................................... 6 6.5 Alert#................................................................................................................................ 6 6.6 THERM# ............................................................................................................................ 7 6.7 ADC Conversion Sequence ............................................................................................... 7 6.8 Thermal Mass and Self Heating......................................................................................... 7 6.9 ADC Noise Filtering ........................................................................................................... 7 6.10 PCB Layout Guide........................................................................................................... 8 7. Registers Description .............................................................................................................. 9 1. 2. 3. 4. 5. 6. 7.1 Configuration Register Index 03h(Read), 09h(Write)................................................... 9 7.2 Status Register Index 02h .............................................................................................. 9 7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write).............................................. 10 7.4 One-Shot Register Index 0Fh...................................................................................... 10 7.5 Alert Queue & Timeout Register Index 22h .................................................................. 10 7.6 Status-with-ARA Control Register Index 24h ............................................................. 11 7.7 Chip ID I Register Index 5Ah........................................................................................ 11 7.8 Chip ID II Register Index 5Bh....................................................................................... 11 7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh....................................................... 11 7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh ..................................................... 11 7.11 Vendor ID II (Manufacturer ID) Register Index FEh .................................................... 11 7.12 Value RAM Index 10h- 2Fh ........................................................................................ 11 8. Electrical characteristic.......................................................................................................... 12 8.1 Absolute Maximum Ratings .............................................................................................. 12 8.2 DC Characteristics ............................................................................................................ 12 8.3 AC Characteristics ............................................................................................................ 14 9. Package Dimensions............................................................................................................. 15 F75383/F75384 -II- July, 2007 V0.32P F75383/F75384 10 Application Circuit .................................................................................................................. 17 F75383/F75384 -III- July, 2007 V0.32P F75383/F75384 1. General Description The F75383/F75384 is a temperature sensor IC with alert signal which is specific designed for notebook, graphic cards etc. An 11-bit analog-to-digital converter (ADC) was built inside F75383/F75384. The F75383/F75384 can monitor two set of temperature which is very important for the system to work stably and properly. This chip provides 1 remote temperature sensor and 1 local temperature sensor. The remote temperature sensor can be performed by CPU thermal diode or transistor 2N3906. The users can set up the upper and lower limits (alarm thresholds) of all monitored parameters and this chip can also issue warning messages for system protection when there is something wrong with monitored items. Through the BIOS or application software, the users can read all the monitored parameters of system all the time. And a pop-up warning can be also activated when the monitored item was out of the proper/pre-setting range. The application software could be Fintek's application utility, or other management application software. The F75383/F75384 is in the package of 8-pin MSOP/SOP and powered by 3.3V. 2. Features Provide 1 on-chip local and 1 remote temperature sensing ±1 oC accuarcy on remote channel and ±3 oC accuarcy on local channel ±1 oC (+60 oC to +100 oC, remote) ±3 oC (+60 oC to +100 oC, local) ALERT# output for SMBus alert THERM# output for over temperature alert or for system shut down Programmable THERM# limits and THERM# hysteresis Programmable alert queue Programmable limited and setting points(alert threshold) for all monitored items 2 wire SMBus interface 3VCC operation and in 8-SOP/8-MSOP green class package 8-MSOP Package – F75383M/F75384M ; 8-SOP Package – F75383S/F75384S The difference between F75383 and F75384 is SMBus address ID and they have the following SMBus slave address: A6 A5 A4 A3 A2 A1 A0 F75383 1 0 0 1 1 0 0 F75384 1 0 0 1 1 0 1 Noted: Patented TW 235231 TWI263778 F75383/F75384 -1- July, 2007 V0.32P F75383/F75384 3. 4. 5. Key Specifications Supply Voltage 3.0~3.6V Supply Current 180 uA (typ) Pin Configuration VCC 1 D+ 2 D- 3 THERM# 4 F75383 F75384 SCL 7 SDA 6 ALERT# 5 GND Pin Descriptions I/O12t - TTL level bi-directional pin with 12 mA source-sink capability I/O12ts - TTL level and schmitt trigger O12 - Output pin with 12 mA source-sink capability O24V4 - Output pin with 24 mA source-sink capability, output 4V AOUT - Output pin(Analog) OD12 - Open-drain output pin with 12 mA sink capability INt - TTL level input pin INts - TTL level input pin and schmitt trigger AIN 8 - Input pin(Analog) F75383/F75384 -2- July, 2007 V0.32P F75383/F75384 PIN NO PIN NAME TYPE PWR DESCRIPTION PWR 3VCC Power Pin 1 VCC 2 D+ AIN 3VCC Positive connection to remote temperature sensor (ex: thermal diode anode) 3 D- AIN 3VCC Negative connection to remote temperature sensor(ex: thermal diode cathode) 4 THERM# OD12 3VCC Active LOW output. This pin will be logic low when the temperature exceeds its limit. 5 GND PWR 3VCC Ground 6 ALERT# OD12 3VCC Active LOW output. Used as SMBus alert or Interrupt 7 SDA INts/OD12 3VCC Serial bus data 8 SCL INt s 3VCC Serial bus clock 6. Functional Description 6.1 General Description The F75383/F75384 is a simple temperature sensor with warning signal output. It includes a local and a remote temperature sensor. Both measured temperature are compared with its high, low and THERM limits which are stored in the registers. When one or more out-of-limit events occur, the flags in Status Register will be set and that may cause ALERT output to low. Also, measured temperature exceeding THERM limit may cause THERM output to low. 6.2 The warning message Pin4 and pin6 act as warning message when the temperature exceeds it threshold point. 6.3 Access Interface The F75383/F75384 can be connected to a compatible 2-wire serial system management bus as a slave device under the control of the master device, using two device terminals SCL and SDA. The F75383/F75384 supports SMBus protocol of, “Write Byte”, “Read Byte”, both with or without Packet Error checking(PEC) which is calculated using CRC-8. For detail information about PEC, please check SMBus 1.1 specification. F75383/F75384 supports 25ms timeout for no activity on the SMBus. This timeout function is programmed at 22h bit7 and default is disabled. F75383/F75384 also supports Alert Response Address(ARA) protocol. The operation of the protocol is described with details in the following sections. F75383/F75384 -3- July, 2007 V0.32P F75383/F75384 (a) SMBus write to internal address register followed by the data byte 0 7 8 0 7 8 SCL SDA 1 0 0 Start By Master 1 1 0 0 R/W D7 D6 Ack by 383 Frame 1 Serial Bus Address Byte D5 D4 D3 D2 D1 D0 Ack by 383 Frame 2 Internal Index Register Byte 0 7 8 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0 Stop by Master Frame 3 Data Byte Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte (b) Serial bus write to internal address register only 0 7 8 0 7 8 SCL SDA 1 0 Start By Master 0 1 1 0 0 R/W D7 D6 Ack by 383 Frame 1 Serial Bus Address Byte D5 D4 D3 D2 D1 D0 Ack by 383 Frame 2 Internal Index Register Byte Stop by Master 0 Figure 2. Serial Bus Write to Internal Address Register Only (c) Serial bus read from a register with the internal address register prefer to desired location 0 7 8 0 7 8 SCL 1 SDA 0 Start By Master 0 1 1 0 0 R/W D7 D6 Ack by 383 Frame 1 Serial Bus Address Byte D5 D4 D3 D2 D1 D0 Ack by Master Frame 2 Internal Index Register Byte Stop by Master 0 Figure 3. Serial Bus Read from Internal Address Register (d) Alert Response Address 0 7 8 0 7 8 SCL R/W 0 SDA Start By Master 0 0 1 1 0 0 0 Ack by 383 Frame 1 Alert Response Address 1 0 0 1 Frame 2 Device Address 1 0 0 Ack by Master Stop by Master 0 Figure 4. Alert Response Address F75383/F75384 -4- July, 2007 V0.32P F75383/F75384 6.4 Typical Operating Characteristics Temperature Error vs.D+/D- Capacitance Local Temperature Error vs. Die Temperature Local Temperature error(℃) Temperature error(℃) vs. D+/D- capacitance 0.8 1 0 0.6 Temperature error(℃) Temperature error(℃ -1 -2 -3 -4 -5 -6 -7 -8 0.4 0.2 0 -0.2 -0.4 -9 -0.6 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 0 Capacitance(nf) 10 20 30 40 50 60 70 80 90 100 Temperature(℃) Remote Diode Error vs. Remote Temperature Error 0.6 Te m pe ra ture Erroe 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0 20 40 60 Te m pe ra ture 80 100 120 Operating Supply Current vs. Conversion Rate Operating current (uA) Operating current (uA) 250 200 150 100 50 0 0.0625 0.125 0.25 0.5 1 2 4 8 16 32 64 Conversion rate(Hz) F75383/F75384 -5- July, 2007 V0.32P F75383/F75384 6.5 Temperature Monitoring The F75383/F75384 monitors a local and a remote temperature sensor. Both can be measured from 0°C to 140.875°C. The temperature format is as the following table: Temperature ( High Byte ) Digital Output Temperature ( Low Byte ) Digital Output 0°C 0000 0000 0°C 000 0 0000 1°C 0000 0001 0.125°C 001 0 0000 25°C 0001 1001 0.250°C 010 0 0000 50°C 0011 0010 0.375°C 011 0 0000 75°C 0100 1011 0.500°C 100 0 0000 90°C 0101 1010 0.625°C 101 0 0000 100°C 0110 0100 0.750°C 110 0 0000 140°C 1000 1100 0.875°C 111 0 0000 Remote-sensor transistor manufacturers 6.5 Manufacturer Model Number Panasonic 2SB0709 2N3906 Philips PMBT3906 Alert# Five events can trigger ALERT# to low: (1). VT1(Local) temperature exceeds High Limit (2). VT1(Local) temperature goes below Low Limit (3). VT2(Remote) temperature exceeds High Limit (4). VT2(Remote) temperature goes below Low Limit (5). VT2(Remote) temperature is Open-circuit. These five events are wired-NOR together. This means that when one of out-of-limit event occurs, the ALERT# output goes low if the MASK control is disabled. ALERT# signal can be used as an IRQ-like interrupt or as an SMBALERT. When ALERT# acts as an IRQ-like interrupt, the ALERT# will be de-asserted until the following 2 conditions are matched: (1). The abnormal condition is gone F75383/F75384 -6- July, 2007 V0.32P F75383/F75384 (2). Reading the Status register to clear the status When ALERT# acts as a SMBALERT, the ALERT# will be de-asserted until the following 3 conditions are matched: (1). The abnormal condition is gone (2). Reading the Status register to clear the status (3). The ALERT# has been serviced by the SMBus master reading the device address. For more information about SMBALERT, please see SMBus 1.1 specification. 6.6 THERM# Either VT1(Local) or VT2(Remote) temperature exceeds the corresponding THERM limit, the THERM# output will assert low. The asserted output will be de-asserted until the temperature goes below (THERM Limit – Hysteresis). The hysteresis default value is 10°C and it can be programmed. Both VT1 and VT2 have their own THERM limits and Hysteresis values. 6.7 ADC Conversion Sequence If a START command is written, both channels are converted and the results of both measurements are available after the end of conversion. A BUSY status bit in the status byte shows that the device is actually performing a new conversion; however, even if the ADC is busy, the results of the previous conversion are always available. 6.8 Thermal Mass and Self Heating Thermal mass effect can seriously degrade the F75383’s effective accuracy. The thermal time constant of the SOP package is about 140 in still air. For the F75383/S junction temperature to settle to within +1°C after a sudden +100°C change requires about five time constants or 12 minutes. The use of smaller packages for remote sensors such as SOT23, improves the situation. Take care to account for thermal gradients between the heat source and the sensor package do not interfere with measurement accuracy. Sel-heating does not significantly affect measurement accuracy. Remote sensor self-heating due to the diode current source is negligible. For the local diode, the worst case error occurs when auto-converting at the fastest rate and simultaneously sinking maximum current at the ALERT# output. For instance, at an 64Hz rate and ALERT# sink around 0.7mA when pull up resistor 4.7K ohm to 3.3VCC, the typical power dissipation is VCC x 220 uA plus 0.4V x 0.7mA. Package θJA is about 120 °C/W, so with VCC = 3.3V and no copper PC board heat-sinking, the resulting temperature rise is: dT = 1.01mW x 120 °C/W = 0.12 °C Even with these contrived circumstances, it is difficult to introduce significant self-heating errors. 6.9 ADC Noise Filtering The ADC is integrating type with inherently good noise rejection. Micro-power operation places constraints on high-frequency noise rejection; therefore, careful PCB board layout and suitable external filtering are required for high-accuracy remote measurement in F75383/F75384 -7- July, 2007 V0.32P F75383/F75384 electronically noisy environment. High frequency EMI is best filtered at D+ and D- with an external 2200pF capacitor. Too high capacitance may introduce errors due to the rise time of the switched current source. Nearly all noise sources tested cause the ADC measurement to be higher than the actual temperature, depending on the frequency and amplitude. 6.10 PCB Layout Guide PCB can be electrically noisy environments, and the F75383/F75384 is measuring very small voltage from the remote sensor, so care must be taken to minimize noise which is occurred at the sensor inputs. The following guideline should be taken to reduce the measurement error of the temperature sensors: 1. Place the F75383/F75384 as close as practical to the remote sensing diode. In noisy environments, such as a computer main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst noise sources are avoided. Noise sources generally include clock generators, CRTs, memory buses and PCI/ISA bus etc. 2. Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the CRT. And also don’t route the trace across fast digital signals which can easily induce bigger error. GND 10MILS DXP 10MILS DXN 10MILS MINIMUM 10MILS GND 3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended. 4. Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D- path and at the same temperature. Thermocouple effects should not be a major problem as 1℃ corresponds to about 200µV. It means that a copper-solder thermocouple exhibits 3µV/℃, and takes about 200µV of the voltage error at D+ & D- to cause a 1℃ measurement error. Adding a few thermocouples causes a negligible error. 5. Place a 0.1µF bypass capacitor close to the VCC pin. In very noisy environments, place an external 2200pF input filter capacitors across D+, D- close to the F75383/F75384. 6. If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. It will work up to F75383/F75384 -8- July, 2007 V0.32P F75383/F75384 around 6 to 12 feet. 7. Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance will affect the measurement accuracy. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also induce errors. 1 Ω series resistance introduces about 0.5℃ error. 7. Registers Description 7.1 Configuration Register Index 03h(Read), 09h(Write) Power on default <7:0> = 00h Bit Name Attribute Description 7 ALERT_MASK R/W Set to 1, mask ALERT# signal output. 6 RUN_STOP R/W Set to 0, monitor. 5-0 Reserved Set to 1, stop to monitor(software power down). 7.2 Status Register Index 02h Power on default <7:0> = 00h Bit Name Attribute Description 7 ADC_BUSY RO Set to 1, ADC is converting. 6 VT1HIGH RO Set to 1, VT1 temperature exceeds high limit. Set to 0, VT1 temperature does not exceed high limit. 5 VT1LOW RO Set to 1, VT1 temperature goes below low limit. Set to 0, VT1 temperature does not goes below low limit. 4 VT2HIGH RO Set to 1, VT2 temperature exceeds high limit. Set to 0, VT2 temperature does not exceed high limit. 3 VT2LOW RO Set to 1, VT2 temperature goes below low limit. Set to 0, VT2 temperature does not goes below low limit. 2 OPEN RO Set to 1, VT2 is open-circuit. 1 VT2THERM RO Set to 1, VT2 temperature exceeds its THERM limit. 0 VT1THERM RO Set to 1, VT1 temperature exceeds its THERM limit. VT1(Local) ; VT2(Remote) F75383/F75384 -9- July, 2007 V0.32P F75383/F75384 7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write) Power on default <7:0> = 08h Bit Name Attribute 7-0 CONV_RATE R/W Description Set conversion times per second. Value Conversion/Sec Value Conversion/Sec 00h 0.0625 06h 4 01h 0.125 07h 8 02h 0.25 08h 16 03h 0.5 09h 32 04h 1 0Ah 64 05h 2 0Bh ~ FFh Reserved 7.4 One-Shot Register Index 0Fh Power on default <7:0> = xxh Bit Name 7-0 ONE-SHOT Attribute Description WO When F75383/F75384 is at standby mode, writing any value to this register will initiate a single conversion and comparison cycle. After the single cycle, F75383/F75384 will returns to standby mode. 7.5 Alert Queue & Timeout Register Index 22h Power on default <7:0> = 01h Bit Name Attribute 7 EN_I2CTMOUT R/W Description Set to 1, enable serial interface timeout function. (Timeout time = 25ms) Set to 0, disable. 6-4 Reserved 3-1 ALERT_QUEUE R/W This number determines how many abnormal measurements must occur before ALERT signal is generated. 000 : Once 001 : Twice F75383/F75384 -10- July, 2007 V0.32P F75383/F75384 011 : 3 times 111 : 4 times 0 Reserved RO Always read 1. 7.6 Status-with-ARA Control Register Index 24h Power on default <7:0> = 01h Bit Name 7-6 Reserved 0 EN_ARA_STS Attribute R/W Description Set to 1, ALERT de-asserted condition is related with ARA. Set to 0, ALERT de-asserted condition is not related with ARA(Alert Response Address). 7.7 Chip ID I Register Index 5Ah Power on default: 03h. 7.8 Chip ID II Register Index 5Bh Power on default: 03h. 7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh Power on default: 19h. 7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh Power on default: 34h. 7.11 Vendor ID II (Manufacturer ID) Register Index FEh Power on default: 23h. (programmable) 7.12 Value RAM Index 10h- 2Fh VT1 : Local Temperature F75383/F75384 -11- July, 2007 V0.32P F75383/F75384 VT2 : Remote Temperature The value in quota is its power-on default value. Description Attribute Read Address Read Address Write Address Write Address (High Byte) (Low Byte) (High Byte) (Low Byte) VT1 reading RO 00h 1Ah VT2 reading RO 01h 10h VT1 High Limit R/W 05h (55h) 1Bh (00h) 0Bh 1Bh VT1 Low Limit R/W 06h (00h) 1Ch (00h) 0Ch 1Ch VT2 High Limit R/W 07h (55h) 13h (00h) 0Dh 13h VT2 Low Limit R/W 08h (00h) 14h (00h) 0Eh 14h VT1 THERM limit R/W 20h (55h) 20h VT1 THERM Hysteresis R/W 21h (0Ah) 21h VT2 THERM limit R/W 19h (55h) 19h VT2 THERM Hysteresis R/W 23h (0Ah) 23h 8. Electrical characteristic 8.1 Absolute Maximum Ratings PARAMETER RATING UNIT -0.5 to 5.5 V -0.5 to VCC+0.5 V Operating Temperature 0 to +140 °C Storage Temperature -55 to 150 °C Power Supply Voltage Input Voltage Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device 8.2 DC Characteristics (TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V ) Parameter Temperature Error, Remote Diode Conditions o TYP ±1 0 C <TD < 140 C ±1 60 C < TD < 100 C, VCC = 3.0V to 3.6V o F75383/F75384 MIN o o -12- MAX Unit o C ±3 July, 2007 V0.32P F75383/F75384 Temperature Error, Local Diode o o 0 C < TA < 100 C, VCC = 3.0V to 3.6V Supply Voltage range Average operating supply current 3.0 16 Conversions / Sec Rate 0.0625 Conversions / Sec Rate ±1 ±3 3.3 3.6 Under-voltage lockout threshold 90 uA 5 uA Diode source current o C 2.55 Power on reset threshold V uA 0.125 VCC input, Disables ADC , Rising Edge C 180 Standby supply current Resolution o 2.2 V 2.4 V High Level 95 uA Low Level 10 uA (TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V) PARAMETER SYM. MIN. TYP. MAX. UNIT 0.8 V CONDITIONS I/O12t - TTL level bi-directional pin with source-sink capability of 12 mA Input Low Voltage VIL Input High Voltage VIH 2.0 Output Low Current IOL 10 Output High Current IOH Input High Leakage Input Low Leakage V 12 mA VOL = 0.4V -10 mA VOH = 2.4V ILIH +1 µA VIN = VCC ILIL -1 µA VIN = 0V -12 I/O12ts - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input Input Low Threshold Voltage Vt- 0.5 0.8 Input High Threshold Voltage Vt+ 1.6 2.0 Output Low Current IOL 10 12 Output High Current IOH V VCC = 3.3 V V VCC = 3.3 V mA VOL = 0.4 V -10 mA VOH = 2.4V Input High Leakage ILIH +1 µA VIN = VCC Input Low Leakage ILIL -1 µA VIN = 0V MAX. UNIT CONDITIONS mA VOL = 0.4V mA VOH = 2.4V mA VOL = 0.4V -12 1.1 2.4 8.2 DC Characteristics, continued PARAMETER SYM. MIN. TYP. OUT12t - TTL level output pin with source-sink capability of 12 mA Output Low Current IOL Output High Current IOH 12 16 -14 -12 OD8 - Open-drain output pin with sink capability of 8 mA Output Low Current F75383/F75384 IOL 6 8 -13- July, 2007 V0.32P F75383/F75384 OD16 - Open-drain output pin with sink capability of 16 mA Output Low Current IOL 12 16 mA VOL = 0.4V I/OOD16ts - TTL level bi-directional pin, can select to OD or OUT by register, with 16 mA source-sink capability Input Low Threshold Voltage Vt- 0.5 0.8 1.1 V VCC = 3.3 V Input High Threshold Voltage Vt+ 1.6 2.0 2.4 V VCC = 3.3 V Output Low Current IOL 6 8 mA VOL = 0.4 V Output High Current IOH -12 mA VOH = 2.4V Input High Leakage ILIH +1 µA VIN = VCC Input Low Leakage ILIL -1 µA VIN = 0V Input Low Voltage VIL 0.8 V Input High Voltage VIH Input High Leakage ILIH +1 µA VIN = VCC Input Low Leakage ILIL -1 µA VIN = 0 V -16 INt - TTL level input pin INts - 2.0 V TTL level Schmitt-triggered input pin Input Low Threshold Voltage Vt- 0.5 0.8 1.1 V VCC = 3.3V Input High Threshold Voltage Vt+ 1.6 2.0 2.4 V VCC = 3.3V Input High Leakage ILIH +1 µA VIN = VCC Input Low Leakage ILIL -1 µA VIN = 0 V 8.3 AC Characteristics t SCL t t R R SCL t HD;SDA t SU;DAT t SU;STO SDA IN VALID DATA t HD;DAT SDA OUT Serial Bus Timing Diagram F75383/F75384 -14- July, 2007 V0.32P F75383/F75384 Serial Bus Timing PARAMETER SYMBOL MIN. MAX. UNIT t-SCL 0.5 10000 uS Start condition hold time tHD;SDA 0.5 uS Stop condition setup-up time tSU;STO 0.5 uS DATA to SCL setup time tSU;DAT 50 nS DATA to SCL hold time tHD;DAT 50 nS SCL and SDA rise time tR 0.4 uS SCL and SDA fall time tF 0.4 uS SCL clock period 9. Package Dimensions (F75383/F75384 8-MSOP Package ) F75383/F75384 -15- July, 2007 V0.32P F75383/F75384 8 5 c E HE L 4 1 O 0.25 D A Y e SEATING PLANE GAUGE PLANE A1 b Control demensions are in milmeters . SYMBOL A A1 b c E D e HE Y L θ DIMENSION IN MM MAX. MIN. 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 3.80 4.00 4.80 5.00 1.27 BSC 6.20 5.80 0.10 0.40 1.27 0 10 DIMENSION IN INCH MIN. MAX. 0.053 0.069 0.010 0.004 0.020 0.013 0.010 0.008 0.157 0.150 0.188 0.196 0.050 BSC 0.228 0.016 0 0.244 0.004 0.050 10 (F75383/F75384 8-SOP Package ) Feature Integration Technology Inc. Headquarters Taipei Office 3F-7, No 36, Tai Yuan St., Bldg. K4, 7F, No.700, Chung Cheng Rd., Chupei City, Hsinchu, Taiwan 302, R.O.C. Chungho City, Taipei, Taiwan 235, R.O.C. TEL : 886-3-5600168 TEL : 866-2-8227-8027 FAX : 886-3-5600166 FAX : 866-2-8227-8037 www: http://www.fintek.com.tw Please note that all datasheet and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this datasheet belong to their respective owner F75383/F75384 -16- July, 2007 V0.32P 10 Application Circuit Example 1: TEMPERATURE MONITOR (CPU THERMAL DIODE) D+ THERDA C1 2200pF THERDC VCC3V DC2 0.1u R1 4.7K R2 R3 R4 4.7K 4.7K 4.7K Example 2: U1 TEMPERATURE MONITOR (2N3906) D+ D- D+ Q1 2N3906 C3 2200pF 1 2 3 4 VCC D+ DTHERM# SCL SDA ALERT# GND 8 7 6 5 SCLK SDATA F75383M D- Title Size A Date: -17- Feature Integration Technology Inc. Document Number F75383M Application Circuit Tuesday , January 27, 2004 Rev 0.1 Sheet 1 of 1 July, 2007 V0.32P